Pole piece flying cutting device and method, computer device and storage medium
By integrating multi-galvanometer modules and laser components into a cutting method, the problem of low cutting efficiency of traditional single galvanometers has been solved, achieving efficient cutting of lithium battery electrodes and increasing production capacity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG LIYUANHENG TECH CO LTD
- Filing Date
- 2023-05-31
- Publication Date
- 2026-05-12
AI Technical Summary
Traditional die-cutting methods for lithium battery electrodes limit the processing area due to the single galvanometer, reducing the cutting efficiency and product capacity.
By employing multiple galvanometer modules and laser components, combined with a flying cutting algorithm, integrated cutting of multiple laser trajectories is achieved, and the cutting path is optimized through the feeding of the transport mechanism and negative feedback signals.
It improved the cutting efficiency and production capacity of electrode sheets, expanded the processing area, and saved equipment costs.
Smart Images
Figure CN116586780B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of product processing technology, and in particular to an electrode flying cutting device, method, computer equipment and storage medium. Background Technology
[0002] Lithium-ion batteries are one of the most important power components in new energy vehicles and other products. They are a relatively recent development with huge demand. In current technology, the cell forming process for power batteries requires cutting the positive and negative electrode plates.
[0003] Traditional die-cutting methods require the use of die-cutting to shape the tabs and electrodes when cutting positive and negative electrode sheets. During the processing of the tabs and electrodes, a single galvanometer is usually used to cut the electrode sheets. However, a single galvanometer will limit the processing area and easily cause the tabs and electrodes to be cut separately, thereby reducing the cutting efficiency of the electrodes and the production capacity. Summary of the Invention
[0004] The main objective of this application is to provide an electrode flying cutting device, method, computer equipment, and storage medium that uses multiple galvanometer modules for processing, which can integrate multiple laser processes to improve product capacity and cutting efficiency.
[0005] To achieve the above objectives, a first aspect of this application provides an electrode flying cutting device, comprising:
[0006] Laser assembly used to emit multiple laser beams;
[0007] A galvanometer module is communicatively connected to the laser assembly and is used to cut sample electrodes.
[0008] A transport mechanism is disposed on one side of the beam emission direction of the galvanometer module mechanism, and the transport mechanism is used to transport sample electrodes along a preset feeding direction.
[0009] The controller is communicatively connected to the laser assembly, the galvanometer module, and the transport mechanism. The controller sends a start signal to the laser assembly, causing it to emit multiple laser beams to the galvanometer module. Based on a preset flying-cutting algorithm, the controller controls the galvanometer module to calculate the laser trajectory corresponding to each laser beam. It controls the transport mechanism to transport the sample electrode sheet along a preset feeding direction and receives a negative feedback signal generated by the transport mechanism. Based on the negative feedback signal and the flying-cutting algorithm, it performs path derivation on the multiple laser trajectories to obtain multiple laser processing paths. It sends all the laser processing paths to the galvanometer module, causing the galvanometer module to cut the sample electrode sheet according to the laser processing paths.
[0010] In some embodiments, the device further includes a gantry; the galvanometer module mechanism includes a first galvanometer module, a second galvanometer module, and a third galvanometer module, wherein the second galvanometer module is disposed in the center of the frame of the gantry, and the first galvanometer module and the third galvanometer module are respectively disposed on both sides of the second galvanometer module according to a preset installation interval.
[0011] In some embodiments, the laser assembly includes a first laser disposed on one side of the gantry and a second and a third laser disposed on the other side of the gantry. The first laser is communicatively connected to a first galvanometer module, the second laser is communicatively connected to a second galvanometer module, and the third laser is communicatively connected to a third galvanometer module.
[0012] A second aspect of this application provides a method for electrode flying cutting, applied to an electrode flying cutting device, the electrode flying cutting device including a laser assembly, a galvanometer module mechanism and a transport mechanism;
[0013] The method includes:
[0014] A start signal is sent to the laser assembly so that the laser assembly emits multiple laser beams to the galvanometer module mechanism according to the start signal;
[0015] Based on a preset flight cutting algorithm, the galvanometer module mechanism calculates the laser trajectory corresponding to each laser beam.
[0016] The transport mechanism is controlled to transport sample electrodes along a preset feeding direction, and the negative feedback signal generated by the transport mechanism is received.
[0017] Based on the negative feedback signal and the flight cutting algorithm, multiple laser trajectories are derived to obtain multiple laser processing paths;
[0018] All the laser processing paths are sent to the galvanometer module mechanism so that the galvanometer module mechanism can cut the sample electrode according to the laser processing paths.
[0019] In some embodiments, the laser assembly includes a first laser, a second laser, and a third laser; sending a start signal to the laser assembly to cause the laser assembly to emit multiple laser beams to the galvanometer module mechanism according to the start signal includes:
[0020] The laser processing power, laser processing frequency, and laser processing speed are determined based on the start signal.
[0021] The start signal is sent to the laser assembly to control the first laser, the second laser, and the third laser to emit the first laser, the second laser, and the third laser to the galvanometer module mechanism according to the laser processing power, the laser processing frequency, and the laser processing speed.
[0022] In some embodiments, the galvanometer module mechanism includes a first galvanometer module, a second galvanometer module, and a third galvanometer module; the step of controlling the galvanometer module mechanism to calculate the laser trajectory corresponding to each laser based on a preset flight cutting algorithm includes:
[0023] Based on the flight cutting algorithm, the first galvanometer module is controlled to calculate the trajectory corresponding to the first laser to obtain the first trajectory, the second galvanometer module is controlled to calculate the trajectory corresponding to the second laser to obtain the second trajectory, and the third galvanometer module is controlled to calculate the trajectory corresponding to the third laser to obtain the third trajectory.
[0024] In some embodiments, the step of deriving multiple laser processing paths from multiple laser trajectories based on the negative feedback signal and the flight cutting algorithm includes:
[0025] Based on the negative feedback signal, image generation operations are performed on the first trajectory, the second trajectory, and the third trajectory to generate a path cutting map;
[0026] The path cutting map is derived according to the flight cutting algorithm to obtain a first laser processing path corresponding to the first trajectory, a second laser processing path corresponding to the second trajectory, and a third laser processing path corresponding to the third trajectory. The first laser processing path and the third laser processing path are mirror images of each other, and the second laser processing path is a straight line.
[0027] In some embodiments, sending all the laser processing paths to the galvanometer module mechanism so that the galvanometer module mechanism cuts the sample electrode according to the laser processing paths includes:
[0028] All the laser processing paths are sent to the galvanometer module mechanism so that the first galvanometer module cuts the sample electrode along the first laser processing path, the second galvanometer module performs linear cyclic cutting of the sample electrode along the second laser processing path, and the third galvanometer module cuts the sample electrode along the third laser processing path.
[0029] A third aspect of this application provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor is used to perform the electrode flying cutting method as described in any one of the second aspect embodiments.
[0030] A fourth aspect of this application provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a computer, the computer is used to perform the electrode flying cutting method as described in any one of the embodiments of the second aspect of this application.
[0031] The electrode flying cutting device, method, and storage medium proposed in this application have the following beneficial effects: The controller is communicatively connected to the laser assembly, the galvanometer module mechanism, and the transport mechanism, and is used to send a start signal to the laser assembly so that the laser assembly emits multiple lasers to the galvanometer module mechanism, thereby expanding the processing area of the galvanometer module. Then, based on a preset flying cutting algorithm, the controller controls the galvanometer module to calculate the laser trajectory corresponding to each laser, and controls the transport mechanism to transport the sample electrode along a preset feeding direction, realizing electrode cutting while feeding. Afterwards, based on the negative feedback signal sent by the transport mechanism and the flying cutting algorithm, the path is derived for multiple laser trajectories to obtain multiple laser processing paths, thereby integrating multiple laser processes together and improving product capacity. Finally, all laser processing paths are sent to the galvanometer module mechanism so that the galvanometer module mechanism cuts the sample electrode according to the laser processing paths, realizing that different galvanometer modules in the galvanometer module mechanism cut the electrode according to the trajectory calculated by their respective algorithms, thereby improving the cutting efficiency of the sample electrode. Attached Figure Description
[0032] Figure 1 This is a schematic diagram of the electrode flying cutting device provided in the embodiments of this application;
[0033] Figure 2This is a flowchart illustrating the specific method of the electrode flying cutting method provided in the embodiments of this application;
[0034] Figure 3 yes Figure 2 The detailed flowchart of step S101;
[0035] Figure 4 yes Figure 2 The detailed flowchart of step S102;
[0036] Figure 5 yes Figure 2 The detailed flowchart of step S104;
[0037] Figure 6 yes Figure 2 The detailed flowchart of step S105;
[0038] Figure 7 This is a schematic diagram of the tab pattern provided in the example of this application;
[0039] Figure 8 This is a schematic diagram of the tab pattern provided in another example of this application;
[0040] Figure 9 This is a schematic diagram of the hardware structure of the computer device provided in the embodiments of this application. Detailed Implementation
[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0042] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.
[0044] The electrode flying cutting method provided in this application can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, or smartwatch, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms; the software can be an application implementing the above method, but is not limited to the above forms.
[0045] The embodiments of this application can be used in numerous general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer computer devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.
[0046] Lithium-ion batteries are one of the most important power components in new energy vehicles and other products. They are a relatively recent development with huge demand. In current technology, the cell forming process for power batteries requires cutting the positive and negative electrode plates.
[0047] Traditional die-cutting methods require the use of die-cutting to shape the tabs and electrodes when cutting positive and negative electrode sheets. During the processing of the tabs and electrodes, a single galvanometer is usually used to cut the electrode sheet. However, the processing area is limited by the single galvanometer. Due to the different working modes and cutting paths of each galvanometer, the tabs and electrodes are easily cut separately, thereby reducing the cutting efficiency of the electrode sheet and the product capacity.
[0048] To address the aforementioned issues, this embodiment proposes an electrode flying cutting device, method, computer equipment, and storage medium, which offers the following advantages: The controller is communicatively connected to the laser assembly, the galvanometer module mechanism, and the transport mechanism, respectively. It sends a start signal to the laser assembly to emit multiple laser beams to the galvanometer module mechanism, thereby expanding the processing area of the galvanometer module. Based on a preset flying cutting algorithm, the controller calculates the laser trajectory corresponding to each laser beam and controls the transport mechanism to transport the sample electrode along a preset feeding direction, enabling simultaneous feeding and electrode cutting. Then, based on the negative feedback signal sent by the transport mechanism and the flying cutting algorithm, multiple laser trajectories are derived to obtain multiple laser processing paths, thus integrating multiple laser processes and improving product productivity. Finally, all laser processing paths are sent to the galvanometer module mechanism, enabling it to cut the sample electrode according to the laser processing paths. This allows different galvanometer modules within the galvanometer module mechanism to cut the electrode according to their respective algorithms' calculated trajectories, improving the cutting efficiency of the sample electrode.
[0049] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the electrode flying cutting device provided in the embodiments of this application;
[0050] In some embodiments, the electrode flying cutting device includes:
[0051] Laser assembly used to emit multiple laser beams;
[0052] It is understandable that the laser emitted by the laser assembly includes, but is not limited to, infrared lasers, ultraviolet lasers, and so on, of various wavelengths.
[0053] The galvanometer module is connected in communication with the laser assembly and is used to cut the sample electrode 500.
[0054] In some embodiments, the galvanometer module mechanism controls the size of the laser by adjusting the reflection angle and rotation angle, thereby completing the positioning, cutting and fine control of the laser spot, improving cutting accuracy and reliability.
[0055] It should be noted that the galvanometer module can be connected to the laser components via optical fibers, twisted pairs, or other means.
[0056] The transport mechanism 100 is located on one side of the beam emission direction of the galvanometer module mechanism. The transport mechanism 100 is used to transport the sample electrode 500 along the preset feeding direction.
[0057] In some embodiments, the transport mechanism 100 is configured corresponding to the galvanometer module mechanism and is located on one side of the beam emission direction of the galvanometer module mechanism. The preset feeding direction can be set by the user according to their needs, such as feeding from left to right or from right to left, thereby realizing the movement of the sample electrode 500 and further accelerating the processing efficiency of the sample electrode 500.
[0058] It should be noted that the transport mechanism 100 can be a belt conveyor, chain conveyor, etc., and this embodiment does not impose specific limitations.
[0059] The controller is communicatively connected to the laser assembly, the galvanometer module mechanism, and the transport mechanism 100. The controller sends a start signal to the laser assembly, causing it to emit multiple laser beams to the galvanometer module mechanism. Based on a preset flying-cutting algorithm, the controller controls the galvanometer module mechanism to calculate the laser trajectory corresponding to each laser beam. It controls the transport mechanism 100 to transport the sample electrode 500 along a preset feeding direction and receives negative feedback signals generated by the transport mechanism 100. Based on the negative feedback signals and the flying-cutting algorithm, it performs path derivation on the multiple laser trajectories to obtain multiple laser processing paths. It sends all laser processing paths to the galvanometer module mechanism, enabling the galvanometer module mechanism to cut the sample electrode 500 according to the laser processing paths. This achieves electrode cutting by different galvanometer modules within the galvanometer module mechanism according to their respective algorithms' calculated trajectories, improving the cutting efficiency of the sample electrode 500.
[0060] In some embodiments, the device further includes a gantry 200; the galvanometer module mechanism includes a first galvanometer module 310, a second galvanometer module 320, and a third galvanometer module 330. The second galvanometer module 320 is located in the center of the frame of the gantry 200. The first galvanometer module 310 and the third galvanometer module 330 are respectively arranged on both sides of the second galvanometer module 320 according to a preset installation interval, thereby expanding the processing area of the galvanometer, improving cutting efficiency, and solving the problem of limited processing area of a single galvanometer.
[0061] It should be noted that the first galvanometer module 310, the second galvanometer module 320, and the third galvanometer module 330 are sequentially mounted on the frame of the gantry 200, and the distance between two adjacent galvanometer modules is a preset installation interval. The installation interval is related to the length and width of the laser emitted by the laser assembly and is customized according to the length and width of the laser. For example, if the processing area of a single laser is 250mm*250mm, the installation interval is 250mm; if the processing area of a single laser is 300mm*300mm, the installation interval is 300mm, and so on.
[0062] In some embodiments, the laser assembly includes a first laser 410 disposed on one side of the gantry 200 and a second laser 420 and a third laser 430 disposed on the other side of the gantry 200. The first laser 410 is communicatively connected to a first galvanometer module 310, the second laser 420 is communicatively connected to a second galvanometer module 320, and the third laser 430 is communicatively connected to a third galvanometer module 330, thereby enabling large-area processing of the electrode sheet and accelerating the cutting efficiency of the electrode sheet.
[0063] It should be noted that the individual laser processing areas of the first laser 410, the second laser 420, and the third laser 430 are the same. For example, in this embodiment, the individual laser processing area is 250mm*250mm. The first galvanometer module 310, the second galvanometer module 320, and the third galvanometer module are spaced 250mm apart, so that the galvanometer processing area composed of the three galvanometer modules is 750mm*250mm.
[0064] It is understandable that the number of galvanometer modules in the galvanometer module mechanism is the same as the number of lasers in the laser assembly.
[0065] Please refer to Figure 2 , Figure 2 This is a flowchart of a specific method of the electrode flying cutting method provided in the embodiments of this application. It is applied, but not limited to, to the electrode flying cutting device described above. In some embodiments, the electrode flying cutting method includes, but is not limited to, steps S101 to S105.
[0066] Step S101: Send a start signal to the laser assembly so that the laser assembly emits multiple laser beams to the galvanometer module mechanism according to the start signal;
[0067] In some embodiments, a start signal is sent to the laser assembly to start the laser assembly, so that the laser assembly sends multiple laser beams to the galvanometer module mechanism to achieve optical path adjustment of multiple laser beams, thereby completing the positioning, cutting and fine control of the light spot.
[0068] Step S102: Based on the preset flight cutting algorithm, the galvanometer module mechanism is controlled to calculate the laser trajectory corresponding to each laser.
[0069] In some embodiments, the galvanometer module mechanism is controlled by a preset flying cutting algorithm to calculate the laser trajectory corresponding to each laser, thereby improving the cutting accuracy of the electrode sheet and realizing automated and efficient production.
[0070] Step S103: Control the transport mechanism to transport the sample electrode along the preset feeding direction and receive the negative feedback signal generated by the transport mechanism.
[0071] In some embodiments, the control mechanism transports sample electrodes along a preset feeding direction, and the transport mechanism generates a negative feedback signal during the transport of sample electrodes. Receiving the negative feedback signal generated by the transport mechanism enables electrode feeding and electrode cutting to be performed simultaneously, thereby improving the cutting efficiency of the electrode.
[0072] Step S104: Based on the negative feedback signal and the flying cutting algorithm, multiple laser trajectories are derived to obtain multiple laser processing paths;
[0073] In some embodiments, multiple laser trajectories are derived based on negative feedback signals and a flight cutting algorithm, and path planning is performed on the multiple laser trajectories to optimize the cutting path and obtain multiple laser processing paths, thereby maximizing material utilization and reducing waste, and lowering processing costs.
[0074] Step S105: Send all laser processing paths to the galvanometer module mechanism so that the galvanometer module mechanism can cut the sample electrode according to the laser processing paths.
[0075] In some embodiments, all laser processing paths are sent to the galvanometer module mechanism so that the galvanometer module mechanism can cut the sample electrode according to the laser processing path, thereby enabling different galvanometer modules to cut the electrode according to the trajectory calculated by their respective algorithms, which can adapt to the cutting needs of various types of electrode.
[0076] Please refer to Figure 3 , Figure 3 This is a flowchart illustrating step S101 provided in an embodiment of this application. In some embodiments, step S101 includes, but is not limited to, steps S201 and S202.
[0077] Step S201: Determine the laser processing power, laser processing frequency, and laser processing speed based on the start signal;
[0078] In some embodiments, the start signal includes preset laser processing power, laser processing frequency, and laser processing speed. Therefore, the laser processing power, laser processing frequency, and laser processing speed are determined first based on the start signal, which facilitates the adjustment of the processing speed of the sample electrode and improves the cutting efficiency of the sample electrode.
[0079] Step S202: Send a start signal to the laser assembly to control the first laser, the second laser and the third laser to emit the first laser, the second laser and the third laser to the galvanometer module mechanism according to the laser processing power, the laser processing frequency and the laser processing speed.
[0080] In some embodiments, a start signal is sent to the laser assembly to control the first laser, the second laser, and the third laser to start, so that the three lasers emit the first laser, the second laser, and the third laser to the galvanometer module mechanism according to the preset laser processing power, laser processing frequency, and laser processing speed, respectively. The first laser is generated by the first laser, the second laser is generated by the second laser, and the third laser is generated by the third laser, thereby expanding the processing area of the sample electrode.
[0081] Please refer to Figure 4 , Figure 4 This is a flowchart illustrating step S102 provided in an embodiment of this application. In some embodiments, step S102 may include, but is not limited to, step S301.
[0082] Step S301: Based on the flight cutting algorithm, control the first galvanometer module to calculate the trajectory corresponding to the first laser to obtain the first trajectory; control the second galvanometer module to calculate the trajectory corresponding to the second laser to obtain the second trajectory; and control the third galvanometer module to calculate the trajectory corresponding to the third laser to obtain the third trajectory.
[0083] In some embodiments, the first galvanometer module, the second galvanometer module, and the third galvanometer module are controlled based on the flight cutting algorithm to calculate the trajectories corresponding to the first laser, the second laser, and the third laser, respectively, to obtain the first trajectory, the second trajectory, and the third trajectory, thereby obtaining the trajectories of different galvanometer modules. The first trajectory, the second trajectory, and the third trajectory are the actual cutting trajectories of the first galvanometer module, the second galvanometer module, and the third galvanometer module, which facilitates the subsequent determination of the processing path during the movement process.
[0084] Please refer to Figure 5 , Figure 5 This is a flowchart illustrating step S104 as provided in an embodiment of this application. In some embodiments, step S104 includes, but is not limited to, steps S401 and S402.
[0085] Step S401: Perform image generation operation on the first trajectory, the second trajectory, and the third trajectory based on the negative feedback signal to generate a path cutting map;
[0086] Step S402: Based on the flight cutting algorithm, the path cutting map is derived to obtain the first laser processing path corresponding to the first trajectory, the second laser processing path corresponding to the second trajectory, and the third laser processing path corresponding to the third trajectory.
[0087] It should be noted that the first laser processing path and the third laser processing path are mirror images of each other, and the second laser processing path is a straight line.
[0088] In some embodiments, after receiving a negative feedback signal, an image generation operation is performed on the first trajectory, the second trajectory, and the third trajectory to generate an actual path cutting map. Then, the multiple trajectories in the path cutting map are reversed using a flight cutting algorithm to obtain the laser cutting path in flight, namely, the first laser processing path, the second laser processing path, and the third laser processing path, thereby enabling dynamic cutting of the electrode sheet.
[0089] It should be noted that the paths calculated using the flying cut algorithm for the first and third laser processing paths are opposite.
[0090] Please refer to Figure 6 , Figure 6 This is a flowchart illustrating step S105 as provided in an embodiment of this application. In some embodiments, step S105 may include, but is not limited to, step S501.
[0091] Step S501: Send all laser processing paths to the galvanometer module mechanism so that the first galvanometer module cuts the sample electrode along the first laser processing path, the second galvanometer module performs linear cyclic cutting of the sample electrode along the second laser processing path, and the third galvanometer module cuts the sample electrode along the third laser processing path.
[0092] In some embodiments, all laser processing paths are sent to the galvanometer module mechanism so that the first galvanometer module cuts the sample electrode along the first laser processing path, the second galvanometer module performs linear cyclic cutting of the sample electrode along the second laser processing path, and the third galvanometer module cuts the sample electrode along the third laser processing path, thereby completing the complete cutting of the electrode, improving the matching accuracy between multiple galvanometer modules, increasing cutting efficiency, and saving equipment costs.
[0093] It should be noted that the second laser processing path is set in a straight line, but the actual light output is a straight line shot out from an inclined plane.
[0094] To explain the electrode flying cutting device and method more clearly and thoroughly, specific examples are provided below.
[0095] Example 1:
[0096] The laser processing power, frequency, and speed are set by the industrial control computer. Then, the industrial control computer controls three lasers to generate laser light, which is transmitted to the galvanometer module mechanism through optical fiber. The three galvanometer modules then use a flying-cutting algorithm to calculate the trajectory corresponding to galvanometer modules 1, 2, and 3 respectively. During the electrode transportation process, the motor installed on the transport electrode generates a negative feedback signal that is transmitted back to the control card. After receiving the signal, the control card uses the flying-cutting algorithm to deduce the laser trajectory into a laser processing path. The controller then transmits the three regenerated algorithm path processing trajectories to the three galvanometer modules to perform laser cutting simultaneously, completing the entire electrode cutting process.
[0097] refer to Figure 7-8 , Figure 7 A schematic diagram of the tab pattern provided as an example of the present invention;
[0098] Figure 8 A schematic diagram of a tab pattern provided for another example of the present invention;
[0099] The flight cutting algorithm first reverse-engineers the pre-processed planar cutting path into the laser cutting path during flight, and then cuts the electrode pattern (such as...) Figure 7 (as shown) converted into a graphic (e.g.) Figure 8 (As shown).
[0100] It should be noted that the trajectories calculated by the flying-cutting algorithm used by the first and third galvanometer modules are opposite. The second galvanometer module implements linear cyclic laser cutting. The specific algorithm is as follows:
[0101] The actual cutting trajectory of segment 0A at height is:
[0102]
[0103] Among them, t step ∈[0, H 0A / k1V0], V1=k1V0, where V0 is the processing speed of the transport mechanism, H 0A V1 is the actual height of the cutting path 0A, V1 is the cutting speed of path 0A, and k1 is the first correction coefficient.
[0104] The trajectory of the galvanometer in segment 0A is calculated based on the actual trajectory of the straight line segment as follows:
[0105]
[0106] The actual cutting trajectory of line segment AB is:
[0107]
[0108] Among them, t step ∈[0, S 0A / k2V0], V2=k2V0, V2 is the cutting speed of path AB, and k2 is the second correction coefficient.
[0109] The trajectory of the galvanometer in segment AB is calculated based on the actual trajectory of the straight line segment as follows:
[0110]
[0111] The actual cutting trajectory of arc BC segment is as follows:
[0112]
[0113] Among them, t step ∈[aR1 / k1V0], V3=k1V0, V3 is the cutting speed of path BC, R1 is the radius of arc BC, and α is the angle of arc BC.
[0114] The actual trajectory of the circular arc segment is calculated using the galvanometer trajectory for segment BC of the circular arc, as detailed below:
[0115]
[0116] The actual cutting trajectory of straight line segment CD is:
[0117]
[0118] Among them, t step ∈[0, H CD / k2V0], V4=k2V0, V4 is the cutting speed of path CD, H CD This represents the height of the actual cutting path CD.
[0119] The trajectory of the galvanometer in segment CD is calculated based on the actual trajectory of the straight line segment as follows:
[0120]
[0121] The actual cutting trajectory of line segment DE is:
[0122]
[0123] Among them, t step ∈[0, S DE / k5V0], V5=k5V0, V5 is the cutting speed of path DE, and k5 is the fifth correction coefficient.
[0124] The trajectory of the galvanometer in segment DE is calculated based on the actual trajectory of the straight line segment as follows:
[0125]
[0126] It should be noted that the actual cutting trajectories of straight line segment DE, circular arc segment EF, and straight line segment FG are consistent with the path trajectory equations of segments AB, BC, and CD, respectively, which will not be elaborated further.
[0127] The actual cutting trajectory of the straight line segment GH is:
[0128]
[0129] Among them, t step ∈[0, S DE / k8V0], V8=k8V0, V8 is the cutting speed of path GH, and k8 is the eighth correction coefficient.
[0130] The trajectory of the galvanometer in segment GH is calculated based on the actual trajectory of the straight line segment as follows:
[0131]
[0132] It should be noted that the actual cutting trajectories of the straight line segment HI, the circular arc segment IJ, the straight line segment JK, the straight line segment KL, the circular arc segment LM, the straight line segment MN, and the height segment MP are consistent with the path trajectory equations of the segments FG, EF, DE, CD, BC, AB, and OA, respectively.
[0133] In some embodiments, the multiple galvanometer modules of this solution are used for parallel cutting, making full use of their effective processing area. This achieves the effect of maximizing the effective processing area, thereby cutting larger electrode sheets of different sizes and improving cutting efficiency. At the same time, combined with the flying cutting algorithm, electrode sheet feeding can be achieved while the three galvanometer modules cut the electrode sheets according to the trajectories calculated by their respective algorithms, integrating multiple laser processes together, which not only saves equipment costs but also increases product production capacity.
[0134] This application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor is used to execute the electrode flying cutting method in the above embodiments of this application.
[0135] Reference Figure 9 , Figure 9 This is a schematic diagram of the hardware structure of the computer device provided in the embodiments of this application.
[0136] The following is combined Figure 9 The hardware structure of the computer device is described in detail. The computer device includes: a processor 910, a memory 920, an input / output interface 930, a communication interface 940, and a bus 950.
[0137] The processor 910 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.
[0138] The memory 920 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 920 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 920 and called and executed by the processor 910 using the electrode flying cutting method of the embodiments of this application.
[0139] The input / output interface 930 is used to implement information input and output;
[0140] The communication interface 940 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.); and the bus 950 is used to transmit information between the various components of the device (such as processor 910, memory 920, input / output interface 930 and communication interface 940).
[0141] The processor 910, memory 920, input / output interface 930 and communication interface 940 are connected to each other within the device via bus 950.
[0142] This application also provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a computer, the computer is used to perform the electrode flying cutting method as described in the above embodiments of this application.
[0143] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
[0144] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.
[0145] It will be understood by those skilled in the art that Figures 2 to 6 The technical solutions shown do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.
[0146] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.
[0147] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.
[0148] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0149] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.
[0150] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0151] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0152] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.
[0153] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0154] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.
Claims
1. A polarity flying cutting device, characterized in that, include: Laser assembly used to emit multiple laser beams; A galvanometer module is communicatively connected to the laser assembly and is used to cut sample electrodes. A transport mechanism is disposed on one side of the beam emission direction of the galvanometer module mechanism, and the transport mechanism is used to transport sample electrodes along a preset feeding direction. The controller is communicatively connected to the laser assembly, the galvanometer module, and the transport mechanism. The controller sends a start signal to the laser assembly, causing it to emit multiple laser beams to the galvanometer module. Based on a preset flying-cutting algorithm, the controller controls the galvanometer module to calculate the laser trajectory corresponding to each laser beam. The controller also controls the transport mechanism to transport the sample electrode along a preset feeding direction and receives negative feedback signals generated by the transport mechanism. Based on the negative feedback signals and the flying-cutting algorithm, the controller performs path derivation on the multiple laser trajectories to obtain multiple laser beams. The laser processing path is sent to the galvanometer module mechanism so that the galvanometer module mechanism can cut the sample electrode according to the laser processing path. Specifically, the galvanometer module mechanism includes a first galvanometer module, a second galvanometer module, and a third galvanometer module. The first galvanometer module and the third galvanometer module use opposite trajectories calculated by the flying cutting algorithm. The second galvanometer module realizes linear cyclic laser cutting. Multiple galvanometer modules cut side by side to make full use of their effective processing area to achieve the effect of maximizing the effective processing area and cutting larger electrode sheets of different sizes, thereby improving cutting efficiency.
2. The electrode flying cutting device according to claim 1, characterized in that, The device also includes a gantry frame; the galvanometer module mechanism includes a first galvanometer module, a second galvanometer module and a third galvanometer module, the second galvanometer module is located in the center of the gantry frame, and the first galvanometer module and the third galvanometer module are respectively located on both sides of the second galvanometer module according to a preset installation interval.
3. The electrode flying cutting device according to claim 2, characterized in that, The laser assembly includes a first laser disposed on one side of the gantry and a second and a third laser disposed on the other side of the gantry. The first laser is communicatively connected to the first galvanometer module, the second laser is communicatively connected to the second galvanometer module, and the third laser is communicatively connected to the third galvanometer module.
4. A method for cutting electrode sheets by flight, characterized in that, The electrode flying cutting device as described in any one of claims 1 to 3, wherein the electrode flying cutting device includes a laser assembly, a galvanometer module mechanism, and a transport mechanism; The method includes: A start signal is sent to the laser assembly so that the laser assembly emits multiple laser beams to the galvanometer module mechanism according to the start signal; Based on a preset flight cutting algorithm, the galvanometer module mechanism calculates the laser trajectory corresponding to each laser beam. The transport mechanism is controlled to transport sample electrodes along a preset feeding direction, and the negative feedback signal generated by the transport mechanism is received. Based on the negative feedback signal and the flight cutting algorithm, multiple laser trajectories are derived to obtain multiple laser processing paths; All the laser processing paths are sent to the galvanometer module mechanism so that the galvanometer module mechanism can cut the sample electrode according to the laser processing paths.
5. The electrode flying cutting method according to claim 4, characterized in that, The laser assembly includes a first laser, a second laser, and a third laser; sending a start signal to the laser assembly to cause the laser assembly to emit multiple laser beams to the galvanometer module mechanism according to the start signal includes: The laser processing power, laser processing frequency, and laser processing speed are determined based on the start signal. The start signal is sent to the laser assembly to control the first laser, the second laser, and the third laser to emit the first laser, the second laser, and the third laser to the galvanometer module mechanism according to the laser processing power, the laser processing frequency, and the laser processing speed.
6. The electrode flying cutting method according to claim 5, characterized in that, The galvanometer module mechanism includes a first galvanometer module, a second galvanometer module, and a third galvanometer module; the calculation of the laser trajectory corresponding to each laser beam based on the preset flight cutting algorithm includes: Based on the flight cutting algorithm, the first galvanometer module is controlled to calculate the trajectory corresponding to the first laser to obtain the first trajectory, the second galvanometer module is controlled to calculate the trajectory corresponding to the second laser to obtain the second trajectory, and the third galvanometer module is controlled to calculate the trajectory corresponding to the third laser to obtain the third trajectory.
7. The electrode flying cutting method according to claim 6, characterized in that, The process of deriving multiple laser trajectories based on the negative feedback signal and the flight cutting algorithm yields multiple laser processing paths, including: Based on the negative feedback signal, image generation operations are performed on the first trajectory, the second trajectory, and the third trajectory to generate a path cutting map; The path cutting map is derived according to the flight cutting algorithm to obtain a first laser processing path corresponding to the first trajectory, a second laser processing path corresponding to the second trajectory, and a third laser processing path corresponding to the third trajectory. The first laser processing path and the third laser processing path are mirror images of each other, and the second laser processing path is a straight line.
8. The electrode flying cutting method according to claim 7, characterized in that, Sending all the laser processing paths to the galvanometer module mechanism so that the galvanometer module mechanism can cut the sample electrode according to the laser processing paths includes: All the laser processing paths are sent to the galvanometer module mechanism so that the first galvanometer module cuts the sample electrode along the first laser processing path, the second galvanometer module performs linear cyclic cutting of the sample electrode along the second laser processing path, and the third galvanometer module cuts the sample electrode along the third laser processing path.
9. A computer device, characterized in that, The computer device includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor is used to perform the electrode flying cutting method as described in any one of claims 4 to 8.
10. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program, and when the computer program is executed by the computer, the computer is used to perform the electrode flying cutting method as described in any one of claims 4 to 8.