Wafer support ring processing method

Abstract

The application relates to a wafer support ring processing method, S1, roughing treatment; S2, stress relief treatment; S3, finishing treatment; S4, polishing and inspection. In one aspect, the corresponding processing area can be kept in an exposed state during forward / reverse positioning of the support ring, one-time processing forming is realized, the processing precision is high, and the efficiency is high; in another aspect, the positioning of the support ring is realized through cooperation between the bolts, the positioning seats and the support ring, the support ring is subjected to small stress, the structure is stable and is not prone to deformation, and the product yield is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of precision machining, and particularly relates to a wafer support ring machining method. BACKGROUND

[0002] When one side of a wafer is subjected to electroplating machining, a support ring needs to be arranged to abut against the other side of the wafer to form positioning and support, wherein the support ring comprises a first ring body and a second ring body which are concentric and whose outer diameters gradually decrease along the center line thereof.

[0003] At present, in the machining of the above support ring, the traditional machining steps include: a) material preparation, a support ring blank is obtained by laser cutting a plate material; b) rough machining; c) stress relief treatment; d) finishing treatment (grinding, milling, deburring and polishing, etc.); e) packaging after inspection.

[0004] However, in the actual machining process, the support ring is a thin-walled part, lacks clamping positions, and the traditional clamping method (using clamps such as clamping blocks and pressing plates) is easy to cause deformation of the support ring, affecting the later assembly of the product; moreover, the machining area on the surface of the support ring is easily covered by the clamp, and it is necessary to frequently adjust the clamping position of the clamp on the support ring to ensure that all machining areas of the support ring can be machined, the positioning reference is easy to deviate, resulting in low machining precision, and the operation is complicated and low in efficiency. SUMMARY

[0005] The technical problem to be solved by the present application is to overcome the shortcomings of the prior art and provide a novel wafer support ring machining method.

[0006] To solve the above technical problems, the present application adopts the following technical solutions:

[0007] A wafer support ring machining method, the support ring comprises a first ring body and a second ring body which are concentric and whose outer diameters gradually decrease, and the machining method comprises the following steps:

[0008] S1, rough machining treatment

[0009] The outer circle and the inner hole of the circular ring blank are gradually machined to form the profiles of the first ring body and the second ring body, and a deformation allowance is left;

[0010] S2, stress relief treatment

[0011] The circular ring blank after rough machining is heated to 360-420℃, and after holding for 3-5H, it is air cooled to 35-45℃, and this cycle is repeated at least twice;

[0012] S3, finishing treatment

[0013] a) machining a plurality of connecting holes distributed around the outer periphery of the second ring body on the first ring body, and grinding the end face of the first ring body as a machining reference surface;

[0014] b) placing the ring blank in a forward orientation on a forward positioning seat in the positioning device, wherein the machined reference surface on the first ring body is in contact with the top surface of the forward positioning seat, and the first ring body is fixed to the forward positioning seat by connecting from bottom to top with bolts, and then machining the exposed surface and the inner wall on the first ring body and the second ring body respectively;

[0015] c) placing the ring blank processed in step b) in a reverse orientation on a reverse positioning seat in the positioning device, wherein the second ring body is positioned on the reverse positioning seat as a machining reference from the circumferential direction and the end surface, and the first ring body is supported on the reverse positioning seat, and the first ring body is fixed to the reverse positioning seat by connecting from top to bottom with bolts, and then machining the exposed surface on the first ring body;

[0016] S4, polishing and inspection

[0017] The surface of the support ring after finish machining is polished, and dimensional inspection is performed.

[0018] According to a specific preferred aspect of the present application, in S1, all positions prone to stress on the first ring body and the second ring body are roughened to deform and release stress. Here, the deformation generated during subsequent finish machining is reduced, and the workpiece size is stable.

[0019] According to another specific preferred aspect of the present application, in S3, the positioning device used in steps b) and c) includes a work platform having a first station and a second station, a forward positioning unit and a reverse positioning unit arranged on the first station and the second station respectively, wherein the forward positioning unit includes a forward positioning seat having a plurality of first through holes, a plurality of forward connecting bolts, and an operation area formed between the forward positioning seat and the work platform for hand operation, the support ring is placed horizontally on the top of the forward positioning seat, and the plurality of forward connecting bolts are connected from the operation area upwardly to correspond to each connecting hole and first through hole; the reverse positioning unit includes a reverse positioning seat having a plurality of second through holes, a plurality of reverse connecting bolts, wherein the reverse positioning seat is recessed downwardly from the top surface and forms a positioning groove matched with the second ring body, during reverse positioning, the second ring body is inserted into the positioning groove and is in contact with the inner wall of the positioning groove from the circumferential direction, and is supported on the groove bottom from the bottom, the first ring body is supported on the top of the reverse positioning seat, and the plurality of reverse connecting bolts are connected from top to bottom to correspond to each second through hole and connecting hole.

[0020] Preferably, the forward positioning seat includes a plurality of pads arranged on the work platform, and a seat plate arranged horizontally on the top of the plurality of pads, wherein the seat plate and the work platform form an operation area. Here, the structure is simple and easy to install and implement.

[0021] Further, the operation area is formed with an open mouth around the periphery. In this way, the worker can conveniently put his hand into the operation area from any direction to operate.

[0022] Preferably, the top of each cushion block protrudes to the side of the corresponding side edge of the seat plate; the forward positioning unit further comprises a first pressing component, wherein the first pressing component is pressed on the part of the seat plate protruding from the top of the cushion block. In this way, the seat plate and the workpiece are prevented from being deviated under force during machining.

[0023] Specifically, the first pressing component comprises a support module supported on the workbench, a pressing module arranged on the top of the support module, and an adjusting module connected between the pressing module and the workbench, wherein the pressing module is pressed on the top of the cushion block and corresponds to the side edge of the seat plate from the end. In this way, the stability of the seat plate is increased.

[0024] Further, the first pressing component is at least two and symmetrically arranged on opposite sides of the seat plate.

[0025] Preferably, the reverse positioning unit further comprises a second pressing component for pressing the reverse positioning seat on the workbench, wherein the second pressing component has the same structure as the first pressing component.

[0026] Preferably, the second ring body is distributed with a plurality of convex ribs in the circumferential direction, and the positioning groove is correspondingly formed with a plurality of inwardly recessed avoidance grooves matched with the plurality of convex ribs one by one. In this way, the workpiece is prevented from being deviated under force during machining.

[0027] Preferably, the workbench is formed with a plurality of chip removal grooves.

[0028] Specifically, the plurality of chip removal grooves are distributed in parallel and at intervals, wherein each chip removal groove extends along the arrangement direction of the first station and the second station. In this way, the waste chips are conveniently collected, and the waste chips are prevented from being accumulated on the surface of the workbench to affect machining.

[0029] Due to the implementation of the above technical solutions, the present application has the following advantages compared with the prior art:

[0030] The existing support ring processing method has the defects of easy deformation of the support ring, shielding of the processing area on the support ring, frequent position adjustment, low processing precision and low efficiency. The present application performs roughing and stress relief treatment on the ring blank, and then performs finishing treatment. In the finishing treatment, the end face of the first ring body and the end face and circumference of the second ring body are used as the processing reference for positioning in the forward and reverse directions, and the blank is fixed by bolts to avoid any shielding of the blank, so that all exposed parts of the blank in the two positioning can be processed and formed at one time. Therefore, compared with the prior art, the present application can keep the corresponding processing area completely exposed during forward / reverse positioning of the support ring, realize one-time processing and forming, has high processing precision and high efficiency, and effectively improves the product yield. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a front view schematic diagram of the wafer support ring of the present application;

[0032] Figure 2 It is a front view schematic diagram of the wafer support ring of the present application; Figure 1 It is a sectional view schematic diagram of the present application in A-A direction;

[0033] Figure 3 It is a front view schematic diagram of the positioning device for processing the wafer support ring of the present application;

[0034] Figure 4 It is a front view schematic diagram of the positioning device for processing the wafer support ring of the present application; Figure 3

[0035] Figure 5 It is an enlarged schematic diagram of the structure of the reverse positioning seat in the present application; Figure 4

[0036] Figure 6 It is a sectional view schematic diagram of the present application in B-B direction; Figure 5

[0037] Wherein: H, support ring; H1, first ring body; k0, connecting hole; H2, second ring body; j, protruding rib;

[0038] 1, work platform; w1, first work station; w2, second work station; 10, chip removal groove;

[0039] 2, forward positioning unit; 20, forward positioning seat; 200, pad; 201, seat plate; q, operation area; k1, first through hole; 21, first pressing component; 210, support module; 211, pressing module; 213, adjusting module; 22, forward connecting bolt;

[0040] ​​​3, reverse positioning unit; 30, reverse positioning seat; 300, positioning groove; c, avoiding groove; k2, second through hole; 31, reverse connecting bolt; 32, second pressing part. DETAILED DESCRIPTION

[0041] In order to make the above objectives, characteristics and advantages of the present application more apparent, concrete embodiments of the present application are described in detail below. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the present application. However, the present application can be implemented in many different ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship as the orientation or positional relationship, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0043] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0044] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] In the present application, unless otherwise explicitly specified and limited, a first feature is "on" or "under" a second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature is "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature is "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature. It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or a middle element can exist at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for illustrative purposes and are not the only embodiment.

[0046] As shown in Figures 1 to 4 The wafer support ring H of the present embodiment includes a first ring body H1 and a second ring body H2 which are concentric and have gradually decreasing outer diameters, wherein the first ring body H1 is provided with a plurality of connecting holes k0 which are arranged in an array around the outer periphery of the second ring body H2. The positioning device for processing the wafer support ring of the present embodiment includes a work platform 1 having a first work station w1 and a second work station w2, a forward positioning unit 2 and a reverse positioning unit 3 which are respectively arranged on the first work station w1 and the second work station w2.

[0047] Specifically, the first work station w1 and the second work station w2 are arranged side by side and spaced apart, and a plurality of chip removal grooves 10 are also formed side by side and spaced apart on the work platform 1, wherein each chip removal groove 10 is arranged extending along the left-right direction.

[0048] In the present embodiment, the forward positioning unit 2 includes a forward positioning seat 20 having a plurality of first through holes k1, a first pressing component 21, and a plurality of forward connecting bolts 22. An operation area q is formed between the forward positioning seat 20 and the work platform 1 for hand operation. The support ring H is placed flat on the top of the forward positioning seat 20. The plurality of forward connecting bolts 22 correspondingly connect each connecting hole k0 and first through hole k1 upward from the operation area q.

[0049] Specifically, the forward positioning seat 20 includes four pads 200 arranged on the work platform 1, and a rectangular seat plate 201 horizontally arranged on the top of the four pads 200. An operation area q is formed between the seat plate 201 and the work platform 1, and the four pads 200 are supported at the four corners of the seat plate 201. Therefore, an open opening is formed around the operation area q for the hands of workers to enter and exit.

[0050] For the convenience of implementation, the top of each cushion block 200 protrudes to the side of the corresponding side edge of the seat plate 201, and the first pressing component 21 is pressed on the part of the seat plate 201 protruding from the top of the cushion block 200.

[0051] Specifically, the first pressing component 21 is two and symmetrically arranged on the opposite sides of the seat plate 201, wherein each first pressing component 21 comprises a support module 210 supported on the workbench 1, a pressing module 211 arranged on the top of the support module 210, and an adjusting module 213 connected between the pressing module 211 and the workbench 1, wherein the pressing module 211 is pressed on the top of the corresponding cushion block 200 and abuts on the corresponding side edge of the seat plate 201 from the end; the adjusting module 213 adopts a bolt piece to adjust the pressing force of the pressing module 211 in the up-down direction.

[0052] In this example, the reverse positioning unit 3 comprises a rectangular reverse positioning seat 30 with a plurality of second through holes k2, a plurality of reverse connecting bolts 31, and a second pressing component 32 for pressing the reverse positioning seat 30 on the workbench 1, wherein the reverse positioning seat 30 is recessed downward from the top surface and forms a positioning groove 300 matched with the second ring body H2, when reverse positioning, the second ring body H2 is inserted into the positioning groove 300 and abuts on the inner wall of the positioning groove 300 from the circumferential direction, and is supported on the groove bottom of the positioning groove 300 from the bottom, the first ring body H2 is supported on the top of the reverse positioning seat 30, and the plurality of reverse connecting bolts 31 are correspondingly connected from top to bottom each second through hole k2 and the connecting hole k0.

[0053] Specifically, the circumferential direction of the second ring body H2 forms a plurality of protrusions j, and the inner wall of the positioning groove 300 forms a plurality of avoidance grooves c matched with the plurality of protrusions j one by one, and each protrusion j is correspondingly inserted into each avoidance groove c when reverse positioning.

[0054] In addition, the second pressing component 32 has the same structure as the first pressing component 21, and the second pressing component 32 is two and symmetrically arranged on the opposite sides of the reverse positioning seat 30

[0055] In summary, the machining method of the embodiment comprises the following steps:

[0056] S1, roughing treatment

[0057] The outer circle and the inner hole of the circular ring blank are gradually machined to form the profiles of the first ring body H1 and the second ring body H2, and a margin for deformation is left; at the same time, all positions prone to stress on the first ring body H1 and the second ring body H2 are roughened to deform and release stress

[0058] S2, stress relief treatment

[0059] The roughened ring blank is heated to 360-420 DEG C, and after 3-5H of holding, it is air cooled to 35-45 DEG C, and this cycle is repeated at least twice;

[0060] S3, finishing processing

[0061] a) machining a plurality of connecting holes k0 distributed around the outer periphery of the second ring body H2 on the first ring body H1, and grinding the end face of the first ring body H1 as a machining reference surface;

[0062] b) placing the ring blank in a forward direction on the forward positioning seat 20, wherein the machining reference surface on the first ring body H1 is in contact with the top surface of the forward positioning seat 20, and the first ring body H1 is fixed with the forward positioning seat 20 by connecting the forward connecting bolts 22 from bottom to top, and then machining the exposed surfaces and inner walls on the first ring body H1 and the second ring body H2, respectively;

[0063] c) placing the ring blank processed in step b) in a reverse direction on the reverse positioning seat 30, wherein the second ring body H2 is positioned on the reverse positioning seat 30 as a machining reference surface (i.e. the second ring body H2 is inserted into the positioning groove 300), the first ring body H1 is supported on the reverse positioning seat 30, and the first ring body H1 is fixed with the reverse positioning seat 30 by connecting the reverse connecting bolts 31 from top to bottom, and then machining the exposed surface on the first ring body H1;

[0064] S4, polishing and inspection

[0065] The surface of the finished support ring is polished and dimensionally inspected.

[0066] Therefore, the embodiment has the following technical advantages:

[0067] The existing support ring machining method has the defects of easy deformation of the support ring, shielding of the machining area on the support ring, and frequent adjustment of the position, resulting in low machining precision and low efficiency. The present application performs roughing and stress relief on the ring blank before finishing processing. In the finishing processing, the end face of the first ring body, the end face and the circumference of the second ring body are used as machining reference surfaces by positioning in a forward direction and a reverse direction twice, and the blank is fixed by connecting bolts to avoid any shielding of the blank, so that all exposed parts of the blank in the two positioning processes can be machined and formed at one time. Therefore, compared with the prior art, the present application can keep the corresponding machining area completely exposed during forward / reverse positioning of the support ring, realize one-time machining and forming, has high machining precision and high efficiency, and effectively improves the product yield.

[0068] The above has made the detailed description to the application, its purpose is in order to let the person who is familiar with this field technology can understand the content of the application and implements, and cannot limit the protection scope of the application with this, all according to the spirit of the application of equivalent change or modification, should be covered in the protection scope of the application.

Claims

1. A method of processing a wafer support ring, the support ring comprising a first ring body and a second ring body concentric and having an outer diameter that decreases in steps, characterized in that: The processing method comprises the following steps: S1, roughing treatment Gradually processing the outer circle and inner hole of the circular blank to form the profile of the first ring body and the second ring body, and leaving a margin for deformation; S2, stress relief treatment Heating the circular blank after roughing to 360-420℃, and holding for 3-5H, then air cooling to 35-45℃, and repeating the cycle at least twice; S3, finishing treatment a) Processing a plurality of connecting holes distributed around the outer periphery of the second ring body on the first ring body, and grinding the end face of the first ring body as a processing reference surface; b) Placing the circular blank in the forward direction on the forward positioning seat in the positioning device, wherein the processing reference surface on the first ring body is in contact with the top surface of the forward positioning seat, and the first ring body is fixed with the forward positioning seat by connecting from bottom to top with bolts, and then the exposed surface and the inner wall on the first ring body and the second ring body are processed respectively; c) Placing the circular blank after processing in step b) in the reverse direction on the reverse positioning seat in the positioning device, wherein the second ring body is positioned on the reverse positioning seat as the processing reference and the end face, and the first ring body is supported on the reverse positioning seat, and the first ring body is fixed with the reverse positioning seat by connecting from top to bottom with bolts, and then the exposed surface on the first ring body is processed; The positioning device used comprises a work platform with a first station and a second station, a forward positioning unit and a reverse positioning unit arranged on the first station and the second station respectively, wherein the forward positioning unit comprises a forward positioning seat with a plurality of first through holes, a plurality of forward connecting bolts, and an operation area formed between the forward positioning seat and the work platform for hand operation, the support ring is placed horizontally on the top of the forward positioning seat, and the plurality of forward connecting bolts are connected from the operation area upwardly to correspond to each connecting hole and first through hole; the reverse positioning unit comprises a reverse positioning seat with a plurality of second through holes, a plurality of reverse connecting bolts, wherein the reverse positioning seat is recessed downwardly from the top surface and forms a positioning groove matched with the second ring body, during reverse positioning, the second ring body is inserted into the positioning groove and is in contact with the inner wall of the positioning groove from the periphery, and is supported on the groove bottom from the bottom, the first ring body is supported on the top of the reverse positioning seat, and the plurality of reverse connecting bolts are connected from top to bottom to correspond to each second through hole and connecting hole; S4, polishing and inspection Polishing the surface of the support ring after finishing processing, and performing size inspection.

2. The wafer support ring processing method of claim 1, wherein: In S1, all positions prone to stress on the first ring body and the second ring body are roughened to deform and release stress.

3. The wafer support ring machining method of claim 1, wherein: The forward positioning seat comprises a plurality of pads arranged on the work platform, and a seat plate arranged horizontally on the top of the plurality of pads, wherein the seat plate and the work platform form the operation area; an open mouth is formed around the operation area.

4. The wafer support ring machining method of claim 3, wherein: The top of each of the pads protrudes to a corresponding side of the seat plate; the forward positioning unit further comprises a first pressing component, wherein the first pressing component is pressed on the part of the top of the pad protruding to the seat plate, the first pressing component comprises a supporting module supported on the working platform, a pressing module arranged on the top of the supporting module, and an adjusting module connected between the pressing module and the working platform, wherein the pressing module is pressed on the top of the pad and corresponds to abuts against the side of the seat plate from the end.

5. The wafer support ring machining method of claim 4, wherein: The first pressing component is at least two and symmetrically arranged on opposite sides of the seat plate.

6. The wafer support ring processing method according to claim 4 or 5, characterized by: The reverse positioning unit further comprises a second pressing component for pressing the reverse positioning seat on the working platform, wherein the second pressing component has the same structure as the first pressing component.

7. The wafer support ring machining method of claim 1, wherein: The second ring body is circumferentially distributed with a plurality of convex ribs, and the positioning groove is circumferentially formed with a plurality of inwardly recessed and one-to-one corresponding matching avoidance grooves corresponding to the plurality of convex ribs.

8. The wafer support ring machining method of claim 7, wherein: A plurality of chip removal grooves are formed on the working platform.

9. The wafer support ring machining method of claim 8, wherein: A plurality of the chip removal grooves are distributed side by side and spaced apart, wherein each of the chip removal grooves extends along the arrangement direction of the first station and the second station. A plurality of chip removal grooves are formed on the working platform. A plurality of the chip removal grooves are distributed side by side and spaced apart, wherein each of the chip removal grooves extends along the arrangement direction of the first station and the second station.

Images