Splicing device

Abstract

The present disclosure provides a splicing device, including a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The second splicing unit includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. P is the pitch between the first light-emitting unit and the second light-emitting unit, and the pitch between the third light-emitting unit and the fourth light-emitting unit. LA1 is the horizontal distance from the center of the second light-emitting unit to the first reference plane. LB3 is the horizontal distance from the intersection between the light-emitting surface of the second splicing unit and the second reference plane to the first reference plane. LB1x and LB1y are the horizontal and vertical components of the distance from the intersection to the center of the third light-emitting unit, respectively. LA2 is the vertical distance from the light-emitting surface of the first splicing unit to the bottom surface of the first substrate. LB2 is the vertical distance from the bottom surface of the first substrate to the intersection. The splicing device satisfies: #imgabs0#

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to a splicing device. Background Art

[0002] Video wall displays are not only suitable for large video walls, but can also be used in electronic devices with unique angles to display advertising content or demonstrate virtual stereoscopic videos, thereby attracting the attention of passers-by. Such applications can be found in public spaces such as shopping malls, stations, commercial districts, and museums. In existing video wall systems, at certain viewing angles, the seam (a black line) at the corners is easily visible, causing discontinuity in the displayed image. Summary of the Invention

[0003] The present disclosure provides a splicing device, which helps to improve the discontinuity problem of displayed images.

[0004] According to an embodiment of the present disclosure, a splicing device has a splicing portion. The splicing device includes a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The first light-emitting unit and the second light-emitting unit are arranged on the first substrate, and the second light-emitting unit is located between the first light-emitting unit and the splicing portion, wherein the pitch between the first light-emitting unit and the second light-emitting unit is P. The second splicing unit is adjacent to the first splicing unit at the splicing portion and includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. The third light-emitting unit and the fourth light-emitting unit are arranged on the second substrate, wherein the third light-emitting unit is located between the splicing portion and the fourth light-emitting unit, and the pitch between the third light-emitting unit and the fourth light-emitting unit is also P. The splicing device satisfies the following formula:

[0005]

[0006] Among them, LA1 is the horizontal distance from the center of the second light-emitting unit to the first reference plane, the first reference plane is perpendicular to the light-emitting surface of the first splicing unit and passes through the upper edge of the adjacent splicing part of the first substrate; LB3 is the horizontal distance from the junction between the light-emitting surface of the second splicing unit and the second reference plane to the first reference plane, the second reference plane is perpendicular to the light-emitting surface of the second splicing unit and passes through the upper edge of the adjacent splicing part of the second substrate; LB1x is the horizontal component of the distance from the junction to the center of the third light-emitting unit; LA2 is the vertical distance from the light-emitting surface of the first splicing unit to the bottom surface of the first substrate; LB2 is the vertical distance from the bottom surface of the first substrate to the junction; LB1y is the vertical component of the distance from the junction to the center of the third light-emitting unit.

[0007] In order to make the above features and advantages of the present disclosure more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figures 1 to 10 1 and 2 are partial cross-sectional schematic diagrams of splicing devices according to multiple embodiments of the present disclosure. DETAILED DESCRIPTION

[0009] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0010] Throughout this disclosure and the appended claims, certain terms are used to refer to specific components. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, the words "including" and "comprising" are open-ended and should be interpreted as meaning "including, but not limited to..."

[0011] Directional terms used herein, such as "up," "down," "front," "back," "left," "right," etc., are used only with reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present disclosure. In the accompanying drawings, each figure depicts the general characteristics of the methods, structures, and / or materials used in particular embodiments. However, these figures should not be construed as defining or limiting the scope or nature of the embodiments. For example, the relative sizes, thicknesses, and positions of various layers, regions, and / or structures may be reduced or exaggerated for clarity.

[0012] A structure (or layer, element, substrate) described in the present disclosure is located on / above another structure (or layer, element, substrate), which may refer to the two structures being adjacent and directly connected, or it may refer to the two structures being adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate element, intermediate substrate, intermediate gap) between the two structures, the lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure is adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be composed of a single-layer or multi-layer physical structure or a non-physical structure, without limitation. In the present disclosure, when a certain structure is disposed "on" another structure, it may refer to a certain structure being "directly" on the other structure, or a certain structure being "indirectly" on the other structure, that is, at least one structure is sandwiched between the certain structure and the other structure.

[0013] The terms "approximately," "equal to," "equal to," "same as," "substantially," or "approximately" are generally interpreted as within 20% of a given value or range, or as within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. In addition, the phrases "a range from a first value to a second value," "a range between a first value and a second value" indicate that the range includes the first value, the second value, and other values therebetween.

[0014] The use of ordinal numbers such as "first" and "second" in the specification and claims to modify an element does not, by itself, imply or indicate any prior ordinal number of the element(s), nor does it indicate the order of one element relative to another, or the order of manufacturing methods. Such ordinal numbers are used solely to clearly distinguish one element from another with the same name. The claims and the specification may not use the same terminology; thus, the first element in the specification may be the second element in the claim.

[0015] The electrical connection or coupling described in this disclosure may refer to a direct connection or an indirect connection. In the case of a direct connection, the endpoints of the two circuit elements are directly connected or connected to each other by a conductor segment. In the case of an indirect connection, there is a switch, diode, capacitor, inductor, resistor, other suitable element, or a combination of the above elements between the endpoints of the two circuit elements, but it is not limited thereto.

[0016] In the present disclosure, the length, width, thickness, height or area, or the distance or spacing between elements may be measured using an optical microscopy (OM), a scanning electron microscope (SEM), an α-step film thickness profiler, an ellipsometer, or other suitable methods. Specifically, according to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image of the element to be measured, and the length, width, thickness, height or area of each element, or the distance or spacing between elements may be measured, but the present invention is not limited thereto.

[0017] In addition, any two values or directions used for comparison may have a certain degree of error. Furthermore, the phrases "a given range is from a first value to a second value," "a given range falls within the range from a first value to a second value," or "a given range is between a first value and a second value" indicate that the given range includes the first value, the second value, and any values therebetween. If the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0018] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the present disclosure.

[0019] In the present disclosure, an electronic device may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-luminous display device or a luminous display device. The electronic device may, for example, include liquid crystal, a light-emitting diode, fluorescence, phosphor, quantum dots (QD), other suitable display media, or a combination thereof. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound, but is not limited thereto. In the present disclosure, an electronic device may include electronic components, and the electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light-emitting diode or a photodiode. The light-emitting diode may, for example, include an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot LED, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any of the aforementioned arrangements and combinations, but is not limited thereto. In addition, the shape of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have a drive system, a control system, a light source system, ... and other peripheral systems to support a display device, an antenna device, a wearable device (for example, including augmented reality or virtual reality), an in-vehicle device (for example, including a car windshield), or a splicing device.

[0020] Figures 1 to 10 They are partial cross-sectional schematic diagrams of the splicing devices according to multiple embodiments of the present disclosure. It should be noted that, Figures 1 to 10 The provided technical solutions may be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present disclosure.

[0021] Please refer to Figure 1 The splicing device 1 has a splicing point X. The splicing point X is the area / position where multiple splicing units in the splicing device 1 are spliced together. Figure 1 For example, the splicing device 1 may include a first splicing unit 10 and a second splicing unit 12 , and the splicing location X is the area / position where the second splicing unit 12 is adjacent to the first splicing unit 10 .

[0022] The first splicing unit 10 may include, but is not limited to, a first substrate 100, a first light emitting unit 102, and a second light emitting unit 104. For example, the first splicing unit 10 may further include, but is not limited to, a circuit layer 106 and a driving circuit (not shown).

[0023] The first substrate 100 is used to carry the first light-emitting unit 102, the second light-emitting unit 104, the circuit layer 106 and the driving circuit (not shown). The first substrate 100 may be a hard substrate or a flexible substrate. The first substrate 100 may include glass, quartz, ceramic, sapphire, a printed circuit board (PCB), plastic, other suitable materials or a combination of the foregoing materials, but is not limited thereto. Plastic may include polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), other suitable flexible materials or a combination of the foregoing materials, but is not limited thereto. In addition, the transmittance of the first substrate 100 is not limited, that is, the first substrate 100 may be a transparent substrate, a semi-transparent substrate or an opaque substrate.

[0024] The first light-emitting unit 102 is disposed on the first substrate 100. The first light-emitting unit 102 includes, for example, a red light-emitting diode R, a green light-emitting diode G, a blue light-emitting diode B, and an encapsulation layer PK, but is not limited thereto. The first light-emitting unit 102 may further include other components or layers as needed, without further limitation.

[0025] The red light-emitting diodes R, green light-emitting diodes G, and blue light-emitting diodes B are arranged on the first substrate 100, for example, along the horizontal direction DP. Each of the red light-emitting diodes R, green light-emitting diodes G, and blue light-emitting diodes B may include a light-emitting diode, a sub-millimeter light-emitting diode, a micro light-emitting diode, or a quantum dot light-emitting diode. The encapsulation layer PK covers the red light-emitting diodes R, green light-emitting diodes G, and blue light-emitting diodes B. The material of the encapsulation layer PK may include a transparent material, a water- and oxygen-blocking material, other suitable materials, or a combination thereof, but is not limited thereto. For example, the material of the encapsulation layer PK may include epoxy, acrylic resin, silicone, polyimide polymer, or a combination thereof, but is not limited thereto.

[0026] The second light-emitting unit 104 is disposed on the first substrate 100 and is located between the first light-emitting unit 102 and the joint X. In other words, the second light-emitting unit 104 is closer to the joint X of the splicing device 1 than the first light-emitting unit 102. The second light-emitting unit 104 may have the same or similar structure as the first light-emitting unit 102, and will not be repeated here.

[0027] The pitch between the first light-emitting unit 102 and the second light-emitting unit 104 is P. The pitch P may be the shortest distance from the center of the first light-emitting unit 102 (e.g., the center C1 of the top of the green light-emitting diode G) to the center of the second light-emitting unit 104 (e.g., the center C2 of the top of the green light-emitting diode G). Alternatively, the pitch P may be the shortest distance from an edge (e.g., the left edge or the right edge) of the first light-emitting unit 102 to the corresponding edge (e.g., the left edge or the right edge) of the second light-emitting unit 104.

[0028] According to different requirements, the first splicing unit 10 may further include other light emitting units. In other words, the number of light emitting units in the first splicing unit 10 may be greater than 2, and the plurality of light emitting units may be arranged in an array on the first substrate 100 .

[0029] The circuit layer 106 is disposed on the first substrate 100 and is located between the first light-emitting unit 102 and the first substrate 100 and between the second light-emitting unit 104 and the first substrate 100. The circuit layer 106 may include a patterned conductive pattern, and the first light-emitting unit 102 and the second light-emitting unit 104 may be electrically connected to a driving circuit (not shown) through the circuit layer 106. The material of the circuit layer 106 may include a transparent conductive material or a non-transparent conductive material. The transparent conductive material may include, but is not limited to, metal oxides, graphene, carbon nanotubes, other suitable transparent conductive materials, or combinations thereof. The non-transparent conductive material may include, but is not limited to, a metal, an alloy, or combinations thereof.

[0030] A driving circuit (not shown) is disposed on the first substrate 100. In some embodiments, the driving circuit may be disposed on the light-emitting side of the first substrate 100 (e.g., the side where the first light-emitting unit 102 and the second light-emitting unit 104 are located). In other embodiments, the driving circuit may be disposed on the back side of the first substrate 100 (e.g., the side opposite the light-emitting side), and the circuit layer 106 may be electrically connected to the driving circuit via a conductive through-hole (not shown) extending through the first substrate 100, a flexible printed circuit (FPC; not shown), a conductive layer (not shown) disposed on the sidewall of the first substrate 100, or other forms of connectors (not shown).

[0031] The second splicing unit 12 is adjacent to the first splicing unit 10 at the splicing point X and includes a second substrate 120, a third light-emitting unit 122, and a fourth light-emitting unit 124, but the present invention is not limited thereto. For example, the second splicing unit 12 may further include a circuit layer 126 and a driving circuit (not shown), but the present invention is not limited thereto.

[0032] The second substrate 120 is used to carry the third light-emitting unit 122, the fourth light-emitting unit 124, the circuit layer 126 and the driving circuit (not shown). The second substrate 120 may be a hard substrate or a flexible substrate. The second substrate 120 may include glass, quartz, ceramic, sapphire, a printed circuit board (PCB), plastic, other suitable materials or a combination of the foregoing materials, but is not limited thereto. . Plastic may include polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), other suitable flexible materials or a combination of the foregoing materials, but is not limited thereto. In addition, the transmittance of the second substrate 120 is not limited, that is, the second substrate 120 may be a transparent substrate, a semi-transparent substrate or an opaque substrate.

[0033] The third light emitting unit 122 is disposed on the second substrate 120. The third light emitting unit 122 may have a structure that is the same as or similar to that of the first light emitting unit 102, and details thereof will not be repeated herein.

[0034] The fourth light-emitting unit 124 is disposed on the second substrate 120, with the third light-emitting unit 122 located between the joint X and the fourth light-emitting unit 124. In other words, the third light-emitting unit 122 is closer to the joint X of the splicing device 1 than the fourth light-emitting unit 124. The fourth light-emitting unit 124 may have the same or similar structure as the first light-emitting unit 102, and a detailed description thereof will not be repeated here.

[0035] The first splicing unit 10 and the second splicing unit 12 may have the same pitch. In other words, the pitch between the third light-emitting unit 122 and the fourth light-emitting unit 124 may also be P. The pitch P may be the shortest distance from the center of the third light-emitting unit 122 (e.g., the center C3 of the top of the green light-emitting diode G) to the center of the fourth light-emitting unit 124 (e.g., the center C4 of the top of the green light-emitting diode G). Alternatively, the pitch P may be the shortest distance from an edge (e.g., the left edge or the right edge) of the third light-emitting unit 122 to the corresponding edge (e.g., the left edge or the right edge) of the fourth light-emitting unit 124.

[0036] According to different requirements, the second splicing unit 12 may further include other light emitting units. In other words, the number of light emitting units in the second splicing unit 12 may be greater than 2, and the plurality of light emitting units may be arranged in an array on the second substrate 120 .

[0037] The circuit layer 126 is disposed on the second substrate 120 and is located between the third light-emitting unit 122 and the second substrate 120, and between the fourth light-emitting unit 124 and the second substrate 120. The circuit layer 126 may include a patterned conductive pattern, and the third light-emitting unit 122 and the fourth light-emitting unit 124 may be electrically connected to a driving circuit (not shown) via the circuit layer 126. The material of the circuit layer 126 may be the same as or similar to the material of the circuit layer 106, and will not be repeated here.

[0038] A driving circuit (not shown) is disposed on the second substrate 120. In some embodiments, the driving circuit may be disposed on the light-emitting side of the second substrate 120 (e.g., the side where the third light-emitting unit 122 and the fourth light-emitting unit 124 are located). In other embodiments, the driving circuit may be disposed on the back side of the second substrate 120 (e.g., the side opposite the light-emitting side), and the circuit layer 126 may be electrically connected to the driving circuit via a conductive through-hole (not shown) extending through the second substrate 120, a flexible printed circuit (FPC; not shown), a conductive layer (not shown) disposed on the sidewall of the second substrate 120, or other forms of connectors (not shown).

[0039] By reducing the distance DT between the light-emitting unit closest to the joint X in the first splicing unit 10 (such as the second light-emitting unit 104) and the light-emitting unit closest to the joint X in the second splicing unit 12 (such as the third light-emitting unit 122), for example, making the distance DT the same or close to the pitch P, the visibility of the splicing seam at the corner can be reduced, thereby helping to improve the discontinuity problem of the displayed image. According to simulation analysis, when the distance DT is less than or equal to 1.5 times the pitch P, the visibility of the splicing seam at the corner can be reduced, thereby helping to improve the discontinuity problem of the displayed image. By using the Pythagorean theorem, the following formula can be derived:

[0040]

[0041] The parameters in the above formula are defined as follows:

[0042] LA1 is the horizontal distance from the center of the second light emitting unit 104 (e.g., the center C2 of the top of the green light emitting diode G) to the first reference plane RF1, that is, the distance from the center C2 to the first reference plane RF1 in the horizontal direction DP;

[0043] The first reference plane RF1 is perpendicular to the light emitting surface E1 of the first splicing unit 10 and passes through the upper edge UB1 of the first substrate 100 adjacent to the splicing portion X;

[0044] The light emitting surface E1 of the first splicing unit 10 is aligned with the top surfaces of the plurality of light emitting diodes (such as the red light emitting diode R, the green light emitting diode G, and the blue light emitting diode B) in the first splicing unit 10. Figure 1 For example, the light-emitting surface E1 is aligned with the top surfaces of the light-emitting diodes.

[0045] LB3 is the horizontal distance from the boundary BL between the light-emitting surface E2 of the second splicing unit 12 and the second reference plane RF2 to the first reference plane RF1, that is, the distance from the boundary BL to the first reference plane RF1 in the horizontal direction DP;

[0046] The second reference plane RF2 is perpendicular to the light emitting surface E2 of the second splicing unit 12 and passes through the upper edge UB2 of the second substrate 120 adjacent to the splicing portion X;

[0047] The light emitting surface E2 of the second splicing unit 12 is aligned with the top surfaces of the plurality of light emitting diodes (such as the red light emitting diode R, the green light emitting diode G, and the blue light emitting diode B) in the second splicing unit 12. Figure 1 For example, the light-emitting surface E2 is aligned with the top surfaces of the light-emitting diodes.

[0048] The angle θ between the light-emitting surface E2 of the second splicing unit 12 and the light-emitting surface E1 of the first splicing unit 10 is the splicing angle between the second splicing unit 12 and the first splicing unit 10. In some embodiments, the angle θ is between 90 degrees and 135 degrees, that is, 90 degrees ≦ angle θ ≦ 135;

[0049] LB1x is the horizontal component of the distance LB1 from the junction BL to the center of the third light-emitting unit 122 (e.g., the center C3 of the top of the green light-emitting diode G). That is, the horizontal component LB1x is the orthographic projection of the distance LB1 from the junction BL to the center C3 in the horizontal direction DP.

[0050] LA2 is the vertical distance from the light-emitting surface E1 of the first splicing unit 10 to the bottom surface SB1 of the first substrate 100, that is, the distance from the light-emitting surface E1 to the bottom surface SB1 in the vertical direction DV;

[0051] LB2 is a vertical distance from the bottom surface SB1 of the first substrate 100 to the boundary BL, that is, a distance from the bottom surface SB1 to the boundary BL in the vertical direction DV;

[0052] LB1y is a vertical component of the distance LB1 from the boundary BL to the center C3 of the third light emitting unit 122 , that is, the vertical component LB1y is an orthographic projection of the distance LB1 from the boundary BL to the center C3 in the vertical direction DV.

[0053] The following table lists some specific ranges of the above parameters, but it should be understood that any parameter range that can satisfy the above formula is included in the protection scope of the present disclosure.

[0054]

[0055] In the above table, except for the horizontal distance LB3 and the vertical distance LB2, which have positive and negative values, the other parameters are all positive values. The positive and negative values of the horizontal distance LB3 are divided by the first reference plane RF1. When the junction BL is located to the right of the first reference plane RF1 (that is, when viewed from the vertical direction DV, the junction BL does not overlap with the first splicing unit 10), the horizontal distance LB3 is a positive value. On the contrary, when the junction BL is located to the left of the first reference plane RF1 (that is, when viewed from the vertical direction DV, the junction BL overlaps with the first splicing unit 10), the horizontal distance LB3 is a negative value. The positive and negative values of the vertical distance LB2 are divided by the bottom surface SB1 of the first substrate 100. When the junction BL is located below the bottom surface SB1 (that is, when viewed from the horizontal direction DP, the junction BL does not overlap with the first substrate 100), the vertical distance LB2 is a positive value. On the contrary, when the boundary BL is located above the bottom surface SB1 (ie, when viewed from the horizontal direction DP, the boundary BL overlaps with the first substrate 100 ), the vertical distance LB2 is a negative value.

[0056] It should be understood that the splicing device 1 may further include other components or layers depending on different needs. For example, the splicing device 1 may further include a truss, a mechanical support frame, an adhesive layer, or other fixing structure to secure the splicing units, but the present invention is not limited to this. The following embodiments can all be modified in the same manner and will not be repeated below.

[0057] although Figure 1 It is schematically shown that the splicing angle between the second splicing unit 12 and the first splicing unit 10 (the angle θ between the light-emitting surface E2 and the light-emitting surface E1) is greater than or equal to 90 degrees, and the second splicing unit 12 is thicker than the first splicing unit 10, but it should be understood that various parameters in the splicing device 1 (including the angle θ, the thickness of the splicing unit, the shape design of the substrate in the splicing unit or the structural design of the light-emitting unit, etc.) can be changed according to needs.

[0058] Please refer to Figure 2 , splicing device 1A and Figure 1 The main differences of the splicing device 1 are described below. In the splicing device 1A, the splicing angle (the angle θ between the light-emitting surface E2 and the light-emitting surface E1) of the second splicing unit 12 and the first splicing unit 10 is equal to 90 degrees. In addition, the boundary BL is close to the first reference plane RF1 in the horizontal direction DP and is located to the left of the first reference plane RF1, so that the horizontal distance LB3 (see Figure 1) changes from a positive value to a negative value. Under this design, the distance DT between the second light emitting unit 104 and the third light emitting unit 122 can be further reduced, which helps to further improve the discontinuity problem of the displayed image.

[0059] Although not shown, Figure 2 The second splicing unit 12 in the image can be further moved to the left, thereby further reducing the distance DT between the second light-emitting unit 104 and the third light-emitting unit 122.

[0060] Please refer to Figure 3 , splicing device 1B and Figure 1 The main differences of the splicing device 1 are described below. In the splicing device 1B, the splicing angle (the angle θ between the light emitting surface E2 and the light emitting surface E1) between the second splicing unit 12 and the first splicing unit 10 is equal to 90 degrees, and the horizontal component LB1x becomes 0.

[0061] Please refer to Figure 4 , splicing device 1C and Figure 3 The main differences between the splicing device 1B and the splicing device 1C are described below. In the splicing device 1C, the second splicing unit 12 is moved to the left to reduce the distance DT between the second light-emitting unit 104 and the third light-emitting unit 122 by reducing the horizontal distance LB3. In addition, the second splicing unit 12 and the first splicing unit 10 have the same thickness, for example.

[0062] Although not shown, Figure 4 The second splicing unit 12 can be further moved to the left or right. In addition, the splicing angle between the second splicing unit 12 and the first splicing unit 10 (the angle θ between the light emitting surface E2 and the light emitting surface E1) can be greater than or equal to 90 degrees and less than or equal to 135 degrees.

[0063] Please refer to Figure 5 , splicing device 1D and Figure 3 The main differences between the splicing device 1B and the splicing device 1D are described below. In the splicing device 1D, the first substrate 100 and the second substrate 120 are chamfered near the splicing point X to reduce the vertical distance LB2, for example, changing the vertical distance LB2 from a positive value to a negative value, thereby further reducing the distance DT between the second light-emitting unit 104 and the third light-emitting unit 122.

[0064] Although not shown, Figure 5 The second splicing unit 12 can be further moved to the lower left, upper right or right. In addition, the splicing angle (the angle θ between the light-emitting surface E2 and the light-emitting surface E1) between the second splicing unit 12 and the first splicing unit 10 can be greater than or equal to 90 degrees and less than or equal to 135 degrees.

[0065] Please refer to Figure 6 , splicing device 1E and Figure 5The main differences of the splicing device 1D are described below. In the splicing device 1E, the second splicing unit 12 is further moved to the lower left, so that the horizontal distance LB3 changes from a positive value to a negative value, and the vertical distance LB2 changes from a negative value to a positive value.

[0066] Although not shown, Figure 6 The second splicing unit 12 can be further moved to the lower left or upper right. In addition, the splicing angle (the angle θ between the light-emitting surface E2 and the light-emitting surface E1) between the second splicing unit 12 and the first splicing unit 10 can be greater than or equal to 90 degrees and less than or equal to 135 degrees.

[0067] Please refer to Figure 7 , splicing device 1F and Figure 6 The main differences between the splicing device 1E and the second splicing unit 1F are described below. In the splicing device 1F, the second splicing unit 12 is further moved to the upper right, causing the horizontal distance LB3 to change from a negative value to approach zero, and the vertical distance LB2 to change from a positive value to a negative value. Furthermore, the second splicing unit 12 and the first splicing unit 10 have, for example, the same thickness.

[0068] Although not shown, Figure 7 The second splicing unit 12 can be further moved to the lower left or upper right. In addition, the splicing angle (the angle θ between the light-emitting surface E2 and the light-emitting surface E1) between the second splicing unit 12 and the first splicing unit 10 can be greater than or equal to 90 degrees and less than or equal to 135 degrees.

[0069] Please refer to Figure 8 , splicing device 1G and Figure 7 The main differences of the splicing device 1F are described below. In the splicing device 1G, the second splicing unit 12 is thinner than the first splicing unit 10.

[0070] Although not shown, Figure 8 The second splicing unit 12 can be further moved to the lower left or upper right. In addition, the splicing angle (the angle θ between the light-emitting surface E2 and the light-emitting surface E1) between the second splicing unit 12 and the first splicing unit 10 can be greater than or equal to 90 degrees and less than or equal to 135 degrees.

[0071] Please refer to Figure 9 , splicing device 1H and Figure 8 The main differences between the splicing device 1G and the splicing device 1H are described below. In the splicing device 1H, the multiple light-emitting units in the first splicing unit 10 (such as the first light-emitting unit 102 and the second light-emitting unit 104) share a single encapsulation layer PK, and the multiple light-emitting units in the second splicing unit 12 (such as the third light-emitting unit 122 and the fourth light-emitting unit 124) share a single encapsulation layer PK. Although not shown, other embodiments of the present disclosure may also adopt a design in which multiple light-emitting units share a single encapsulation layer PK, which will not be repeated below.

[0072] Please refer to Figure 10 , splicing device 1I and Figure 9 The main differences of the splicing device 1H are described below. In the splicing device 1I, each of the multiple light-emitting units (such as the first light-emitting unit 102, the second light-emitting unit 104, the third light-emitting unit 122 and the fourth light-emitting unit 124) further includes a micro lens ML ( Figure 10 Only the microlenses ML in the first light-emitting unit 102 are schematically indicated, and the encapsulation layer PK in the first splicing unit 10 covers the microlenses ML of the first and second light-emitting units 102, 104. The encapsulation layer PK in the second splicing unit 12 covers the microlenses ML of the third and fourth light-emitting units 122, 124. Although not shown, other embodiments of the present disclosure may also adopt the design of microlenses ML, which will not be repeated below.

[0073] In summary, in the embodiments of the present disclosure, the design of the above formula can reduce the visibility of the seams at the corners, thereby helping to improve the discontinuity problem of the displayed image.

[0074] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

[0075] Although the embodiments and advantages of the present disclosure have been disclosed above, it should be understood that any person skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure, and the features between the embodiments can be arbitrarily mixed and replaced with each other to form other new embodiments. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand from the content of the present disclosure that the processes, machines, manufacturing, material compositions, devices, methods and steps currently or in the future developed can be used according to the present disclosure as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment. The scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. A splicing device having a splicing portion, characterized in that: The splicing device comprises: The first splicing unit includes: a first substrate; a first light emitting unit, disposed on the first substrate; and a second light emitting unit disposed on the first substrate and located between the first light emitting unit and the joint, wherein a pitch between the first light emitting unit and the second light emitting unit is P; and A second splicing unit is adjacent to the first splicing unit at the splicing position and comprises: a second substrate; a third light emitting unit, disposed on the second substrate; and A fourth light-emitting unit is provided on the second substrate, wherein the third light-emitting unit is located between the joint and the fourth light-emitting unit, and the pitch between the third light-emitting unit and the fourth light-emitting unit is also P. The splicing device satisfies the following formula: Among them, LA1 is the horizontal distance from the center of the second light-emitting unit to the first reference plane, the first reference plane is perpendicular to the light-emitting surface of the first splicing unit and passes through the upper edge of the first substrate adjacent to the splicing, LB3 is the horizontal distance from the junction between the light-emitting surface of the second splicing unit and the second reference plane to the first reference plane, the second reference plane is perpendicular to the light-emitting surface of the second splicing unit and passes through the upper edge of the second substrate adjacent to the splicing, LB1x is the horizontal component of the distance from the junction to the center of the third light-emitting unit, LA2 is the vertical distance from the light-emitting surface of the first splicing unit to the bottom surface of the first substrate, LB2 is the vertical distance from the bottom surface of the first substrate to the junction, and LB1y is the vertical component of the distance from the junction to the center of the third light-emitting unit.

2. The splicing device according to claim 1, characterized in that: An included angle between the light emitting surface of the first splicing unit and the light emitting surface of the second splicing unit is between 90 degrees and 135 degrees.

3. The splicing device according to claim 1, characterized in that: P is between 0.2mm and 1.27mm.

4. The splicing device according to claim 1, characterized in that: LA1 is between 0.03mm and 0.64mm.

5. The splicing device according to claim 1, characterized in that: LB3 is between -0.64mm and 0.64mm.

6. The splicing device according to claim 1, characterized in that: LB1x is between 0mm and 0.45mm.

7. The splicing device according to claim 1, characterized in that: LA2 is between 0.3mm and 1.7mm.

8. The splicing device according to claim 1, characterized in that: LB2 is between -1.7mm and 1.27mm.

9. The splicing device according to claim 1, characterized in that: LB1y is between 0.01mm and 0.64mm.

10. The splicing device according to claim 1, characterized in that: The first substrate and the second substrate are chamfered near the joint.

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