Carbon-free laser cutting device and process method for green porcelain plate

Abstract

The present application relates to a kind of green porcelain plate carbon-free laser cutting device and process method, process method includes: green porcelain plate is fixed, so that the cutting area of green porcelain plate is in hollow state, and laser focal point is set in the thickness center of green porcelain piece;Green porcelain plate is cut according to original pattern using selected power, the difference value of the actual cutting contour size and original pattern is measured, the ablation radius of green porcelain plate under selected power is obtained, and original pattern is compensated using ablation radius, to obtain processing pattern;From the direction of cutting finished product, offset a distance of ablation radius by processing pattern, to obtain offset pattern;First, green porcelain plate is cut according to offset pattern, then green porcelain plate is cut according to processing pattern twice, dust cleaning is carried out using dust removal device and air compression device simultaneously during cutting, to obtain cutting finished product.The carbon-free laser cutting process method can obtain green porcelain cutting section with small taper, clean, no slag, not black.

Description

Technical Field

[0001] This invention belongs to the field of laser cutting technology, specifically relating to a non-carbonization laser cutting device and process for green ceramic plates. Background Technology

[0002] LTCC / HTCC electronic ceramics are widely used in emerging electronic fields and represent an important development direction for micro-integrated circuits. Green ceramics refer to materials that have not yet been sintered into electronic ceramics at high temperatures. Compared to sintered electronic ceramics, which exhibit hardness and brittleness, green ceramics are easier to cut and drill. Therefore, in industry, green ceramic plates are typically cut and drilled first, followed by high-temperature sintering to obtain the desired LTCC / HTCC electronic ceramics.

[0003] Traditional methods of cutting green ceramics involve contact machining, which can deform the ceramic slab and prevent precision cutting. Laser cutting, a non-contact method, offers high precision, stability, and flexibility, meeting the needs of various shapes. However, laser processing generates heat, leading to ablation of the cutting edges, carbonization, and blackening of the cut surface. Furthermore, the thicker the green ceramic, the longer the cutting time, resulting in greater heat accumulation and more severe blackening, ultimately affecting the electrical properties of the sintered electronic ceramics. Summary of the Invention

[0004] To address the aforementioned problems in the existing technology, this invention provides a carbon-free laser cutting device and process for green ceramic plates. The technical problem to be solved by this invention is achieved through the following technical solution:

[0005] This invention provides a carbon-free laser cutting device for green ceramic slabs, comprising: a laser, a beam adjustment system, a scanning galvanometer, a telecentric scene, a dust removal device, an air compression device, and a tooling fixture.

[0006] The laser is used to emit a laser beam;

[0007] The beam adjustment system is disposed in the optical path of the laser and is used to adjust the laser beam by expanding the beam, adjusting the divergence angle, and adjusting the beam direction.

[0008] The scanning galvanometer is disposed in the optical path of the beam adjustment system and is used to control the trajectory of the laser beam.

[0009] The telecentric scene is set at the beam emitting end of the scanning galvanometer to focus the laser beam and form a focused spot to cut the green ceramic plate.

[0010] The tooling fixture is set at the focused spot formed by the telecentric scene focusing, and is used to fix the green ceramic plate so that the cutting area of ​​the green ceramic plate is in a hollow state.

[0011] The dust removal device is located at the cutting position of the green ceramic plate and is used to adsorb the dust and soot generated during cutting.

[0012] The air compressor is located at the cutting position of the green ceramic plate and is opposite to the dust removal device, and is used to assist the dust removal device in cleaning dust.

[0013] In one embodiment of the present invention, the beam adjustment system includes a beam expander, a first reflector, and a second reflector, wherein,

[0014] The beam expander is disposed in the optical path of the laser and is used to adjust the beam expansion and divergence angle of the laser beam;

[0015] The first reflector is disposed in the optical path of the beam expander and is used to guide the laser beam for the first time.

[0016] The second reflector is disposed in the optical path of the first reflector and is used to guide the laser beam a second time.

[0017] In one embodiment of the present invention, when the finished product is a ceramic tile with an inner cavity, the tooling fixture includes a base, several beams, and several ribs, wherein,

[0018] The beams are distributed parallel to each other on the base, and the ribs are distributed perpendicularly on the beams. The beams are provided with adsorption holes to fix the green ceramic plate, and the cut area of ​​the green ceramic plate is located in the area formed by the intersection of the beams and the ribs.

[0019] In one embodiment of the present invention, when the finished product is a single piece of green ceramic, and the tooling fixture includes a base and an adsorption device, wherein...

[0020] The adsorption device is fixed on the base and is used to adsorb the green ceramic plate. The cut area of ​​the green ceramic plate is located around the adsorption device.

[0021] Another embodiment of the present invention provides a carbon-free laser cutting process for green ceramic plates, comprising the following steps:

[0022] S1. Fix the green ceramic plate so that the cutting area of ​​the green ceramic plate is in a hollow state, and set the laser focus at the center of the thickness of the green ceramic plate.

[0023] S2. Cut the green ceramic plate according to the original pattern using the selected power, measure the difference between the actual cut outer dimensions and the original pattern, obtain the ablation radius of the green ceramic plate under the selected power, and use the ablation radius to compensate for the original pattern to obtain the processed pattern;

[0024] S3. Offset the processing pattern by a distance equal to the ablation radius in a direction away from the cut finished product to obtain an offset pattern;

[0025] S4. First, cut the green ceramic plate according to the offset pattern, and then cut the green ceramic plate a second time according to the processing pattern. At the same time as cutting, use a dust removal device and an air compression device to clean the dust and obtain the cut finished product.

[0026] In one embodiment of the present invention, when the cut finished product is a ceramic tile with an inner cavity, step S3 includes:

[0027] The processed pattern is offset inward by a distance equal to the ablation radius to obtain the offset pattern, which is located inside the processed pattern.

[0028] In one embodiment of the present invention, when the cut product is a single piece of green ceramic, step S3 includes:

[0029] The processed pattern is offset outward by a distance equal to the ablation radius to obtain the offset pattern, which is located outside the processed pattern.

[0030] In one embodiment of the present invention, step S4 includes:

[0031] Place any corner of the offset pattern at the center of the scanning galvanometer and use it as the center of the first galvanometer. Cut the green ceramic plate according to the offset pattern, and cut the two sides of the green ceramic piece closest to the center of the first galvanometer according to the processing pattern. At the same time as cutting, use a dust removal device and an air compression device to clean the dust.

[0032] The angle between the processing pattern and the center of the first galvanometer is placed at the center of the scanning galvanometer and used as the center of the second galvanometer. The two sides of the green ceramic piece closest to the center of the second galvanometer are cut according to the processing pattern. During the cutting process, dust is cleaned using a dust removal device and an air compression device to obtain the cut finished product.

[0033] In one embodiment of the present invention, the laser power of the processed pattern is less than the laser power of the bias pattern.

[0034] In one embodiment of the present invention, the adsorption port of the dust removal device is parallel to the green ceramic plate, the height of the adsorption port from the surface of the green ceramic plate is 2-4cm, and the center distance of the adsorption port from the cutting line is 4-6cm.

[0035] The air nozzle of the air compressor is 9-11 cm away from the cutting line and forms a 30° angle with the horizontal plane of the green ceramic plate. The air pressure of the air compressor is 0.1 MPa.

[0036] The thickness of the raw ceramic slab is 0.12-5mm.

[0037] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0038] 1. The carbon-free laser cutting process of the present invention, by offsetting the cutting product by a distance equal to the ablation radius, first cuts according to the offset pattern, and then performs a second cut according to the processing pattern. After moving a distance equal to the length of the ablation radius, half of the laser spot acts on the edge of the green porcelain, while the other half does not act. At this time, the cutting position is no longer a semi-closed kerf cavity, but an open space, which can effectively cool down. In this state, a large amount of slag and dust will not be generated. A small amount of black slag and dust will not splash onto the cutting surface, but will be sprayed from the cutting surface to the open space and promptly removed under the combined action of the dust removal system and the off-axis blowing. This can result in a green porcelain cutting surface with a small taper, clean, slag-free, and non-blackening.

[0039] 2. The carbon-free laser cutting process of the present invention is applicable to all common green ceramic plate thicknesses. It is mainly used for carbon-free, blackening cutting and drilling of LTCC / HTCC green ceramic plates with a thickness greater than 2mm. The thicker the green ceramic plate, the more obvious the improvement effect, which greatly enhances and improves the performance of sintered electronic ceramics. Attached Figure Description

[0040] Figure 1 A non-carbonization laser cutting device for green ceramic plates is provided in this embodiment of the invention;

[0041] Figure 2 This is a schematic diagram of the structure of a cutting fixture for the inner cavity of a green ceramic plate provided in an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of the structure of a single-piece cutting fixture for green ceramic plates provided in an embodiment of the present invention;

[0043] Figure 4 A schematic diagram illustrating the process principle of cutting the inner cavity of a green ceramic plate according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram illustrating the process principle of single-piece cutting of green ceramic slabs provided in an embodiment of the present invention.

[0045] Figure 6 This invention provides a comparative diagram of the principles of carbonized blackening and non-carbonized blackening on a cut surface.

[0046] Figure 7 Comparison of the cutting effects of carbonized and non-carbonized 4mm thick raw ceramic plates provided in this embodiment of the invention. Detailed Implementation

[0047] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0048] Example 1

[0049] Please see Figure 1 , Figure 1 This invention provides a carbon-free laser cutting device for green ceramic slabs. The carbon-free laser cutting device for green ceramic slabs includes a laser 1, a beam adjustment system 2, a scanning galvanometer 3, a telecentric scene 4, a dust removal device 5, an air compression device 6, and a tooling fixture 7.

[0050] The laser 1 is used to emit a laser beam. The beam adjustment system 2 is located in the optical path of the laser 1 and is used to adjust the beam expansion, divergence angle, and beam direction. The scanning galvanometer 3 is located in the optical path of the beam adjustment system 2 and is used to control the trajectory of the laser beam. The telecentric scene 4 is located at the beam emitting end of the scanning galvanometer 3 and is used to focus the laser beam to form a high-energy-density focused spot for cutting the green ceramic plate. The tooling fixture 7 is located at the focused spot formed by the telecentric scene 4 and is used to fix the green ceramic plate, maintain the green ceramic piece, and ensure that the cutting area of ​​the green ceramic plate is in a hollowed-out state. The dust removal device 5 is located at the cutting position of the green ceramic plate and is used to adsorb dust and soot generated during cutting. The air compressor 6 is located at the cutting position of the green ceramic plate and opposite to the dust removal device 5, and is used to assist the dust removal device 5 in dust removal.

[0051] Specifically, laser 1 is an ultraviolet nanosecond laser with a wavelength of 355nm. The focal length of telecentric scene 4 is F=60~160mm.

[0052] Raw ceramic tiles are formed by the "casting" process of ceramic powder. During the laser process, a large amount of dust and soot will be generated. Therefore, this embodiment is equipped with a dust removal device to remove the dust and soot in a timely manner to prevent dust from adhering to the raw ceramic tiles.

[0053] Furthermore, the cutting device's auxiliary processing system also includes a high-precision positioning camera and a high-precision motion system.

[0054] In one specific embodiment, the beam adjustment system 2 includes a beam expander 21, a first reflector 22, and a second reflector 23. The beam expander 21 is disposed in the optical path of the laser 1 and is used to adjust the beam's expansion and divergence angle. The first reflector 22 is disposed in the optical path of the beam expander 21 and is used to guide the laser beam for the first time. The second reflector 23 is disposed in the optical path of the first reflector 22 and is used to guide the laser beam for the second time.

[0055] Please see Figure 2 , Figure 2 This is a schematic diagram of a cutting fixture for the inner cavity of a green ceramic plate provided in an embodiment of the present invention. When the finished product is a green ceramic plate with an inner cavity, the fixture is an adsorption and perforation fixture, including a base 71, several beams 72, and several ribs 73. The several beams 72 are distributed parallel to each other on the base 71, and the several ribs 73 are distributed perpendicularly on the several beams 72. The several beams 72 are provided with adsorption holes to fix the green ceramic plate, and the cutting area of ​​the green ceramic plate is located in the area formed by the intersection of the several beams 72 and the several ribs 73.

[0056] In this embodiment, when the finished product is an inner cavity, an adsorption-based perforated fixture is used to perforate the cutting area, which can effectively remove slag. After cutting through, the waste material falls off immediately, preventing the illusion of not cutting through and causing multiple ineffective cuts.

[0057] Please see Figure 3 , Figure 3 This is a schematic diagram of a single-piece cutting fixture for green ceramic slabs provided in an embodiment of the present invention. When the finished product is a single piece of green ceramic, the fixture 7 is a support and adsorption fixture, including a base 71 and an adsorption device 74. The adsorption device 74 is fixed on the base 71 and is used to adsorb the green ceramic slab. The cutting area of ​​the green ceramic slab is located around the adsorption device 74.

[0058] In this embodiment, when the finished product is a single piece of green ceramic, a support adsorption fixture is used. After the cutting waste (outer frame) falls off, the single piece of green ceramic is supported and adsorbed by the adsorption column, and then directly subjected to secondary cutting to remove carbonization and optimize the taper.

[0059] Specifically, for a 3mm thick green ceramic plate, using a 20W ultraviolet nanosecond laser, the wire processing capability of this device is 1~2mm / s.

[0060] Example 2

[0061] Based on Embodiment 1, this embodiment provides a non-carbonization laser cutting process for green ceramic plates, which can be performed using the cutting device described in Embodiment 1.

[0062] Green ceramic tiles are mainly made of alumina powder and polymer materials. To avoid the unavoidable contact and deformation of the blank during mechanical processing, non-contact laser processing has become an alternative process. The difficulty of laser processing lies in the fact that post-laser cutting treatments, such as ultrasonic cleaning or alcohol wiping, are not possible. In other words, the adverse effects of laser processing, such as ablation, can only be minimized from the laser's perspective.

[0063] Based on this, the carbon-free laser cutting process for green ceramic plates in this embodiment includes the following steps:

[0064] S1. Fix the green ceramic plate so that the cutting area of ​​the green ceramic plate is in a hollow state, and set the laser focus at the center of the thickness of the green ceramic plate.

[0065] First, the status of the cutting device is verified, including laser spot detection, optical path perpendicularity and concentricity verification, terminal (under telecentric field lens) power detection, laser focus calibration, offset calibration, tooling fixture installation and adsorption force test, etc.

[0066] After confirming the status is correct, place the green ceramic plate on the fixture and fix it in place, so that the cutting area of ​​the green ceramic plate is in a hollowed-out state. Specifically, if the cut product is a green ceramic tile with an inner cavity, select... Figure 2 The fixture shown is selected if the finished product is a single piece of green ceramic. Figure 3 The tooling fixture shown.

[0067] Next, adjust the position of the horn-shaped suction port at the end of the bamboo-joint tube of the dust removal device so that the suction port is parallel to the green ceramic plate, with the height of the suction port from the surface of the green ceramic plate being 2-4 cm, and the center of the suction port being 4-6 cm from the cutting line. Simultaneously, adjust the position and angle of the serpentine nozzle of the air compressor device, with the nozzle 9-11 cm from the cutting line, forming a 30° angle with the horizontal plane of the green ceramic plate, and opposite the dust removal suction port. The air pressure of the air compressor device is 0.1 MPa. Specifically, the height of the suction port from the surface of the green ceramic plate is 3 cm, the center of the suction port is 5 cm from the cutting line, and the nozzle is 10 cm from the cutting line.

[0068] Next, the process parameters are set. For green ceramic sheets of the same type but different thicknesses, the same process parameters can be used, such as laser power, repetition rate, and scanning speed. Only the number of cuts needs to be adjusted. Here, green ceramic sheets of the same type refer to green ceramic sheets formed from ceramic powder of the same material under the same casting process.

[0069] Finally, the laser focus was set at the center of the thickness of the green ceramic plate.

[0070] S2. Cut the green ceramic plate according to the original pattern using the selected power, measure the difference between the actual cut outer dimensions and the original pattern, and obtain the ablation radius of the green ceramic plate under the selected power.

[0071] Specifically, because different green ceramics (materials and densities) have different ablation radii at different power levels, the dimensions of the machining drawing need to be adjusted before cutting. The original drawing is cut using the selected power, and the difference between the actual cut dimensions and the original drawing is measured. This value is called the ablation radius 'a' of the green ceramic at that power. Then, the drawing dimensions are adjusted to compensate for the original drawing. This process is repeated until the actual cut dimensions meet the dimensional and accuracy specifications. The resulting drawing is called the machined drawing. Figure 4 and Figure 5 As shown, Figure 4 This is a schematic diagram illustrating the process principle of cutting the inner cavity of a green ceramic plate according to an embodiment of the present invention. Figure 5 A schematic diagram illustrating the process principle of single-piece cutting of green ceramic slabs provided in an embodiment of the present invention.

[0072] S3. Offset the processing pattern by a distance equal to the ablation radius in a direction away from the finished product to obtain an offset pattern.

[0073] Specifically, when the cut product is a ceramic tile with an inner cavity, the following method is used: Figure 2 The tooling and fixtures shown, and the process plan are as follows: Figure 4 As shown, the processing pattern determined in step S2 needs to be offset inward by a distance equal to the ablation radius to obtain the offset pattern. At this time, the offset pattern is located outside the processing pattern. When the finished product is a single piece of green ceramic, the following method is used: Figure 3 The tooling fixture shown supports the area of ​​the cutting block, making the cutting area hollowed out. Then, the processed pattern is offset outward by a distance equal to the ablation radius to obtain the offset pattern. At this time, the offset pattern is located outside the processed pattern. The process scheme is as follows: Figure 5 As shown.

[0074] S4. First, cut the green ceramic plate according to the offset pattern, and then cut the green ceramic plate a second time according to the processing pattern. At the same time as cutting, use a dust removal device and an air compression device to clean the dust and obtain the cut finished product.

[0075] Specifically, when the cut product is an inner cavity ceramic piece, the offset pattern and the processing pattern are cut sequentially from the inside to the outside. After the inner offset pattern is cut, the waste material falls off. After the outer processing pattern is cut, an inner cavity with no carbonization and blackening on the end face can be obtained. If the ablation degree of the cut surface is required to be high, the inner and outer patterns need to be processed in separate layers to reduce the laser power of the outer pattern.

[0076] Specifically, when the cut product is a single piece of green ceramic, firstly, the center of the part is set, and any corner of the outer offset pattern is placed at the center of the scanning galvanometer plane and used as the first galvanometer center 1, such as... Figure 5 As shown in the lower left corner. Then, select the outer offset pattern to cut the green ceramic plate. At this time, the cut green ceramic block has a severely blackened cut surface and a generally large taper. Then, cut the two sides of the green ceramic piece closest to the center of the first galvanometer according to the processing pattern, such as... Figure 5The two sides adjacent to the center of the first galvanometer are shown. Next, the platform is moved, with the X-axis moving distance equal to the x-axis dimension of the inner machined pattern plus the ablation radius *a*, and the Y-axis moving distance equal to the y-axis dimension of the inner machined pattern plus the ablation radius *a*. This re-establishes the part center, ensuring that the angle between the machined pattern and the center of the first galvanometer is placed at the center of the scanning galvanometer's area and serves as the center 2 of the second galvanometer. Figure 5 The upper right corner of the processing pattern is located at the center of the scanning galvanometer. Finally, the two sides of the green ceramic sheet closest to the center of the second galvanometer are cut according to the processing pattern. After processing, a single piece of green ceramic with no carbonization or blackening on the end face and dimensions that meet the specifications can be obtained.

[0077] It is important to emphasize that the dust removal device and air compression device must be kept running throughout the entire cutting process to clean up the ejected green ceramic dust in a timely manner.

[0078] For powdered pressed materials, the main mechanism of laser interaction differs from that of other materials. It relies more on a phase explosion effect generated by thermal influence in a small area, which disperses the powder near that area. Therefore, the actual kerf width is much larger than the theoretical ablation diameter. This means that thermal effects are more favorable for processing green ceramic materials, so short-pulse lasers such as picosecond and femtosecond lasers, which have weaker thermal effects, are actually less favorable for processing green ceramic materials. The intense phase explosion effect also means that even a low-energy-density focal spot can be highly efficient. As long as a large temperature gradient is generated in a small area, alumina powder can be effectively removed. In this embodiment, a 160mm telecentric field lens is used, and a 3mm defocus does not reduce processing efficiency. During processing, a large amount of dust is ejected from the focal spot, with a small-tapered conical trajectory and a small angle with the incident laser. At the same time, a dust removal device is installed between the field lens and the green ceramic plate to prevent dust from falling onto the green ceramic and affecting its subsequent electrical properties, and also to protect the optical lens from dust contamination affecting the optical performance of the laser. Please refer to [link to relevant documentation]. Figure 6 , Figure 6 This is a comparison diagram illustrating the principles of carbonized blackening and non-carbonized blackening on a cut surface, provided as an embodiment of the present invention. Figure 6 As shown in the left and right images, most of the dust generated during the processing is effectively removed, with only a very small amount of dust falling onto the cutting surface, thus keeping the cut surface clean and tidy and preventing it from turning black.

[0079] Furthermore, based on the principle of phase explosion, a small kerf causes dust within the kerf to collide back and forth on the kerf cavity wall, resulting in a large amount of black molten slag adhering to the cut surface. In this case, the cutting line needs to be shifted towards the green ceramic plate by a distance equal to the ablation radius for a secondary cut. After shifting by a distance equal to the ablation radius, half of the laser focal spot acts on the edge of the green ceramic, while the other half remains unaffected. The cutting position is no longer a semi-enclosed kerf cavity but an open space, which effectively cools the surface. Under these conditions, a large amount of molten slag and dust is not generated. The small amount of black molten slag and dust does not splash onto the cut surface but is instead ejected from the cut surface into the open space and promptly removed by the combined action of the dust removal system and the off-axis air blowing. This results in a green ceramic cut surface with a small taper, cleanliness, no slag adhesion, and no blackening. Please refer to [link to relevant documentation]. Figure 7 , Figure 7 Comparison images of carbonized and non-carbonized cutting effects of a 4mm thick raw ceramic plate provided in an embodiment of the present invention. Figure 7 As can be seen, the method in this embodiment yields a clean, slag-free, and non-blackened raw ceramic cut surface with a small taper.

[0080] The carbon-free laser cutting process of this embodiment offsets the cutting process by a distance equal to the ablation radius in the direction away from the finished product. First, the cutting is performed according to the offset pattern, and then a second cutting is performed according to the processing pattern. After moving a distance equal to the length of the ablation radius, half of the laser spot acts on the edge of the green ceramic, while the other half does not act. At this time, the cutting position no longer produces a semi-closed kerf cavity, but an open space, which can effectively cool down the ceramic. In this state, a large amount of slag and dust will not be generated. A small amount of black slag and dust will not splash onto the cutting surface, but will be sprayed from the cutting surface into the open space and promptly removed by the combined action of the dust removal system and the off-axis air blowing. This results in a green ceramic cutting surface with a small taper, clean, slag-free, and non-blackening.

[0081] The carbon-free laser cutting process described in this embodiment is applicable to all common green ceramic slab thicknesses, from as thin as 0.12mm to as thick as 5mm. It is primarily used for carbon-free, blackening-free cutting and drilling of LTCC / HTCC green ceramic slabs thicker than 2mm. Since the decarbonization effect of this process is consistent across different thicknesses of green ceramic, the improvement is more pronounced the thicker the green ceramic. Green ceramic slabs cut using this embodiment appear clean and tidy. Only under a 100x magnifying microscope can very slight ablation and blackening be observed, but the cut surface remains relatively clean. This process has no adverse effects on the performance of the subsequently sintered electronic ceramics and significantly enhances and improves their properties.

[0082] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A carbon-free laser cutting process for green ceramic slabs, characterized in that, Laser cutting using a carbonless laser cutting device includes the following steps: S1. Fix the green ceramic plate so that the cutting area of ​​the green ceramic plate is in a hollow state, and set the laser focus at the center of the thickness of the green ceramic plate. S2. Cut the green ceramic plate according to the original pattern using the selected power, measure the difference between the actual cut outer dimensions and the original pattern, obtain the ablation radius of the green ceramic plate under the selected power, and use the ablation radius to compensate for the original pattern to obtain the processed pattern; S3. Offset the processing pattern by a distance equal to the ablation radius in a direction away from the cut finished product to obtain an offset pattern; When the finished product is a green ceramic tile with an inner cavity, the processing pattern is offset inward by a distance equal to the ablation radius to obtain the offset pattern, which is located inside the processing pattern; when the finished product is a single green ceramic block, the processing pattern is offset outward by a distance equal to the ablation radius to obtain the offset pattern, which is located outside the processing pattern. S4. First, cut the green ceramic plate according to the offset pattern, and then cut the green ceramic plate a second time according to the processing pattern. At the same time as cutting, use a dust removal device and an air compression device to clean the dust and obtain the cut finished product.

2. The non-carbonization laser cutting process for green ceramic plates according to claim 1, characterized in that, The non-carbonized laser cutting device for the green ceramic plate includes: a laser (1), a beam adjustment system (2), a scanning galvanometer (3), a telecentric scene (4), a dust removal device (5), an air compression device (6), and a tooling fixture (7), wherein, The laser (1) is used to emit a laser beam; The beam adjustment system (2) is disposed in the optical path of the laser (1) and is used to adjust the beam expansion, divergence angle and beam direction of the laser beam; The scanning galvanometer (3) is disposed in the optical path of the beam adjustment system (2) to control the trajectory of the laser beam. The telecentric scene (4) is set at the beam emitting end of the scanning galvanometer (3) to focus the laser beam and form a focused spot to cut the raw ceramic plate; The tooling fixture (7) is set at the focused spot formed by the telecentric scene (4) and is used to fix the green ceramic plate so that the cutting area of ​​the green ceramic plate is in a hollow state. The dust removal device (5) is located at the cutting position of the green ceramic plate and is used to adsorb the dust and soot generated during cutting. The air compressor (6) is located at the cutting position of the green ceramic plate and is opposite to the dust removal device (5), and is used to assist the dust removal device (5) in cleaning dust.

3. The carbon-free laser cutting process for green ceramic plates according to claim 2, characterized in that, The beam adjustment system (2) includes a beam expander (21), a first reflector (22), and a second reflector (23), wherein, The beam expander (21) is disposed in the optical path of the laser (1) and is used to expand and adjust the divergence angle of the laser beam. The first reflector (22) is disposed in the optical path of the beam expander (21) for guiding the laser beam for the first time; The second reflector (23) is disposed in the optical path of the first reflector (22) for guiding the laser beam a second time.

4. The carbon-free laser cutting process for green ceramic plates according to claim 2, characterized in that, When the finished product is a ceramic tile with an inner cavity, the tooling fixture (7) includes a base (71), several beams (72), and several ribs (73), wherein, The beams (72) are distributed parallel to each other on the base (71), and the ribs (73) are distributed perpendicularly on the beams (72). The beams (72) are provided with adsorption holes to fix the green ceramic plate, and the cutting area of ​​the green ceramic plate is located in the area formed by the intersection of the beams (72) and the ribs (73).

5. The carbon-free laser cutting process for green ceramic plates according to claim 2, characterized in that, When the finished product is a single piece of green ceramic, the tooling fixture (7) includes a base (71) and an adsorption device (74), wherein, The adsorption device (74) is fixed on the base (71). The adsorption device (74) is used to adsorb the green ceramic plate, and the cut area of ​​the green ceramic plate is located around the adsorption device (74).

6. The method for carbon-free laser cutting of green ceramic plates according to claim 1, characterized in that, Step S4 includes: Place any corner of the offset pattern at the center of the scanning galvanometer and use it as the center of the first galvanometer. Cut the green ceramic plate according to the offset pattern, and cut the two sides of the green ceramic piece closest to the center of the first galvanometer according to the processing pattern. At the same time as cutting, use a dust removal device and an air compression device to clean the dust. The angle between the processing pattern and the center of the first galvanometer is placed at the center of the scanning galvanometer and used as the center of the second galvanometer. The two sides of the green ceramic piece closest to the center of the second galvanometer are cut according to the processing pattern. During the cutting process, dust is cleaned using a dust removal device and an air compression device to obtain the cut finished product.

7. The method for carbonless laser cutting of green ceramic plates according to claim 1, characterized in that, The laser power of the processed pattern is less than the laser power of the bias pattern.

8. The method for carbon-free laser cutting of green ceramic plates according to claim 1, characterized in that, The adsorption port of the dust removal device is parallel to the green ceramic plate, the height of the adsorption port from the surface of the green ceramic plate is 2-4cm, and the center distance of the adsorption port from the cutting line is 4-6cm. The air nozzle of the air compressor is 9-11 cm away from the cutting line and forms a 30° angle with the horizontal plane of the green ceramic plate. The air pressure of the air compressor is 0.1 MPa. The thickness of the raw ceramic slab is 0.12-5mm.

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