A power electronic equipment cooling system, method and a condenser

Abstract

The application discloses a kind of power electronic equipment cooling system, method and a condenser.It includes evaporator, hermetically sealed box, steam pipe, condenser and reflux pipe;Liquid cooling medium is injected in hermetically sealed box, and semiconductor device, evaporator and other auxiliary devices are immersed, and hermetically sealed box is connected with steam pipe and reflux pipe respectively on both sides;Evaporator is pressed into a whole with semiconductor device and is arranged in hermetically sealed box, and liquid cooling medium around evaporator is vaporized, enters the condenser arranged above hermetically sealed box, and condenser is connected with steam pipe and reflux pipe respectively, and gaseous cooling medium is liquefied, and returns to hermetically sealed box.It realizes that cooling medium dynamically self-circulates, and it is safer and more reliable, and operation and maintenance are more convenient, heat transfer efficiency is high, equipment size is greatly reduced, cost is reduced, and the problems such as traditional air cooling heat dissipation power, operation noise, water cooling structure complexity, equipment size, high leakage water failure rate, installation and operation and maintenance complexity are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of equipment cooling technology, in particular to a power electronic equipment cooling system, a method and a condenser. BACKGROUND

[0002] With the development of high-power power electronic technology, the research and production technology of higher voltage and higher capacity semiconductor devices (thyristor, diode, IGBI, IGCT, IEGT, etc.) are constantly mature, which constantly promotes the development and application of high-voltage high-power power electronic equipment technology. The LCC DC transmission technology based on thyristor converter valve as the core realizes long-distance high-capacity power transmission, and has become the backbone network of China's power grid at present. The MMC flexible DC transmission technology, DC circuit breaker technology and power electronic transformer technology based on IGBT and IGCT converter valve as the core have been widely used in ultra-high voltage and high voltage DC transmission fields and low voltage DC power supply fields. However, as the core device of DC system equipment, semiconductor devices inevitably generate a large amount of heat loss during operation. Whether the generated heat can be removed in time and the operating temperature of the device can be controlled within a certain range determines the reliability and stability of the equipment operation.

[0003] At present, high-voltage high-power power electronic equipment such as high-power converter valve and DC transformer generally adopts deionized water cooling scheme, which uses the large specific heat of water to remove the heat generated by semiconductor devices. Small-power power electronic equipment with smaller heat loss generally adopts forced direct air cooling scheme based on heat pipe heat dissipation. The deionized water cooling scheme has complex circulation pipeline structure of power electronic equipment cooling system, many water pipe joints, high water leakage failure rate, large overall equipment volume, and complex installation and operation and maintenance, and high cost. The forced air cooling scheme has low heat dissipation efficiency and large noise, which cannot meet the heat dissipation demand of high-power equipment. SUMMARY

[0004] In order to solve the above problems, the present application is made, and through specific embodiments and specific prototype test demonstration, a power electronic equipment cooling system, a method and a condenser are provided.

[0005] In a first aspect, the present application provides a power electronic equipment cooling system, which comprises an evaporator, a fully sealed box, a steam pipe, a condenser and a return pipe.

[0006] The fully sealed box is filled with liquid cooling medium, and the liquid cooling medium immerses the semiconductor device and the evaporator. The upper side of one side of the fully sealed box is connected to the steam pipe, and the lower side of the other side of the fully sealed box is connected to the return pipe.

[0007] The evaporator is arranged inside the fully-sealed box and is used to absorb the heat conducted by the semiconductor device, vaporize the liquid cooling medium around the evaporator into vapor, and make the vaporized cooling medium enter the condenser through the vapor pipe.

[0008] The condenser is arranged above the fully-sealed box, is connected to the vapor pipe and the return pipe respectively, and is used to liquefy the vaporized cooling medium, return the liquid cooling medium to the fully-sealed box through the return pipe, and insulate the cooling medium.

[0009] Specifically, the condenser comprises a heat dissipation fan and a blade, a condenser vapor inlet manifold, a condenser return liquid collection pipe, and a cooling liquefaction pipe.

[0010] The heat dissipation fan and the blade are arranged at the top end of the condenser.

[0011] The cooling liquefaction pipes are arranged from top to bottom in the condenser, and the area where the cooling liquefaction pipes are arranged comprises an exhaust layer area and a cooling liquefaction layer area. The exhaust layer area is located at the top area of the condenser below the heat dissipation fan and the blade, and the cooling liquefaction layer area is the area where the other cooling liquefaction pipes are arranged below the exhaust layer area.

[0012] The cooling liquefaction pipes in the cooling liquefaction layer area are connected in series in each 2 layers, the upper layer of each group is connected to the condenser vapor inlet manifold, and the lower layer of each group is connected to the condenser return liquid collection pipe.

[0013] The condenser vapor inlet manifold is connected to the vapor pipe, and the condenser return liquid collection pipe is connected to the return pipe.

[0014] Specifically, the heat dissipation fan and the blade operate in the mode of air extraction, air enters the bottom of the condenser, air exits the top of the condenser, and the heat on the surface of the cooling liquefaction pipes is taken away.

[0015] Specifically, each layer of the cooling liquefaction pipes is provided with an interlayer collection upper pipe and an interlayer collection lower pipe, each layer of the cooling liquefaction pipes is connected in parallel between the interlayer collection upper pipe and the interlayer collection lower pipe, each layer of the cooling liquefaction pipes is connected to the condenser vapor inlet manifold through the corresponding interlayer collection upper pipe, and each layer of the cooling liquefaction pipes is connected to the condenser return liquid collection pipe through the corresponding interlayer collection lower pipe.

[0016] Specifically, the number of layers of the cooling liquefaction pipes in the cooling liquefaction layer area is any even number, and is moderately matched according to the heat dissipation requirement.

[0017] Specifically, the condenser further comprises an air exhaust valve, and the air exhaust valve is arranged on the top layer end gas collection pipe in the exhaust layer area.

[0018] Specifically, the air exhaust valve is an electromagnetic pressure regulating valve. When the pressure in the cooling liquefaction pipe reaches or exceeds a first threshold value, the air exhaust valve is automatically opened to exhaust air. When the pressure in the cooling liquefaction pipe is less than the first threshold value and not less than a second threshold value, the air exhaust valve is automatically closed. When the pressure in the cooling liquefaction pipe is less than the second threshold value, the air exhaust valve is automatically opened to inhale air.

[0019] Specifically, the power electronic equipment cooling system further comprises a liquid injection valve and a liquid discharge valve. The liquid injection valve is arranged on the fully sealed box body and injects cooling medium into the fully sealed box body after being opened. The liquid injection valve is closed after the liquid level in the fully sealed box body reaches a set value. The liquid discharge valve is arranged at the bottom of the fully sealed box body and discharges liquid in the fully sealed box body after being opened.

[0020] Specifically, the evaporator is integrally connected with the semiconductor device and arranged inside the fully sealed box body.

[0021] Specifically, the cooling medium is electronic fluorination liquid, which is used for cooling and insulation.

[0022] In a second aspect, an embodiment of the present application provides a condenser, which comprises a heat dissipation fan and a blade, a condenser steam inlet manifold, a condenser liquid return collecting pipe and a cooling liquefaction pipe. The heat dissipation fan and the blade are arranged at the top end of the condenser. The cooling liquefaction pipes are arranged from top to bottom in the condenser. The area where the cooling liquefaction pipes are located comprises an exhaust layer area and a cooling liquefaction layer area. The exhaust layer area is located at the top area of the condenser below the heat dissipation fan and the blade. The cooling liquefaction layer area is the area where the other cooling liquefaction pipes below the exhaust layer area are located. The cooling liquefaction pipes in the cooling liquefaction layer area are connected in series in groups of two. The upper layer of each group is connected to the condenser steam inlet manifold, and the lower layer of each group is connected to the condenser liquid return collecting pipe.

[0023] Specifically, the heat dissipation fan and the blade operate in the mode of air extraction. Air enters the bottom of the condenser and exits the top, thereby taking away the heat on the surface of the cooling liquefaction pipes.

[0024] Specifically, each of the cooling liquefaction pipes is provided with an interlayer collecting upper pipe and an interlayer collecting lower pipe. Each of the cooling liquefaction pipes is connected in parallel between the interlayer collecting upper pipe and the interlayer collecting lower pipe. Each of the cooling liquefaction pipes is connected to the condenser steam inlet manifold through the corresponding interlayer collecting upper pipe, and is connected to the condenser liquid return collecting pipe through the corresponding interlayer collecting lower pipe.

[0025] Specifically, the number of layers of the cooling liquefaction pipes in the cooling liquefaction layer area is any even number.

[0026] Specifically, the condenser further comprises an air exhaust valve arranged on the end gas collecting pipe of the top layer of the cooling liquefaction pipes in the exhaust layer area.

[0027] Specifically, the air exhaust valve is an electromagnetic pressure regulating valve, when the pressure in the cooling liquefaction pipe reaches or exceeds the first threshold value, the air exhaust valve is automatically opened to exhaust air, when the pressure in the cooling liquefaction pipe is less than the first threshold value and not less than the second threshold value, the air exhaust valve is automatically closed, and when the pressure in the cooling liquefaction pipe is less than the second threshold value, the air exhaust valve is automatically opened to inhale air.

[0028] Specifically, the cooling medium in the cooling liquefaction pipe is electronic fluorination liquid, which is used for cooling and insulation.

[0029] In a third aspect, the embodiments of the present application provide a power electronic equipment cooling method, which uses the power electronic equipment cooling system or condenser as described above to cool the power electronic equipment.

[0030] The above technical solutions provided by the embodiments of the present application have at least the following beneficial effects:

[0031] Compared with the traditional water cooling, the whole heat generating component of the power electronic equipment is immersed in the insulating liquid, the cooling system is more simple, there is no complex pipeline, too many joints, water leakage hazards and the like, the equipment operation safety and reliability are higher, and the operation and maintenance are more convenient; the problems of small heat dissipation power and operation noise of the traditional air cooling are solved.

[0032] The two-phase phase change cooling scheme is adopted, the heat generating component and the electrical device are fully immersed in the cooling medium by using the high vaporization heat parameter characteristics of the cooling working medium, and the heat is taken away by liquid vaporization and evaporation, so that the heat transfer efficiency is high.

[0033] By using the high insulation strength characteristics of the liquid, the liquid is used as the insulating medium of the main insulation of the power electronic equipment, compared with the traditional air insulating medium, the insulation strength per unit distance is about 20 times higher, so that the equipment size can be greatly reduced and the cost can be reduced.

[0034] The condenser is arranged on the upper part of the heat-sealed box, the position height difference between the box and the condenser is used to realize the dynamic self-circulation of the continuous evaporation-liquefaction-evaporation of the cooling medium, the condenser is designed by using the partitioned and layered design scheme of the internal cooling liquefaction pipe, and the condenser cooling liquefaction layer region and the exhaust layer region are formed, the cooling pipeline of the condenser cooling liquefaction layer adopts the series-parallel combined design scheme, the contact area of the steam and the cooling liquefaction pipe is increased, the contact space and the circulation resistance of the cooling liquid after liquefaction and the cooling pipe are reduced, and the heat dissipation efficiency of the condenser is greatly improved.

[0035] The exhaust layer cooling pipeline adopts a series design and a design scheme of configuring an electromagnetic pressure regulating valve, can automatically collect air in the system and discharge, promotes the circulation of the cooling medium to be more smooth, collects the cooling residual steam which is not completely liquefied in the liquefaction layer region and liquefies, and the steam is more completely liquefied; the density difference between air and the cooling medium is utilized to realize automatic exhaust and cooling medium circulation; the cooling medium steam which is not completely liquefied in the liquefaction layer is collected and continuously liquefied, and is naturally returned to the sealed box through the liquid return main pipe.

[0036] The condenser exhaust layer is provided with a pressure regulating electromagnetic valve scheme, which automatically adjusts the internal pressure of the condenser, ensures that the cooling system medium circulation is smooth under different operating loads, is free from mechanical stress caused by excessively high or low internal pressure, and improves the operating reliability and mechanical life of the circulation system.

[0037] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

[0038] The technical solutions of the present application will be further described in detail below with the help of the drawings and examples. BRIEF DESCRIPTION OF DRAWINGS

[0039] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate embodiments of the present application and explain the present application, and do not constitute a limitation of the present application. In the drawings:

[0040] Figure 1 It is a schematic diagram of a cooling system for a power electronic equipment in an embodiment of the present application;

[0041] Figure 2 It is a schematic diagram of a cooling liquefaction pipe arrangement between condenser layers in an embodiment of the present application;

[0042] Figure 3 It is a schematic diagram of a condenser interlayer collection pipe in an embodiment of the present application;

[0043] Figure 4a And 4b It is a schematic diagram of a three-dimensional model of a condenser in an embodiment of the present application.

[0044] Reference signs: 1-semiconductor device, 2-evaporator, 3-drain valve, 4-totally sealed box, 5-steam pipe, 6-condenser, 7-air exhaust valve, 8-backflow pipe, 9-liquid injection valve, 60-radiation fan and blade, 61-cooling liquefaction pipe, 65-condenser steam inlet main pipe, 68-condenser liquid return collection pipe, 612-cooling liquefaction layer region, 613-exhaust layer region, 614-interlayer collection upper pipe, 615-interlayer collection lower pipe. Detailed Implementation

[0045] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0046] To address the problems existing in the prior art, embodiments of the present invention provide a power electronic equipment cooling system, method, and a condenser.

[0047] Example 1

[0048] Embodiment 1 of the present invention provides a cooling system for power electronic equipment, such as Figure 1 As shown, the system includes: an evaporator 2, a fully sealed enclosure 4, a steam pipe 5, a condenser 6, and a return pipe 8. The fully sealed enclosure 4 is filled with a liquid cooling medium that immerses the semiconductor device, heating components, evaporator, and electrical components. The steam pipe 5 is connected to the upper part of one side of the fully sealed enclosure 4, and the return pipe 8 is connected to the lower part of the other side. The evaporator 2 is located inside the fully sealed enclosure 4 and is used to absorb heat conducted by the semiconductor device, vaporizing the liquid cooling medium around the evaporator 2. The vaporized cooling medium enters the condenser 6 through the steam pipe 5. The condenser 6 is located above the fully sealed enclosure 4 and is connected to both the steam pipe 5 and the return pipe 8. The condenser 6 liquefies the vaporized cooling medium, which then flows back into the fully sealed enclosure 4 through the return pipe 8. The cooling medium is insulated. By utilizing the height difference between the enclosure and the condenser, a dynamic self-circulation of the cooling medium—evaporation-liquefaction-evaporation—is achieved. The heat-generating components and electrical devices are fully immersed in the cooling medium, resulting in high heat dissipation efficiency. Furthermore, the enclosure reduces noise, solving the problems of low heat dissipation power and high operating noise associated with traditional air-cooled systems.

[0049] The cooling medium is a friendly liquid with a moderate boiling point, high heat of vaporization, strong insulation properties, and is non-toxic and environmentally friendly. The medium circulation flow rate is automatically adjusted according to the heat generated by the equipment load, and it is self-circulating without the need for manual control.

[0050] In some specific embodiments, such as Figure 2As shown, the condenser 6 includes a heat dissipation fan and blade 60, a condenser steam inlet manifold 65, a condenser liquid return collection pipe 68 and a cooling liquefaction pipe 61; the heat dissipation fan and blade 60 are arranged at the top end of the condenser 6; the cooling liquefaction pipes 61 are arranged from top to bottom in the condenser 6, and the area where the cooling liquefaction pipes 61 are arranged includes an exhaust layer area 613 and a cooling liquefaction layer area 612; the exhaust layer area 613 is located at the top area of the condenser 6 below the heat dissipation fan and blade 60, and the cooling liquefaction layer area 612 is the area where the other cooling liquefaction pipes 61 are arranged below the exhaust layer area 613; the cooling liquefaction pipes 61 in the cooling liquefaction layer area 612 are connected in series in groups of every two layers, the upper layer of each group is connected to the condenser steam inlet manifold 65, and the lower layer of each group is connected to the condenser liquid return collection pipe 68; the condenser steam inlet manifold 65 is connected to the steam pipe 5, and the condenser liquid return collection pipe 68 is connected to the return pipe 8.

[0051] The number of layers involved in the exhaust layer area 613 is not limited to Figure 2 The two layers shown can be one layer, two layers or multiple layers, which is determined according to the design of the heat dissipation power.

[0052] In some specific embodiments, the heat dissipation fan and blade 60 operate in the way of air extraction, air enters the bottom of the condenser 6, air exits the top of the condenser 6, and the heat on the surface of the cooling liquefaction pipe 61 is taken away. The condenser 6 is a forced air cooling type, and the arrangement of the upper and lower layers of the internal pipeline is as shown in FIG. 2.

[0053] In some specific embodiments, as Figure 3 As shown in FIG. 2, each layer of the cooling liquefaction pipe 61 is provided with an interlayer collection upper pipe 614 and an interlayer collection lower pipe 615, each layer of the cooling liquefaction pipe 61 is connected in parallel between the interlayer collection upper pipe 614 and the interlayer collection lower pipe 615, each layer of the cooling liquefaction pipe 61 is connected to the condenser steam inlet manifold 65 through the corresponding interlayer collection upper pipe 614, and each layer of the cooling liquefaction pipe 61 is connected to the condenser liquid return collection pipe 68 through the corresponding interlayer collection lower pipe 615. Figure 3 The arrow in FIG. 2 indicates the circulation direction of the two-phase cooling medium, and the arrow beside the air exhaust valve 7 indicates the air exhaust direction. The structure corresponding to Figure 3 The condenser shape corresponding to the structure shown in FIG. 2 is as shown in FIG. 3. Figure 4a and Figure 4b As shown in FIG. 3, the cooling medium vapor enters the interlayer collection upper pipe 614 of the cooling liquefaction layer area 612 through the condenser steam inlet manifold 65, then enters the cooling liquefaction pipe 61 for cooling liquefaction, and the liquefied cooling medium liquid enters the condenser liquid return collection pipe 68 through the interlayer collection lower pipe 615, and returns to the fully sealed box body (4).

[0054] In some specific embodiments, the number of layers of the cooling liquefaction tubes 61 in the cooling liquefaction layer area 612 is any even number. The number of layers involved in the cooling liquefaction layer area 612 is not limited to Figure 2 The 6 layers shown can be any even number, and are determined according to the design of the heat dissipation power.

[0055] In some specific embodiments, the condenser 6 further comprises an air exhaust valve 7, which is arranged on the top layer end manifold of the cooling liquefaction tube 61 in the exhaust layer area 613.

[0056] In some specific embodiments, the air exhaust valve 7 is an electromagnetic pressure regulating valve. When the pressure in the cooling liquefaction tube 61 reaches or exceeds a first threshold value, the air exhaust valve 7 is automatically opened to exhaust air. When the pressure in the cooling liquefaction tube 61 is less than the first threshold value and not less than a second threshold value, the air exhaust valve 7 is automatically closed. When the pressure in the cooling liquefaction tube 61 is less than the second threshold value, the air exhaust valve 7 is automatically opened to inhale air. The main function of the electromagnetic valve 7 is to regulate the pressure in the condenser. When the power electronic equipment is under heavy load, the internal air is exhausted to promote the self-circulation of the internal cooling medium vapor and liquid. When the cooling medium vapor in the vapor tube 5 continuously enters the condenser 6, the internal air is squeezed, the pressure increases to reach or exceed the first threshold value, the electromagnetic valve is automatically opened to exhaust the internal air, and the pressure is less than the first threshold value and not less than the second threshold value, the electromagnetic valve is closed. When the power electronic equipment is switched from full load to light load, standby or shutdown, the internal pressure of the fully sealed system will enter a negative pressure state, and when the pressure is less than the second threshold value, the electromagnetic valve 7 is automatically opened to inhale air, the internal pressure is increased, and the internal pressure is regulated to be within a certain range, so as to avoid the mechanical stress generated by the negative pressure resistance of the circulating system and the continuous boiling of the liquid.

[0057] The cooling medium vapor is continuously generated, and the internal pressure increases. When the pressure reaches a certain value, the pressure regulating electromagnetic valve 7 is opened. The air is pushed by the pressure generated by the cooling medium vapor, and sequentially enters the exhaust layer area 613 through the condenser vapor inlet manifold 65, the interlayer collection upper tube 614, the cooling liquefaction tube 61, the interlayer collection lower tube 615, the condenser liquid return collection tube 68, and finally enters the exhaust layer area 613. The lower layer collection tube, and then sequentially passes through the exhaust layer interlayer cooling liquefaction tube and the upper layer collection tube, and is exhausted through the pressure regulating electromagnetic valve 7. By taking advantage of the characteristics that the density of air is much smaller than the density of cooling medium vapor and the density of cooling liquid, when the air and the cooling medium liquid enter the exhaust layer area 613 during the exhaust process, the air automatically moves upward into the exhaust layer area 613, and the liquid automatically moves downward into the condenser liquid return collection tube 68 to return to the sealed box 4. By taking advantage of the difference between the density of air and the density of the cooling medium, automatic exhaust and cooling medium circulation are achieved; the cooling medium vapor that has not been completely liquefied in the cooling liquefaction layer is collected and continuously liquefied, and is naturally returned to the sealed box through the liquid return manifold.

[0058] In some specific embodiments, the power electronic equipment cooling system further comprises a liquid injection valve 9 and a liquid discharge valve 3. The liquid injection valve 9 is arranged on the hermetically sealed box 4 and, when opened, injects cooling medium into the hermetically sealed box 4. When the liquid level in the hermetically sealed box 4 reaches a set value, the liquid injection valve 9 is closed to stop the injection. The liquid discharge valve 3 is arranged at the bottom of the hermetically sealed box 4 and, when opened, discharges the liquid in the hermetically sealed box 4. When the hermetically sealed box 4 needs to be opened for device replacement or maintenance, the liquid discharge valve 3 is manually opened. After the liquid in the hermetically sealed box 4 is completely discharged, the liquid discharge valve is closed, and the liquid discharge is completed.

[0059] In some specific embodiments, the evaporator is integrally connected with the semiconductor device and arranged inside the hermetically sealed box.

[0060] In some specific embodiments, the cooling medium is an electronic fluorination liquid, which is used for cooling and insulation.

[0061] During operation, the heat generated by the high-power semiconductor device 1 under high-voltage and high-current stress is conducted to the evaporator 2. The evaporator 2 absorbs heat to vaporize the surrounding cooling liquid medium into a gaseous state. The gaseous cooling medium enters the condenser 6 through the steam pipe 5. The steam is liquefied into a liquid in the condenser 6 after being cooled, and then returns to the hermetically sealed box 4 through the return pipe 8 by gravity, thereby forming a natural cooling circulation system. During the circulation process, the heat generated by the high-power power electronic equipment is taken away by the vaporization heat of the cooling medium. The self-circulation is realized by the pressure generated by the steam and the gravity of the liquid.

[0062] To solve the heat dissipation problem caused by the large heat loss of high-voltage and high-power power electronic equipment, overcome the shortcomings of the traditional water cooling scheme of power electronic equipment, such as complex structure and assembly, many pipeline nodes, large leakage risk, and complex operation and maintenance, solve the problems of small heat dissipation power and operation noise of traditional air cooling, and greatly improve the heat dissipation capacity of the cooling system. The heat dissipation efficiency per unit volume of the heat exchanger is nearly 3 times that of the traditional water cooling system and its condenser. The full immersion two-phase phase change cooling has uniform heat dissipation, simplified structure, no risk of liquid leakage, easy maintenance or maintenance-free, and the cooling temperature control is not affected by the environment temperature. The operation stability and safety of high-voltage and high-power power electronic equipment can be greatly improved.

[0063] In the above embodiments, the heat generating components of the power electronic equipment are immersed in the insulating liquid as a whole. Compared with the traditional water cooling, there is no complex pipeline, many joints, and water leakage risk. The equipment has higher operation safety and reliability, and is more convenient to operate and maintain. The problems of small heat dissipation power and operation noise of traditional air cooling are solved.

[0064] Adopting two-phase phase change cooling scheme, using the characteristics of high vaporization heat of cooling medium, the heat generating components and electrical devices are fully immersed in the cooling medium, the heat is taken away by liquid vaporization and evaporation, and the heat transfer efficiency is high;

[0065] Using the high insulation strength characteristics of liquid, as the main insulation of power electronic equipment, compared with traditional air insulation medium, the insulation strength per unit distance is about 20 times higher, which can realize the significant reduction of equipment size and cost reduction;

[0066] The condenser is placed on the upper part of the heat-sealed box, and the height difference between the box and the condenser is used to realize the dynamic self-circulation of the cooling medium constantly evaporating-liquefying-evaporating. The condenser is designed with internal cooling liquefaction pipe partitioning and layering design scheme, which is divided into condenser cooling liquefaction layer area and exhaust layer area. The condenser cooling liquefaction layer cooling pipeline adopts a series-parallel combined design scheme, which increases the contact area of steam and cooling liquefaction pipe, reduces the contact space and circulation resistance of cooling liquid after liquefaction, and greatly improves the heat dissipation efficiency of the condenser;

[0067] The exhaust layer cooling pipeline adopts a series design and an electromagnetic pressure regulating valve design scheme, which can automatically collect air in the system and discharge it, promote the circulation of the cooling medium, collect the residual cooling medium steam in the exhaust layer area that is not completely liquefied with air, and liquefy it. The steam is more completely liquefied. Using the difference between the density of air and the density of cooling medium, automatic exhaust and cooling medium self-circulation are realized. The cooling medium steam in the cooling liquefaction layer that is not completely liquefied is collected and continues to be liquefied, and is naturally returned to the sealed box through the liquid return main pipe;

[0068] The condenser exhaust layer is provided with a pressure regulating electromagnetic valve scheme, which automatically adjusts the internal pressure of the condenser, ensures the smooth circulation of the cooling system medium under different operating loads, prevents internal air from hindering the entry of cooling medium steam into the cooling condenser, and prevents mechanical stress caused by excessive or insufficient internal pressure, improves the operation reliability and mechanical life of the circulating system.

[0069] Example two

[0070] The second embodiment of the present application provides a condenser, which comprises a heat dissipation fan and a blade 60, a condenser steam inlet manifold 65, a condenser liquid return collecting pipe 68 and a cooling liquefaction pipe 61; the heat dissipation fan and the blade 60 are arranged at the top end of the condenser 6; the cooling liquefaction pipes 61 are arranged from top to bottom in the condenser 6, and the area where the cooling liquefaction pipes 61 are arranged comprises an exhaust layer area 613 and a cooling liquefaction layer area 612; the exhaust layer area 613 is located at the top area of the condenser 6 below the heat dissipation fan and the blade 60; and the cooling liquefaction layer area 612 is the area where the other cooling liquefaction pipes 61 are arranged below the exhaust layer area 613; the cooling liquefaction pipes 61 in the cooling liquefaction layer area 612 are connected in series in each two layers to form a group, and the upper layer of each group is connected to the condenser steam inlet manifold 65, and the lower layer of each group is connected to the condenser liquid return collecting pipe 68.

[0071] In some specific embodiments, the heat dissipation fan and the blade 60 operate in the mode of air extraction, air enters the bottom of the condenser 6, air exits from the top of the condenser 6, and the heat on the surface of the cooling liquefaction pipe 61 is taken away.

[0072] In some specific embodiments, each layer of the cooling liquefaction pipe 61 is provided with an interlayer collecting upper pipe 614 and an interlayer collecting lower pipe 615, and each layer of the cooling liquefaction pipe 61 is connected in parallel between the interlayer collecting upper pipe 614 and the interlayer collecting lower pipe 615; each layer of the cooling liquefaction pipe 61 is connected to the condenser steam inlet manifold 65 through the corresponding interlayer collecting upper pipe 614; and each layer of the cooling liquefaction pipe 61 is connected to the condenser liquid return collecting pipe 68 through the corresponding interlayer collecting lower pipe 615.

[0073] In some specific embodiments, the number of layers of the cooling liquefaction pipes 61 in the cooling liquefaction layer area 612 is any even number.

[0074] In some specific embodiments, the condenser 6 further comprises an air exhaust valve 7, which is arranged on the end gas collecting pipe of the top layer of the cooling liquefaction pipe 61 in the exhaust layer area 613.

[0075] In some specific embodiments, the air exhaust valve 7 is an electromagnetic pressure regulating valve; when the pressure in the cooling liquefaction pipe 61 reaches or exceeds a first threshold value, the air exhaust valve 7 is automatically opened to exhaust air; when the pressure in the cooling liquefaction pipe 61 is less than the first threshold value and not less than a second threshold value, the air exhaust valve 7 is automatically closed; and when the pressure in the cooling liquefaction pipe 61 is less than the second threshold value, the air exhaust valve 7 is automatically opened to inhale air.

[0076] In some specific embodiments, the cooling medium in the cooling liquefaction pipe 61 is an electronic fluorination liquid, which is used for cooling and insulation.

[0077] As to the condenser in the above-mentioned embodiments, the detailed description has been made in the embodiment of the power electronic equipment cooling system, and thus will not be described in detail here.

[0078] In the embodiment, the condenser is designed with an internal cooling liquefaction pipe partitioning and layering scheme, which respectively forms a condenser cooling liquefaction layer area and an exhaust layer area. The condenser cooling liquefaction layer cooling pipeline adopts a series-parallel combined hybrid design scheme, which increases the contact area between the steam and the cooling liquefaction pipe, reduces the contact space and circulation resistance of the cooled liquid after liquefaction, and greatly improves the condenser heat dissipation efficiency. The exhaust layer cooling pipeline adopts a series design and a design scheme of configuring an electromagnetic pressure regulating valve, which can automatically collect air in the system and discharge it, promote the circulation of the cooling medium, collect the cooling residual steam that is not completely liquefied in the liquefaction layer area and liquefy it, and make the steam liquefaction more complete. The density difference between air and cooling medium steam is utilized to realize automatic exhaust and self-circulation of the cooling medium. The cooling medium steam that is not completely liquefied in the cooling liquefaction layer is collected and continuously liquefied, and then naturally flows back to the sealed box through the liquid return main pipe.

[0079] The condenser exhaust layer is provided with a pressure regulating electromagnetic valve scheme to automatically regulate the internal pressure of the condenser, ensure the circulation of the cooling system medium under different operating loads of the equipment, avoid mechanical stress caused by excessively high or low internal pressure, and improve the operation reliability and mechanical life of the circulation system.

[0080] By utilizing the high insulation strength characteristics of the liquid, as the cooling medium, the insulation strength per unit distance is about 20 times higher than that of the traditional air insulation medium, which can realize a significant reduction in the size of the equipment and a reduction in the cost.

[0081] Embodiment three

[0082] The embodiment three of the present application provides a power electronic equipment cooling method using the power electronic equipment cooling system or the condenser as described above to cool the power electronic equipment.

[0083] As to the power electronic equipment cooling method in the above-mentioned embodiments, the detailed description has been made in the embodiment of the power electronic equipment cooling system or the condenser, and thus will not be described in detail here.

[0084] In the above-mentioned method of the embodiment, the power electronic equipment heat generating components are entirely immersed in the insulating liquid. Compared with the traditional water cooling, there is no complex pipeline, numerous joints, water leakage hazards, and the like, the equipment operation safety and reliability are higher, and the operation and maintenance are more convenient. The problems of small heat dissipation power and operating noise of the traditional air cooling are solved.

[0085] Adopting two-phase phase change cooling scheme, using the characteristics of high vaporization heat of cooling medium, the heat generating components and electrical devices are fully immersed in the cooling medium, and the heat is taken away by liquid vaporization and evaporation, with high heat transfer efficiency;

[0086] Using the high insulation strength characteristics of liquid, as the main insulation of power electronic equipment, compared with traditional air insulation medium, the insulation strength per unit distance is about 20 times higher, which can realize the significant reduction of equipment size and cost reduction;

[0087] The condenser is placed on the upper part of the heat-sealed box, and the height difference between the box and the condenser is used to realize the dynamic self-circulation of the cooling medium constantly evaporating-liquefying-evaporating. The condenser is designed with internal cooling liquefaction pipe partitioning and layering design scheme, which is divided into condenser cooling liquefaction layer area and exhaust layer area. The condenser cooling liquefaction layer cooling pipeline adopts a series-parallel combined design scheme, which increases the contact area of steam with the cooling liquefaction pipe, reduces the contact space and circulation resistance of the cooling liquid after liquefaction, and greatly improves the heat dissipation efficiency of the condenser;

[0088] The exhaust layer cooling pipeline adopts a series design and an electromagnetic pressure regulating valve design scheme, which can automatically collect air in the system and exhaust, promote the circulation of the cooling medium, collect the cooling residual steam in the liquefaction layer area and liquefy it, and make the steam liquefaction more complete. By using the density difference between air and cooling medium, automatic exhaust and self-circulation of cooling medium are realized. The cooling medium steam in the cooling liquefaction layer is collected and continues to be liquefied, and then flows back to the sealed box through the liquid return main pipe;

[0089] The condenser exhaust layer is provided with a pressure regulating electromagnetic valve scheme to automatically regulate the internal pressure of the condenser, ensuring that the cooling system medium circulates smoothly under different operating loads, avoiding mechanical stress caused by excessive internal pressure or low pressure, and improving the operation reliability and mechanical life of the circulating system.

[0090] Those skilled in the art can change the above sequence without departing from the protection scope of the present disclosure. Any modification, supplement and equivalent replacement within the principle range of the present application shall still belong to the patent coverage range of the present application.

Claims

1. A cooling system for power electronic equipment, characterized in that, include: Evaporator (2), fully sealed housing (4), steam pipe (5), condenser (6) and return pipe (8); The fully sealed enclosure (4) is filled with liquid cooling medium, which immerses the semiconductor device (1) and the evaporator (2). The steam pipe (5) is connected to the top of one side of the fully sealed enclosure (4), and the return pipe (8) is connected to the bottom of the other side of the fully sealed enclosure (4). The evaporator (2) is located inside the fully sealed enclosure (4) and is used to absorb the heat conducted by the semiconductor device. The liquid cooling medium around the evaporator (2) is vaporized into a gaseous state, and the gaseous cooling medium enters the condenser (6) through the steam pipe (5). The condenser (6) is located above the fully sealed enclosure (4). The condenser (6) is connected to the steam pipe (5) and the return pipe (8) respectively. The condenser (6) liquefies the vapor cooling medium, and the liquid cooling medium flows back into the fully sealed enclosure (4) through the return pipe (8). The condenser (6) includes a heat dissipation fan and blades (60), a condenser steam inlet main pipe (65), a condenser liquid return collection pipe (68), and a cooling liquefaction pipe (61). The cooling fan and blades (60) are located at the top of the condenser (6); Cooling liquefaction pipes (61) are arranged from top to bottom in the condenser (6). The area where the cooling liquefaction pipes (61) are located includes an exhaust layer area (613) and a cooling liquefaction layer area (612). The exhaust layer area (613) is located in the top area of ​​the condenser (6) below the heat dissipation fan and blades (60). The cooling liquefaction layer area (612) is the area where other cooling liquefaction pipes (61) are located below the exhaust layer area (613). In the cooling liquefaction layer area (612), the cooling liquefaction pipes (61) are connected in series in every two layers as a group. The upper layer of each group is connected to the condenser steam inlet main pipe (65), and the lower layer of each group is connected to the condenser return liquid collection pipe (68). The condenser steam inlet main pipe (65) is connected to the steam pipe (5), and the condenser return liquid collection pipe (68) is connected to the return pipe (8). Each layer of cooling liquefaction pipe (61) is provided with an interlayer upper collection pipe (614) and an interlayer lower collection pipe (615). Each layer of cooling liquefaction pipe (61) is connected in parallel between the interlayer upper collection pipe (614) and the interlayer lower collection pipe (615). Each layer of cooling liquefaction pipe (61) is connected to the condenser steam inlet main pipe (65) through the corresponding interlayer upper collection pipe (614). Each layer of cooling liquefaction pipe (61) is connected to the condenser return liquid collection pipe (68) through the corresponding interlayer lower collection pipe (615). The cooling medium is insulating.

2. The power electronic equipment cooling system as described in claim 1, characterized in that, The cooling fan and blades (60) operate by exhaust, with air entering from the bottom of the condenser (6) and exiting from the top, carrying away the heat from the surface of the cooling liquefaction pipe (61).

3. The power electronic equipment cooling system as described in claim 1, characterized in that, The number of cooling liquefaction pipes (61) in the cooling liquefaction layer region (612) can be any even number of layers, and can be appropriately matched according to heat dissipation requirements.

4. The power electronic equipment cooling system as described in claim 1, characterized in that, The condenser (6) also includes an air exhaust valve (7), which is disposed on the end of the cooling liquefaction pipe (61) in the exhaust layer region (613).

5. The power electronic equipment cooling system as described in claim 4, characterized in that, The air exhaust valve (7) is an electromagnetic pressure regulating valve. When the pressure inside the cooling liquefaction pipe (61) reaches or exceeds the first threshold, the air exhaust valve (7) automatically opens to discharge air. When the pressure inside the cooling liquefaction pipe (61) is less than the first threshold and not less than the second threshold, the air exhaust valve (7) automatically closes. When the pressure inside the cooling liquefaction pipe (61) is less than the second threshold, the air exhaust valve (7) automatically opens to draw in air.

6. The power electronic equipment cooling system as described in claim 1, characterized in that, The power electronic equipment cooling system also includes a liquid injection valve (9) and a liquid drain valve (3). The liquid injection valve (9) is installed on the fully sealed box (4). After opening, it injects cooling medium into the fully sealed box (4). When the liquid level in the fully sealed box (4) reaches the set value, the liquid injection valve (9) is closed. The liquid drain valve (3) is installed at the bottom of the fully sealed box (4). After opening, it drains the liquid in the fully sealed box (4).

7. The power electronic equipment cooling system as described in claim 1, characterized in that, The evaporator (2) is pressed together with the semiconductor device (1) and placed inside the fully sealed enclosure (4).

8. The power electronic equipment cooling system as described in any one of claims 1 to 7, characterized in that, The cooling medium is an electronic fluorinated liquid, used for cooling and insulation.

9. A condenser, characterized in that, It includes a cooling fan and blades (60), a condenser steam inlet manifold (65), a condenser liquid return manifold (68), and a cooling liquefaction pipe (61). The cooling fan and blades (60) are located at the top of the condenser (6); Cooling liquefaction pipes (61) are arranged from top to bottom in the condenser (6). The area where the cooling liquefaction pipes (61) are located includes an exhaust layer area (613) and a cooling liquefaction layer area (612). The exhaust layer area (613) is located in the top area of ​​the condenser (6) below the heat dissipation fan and blades (60). The cooling liquefaction layer area (612) is the area where other cooling liquefaction pipes (61) are located below the exhaust layer area (613). In the cooling liquefaction layer area (612), the cooling liquefaction pipes (61) are connected in series in every two layers as a group. The upper layer of each group is connected to the condenser steam inlet main pipe (65), and the lower layer of each group is connected to the condenser return liquid collection pipe (68). Each layer of cooling liquefaction pipe (61) is provided with an interlayer upper collection pipe (614) and an interlayer lower collection pipe (615). Each layer of cooling liquefaction pipe (61) is connected in parallel between the interlayer upper collection pipe (614) and the interlayer lower collection pipe (615). Each layer of cooling liquefaction pipe (61) is connected to the condenser steam inlet main pipe (65) through the corresponding interlayer upper collection pipe (614). Each layer of cooling liquefaction pipe (61) is connected to the condenser return liquid collection pipe (68) through the corresponding interlayer lower collection pipe (615).

10. The condenser as claimed in claim 9, characterized in that, The number of layers of cooling liquefaction pipes (61) in the cooling liquefaction layer region (612) is any even number.

11. The condenser as claimed in claim 9, characterized in that, The condenser (6) also includes an air exhaust valve (7), which is disposed on the end of the cooling liquefaction pipe (61) in the exhaust layer region (613).

12. The condenser as claimed in claim 11, characterized in that, The air exhaust valve (7) is an electromagnetic pressure regulating valve. When the pressure inside the cooling liquefaction pipe (61) reaches or exceeds the first threshold, the air exhaust valve (7) automatically opens to discharge air. When the pressure inside the cooling liquefaction pipe (61) is less than the first threshold and not less than the second threshold, the air exhaust valve (7) automatically closes. When the pressure inside the cooling liquefaction pipe (61) is less than the second threshold, the air exhaust valve (7) automatically opens to draw in air.

13. The condenser according to any one of claims 9 to 12, characterized in that, The cooling medium inside the cooling liquefaction pipe (61) is electronic fluorinated liquid, used for cooling and insulation.

14. A cooling method for power electronic equipment, characterized in that, The power electronic equipment is cooled using the power electronic equipment cooling system as described in any one of claims 1 to 8 or the condenser as described in any one of claims 9 to 13.

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