electronic devices

Abstract

An electronic device comprises a housing and a first heat source, a second heat source and a heat dissipation module arranged in the housing. The housing comprises a first shell and a second shell. The first shell comprises an upper surface and a lower surface opposite to each other, a through opening and a side wall. The second shell is arranged at one end of the side wall. The heat dissipation module comprises a first fan, a second fan, a first heat conductor and a second heat conductor. The first fan is arranged on one side of the first shell. The second fan is arranged on the other side of the first shell and is adjacent to the second heat source, and the first air outlet of the first fan and the second air outlet of the second fan are located on opposite sides of the side wall. One end of the first heat conductor is assembled with the first fan, and the other end is located at a position on the upper surface side corresponding to the first heat source. One end of the second heat conductor is assembled with the second fan, and the other end is located on the lower surface side and is in contact with the second heat source.

Description

Technical Field

[0001] This case is related to electronic devices. Background Art

[0002] With the increasing popularity of electronic devices, users have higher and higher demands for the performance of electronic devices. As a result, the number of electronic components within electronic devices has increased. To prevent various electronic components from overheating and failing to operate normally, the need for heat dissipation within electronic devices has become increasingly important. However, with the increasing number of electronic components within electronic devices, the problem of not being able to balance space allocation and heat dissipation efficiency has been urgently sought to be improved by the applicant. Summary of the Invention

[0003] This case provides an electronic device comprising a housing, a first heat source, a second heat source, and a heat dissipation module. The housing comprises a first shell and a second shell. The first shell comprises opposing upper and lower surfaces, a through hole, and a side wall. The through hole extends through the upper and lower surfaces, and the side wall extends along the contour of the lower surface away from the upper surface. The second shell is disposed at an end of the side wall away from the upper surface. The first heat source is disposed within the housing and corresponds to the through hole. The second heat source is disposed within the housing. The heat dissipation module comprises a first fan, a second fan, a first heat conductor, and a second heat conductor. The first fan comprises a first air outlet and is disposed on one side of the first housing. The second fan comprises a second air outlet and is disposed on the other side of the first housing and adjacent to the second heat source, with the first and second air outlets being located on opposite sides of the side wall. One end of the first heat conductor is assembled to the first fan, and the other end is located on the upper surface side corresponding to the first heat source. One end of the second heat conductor is assembled to the second fan, and the other end is located on the lower surface side and abuts the second heat source.

[0004] In some embodiments, the first shell further includes two partition walls, which are arranged on the lower surface and define two non-waterproof areas and a waterproof area with the side walls respectively. The first heat source and the second heat source are both located in the waterproof area.

[0005] In some embodiments, the first fan and the second fan are respectively located in two non-waterproof areas.

[0006] In some embodiments, the aforementioned first shell further includes a through-hole and a groove, the through-hole passes through the upper surface and the lower surface, the groove is arranged on the upper surface and connects the through-hole and the through-hole, the first heat conductor is arranged in the groove, and one end of the first heat conductor is located at the through-hole, and the other end is located at the through-hole.

[0007] In some embodiments, the electronic device further includes two heat dissipation fin groups, wherein one heat dissipation fin group is disposed in the through opening and located at the first air outlet of the first fan, and the other heat dissipation fin group is disposed at the second air outlet of the second fan.

[0008] In some embodiments, the first heat conducting member is provided at one end of the first fan and abuts against one of the heat dissipation fin groups, and the second heat conducting member is provided at one end of the second fan and abuts against the other heat dissipation fin group.

[0009] In some embodiments, the second housing includes a main frame and a panel. The main frame is connected to the side wall, and the panel is detachably disposed on the main frame.

[0010] In some embodiments, the position of the aforementioned plate corresponds to the position of the first fan.

[0011] In some embodiments, the position of the plate corresponds to the position of the second heat source and the second fan.

[0012] In some embodiments, the plate has a plurality of heat dissipation holes.

[0013] In some embodiments, the electronic device further includes an input device, which is disposed on the upper surface and covers the first heat source and the first heat conducting member.

[0014] In some embodiments, the electronic device further includes a circuit board, and the first heat source and the second heat source are respectively located on opposite sides of the circuit board.

[0015] In some embodiments, the heat dissipation module further includes a heat conducting plate including a first surface and a second surface arranged in opposite directions. The heat conducting plate is disposed at the opening, the first heat conducting member is abutted against the first surface, and the first heat source is abutted against the second surface.

[0016] In some embodiments, the electronic device further includes a coupling unit, and the circuit board is coupled to the heat conducting plate via the coupling unit.

[0017] In some embodiments, the aforementioned coupling unit includes a coupling member and a locking member, the coupling member includes a fixed section and a cantilever section connected to each other, the fixed section is fixed to the second surface, and the locking member passes through the circuit board and is locked to the cantilever section.

[0018] In some embodiments, the aforementioned coupling unit further includes a nut disposed at an end of the cantilever section away from the fixed section, and the locking piece passes through the circuit board and is locked to the nut.

[0019] In some embodiments, the aforementioned coupling member is a long strip structure, and the coupling member includes two cantilever sections respectively connected to two ends of the fixed section.

[0020] In some embodiments, there are two coupling members, and the two coupling members are disposed in parallel on the heat conducting plate.

[0021] This case provides another electronic device, including a housing, a circuit board, a first heat source, a heat dissipation module and a coupling unit. The circuit board is arranged in the housing. The first heat source is arranged on the circuit board. The heat dissipation module includes a first fan, a heat conducting plate and a first heat conducting member. The first fan is arranged in the housing. The heat conducting plate includes a first surface and a second surface arranged in opposite directions, and the second surface is abutted against the first heat source. One end of the first heat conducting member is assembled to the first fan, and the other end is abutted against the first surface of the heat conducting plate. The coupling unit includes a coupling member and a locking member. The coupling member includes a fixed section and a cantilever section that are connected to each other, the fixed section is fixed to the second surface of the heat conducting plate, and the locking member passes through the circuit board and is locked to the cantilever section.

[0022] In some embodiments, the aforementioned coupling unit further includes a nut disposed at an end of the cantilever section away from the fixed section, and the locking piece passes through the circuit board and is locked to the nut. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic three-dimensional appearance diagram of an embodiment of the electronic device of the present invention;

[0024] Figure 2 A schematic diagram of a partial structural breakdown of an embodiment of the electronic device of the present invention;

[0025] Figure 3 For the Figure 1 The schematic diagram of the local three-dimensional section drawn by the 3-3 section line;

[0026] Figure 4 A schematic diagram of the partial structure of an embodiment of the electronic device of the present invention Figure 1 ;

[0027] Figure 5 A schematic diagram of the partial structure of an embodiment of the electronic device of the present invention Figure 2 ;

[0028] Figure 6 A three-dimensional schematic diagram of a local structure of the electronic device in this case;

[0029] Figure 7 for Figure 6 Schematic diagram of the decomposition;

[0030] Figure 8 For the Figure 1 The local cross-sectional view drawn by the 8-8 cutting line;

[0031] Figure 9 FIG. 1 is a schematic diagram of a three-dimensional appearance of an embodiment of the electronic device of the present invention from another perspective.

[0032]

Explanation of symbols

[0033] 10: Shell

[0034] 11: First shell

[0035] 111: Upper surface

[0036] 112: lower surface

[0037] 113: Passage

[0038] 114: Side Wall

[0039] 115: Partition wall

[0040] 116: Airflow Channel

[0041] 117: hole

[0042] 118: Groove

[0043] 12: Second shell

[0044] 121: Main frame

[0045] 1211:Assembly port

[0046] 122: Plate

[0047] 1221: Heat dissipation holes

[0048] 20: First heat source

[0049] 30: Second heat source

[0050] 40: Heat dissipation module

[0051] 41: First Fan

[0052] 411: First air outlet

[0053] 412: First air inlet

[0054] 42: Second Fan

[0055] 421: Second air outlet

[0056] 422: Second air inlet

[0057] 43: first heat conducting member

[0058] 44: Second heat conducting member

[0059] 45:Heat conduction plate

[0060] 451: First side

[0061] 452: Side 2

[0062] 4521: Positioning slot

[0063] 4522:convex part

[0064] 50: Circuit board

[0065] 60: Combined unit

[0066] 61:Joint

[0067] 611: Fixed segment

[0068] 612: Cantilever section

[0069] 62:Fixer

[0070] 63: Locking firmware

[0071] 64: Nut

[0072] 641: Set

[0073] 642: Head

[0074] 70: cooling fin group

[0075] A: Non-waterproof area

[0076] B: Waterproof area

[0077] I: Input device DETAILED DESCRIPTION

[0078] See Figures 1 to 5 , Figure 1 A schematic three-dimensional appearance diagram of an embodiment of the electronic device of the present invention; Figure 2 A schematic diagram of a partial structural breakdown of an embodiment of the electronic device of the present invention; Figure 3 For the Figure 1 The schematic diagram of the local three-dimensional section drawn by the 3-3 section line; Figure 4 A schematic diagram of the partial structure of an embodiment of the electronic device of the present invention Figure 1 ; Figure 5 A schematic diagram of the partial structure of an embodiment of the electronic device of the present invention Figure 2 .

[0079] The electronic device in this case includes a housing 10 and a first heat source 20, a second heat source 30 and a heat dissipation module 40 arranged in the housing 10. The housing 10 includes a first shell 11 and a second shell 12. The first shell 11 includes an upper surface 111 and a lower surface 112 relative to each other, a through-hole 113 and a side wall 114. The through-hole 113 passes through the upper surface 111 and the lower surface 112, and the side wall 114 extends along the contour of the lower surface 112 in a direction away from the upper surface 111. The second shell 12 is arranged at an end of the side wall 114 away from the lower surface 112 of the first shell 11. The first heat source 20 is arranged at a position corresponding to the through-hole 113. The heat dissipation module 40 includes a first fan 41, a second fan 42, a first heat conductor 43 and a second heat conductor 44. The first fan 41 includes a first air outlet 411, and the first fan 41 is arranged on one side of the first shell 11. The second fan 42 includes a second air outlet 421. The second fan 42 is located on the other side of the first housing 11, adjacent to the second heat source 30. The first air outlet 411 and the second air outlet 421 are located on opposite sides of the sidewall 114. One end of the first heat conductor 43 is mounted on the first fan 41, and the other end is located on the upper surface 111 at a position corresponding to the first heat source 20. One end of the second heat conductor 44 is mounted on the second fan 42, and the other end is located on the lower surface 112, abutting the second heat source 30.

[0080] In this way, the heat dissipation module 40 can fully provide heat dissipation for the first heat source 20 and the second heat source 30 located at different positions in the limited space within the outer shell 10, thereby improving the freedom of position configuration of the first heat source 20 and the second heat source 30 within the outer shell 10. In addition, since the first air outlet 411 of the first fan 41 and the second air outlet 421 of the second fan 42 are located on opposite sides of the side wall 114, when the first heat conductor 43 and the second heat conductor 44 are assembled with the first fan 41 and the second fan 42, the first heat source 20 and the second heat source 30 can be configured at different positions within the outer shell 10 according to the positions of the first heat conductor 43 and the second heat conductor 44, which can not only effectively improve the heat dissipation efficiency, but also improve the space utilization within the outer shell 10.

[0081] See Figures 1 to 3 In this case, the electronic device is a device that has electronic components that generate heat due to operation. In some embodiments, the electronic device is a notebook computer, but the present invention is not limited to this. In these embodiments, the housing 10 is the main body housing of the notebook computer, the first shell 11 is the C component for installing the input device I, and the second shell 12 is the D component supported on the usage surface. Here, the input device I is arranged on the upper surface 111 of the first shell 11 and covers the opening 113. The second shell 12 and the lower surface 112 and side wall 114 of the first shell 11 form a space for accommodating the first heat source 20, the second heat source 30 and the heat dissipation module 40.

[0082] See Figures 3 to 5 , Figure 4 This is a schematic diagram of an embodiment of the electronic device of the present invention, in which the second housing 12 is omitted and the device is shown from a perspective perpendicular to the lower surface 112 of the first housing 11 ; Figure 5 is based on Figure 4 The second heat source 30 and the second heat conducting member 44 are omitted and the circuit board 50 is shown in the schematic diagram.

[0083] In some embodiments, the first housing 11 includes two partition walls 115 and a plurality of airflow channels 116, each of which extends through the side walls 114. In these embodiments, each partition wall 115 is disposed on the lower surface 112 and extends from the lower surface 112 away from the upper surface 111. Each partition wall 115 is connected to the side wall 114 at both ends, and each airflow channel 116 is located within the range of each end of the partition wall 115. Thus, each partition wall 115, the portion of the side wall 114 containing the airflow channel 116, and the second housing 12 define two non-waterproof areas A, and the two partition walls 115, the remaining portion of the side wall 114, and the second housing 12 define a waterproof area B.

[0084] In these embodiments, the first fan 41 and the second fan 42 are respectively located in each non-waterproof area A and exhaust gas through each air flow channel 116, while the first heat source 20 and the second heat source 30 can be set in the waterproof area B, ensuring that the heat dissipation airflow of the first fan 41 and the second fan 42 is smooth and the heat dissipation effect is ensured, while also ensuring the waterproofness of the first heat source 20 and the second heat source 30 located in the outer shell 10 to avoid affecting the operation of the first heat source 20 and the second heat source 30.

[0085] See Figures 3 to 5 In this embodiment, the first housing 11 further includes a through-hole 117 and a groove 118. The through-hole 117 passes through the upper surface 111 and the lower surface 112 and communicates with the non-waterproof area A where the first fan 41 is located. The groove 118 is provided on the upper surface 111 and communicates with the through-hole 117 and the through-hole 113. It is worth noting that Figure 4 、 Figure 5 The dashed outline in the figure represents the outline of the groove 118 recessed in the upper surface 111 of the first housing 11. A portion of the groove 118 corresponds to the shape of the first heat conductor 43, while the remaining portion connects to the opening 113 and corresponds to the shape of the heat conducting plate 45. Thus, the first heat conductor 43 is disposed within the groove 118, with one end of the first heat conductor 43 positioned corresponding to the opening 113 to absorb heat energy generated by the first heat source 20. The other end of the first heat conductor 43 is located at the opening 117, corresponding to the first fan 41. The airflow generated by the first fan 41 quickly dissipates heat energy from the first heat conductor 43.

[0086] The input device I is simultaneously covered over the heat conducting plate 45, the through-hole 117, the first heat conducting member 43, and the groove 118. Thus, the first heat conducting member 43 and the heat conducting plate 45 are located between the input device I and the upper surface 111 of the first shell 11. When using the electronic device, the user will not directly contact the first heat conducting member 43 and the heat conducting plate 45, thereby improving safety and comfort.

[0087] See Figures 3 to 7 , Figure 6 A three-dimensional schematic diagram of a local structure of the electronic device in this case; Figure 7 for Figure 6 Schematic diagram of the decomposition of the heat dissipation module 40. In this embodiment, the heat dissipation module 40 further includes a heat conducting plate 45, which is disposed between the first heat source 20 and the first heat conducting member 43. The large area of ​​the heat conducting plate 45 contacts between the first heat conducting member 43 and the first heat source 20, thereby quickly transferring the heat from the first heat source 20 to the first heat conducting member 43, thereby improving the heat conduction effect of the first heat conducting member 43. In these embodiments, the heat conducting plate 45 is a plate-shaped body having an area larger than that of the first heat source 20. In some embodiments, the heat conducting plate 45 is a copper sheet with a high thermal conductivity coefficient, but the present invention is not limited to this.

[0088] See Figures 2 to 7 In some embodiments where the heat dissipation module 40 includes a heat conducting plate 45 , the area of ​​the heat conducting plate 45 is larger than the area of ​​the through opening 113 . Figure 2 The heat conducting plate 45 shown completely covers the opening 113. The heat conducting plate 45 includes a first surface 451 and a second surface 452 arranged in opposite directions. The heat conducting plate 45 is disposed on the upper surface 111 of the first housing 11, with the second surface 452 covering the opening 113 and resting against the upper surface 111 around the opening 113. The first heat conducting member 43 abuts against the first surface 451 of the heat conducting plate 45. The first heat source 20 is disposed in the housing 10 at a position corresponding to the opening 113 and abuts against the second surface 452.

[0089] Thus, the heat conducting plate 45 is stably supported against the upper surface 111 of the first housing 11 while simultaneously contacting the first heat source 20. In these embodiments, the second surface 452 of the heat conducting plate 45 further includes a protrusion 4522. The shape and size of the protrusion 4522 are smaller than those of the opening 113. When the second surface 452 of the heat conducting plate 45 is in contact with the upper surface 111 of the first housing 11, the protrusion 4522 of the heat conducting plate 45 passes through the opening 113 to securely contact the first heat source 20 within the first housing 11.

[0090] In these embodiments, the shape of the groove 118 communicating between the through-port 113 and the through-port 117 at the position corresponding to the through-port 113 corresponds to the shape of the heat conducting plate 45, thereby making it easier to assemble the heat conducting plate 45 and stably accommodate it in the groove 118 to correspond to the through-port 113 and the first heat source 20. In addition, it is also easier to fix the heat conducting plate 45 to the upper surface 111 of the first housing 11 by various fixing means, such as Figure 5 As shown, the outer periphery of the heat conducting plate 45 is fixed to the first housing 11 by screws.

[0091] See Figures 3 to 5 In some embodiments, the electronic device further includes a circuit board 50, which is disposed within the housing 10 in a direction parallel to the lower surface 112. The first heat source 20 and the second heat source 30 are located on opposite sides of the circuit board 50, and the first heat source 20 and the second heat source 30 are disposed at different heights within the housing 10. In these embodiments, the first heat source 20 is disposed on the side of the circuit board 50 closer to the lower surface 112, and the second heat source 30 is disposed on the side of the circuit board 50 farther from the lower surface 112. Thus, the first heat source 20 and the second heat source 30 can be located at different heights within the housing 10. The first heat source 20, the first fan 41, and the first heat conductor 43 for dissipating heat from the first heat source 20 can be positioned as close as possible to the upper surface 111 of the first housing 11. The second heat conductor 44 for dissipating heat from the second heat source 30 can be positioned closer to the second housing 12. This allows the heat dissipation module 40 to fully dissipate heat from the first heat source 20 and the second heat source 30 at different heights, thereby improving space utilization within the housing 10. In some embodiments, the first heat source 20 and the second heat source 30 can be, for example, a central processing unit or a graphics card, respectively, but the present invention is not limited thereto. In some embodiments, the first heat conducting member 43 and the second heat conducting member 44 can be, for example, a heat pipe or a flat copper tube with high thermal conductivity, but the present invention is not limited thereto.

[0092] See Figures 5 to 8 , Figure 8 For the Figure 1 A partial cross-sectional view drawn along the section line 8-8. In this embodiment, the electronic device further includes a coupling unit 60 for coupling the heat conducting plate 45 to the circuit board 50, ensuring that the heat conducting plate 45 can reliably contact the first heat source 20 on the circuit board 50 under a predetermined pressure. In these embodiments, the circuit board 50 is not directly coupled to the heat conducting plate 45, but rather coupled to the heat conducting plate 45 via the coupling unit 60. Here, the coupling unit 60, which is fixed to the heat conducting plate 45, constrains the relative position of the circuit board 50 with respect to the heat conducting plate 45.

[0093] See Figures 5 to 8In this embodiment, the coupling unit 60 includes a coupling member 61, a fixing member 62, and a locking member 63. The coupling member 61 includes a fixed section 611 and a cantilever section 612. The fixing member 62 secures the coupling member 61 to the second surface 452 of the heat conducting plate 45 and defines the fixed section 611. The two ends of the fixed section 611 define cantilever sections 612. The locking member 63 passes through the circuit board 50 and is locked to the cantilever sections 612. Here, because one end of the cantilever section 612 is connected to the fixed section 611 and the other end is free, when the locking member 63 is locked to the circuit board 50 through the cantilever section 612, the end of the cantilever section 612 connected to the fixed section 611 limits the locking depth of the cantilever section 612 and the locking member 63 locked to the cantilever section 612. The cantilever section 612, constrained by the fixed section 611, can restrain the locking member 63 to prevent excessive locking force of the locking member 63 from damaging the circuit board 50.

[0094] See Figures 5 to 8 In some embodiments, the fixing members 62 of the coupling unit 60 may be, but are not limited to, rivets or screws. In these embodiments, there are two fixing members 62 , which are disposed in the middle of the coupling member 61 and fixed to the heat conducting plate 45 . The area between the two fixing members 62 defines a fixing section 611 , and the area between each fixing member 62 and the two free ends of the coupling member 61 defines a cantilever section 612 .

[0095] See Figures 4 to 7 Furthermore, in this embodiment, the coupling unit 60 includes two coupling members 61, each of which is a long, strip-shaped structure. The two coupling members 61 are disposed on the second surface 452 of the heat conducting plate 45, and are located parallel to each other on opposite sides of the through-hole 113. In these embodiments, each coupling member 61 includes two cantilever segments 612, each of which is connected to both ends of the fixed segment 611. Thus, the coupling unit 60 can lock the circuit board 50 to the coupling member 61 fixed to the heat conducting plate 45 via four locking members 63. Each locking member 63 can be disposed at a corresponding corner of the through-hole 113, thereby improving the locking stability between the coupling unit 60 and the circuit board 50.

[0096] See Figures 5 to 8In some embodiments, the coupling unit 60 further includes a nut 64 disposed at the end of the cantilever section 612 away from the fixed section 611. The locking member 63 passes through the circuit board 50 and is locked to the nut 64, thereby facilitating the locking of the locking member 63. In some embodiments in which the coupling unit 60 includes the nut 64, the nut 64 includes a sleeve 641 and a head 642 that are connected to each other. The sleeve 641 includes an internal thread groove, and the head 642 is a flat plate with an outer profile larger than the sleeve 641. The nut 64 is displaceably inserted through the sleeve 641 at the end of the cantilever section 612 away from the fixed section 611. After the locking member 63 passes through the circuit board 50 and is locked to the sleeve 641 of the nut 64, the nut 64 abuts against the heat conducting plate 45 and the coupling member 61 with the head 642. In these embodiments, the second surface 452 of the heat conducting plate 45 includes a plurality of positioning grooves 4521. The position of each positioning groove 4521 corresponds to the locking position of the locking member 63, and the shape of each positioning groove 4521 corresponds to the shape of the head 642 of the nut 64. Thus, each positioning groove 4521 can provide the nut 64 with initial positioning on the heat conducting plate 45 during assembly. After the coupling 61 is fixed to the heat conducting plate 45 through the fixing section 611, the cantilever section 612 can restrict the nut 64 from falling off. Here, the floatability of the locking member 63 after being locked on the nut 64 is improved through the displaceable configuration of the nut 64, and the manufacturing process and production cost of the coupling 61 can also be simplified.

[0097] In some embodiments, the nut 64 is not limited to being displaceably disposed in the cantilever section 612 . The nut 64 may also be the cantilever section 612 that only includes the sleeve 641 and is directly integrally formed with the coupling 61 . The present invention is not limited thereto.

[0098] It is worth noting that since the locking pressure that the circuit board 50 can withstand is not the same, in order to adjust the locking pressure between the coupling unit 60 and the circuit board 50, the floating stroke of the cantilever section 612 can be changed accordingly by changing the material, thickness or length of the coupling 61, thereby relatively controlling the locking pressure of the locking piece 63 to ensure that the circuit board 50 is not damaged due to excessive locking pressure of the locking piece 63.

[0099] See Figure 3 and Figure 4 In some embodiments, the electronic device further includes two heat dissipation fin assemblies 70. One heat dissipation fin assembly 70 is disposed in the opening 117 and located at the first air outlet 411 of the first fan 41, and the other heat dissipation fin assembly 70 is disposed at the second air outlet 421 of the second fan 42. In these embodiments, one end of the first heat conduction member 43 disposed on the first fan 41 abuts against the heat dissipation fin assembly 70 located at the first air outlet 411, and one end of the second heat conduction member 44 disposed on the second fan 42 abuts against the heat dissipation fin assembly 70 located at the second air outlet 421. Thus, the configuration of the heat dissipation fin assembly 70 improves heat dissipation efficiency.

[0100] See Figure 9 In this embodiment, the second housing 12 includes a main frame 121 and a panel 122. The main frame 121 is assembled to the side wall 114, and the panel 122 is detachably mounted on the main frame 121. This allows the user to easily remove the panel 122 to replace or repair electronic components within the housing 10. In these embodiments, the main frame 121 is a plate-like structure whose outer contour corresponds to the contour of the side wall 114 for assembly to the side wall 114. The main frame 121 has a plurality of assembly openings 1211. The position and shape of each assembly opening 1211 correspond to various electronic components within the housing 10. The panel 122 is detachably assembled to each assembly opening 1211, thereby allowing the user to easily remove the panel 122 to replace or repair various components within the housing 10.

[0101] See Figure 9 In some embodiments where the second shell 12 includes a detachable panel 122, the number of panels 122 can be multiple, and the position of each panel 122 can correspond to the position of the first fan 41, the second fan 42 or the second heat source 30, respectively, so as to facilitate the maintenance or replacement of the first fan 41, the second fan 42 or the second heat source 30.

[0102] See Figure 3 and Figure 9 In some embodiments where the position of the plate 122 corresponds to the first fan 41 or the second fan 42, each plate 122 also includes a plurality of heat dissipation holes 1221. In addition to serving as a flow path for airflow to enter the housing 10, the heat dissipation holes 1221 of each plate 122 can also ensure that the first fan 41 or the second fan 42 can smoothly inhale external air for heat dissipation. In these embodiments, the first fan 41 and the second fan 42 are centrifugal fans, the first fan 41 includes a first air inlet 412, the opening directions of the first air inlet 412 and the first air outlet 411 are perpendicular to each other, the second fan 42 includes a second air inlet 422, the opening directions of the second air inlet 422 and the second air outlet 421 are perpendicular to each other, thereby, the first air inlet 412 of the first fan 41 and the second air inlet 422 of the second fan 42 can correspond to the position of the heat dissipation hole 1221 of the plate 122 of the second shell 12, and the first air outlet 411 and the second air outlet 421 can correspond to the position of the air flow channel 116 of the side wall 114 of the first shell 11, thereby ensuring smooth airflow in and out of the first fan 41 and the second fan 42, thereby ensuring the heat dissipation effect.

[0103] Although the present disclosure has been described above with reference to certain embodiments, this disclosure is not intended to be limiting. Any person skilled in the art may make modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of patent protection for this case shall be determined by the scope defined in the appended claims.

Claims

1. An electronic device, characterized in that: include: A housing comprising: A first shell, comprising an upper surface and a lower surface opposite to each other, a through opening and a side wall, wherein the through opening passes through the upper surface and the lower surface, and the side wall extends along the contour of the lower surface in a direction away from the upper surface; as well as a second shell, disposed at an end of the side wall away from the upper surface; a first heat source disposed in the housing and corresponding to the opening; a second heat source disposed within the housing; and A heat dissipation module, comprising: a first fan including a first air outlet, the first fan being disposed on one side of the first housing; a second fan including a second air outlet, the second fan being disposed on the other side of the first housing and adjacent to the second heat source, and the first air outlet and the second air outlet being located on opposite sides of the side wall; a first heat conducting member, one end of which is assembled with the first fan and the other end of which is located at a position on the upper surface corresponding to the first heat source; and A second heat conducting member has one end assembled on the second fan and the other end located on the lower surface and in contact with the second heat source.

2. The electronic device according to claim 1, wherein The first shell further includes two partition walls, which are arranged on the lower surface and define two non-waterproof areas and a waterproof area with the side wall respectively. The first heat source and the second heat source are both located in the waterproof area.

3. The electronic device according to claim 2, wherein: The first fan and the second fan are respectively located in the two non-waterproof areas.

4. The electronic device according to claim 1, wherein: The first shell further includes a through-hole and a groove. The through-hole passes through the upper surface and the lower surface. The groove is arranged on the upper surface and connects the through-hole and the through-hole. The first heat-conducting member is arranged in the groove, and one end of the first heat-conducting member corresponds to the through-hole, and the other end is located at the through-hole.

5. The electronic device according to claim 4, wherein: The invention also comprises two heat dissipation fin groups, wherein one heat dissipation fin group is arranged in the through opening and located at the first air outlet of the first fan, and the other heat dissipation fin group is arranged at the second air outlet of the second fan.

6. The electronic device according to claim 5, wherein: The first heat conducting member is arranged at the end of the first fan and abuts against one of the heat dissipation fin groups. The second heat conducting member is arranged at the end of the second fan and abuts against the other heat dissipation fin group.

7. The electronic device according to claim 1, wherein: The second shell includes a main frame and a plate. The main frame is assembled on the side wall, and the plate is detachably arranged on the main frame.

8. The electronic device according to claim 7, wherein: The position of the plate corresponds to the position of the first fan.

9. The electronic device according to claim 7, wherein: The position of the plate corresponds to the positions of the second heat source and the second fan.

10. The electronic device according to claim 7, wherein: The plate has a plurality of heat dissipation holes.

11. The electronic device according to claim 1, wherein: The device further comprises an input device which is arranged on the upper surface and covers the first heat source and the first heat conducting member.

12. The electronic device according to claim 1, wherein: The device further comprises a circuit board, wherein the first heat source and the second heat source are respectively located on two opposite sides of the circuit board.

13. The electronic device according to claim 12, wherein: The heat dissipation module further includes a heat conducting plate including a first surface and a second surface arranged in opposite directions. The heat conducting plate is disposed at the through opening, the first heat conducting member is abutted against the first surface, and the first heat source is abutted against the second surface.

14. The electronic device according to claim 13, wherein: The device further comprises a combining unit, through which the circuit board is combined with the heat conducting plate.

15. The electronic device according to claim 14, wherein: The combining unit includes a combining piece and a locking piece. The combining piece includes a fixed section and a cantilever section connected to each other. The fixed section is fixed to the second surface. The locking piece passes through the circuit board and is locked to the cantilever section.

16. The electronic device according to claim 15, wherein: The combining unit further comprises a nut which is arranged at one end of the cantilever section away from the fixing section, and the locking piece passes through the circuit board and is locked on the nut.

17. The electronic device according to claim 15, wherein: The connecting piece is a long strip structure and comprises two cantilever sections respectively connected to the two ends of the fixing section.

18. The electronic device according to claim 17, wherein: The number of the combining pieces is two, and the two combining pieces are arranged in parallel on the heat conducting plate.

19. An electronic device, characterized in that: include: A housing comprising an upper surface and a lower surface opposite to each other; a circuit board disposed in the housing; a first heat source disposed on the circuit board; a second heat source disposed within the housing; A heat dissipation module, comprising: a first fan disposed in the housing; a heat conducting plate comprising a first surface and a second surface disposed opposite to each other, the second surface being in contact with the first heat source; and a first heat conducting member, one end of which is assembled with the first fan, and the other end of which is located at a position on the upper surface corresponding to the first heat source and abuts against the first surface of the heat conducting plate; a second heat conducting member, one end of which is assembled with a second fan, and the other end of which is located on the lower surface and abuts against the second heat source; and A combining unit comprising: a coupling member comprising a fixed section and a cantilever section connected to each other, wherein the fixed section is fixed to the second surface of the heat conducting plate; and A locking piece passes through the circuit board and is locked to the cantilever section.

20. The electronic device according to claim 19, wherein: The combining unit further comprises a nut which is arranged at one end of the cantilever section away from the fixing section, and the locking piece passes through the circuit board and is locked on the nut.

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