Wafer pickup device

Abstract

A wafer pickup device is provided, which comprises a Z-axis moving platform, a pickup shovel, a coaxial laser sensor, a vacuum chuck, a Y-axis moving platform and a PLC system; the pickup shovel is installed on the Z-axis moving platform; the coaxial laser sensor is installed at the end of the pickup shovel; the Y-axis moving platform is used to drive the Z-axis moving platform to move along the Y-axis direction; the vacuum chuck is installed at the end of the pickup shovel and located at the side of the coaxial laser sensor in the Y-axis direction; the PLC system is in communication connection with the Z-axis moving platform, the Y-axis moving platform, the coaxial laser sensor and the vacuum chuck; the PLC system receives and stores the data of the Y-axis position and the Z-axis height of each wafer determined by the coaxial laser sensor; the PLC system determines the pickup position of each wafer based on the Y-axis position, the Z-axis height of each wafer and the position of the vacuum chuck on the pickup shovel; the pickup position is used to pick up the corresponding wafer from the wafer box in the cleaning liquid.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically to a wafer pick-up device. Background Technology

[0002] A wafer is a silicon wafer formed by cutting a silicon ingot.

[0003] After dicing the wafers, the grinding process begins. Grinding reduces saw marks and surface damage on both the front and back sides. It also thins the wafers and helps release stress accumulated during dicing. Following grinding, the wafers undergo etching and cleaning processes, using a cleaning solution of sodium hydroxide, acetic acid, and nitric acid to mitigate damage and cracks caused during grinding. A crucial spin-drying process involves rapidly centrifuging the wafers within a specified time to remove any residual cleaning solution, preventing damage to the wafer surface.

[0004] During cleaning, wafers are supported at intervals along the Y-axis (horizontal axis) within wafer cassettes, with each wafer positioned vertically within the cassette (i.e., both surfaces perpendicular to the circumference should be perpendicular to the Y-axis). The wafer cassettes are open and placed within a cleaning tank filled with cleaning fluid, which immerses multiple wafers. After cleaning, if the pick-up mechanism used in the spin-drying process can accurately retrieve the wafers directly from the wafer cassettes within the cleaning tank, production efficiency will be significantly improved. Summary of the Invention

[0005] In view of the problems existing in the background art, the purpose of this disclosure is to provide a wafer pick-up device that can accurately pick up wafers directly from the wafer cassette in the cleaning tank, thereby greatly improving production efficiency.

[0006] Therefore, a wafer pickup device is provided, comprising a Z-axis moving platform, a pickup shovel, a coaxial laser sensor, a vacuum chuck, a Y-axis moving platform, and a PLC system. The Z-axis moving platform can move up and down along the vertical Z-axis and can be positioned above a cleaning tank. The cleaning tank is used to hold cleaning fluid and accommodate wafer cassettes. Multiple wafers are supported at intervals along the horizontal Y-axis within the wafer cassettes. The thickness direction of each wafer is in the Y-axis direction and they are of equal thickness. The wafer cassettes open upward along the Z-axis to expose a portion of the peripheral surface of the multiple wafers to the coaxial laser sensor. The cleaning fluid is used to immerse the multiple wafers to process multiple wafers. The wafers are cleaned; a pick-up shovel is mounted on a Z-axis moving platform, allowing it to move up and down along the Z-axis as the platform moves. A coaxial laser sensor is mounted at the end of the pick-up shovel. As the shovel moves downwards, the coaxial laser sensor enters the cleaning solution and senses the wafers along the Z-axis to determine their Y-axis position and Z-axis height. During sensing, the emitted and reflected light from the coaxial laser sensor is coaxial along the Z-axis. The distance between the leftmost wafer on the Y-axis and the left wall of the wafer cassette, the spacing between adjacent wafers along the Y-axis, and the distance between the rightmost wafer on the Y-axis and the right wall of the wafer cassette are set. The laser beam is set to a size larger than the emitted light spot of the coaxial laser sensor, and the working distance of the coaxial laser sensor is smaller than the diameter of the wafer. A Y-axis moving platform drives a Z-axis moving platform along the Y-axis, allowing the coaxial laser sensor to sense all the wafers as the Z-axis moving platform moves along the Y-axis, thus completing the scanning and counting of all wafers. A vacuum chuck is mounted at the end of the pick-up shovel and located to the side of the coaxial laser sensor along the Y-axis. The vacuum chuck can move up and down along the Z-axis with the pick-up shovel and the Z-axis moving platform, and is used by the coaxial laser sensor to scan all the wafers. After scanning is completed, each wafer is picked up along the Y-axis upwards to remove it from the cleaning solution. The PLC system is communicatively connected to the Z-axis moving platform, the Y-axis moving platform, the coaxial laser sensor, and the vacuum chuck. The PLC system receives and stores the Y-axis position and Z-axis height data of each wafer determined by the coaxial laser sensor. Based on the Y-axis position, Z-axis height, and the position of the vacuum chuck on the pick-up shovel, the PLC system determines the pick-up position of each wafer. The pick-up position is used for the Z-axis translation of the Z-axis moving platform, the Y-axis translation of the Y-axis moving platform, and the switching operation of the vacuum chuck to pick up the corresponding wafer from the wafer cassette in the cleaning solution.

[0007] The beneficial effects of this disclosure are as follows: In the wafer pick-up device of this disclosure, the Y-axis position and Z-axis height of each wafer in the wafer cassette in the cleaning tank can be determined by the cooperation of the Z-axis moving platform, the coaxial laser sensor, the Y-axis moving platform and the PLC system. Thus, after multiple wafers in the wafer cassette are cleaned, the corresponding wafers can be directly taken out from the wafer cassette in the cleaning tank by the vacuum suction cup on the pick-up shovel set on the Z-axis moving platform, using the determined Y-axis position and Z-axis height of each wafer in the wafer cassette in the cleaning tank, for subsequent spin drying. That is, the wafers are accurately picked up directly from the wafer cassette in the cleaning tank, thereby greatly improving production efficiency. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a wafer pickup device according to the present disclosure.

[0009] Figure 2 yes Figure 1 A magnified view of the circled part.

[0010] The reference numerals in the attached figures are explained as follows:

[0011] 100 wafer pick-up device 71 motor

[0012] 1Z-axis moving platform 711 rotary axis

[0013] 2 Pick-up Shovel 8HMI

[0014] 21-end 9X-axis moving platform

[0015] 22 base terminal 10 drive mechanism

[0016] 3 coaxial laser sensors 200 cleaning tank

[0017] 4 vacuum suction cups, 300 pieces per box

[0018] 5Y-axis moving platform for 400 wafers

[0019] 6PLC system 400a peripheral

[0020] 7. Flipping Mechanism Detailed Implementation

[0021] The accompanying drawings illustrate embodiments of this disclosure, and it will be understood that the disclosed embodiments are merely examples of this disclosure, which can be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but are intended only as the basis for the claims and as an illustrative basis to teach those skilled in the art how to implement this disclosure in various ways.

[0022] Reference Figure 1 and Figure 2The wafer pick-up device 100 includes a Z-axis moving platform 1, a pick-up shovel 2, a coaxial laser sensor 3, a vacuum chuck 4, a Y-axis moving platform 5, and a PLC system 6.

[0023] Z-axis moving platform 1 can move up and down along the vertical Z-axis. Z-axis moving platform 1 can be positioned above cleaning tank 200. Cleaning tank 200 is used to hold cleaning fluid (not shown) and accommodate wafer cassette 300. Multiple wafers 400 are supported at intervals in wafer cassette 300 along the horizontal Y-axis (i.e., the first axis of the horizontal plane). The thickness direction of each wafer 400 is in the Y-axis direction and they are wafers of equal thickness. Wafer cassette 300 opens upward along the Z-axis to expose a portion of the peripheral surface 400a of multiple wafers 400 to coaxial laser sensor 3. Cleaning fluid is used to immerse multiple wafers 400 to clean multiple wafers 400.

[0024] The scoop 2 is mounted on the Z-axis moving platform 1 so that it can move up and down along the Z-axis as the Z-axis moving platform 1 moves up and down.

[0025] A coaxial laser sensor 3 is installed at the end 21 of the pick-up shovel 2. The coaxial laser sensor 3 can move into the cleaning fluid as the pick-up shovel 2 moves downward and sense the wafer 400 in the cleaning fluid along the Z-axis to determine the Y-axis position and Z-axis height of the wafer 400. During sensing, the emitted light and reflected light of the coaxial laser sensor 3 are coaxial along the Z-axis. The distance between the wafer 400 on the leftmost side of the Y-axis and the left wall of the wafer cassette 300, the distance between adjacent wafers 400 along the Y-axis, and the distance between the wafer 400 on the rightmost side of the Y-axis and the right wall of the wafer cassette 300 are set to be greater than the size of the light spot emitted by the coaxial laser sensor 3. The working distance of the coaxial laser sensor 3 is less than the diameter of the wafer 400.

[0026] Y-axis moving platform 5 is used to drive Z-axis moving platform 1 to move along the Y-axis direction, so that coaxial laser sensor 3 moves along the Y-axis direction of Z-axis moving platform 1 driven by Y-axis moving platform 5 to sense all the multiple wafers 400 to complete the scanning and counting of all wafers 400.

[0027] The vacuum chuck 4 is installed at the end 21 of the pick-up shovel 2 and is located to the side of the coaxial laser sensor 3 in the Y-axis direction. The vacuum chuck 4 can move up and down on the Z-axis along with the pick-up shovel 2 and the Z-axis moving platform 1. The vacuum chuck 4 is used to pick up each wafer 400 along the Y-axis to remove it from the cleaning solution after the coaxial laser sensor 3 has finished scanning all the wafers 400.

[0028] The PLC system 6 is communicatively connected to the Z-axis moving platform 1, the Y-axis moving platform 5, the coaxial laser sensor 3, and the vacuum chuck 4. The PLC system 6 receives and stores the Y-axis position and Z-axis height data of each wafer 400 determined by the coaxial laser sensor 3, the Z-axis moving platform 1, and the Y-axis moving platform 5. Based on the Y-axis position and Z-axis height of each wafer 400 and the position of the vacuum chuck 4 on the pick-up shovel 2, the PLC system 6 determines the pick-up position of each wafer 400. The pick-up position is used for the Z-axis translation of the Z-axis moving platform 1, the Y-axis translation of the Y-axis moving platform 5, and the switching operation of the vacuum chuck 4 to pick up the corresponding wafer 400 from the wafer cassette 300 in the cleaning fluid.

[0029] During operation:

[0030] After the wafer cassette 300 is placed in the cleaning tank 200 and cleaning solution is injected into the cleaning tank 200 to immerse multiple wafers 400 (i.e., after the cleaning solution injection is completed),

[0031] The PLC system 6 communicates with the Z-axis moving platform 1, the Y-axis moving platform 5, and the coaxial laser sensor 3, so that the Y-axis moving platform 5 drives the Z-axis moving platform 1, along with the pick-up shovel 2 and the coaxial laser sensor 3, to move along the Y-axis from the starting position to the ending position of the Y-axis. At the same time, the Z-axis moving platform 1 moves downward along the Z-axis so that the coaxial laser sensor 3 at the end 21 of the pick-up shovel 2 enters the cleaning fluid and approaches the peripheral surface 400a of the wafer 400.

[0032] When the coaxial laser sensor 3 approaches the first wafer 400 located near the Y-axis starting point, and the distance from the peripheral surface 400a of the first wafer 400 to the coaxial laser sensor 3 meets the working distance of the coaxial laser sensor 3, the coaxial laser sensor 3 senses the two surfaces of the first wafer 400 in the Y-axis direction based on coaxial emitted and reflected light. Then, based on the Y-axis position of the coaxial laser sensor 3 driven by the Y-axis moving platform 5 and the Z-axis height of the coaxial laser sensor 3 driven by the Z-axis moving platform 1, it determines and counts the Y-axis position and Z-axis height of the wafer 400.

[0033] When the coaxial laser sensor 3 moves completely away from the first wafer 400 along the Y-axis moving platform 5 and is aligned with the gap between the first wafer 400 and the second wafer 400 adjacent to the first wafer 400 along the Z-axis direction, the coaxial laser sensor 3 receives no reflected light.

[0034] When the coaxial laser sensor 3 collects reflected light from the second wafer 400 as the Y-axis moving platform 5 moves, it senses the second wafer 400, and so on, until all the wafers 400 are sensed to complete the scanning and counting of all wafers 400.

[0035] The coaxial laser sensor 3 transmits the Y-axis position and Z-axis height of each wafer 400 to the PLC system 6 in real time for recording and storage. The PLC system 6 determines and stores the pick-up position of each wafer 400 based on the Y-axis position, Z-axis height of each wafer 400 and the position of the vacuum chuck 4 on the pick-up shovel 2.

[0036] After multiple wafers 400 have finished cleaning in the cleaning solution, the PLC system 6 controls the Z-axis translation of the Z-axis moving platform 1, the Y-axis translation of the Y-axis moving platform 5, and the switching operation of the vacuum chuck 4 based on the pick-up position of each wafer, so as to pick up the corresponding wafer 400 from the wafer cassette 300 in the cleaning solution along the Z-axis upward.

[0037] In the wafer pick-up device 100 disclosed herein, the Y-axis position and Z-axis height of each wafer 400 within the wafer cassette 300 in the cleaning tank 200 can be determined through the cooperation of the Z-axis moving platform 1, the coaxial laser sensor 3, the Y-axis moving platform 5, and the PLC system 6. Thus, after multiple wafers 400 within the wafer cassette 300 have been cleaned, the corresponding wafer 400 can be directly removed from the wafer cassette 300 in the cleaning tank 200 using the vacuum suction cup 4 mounted on the pick-up shovel 2 on the Z-axis moving platform 1, based on the determined Y-axis position and Z-axis height of each wafer 400 within the wafer cassette 300 in the cleaning tank 200, for subsequent spin drying. In other words, the wafer 400 is precisely picked up directly from the wafer cassette 300 in the cleaning tank 200, thereby greatly improving production efficiency. Furthermore, the use of the vacuum suction cup 4 enables safe and non-destructive picking up of the wafers 400.

[0038] In the wafer pick-up device 100 disclosed herein, by utilizing the determined Y-axis position and Z-axis height of each wafer 400 within the wafer cassette 300 in the cleaning tank 200, the vacuum suction cup 4 on the pick-up shovel 2 mounted on the Z-axis moving platform 1 can selectively pick up any wafer 400.

[0039] In the wafer pickup device 100 disclosed herein, the coaxial laser sensor 3, which extends into the cleaning fluid, has strong anti-interference ability (i.e., resists the interference of the cleaning fluid on the emitted and reflected light) because the emitted light and reflected light are coaxial. In addition, since the coaxial laser sensor 3 is a close-range sensor, the measurement accuracy is high.

[0040] It should be noted that in the wafer pickup device 100 of this disclosure, when the coaxial laser sensor 3 senses the two surfaces of the wafer 400 in the Y-axis direction based on coaxial emitted and reflected light, the amount of reflected light changes from the gap between the two sides of the wafer 400, to the edge (i.e., the circular edge) where each surface of the wafer 400 intersects with the peripheral surface 400a in the Y-axis direction, and then back to the peripheral surface 400a of the wafer 400. Based on this change, and in conjunction with the Y-axis position of the coaxial laser sensor 3 driven by the Y-axis moving platform 5, the Y-axis position of each surface of the wafer 400 in the Y-axis direction can be determined, thereby determining the Y-axis position of the wafer 400. Furthermore, the working distance of the coaxial laser sensor 3 is less than the diameter of the wafer 400, thereby preventing the bottom surface of the wafer cassette 300 in the Z-axis direction from reflecting the emitted light of the coaxial laser sensor 3.

[0041] The wafer 400 is available in sizes of 4 inches, 6 inches, 8 inches, and 12 inches. Therefore, the wafer pick-up device 100 disclosed herein can scan the wafer cassette 300 containing wafers 400 of different sizes.

[0042] The Z-axis moving platform 1 can adopt any known suitable motion mechanism, such as a cylinder, linear motor, etc.

[0043] like Figure 1 and Figure 2 As shown, the pickup shovel 2 is a straight rod. Using a straight rod makes it easier to determine the position of the vacuum suction cup 4 on the pickup shovel 2.

[0044] The coaxial laser sensor 3 can be any known or commercially available device, such as the Keyence CL-P007, which enables fast, high-precision, and stable scanning.

[0045] The vacuum suction cup 4 can take any suitable form. For example, the vacuum suction cup 4 can be a complete device or a standalone suction head (with an external vacuum device).

[0046] Similarly, the Y-axis moving platform 5 can adopt any known suitable motion mechanism, such as a cylinder, linear motor, etc.

[0047] like Figure 1As shown, the wafer pick-up device 100 may further include a flipping mechanism 7. The flipping mechanism 7 is disposed on the pick-up shovel 2. The flipping mechanism 7 is used to drive the vacuum chuck 4 to rotate around the X-axis direction (i.e., the horizontal second axis) which is perpendicular to the Z-axis and Y-axis directions, so as to flip the vacuum chuck 4 together with the wafer 400 to the horizontal after the vacuum chuck 4 picks up the wafer 400 and removes it from the cleaning fluid, and to cause the vacuum chuck 4 to rotate in the opposite direction to the initial position on the pick-up shovel 2 after the vacuum chuck 4 releases the wafer 400.

[0048] Furthermore, the PLC system 6 is also communicatively connected to the flipping mechanism 7 so that after the vacuum chuck 4 picks up the wafer 400 and removes it from the cleaning solution, it can communicate with the flipping mechanism 7 to cause the flipping mechanism 7 to drive the vacuum chuck 4 and the wafer 400 to flip to a horizontal position, and cause the Y-axis moving platform 5 to drive the Z-axis moving platform 1, together with the pick-up shovel 2 and the flipped wafer 400, to move along the Y-axis to the equipment of the subsequent process (e.g., a spin dryer) to supply the wafer 400, and after the vacuum chuck 4 releases the wafer 400, it can cause the vacuum chuck 4 to rotate in the opposite direction to the initial position on the pick-up shovel 2.

[0049] Specifically, such as Figure 1 and Figure 2 As shown, the flipping mechanism 7 includes a motor 71, which has a rotating shaft 711. The rotating shaft 711 passes horizontally along the X-axis direction through the Z-axis moving platform 1 and the base end 22 of the picking shovel 2 opposite to the end 21 and is fixedly connected to the base end 22 of the picking shovel 2. The dimensions of the picking shovel 2 along the Z-axis direction are set such that when the end 21 enters the cleaning liquid, both the base end 22 and the motor 71 are above the cleaning liquid. The rotating shaft 711 can rotate relative to the Z-axis moving platform 1 around the X-axis direction to drive the picking shovel 2 to rotate relative to the Z-axis moving platform 1 around the X-axis direction.

[0050] like Figure 1 As shown, the wafer pickup device 100 also includes an HMI 8. The HMI 8 is communicatively connected to the system 6 and displays data of the wafers 400 scanned and picked up in real time by the PLC system 6.

[0051] Reference Figure 1 The wafer pick-up device 100 may also include an X-axis moving platform 9. The X-axis moving platform 9 drives the Y-axis moving platform 5 and the Z-axis moving platform 1 to move together along the horizontal X-axis direction perpendicular to the Y-axis, so that the vertical extension line of the pick-up shovel 2 in the Z-axis direction passes through the center of the wafer 400, thereby positioning the pick-up shovel 2 directly above the vertex of the wafer 400. The X-axis moving platform 9 improves the flexibility of placing the cleaning tank 200. If the cleaning tank 200 and the wafer cassette 300 are positioned such that the vertex of the wafer 400 is directly below the pick-up shovel 2, the X-axis moving platform 9 can be omitted.

[0052] To facilitate pickup by vacuum suction cup 2, such as Figure 1 and Figure 2 As shown, the wafer pick-up device 100 may further include a drive mechanism 10. The drive mechanism 10 is communicatively connected to the system 6, and is mounted on the pick-up shovel 2 and connected to the vacuum chuck 4 to drive the vacuum chuck 4 to move up and down in the Z-axis direction. By configuring the drive mechanism 10, the vacuum chuck 4 can be flush with or extend beyond the end of the pick-up shovel 2, thereby bringing the vacuum chuck 4 closer to the wafer 400 and improving the stability and efficiency of the vacuum chuck 4 in picking up the wafer 400.

[0053] Several exemplary embodiments have been described in detail above, but this document is not intended to limit itself to the explicitly disclosed combinations. Therefore, unless otherwise stated, the various features disclosed herein can be combined to form several other combinations, which are not shown for simplicity.

Claims

1. A wafer pickup device, characterized in that, The wafer pick-up device (100) includes a Z-axis moving platform (1), a pick-up shovel (2), a coaxial laser sensor (3), a vacuum chuck (4), a Y-axis moving platform (5), and a PLC system (6); The Z-axis moving platform (1) can move up and down along the vertical Z-axis. The Z-axis moving platform (1) can be positioned above the cleaning tank (200). The cleaning tank (200) is used to hold the cleaning fluid and accommodate the wafer cassette (300). Multiple wafers (400) are supported at intervals in the wafer cassette (300) along the horizontal Y-axis. The thickness direction of each wafer (400) is in the Y-axis direction and is a wafer of equal thickness. The wafer cassette (300) opens upward along the Z-axis to expose a portion of the peripheral surface (400a) of the multiple wafers (400) to the coaxial laser sensor (3). The cleaning fluid is used to immerse the multiple wafers (400) to clean the multiple wafers (400). The picking shovel (2) is mounted on the Z-axis moving platform (1) so that it can move up and down on the Z-axis as the Z-axis moving platform (1) moves up and down; A coaxial laser sensor (3) is installed at the end (21) of the pick-up shovel (2). The coaxial laser sensor (3) can move into the cleaning fluid as the pick-up shovel (2) moves downward and sense the wafer (400) in the cleaning fluid along the Z-axis to determine the Y-axis position and Z-axis height of the wafer (400). During sensing, the emitted light and reflected light of the coaxial laser sensor (3) are coaxial along the Z-axis. The distance between the wafer (400) on the leftmost side of the Y-axis and the left wall of the wafer cassette (300), the distance between adjacent wafers (400) along the Y-axis, and the distance between the wafer (400) on the rightmost side of the Y-axis and the right wall of the wafer cassette (300) are set to be greater than the size of the light spot emitted by the coaxial laser sensor (3). The working distance of the coaxial laser sensor (3) is less than the diameter of the wafer (400). The Y-axis moving platform (5) is used to drive the Z-axis moving platform (1) to move along the Y-axis direction, so that the coaxial laser sensor (3) moves along the Y-axis direction of the Z-axis moving platform (1) driven by the Y-axis moving platform (5) to sense all the multiple wafers (400) to complete the scanning and counting statistics of all wafers (400); The vacuum chuck (4) is installed at the end (21) of the pick-up shovel (2) and is located on the side of the coaxial laser sensor (3) in the Y-axis direction. The vacuum chuck (4) can move up and down on the Z-axis along with the pick-up shovel (2) and the Z-axis moving platform (1). The vacuum chuck (4) is used to pick up each wafer (400) along the Y-axis to remove it from the cleaning solution after the coaxial laser sensor (3) has finished scanning all the wafers (400). The PLC system (6) is connected to the Z-axis moving platform (1), the Y-axis moving platform (5), the coaxial laser sensor (3), and the vacuum chuck (4). The PLC system (6) receives and stores the Y-axis position and Z-axis height data of each wafer (400) determined by the coaxial laser sensor (3). The PLC system (6) determines the pick-up position of each wafer (400) based on the Y-axis position, Z-axis height, and the position of the vacuum chuck (4) on the pick-up shovel (2). The pick-up position is used for the Z-axis translation of the Z-axis moving platform (1), the Y-axis translation of the Y-axis moving platform (5), and the switching operation of the vacuum chuck (4) to pick up the corresponding wafer (400) from the wafer cassette (300) in the cleaning fluid.

2. The wafer pickup device according to claim 1, characterized in that, Wafers (400) are available in 4-inch, 6-inch, 8-inch and 12-inch sizes.

3. The wafer pickup device according to claim 1, characterized in that, The shovel (2) is a straight rod.

4. The wafer pickup device according to claim 1, characterized in that, The coaxial laser sensor (3) is Keyence CL-P007.

5. The wafer pickup device according to claim 1, characterized in that, The wafer pick-up device (100) also includes a flipping mechanism (7), which is disposed on the pick-up shovel (2). The flipping mechanism (7) is used to drive the vacuum chuck (4) to rotate around the X-axis direction, which is perpendicular to the Z-axis and Y-axis directions, so as to drive the vacuum chuck (4) and the wafer (400) to flip to the horizontal after the vacuum chuck (4) picks up the wafer (400) and removes it from the cleaning solution, and to cause the vacuum chuck (4) to rotate in the opposite direction to the initial position on the pick-up shovel (2) after the vacuum chuck (4) releases the wafer (400).

6. The wafer pickup device according to claim 5, characterized in that, The PLC system (6) is also connected to the flipping mechanism (7) to communicate with the flipping mechanism (7) after the vacuum chuck (4) picks up the wafer (400) and removes it from the cleaning solution. This allows the flipping mechanism (7) to flip the vacuum chuck (4) and the wafer (400) to a horizontal position, and to move the Y-axis moving platform (5) along the Z-axis moving platform (1) along with the pick-up shovel (2) and the flipped wafer (400) along the Y-axis to the equipment of the subsequent process to supply the wafer (400). After the vacuum chuck (4) releases the wafer (400), it causes the vacuum chuck (4) to rotate in the opposite direction to the initial position on the pick-up shovel (2).

7. The wafer pickup device according to claim 5, characterized in that, The flipping mechanism (7) includes a motor (71) having a rotating shaft (711) that passes horizontally along the X-axis through the Z-axis moving platform (1) and the base end (22) of the picking shovel (2) opposite to the end (21) and is fixedly connected to the base end (22) of the picking shovel (2). The dimensions of the picking shovel (2) along the Z-axis are set such that when the end (21) enters the cleaning liquid, both the base end (22) and the motor (71) are above the cleaning liquid. The rotating shaft (711) can rotate relative to the Z-axis moving platform (1) about the X-axis to drive the picking shovel (2) to rotate relative to the Z-axis moving platform (1) about the X-axis.

8. The wafer pickup device according to claim 1, characterized in that, The wafer pickup device (100) also includes an HMI (8). The HMI (8) communicates with the system (6) and displays data of the wafer (400) scanned and picked up in real time by the PLC system (6).

9. The wafer pickup device according to claim 1, characterized in that, The wafer pick-up device (100) also includes an X-axis moving platform (9), which is used to drive the Y-axis moving platform (5) and the Z-axis moving platform (1) to move together along the horizontal X-axis direction perpendicular to the Y-axis, so that the vertical extension line of the pick-up shovel (2) in the Z-axis direction passes through the center of the wafer (400), thereby making the pick-up shovel (2) located directly above the vertex of the wafer (400).

10. The wafer pickup device according to claim 1, characterized in that, The wafer pick-up device (100) also includes a drive mechanism (10), which is communicatively connected to the system (6). The drive mechanism (10) is mounted on the pick-up shovel (2) and connected to the vacuum chuck (4) to drive the vacuum chuck (4) to move up and down in the Z-axis direction.

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