Inductive acoustic filters for acoustic equipment

Abstract

The present disclosure relates to inductive acoustic filters for acoustic devices. Various aspects of the subject technology relate to inductive acoustic filters for acoustic devices. The inductive filter can include a substrate, an etched serpentine channel in and within a surface of the substrate extending from a first port in the substrate to a second port in the substrate. The inductive filter can also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter can be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.

Description

Technical Field

[0001] This specification generally relates to acoustic devices including inductive acoustic filters for use in acoustic devices. Background Art

[0002] Electronic devices such as computers, media players, cellular phones, and other electronic equipment often have acoustic components such as microphones. Integrating acoustic components into electronic devices, such as in compact devices including portable electronic devices, can be challenging. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Certain features of the subject technology are set forth in the appended claims. However, for illustrative purposes, several aspects of the subject technology are set forth in the following figures.

[0004] Figure 1 A perspective view of an exemplary electronic device with a microphone is shown in accordance with various aspects of the subject technology.

[0005] Figure 2 A cross-sectional side view of a portion of an electronic device including a vented liquid-resistant microphone adjacent to an opening in a housing of the device is shown in accordance with various aspects of the subject technology.

[0006] Figure 3 A cross-sectional side view of a vented, liquid-resistant microphone module is shown in accordance with various aspects of the subject technology.

[0007] Figure 4 A cross-sectional side view of a vented, liquid-resistant microphone module with a resistive vent is shown in accordance with various aspects of the subject technology.

[0008] Figure 5 Shown is a cross-sectional side view of a portion of another vented, liquid-resistant microphone module having a resistive vent in accordance with various aspects of the subject technology.

[0009] Figure 6 A cross-sectional side view of a vented, liquid-resistant microphone module with an inductive vent is shown in accordance with various aspects of the subject technology.

[0010] Figure 7 Shown is a cross-sectional side view of a portion of another vented, liquid-resistant microphone module having an inductive vent in accordance with various aspects of the subject technology.

[0011] Figure 8 Shown is a cross-sectional side view of another vented liquid-resistant microphone module with an inductive vent in accordance with various aspects of the subject technology.

[0012] Figure 9 Shown is a cross-sectional side view of a portion of a vented, liquid-resistant microphone module having a resistive vent and an inductive vent, in accordance with various aspects of the subject technology.

[0013] Figure 10 A cross-sectional side view of a vented, liquid-resistant microphone module having a resistive vent disposed in a circuit block is shown in accordance with various aspects of the subject technology.

[0014] Figure 11 Shown is a cross-sectional side view of a portion of another vented, liquid-resistant microphone module having a resistive vent and an inductive vent in accordance with various aspects of the subject technology.

[0015] Figure 12 Shown is a cross-sectional side view of a portion of another vented, liquid-resistant microphone module having a resistive vent and an inductive vent in accordance with various aspects of the subject technology.

[0016] Figure 13 Shown is a cross-sectional side view of a portion of another vented, liquid-resistant microphone module having a resistive vent and an inductive vent in accordance with various aspects of the subject technology.

[0017] Figure 14 Shown is a cross-sectional side view of a portion of a vented, liquid-resistant microphone module having an inductive vent and a resistive vent disposed in a circuit block in accordance with various aspects of the subject technology.

[0018] Figure 15 Shown is a cross-sectional side view of a portion of a vented, liquid-resistant microphone module having an inductive vent and an additional vent to a back volume in accordance with various aspects of the subject technology.

[0019] Figure 16 Shown is a cross-sectional side view of a portion of a vented, liquid-resistant microphone module having an inductive vent at least partially disposed in a microphone substrate, in accordance with various aspects of the subject technology.

[0020] Figure 17 Shown is a cross-sectional side view of a resistive vent in accordance with various aspects of the subject technology.

[0021] Figure 18 Aspects of a circuit block including a resistive vent are shown in accordance with various aspects of the subject technology.

[0022] Figure 19 Shown is a simplified cross-sectional side view of an inductive vent having a first port on a first side and a second port on an opposing second side, in accordance with various aspects of the subject technology.

[0023] Figure 20 Shown is a simplified cross-sectional side view of an inductive vent having a first port and a second port on a first side in accordance with various aspects of the subject technology.

[0024] Figure 21 Shown is a simplified cross-sectional side view of an inductive vent having a first port on an edge and a second port on a side, in accordance with various aspects of the subject technology.

[0025] Figure 22 Shown is a cross-sectional top view of an inductive vent having a first port and a second port on one or more sides and a serpentine fluid passage therebetween, in accordance with various aspects of the subject technology.

[0026] Figure 23 Shown is a cross-sectional top view of an inductive vent having a first port on an edge, a second port on a side, and a serpentine fluid passage between the first and second ports in accordance with various aspects of the subject technology.

[0027] Figure 24 Shown is a side view of an inductive vent having a first port on an edge and a second port on a side, and a serpentine fluid passage between the first and second ports, in accordance with various aspects of the subject technology.

[0028] Figure 25 Shown is a cross-sectional side view of an inductive vent in accordance with various aspects of the subject technology.

[0029] Figure 26 A top perspective view of a fluid pathway of an inductive vent is shown in accordance with various aspects of the subject technology.

[0030] Figure 27 Shown is a cross-sectional side view of a microphone substrate including an embedded inductive vent in accordance with various aspects of the subject technology.

[0031] Figure 28 Aspects of a metal layer of a microphone substrate including an embedded inductive vent are shown in accordance with various aspects of the subject technology.

[0032] Figure 29 A flow chart illustrating illustrative operations that may be performed to operate a vented, liquid-resistant microphone in accordance with various aspects of the subject technology. DETAILED DESCRIPTION

[0033] The specific embodiment shown below is intended to be a description of the various configurations of the subject technology and is not intended to represent the only configuration that the subject technology can be put into practice. The accompanying drawings are incorporated herein and constitute a part of the specific embodiment. The specific embodiment includes that specific details are intended to provide a thorough understanding of the subject technology. However, it will be clear and obvious to those skilled in the art that the subject technology is not limited to the specific details shown herein and can be put into practice without these specific details. In some cases, well-known structures and components are shown in block diagram form to avoid making the concept of the subject technology vague.

[0034] Electronic devices such as desktop computers, televisions, set-top boxes, Internet of Things (IoT) devices, and portable electronic devices (including mobile phones, portable music players, smart watches, tablets, smart speakers, remote controls for other electronic devices, headphones, earbuds, and laptop computers) typically include one or more sensors and / or one or more components that respond to air movement and / or acoustic signals (such as sound (e.g., from outside the housing of the device)) to convert signals, such as speakers that move air based on the received signals. As examples, the sensors may include acoustic sensors, pressure sensors, and / or ultrasonic sensors, and the acoustic sensors may include microphones for inputting sound to the device.

[0035] For example, a sensor such as a pressure sensor or an acoustic sensor, or any combination thereof, may be disposed within the housing of the electronic device and configured to receive input from outside the housing, in part due to airflow from outside the housing into the housing at various openings or ports. However, it may also be desirable to prevent liquid from entering the housing of the electronic device and / or entering the sensor module (such as a microphone module, an ultrasonic sensor module, a pressure sensor module, or any combination thereof). In some sensor modules, a porous membrane may be included that allows airflow therethrough to provide liquid resistance to the sensor module. In order to achieve low acoustic losses through the porous membrane, the porous membrane may be thin and compliant, which typically results in the porous membrane being less robust to high ingress pressures caused by deep liquid (e.g., water) immersion (such as immersion at a depth of greater than about six meters).

[0036] According to various aspects of the present invention, a sensor module, such as a microphone module or an ultrasonic sensor module, may be provided with a non-porous membrane that extends over an acoustic port and prevents liquid from entering the sensor module. For example, the non-porous membrane may be positioned so that it forms a boundary between a front volume of the microphone module and an external environment of the microphone module and prevents liquid and air from entering the microphone module. In order to achieve low acoustic losses through the non-porous membrane, the non-porous membrane may be thin and relatively rigid, which may help provide a more robust membrane structure than a porous membrane and may resist large liquid entry pressures caused by immersion in deep liquid (e.g., water) to a depth of up to, for example, one hundred meters. However, while a (e.g., thin and relatively rigid) non-porous membrane may allow sound from the external environment to pass through the membrane to a sound-responsive element of the microphone module, the non-porous membrane may limit or prevent airflow between the front volume and the external environment, which may be detrimental to the function of acoustic components, such as a microphone or ultrasonic sensor.

[0037] For example, to obtain the liquid-proof benefits of a microphone module having a non-porous membrane above the acoustic port while maintaining microphone functionality, the microphone module may be provided with a leak port to allow airflow into and out of a front volume sealed from the external environment by the non-porous membrane.

[0038] In one or more embodiments, an opening may be provided in the substrate of a sensor module (such as a microphone module having a non-porous membrane). The opening may extend from a sealed volume on a first side of the substrate and fluidically coupled to a front volume and sealed by the non-porous membrane to another environment outside the microphone module, such as the external environment on an opposite second side of the substrate. In one or more embodiments, a sensor module having a non-porous membrane and a drain port may be implemented in an electronic device such as a smartphone, a smartwatch, or a tablet device, which has a housing defining an interior volume in which the microphone module is disposed. In one or more embodiments, a drain port passing through the substrate of the microphone module may fluidically couple the sealed volume on the first side of the substrate to the interior volume of the electronic device, which is fluidically coupled to the front volume and sealed by the non-porous membrane. In this way, the interior volume of the electronic device may act as an air reservoir for venting air from the front volume of the microphone module. In one or more embodiments, a resistive vent or resistive filter and / or an inductive vent or inductive filter may be provided above the drain port to prevent sound from within the interior cavity from reaching the sound-responsive element of the microphone.

[0039] Figure 1 An exemplary electronic device including a sensor module such as a microphone module is shown in FIG. Figure 1 In the example of FIG, the electronic device 100 has been implemented using a housing 106 that is small enough to be portable and carried or worn by a user (e.g., Figure 1The electronic device 100 may be a handheld electronic device such as a tablet computer or a cellular phone or a smart phone, or a wearable device such as a smart watch, headphones or earbuds). Figure 1 In the example of FIG1 , the electronic device 100 includes a display such as a display 110 mounted on a front surface of a housing 106. The electronic device 100 includes one or more input / output devices (such as a touch screen incorporated into the display 110), virtual or mechanical buttons or switches, and / or other input / output components disposed on or behind the display 110 or on or behind other portions of the housing 106. The display 110 and / or the housing 106 may form a housing within which components of the electronic device 100 (e.g., one or more processors, volatile or non-volatile memory, a battery, one or more integrated circuits, one or more speakers, or other components) are disposed. The display 110 and / or the housing 106 may include one or more openings to accommodate buttons, switches, speakers, light sources, sensors such as microphones, and / or cameras (as examples).

[0040] exist Figure 1 In the example of FIG. 1 , the housing 106 includes an opening 108 in the housing 106. In this example, the opening 108 forms a port for a sensor (e.g., a microphone) that receives acoustic input (such as sound from the external environment outside the housing 106). For example, the opening 108 may form a sensor port for a sensor module disposed within the housing 106, such as a microphone port for a microphone module disposed within the housing 106 and / or an ultrasound sensor port for an ultrasound sensor disposed within the housing 106. One or more additional openings in the housing 106 and / or display 110 (although in Figure 1 , (not explicitly shown) may form a speaker port for a speaker disposed within the housing 106.

[0041] The opening 108 may be an open port or may be completely or partially covered with a breathable membrane and / or mesh structure that allows air and sound to pass through the opening. Figure 1 One opening 108 is shown in FIG, but this is merely exemplary. One opening 108, two openings 108, or more than two openings 108 may be provided on the top edge and / or bottom edge of the housing 106, and / or one or more openings may be formed on a side wall (e.g., a left side wall or a right side wall). Figure 1 106 , one or more additional openings for acoustic components and / or sensors can be formed on the rear surface of the housing 106 and / or on the front surface of the housing 106 or the display 110. In some implementations, one or more sets of openings 108 in the housing 106 can align with acoustic ports of acoustic components and / or sensors within the housing 106.

[0042] Housing 106, sometimes referred to as a casing, can be formed from plastic, glass, ceramic, fiber composite materials, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials. In one example, housing 106 can be formed from a metal perimeter portion and / or a metal or glass back panel mounted to the metal perimeter portion, the metal perimeter portion extending around the perimeter of electronic device 100 (e.g., continuously or in pieces) to form a top edge, a bottom edge, and sidewalls extending therebetween. In this example, the casing can be formed from the metal perimeter portion, the back panel, and the display 110, and device circuitry such as a battery, one or more processors, memory, an application-specific integrated circuit, sensors, antennas, acoustic components, etc., can be housed within the casing.

[0043] However, it should be understood that Figure 1 The configuration of the electronic device 100 is merely illustrative. In other specific implementations, the electronic device 100 may be a computer (e.g., a smartwatch, a pendant device, or other wearable or miniature device), a media player, a gaming device, a navigation device, a computer monitor, a television, a headset, or a slightly larger device (e.g., a computer integrated into a display such as a computer monitor, a laptop computer, or other electronic equipment).

[0044] For example, in some implementations, the housing 106 can be formed using a unitary configuration in which some or all of the housing 106 is machined or molded into a single structure, or the housing can be formed using multiple structures (e.g., an internal frame structure, one or more structures forming an exterior housing surface, etc.). Figure 1 The housing 106 is shown as a single structure, but the housing 106 can have multiple parts. For example, in other implementations, the housing 106 can have an upper portion and a lower portion, with the lower portion coupled to the upper portion using a hinge that allows the upper portion to rotate relative to the lower portion about a rotation axis. In some implementations, a keyboard such as a QWERTY keyboard and a touchpad can be mounted in the lower housing portion.

[0045] In some embodiments, the electronic device 100 can be provided in the form of a wearable device such as a smart watch. For example, in some embodiments, the housing 106 can include one or more interfaces for mechanically coupling the housing 106 to a strap or other structure for securing the housing 106 to the wearer. In some embodiments, the electronic device 100 can be a mechanical or other non-electronic device, wherein the microphone can be mounted within the housing, such as a pen or a support structure such as a monitor stand for a computer monitor. In any of these exemplary embodiments, the housing 106 includes an opening 108 associated with the microphone module. In some embodiments, the electronic device 100 can be provided in the form of a computer integrated into a computer monitor and / or other display (such as a television). The display 110 can be mounted on the front surface of the housing 106, and optionally a bracket can be provided to support the housing 106 (for example, on a desktop computer) and / or the housing 106 can be mounted on a surface such as a wall.

[0046] The sensor module disposed within the housing 106 receives sound through at least one associated opening 108 . Figure 2 A cross-sectional view of a portion of the electronic device 100 in which a sensor module is installed is shown. For illustrative purposes, the sensor module is described herein as being implemented as a microphone module 202. However, it should be understood that the microphone module 202 can operate as another type of sensor module (e.g., an ultrasonic sensor module) by providing a sound-responsive element that responds to acoustic signals having a frequency greater than 20 kHz.

[0047] exist Figure 2 In the example of FIG. 1 , the electronic device 100 includes a sensor module implemented as a microphone module 202 mounted within the housing 106, the microphone module being adjacent to and aligned with the opening 108 in the housing 106. In this example, the microphone module 202 is mounted to an interior surface 221 of the housing 106, such as on a surface formed by the housing 106 and the housing 106. Figure 1 The display 110 is formed within the housing.

[0048] As shown, the microphone module 202 may include a substrate 204 (e.g., a printed circuit board (PCB) substrate, such as a multi-layer PCB) attached to an interior surface 221, such as by an adhesive 212. The adhesive 212 may be, for example, a sealing pressure sensitive adhesive (PSA) or another adhesive or attachment mechanism that attaches the substrate 204 to the interior surface 221 such that the mounting interface is sealed to prevent moisture or other contaminants from entering the housing 106 via a path between the substrate 204 and the interior surface 221. Figure 2In the example shown, an opening 215 (e.g., a first opening) in substrate 204 is aligned with opening 108 in housing 106 to allow sound to pass from an environment 219 external to housing 106 to a sensor assembly 218 mounted on substrate 204. In this manner, sensor assembly 218 is in fluid and acoustic communication with opening 215 in substrate 204 (and in acoustic communication with opening 108 in housing 106). Sensor assembly 218 may include, for example, a microelectromechanical system (MEMS) microphone assembly having a movable or flexible membrane that, when moved or flexed by incoming sound, causes the MEMS microphone to generate an electrical signal corresponding to the incoming sound. As another example, sensor assembly 218 may include a movable or flexible diaphragm attached to a voice coil, wherein current is generated in the voice coil when the diaphragm moves and / or flexes. As discussed in further detail below, sensor assembly 218 may include additional microphone circuitry coupled to substrate 204.

[0049] like Figure 2 As shown, the sensor assembly 218 of the microphone module 202 is disposed beneath a cover 208 (sometimes referred to as a lid, cover, or shield), which is mounted on the substrate 204 above the sensor assembly 218. In this configuration, a cavity formed between the sensor assembly 218 and the cover 208 defines a back volume 210 for the sensor assembly 218.

[0050] like Figure 2 As shown, the microphone module 202 may include a non-porous membrane 216. As shown, the non-porous membrane 216 may span the opening 215 in the substrate and may fluidly separate the sealed volume within the microphone module from an environment 219 outside the housing 106 (e.g., on the first side of the substrate 204). For example, the non-porous membrane 216 may prevent air and fluid from flowing through the membrane and still function as a low-loss acoustic membrane. Figure 2 In the example of FIG, a non-porous membrane 216 is mounted within a recess 214 in the substrate 204. As discussed in further detail below, the non-porous membrane 216 can seal the front volume of the microphone module from an environment 219 outside the housing 106. In this way, a liquid-proof microphone module can be provided.

[0051] For example, to provide venting for a liquid-resistant microphone module having a non-porous membrane 216 that seals the front volume of the microphone from the environment 219, an opening 209 (e.g., a second opening) can be provided in the substrate 204. The opening 209 can provide a drain port from the front volume of the microphone module 202 to another environment outside the microphone module, such as the interior volume 222 of the electronic device 100. Figure 2As shown, an interior volume 222 within the electronic device 100 in which the microphone module 202 is implemented can be separated from the rear volume 210 by the cover 208. In this way, the interior volume 222 can be sealed from the rear volume 210 and can serve as an air reservoir for the microphone module 202.

[0052] According to various implementations described herein, microphone module 202 may also include various arrangements of resistive and / or inductive acoustic vents and / or filters over opening 209 in substrate 204 to allow air to flow through opening 209 while preventing sound from leaking through opening 209 (e.g., from interior volume 222) to sensor assembly 218. In one or more implementations, an additional leakage path from the front volume to the rear volume 210 may also be provided through substrate 204.

[0053] In one or more implementations described in further detail below, a resistive vent can be provided at the opening 209 in the substrate 204. In one or more implementations described in further detail below, an inductive vent can be provided at the opening 209 in the substrate 204. The inductive vent can include a first port coupled to the front volume of the microphone module 202, a second port coupled to the opening 209 in the substrate 204, and a fluid pathway, such as a serpentine fluid pathway from the first port to the second port. Various implementations and arrangements of inductive and resistive vents are also disclosed herein.

[0054] Figure 3 A cross-sectional side view of the microphone module 202 in an exemplary implementation is shown. Figure 3 In the example of , the microphone module 202 includes a substrate 204 having a side 311 (e.g., a first side) and a side 313 (e.g., an opposite second side) opposite the first side. As shown, a cover 208 can be mounted to the side 311 of the substrate 204 and can at least partially define (e.g., together with a portion of the substrate 204 and a portion of the sensor circuit) a back volume 210 of the microphone module 202. For example, the cover 208 can be attached to a surface on the side 311 of the substrate 204 using a conductive adhesive 302 (such as a solder material). In one or more specific implementations, the solder material can also fluidly seal the back volume 210 from an environment outside the cover (such as the interior volume 222 of the electronic device 100). Figure 3 , it can be seen that the front volume 300 is separated from the rear volume 210 by the sound responsive element 316. As shown, the front volume 300 is fluidly coupled to the opening 215 in the base plate 204.

[0055] exist Figure 3In the example of FIG, the non-porous membrane 216 is attached to the side 313 of the substrate within the recess 214 in the substrate and substantially spans the recess 214. In various implementations, the non-porous membrane 216 can be formed of a polytetrafluoroethylene (PTFE) membrane (such as a non-expanded PTFE membrane) or a polyimide membrane. In various implementations, the non-porous membrane can have a thickness, for example, between one and twenty microns.

[0056] like Figure 3 As shown, the non-porous membrane 216 defines a sealed volume 301 that is fluidically coupled to the front volume 300 via the opening 215. In this configuration, the non-porous membrane 216 provides a liquid-tight seal between the front volume 300 and a first environment external to the microphone module 202 on the side 313 of the substrate 204 (e.g., in one or more embodiments, an environment 219 external to the electronic device 100). As shown, the opening 209 in the substrate 204 can extend from the sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to a second environment external to the microphone module on the side 311 of the substrate 204 (e.g., in one or more embodiments, a second environment formed by or including the interior volume 222 of the electronic device 100). In this manner, the opening 209 allows airflow 333 (e.g., due to movement of the sound-responsive element 316) through the opening 209 between the sealed volume 301 and the environment external to the microphone module on the side 311 of the substrate 204.

[0057] exist Figure 3 In the example of FIG. 2 , the microphone module 202 includes a sound responsive element 316. In various implementations, the sound responsive element can be a movable diaphragm or an actuatable MEMS structure. The sound responsive element 316 can move and / or vibrate in response to sound passing through the non-porous membrane 216. The movement of the sound responsive element 316 can cause an electrical response that is transmitted to a microphone circuit, such as an integrated circuit 318 (e.g., an application specific integrated circuit) that is also disposed below the cover 208 and within the rear volume 210, for processing the microphone signal generated by the sound responsive element 316. For example, the sound responsive element 316 and the integrated circuit 318 can form a Figure 2 All or part of sensor assembly 218. Microphone signals generated by acoustically responsive element 316 and / or processed by integrated circuit 318 may be passed (e.g., via conductive structures comprising metal layers in substrate 204) to one or more conductive contacts on substrate 204 (e.g., conductive contacts 304 and / or conductive contacts 306 on side 313 of the substrate and / or one or more conductive contacts (e.g., conductive contacts 312) on side 311 of the substrate) for output to other devices and / or components (e.g., via connectors attached to one or more of the conductive contacts, such as a flexible printed circuit).

[0058] In one or more implementations, the microphone module 202 may further include a circuit block 308. For example, the circuit block 308 may be coupled to conductive contacts 312 on a side 311 of the substrate 204 and may include one or more conductive vias 310 extending vertically away from the substrate 204 to one or more conductive contacts (e.g., conductive contacts 314 on the top surface of the circuit block 308). In various implementations, the microphone module may be provided with Figure 3 306. Figure 3 Any or all of the conductive contacts may be electrically coupled to device circuitry (e.g., volatile and / or nonvolatile memory, one or more processors, etc.) of the electronic device 100 via a connector (such as a flexible printed circuit attached to one or more of the conductive contacts).

[0059] Figure 4 An example of a microphone module 202 is shown in which a resistive vent 400 (also referred to herein as a resistive filter) is disposed over the opening 209 on the side 311 of the substrate 204. For example, Figure 4 The resistive vent 400 includes a porous membrane that spans over the opening 209 and allows airflow through it while preventing sound from passing through it. In this example, the resistive vent 400 is attached to the substrate 204 on side 311. Figure 4 As shown, resistive vent 400 spans over opening 209, and airflow 333 can flow (e.g., due to movement of acoustically responsive element 316) between sealed volume 301 and the environment external to the microphone module on side 311 of substrate 204 (e.g., interior volume 222 of electronic device 100 in one or more implementations) through opening 209 and through resistive vent 400. Figure 4 In the example of FIG, the resistive vent 400 is provided on the side 311 of the substrate. Figure 5 As shown, in one or more implementations, the resistive vent 400 can be disposed over the opening 209 on the side 313 of the substrate 204 (eg, attached to a surface of the substrate 204 on the side 313 ).

[0060] exist Figure 4 and Figure 5In the example of , the resistive vent 400 is disposed above the opening 209. In one or more specific implementations, the microphone module 202 may also (or alternatively) include an inductive vent (sometimes referred to as an inductive filter) above the opening 209. As an example, Figure 6 shows an implementation in which the microphone module 202 includes an inductive vent 600 over the opening 209 on the side 311 of the substrate 204, and Figure 7 An implementation is shown in which the microphone module 202 includes an inductive vent 600 over the opening 209 on the side 313 of the substrate 204. Figure 6 and Figure 7 In the example of FIG, inductive vent 600 is attached to a surface of substrate 204 (e.g., on sides 311 and 313, respectively) and covers opening 209. As discussed in further detail below, inductive vent 600 may include a channel within the substrate having a length that is substantially greater than the width of the channel, such that inductive vent 600 acts as a low-pass acoustic filter.

[0061] like Figure 4 and Figure 5 As shown, airflow 333 may be directed through the resistive vent 400 (e.g., through the porous membrane of the resistive vent). Figure 6 and Figure 7 As shown, in an embodiment in which an inductive vent 600 is provided, the airflow 333 may include a portion that travels laterally through the inductive vent 600 in a direction generally parallel to the surface of the substrate 204 (e.g., through a serpentine fluid passage or channel in the inductive vent, as described in further detail below) for at least a portion of the passage.

[0062] In these examples, the non-porous membrane is mounted to side 313 of substrate 204 (e.g., at Figure 7 313 and laterally outward from the inductive vent 600). In one or more other implementations, the microphone module 202 can include the inductive vent 600 over the opening 209 on the side 313 of the substrate 204, and the non-porous membrane 216 can be mounted to the inductive vent 600.

[0063] For example, Figure 8 An implementation is shown in which the inductive vent 600 substantially spans the groove 214 in the substrate 204 and the non-porous membrane 216 is attached to the inductive vent 600 (eg, to the substrate 204 via the inductive vent 600 ). Figure 8A more extensive implementation of the inductive vent 600 can allow for a relatively longer internal fluid path to extend between a first port coupled to the front volume 300 and a second port coupled to the opening 209. As shown, the inductive vent 600 can include an opening 800 aligned with the opening 215 in the substrate 204 to allow sound to pass through the opening 215 and the opening 800 to the sound-responsive element 316. In one or more implementations, the inductive vent 600 includes a fluid path, such as a serpentine fluid path. In one or more implementations, the fluid path in the inductive vent 600 can include a first portion formed on a first side of the opening 215 and a second portion formed on a second side of the opening 215. In one or more implementations, the fluid path can extend around the opening 800. For example, in a serpentine fluid pathway, two or more segments of the serpentine fluid pathway may be separated by a distance wider than the width of the opening 800, or one or more segments of the serpentine fluid pathway may include a curve or bend that passes around the opening 800 without being fluidly coupled to the opening 800. In one or more implementations, a port or segment of the serpentine fluid pathway may be fluidly coupled to the opening 800.

[0064] like Figure 8 As shown, in one or more implementations, the inductive vent 600 can be formed by a substrate 802 and a cover layer. For example, the substrate 802 can be a patterned substrate in which an etched channel partially defines a fluid passage, such as a serpentine fluid passage. For example, the etched channel can define two opposing sidewalls and a bottom wall extending between the two opposing sidewalls, and the substrate 802 (e.g., before being attached to the substrate 204) can define an open channel without a top wall. Figure 8 As shown, adhesive layer 804 may attach substrate 802 of inductive vent 600 to substrate 204 of microphone module 202. In this manner, substrate 204 and / or adhesive layer 804 may form a covering layer for inductive vent 600. In one or more embodiments, adhesive layer 804 may cover the fluid pathway and (e.g., in combination with substrate 204) define walls, such as the top wall of the fluid pathway formed by the etched pattern in substrate 802. Adhesive layer 804 may be formed from, for example, a heat activated film, a pressure sensitive adhesive, a curable liquid adhesive, or another adhesive material. In one or more other embodiments described herein, the covering layer forming the top wall of the etched pattern in the substrate of the inductive vent may include or be bonded by a polymer layer, such as a polyimide tape adhesively attached to the substrate of the inductive vent. As Figure 8 As shown, adhesive layer 804 can adhesively attach substrate 204 to side 313 of substrate 204 within recess 214. In this example, non-porous membrane 216 is attached to substrate 204 of inductive vent 600.

[0065] exist Figure 8 In the example shown, the inductive vent 600 is disposed on the side 313 of the substrate 204, and the microphone module 202 is not provided with a resistive vent. However, in one or more other implementations, the microphone module 202 may include the inductive vent 600 disposed on the side 313 of the substrate 204 and a resistive vent above the opening 209.

[0066] For example, Figure 9 An exemplary implementation of microphone module 202 is shown, wherein microphone module 202 includes an inductive vent 600 disposed over opening 209 on side 313 of substrate 204 and a resistive vent 400 disposed over opening 209 on side 311 of substrate 204. In this example, airflow 333 passes directly through resistive vent 400, through opening 209, and laterally through inductive vent 600 in a direction generally parallel to the surface of substrate 204. In this example, non-porous membrane 216 is attached to inductive vent 600.

[0067] Figure 10 Another example embodiment is shown in which the microphone module 202 includes a resistive vent over the opening 209 on the side 311 of the substrate 204. Figure 10 In the example of FIG. 1 , a circuit block 1000 (e.g., an input / output (I / O) block) is disposed over an opening 209 on a side 311 of a substrate 204. In this example, the circuit block 1000 includes a conductive path 1002 extending from a conductive contact 312 to a conductive contact 1004 on a top surface of the circuit block 1000. In this example, the circuit block 1000 also forms a resistive vent over the opening 209. In this example, the resistive vent is disposed in the circuit block. For example, the resistive vent can be formed by a membrane 1006 (e.g., a porous membrane) extending across a central opening 1008 in the circuit block 1000.

[0068] exist Figure 10 In the example of FIG. 3 , circuit block 1000 is disposed on side 311 of the substrate, and microphone module 202 may not be provided with inductive vent 600, or may include inductive vent 600 above opening 209 on side 313 of substrate 204 (e.g., as shown in FIG. 3 ). Figure 7 Inductive vent as shown or as Figure 8 For example, in one or more implementations, microphone module 202 can include circuit block 1000 including a resistive vent mounted above opening 209 on side 313 of substrate 204 and inductive vent 600 mounted above opening 209 on side 313 of substrate 204. Figure 10In the example of FIG. 2 , the microphone module 202 may be provided with the circuit block 1000 above the opening 209 and may not have the circuit block 308 (see, for example, FIG. 2 ). Figure 3 ), or may include both circuit block 1000 above opening 209 and circuit block 308 on side 311 of substrate 204. For example, in an implementation in which microphone module 202 includes both circuit block 1000 above opening 209 and circuit block 308 on side 311 of substrate 204, circuit block 1000 may be used to route electrical signals from the microphone circuit to conductive contacts 1004 on top of circuit block 1000 (e.g., for transmission to other device circuitry (such as a processor) via an interface (such as a flexible printed circuit)), and circuit block 308 may provide an additional input / output (I / O) block for embedding a functional silicon die (e.g., to provide RF filtering or other processing for microphone signals from microphone module 202).

[0069] Return Reference Figure 9 In an example, microphone module 202 includes inductive vent 600 disposed over opening 209 on side 313 of substrate 204, resistive vent 400 over opening 209 on side 311 of substrate 204, and non-porous membrane 216 attached to inductive vent 600 (e.g., to substrate 802 of inductive vent 600). In another example, Figure 11 A specific implementation is shown in which the microphone module 202 includes an inductive vent 600 positioned above the opening 209 on the side 313 of the substrate 204, a resistive vent 400 above the opening 209 on the side 311 of the substrate 204, and a non-porous membrane 216 is directly attached to the substrate 204 (e.g., laterally outward from where the inductive vent 600 is attached to the substrate 204).

[0070] exist Figure 11 In the example of , resistive vent 400 is disposed on side 311 of substrate 204 (e.g., disposed within an environment on that side of substrate 204, such as within interior volume 222 of electronic device 100), and inductive vent 600 is disposed on side 313 of substrate 204 (e.g., disposed within sealed volume 301). Figure 9 and Figure 11 In the example of , microphone module 202 includes resistive vent 400 over opening 209 on side 311 of substrate 204 and inductive vent 600 over opening 209 on side 313 of substrate 204. Figure 9 and Figure 11In the example, a ventilation path (e.g., an air pressure equalization path) through the inductive vent 600 and the resistive vent 400 is shown by airflow 333, which flows between the front volume 300, through the channel in the inductive vent 600, and through the porous membrane in the resistive vent 400 to the environment external to the microphone module on the side 311 of the substrate (e.g., an air reservoir formed by the internal volume 222 within the housing 106 of the electronic device 100).

[0071] Figure 12 Another specific implementation of the microphone module 202 is shown in which the resistive vent 400 is disposed above the opening 209 on the side 313 of the substrate 204 (e.g., disposed within the sealed volume 301) and the inductive vent 600 is disposed above the opening 209 on the side 311 of the substrate 204 (e.g., disposed within an environment external to the microphone module on the side 311 of the substrate, such as within the interior volume 222 within the housing 106 of the electronic device 100). Figure 12 In the example of FIG. 4 , microphone module 202 includes inductive vent 600 over opening 209 on side 311 of substrate 204 and resistive vent 400 over opening 209 on side 313 of substrate 204 .

[0072] In various examples described herein, the resistive vent 400 is disposed on one side of the substrate 204 and the inductive vent 600 is disposed on the opposite side of the substrate 204. In one or more other implementations, the inductive vent and the resistive vent may be formed on the same side of the substrate 204. For example, Figure 13A specific implementation is shown in which the inductive vent 600 is attached to the substrate 204 on side 311 of the substrate 204 and the resistive vent 400 is attached to the inductive vent 600 (e.g., on a side of the inductive vent opposite the side of the inductive vent 600 attached to the substrate 204). As shown, in this arrangement, airflow 333 can flow between the sealed volume 301 on side 313 of the substrate 204 and the environment on side 311 of the substrate (e.g., the interior volume 222 of the electronic device 100) via the opening 209, via a first port on the bottom of the inductive vent 600 adjacent to the opening 209, a fluid channel within the inductive vent 600 (e.g., including a portion extending in a direction parallel to the surface of the substrate 204), a port on the top surface of the inductive vent 600, and the resistive vent 400. In this arrangement, the inductive vent 600 may be adhesively attached to the substrate 204, and the resistive vent 400 may be (e.g., adhesively) attached to the inductive vent 600. In this arrangement, the inductive vent 600 may have a first port on a first side and fluidly coupled to the opening 209, and a second port on an opposing second side and fluidly coupled to the resistive vent 400. Figure 13 In the example of , microphone module 202 includes an inductive vent 600 mounted over opening 209 on side 313 of substrate 204 , and a resistive vent 400 mounted over inductive vent 600 .

[0073] Figure 14 Another implementation is shown where the inductive vent and the resistive vent are formed on the same side of the substrate 204. Figure 14 In the example of FIG, the microphone module 202 includes a circuit block 1000 having a central opening 1008 and a membrane 1006 on the side 311 of the substrate, and also includes an inductive vent 600 disposed above the opening 209 on the side 311 of the substrate. In this example, the inductive vent 600 is disposed within the central opening 1008 in the circuit block 1000. Figure 14 In the example, the microphone module 202 includes a circuit block 1000 mounted above an opening 209 on a side 311 of a substrate 204, a resistive vent across an opening in the circuit block (e.g., a center opening 1008), and an inductive vent 600 mounted above the opening 209 on a side 311 of the substrate 204 and within the opening in the circuit block 1000.

[0074] In this article combined Figures 2 to 14In various examples described, the microphone module 202 includes an opening 215 (e.g., a first opening) that can be an acoustic port for the microphone module, and an opening 209 (e.g., a second opening) that provides a drain port from the front volume 300 to the environment on the side 311 of the substrate 204 (e.g., the interior volume 222 of the electronic device 100 that is outside and fluidically separated from the rear volume 210 of the microphone module). In one or more implementations, the microphone module can include another drain port located between the front volume 300 and the rear volume 210. The other drain port can be formed by another opening (e.g., a third opening) in the substrate 204, such as generally between the opening 215 and the opening 209.

[0075] For example, Figure 15 An implementation is shown in which the microphone module 202 includes an inductive vent 600 mounted above the opening 209 on the side 313 of the substrate 204 and an opening 1500 (eg, a third opening) in the substrate 204. Figure 15 In the example of , the inductive vent 600 further includes an opening 1502. As shown, the opening 1502 in the inductive vent 600 can be aligned with the opening 1500 in the substrate 204 to fluidically couple the front volume 300 with the rear volume 210. In one or more specific implementations, the opening 1502 extends through the inductive vent 600, and the inductive filter further includes a fluid passage (e.g., a serpentine fluid passage) therein that extends around the opening 1502 without being fluidically coupled to the opening 1502. In this manner, the substrate 204 can include the opening 209 covered by the inductive vent 600 and the opening 1502 uncovered. As shown in FIG. Figure 15 As shown, the microphone module 202 may include an air flow path 1501 that includes a portion flowing directly between the sealed volume 301 and the rear volume 210 (e.g., to provide another drain port between the front volume 300 and the rear volume 210 to achieve a linear frequency response of the microphone module), and a portion flowing within the inductive vent 600 (e.g., within a serpentine fluid path extending around the opening 215 and the opening 1502) and between the sealed volume 301 and the environment on the side 311 of the substrate via the opening 209.

[0076] exist Figure 15 In the specific implementation shown in , the microphone module 202 having the opening 1500 in the substrate 204 and the opening 1502 in the inductive vent 600 may not have a resistive vent disposed above the opening 209, or may include the resistive vent 400, the circuit block 1000 including the resistive vent, and / or the circuit block 308, as described herein in conjunction with Figure 3 、 Figure 4 、 Figure 5 、 Figure 8、 Figure 9 、 Figure 10 and / or Figure 11 . For example, in one or more implementations, microphone module 202 having opening 1500 in substrate 204 and opening 1502 in inductive vent 600 may include resistive vent 400 above opening 209 on side 311 of substrate 204. As another example, in one or more implementations, microphone module 202 having opening 1500 in substrate 204 and opening 1502 in inductive vent 600 may include a resistive vent disposed within circuit block 1000 attached to side 311 of substrate 204.

[0077] exist Figures 6 to 14 In one or more other implementations, the microphone module 202 may include an inductive vent attached to the substrate 204, such as by an adhesive material (e.g., an adhesive material attaching a cover layer of the inductive vent to the substrate 204). In one or more other implementations, the microphone module 202 may include an inductive filter at least partially formed within the microphone substrate 204 (also referred to herein as the microphone substrate). For example, Figure 16 An implementation is shown in which an inductive filter 1600 (also referred to herein as an inductive vent) is disposed in substrate 204 and extends from opening 215 to opening 209 .

[0078] like Figure 16 As shown, inductive filter 1600 may include a channel 1602 formed in substrate 204. For example, channel 1602 may be an etched channel (e.g., a laser-etched channel, a chemically-etched channel, etc.) that follows a path within substrate 204, such as a serpentine path. In one or more implementations, channel 1602 may be an open channel having three sides formed by grooves in substrate 204 and may be enclosed by a cover layer attached to substrate 204. For example, the cover layer may include a cover 1604 (e.g., an outer layer or outer cover layer, such as a polyimide or other polymer layer) attached to substrate 204 via an adhesive layer 1606. For example, adhesive layer 1606 may be a heat-activated film, a pressure-sensitive adhesive, a curable liquid adhesive, or other adhesive material. Channel 1602 may be, for example, a serpentine channel having one or more turnaround sections and may have a channel width and a channel length that is substantially greater than (e.g., many times greater than) the channel width, as discussed in further detail below.

[0079] exist Figure 16In a specific implementation, the microphone module 202 having the inductive filter 1600 disposed in the substrate 204 may not have a resistive vent disposed above the opening 209, or may include the resistive vent 400, the circuit block 1000 including the resistive vent, and / or the circuit block 308, as in Figure 3 、 Figure 4 、 Figure 5 、 Figure 8 、 Figure 9 、 Figure 10 and / or Figure 11 For example, microphone module 202 having inductive filter 1600 disposed in substrate 204 may include resistive vent 400 above opening 209 on side 311 of substrate 204. In one or more implementations, the resistive vent may be a resistive vent disposed in circuit block 1000 mounted to side 311 of substrate 204.

[0080] exist Figure 16 In the example of FIG, the non-porous membrane 216 is mounted on the cover 1604 of the inductive filter 1600. In other examples, the non-porous membrane 216 can be mounted directly to the side 313 of the substrate 204. For example, as in Figure 16 In examples, the inductive filter 1600 may substantially span the width of the groove 214, or the inductive filter 1600 may have a shorter lateral extent within the substrate 204, and the non-porous membrane 216 may be directly attached to the substrate 204 laterally outward of the distal end of the cover 1604 of the inductive filter 1600.

[0081] exist Figure 16 In the example of FIG. 1 , the substrate 204 does not have an additional opening between the front volume 300 and the rear volume 210. However, in other implementations, the microphone module 202 having the inductive filter 1600 disposed in the substrate 204 and / or having the resistive vent and / or circuit block disposed thereon may include additional openings, such as Figure 15 1602. The embodiment of the present invention further includes an opening 1500 extending between the sealed volume 301 and the rear volume 210. In these implementations, the opening 1500 can pass through the inductive filter 1600 without being fluidically coupled to the channel 1602. For example, one or more sections of the channel 1602 can be spaced apart, curved, and / or bent to bypass the opening 1500 without being fluidically coupled to the channel 1602.

[0082] Figure 17 1 shows a cross-sectional side view of a resistive vent 400 according to one or more implementations. Figure 17As shown, the resistive vent 400 may include a frame 1700 having a central opening 1701. In one or more specific implementations, the central opening 1701 may be aligned with the opening 209 in the substrate 204 of the microphone module 202. As shown, the resistive vent 400 may also include a membrane 1702, such as a porous membrane (e.g., an expanded PTFE membrane) spanning the central opening 1701 in the frame 1700. For example, the membrane 1702 may be a porous membrane that allows airflow but has a large acoustic impedance. When implemented in the microphone module 202, the porous membrane 1702 may extend above the opening 209 in the substrate 204, as described herein in conjunction with various examples. Depending on the direction of the airflow (e.g., airflow 333) through the membrane 1702 when installed above the opening 1702, a portion of the central opening 1701 on the first side of the membrane 209 may form a first inlet or outlet orifice 1706, and a portion of the central opening 1701 on the second side of the membrane 1702 may form a second inlet or outlet orifice 1708. In one or more implementations, the frame 1700 can be formed from plastic or another substrate, such as a printed circuit substrate material (eg, glass reinforced epoxy such as FR4).

[0083] Figure 18 A cross-sectional side view of a circuit block 1000 is shown according to one or more implementations. Figure 18 FIG also shows a top view of the circuit block 1000. Figure 18 As shown, the circuit block 1000 may include a frame 1800. In one or more specific implementations, the frame 1800 may be formed from plastic or another substrate, such as a printed circuit substrate (e.g., a glass reinforced epoxy such as FR4). As shown, a membrane 1006 may span a central opening 1008 in the frame 1800. As shown, conductive pathways 1002 may be formed in the frame 1800. The conductive pathways 1002 may each extend from a conductive contact (e.g., a solder pad) 1806 on a first side of the frame 1800 to a conductive contact 1004 (e.g., a solder pad) on an opposing second side of the frame 1800. Figure 18 1802. In the cross-sectional view of FIG, two conductive pathways 1002 are visible. However, in the top view, six conductive contacts 1004 are shown, indicating six corresponding conductive pathways within the frame. However, this is merely illustrative, and the circuit block 1000 may be provided with any suitable number of conductive pathways and corresponding contact pads. Depending on the direction of airflow (e.g., airflow 333) through the membrane 1006 when mounted over the opening 1006, a portion of the central opening 1008 on the first side of the membrane 209 may form a first inlet or outlet orifice 1802, and a portion of the central opening 1008 on the second side of the membrane 1006 may form a second inlet or outlet orifice 1804.

[0084] like Figure 18As described in the example of FIG. 1 , in one or more specific implementations, when implemented in microphone module 202, circuit block 1000 may include at least one conductive path 1002 extending from a first contact pad (e.g., conductive contact 312) on a first side (e.g., side 311) of substrate 204, facing away from substrate 204, to a second contact pad (e.g., conductive contact 1004) on a top surface of circuit block 1000. In this example, circuit block 1000 includes a body that forms a frame 1800 of a resistive filter and surrounds at least one conductive path 1002.

[0085] Figures 19 to 21 Various simplified cross-sectional side views of an inductive filter 1900 are shown. As an example, Figure 19 、 Figure 20 or Figure 21 The inductive filter 1900 may be a specific implementation of the inductive vent 600 or the inductive filter 1600 described herein. Figure 19 , the inductive filter 1900 may include a first port 1902 formed on a side 1903 (e.g., a first side) of the inductive filter 1900 and a second port 1904 formed on a side 1905 (e.g., an opposite second side) of the inductive filter 1900. As shown, a channel 1906 (e.g., Figure 16 The specific implementation of channel 1602 or as Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 and / or Figure 15 1904) extends through a substrate 1909 (e.g., substrate 204 or a separate inductive filter substrate) between a first port 1902 and a second port 1904. For example, the first port 1902 can be coupled to the front volume 300 of the microphone module, and the second port 1904 can be coupled to the opening 209 in the substrate 204.

[0086] exist Figure 20 In the example of , the first port 1902 and the second port 1904 of the inductive filter 1900 are both formed on a common side (eg, side 1905 in this example) of the inductive filter 1900. Figure 21 In the example of FIG. 1 , the first port 1902 of the inductive filter 1900 is formed on an edge 2100 of the inductive filter 1900 , and the second port 1904 of the inductive filter is formed on a side 1905 of the inductive filter 1900 . Figure 19 、 Figure 20 and Figure 21 The inductive filter can be implemented as Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 and / or Figure 15 Inductive vent / filter of any of the examples. Although Figures 19 to 20 In the example of FIG. 1 , channel 1906 is shown as a single linear channel segment, but it will be understood that channel 1906 may be a serpentine channel or a channel having any other arrangement that extends the channel length relative to the width of the channel.

[0087] For example, Figure 22 Shown Figure 20 1905 or are formed on opposite sides thereof. Figure 23 A cross-sectional top view of an example is shown in which a first port 1902 of the inductive filter 1900 is formed on an edge 2100 of the inductive filter 1900 and a second port 1904 of the inductive filter is formed on a side 1905 of the inductive filter 1900 .

[0088] like Figure 22 and Figure 23 As shown, the channel 1906 can be a serpentine channel including a plurality of parallel segments 2200 extending between bends 2202 and / or bends 2204 to form a turnaround segment within the substrate 1909. Figure 22 and Figure 23 In the example of , the first port 1902 can be an inlet port configured to be fluidly coupled to the opening 215 in the substrate 204 of the microphone module 202. Figure 22 and Figure 23 In the example of FIG, the second port 1904 can be an outlet port configured to be fluidly coupled to the opening 209 in the substrate 204 of the microphone module 202. Figure 22 As shown in the example of , the first port 1902 may include a plurality of input channels 2206, each of which is fluidly located between the channel 1906 and the first port 1902. Figure 22 and Figure 23As shown in the example of , second port 1904 can include a plurality of output channels 2208 , each of which is fluidly coupled between channel 1906 and second port 1904 .

[0089] Figure 24 Shown Figure 21 and Figure 23 19 is a side view of an inductive filter 1900, where the channel 1906 is simply represented as a dashed line. Figure 24 The side view of FIG. 1 shows how the inductive filter 1900 can be formed by a substrate 1909 in which a channel 1906 is formed and a cover 2400. As an example, the cover 2400 can be a combination of the above Figure 8 The covering layer or Figure 16 As shown, the cover 2400 can be attached to the side 1905 of the substrate 1909 by an adhesive material 2401. As an example, the adhesive material 2401 can be Figure 16 Specific implementation of adhesive layer 1606.

[0090] Figure 25 Shown Figures 19 to 24 A cross-sectional side view of the inductive filter 1900 of any of the embodiments of FIG. 1 , wherein cross-sections of several sections 2200 of the channel 1906 can be seen. For example, Figure 25 The cross-sectional view can be along Figure 22 or Figure 23 The cross section AA of any one of the Figure 25 , but the substrate 1909 includes a plurality of components on the same side, different sides, and / or edges of the substrate 1909 (e.g., Figures 19 to 21 1906). The adhesive material 2401 can be patterned so that the inlet port and the outlet port of the channel 1906 are not blocked by the adhesive material. In one or more implementations, the channel 1906 can have a cross-sectional width 2409 between 10 microns and 100 microns (e.g., between two opposing sidewalls 2500) and can have a depth between 10 microns and 100 microns (e.g., between the side 1905 of the substrate 1909 and the bottom surface 2502 of the channel 1906). In one or more implementations, the total length of the channel 1906 can be between 10 mm and 50 mm. Figure 25In the example of , the inductive filter 1900 includes a patterned substrate (e.g., substrate 1909) and a cover layer attached to the patterned substrate, the cover layer defining a surface of a serpentine fluid passage defined by channels 1906. In one or more specific implementations, the cover layer includes an outer layer (e.g., cover 2400) and an adhesive material 2401, and the adhesive material 2401 extends into and partially defines a portion of the serpentine fluid passage. Figure 25 In the example shown, a portion of adhesive material 2401 contacts a surface of substrate 1909 on side 1905 , and a portion 2503 of adhesive material 2401 partially extends into section 2200 of channel 1906 .

[0091] Figure 26 1 shows a perspective view of a fluid passageway including a channel 1906 of an inductive filter 1900 according to one or more implementations, with the substrate 1909, cover 2400, and adhesive material 2401 removed for clarity. Figure 26 As shown, the channel 1906 can form a serpentine fluid passage having a plurality of turns formed by segments 2200, each of which extends between a bend 2202 and a bend 2204. As shown, a plurality of input channels 2206 can extend in parallel between the first port 1902 and the channel 1906. As shown, a portion 2600 of the channel 1906 can extend around the first port 1902 (e.g., so as to surround the first port 1902). Figure 8 800) without being fluidically coupled to the first port 1902. In one or more implementations, the first port 1902 may correspond to Figure 8 The opening is 800. Figure 26 In the example of FIG. 1 , the segments 2200 of the serpentine portion of the channel 1906 are evenly spaced and linear. However, in the example of FIG. 1 , the segments 2200 of the serpentine portion of the channel 1906 are evenly spaced and linear. Figure 15 In one or more implementations of an opening 1502 of another embodiment, one or more of the segments 2200 can have different spacings and / or can include curves or bends around the other opening 1502 without being fluidly coupled to the opening 1502. Figure 26 In the example of FIG, the first port 1902 can be fluidly coupled to the opening 215 of the substrate 204 of the microphone module 202, and the second port 1904 can be fluidly coupled to the opening 209 in the substrate 204. It should be understood that Figure 26 The number of segments 2200 shown in FIG. 2 is illustrative, and more or fewer segments 2200 may be used.

[0092] As shown in this article with various examples such as Figure 16As discussed in the examples of , in one or more implementations, the inductive filter (e.g., inductive vent 600, inductive filter 1600, and / or inductive filter 1900) may be at least partially defined in the substrate 204 of the microphone module 202.

[0093] Figure 27 A cross-sectional side view of the substrate 204 is shown in an implementation in which the inductive filter 1600 is partially defined in the substrate 204 according to one or more implementations.

[0094] like Figure 27 As shown, the substrate 204 can be a multi-layer substrate having one or more metal layers 2700, one or more insulating layers 2702, an insulating layer 2706, and a metal layer 2704. For example, the metal layers 2700 can be interconnected to each other (e.g., through one or more internal through-holes in the substrate) to form a conductive path for operation of the microphone module 202. In one or more specific implementations, the metal layer 2704 can be electrically isolated from the metal layer 2700 by the insulating layer 2706, and a mask can be formed for forming the channel 1906 in the insulating layer 2706. For example, the metal layer 2704 can be a patterned metal layer that forms an etch mask for etching (e.g., laser etching) the channel into the insulating layer 2706. Figure 26 As shown in the example of FIG, in one or more specific implementations, substrate 204 can be formed by a combination of patterning and laminating printed circuit board materials together, such that channel 1906 (e.g., an embedded serpentine channel) is formed therein. For example, channel 1906 can be formed by a combination of patterning and laminating PCB materials together, such that an embedded serpentine channel is formed in the resulting substrate. For example, metal layer 2704 can be patterned and used as a mask for an etching process (e.g., laser etching or other etching process) that removes unmasked portions of insulating layer 2706 and / or insulating layer 2702.

[0095] As shown, cover 2400 (which may be a specific implementation of cover 1604) may be attached to metal layer 2704. For example, adhesive material 2401 (which may be a specific implementation of adhesive layer 1606) may be attached to metal layer 2704 of substrate 204 and cover 2400 may be attached thereto. In one or more specific implementations, adhesive material 2401 may partially extend into channel 1906 formed in metal layer 2704 and insulating layer 2706, such as (for example) Figure 25As shown in the figure, the opening 215 and the opening 209 in the substrate 204 can pass through one or more metal layers 2700, one or more insulating layers 2702, the metal layer 2704 and the insulating layer 2706. In one or more specific implementations, the insulating layer 2702 and / or the insulating layer 2706 can be formed of (for example) a glass reinforced epoxy laminate material (such as FR4). Figure 27 In the example of FIG. 1 , the first port 1902 is fluidly coupled to the opening 215 and the second port 1904 is fluidly coupled to the opening 209 .

[0096] Figure 28 An example of a partially manufactured state 204' of the substrate 204 is shown at a stage where the insulating layer 2702 has not yet been removed to form the openings 215 and 209. Figure 28 , a bottom view of the metal layer 2704 is also shown, highlighting the opening 2800 in the metal layer 2704, which forms an opening in the channel 1906 that can be covered by the cover 2400. As shown, the metal layer 2704 of the substrate 204 can also define a plurality of parallel input channels 2206 extending from the first port 1902 to the serpentine fluid path formed by the channel 1906. Figure 28 In the example of FIG. 2 , a bottom view of the insulating layer 2706 is also shown, and a portion of the metal layer 2802 of the substrate 204 can be seen through the etched channel in the insulating layer 2706 .

[0097] According to one or more embodiments, an inductive acoustic filter (e.g., vent 600, inductive filter 1600, or inductive filter 1900) is provided that includes a substrate (e.g., substrate 204 or substrate 1909), an etched serpentine channel (e.g., channel 1602 or channel 1906) in a surface of the substrate and extending within the substrate from a first port 1902 in substrate 204 to a second port 1904 in substrate 204, and a polymer cover layer (e.g., cover 1604 or cover 2400) adhesively attached to the surface of the substrate over the etched serpentine channel. In one or more embodiments, the polymer cover layer is adhesively attached to the surface of the substrate by an adhesive material (e.g., adhesive layer 1606 or adhesive material 2401) that includes a first portion that contacts a surface of the substrate (e.g., a surface on side 1905) and a second portion that extends into a portion of the etched serpentine channel (e.g., as shown in FIG. 1 ). Figure 25 ). In one or more implementations, the adhesive material comprises a heat-activated film. In one or more implementations, the polymer cover layer is formed of polyimide. In one or more implementations, the etched serpentine channel has a cross-sectional width 2409 and a length that is substantially greater than the cross-sectional width 2409. In this manner, inductive filter 1900 can function as a low-pass acoustic filter.

[0098] In one or more implementations, the polymer cover layer includes an opening that is fluidically coupled to the second port 1904 in the substrate. In one or more implementations, the polymer cover layer is configured for attachment to a microphone substrate (e.g., substrate 204) of the microphone module 202, wherein the opening is aligned with the drain port (e.g., opening 209) in the microphone substrate. In one or more other implementations, the substrate is the microphone substrate (e.g., substrate 204) of the microphone module 202. In one or more implementations, the inductive acoustic filter further includes a plurality of parallel input channels 2206 extending from the first port 1902 to the etched serpentine channel.

[0099] In one or more implementations, the electronic device 100 includes a housing 106 defining an interior volume 222, a microphone module 202 disposed within the interior volume 222. In one or more implementations, the microphone module 202 includes a substrate 204, a cover 208 mounted to the substrate 204, wherein the cover 208 separates a rear volume 210 of the microphone module 202 from the interior volume 222. In one or more implementations, the microphone module 202 also includes a front volume 300 separated from the rear volume 210 by an acoustically responsive element 316 and fluidically coupled to a first opening (e.g., opening 215) in the substrate 204. In one or more implementations, the microphone module also includes a non-porous membrane 216 defining a sealed volume 301 fluidically coupled to the front volume 300 via the first opening and providing a liquid-tight seal between the front volume 300 and an environment 219 external to the housing 106. In one or more implementations, the microphone module further includes a second opening (e.g., opening 209) in the substrate that extends from the sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to the interior volume 222 of the housing 106 outside the cover 208. In one or more implementations, the electronic device 100 further includes at least one of a resistive filter (e.g., resistive vent 400 or a resistive filter disposed in the circuit block 1000) or an inductive filter (e.g., inductive vent 600, inductive filter 1600, or inductive filter 1900) mounted over the second opening in the substrate.

[0100] In one or more implementations, the microphone module 202 includes a substrate 204, a cover 208 mounted to the substrate 204 and at least partially defining a back volume 210 of the microphone module 202, and a front volume 300 separated from the back volume 210 by an acoustically responsive element 316 and fluidly coupled to a first opening (e.g., opening 215) in the substrate 204. In one or more implementations, the microphone module 202 also includes a non-porous membrane 216 that defines a sealed volume 301 that is fluidly coupled to the front volume 300 via the first opening and provides a liquid-tight seal between the front volume 300 and a first environment (e.g., environment 219) external to the microphone module 202 on a first side (e.g., side 313) of the substrate 204. In one or more implementations, the microphone module 202 further includes a second opening (e.g., opening 209) in the substrate 204 that extends from the sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to a second environment (e.g., interior volume 222) external to the microphone module on an opposite second side (e.g., side 311) of the substrate 204. In one or more implementations, the microphone module 202 includes an inductive filter (e.g., inductive vent 600, inductive filter 1600, or inductive filter 1900) disposed between at least a portion of the non-porous membrane 216 and at least a portion of the substrate 204, the inductive filter having a first port 1902 coupled to the front volume 300, a second port 1904 coupled to the second opening in the substrate 204, and a serpentine fluid passage (e.g., formed by channel 1906) from the first port 1902 to the second port 1904.

[0101] In one or more implementations, the inductive filter is attached to the first side (e.g., side 313) of the substrate by an adhesive material (e.g., adhesive material 2401). In one or more implementations, the inductive filter is completely disposed within the sealed volume 301 defined by the non-porous membrane 216 (e.g., Figure 7 and Figure 11 In one or more implementations, the substrate 204 includes a recess 214 within which the inductive filter is attached to the substrate 204, and the inductive filter spans substantially the entire width of the recess 214 (e.g., as shown in FIG. Figure 8 、 Figure 9 、 Figure 15 、 Figure 16 and Figure 27 In one or more implementations, the inductive filter further includes a plurality of parallel input channels 2206 extending from the first port 1902 to the serpentine fluid passage.

[0102] In one or more embodiments, the microphone module 202 may include: a substrate 204; a cover 208 mounted to the substrate 204 and at least partially defining a rear volume 210 of the microphone module 202; a front volume 300 separated from the rear volume 210 by an acoustically responsive element 316 and fluidly coupled to a first opening (e.g., opening 215) in the substrate 204; a non-porous membrane 216 defining a sealed volume 301 fluidly coupled to the front volume 300 via the first opening and providing a liquid-proof seal between the front volume 300 and a first environment (e.g., environment 219) external to the microphone module on a first side (e.g., side 313) of the substrate 204; and a first environment (e.g., environment 219) in the substrate 204. two openings (e.g., opening 209) extending from a sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to a second environment external to the microphone module 202 (e.g., the interior volume 222 of the electronic device 100) on an opposite second side (e.g., side 311) of the substrate; and an inductive filter (e.g., inductive filter 1600 or inductive filter 1900) at least partially defined in the substrate 204, the inductive filter having a first port 1902 coupled to the second opening, a second port 1904 coupled to the second environment, and a serpentine fluid passage (e.g., defined by channel 1906) within the substrate 204 from the first port 1902 to the second port 1904.

[0103] In one or more implementations, the serpentine fluid passage is partially defined by a cover layer (e.g., cover 1604 or cover 2400) that is attached to the substrate 204 by an adhesive material (e.g., adhesive layer 1606 or adhesive material 2401). In one or more implementations, the adhesive material at least partially extends into the serpentine fluid passage (e.g., Figure 25 ). In one or more implementations, the substrate 204 is a multi-layer substrate having a metal layer 2704, and an adhesive material (e.g., adhesive layer 1606 or adhesive material 2401) is attached to the metal layer 2704 of the substrate 204. In one or more implementations, the metal layer 2704 of the substrate 204 further defines a plurality of parallel input channels 2206 extending from the first port 1902 to the serpentine fluid passage.

[0104] In one or more embodiments, the electronic device 100 includes a housing 106 defining an interior volume 222, a microphone module 202 disposed within the interior volume 222. In one or more embodiments, the microphone module 202 includes: a substrate 204; a cover 208 mounted to the substrate 204, the cover 208 separating a rear volume 210 of the microphone module 202 from the interior volume 222; a front volume 300 separated from the rear volume 210 by an acoustically responsive element 316 and fluidically coupled to a first opening (e.g., opening 215) in the substrate 204; a non-porous membrane 216 defining a sealed volume 301 fluidically coupled to the front volume 300 via the first opening and providing a liquid-tight seal between the front volume 300 and an environment 219 external to the housing 106; a second opening in the substrate 204; and a second opening in the substrate 204. an opening (e.g., opening 209) that extends from the sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to an interior volume 222 of the housing outside the cover 208; and an inductive filter (e.g., inductive vent 600, inductive filter 1600, or inductive filter 1900) disposed between at least a portion of the non-porous membrane 216 and at least a portion of the substrate 204, the inductive filter having a first port 1902 coupled to the front volume 300, a second port 1904 coupled to the second opening in the substrate 204, and a serpentine fluid passage (e.g., defined by channel 1906) from the first port to the second port.

[0105] Figure 29 A flow chart illustrating an exemplary process for operating a vented liquid-resistant microphone for an electronic device according to one or more specific implementations is shown. Figures 1 to 28 The process 2900 is described with reference to the electronic device 100 and the microphone module 202. However, the process 2900 is not limited to Figures 1 to 28 The electronic device 100 and microphone module 202 of the embodiment of the present invention are not limited to the embodiment of the present invention, and one or more blocks (or operations) of process 2900 may be performed by one or more other components and other suitable devices. Further for the purpose of explanation, the blocks of process 2900 are described herein as occurring sequentially or linearly. However, multiple blocks of process 2900 may occur in parallel. In addition, the blocks of process 2900 do not have to be performed in the order shown, and / or one or more blocks of process 2900 do not have to be performed and / or may be replaced by other operations.

[0106] exist Figure 29In the example, at box 2902, sound can be received from an environment (e.g., environment 219) outside the electronic device (e.g., electronic device 100) at a sound response element (e.g., sound response element 316) of the liquid-resistant microphone (e.g., microphone module 202) through a non-porous membrane (e.g., non-porous membrane 216) of the liquid-resistant microphone and through a first opening (e.g., opening 215) in a substrate (e.g., substrate 204) of the liquid-resistant microphone.

[0107] At block 2904, an electronic signal can be generated based on the movement of the sound-responsive element due to the received sound. In one or more implementations, the movement of the sound-responsive element due to the received sound causes an airflow (e.g., airflow 333) to pass through a second opening (e.g., opening 209) in the substrate, the second opening being located between a front volume (e.g., front volume 300) of the liquid-resistant microphone that is at least partially defined by the non-porous membrane and an interior cavity of the electronic device (e.g., interior volume 222 within housing 106), the interior cavity being separated from a rear volume (e.g., rear volume 210) of the liquid-resistant microphone by a cover (e.g., cover 208) mounted to the substrate.

[0108] In various implementations, airflow passes through at least one of a resistive filter (e.g., resistive vent 400 or a resistive filter installed in circuit block 1000) or an inductive filter (e.g., inductive vent 600, inductive filter 1600, and / or inductive filter 1900) mounted above the second opening in the substrate, such as, for example Figures 3 to 16 In one or more embodiments, a portion of the airflow may also pass through a third opening in the substrate (e.g., opening 1500) that fluidly couples the rear volume and the front volume (e.g., as in combination with Figure 15 described above).

[0109] According to aspects of the subject disclosure, a microphone module is provided, the microphone module comprising: a substrate; a cover mounted to the substrate and at least partially defining a rear volume of the microphone module; a front volume separated from the rear volume by an acoustically responsive element and fluidically coupled to a first opening in the substrate; a non-porous membrane defining a sealed volume fluidically coupled to the front volume via the first opening and providing a liquid-tight seal between the front volume and a first environment external to the microphone module on a first side of the substrate; a second opening in the substrate extending from the sealed volume defined by the non-porous membrane through the substrate to a second environment external to the microphone module on an opposite second side of the substrate; and an inductive filter disposed between at least a portion of the non-porous membrane and at least a portion of the substrate, the inductive filter having a first port coupled to the front volume, a second port coupled to the second opening in the substrate, and a serpentine fluid passage from the first port to the second port.

[0110] According to other aspects of the subject disclosure, a microphone module is provided, the microphone module comprising: a substrate; a cover mounted to the substrate and at least partially defining a rear volume of the microphone module; a front volume separated from the rear volume by an acoustically responsive element and fluidically coupled to a first opening in the substrate; a non-porous membrane defining a sealed volume fluidically coupled to the front volume via the first opening and providing a liquid-tight seal between the front volume and a first environment external to the microphone module on a first side of the substrate; a second opening in the substrate extending from the sealed volume defined by the non-porous membrane through the substrate to a second environment external to the microphone module on an opposite second side of the substrate; and an inductive filter at least partially defined in the substrate, the inductive filter having a first port coupled to the second opening, a second port coupled to a second environment, and a serpentine fluid passage within the substrate from the first port to the second port.

[0111] According to other aspects of the subject disclosure, an inductive acoustic filter is provided, comprising: a substrate; an etched serpentine channel extending in a surface of the substrate and within the substrate from a first port in the substrate to a second port in the substrate; and a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel.

[0112] According to other aspects of the subject disclosure, there is provided an inductive acoustic filter comprising: a substrate; a channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate; and a polymer cover layer adhesively attached to the surface of the substrate over the channel.

[0113] The various functions described above can be implemented in digital electronic circuits, computer software, firmware, or hardware. The technology can be implemented using one or more computer program products. A programmable processor and computer can be included in or packaged as a mobile device. The processes and logic flows can be executed by one or more programmable processors and one or more programmable logic circuits. General-purpose and special-purpose computing devices and storage devices can be interconnected via a communication network.

[0114] Some embodiments include electronic components such as microprocessors, storage devices, and memories that store computer program instructions in machine-readable or computer-readable media (or computer-readable storage media, machine-readable media, or machine-readable storage media). Some examples of such computer-readable media include RAM, ROM, compact disc read-only memory (CD-ROM), compact disc recordable memory (CD-R), compact disc rewritable memory (CD-RW), digital versatile disc read-only memory (e.g., DVD-ROM, dual-layer DVD-ROM), various recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD card, mini-SD card, micro-SD card, etc.), magnetic and / or solid-state hard drives, ultra-density optical discs, any other optical or magnetic media, and floppy disks. Computer-readable media can store a computer program that can be executed by at least one processing unit and includes an instruction set for performing various operations. Examples of computer programs or computer code include machine code, such as that generated by a compiler, and files that include higher-level code that can be executed by a computer, electronic component, or microprocessor using an interpreter.

[0115] While the above discussion primarily relates to microprocessors or multi-core processors that execute software, some implementations are performed by one or more integrated circuits such as application specific integrated circuits (ASICs) or field programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions stored on the circuits themselves.

[0116] As used in this specification and any claims of this patent application, the terms "computer," "processor," and "memory" refer to electronic or other technological devices. These terms exclude persons or groups of persons. As used in this specification and any claims of this patent application, the terms "computer-readable medium" and "computer-readable media" are strictly limited to tangible, tangible objects that store information in a form that can be read by a computer. These terms exclude any wireless signals, wired download signals, and any other transient signals.

[0117] To provide for interaction with a user, implementations of the subject matter described herein may be implemented on a computer as described herein having a display device for displaying information to the user and a keyboard and pointing device, such as a keyboard, that the user can use to provide input to the computer. Other types of devices may also be used to provide for interaction with the user; for example, feedback provided to the user may be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user may be received in any form, including acoustic, voice, or tactile input.

[0118] Many of the features and applications described above can be implemented as a software process specified as a set of instructions recorded on a computer-readable storage medium (also referred to as a computer-readable medium). When these instructions are executed by one or more processing units (e.g., one or more processors, cores of a processor, or other processing units), the instructions cause the one or more processing units to perform the actions indicated in the instructions. Examples of computer-readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard drives, EPROMs, and the like. Computer-readable media do not include carrier waves and electrical signals transmitted wirelessly or via wired connections.

[0119] In this specification, the term "software" is intended to include firmware residing in a read-only memory or applications stored in a magnetic storage device, which can be read into a memory for processing by a processor. Likewise, in some implementations, while retaining the different software aspects of this subject disclosure, multiple software aspects of this subject disclosure can be implemented as sub-parts of a larger program. In some implementations, multiple software aspects can also be implemented as stand-alone programs. Finally, any combination of stand-alone programs that together implement the software aspects described herein is within the scope of this subject disclosure. In some implementations, when installed to run on one or more electronic systems, a software program defines one or more specific machine implementations that execute and perform the operations of the software program.

[0120] A computer program (also referred to as a program, software, software application, script, or code) can be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and it can be deployed in any form, including as a stand-alone program or as a module, component, subroutine, object, or other unit suitable for use in a computing environment. A computer program can, but need not, correspond to a file in a file system. A program can be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, subroutines, or code portions). A computer program can be deployed to execute on one computer or on multiple computers located at the same site or distributed across multiple sites and interconnected by a communications network.

[0121] Should be understood that the specific order or the hierarchical structure of the frames in the process disclosed by the present invention are illustrations of exemplary methods. Based on design preference requirements, it should be understood that the specific order or the hierarchical structure of the frames in the process can be rearranged or all the frames shown are executed. Some frames in these frames can be executed simultaneously. For example, in some cases, multitasking and parallel processing may be advantageous. In addition, the division of each system component in the above-mentioned aspects should not be understood as requiring this type of division in all aspects, and should be understood that program components and systems can generally be integrated together in a single software product or be encapsulated in a plurality of software products.

[0122] In one aspect, the term "coupled" or the like may refer to a direct coupling. On the other hand, the term "coupled" or the like may refer to an indirect coupling.

[0123] Terms such as top, bottom, front, back, side, horizontal, vertical, etc. refer to an arbitrary frame of reference, not the usual gravitational frame of reference. Thus, such terms may extend upward, downward, diagonally, or horizontally in a gravitational frame of reference.

[0124] The previous description is provided to enable those skilled in the art to practice various aspects described herein. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects. Therefore, the present claims are not intended to be limited to the aspects shown herein, but are intended to make the full scope consistent with the language claims, wherein reference to elements in singular values ​​is not intended to mean "one and only one", but rather "one or more", unless specifically noted. Unless otherwise specifically stated, the term "some" refers to one or more. Male pronouns (e.g., his) include female and neutral (e.g., her and its), and vice versa. Titles and subtitles (if any) are used only for convenience and do not limit this subject disclosure.

[0125] The predicate words "configured to," "operable to," and "programmed to" do not imply any specific tangible or intangible modification of a subject matter and are intended to be used interchangeably. For example, a component or processor configured to monitor and control an operation may also mean that the processor is programmed to monitor and control the operation or that the processor is operable to monitor and control the operation. Similarly, a processor configured to execute code may be interpreted as a processor programmed to execute code or operable to execute code.

[0126] Phrases such as "aspects" do not imply that such aspect is essential to the subject technology or that such aspect applies to all configurations of the subject technology. Disclosures relating to an aspect may apply to all configurations, or to one or more configurations. Phrases such as "aspects" may refer to one or more aspects, and vice versa. Phrases such as "configurations" do not imply that such configurations are essential to the subject technology or that such configurations apply to all configurations of the subject technology. Disclosures relating to a configuration may apply to all configurations, or to one or more configurations. Phrases such as "configurations" may refer to one or more configurations, and vice versa.

[0127] The word “exemplary” is used herein to mean “serving as an example or illustration.” Any aspect or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs.

[0128] All structural and functional equivalents to the elements of the various aspects described throughout this disclosure that are known or later become known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be covered by the claims. In addition, nothing disclosed herein is intended to be made available to the public regardless of whether the disclosure is explicitly stated in the claims. No claim element should be interpreted under the provisions of 35 U.S.C. § 112(f) unless the element is expressly stated using the phrase "means for..." or, in the case of a method claim, the element is stated using the phrase "step for..." In addition, to the extent that the terms "including," "having," etc. are used in the specification or claims, such terms are intended to be inclusive in a manner similar to how the term "comprising" is interpreted when used as a transitional word in a claim.

Claims

1. A microphone module, comprising: substrate; a cover mounted to the substrate and at least partially defining a rear volume of the microphone module, a front volume separated from the rear volume by a sound-responsive element and fluidly coupled to a first opening in the substrate; a non-porous membrane defining a sealed volume fluidly coupled to the front volume via the first opening and providing a liquid-tight seal between the front volume and a first environment located on the first side of the substrate and external to the microphone module; a second opening in the substrate extending from the sealed volume defined by the non-porous membrane through the substrate to a second environment on an opposite second side of the substrate and external to the microphone module; as well as An inductive filter is disposed between at least a portion of the non-porous membrane and at least a portion of the substrate, the inductive filter having a first port coupled to the front volume, a second port coupled to the second opening in the substrate, and a serpentine fluid passage from the first port to the second port.

2. The microphone module according to claim 1, wherein The inductive filter is attached to the first side of the substrate by an adhesive material.

3. The microphone module according to claim 2, wherein: The first port of the inductive filter is formed on a first side of the inductive filter, and the second port of the inductive filter is formed on an opposite second side of the inductive filter.

4. The microphone module according to claim 2, wherein: The first port and the second port of the inductive filter are both formed on a common side of the inductive filter.

5. The microphone module according to claim 2, wherein The first port of the inductive filter is formed on an edge of the inductive filter, and the second port of the inductive filter is formed on one side of the inductive filter. The microphone module according to claim 2 , wherein: The inductive filter is disposed entirely within the sealed volume defined by the non-porous membrane.

7. The microphone module according to claim 2, wherein: The substrate comprises a groove, wherein the inductive filter is attached to the substrate within the groove, and wherein the inductive filter spans substantially an entire width of the groove.

8. The microphone module according to claim 1, wherein The inductive filter includes an opening extending through the inductive filter, and wherein the serpentine fluid passage extends around the opening without being fluidly coupled to the opening.

9. The microphone module of claim 1 , further comprising a resistive filter mounted to the opposing second side of the substrate and comprising: a frame having a central opening aligned with the second opening in the substrate of the microphone module; as well as A porous membrane spans the central opening in the frame and extends over the second opening in the substrate.

10. The microphone module of claim 9, further comprising a circuit block comprising at least one conductive path extending from a first contact pad on the opposite second side of the substrate away from the substrate to a second contact pad on the top surface of the circuit block. The microphone module according to claim 10 , wherein: The circuit block includes a body forming the frame of the resistive filter and surrounding the at least one conductive path.

12. A microphone module, comprising: substrate; a cover mounted to the substrate and at least partially defining a rear volume of the microphone module, a front volume separated from the rear volume by a sound-responsive element and fluidly coupled to a first opening in the substrate; a non-porous membrane defining a sealed volume fluidly coupled to the front volume via the first opening and providing a liquid-tight seal between the front volume and a first environment located on the first side of the substrate and external to the microphone module; a second opening in the substrate extending from the sealed volume defined by the non-porous membrane through the substrate to a second environment on an opposite second side of the substrate and external to the microphone module; as well as An inductive filter is at least partially defined in the substrate and has a first port coupled to the second opening, a second port coupled to the second environment, and a serpentine fluid passage within the substrate from the first port to the second port.

13. The microphone module according to claim 12, wherein: The serpentine fluid passage is defined in part by a cover layer attached to the substrate by an adhesive material.

14. The microphone module according to claim 13, wherein The adhesive material extends at least partially into the serpentine fluid passage.

15. The microphone module according to claim 13, wherein The substrate comprises a multi-layer substrate having a metal layer, and wherein the adhesive material is attached to the metal layer of the substrate.

16. The microphone module according to claim 15, wherein The metal layer of the substrate also defines a plurality of parallel input channels extending from the first port to the serpentine fluid passage.

17. An inductive acoustic filter, comprising: substrate; an etched serpentine channel extending in a surface of the substrate and within the substrate from a first port in the substrate to a second port in the substrate; as well as A polymer cover layer is adhesively attached to the surface of the substrate over the etched serpentine channel.

18. The inductive acoustic filter according to claim 17, wherein The polymer cover layer is adhesively attached to the surface of the substrate by an adhesive material including a first portion in contact with the surface of the substrate and a second portion extending into a portion of the etched serpentine channel.

19. The inductive acoustic filter according to claim 18, wherein The adhesive material includes a heat activated film.

20. The inductive acoustic filter according to claim 19, wherein The polymer cover layer is formed from polyimide.

21. The inductive acoustic filter according to claim 17, wherein The etched serpentine channel has a width and a length substantially greater than the width.

22. The inductive acoustic filter according to claim 17, wherein The polymer cover layer includes an opening fluidly coupled to a second port in the substrate.

23. The inductive acoustic filter according to claim 22, wherein The polymer cover layer is configured for attachment to a microphone substrate of a microphone module, wherein the opening is aligned with a drain port in the microphone substrate.

24. The inductive acoustic filter according to claim 17, wherein The substrate includes a microphone substrate of a microphone module.

25. The inductive acoustic filter of claim 17, further comprising a plurality of parallel input channels extending from the first port to the etched serpentine channel.

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