A high-efficiency heat dissipation laser module for a laser photodynamic therapeutic instrument

Abstract

The application discloses a high-efficiency heat dissipation laser module for a laser photodynamic therapeutic instrument, and belongs to the field of heat dissipation of laser photodynamic therapeutic instruments. The high-efficiency heat dissipation laser module for the laser photodynamic therapeutic instrument comprises a mounting plate and a laser assembly, the laser assembly is mounted on the mounting plate, the top surface of the mounting plate is fixedly connected with a protective shell, and the upper side of the protective shell is provided with a heat dissipation assembly; a box body is fixedly connected to the front side wall of the protective shell close to the right side, a through groove is formed in the side wall of the box body, and a cooling assembly is mounted in the through groove; a partition plate is fixedly connected to the inner wall of the box body close to the top surface, and a flow guide assembly is arranged on the front side of the protective shell. The high-efficiency heat dissipation laser module can realize the following effects: the graphene heat dissipation sheet with super-high heat conduction performance can uniformly dissipate the heat generated during the operation of the laser assembly, and the temperature in the operation space of the laser assembly is reduced.

Description

A high-efficiency heat dissipation laser module for laser photodynamic therapy devices Technical Field

[0001] This invention relates to the field of heat dissipation in laser photodynamic therapy devices, and more specifically, to a high-efficiency heat dissipation laser module for laser photodynamic therapy devices. Background Technology

[0002] Photodynamic therapy (PDT) strictly falls under the category of laser therapy, but it differs from simple laser therapy. PDT involves intravenously injecting a photosensitizer into the patient. This photosensitizer identifies cancerous cells and selectively accumulates around them. 48-72 hours later, the tumor site is irradiated with light of a specific wavelength and intensity. This produces photochemical and photobiological effects, leading to irreversible damage to the tumor tissue through direct cytotoxicity and microvascular disruption—a minimally invasive treatment method.

[0003] Currently, commonly used photosensitizers are hematoporphyrin derivatives and dihematoporphyrin ethers. The irradiation laser is a red gold vapor laser. In addition, in recent years, the application of image-intensity focused endoscopy (PIT) systems has been used to observe green fluorescence in esophageal and gastric cancer patients 48–72 hours after intravenous injection of hematoporphyrin derivatives, aiding in tumor localization. PDT can be used in conjunction with radiotherapy, chemotherapy, and surgery to produce additive or synergistic effects; it can also be used for advanced cancers unsuitable for radiotherapy, chemotherapy, and surgery, especially for patients with advanced gastrointestinal tumors, significantly improving their quality of life and prolonging their survival time.

[0004] Currently, laser therapy devices can be broadly categorized based on their mechanisms of action into photocoagulation lasers, photosplit lasers, photocutting lasers, photodynamic therapy lasers, and low-power photodynamic therapy lasers. Photocoagulation lasers utilize the thermal effect of laser light to cause tissue coagulation, evaporation, vaporization, and carbonization; photosplit and photocutting lasers utilize the ionization or photochemical effect of laser light to split and cut tissue; and photocoagulation lasers, according to their classification, mainly include ruby ​​lasers, hydrogen ion lasers, semiconductor lasers, carbon dioxide lasers, high-energy ultrapulse carbon dioxide lasers, photocutting lasers, YAG lasers, and excimer lasers.

[0005] During laser therapy, the temperature of the laser module used to generate laser light increases over time. Currently, most laser modules used in laser therapy devices are semiconductor lasers. With the development of high-power semiconductor lasers, output power is constantly increasing, leading to a corresponding increase in the thermal effect of the chip. If the large amount of waste heat generated during laser operation cannot be dissipated in time, the temperature of the active region of the laser will rise rapidly, causing a redshift in wavelength, reducing the output power and conversion efficiency of the laser, and even shortening the lifespan or causing it to fail. Furthermore, the heat generated by the laser module in traditional laser therapy devices is generally dissipated by accelerating airflow with a fan. However, since the operating energy consumption of the laser module depends on the patient's condition, it is difficult to achieve timely cooling when the laser filter is too high. Therefore, the heat dissipation and thermal effect constraints of semiconductor lasers in laser therapy devices are issues that cannot be ignored. Summary of the Invention

[0006] 1. Technical problems to be solved

[0007] To address the problems existing in the prior art, the purpose of this invention is to provide a high-efficiency heat dissipation laser module for laser photodynamic therapy devices. It can achieve uniform heat dissipation of the heat generated by the laser component during operation by using a graphene heat sink with ultra-high thermal conductivity, while reducing the temperature in the operating space of the laser component.

[0008] 2. Technical Solution

[0009] To solve the above problems, the present invention adopts the following technical solution.

[0010] A high-efficiency heat dissipation laser module for a laser photodynamic therapy device includes a mounting plate and a laser component. The laser component is mounted on the mounting plate, a protective shell is fixedly connected to the top surface of the mounting plate, and a heat dissipation component is provided on the upper side of the protective shell.

[0011] A box body is fixedly connected to the front side wall of the protective shell near the right side. A through groove is opened on the side wall of the box body, and a cooling component is installed in the through groove.

[0012] A partition is fixedly connected to the inner wall of the box near the top surface, and a flow guide component is provided on the front side of the protective shell.

[0013] The airflow guiding component includes an air collecting shell, which is semi-circular in shape and fixedly connected to the front side of the first cooling fan near the bottom surface. An air guide pipe is fixedly connected to the side wall of the air collecting shell, and the other end of the air guide pipe is connected to the box body. An airflow conversion component is provided in the inner cavity of the box body.

[0014] Furthermore, the heat dissipation assembly includes a first heat conduction tube and several second heat conduction tubes. The first heat conduction tube is arranged in a ring. The second heat conduction tubes are fixedly connected to the first heat conduction tube. An adhesive is fixedly connected to the side wall of the second heat conduction tube. A first heat sink is fixedly connected to the top surface of the protective shell. The second heat conduction tubes are fixedly connected to the bottom surface of the first heat sink. A first cooling fan is installed on the front side wall of the protective shell.

[0015] The protective shell has several air outlets on its left and right side walls, and each air outlet side wall is fixedly connected with a dustproof net.

[0016] Furthermore, the cooling component includes a thermoelectric cooler, which is installed in a through slot. Cooling fins are fixedly connected to the rear sidewall of the thermoelectric cooler, and a second heat sink is fixedly connected to the front sidewall of the thermoelectric cooler. A second cooling fan is fixedly connected to the front sidewall of the second heat sink.

[0017] Furthermore, the airflow conversion component includes a partition plate, which is fixedly connected to the inner wall of the box near the top surface. The air guide pipe is located on the upper side of the partition plate. The top surface of the inner cavity of the box and the top surface of the partition plate are respectively fixedly connected to baffles, which are all inclined. The top surface of the partition plate near the protective shell has several through holes, and the front side wall of the protective shell near the bottom surface has several air inlet holes.

[0018] Furthermore, a filter screen is fixedly connected to the inner wall of the air collecting shell near the end face.

[0019] Furthermore, each of the four corners of the bottom surface of the first heat sink is fixedly connected to a connector, and each connector is movably connected to a bolt on its sidewall. The bolt is threadedly connected to the protective shell, and the second heat conduction tape is located between the protective shell and the first heat sink.

[0020] Furthermore, the number of air outlets is half that of the second heat conduction cable, and the air outlets correspond to the second heat conduction cable.

[0021] 3. Beneficial effects

[0022] Compared with the prior art, the advantages of this invention are:

[0023] (1) This technical solution uses the cooperation between the mounting plate, laser component, protective shell and heat dissipation component, etc., and uses graphene heat sink with ultra-high thermal conductivity for heat transfer. The graphene heat sink is attached to the laser component and the first heat sink, which effectively conducts the temperature generated by the laser component during operation through the graphene heat sink. Moreover, the chemical properties of the graphene heat sink are stable and will not affect the operation of the laser component.

[0024] (2) This technical solution can collect part of the wind force generated by the first cooling fan through the cooperation between the protective shell, cooling component and air guiding component, and collect the wind force in the box through the air guide tube. After the hot air is converted into cold air through the semiconductor cooling chip, it is delivered to the inside of the protective shell to cool the operating space of the laser component. At the same time, when the air flow in the protective shell is discharged from the air outlet, the air flow is directly facing the graphene heat sink to achieve the effect of auxiliary heat dissipation. Attached Figure Description

[0025] Figure 1 is a perspective view of the present invention;

[0026] Figure 2 is a schematic diagram of the oblique view structure of the present invention;

[0027] Figure 3 is a schematic diagram of the internal structure of the protective shell in this invention;

[0028] Figure 4 is a side view of the cooling component in this invention.

[0029] Figure 5 is a partial structural schematic diagram of the heat dissipation component in this invention;

[0030] Figure 6 is a schematic diagram of the internal structure of the air collecting shell in this invention;

[0031] Figure 7 is an enlarged view of point A in Figure 1 of this invention.

[0032] Explanation of the labels in the diagram:

[0033] 1. Mounting plate; 2. Laser assembly; 3. Protective shell; 4. First heat sink; 5. First heat conduction cable; 6. Second heat conduction cable; 7. Adhesive; 8. First cooling fan; 9. Box body; 10. Semiconductor cooling chip; 11. Cooling fins; 12. Second heat sink; 13. Second cooling fan; 14. Air collection shell; 15. Air duct; 16. Partition; 17. Through hole; 18. Air inlet; 19. Air outlet; 20. Dustproof screen; 21. Baffle; 22. Filter screen; 23. Connector. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0035] Example 1:

[0036] Please refer to Figures 1-7. A high-efficiency heat dissipation laser module for a laser photodynamic therapy device includes a mounting plate 1 and a laser component 2. The laser component 2 is mounted on the mounting plate 1. A protective shell 3 is fixedly connected to the top surface of the mounting plate 1. A heat dissipation component is provided on the upper side of the protective shell 3.

[0037] The heat dissipation component includes a first heat conduction zone 5 and several second heat conduction zones 6, both of which are made of graphene / graphene heat sinks. The thin-film polymer compound material can be obtained by chemical methods under high temperature and pressure to produce graphene film, which has plasticity like organic plastics and special thermal properties and chemical stability.

[0038] Graphene heat sinks have unique grain orientation, uniform thermal conductivity, and ultra-high thermal conductivity in the plane range of 150-1500W / mK. Due to their sheet-like structure, they can be used on the circuit board of laser component 2 and can be bonded to the circuit board with thermally conductive adhesive and other materials, which not only shields the heat source but also improves the performance of laser component 2.

[0039] A box 9 is fixedly connected to the front side wall of the protective shell 3 near the right side. A through groove is opened on the side wall of the box 9, and a cooling component is installed in the through groove.

[0040] A partition 16 is fixedly connected to the inner wall of the box 9 near the top surface, and a flow guide component is provided on the front side of the protective shell 3.

[0041] High-power semiconductor laser arrays (bars) consist of multiple light-emitting units. In most cases, each light-emitting unit in a bar is not perfectly aligned. This is because the thermal expansion mismatch between the chip and the heat sink substrate, as well as the mechanical and thermomechanical stresses generated during chip manufacturing and packaging, cause each light-emitting unit in the array to bend laterally and not be in a straight line, resulting in near-field nonlinear effects. Thermal design and management of conductively cooled packaged bars are very important. The thermal behavior of the device is closely related to the package structure. If the accumulated heat is not easily dissipated, the temperature rise of the pn junction will have an adverse effect on the output power, slope efficiency, threshold current, and device lifetime.

[0042] Referring to Figures 2 and 5, the heat dissipation assembly includes a first heat conduction cable 5 and several second heat conduction cables 6. The first heat conduction cable 5 is arranged in a ring. The second heat conduction cables 6 are fixedly connected to the first heat conduction cable 5. Adhesive 7 is fixedly connected to the side wall of the second heat conduction cable 6. A first heat sink 4 is fixedly connected to the top surface of the protective shell 3. The second heat conduction cables 6 are fixedly connected to the bottom surface of the first heat sink 4. A first cooling fan 8 is installed on the front side wall of the protective shell 3. Connectors 23 are fixedly connected to the bottom surface of the first heat sink 4 near the four corners. Bolts are movably connected to the side wall of each connector 23. The bolts are threadedly connected to the protective shell 3. The second heat conduction cables 6 are located between the protective shell 3 and the first heat sink 4, and there is a gap between the first heat sink 4 and the protective shell 3. This gap facilitates the installation of the second heat conduction cables 6 and enhances the airflow between the second heat conduction cables 6 and the first heat sink 4. The number of second heat conduction cables 6 is at least four.

[0043] Among them, graphene heat sinks use graphene or graphene mixed with carbon nanotubes, metals, etc. as thermally conductive fillers. Existing technologies make it difficult to mass-produce high-quality single-layer graphene, while few-layer or multi-layer graphene is relatively easy to prepare and inexpensive, and it can maintain thermal conductivity. The graphite layer can be naturally connected to the heat sink, avoiding the problem of contact thermal resistance in application. The thermal conductivity is more than 20% higher than that of conventional nano heat sinks.

[0044] Graphene heat sinks are actually a typical thermal management system, consisting of an external cooling device and a combination of a heat sink and a thermal cross-section. The key function of the heat sink is to create the maximum effective surface area, on which heat is transferred and carried away by an external cooling medium. Thermally conductive graphite sheets effectively transfer heat by uniformly distributing it across a two-dimensional plane, thus ensuring that components operate within their operating temperatures.

[0045] By utilizing the advantages of graphite such as its plasticity, excellent thermal conductivity, and thinness, graphite can be made into thin sheets that can be attached to heat sources. This allows the heat from a single point to be evenly and horizontally distributed, thus enabling the high heat of an electronic product to be dissipated over a wide area. This effectively protects the lifespan of the electronic product; it can also prevent contact between components and provide some shock resistance.

[0046] The protective shell 3 has several air outlets 19 on its left and right side walls. Each air outlet 19 is fixedly connected to a dustproof net 20. The number of air outlets 19 is half that of the second heat conduction cable 6. The air outlets 19 correspond to the second heat conduction cable 6. The airflow gathered inside the protective shell 3 is discharged through the air outlets 19. The air outlets 19 are directly facing the second heat conduction cable 6, which can provide auxiliary heat dissipation for the external second heat conduction cable 6 and reduce the heat transferred to the first heat sink 4.

[0047] Through the cooperation of mounting plate 1, laser component 2, protective shell 3 and heat dissipation components, heat is transferred using graphene heat sink with ultra-high thermal conductivity. The graphene heat sink is attached to laser component 2 and first heat sink 4, effectively conducting the temperature generated by laser component 2 during operation through graphene heat sink. Moreover, the chemical properties of graphene heat sink are stable and will not affect the operation of laser component 2.

[0048] Referring to Figures 1 and 4, the cooling assembly includes a thermoelectric cooler 10, which is installed in a through slot. A cooling fin 11 is fixedly connected to the rear side wall of the thermoelectric cooler 10, and a second heat sink 12 is fixedly connected to the front side wall of the thermoelectric cooler 10. A second cooling fan 13 is fixedly connected to the front side wall of the second heat sink 12.

[0049] When current flows through a thermocouple pair consisting of an N-type semiconductor and a P-type semiconductor, heat transfer occurs between the two ends, creating a temperature difference and forming hot and cold ends. However, semiconductors have inherent resistance, which generates heat when current passes through them, affecting heat transfer. Furthermore, heat between the two electrodes also flows in the reverse direction through the air and the semiconductor material itself. When the temperature difference between the hot and cold ends reaches a certain level, and the amounts of these two types of heat transfer are equal, an equilibrium point is reached, and the forward and reverse heat transfers cancel each other out. At this point, the temperature of the hot and cold ends will not change further. To achieve even lower temperatures, heat dissipation methods can be used to reduce the temperature of the hot end. The temperature difference between the hot and cold surfaces of the semiconductor cooling chip 10 can be maintained between 10-65°C, thus meeting the cooling requirements of the laser component 2 and reducing the temperature inside the protective shell 3 to between 10-25°C.

[0050] Referring to Figures 1 and 4, the airflow guiding component includes an air collecting shell 14. The air collecting shell 14 is semi-circular, which facilitates the collection of airflow blown out by the first cooling fan 8. The air collecting shell 14 is fixedly connected to the front side of the first cooling fan 8 near the bottom surface. An air guide pipe 15 is fixedly connected to the side wall of the air collecting shell 14. The other end of the air guide pipe 15 is connected to the housing 9. An airflow conversion component is provided in the inner cavity of the housing 9. A filter screen 22 is fixedly connected to the inner wall of the air collecting shell 14 near the end face. The filter screen 22 can block impurities and dust, preventing dust from entering the protective shell 3 with the air guide pipe 15 and affecting the operation of the laser component 2.

[0051] Through the cooperation of the protective shell 3, the cooling component and the air guiding component, part of the air force generated by the first cooling fan 8 can be collected. The air force is collected in the box 9 by the air guide 15, and the hot air is converted into cold air by the semiconductor cooling chip 10 and then delivered to the inside of the protective shell 3 to cool the operating space of the laser component 2. At the same time, when the air flow in the protective shell 3 is discharged from the air outlet 19, the air flow is directed towards the graphene heat sink to achieve the effect of auxiliary heat dissipation.

[0052] Referring to Figures 4 and 7, the airflow conversion assembly includes a partition 16, which is fixedly connected to the inner wall of the box 9 near the top surface. The air duct 15 is located on the upper side of the partition 16. Baffles 21 are fixedly connected to the top surface of the inner cavity of the box 9 and the top surface of the partition 16, respectively. The baffles 21 are all inclined and vertically distributed between the two sides. Several through holes 17 are opened on the top surface of the partition 16 near the protective shell 3. Several air inlets 18 are opened on the front side wall of the protective shell 3 near the bottom surface. The inclined angle of the last baffle 21 is downward, which can make the airflow flow towards the air inlet 18. The temperature inside the box 9 and the partition 16 can be reduced by the cooling fins 11. When the air enters the upper side of the partition 16, the airflow flows in a wave shape with the distribution of the baffles 21. During the flow, the low temperature transmitted by the partition 16 is used to initially convert the hot airflow into cold airflow.

[0053] In use: When the laser component 2 is running at a high temperature, the temperature on the circuit board of the laser component 2 will be transferred to the first heat conduction cable 5. The first heat conduction cable 5 will transfer the temperature to the first heat sink 4 through multiple second heat conduction cables 6. The multiple fins on the first heat sink 4 can increase the contact area with the air for heat dissipation. At the same time, the first cooling fan 8 will be activated. The first cooling fan 8 will draw out the hot air from the first heat sink 4, accelerate the airflow near the first heat sink 4, and enhance the heat dissipation rate.

[0054] The first cooling fan 8 generates airflow during operation. Part of the airflow enters the air collection shell 14 and is discharged into the upper side of the box 9 through the air duct 15. At this time, the semiconductor cooling chip 10 is in operation. The semiconductor cooling chip 10 has a cooling surface on one side inside the box 9 and a heating surface on the other side. The cooling fins 11 can reduce the temperature inside the box 9. When the airflow enters the upper side of the partition 16, the airflow flows in a wave shape with the distribution of the baffle 21. During the flow, the low temperature transmitted by the partition 16 is used to initially convert the hot airflow into cold airflow. Then, the airflow enters the interior of the box 9 through the through hole 17 and comes into contact with the cooling fins 11. It is then discharged into the interior of the protective shell 3 through the air inlet 18 to reduce the overall temperature inside the protective shell 3, thereby achieving the purpose of reducing the working space temperature of the laser component 2. The airflow collected inside the protective shell 3 is discharged through the air outlet 19, which is directly facing the second heat conduction cable 6. It can provide auxiliary heat dissipation treatment for the external second heat conduction cable 6, reduce the heat transferred to the first heat sink 4, and thus effectively improve the heat dissipation effect of the laser component 2.

[0055] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. A high-efficiency heat dissipation laser module for a laser photodynamic therapy device, comprising a mounting plate (1) and a laser assembly (2), wherein the laser assembly (2) is mounted on the mounting plate (1), characterized in that: A protective shell (3) is fixedly connected to the top surface of the mounting plate (1), and a heat dissipation component is provided on the upper side of the protective shell (3); a box (9) is fixedly connected to the front side wall of the protective shell (3) near the right side, and a through groove is opened on the side wall of the box (9), and a cooling component is installed in the through groove; a partition (16) is fixedly connected to the inner wall of the box (9) near the top surface, and a flow guiding component is provided on the front side of the protective shell (3); the heat dissipation component includes a first heat conduction tube (5) and several second heat conduction tubes (6), the first heat conduction tube (5) is arranged in a ring, and the first heat conduction tube (5) and Several second conductive heat pipes (6) are graphene heat sinks. The second conductive heat pipes (6) are fixedly connected to the first conductive heat pipes (5). Adhesive (7) is fixedly connected to the side wall of the second conductive heat pipes (6). The top surface of the protective shell (3) is fixedly connected to the first heat sink (4). The second conductive heat pipes (6) are fixedly connected to the bottom surface of the first heat sink (4). The front side wall of the protective shell (3) is equipped with a first cooling fan (8). Several air outlet holes (19) are opened on the left and right side walls of the protective shell (3). Dustproof nets (20) are fixedly connected to the side walls of the air outlet holes (19).

2. The high-efficiency heat dissipation laser module for a laser photodynamic therapy device according to claim 1, characterized in that: The cooling component includes a semiconductor cooling chip (10), which is installed in a through slot. A cooling fin (11) is fixedly connected to the rear side wall of the semiconductor cooling chip (10), and a second heat sink (12) is fixedly connected to the front side wall of the semiconductor cooling chip (10). A second cooling fan (13) is fixedly connected to the front side wall of the second heat sink (12).

3. The high-efficiency heat dissipation laser module for a laser photodynamic therapy device according to claim 1, characterized in that: The airflow guiding component includes an air collecting shell (14), which is semi-circular in shape. The air collecting shell (14) is fixedly connected to the front side of the first cooling fan (8) near the bottom surface. An air guide pipe (15) is fixedly connected to the side wall of the air collecting shell (14). The other end of the air guide pipe (15) is connected to the box body (9). An airflow conversion component is provided in the inner cavity of the box body (9).

4. The high-efficiency heat dissipation laser module for a laser photodynamic therapy device according to claim 3, characterized in that: The airflow conversion component includes a partition (16), which is fixedly connected to the inner wall of the box (9) near the top surface. The air guide pipe (15) is located on the upper side of the partition (16). The top surface of the inner cavity of the box (9) and the top surface of the partition (16) are respectively fixedly connected to baffles (21). The baffles (21) are all inclined. The top surface of the partition (16) near the protective shell (3) has several through holes (17). The front side wall of the protective shell (3) near the bottom surface has several air inlets (18).

5. The high-efficiency heat dissipation laser module for a laser photodynamic therapy device according to claim 3, characterized in that: A filter screen (22) is fixedly connected to the inner wall of the air collecting shell (14) near the end face.

6. The high-efficiency heat dissipation laser module for a laser photodynamic therapy device according to claim 1, characterized in that: The bottom surface of the first heat sink (4) is fixedly connected to the four corners of each of the four corners. The side walls of the connectors (23) are movably connected to bolts. The bolts are threadedly connected to the protective shell (3). The second heat conduction cable (6) is located between the protective shell (3) and the first heat sink (4).

7. The high-efficiency heat dissipation laser module for a laser photodynamic therapy device according to claim 1, characterized in that: The number of air outlets (19) is half that of the second heat conduction cable (6), and the air outlets (19) correspond to the second heat conduction cable (6).

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