Cantilever probe card, processing method, device of cantilever probe card and electronic equipment

Abstract

The application provides a cantilever probe card, a processing method and device of the cantilever probe card and electronic equipment, and relates to the technical field of semiconductors, and alleviates the technical problem of low execution efficiency of a welding process. The cantilever probe card comprises a PCB, a plurality of probe welding points and a silk screen grid are arranged on the PCB, and the plurality of probe welding points are arranged in the silk screen grid; a plurality of probe welding points in each silk screen grid form a square matrix; a plurality of probe welding points in each square matrix correspond to a plurality of shapes; the relative positions of probe welding points of the same shape between a plurality of square matrices in different silk screen grids are the same; wherein the relative positions represent positions relative to a plurality of probe welding points in the same silk screen grid.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a cantilever probe card, a processing method and device of the cantilever probe card, and an electronic device. BACKGROUND

[0002] The cantilever probe card mainly comprises a PCB, probes and functional components, wherein the PCB is a connecting plate required for chip testing. The PCB has welding points corresponding to the number of pins of the chip for welding the probes. At present, the welding points are designed on the PCB according to specific sizes. In the welding process in the manufacturing process of the cantilever probe card, an operation engineer finds the corresponding welding points on the PCB for welding according to a needle drawing. Since the welding points are regularly shaped and densely arranged on the PCB, a lot of time is required to find the corresponding welding points. In particular, some chip designs specify the welding point positions to ensure signal performance, and it is even more time-consuming to find the welding points, resulting in low execution efficiency of the welding process. SUMMARY

[0003] The present application aims to provide a cantilever probe card, a processing method and device of the cantilever probe card, and an electronic device to alleviate the technical problem of low execution efficiency of the welding process.

[0004] In a first aspect, an embodiment of the present application provides a cantilever probe card, comprising a PCB, wherein a plurality of probe welding points and a silk screen grid are arranged on the PCB, and the plurality of probe welding points are arranged in the silk screen grid.

[0005] The plurality of probe welding points in each silk screen grid form a square matrix. The plurality of probe welding points in each square matrix correspond to a plurality of shapes. The probe welding points of the same shape between the plurality of square matrices have the same relative position in different silk screen grids.

[0006] The relative position represents the position relative to the plurality of probe welding points in the same silk screen grid.

[0007] In a second aspect, a processing method of a cantilever probe card is provided, wherein a plurality of probe welding points are arranged on a PCB, and the method comprises the following steps.

[0008] Obtaining a specified division mode corresponding to the plurality of probe welding points;

[0009] Grouping the plurality of probe welding points based on the specified division mode to obtain a grouping result;

[0010] Setting a silk screen line at a separation position between each probe welding point group according to the grouping result, so that the plurality of probe welding point groups are isolated by a silk screen grid formed by the silk screen line;

[0011] determining a specific probe pad in each of the probe pad groups, and setting a highlight mark on each of the specific probe pads, so as to distinguish the specific probe pads from the probe pads other than the specific probe pads in the probe pad groups.

[0012] In a possible implementation, after the grouping of the plurality of probe pads based on the specified grouping manner, a grouping result is obtained, and the method further includes:

[0013] According to the grouping result, a color-developing material corresponding to different wavelengths of invisible light is arranged around the specified probe pads in different probe pad groups, so that the probe pads in different probe pad groups are distinguished by display effects after irradiation of the invisible light.

[0014] Each of the probe pad groups corresponds to one wavelength of invisible light.

[0015] In a possible implementation, the different wavelengths of invisible light include any one or more of the following:

[0016] Infrared rays, ultraviolet rays, and far infrared rays.

[0017] In a possible implementation, after the color-developing material corresponding to different wavelengths of invisible light is arranged around the specified probe pads in different probe pad groups according to the grouping result, the method further includes:

[0018] According to a preset light irradiation priority order, the plurality of probe pads are irradiated with different wavelengths of invisible light in a welding process for different probe pad groups.

[0019] The preset light irradiation priority order is a preset light irradiation order of the different wavelengths of invisible light.

[0020] In a possible implementation, after the grouping of the plurality of probe pads based on the specified grouping manner, a grouping result is obtained, and the method further includes:

[0021] According to the grouping result, a heat-sensitive material of different temperature ranges is arranged around the probe pads in different probe pad groups, so that the probe pads in different probe pad groups are distinguished by display effects after different ambient temperatures.

[0022] Each of the probe pad groups corresponds to one temperature range.

[0023] In a possible implementation, the setting of the highlight mark on each of the specific probe pads includes:

[0024] A fluorescent material is arranged around each of the special probe pads to highlight each of the special probe pads by ultraviolet light.

[0025] In a third aspect, a processing device of a cantilevered probe card is provided, and a plurality of probe pads are arranged on a PCB board, the device comprising:

[0026] An acquisition module is configured to acquire a specified division manner corresponding to the plurality of probe pads;

[0027] A grouping module is configured to group the plurality of probe pads based on the specified division manner to obtain a grouping result;

[0028] A setting module is configured to set a silk screen line at a separation position between each probe pad group according to the grouping result, so that a plurality of the probe pad groups are isolated by a silk screen grid formed by the silk screen line;

[0029] A determination module is configured to determine a special probe pad in each of the probe pad groups, and set a highlight mark for each of the special probe pads, so that the special probe pad and the probe pads other than the special probe pad in the probe pad group are distinguished in a style.

[0030] In a fourth aspect, an electronic device is provided, comprising a memory and a processor, the memory stores a computer program which can be run on the processor, and the processor implements the method of the second aspect when executing the computer program.

[0031] In a fifth aspect, a computer readable storage medium is provided, and the computer readable storage medium stores computer executable instructions, when the computer executable instructions are called and run by a processor, the computer executable instructions cause the processor to run the method of the second aspect.

[0032] The embodiments of the present application bring the following beneficial effects:

[0033] The embodiment of the present application provides a cantilever probe card, a processing method and device of the cantilever probe card and electronic equipment, the cantilever probe card comprises a PCB, a plurality of probe pads and a silk screen grid are arranged on the PCB, and the plurality of probe pads are arranged in the silk screen grid; a plurality of the probe pads in each of the silk screen grids form a square matrix; a plurality of the probe pads in each of the square matrices correspond to a plurality of shapes; the relative positions of the probe pads with the same shape in the plurality of square matrices in different silk screen grids are the same; wherein the relative positions represent the positions of the plurality of probe pads in the same silk screen grid. In the scheme, the plurality of probe pads are divided by the silk screen grid, the specific information such as the different shapes of the probe pads in different positions is added, the shapes of the probe pads with the same relative position in the plurality of silk screen grids are the same, the position information of the probe pads is easily found and positioned by an operator, and it is also convenient to find the corresponding probe in subsequent maintenance. Compared with the design in the prior art, the scheme increases the identification degree of each pad by the differential design of the probe pads and the method of dividing by the silk screen line, reduces the time of finding the corresponding pad of the probe by an operation engineer in a welding process, reduces the manufacturing time of the cantilever probe card, that is, the design mode in the scheme increases the identification degree, reduces the welding time, improves the work efficiency, improves the welding accuracy and the welding speed, and improves the execution efficiency of the welding process.

[0034] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0036] Figure 1 It is a structural schematic diagram of the cantilever probe card;

[0037] Figure 2 It is a schematic diagram of the structure after the probe card is welded;

[0038] Figure 3 It is another schematic diagram of the structure after the probe card is welded;

[0039] Figure 4 It is another schematic diagram of the structure after the probe card is welded;

[0040] Figure 5A schematic diagram of the irregular solder joint design structure of the cantilever probe card provided in this application embodiment;

[0041] Figure 6 A schematic diagram of the conventional solder joint design for existing cantilever probe cards;

[0042] Figure 7 A schematic diagram of the overall structure of the solder joints on the cantilever probe card provided in this embodiment of the application;

[0043] Figure 8 A flowchart illustrating the processing method of the cantilever probe card provided in this application embodiment;

[0044] Figure 9 A schematic diagram of the processing device for the cantilever probe card provided in the embodiments of this application;

[0045] Figure 10 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] The terms "comprising" and "having," and any variations thereof, used in the embodiments of this application, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the steps or units listed, but may optionally include other steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0048] In existing technologies, chip probing (CP) occurs between wafer fabrication and packaging in the entire chip manufacturing process. After the wafer is fabricated, thousands of bare dies (unpackaged chips) are regularly distributed throughout the wafer. Since dicing and packaging have not yet been performed, all the chip pins are exposed. These extremely small pins need to be connected to the tester via finer probes. On the undivided wafer, the exposed chips are connected to the tester via probes; this chip testing is called CP.

[0049] In the semiconductor manufacturing process, chip probing (CP) testing is a crucial step, directly impacting the yield and quality of the finished product. Semiconductor manufacturing testing is divided into CP testing and final testing (FT). CP testing performs wafer probing, while FT testing performs final product testing. CP testing occurs after wafer fabrication but before slicing and packaging, primarily using probe stations and testing machines. The process involves the probe station moving the wafer to the testing position. The pins on the chip are connected to the testing machine's testing module via probes and dedicated cables. The testing machine then inputs signals to the semiconductor chip and collects the output signals, checking electrical parameters to determine the validity of each die on the wafer, filtering out abnormal dies and reducing subsequent costs associated with them. The probe cards used in this process are highly precise tools, manufactured through multiple meticulous steps. Especially with the rapid advancements in semiconductor manufacturing technology, semiconductor chips are becoming smaller, more powerful, and require an increasing number of pins, making probe card manufacturing increasingly difficult. Currently, probe cards are categorized into vertical probe cards, cantilever probe cards, and MEMS probe cards. Among them, cantilever probe cards, due to their relatively low price and flexibility, are widely used in CP testing of Analog chips, Driver chips, Logic chips, and Memory chips. The structure of a cantilever probe card is as follows: Figure 1 As shown, the manufacturing process of the cantilever probe card includes CNC cutting of the ceramic ring and bending needle, oscillating needle, pre-welding baking, welding, plate washing, post-welding baking, needle adjustment, and QA. The structure of the probe card after welding is as follows. Figure 2 , Figure 3 and Figure 4 As shown. Currently, the probe placement and soldering stations require fabrication based on the PIN positions of each chip, which are designed according to the actual chip specifications. Furthermore, the number of PINs in chip designs is increasing (from tens to thousands) and the spacing is decreasing (e.g., 0.3mm). The probe diameter is typically around 0.19mm, and the probe solder joint spacing is generally designed to be 1-1.5mm. Currently, these two stations can only be operated manually by engineers under the assistance of a microscope. The placement and soldering of the probe card require a significant amount of time. For example, with 100 probes, placement is estimated to require 6 hours, and soldering is estimated to require 5 hours. Thus, completing the fabrication of a 100-pin cantilever probe card takes approximately 3 days, and completing a 1000-pin cantilever probe card takes approximately 15-20 days, severely impacting the customer's testing schedule.

[0050] Currently, cantilever probe cards mainly consist of a PCB, probes, and functional components, with the PCB serving as the connection board for chip testing. The PCB has solder joints corresponding to the number of pins on the chip, used for probe soldering. These solder joints are currently designed to a specific size on the PCB. During the soldering process in cantilever probe card manufacturing, engineers locate the corresponding solder joints on the PCB based on the pin pattern. Because these solder joints are regularly shaped and densely arranged on the PCB, finding the appropriate solder joints is time-consuming. Especially for some chips designed to ensure signal performance, the solder joint locations are specified, making the search even more time-consuming. This time is estimated to account for about 50% of the soldering process, resulting in low execution efficiency.

[0051] Based on this, embodiments of this application provide a cantilever probe card, a method for processing the cantilever probe card, an apparatus, and an electronic device. This method can alleviate the technical problem of low execution efficiency in welding processes.

[0052] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0053] This application provides a schematic diagram of the cantilever probe card. The cantilever probe card includes a PCB, on which multiple probe solder points and a silkscreen grid are arranged. The multiple probe solder points are disposed within the silkscreen grid. The multiple probe solder points within each silkscreen grid form a square array; the multiple probe solder points in each square array correspond to various shapes; probe solder points of the same shape in multiple square arrays have the same relative position in different silkscreen grids. The relative position refers to the position relative to the multiple probe solder points within the same silkscreen grid.

[0054] For example, such as Figure 5 As shown, the solder joint grid corresponding to this PCB is a silkscreen network grid. The solder joints in each silkscreen grid on the PCB form a square array. The solder joints in the same square array have different shapes. The solder joints of the same shape have the same relative position to other solder joints in the same grid in different silkscreen grids.

[0055] In practical applications, different information can also be marked on the PCB according to rows and columns and certain rules to increase distinguishability. For example, ... Figure 5 As shown, in the design of irregularly shaped solder joints, every three rows and three columns are grouped together to form a square matrix. The number of protruding columns at the bottom indicates the row number, and the number at the top indicates the column number. Silkscreen separation is added between the square matrices, with vertical lines on the silkscreen indicating the square matrix number. A protruding solder joint on each of the top, bottom, left, and right sides indicates a solder joint requiring special attention. The silkscreened portion above the graphic also uses silkscreen lines to mark the square matrices corresponding to the solder joints. Of course, the square matrix does not necessarily have to be 3×3; it can also be designed as 2×2 or 4×3, and silkscreen lines or other irregularly shaped solder joints can be used as distinguishing symbols.

[0056] Compared to Figure 6 The conventional design of probe solder joints, which are all regular circular, differs from the design of probe solder joints in the cantilever probe card for semiconductor testing provided in this application embodiment. Figure 5 and Figure 7 As shown, a differentiated design is implemented for the regularly and densely arranged probe solder joints on the PCB. The silkscreen lines are designed as a grid, and specific symbols are used to increase the recognizability of the solder joints, enabling operators to easily find the corresponding solder joints on the probe card and reducing the time spent searching for solder joints. In practical applications, the time spent finding and confirming solder joints accounts for about 50% of the soldering station. Using this method can save about 30% of the time spent finding and confirming solder joints, that is, shorten the soldering process by about 15%, and shorten the probe card manufacturing time.

[0057] Therefore, the solution provided in this application embodiment features a design with multiple regularly arranged probe solder points. This design is suitable for the CP testing segment (i.e., semiconductor wafer testing) in semiconductor testing. Multiple regularly arranged probe solder points are divided using a silkscreen grid. By adding specific information such as different shapes to probe solder points at different positions, the shapes of probe solder points in the same relative position within multiple silkscreen grids are identical. This allows for corresponding adjustments to the silkscreen, making it easier for operators to locate the position information of the probe solder points and facilitating the search for corresponding probes during subsequent maintenance. Compared to existing designs, this solution increases the recognizability of each solder point through differentiated design and reduces the time spent by operators searching for the corresponding solder points during the soldering process by using silkscreen lines for differentiation. This also reduces the manufacturing time of the cantilever probe card. In short, the design method in this application embodiment increases recognizability, reduces soldering time, improves work efficiency, and enhances soldering accuracy.

[0058] Figure 8 This is a flowchart illustrating a method for processing a cantilever probe card, as provided in an embodiment of this application.

[0059] Multiple probe solder joints are arranged on the PCB board. For example... Figure 8 As shown, the method includes:

[0060] Step S110: Obtain the specified division method corresponding to multiple probe solder joints.

[0061] The specified division method can be of various forms, and no limitation is made in this embodiment.

[0062] Step S120: Group multiple probe solder joints based on a specified division method to obtain grouping results.

[0063] As one possible implementation, the data can be divided according to rows and columns, for example, into sets of three rows and three columns.

[0064] Step S130: Based on the grouping results, set silkscreen lines at the separation positions between each probe solder joint group so as to isolate multiple probe solder joint groups through the silkscreen mesh formed by the silkscreen lines.

[0065] In practical applications, the solder joints within each silkscreen grid on the PCB can form a square matrix. For example, it can be a square matrix formed by rows and columns, such as three rows and three columns combined into one square matrix, with silkscreen isolation added between the square matrices.

[0066] Step S140: Identify specific probe solder points in each probe solder point group and set a highlight mark for each specific probe solder point to distinguish the specific probe solder point from other probe solder points in the probe solder point group.

[0067] It should be noted that the highlighting can be done in different shapes. For example, solder joints within the same array can have different shapes, and solder joints of the same shape can be positioned in the same relative position to other solder joints within the same screen printing grid. For instance, one prominent design solder joint at the top, bottom, left, and right of the array indicates a solder joint that requires special attention.

[0068] In this embodiment, multiple probe solder points are divided into grids using silkscreen printing. By adding specific information such as different shapes to the probe solder points at different locations, the shapes of probe solder points with the same relative position within multiple silkscreen grids are identical. This makes it easier for operators to locate the position information of the probe solder points and facilitates finding the corresponding probes during subsequent maintenance. Compared with existing designs, this solution increases the recognizability of each solder point through differentiated design of the probe solder points and reduces the time spent by operators to find the corresponding solder points during the welding process by using silkscreen lines to distinguish them, thereby reducing the manufacturing time of the cantilever probe card. In other words, the design method in this embodiment increases recognizability, reduces welding time, improves work efficiency, and enhances welding accuracy.

[0069] The steps described above will be explained in detail below.

[0070] In some embodiments, after step S120, the method may further include the following steps:

[0071] Step a) Based on the grouping results, set up color-developing materials corresponding to invisible light of different wavelengths around the designated probe solder points in different probe solder point groups, so that the probe solder points of different probe solder point groups can be distinguished by the display effect after being irradiated by invisible light.

[0072] Each probe solder joint group corresponds to a wavelength of invisible light. As one possible implementation, the different wavelengths of invisible light include any one or more of the following: infrared, ultraviolet, and far-infrared.

[0073] It should be noted that the screen printing is done twice. Normal screen printing is done once first, and then screen printing is done again for the color developing material.

[0074] In this embodiment, different wavelengths of invisible light corresponding to specific probe solder joints in different probe solder joint groups are applied around them based on the grouping results. When invisible light of a certain wavelength illuminates all probe solder joints on the PCB, the color-developing material corresponding to that wavelength will display an effect different from other grouped areas, thus facilitating the operator to distinguish the probe solder joints surrounded by that color-developing material. It should be noted that when each wavelength of invisible light illuminates the PCB, it is not necessary to illuminate different areas; illuminating all probe solder joints on the PCB is sufficient. This allows for a clear and effective distinction between probe solder joints in different probe solder joint groups after each illumination with a different wavelength of invisible light.

[0075] Based on step a) above, after step a), the method may further include the following steps:

[0076] Step b) According to the preset illumination priority order, multiple probe solder joints are illuminated with invisible light of different wavelengths during the soldering process for different probe solder joint groups.

[0077] The preset lighting priority order is the preset lighting order of invisible light of different wavelengths.

[0078] In practical applications, all probe solder joints on the PCB can be illuminated with invisible light multiple times, each time with a different wavelength of invisible light. The order of illuminating different wavelengths of invisible light can be based on a preset light priority order. This makes it easier to determine the corresponding wavelength of invisible light illuminating each time according to certain order rules, and thus determine the corresponding probe solder joint group.

[0079] In some embodiments, after step S120, the method may further include the following steps:

[0080] Step c) Based on the grouping results, set the thermosensitive material with different temperature ranges around the probe solder points in different probe solder point groups so that the probe solder points in different probe solder point groups can be distinguished and displayed by different ambient temperatures.

[0081] Each probe solder joint group corresponds to a specific temperature range. In this embodiment, thermistor materials with different temperature ranges are set around designated probe solder joints in different probe solder joint groups based on the grouping results. When all probe solder joints on the PCB have passed through the ambient temperature of a certain temperature range, the thermistor material corresponding to that temperature range will show a different effect from other probe solder joint group areas, thus making it easier for the operator to distinguish the probe solder joints with that type of thermistor material around them.

[0082] It should be noted that when the probe solder joints pass through an ambient temperature range, there is no need to heat the PCB in sections. It is sufficient to heat all the probe solder joints on the PCB evenly. This allows for a clear and effective distinction between probe solder joints in different probe solder joint groups after passing through different ambient temperatures each time.

[0083] In some embodiments, the process of setting a highlight mark for each specific probe solder joint in step S140 above may include the following steps:

[0084] Step d) involves placing fluorescent material around each specific probe solder joint to highlight each specific probe solder joint using ultraviolet light.

[0085] In this embodiment, by placing fluorescent material around a specific probe solder joint, when all probe solder joints on the PCB are irradiated with ultraviolet light, the specific probe solder joint with fluorescent material will show a different effect from other grouped areas, thus making it easier for the operator to distinguish the probe solder joint with fluorescent material. It should be noted that when ultraviolet light is irradiated on the PCB, it is not necessary to irradiate in sections; irradiating all probe solder joints on the PCB with ultraviolet light is sufficient, enabling a clear and effective distinction between the specific probe solder joint and other non-specific probe solder joints after ultraviolet light irradiation.

[0086] In some embodiments, after step S120, the method may further include the following steps:

[0087] Step e) Determine the focus position on the PCB board using an AI camera, and use the focus position to lock the position of multiple probe solder points on the PCB board;

[0088] Step f) Based on the grouping results and the locked positions of multiple probe solder joints, a laser is used to irradiate the separation positions between each probe solder joint group to isolate the multiple probe solder joint groups through the laser line.

[0089] It should be noted that the AI ​​camera can determine the focal point on the PCB board using existing image recognition and positioning technology, and then use image content tracking technology to lock the position of multiple probe solder points based on the focal point.

[0090] In practical applications, the laser can be directed parallel to the PCB board to isolate multiple different probe solder joint groups. By using image recognition positioning and tracking technology to locate the positions of multiple probe solder joints, and based on this, laser irradiation can isolate multiple probe solder joint groups, achieving accurate isolation between different probe solder joint groups even when the PCB board is moving.

[0091] Figure 9 A schematic diagram of a processing device for a cantilever probe card is provided. Multiple probe solder points are arranged on a PCB board. For example... Figure 9 As shown, the processing device 900 for the cantilever probe card includes:

[0092] The acquisition module 901 is used to acquire the specified division method corresponding to the plurality of probe solder joints;

[0093] Grouping module 902 is used to group the multiple probe solder joints based on the specified division method to obtain grouping results;

[0094] The first setting module 903 is used to set silkscreen lines at the separation positions between each probe solder joint group according to the grouping result, so as to isolate the multiple probe solder joint groups through the silkscreen mesh formed by the silkscreen lines.

[0095] The determination module 904 is used to determine a specific probe solder point in each probe solder point group and set a highlight mark for each specific probe solder point to distinguish the specific probe solder point from the probe solder points in the probe solder point group other than the specific probe solder point.

[0096] In some embodiments, the device further includes:

[0097] The second setting module is used to set color-developing materials corresponding to invisible light of different wavelengths around a specified probe solder point in different probe solder point groups according to the grouping results, so that the probe solder points in different probe solder point groups can be distinguished by the display effect after being irradiated by the invisible light.

[0098] Each of the probe solder joints corresponds to a wavelength of invisible light.

[0099] In some embodiments, the invisible light of different wavelengths includes any one or more of the following:

[0100] Infrared rays, ultraviolet rays, and far-infrared rays.

[0101] In some embodiments, the device further includes:

[0102] The illumination module is used to illuminate the multiple probe solder joints with invisible light of different wavelengths according to a preset illumination priority order during the welding process for different probe solder joint groups.

[0103] The preset illumination priority order is the preset illumination order of the different wavelengths of invisible light.

[0104] In some embodiments, the device further includes:

[0105] The third setting module is used to set the thermosensitive material with different temperature ranges around the probe solder points in different probe solder point groups according to the grouping results, so that the probe solder points in different probe solder point groups can be distinguished by different ambient temperatures to achieve different display effects.

[0106] Each of the probe solder joint groups corresponds to a temperature range.

[0107] In some embodiments, the determining module 904 is specifically used for:

[0108] Fluorescent material is placed around each of the specific probe solder joints to make each of the specific probe solder joints stand out under ultraviolet light.

[0109] The cantilever probe card processing device provided in this application embodiment has the same technical features as the cantilever probe card processing method provided in the above embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0110] An electronic device provided in this application embodiment, such as Figure 10 As shown, the electronic device 1000 includes a processor 1002 and a memory 1001. The memory stores a computer program that can run on the processor. When the processor executes the computer program, it implements the steps of the method provided in the above embodiments.

[0111] See Figure 10 The electronic device also includes a bus 1003 and a communication interface 1004. The processor 1002, the communication interface 1004 and the memory 1001 are connected via the bus 1003. The processor 1002 is used to execute executable modules, such as computer programs, stored in the memory 1001.

[0112] The memory 1001 may include high-speed random access memory (RAM) or non-volatile memory, such as at least one disk storage device. Communication between this system network element and at least one other network element is achieved through at least one communication interface 1004 (which can be wired or wireless), such as the Internet, wide area network, local area network, metropolitan area network, etc.

[0113] Bus 1003 can be an ISA bus, PCI bus, or EISA bus, etc. The bus can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 10 The symbol is represented by a single double-headed arrow, but this does not mean that there is only one bus or one type of bus.

[0114] The memory 1001 is used to store programs. After receiving an execution instruction, the processor 1002 executes the program. The method executed by the apparatus defined by the process disclosed in any of the preceding embodiments of this application can be applied to the processor 1002 or implemented by the processor 1002.

[0115] The processor 1002 may be an integrated circuit chip with signal processing capabilities. In implementation, each step of the above method can be completed by the integrated logic circuitry in the hardware of the processor 1002 or by instructions in software form. The processor 1002 may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of this application can be directly manifested as execution by a hardware decoding processor, or execution by a combination of hardware and software modules in the decoding processor. The software module can reside in a mature storage medium in the field, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. This storage medium is located in memory 1001. Processor 1002 reads the information in memory 1001 and, in conjunction with its hardware, completes the steps of the above method.

[0116] Corresponding to the above-described processing method for the cantilever probe card, this application embodiment also provides a computer-readable storage medium storing computer-executable instructions. When the computer-executable instructions are invoked and executed by a processor, the computer-executable instructions cause the processor to perform the steps of the above-described processing method for the cantilever probe card.

[0117] The processing device for the cantilever probe card provided in this application embodiment can be specific hardware on the device or software or firmware installed on the device. The implementation principle and technical effects of the device provided in this application embodiment are the same as those in the foregoing method embodiments. For the sake of brevity, any parts not mentioned in the device embodiment can be referred to the corresponding content in the foregoing method embodiments. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can all be referred to the corresponding processes in the above method embodiments, and will not be repeated here.

[0118] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0119] For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0120] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0121] In addition, the functional units in the embodiments provided in this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0122] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the cantilever probe card processing method described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0123] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "first", "second", "third", etc. are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0124] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. All should be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A cantilever probe card, characterized in that, The PCB includes a plurality of probe solder joints and a silkscreen grid arranged on the PCB, wherein the plurality of probe solder joints are disposed within the silkscreen grid; The multiple probe solder points within each silkscreen grid form a square array; the multiple probe solder points in each square array correspond to various shapes; the probe solder points of the same shape in multiple square arrays have the same relative position in different silkscreen grids; The relative position refers to the position relative to the multiple probe solder points within the same silkscreen mesh.

2. A method for processing a cantilever probe card, characterized in that, The method includes: (1) A PCB board with multiple probe solder joints arranged in a specific pattern. Obtain the specified division method corresponding to the multiple probe solder joints; Based on the specified division method, the multiple probe solder joints are grouped to obtain the grouping results; Based on the grouping results, silkscreen lines are set at the separation positions between each probe solder joint group to isolate the multiple probe solder joint groups through the silkscreen mesh formed by the silkscreen lines. Identify specific probe solder points in each probe solder point group and assign a highlight mark to each specific probe solder point to distinguish it from other probe solder points in the probe solder point group.

3. The method according to claim 2, characterized in that, After grouping the plurality of probe solder joints based on the specified division method to obtain the grouping results, the method further includes: Based on the grouping results, color-developing materials corresponding to invisible light of different wavelengths are set around designated probe solder points in different probe solder point groups, so that the probe solder points of different probe solder point groups can be distinguished and displayed after being irradiated by the invisible light. Each of the probe solder joints corresponds to a wavelength of invisible light.

4. The method according to claim 3, characterized in that, The invisible light of different wavelengths includes any one or more of the following: Infrared rays, ultraviolet rays, and far-infrared rays.

5. The method according to claim 3, characterized in that, After setting color-developing materials corresponding to different wavelengths of invisible light around designated probe solder joints in different probe solder joint groups according to the grouping results, the method further includes: According to the preset illumination priority order, during the welding process for different probe solder joint groups, the multiple probe solder joints are illuminated with invisible light of different wavelengths. The preset illumination priority order is the preset illumination order of the different wavelengths of invisible light.

6. The method according to claim 2, characterized in that, After grouping the plurality of probe solder joints based on the specified division method to obtain the grouping results, the method further includes: Based on the grouping results, thermistor materials with different temperature ranges are set around the probe solder points in different probe solder point groups so that the probe solder points in different probe solder point groups can be distinguished by different ambient temperatures to achieve different display effects. Each of the probe solder joint groups corresponds to a temperature range.

7. The method according to claim 2, characterized in that, The step of highlighting each specific probe solder joint includes: Fluorescent material is placed around each of the specific probe solder joints to make each of the specific probe solder joints stand out under ultraviolet light.

8. A processing device for a cantilever probe card, characterized in that, The device includes multiple probe solder joints arranged on a PCB board: The acquisition module is used to acquire the specified division method corresponding to the multiple probe solder joints; The grouping module is used to group the multiple probe solder joints based on the specified division method to obtain the grouping results; The setting module is used to set silkscreen lines at the separation positions between each probe solder joint group according to the grouping results, so as to isolate the multiple probe solder joint groups through the silkscreen mesh formed by the silkscreen lines. The determination module is used to determine a specific probe solder point in each probe solder point group and set a highlight mark for each specific probe solder point to distinguish the specific probe solder point from other probe solder points in the probe solder point group.

9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method described in any one of claims 2 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions that, when invoked and executed by a processor, cause the processor to perform the method according to any one of claims 2 to 7.

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