An electronic device with disassembly detection function

Abstract

This invention discloses an electronic device with disassembly detection function. The device includes at least one disassembly detection unit, each containing at least one coded chip. Each coded chip has a symmetrical shape, but the symmetry of its electrical characteristics is less pronounced than its symmetrical shape. Before leaving the factory, at least one coded chip is assembled and installed within the electronic device in an initial orientation, corresponding to an initial conduction state. After the electronic device is powered on, the disassembly detection unit acquires the current conduction state of at least one coded chip and confirms whether the current conduction state is the initial conduction state. If so, the electronic device is confirmed not to have been disassembled; otherwise, it is confirmed that the electronic device has been disassembled. This invention detects whether the electronic device has been disassembled by comparing the current orientation of each coded chip with its initial factory orientation. If it is determined that the device has been disassembled, the device or system can choose to stop providing service or cancel the warranty, thus improving security.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device with a disassembly detection function. Background Technology

[0002] Currently, most card readers on the market, due to their card payment mechanism, must incorporate anti-tampering and anti-disassembly measures throughout their construction. One common approach is to add a conductive circuit between the PCB circuit board and the casing. This involves placing several conductive terminals on the PCB board and a conductive rubber pad on the opposite side. If the system detects a break in this conductive circuit, it indicates that the casing and PCB board have been separated, meaning the machine has been disassembled, and the system will lock up and become inoperable. The biggest problem with this design is that it becomes ineffective when the battery is dead. Therefore, a small battery must be installed inside the machine for continuous power. If even this small battery runs out of power, even if the machine itself hasn't been disassembled, the broken circuit will still be considered as if it has been disassembled, and the machine will still lock up, requiring a complex and expensive method to unlock. Summary of the Invention

[0003] In view of the problems in the prior art, the present invention provides an electronic device that retains the original anti-tampering mechanism, can verify whether it has been disassembled when the battery is depleted and the electronic device is completely unresponsive, and increases the security and confidentiality of communication between the electronic device and the backend system.

[0004] To achieve the above objectives, the present invention proposes an electronic device with disassembly detection function, comprising at least one disassembly detection unit, each disassembly detection unit comprising at least one coded chip, each coded chip having a symmetrical shape, while the symmetry of the electrical characteristics of each coded chip is lower than the symmetry of the shape. Before leaving the factory, the at least one coded chip is assembled and installed in the electronic device in an initial orientation, the initial orientation corresponding to the initial conduction state. After the electronic device is started, the disassembly detection unit obtains the current conduction state of the at least one coded chip and confirms whether the current conduction state is the initial conduction state. If yes, it confirms that the electronic device has not been disassembled; if no, it confirms that the electronic device has been disassembled.

[0005] As an optional technical solution, the electronic device includes a first housing and a second housing. Each disassembly detection unit includes a first component, a frame, at least one coded chip, and a connector. The first component is disposed on the first housing, the frame is assembled on the first component, and the at least one coded chip is installed in the accommodating space of the frame. The connector is disposed on the second housing and engages with the frame, and the connector abuts against the at least one coded chip to confirm the current conduction state of the at least one coded chip.

[0006] As an optional technical solution, the first component has a first mating part, and the frame has a second mating part. When the frame is assembled on the first component, the first mating part and the second mating part are matched and fitted together, and the frame is limited by the matching and fitting.

[0007] As an optional technical solution, each disassembly detection unit also includes a spring clip, which is disposed on the first component and the movable side of the spring clip abuts against the frame. When the electronic device is disassembled, the frame is separated from the first housing along with the connector because it is engaged with the connector. The spring clip is no longer blocked by the frame, and the movable side releases elastic potential energy and bounces into the area originally occupied by the frame, thus ejecting at least one coded chip.

[0008] As an optional technical solution, the connector has multiple probes, and each coded chip has multiple connection pads. When the electronic device is assembled, the multiple probes abut against the multiple connection pads on the corresponding coded chip. Each disassembly detection unit detects the conduction status of the corresponding coded chip based on the multiple probes after the electronic device is started.

[0009] As an optional technical solution, the plurality of connecting pads are disposed on opposite first and second surfaces of each coded chip, and the conductivity of each connecting pad on the first surface is different from that of each connecting pad on the second surface.

[0010] As an optional technical solution, each coded chip has 4 connecting pads on its first and second surfaces. Two adjacent connecting pads on the first surface are electrically connected to each other, while the other two connecting pads are not connected to the other connecting pads. Three of the four connecting pads on the second surface are electrically connected to each other, while the other connecting pad is not connected to the other connecting pads.

[0011] As an optional technical solution, the first component has a base with a connected retaining wall and an opening, the retaining wall surrounding the first component; when the first housing separates from the second housing, the second housing drives the connector and the frame to move away from the first component, and the at least one coded piece leaves the first component from the opening.

[0012] As an optional technical solution, the opening faces the central area of ​​the electronic device.

[0013] As an optional technical solution, the electronic device includes a first housing and a second housing. Each disassembly detection unit includes a first component, a frame, at least one coded chip, a thin sheet, and a connector. The frame and the thin sheet are located on the first component. One end of the thin sheet is fixedly connected to the frame, and the other end of the thin sheet is fixedly connected to the first component. The at least one coded chip is installed in the accommodating space of the frame. The connector is disposed on the second housing and is engaged with the frame. When the first housing is separated from the second housing, the second housing drives the connector and the frame to move away from the first component, causing the thin sheet to be deformed by the frame and the at least one coded chip to be tilted out.

[0014] The present invention discloses an electronic device with a disassembly detection unit, comprising at least one disassembly detection unit, each including at least one coding plate. The coding plate has a geometrically symmetrical shape (e.g., a rectangle or regular polygon, and / or identical on both sides), allowing it to be assembled into the electronic device in multiple orientations. The electrical or optical characteristics of the coding plate (e.g., surface conductivity, resistance or capacitance, color or transparency) have even fewer directional symmetries than its shape. The electronic device has a detection device at each corresponding coding plate mounting position to detect the electrical or optical characteristics of the coding plate. Before leaving the factory, the electronic device detects the electrical or optical characteristics of each coding plate and records them internally or in a background database. When the user uses the device, it re-detects the orientation of each coding plate upon startup. If the orientation differs from the factory orientation, it is determined that the electronic device has been disassembled and reassembled, thus enhancing security.

[0015] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the first housing of the electronic device of the present invention;

[0017] Figure 2 for Figure 1 An enlarged schematic diagram of region A in the first housing before the detection unit is disassembled and assembled;

[0018] Figure 3 for Figure 1 An enlarged schematic diagram of region A in the first housing during the disassembly and assembly of the detection unit;

[0019] Figure 4 This is a schematic diagram of the second housing of the electronic device of the present invention;

[0020] Figure 5 for Figure 4An enlarged schematic diagram of region B in the second shell;

[0021] Figure 6A This is a partial schematic diagram of the assembly of the first housing and the second housing of the electronic device of the present invention;

[0022] Figure 6B This is a partial schematic diagram of the first housing and the second housing of the electronic device of the present invention after assembly;

[0023] Figure 7 This is a partial schematic diagram of the disassembly of the electronic device of the present invention;

[0024] Figure 8 This is a partial schematic diagram of the disassembled electronic device of the present invention;

[0025] Figures 9a to 10d This is a schematic diagram showing the arrangement of the encoder chips in the electronic device of the present invention;

[0026] Figure 11 This is a partial schematic diagram of the disassembled electronic device according to another embodiment of the present invention. Detailed Implementation

[0027] To provide a further understanding of the purpose, structure, features and functions of the present invention, detailed descriptions are provided below with reference to embodiments.

[0028] The purpose of this invention is to provide an electronic device with disassembly detection function, which, through the combination of software, hardware and mechanism, allows the electronic device or back-end system to verify whether the outer casing of the electronic device has been disassembled, thereby enhancing the security and confidentiality of communication between the electronic device and the back-end system.

[0029] Please refer to Figures 1 to 10d , Figure 1 This is a schematic diagram of the first housing of the electronic device of the present invention; Figure 2 for Figure 1 An enlarged schematic diagram of region A in the first housing before the detection unit is disassembled and assembled; Figure 3 for Figure 1 An enlarged schematic diagram of region A in the first housing during the disassembly and assembly of the detection unit; Figure 4 This is a schematic diagram of the second housing of the electronic device of the present invention; Figure 5 for Figure 4 An enlarged schematic diagram of region B in the second shell;

[0030] Figure 6A This is a partial schematic diagram of the assembly of the first housing and the second housing of the electronic device of the present invention; Figure 6B This is a partial schematic diagram of the first housing and the second housing of the electronic device of the present invention after assembly; Figure 7 This is a partial schematic diagram of the disassembly of the electronic device of the present invention; Figure 8This is a partial schematic diagram of the disassembled electronic device of the present invention; Figures 9a to 10d This is a schematic diagram showing the arrangement of the encoder chips in the electronic device of the present invention.

[0031] The electronic device of the present invention includes one or more disassembly detection units, each disassembly detection unit includes at least one coded piece 114, each coded piece 114 having two-dimensional or three-dimensional geometric symmetry characteristics, such as being rectangular or regular polygonal, and / or the front and back of each coded piece 114 may be the same, so that each coded piece 114 can be assembled into the disassembly detection unit in multiple geometric directions, that is, each coded piece 114 has multiple assembly direction options when assembled into the disassembly detection unit.

[0032] In this invention, the electrical or optical characteristics (e.g., surface conductivity, resistance or capacitance, color or transparency) of each coded chip 114 have fewer directional symmetries than its shape. Since each disassembly detection unit contains at least one coded chip 114, each disassembly detection unit possesses detection capabilities corresponding to the characteristics of the coded chip 114, capable of detecting the electrical or optical characteristics of the coded chip 114 and determining the assembly orientation of the coded chip 114 to confirm whether the electronic device has been disassembled. For simplicity, the coded chip 114 is exemplified below as a square sheet with four conductive pads on each side. Some of these pads are conductive, while others are not, but this is not the only example.

[0033] During the manufacturing process of electronic devices, when assembling electronic devices in the factory, each coded chip 114 is installed in the disassembly detection unit in a random orientation. Before leaving the factory, the electronic device is first started, and the disassembly detection unit detects the conduction status of the connecting pads on each coded chip 114. This can be considered as the initial conduction status of each coded chip 114, and the initial assembly orientation of each coded chip 114 can be determined. It can also be considered as the initial orientation combination of each coded chip 114, and recorded in the electronic device or the system background.

[0034] like Figure 1 , Figure 4 and Figure 6B The electronic device of the present invention includes a circuit board 200 and a first housing 100 covering the circuit board, and at least one disassembly detection unit is disposed between the circuit board 200 and the first housing 100, each disassembly detection unit comprising:

[0035] (1) Connector 210 fixed on circuit board 200;

[0036] (2) A first component 110 fixed to the first housing 100 and corresponding to the connector 210;

[0037] (3) Frame 113, which is an independent part;

[0038] (4) At least one coding piece 114, each coding piece 114 being an independent part.

[0039] like Figure 2 and Figure 3 The direction of disassembly or assembly of the circuit board 200 and the first housing 100 is defined as the Z direction. In this embodiment, the Z direction, X direction and Y direction are perpendicular to each other, wherein the X direction is the vertical direction and both the X direction and the Y direction are horizontal directions.

[0040] like Figures 2 to 3 As shown, the first component 110 has a first mating part 1113, which can be fitted with a corresponding shape (which can be considered a second mating part) on the frame 113. When the frame 113 is placed vertically on the first component 110, the frame 113 is limited by this fitting and cannot move in the horizontal direction. In actual operation, the first mating part 1113 is one of a groove or a protrusion, and the second mating part is the other of a groove or a protrusion. In this embodiment, the first mating part 1113 is a protrusion, and the second mating part is a layered groove.

[0041] like Figure 3 As shown, the frame 113 has a receiving space that can hold at least one coded chip 114. During the assembly of the electronic device in the factory, the worker first places the frame 113 on the first component 110, and then randomly inserts the coded chip 114 into the receiving space of the frame 113 in any orientation. Figure 3 For example, since the coding piece 114 is a square piece, each coding piece 114 can be rotated in any of the four directions or flipped in any direction to be assembled into the aforementioned accommodating space.

[0042] like Figure 3 and Figure 5 As shown, the frame 113 has a corresponding hook 115, and the connector 210 has a corresponding snap-fit ​​structure 211. The hook 115 can engage with the corresponding snap-fit ​​structure 211 on the connector 210. In this embodiment, as... Figure 5 As shown, the snap-fit ​​structure 211 is located on opposite sides of the connector 210.

[0043] like Figure 6A After the factory assembles the frame 113 and inserts at least one encoder chip 114 into its accommodating space, the circuit board 200 is assembled and fixed to the first housing 100 in a vertical direction, such as... Figure 6BThe position shown represents the factory assembly state of the electronic device. At this time, the hooks 115 of the frame 113 and the latching structure 211 on the connector 210 are engaged because the circuit board 200 is close to the first housing 100, and the connector 210 contacts each coding chip 114, thereby detecting the conduction direction of the connection pads on each coding chip 114, that is, the initial conduction state (and also determining the initial direction combination of each coding chip 114), and recording it in the electronic device or the system background.

[0044] In this invention, after the electronic device is assembled, the frame 113 is unable to move horizontally because the second mating part on it and the first mating part 1113 on the first component 110 are interlocked. At the same time, the frame 113 is clamped between the circuit board 200 and the first component 110, and is fixedly connected to the connector 210 on the circuit board 200 by the combination of the hook 115 and the buckle structure 211. Therefore, the frame 113 is unable to move vertically. Thus, the frame 113 is completely fixed inside the electronic device after the electronic device is assembled, and the coding chip 114 placed inside the frame 113 can no longer be rotated or flipped.

[0045] When the electronic device is shipped to the user, each time the electronic device is turned on and used, the disassembly detection unit re-detects the assembly direction of each coding chip 114, that is, the current orientation combination of each coding chip 114, and confirms whether it is the same as when it was shipped. If it is not the same, the system background can determine that the electronic device has been disassembled and reassembled.

[0046] like Figure 3 As shown, in this embodiment, the frame 113 is a hollow frame and surrounds the coding piece 114. The size of the accommodating space of the frame 113 is adapted to the coding piece 114. After the coding piece 114 is placed in the accommodating space, there is not much (or even no) extra space in the accommodating space. In addition to accommodating the coding piece 114 and restricting the orientation of the coding piece 114, this shape and size feature also prevents unauthorized personnel from fixing the coding piece 114 with small tools before completely disassembling the electronic device.

[0047] When electronic devices are disassembled, such as Figure 7 and Figure 8As shown, the circuit board 200 separates from the first housing 100 in the vertical direction. The hook 115 of the frame 113 is engaged with the snap-fit ​​structure 211 on the connector 210. Therefore, the frame 113, which was originally assembled on the side of the first component 110, is separated from the first component 110 along with the side of the circuit board 200. At this time, the coding chip 114 is separated and falls off because it loses the four-sided limit of the frame 113. Once the coding chip 114 falls off from the factory position (i.e. the initial position), the initial assembly direction cannot be known. Even if the electronic device is reassembled and powered on, the system can still determine through the connector 210 that the assembly direction of each coding chip 114 has changed, and determine that the electronic device has been disassembled and reassembled.

[0048] Please refer to Figures 9a to 10d , Figures 9a to 10d This is a schematic diagram showing the arrangement of the encoder chips in the electronic device of the present invention. The conductive state of the connecting pad of the encoder chip 114 of the present invention can be as follows: Figures 9a to 9d as well as Figures 10a to 10d As an example, the encoder 114 can use a double-sided circuit board process, but is not limited to it. Each side of the double-sided circuit board (defined as the first side and the second side) has four connection pads 1141. The four connection pads 1141 on the first side are configured such that two adjacent connection pads are interconnected, while the other two are not interconnected with any other pad. The four connection pads 1141 on the second side of the encoder 114 are configured such that three connection pads are interconnected, and the remaining one is not interconnected with any other connection pad. In this way, only one type of encoder 114 (but the quantity can be large) needs to be manufactured. When the encoder 114 and the connector 210 are brought close together during assembly, such as... Figure 5 The elastic probe 212 on the connector 210, as shown, contacts the connecting pad 1141 on each coded chip 114. The system can then detect the conductivity state of each connecting pad 1141. If the assembly direction of the coded chip 114 is such that its first surface contacts the connector 210, the probe 212 on the connector 210 can measure the conductivity state of this coded chip 114. Figures 9a to 9d One of them depends on the specific assembly direction of the encoder 114; if the assembly direction of the encoder 114 is that the second side contacts the connector 210, then the probe 212 of the connector 210 can measure the conduction state of the encoder 114. Figures 10a to 10d One of the possibilities depends on the specific assembly orientation of the encoder chip 114. That is, in this embodiment, when an encoder chip 114 is placed in the frame 113, eight different conduction states can be randomly generated and detected by the connector 210 (which can also be used to determine the assembly orientation of the encoder chip 114). In this embodiment, the system is either a system built into the electronic device itself or a system that communicates with the electronic device.

[0049] In this embodiment, a square-shaped, geometrically symmetrical coded chip 114, but with asymmetrical conductive characteristics in its connecting pads, has a one-eighth probability that its electrical conductivity characteristics will be exactly the same as its initial assembly direction after being disassembled and reassembled according to its shape; that is, four directions on each side. A disassembly detection unit has two coded chips 114, and the probability that both coded chips 114 will have the same initial assembly direction after reassembly is only one-sixty-fourth (8 to the power of 2). If the electronic device (or a system) has four disassembly detection units, such as... Figure 1 Combination Figure 5 As shown, the probability that all eight coded chips 114 are disassembled and reassembled with the same current assembly orientation as their initial assembly orientation is only 1 in 16,777,216 (8 to the power of 8). In other words, when the electronic device is powered on, the system can determine whether the current assembly orientation of all coded chips 114 is the same as the factory orientation by detecting whether the current assembly orientation is the same as the factory orientation through connector 210.

[0050] In this invention, the electronic device includes a detection unit that identifies the electrical or optical characteristics of the coded chip 114. During factory assembly, each coded chip 114 is placed into a storage space in a random orientation. When the electronic device is assembled and powered on for testing, the detection unit first detects the electrical or optical characteristics of the coded chip 114 in its factory state (i.e., its initial conduction state) and records it in the storage unit or background database within the electronic device. When the electronic device is operated by the user, for example, after each power-on, the detection unit can detect the current electrical or optical characteristics of each coded chip 114 (i.e., its current conduction state) to confirm the current orientation combination. By comparing the current orientation combination of each coded chip 114 with the initial orientation combination at the factory, it can detect whether the electronic device has been disassembled. If it is determined that the device has been disassembled, the electronic device or background system can choose to stop providing service or cancel the warranty.

[0051] Furthermore, such as Figure 2 and Figure 3 As shown, the first component 110 is provided with a spring piece 112, which has a movable side 1121. When assembling and disassembling the detection unit, the movable side 1121 of the spring piece 112 is first pushed away from the area of ​​the frame 113, and then vertically placed into the frame 113. Then, the coding chip 114 is placed in. Because the second mating part of the frame 113 and the first mating part 1113 on the first component 110 are engaged, the frame 113 is fixed in the horizontal direction. At this time, the movable side 1121 of the spring piece 121 is blocked outside the area of ​​the frame 113 and abuts against the frame 113. When the electronic device is disassembled, such as... Figure 8As shown, at the instant the circuit board 200 and the first housing 100 separate, the frame 113 engages with the latch structure 211 on the connector 210 due to its own hook 115. As the connector 210 separates from the first housing 100, the spring piece 112 is no longer blocked by the frame 113. Its movable side 1121 releases elastic potential energy and springs into the area originally occupied by the frame 113, thus ejecting the coding piece 114 away from its original position (i.e., the initial position). This ensures that the coding piece 114 cannot remain in the initial position when the circuit board 200 and the first housing 100 separate.

[0052] More preferably, the direction in which the spring 112 ejects the coded chip 114 can be toward the interior of the electronic device (i.e., Figure 1 and Figure 4 The central area shown), rather than ejected outwards (i.e., the central area shown), rather than ejected outwards (i.e. Figure 1 and Figure 4 As shown in the edge area, in actual operation, if each coded chip 114 ejects outward, someone attempting to crack the electronic device could first set up a blocking structure at the edge of the electronic device to prevent the coded chips 114 from ejecting and thus risk being cracked. In this embodiment, by making each coded chip 114 move towards the inside of the electronic device when it is ejected from its initial position by the ejector 112, the aforementioned risk can be avoided.

[0053] Better, such as Figures 2 to 3 As shown, the first component 110 has a base 111, and the base 111 has a baffle 1112. The baffle 1112 surrounds the first component 110, enclosing the spring clip 112 within the internal space. This prevents someone attempting to crack the electronic device from first fixing or damaging the spring clip 112 from the side of the first component 110 before disassembling it. Furthermore, the baffle 1112 needs to have an opening in the direction in which the coded chip 114 is ejected to avoid obstructing the ejection of the coded chip 114. In this embodiment, the openings of each baffle 1112 face the central area of ​​the electronic device.

[0054] Please refer to Figure 11 , Figure 11 This is a partial schematic diagram of the disassembled electronic device according to another embodiment of the present invention. Unlike the previous embodiments, in this embodiment, a thin sheet 312 of a foldable sheet material is used instead of the spring sheet 112, such as... Figure 11As shown, one end of the sheet 312 is bonded to the base 111 on the first component 110, and the other end of the sheet 312 is bonded to the frame 113. When the electronic device is disassembled, the circuit board 200 separates from the first housing 100 in the vertical direction. The hook 115 of the frame 113 engages with the snap-fit ​​structure 211 on the connector 210. Therefore, the frame 113, which was originally assembled on the side of the first component 110, separates from the first component 10 along with the side of the circuit board 200. Since one end of the sheet 312 is bonded to the frame 113, the sheet 312 deforms as the frame 113 moves, causing the coding chip 114 to tip out and leave its original position. In this embodiment, after the sheet 312 is folded, its two ends are connected to the same side of the first component 110 and the frame 113 (e.g., Figure 11 (on the right side of the frame), when the electronic device is assembled, each coded chip 114 is placed in the accommodating space of the frame 113 and located on a local area of ​​the sheet 312 so that each coded chip 114 can be tilted out when the sheet 312 is deformed.

[0055] The present invention discloses an electronic device with disassembly detection function, comprising at least one disassembly detection unit, each unit including at least one coded chip, which is assembled in a corresponding accommodating space within the electronic device. The coded chip has geometric symmetry in its shape, but exhibits less symmetry in its electrical or optical characteristics compared to its geometric shape. This geometric symmetry allows for various assembly options within the accommodating space. When the electronic device is disassembled, the outer casing separates, and the coded chip detaches from the aforementioned accommodating space. When reassembling the components of the electronic device after disassembly, the geometric symmetry of the coded chip makes it impossible to ascertain the initial assembly orientation of each coded chip before disassembly. While it may appear that the coded chips can be returned to their original positions, the electrical or optical characteristics cannot be guaranteed to match the initial state, thus enhancing the security and confidentiality of the electronic device.

[0056] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. An electronic device with disassembly detection function, characterized in that... The electronic device comprises: at least one disassembly detection unit, each disassembly detection unit comprising at least one code sheet, each code sheet having a symmetric shape and a symmetric electrical property, the at least one code sheet being assembled in an initial orientation combination in the electronic device before leaving factory, the initial orientation combination corresponding to an initial conduction state; and after the electronic device is started, the disassembly detection unit acquires a current conduction state of the at least one code sheet, and determines whether the current conduction state is the initial conduction state, if yes, it is determined that the electronic device has not been disassembled; if no, it is determined that the electronic device has been disassembled. 2.The electronic device of claim 1, wherein: The electronic device comprises a first shell and a second shell, each disassembly detection unit comprises a first component, a frame, at least one code sheet and a connector, the first component is arranged on the first shell, the frame is assembled on the first component, and the at least one code sheet is arranged in the accommodating space of the frame; the connector is arranged on the second shell and is buckled with the frame, and the connector is in contact with the at least one code sheet to determine the current conduction state of the at least one code sheet. 3.The electronic device of claim 2, wherein: The first component has a first matching part, the frame has a second matching part, and when the frame is assembled on the first component, the first matching part and the second matching part are matched and embedded, and the frame is limited by the matched and embedded frame. 4.The electronic device of claim 2, wherein: Each disassembly detection unit further comprises a spring, which is arranged on the first component and the movable side of the spring is in contact with the frame; when the electronic device is disassembled, the frame is separated from the first shell together with the connector because the frame is buckled with the connector, the spring is no longer blocked by the frame, the movable side releases elastic potential and pops into the area originally occupied by the frame, and the at least one code sheet is ejected. 5.The electronic device of claim 2, wherein: The connector has a plurality of probes, each code sheet has a plurality of connection pads, and when the electronic device is assembled, the plurality of probes are in contact with the plurality of connection pads on the corresponding code sheet; each disassembly detection unit detects the conduction state of the corresponding code sheet according to the plurality of probes after the electronic device is started. 6.The electronic device of claim 5, wherein: The plurality of connection pads are arranged on opposite first and second surfaces of each code sheet, and the conduction state of each connection pad on the first surface is different from that on the second surface. 7.The electronic device of claim 6, wherein: Each code sheet has four connection pads on the first and second surfaces, and adjacent two connection pads on the four connection pads on the first surface are in electrical connection with each other, and the other two connection pads are not in conduction; three connection pads on the four connection pads on the second surface are in electrical connection with each other, and the other connection pad is not in conduction. 8.The electronic device of claim 4, wherein: The first component has a base with a connected retaining wall and an opening, and the retaining wall surrounds the first component; when the first shell and the second shell are separated, the second shell drives the connector and the frame to move away from the first component, and the at least one code sheet leaves the first component from the opening. 9.The electronic device of claim 8, wherein: The opening is directed to the central area of the electronic device. 10.The electronic device of claim 1, wherein: The electronic device includes a first casing and a second casing. Each disassembly detection unit includes a first component, a frame, at least one code sheet, a sheet and a connector. The frame and the sheet are located on the first component. One end of the sheet is fixedly connected to the frame. The other end of the sheet is fixedly connected to the first component. The at least one code sheet is installed in a receiving space of the frame. The connector is arranged on the second casing and is buckled with the frame. When the first casing and the second casing are separated, the second casing drives the connector and the frame to move away from the first component, so that the sheet is driven by the frame to be deformed and the at least one code sheet is poured out.

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