Fully automatic planar waveguide coupling device based on nanoscale sensing contact
By combining high-precision stepper motors and nanoscale sensing sensors with software algorithms, automatic alignment and angle adjustment of the FA fiber core and chip were achieved, solving the problems of low accuracy and efficiency in the optical coupling process of optical devices, and realizing high-precision fully automatic planar waveguide coupling.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN BRIGHTAS COMM EQUIP CO LTD
- Filing Date
- 2023-05-24
- Publication Date
- 2026-06-02
AI Technical Summary
In existing technologies, the optical coupling process of optical devices mainly relies on manual or semi-automatic debugging, which is time-consuming and the repeatability and stability are affected by the skills of employees. It is difficult to meet the needs of mass production of high-precision and high-efficiency optical devices, especially in planar waveguide devices, where there are problems of large individual differences and long training cycles.
By employing a high-precision stepper motor and a high-precision nanoscale sensing sensor, combined with coupling software algorithms, automatic alignment and angle adjustment of the FA fiber core and the chip are achieved. High-precision fully automatic planar waveguide coupling is realized through XYZ axis coordination.
It achieves high-precision, low-cost fully automatic optical coupling with an angle adjustment accuracy of ±1µm, solving the problems of insufficient accuracy and low efficiency in traditional methods, and is suitable for high-precision automatic angle adjustment in the optical communication industry.
Smart Images
Figure CN116609885B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of coupling device technology, and in particular to a fully automated planar waveguide coupling device based on nanoscale sensing contact. Background Technology
[0002] With the rapid development of optical communication technology in China, mobile internet and data transmission have become widespread, and communication capacity is increasing. Optical fiber communication is also developing towards miniaturization and integration. The rapid development of photonic integration and electronic integration technologies, based on planar waveguide technology, has led to increasingly refined and miniaturized designs. In recent years, planar silicon photonics and planar waveguide technologies have been widely commercialized. Planar waveguides are crucial for the integration of optical devices, ensuring precise alignment of the input electrical or optical signals with the chip's receiving or transmitting end, and precise alignment of the output signals with the chip's receiving or transmitting end. This is a very important step in the manufacturing process of optical devices, known as optical coupling. Currently, optical coupling is mainly performed manually or semi-automatically under a microscope. This process is time-consuming, and the repeatability and stability of the coupling are greatly affected by the skill level of the operators, resulting in significant individual differences. Furthermore, optical path debugging requires a high level of operator proficiency and familiarity with the equipment, leading to long training periods and hindering rapid mass production of optical devices. Therefore, traditional manual or semi-automatic debugging methods are no longer suitable for the optical requirements of coupling more channels, smaller sizes, and higher precision optical devices.
[0003] With the rapid development of communication technology and its services, the research on high-capacity optical fiber communication systems has significant application value. To date, the maximum transmission capacity achieved for optical fibers is only 0.24% of their potential capacity. Dense wavelength division multiplexing (DWDM) and coarse wavelength division multiplexing (CWDM) technologies can effectively tap into the transmission potential of optical fibers. With the rise of data centers, the demand for optical devices based on planar waveguide silicon photonic chips (SPLITTER, AWG, CWDM4, CWDM8, etc.) has surged, placing new demands on planar waveguide packaging technology. Currently, coupling technology is monopolized by manufacturers in Japan and the United States, resulting in expensive equipment and extremely high subsequent upgrade and maintenance costs, preventing large-scale application by Chinese industrial manufacturers. This prompted our company to develop a new type of domestically produced, fully automated, high-precision, high-efficiency, low-cost planar waveguide-based optical coupling technology to meet market demands.
[0004] In the past two years, orders in the data communication field have surged, while prices have plummeted. Cost reduction has become a top priority for all 100G optical module manufacturers. New materials and new solutions each have their own advantages. Among the CWDM4 / LR4 packaging solutions, the AWG solution stands out and has a significant impact on traditional film-type CWDM. In high-speed optical modules, apart from lasers, CWDM products have the highest value, while the AWG solution has low batch cost and can replicate PLC packaging technology, which will have a huge cost advantage in the future.
[0005] Driven by giants Intel and IBM, silicon optics technology will soon be widely adopted in data centers and supercomputers. However, it will find limited application in the consumer industry: smart devices and PCs don't have many chips, so they don't need the sophisticated inter-chip optical signal transmission. New technologies will impact our lives more indirectly: the rapid growth in the performance of future cloud computing platforms will provide faster and better information services to ordinary users, and silicon optics technology is one of the key contributors to this. Until semiconductor processes reach their physical limits and revolutionary new computers emerge, silicon optics technology will fill the gaps and extend Moore's Law as much as possible.
[0006] Planar waveguides and arrayed waveguide devices are core optoelectronic devices supporting the rapid development of fiber optic communication in the 21st century. The coupling and packaging of arrayed waveguide devices utilizes a full-space, six-DOF motion platform to optically align, couple, and fix the waveguide chip to the input and output array fibers, achieving complete device functionality. On one hand, the coupling and packaging of planar arrayed waveguide devices requires sub-micron level positioning accuracy, full-space, and multi-channel optical alignment. Insufficient alignment accuracy in any channel will lead to the loss of signal transmission or conversion functions, rendering the entire device unusable. On the other hand, the bonding strength and stress distribution at the coupling interface directly determine the additional micro-displacement at the coupling interface and the reliability of the device. The coupling and packaging of arrayed waveguide devices integrates relevant theories and cutting-edge technologies from waveguide optics, integrated optics, control science, microfabrication, and materials science. It is one of the key technologies in the manufacturing of arrayed waveguide devices and has become a technological bottleneck restricting the rapid development of integrated optoelectronic devices. Summary of the Invention
[0007] The purpose of this invention is to provide a fully automatic planar waveguide coupling device based on nanoscale sensing contact. It uses a high-precision stepper motor in conjunction with a high-precision sensing contact sensor to fully realize fully automatic high-speed coupling of light with planar optical waveguides, improve the accuracy of planar waveguide coupling of light, and fully realize high-precision automatic angle adjustment function.
[0008] This invention is achieved through the following technical solution:
[0009] A fully automated planar waveguide coupling device based on nanoscale sensing contact includes a chip placement component and symmetrically arranged input and output components. Each input and output component is driven by a stepper motor. The stepper motor is electrically connected to a driver. Coupling software controls the driver to drive the stepper motors to displace the input and output components in different directions, achieving mode field matching between the FA fiber core and the chip waveguide, thus achieving initial alignment of the optical waveguide. The coupling software automatically switches the displacement step size, achieving precise alignment again through the input and output components. The coupling software also controls the driver to control the step size and movement of the angle stepper motors to achieve multi-channel equalization.
[0010] As a further improvement to the technical solution of the present invention, the input component includes an input Z-axis, an input X-axis, an input Y-axis, an input θZ-axis, an input θX-axis, an input θY-axis, an input ranging sensor, an input moving guide rail, and an input clamp; the input Z-axis is connected to the input X-axis; the input X-axis is connected to the input θZ-axis; the input θZ-axis is connected to the input Y-axis; the input Y-axis is connected to the input θX-axis; the input θX-axis is connected to the input θY-axis; the input ranging sensor and the input moving guide rail are respectively mounted on the input θX-axis; the input clamp is mounted on the input moving guide rail; and the FA fiber core is fixed on the input clamp.
[0011] As a further improvement to the technical solution of the present invention, the output component includes an output Z-axis, an output X-axis, an output Y-axis, an output θZ-axis, an output θX-axis, an output θY-axis, an output ranging sensor, an output moving guide rail, and an output clamp; the output Z-axis is connected to the output X-axis; the output X-axis is connected to the output θZ-axis; the output θZ-axis is connected to the output Y-axis; the output Y-axis is connected to the output θX-axis; the output θX-axis is connected to the output θY-axis; the output ranging sensor and the output moving guide rail are respectively mounted on the output θX-axis; the output clamp is mounted on the output moving guide rail; and the FA fiber core is fixed on the output clamp.
[0012] As a further improvement to the technical solution of the present invention, the chip placement assembly includes a chip clamp and a chip mounting base; the chip clamp is disposed on the top of the chip mounting base; and the chip is placed on the chip clamp.
[0013] As a further improvement to the technical solution of the present invention, the coupling software controls the stepper motor to automatically adjust the angle and distance between the FA fiber core and the chip. The thickness of the adhesive layer is accurately controlled by measuring the distance through the input and output distance sensors. The coupling software algorithm automatically and quickly finds the coupling position between the FA fiber core and the chip by inputting the Z-axis, inputting the X-axis, inputting the Y-axis, outputting the Z-axis, outputting the X-axis, and outputting the Y-axis.
[0014] As a further improvement to the technical solution of the present invention, the positional distance A between the FA fiber core and the left side of the chip is detected by the leftward displacement of the input θX axis, and the positional distance B between the FA fiber core and the right side of the chip is detected by the rightward displacement of the input θX axis. The coupling software calculates the horizontal position based on the positional relationship between A and B, and the stepper motor drives the input component to automatically move to a position parallel to the chip.
[0015] As a further improvement to the technical solution of the present invention, the position distance C between the FA fiber core and the left side of the chip is detected by the leftward displacement of the output θX axis, and the position distance D between the FA fiber core and the right side of the chip is detected by the rightward displacement of the output θX axis. The coupling software calculates the horizontal position based on the positional relationship between C and D, and the stepper motor drives the output component to automatically move to a position parallel to the chip.
[0016] As a further improvement to the technical solution of the present invention, the travel of the input Z-axis is 30mm; the travel of the input X-axis and the input Y-axis is 20mm; and the travel of the input θZ-axis, input θX-axis, and input θY-axis is ±8°.
[0017] As a further improvement to the technical solution of the present invention, the travel of the output Z-axis is 30mm; the travel of the output X-axis and the output Y-axis is 20mm; and the travel of the output θZ-axis, output θX-axis and output θY-axis is ±8°.
[0018] As a further improvement to the technical solution of the present invention, the accuracy of both the input ranging sensor and the output ranging sensor is ±0.1µm.
[0019] The beneficial effects of this invention are:
[0020] This invention employs a high-precision stepper motor in conjunction with a high-precision nanometer-level sensing sensor to detect distance. Through a coupling software algorithm, it automatically adjusts the angle with an accuracy of ±1µm. This is integrated into an automatic light-aligning platform, achieving high-precision, low-cost, fully automatic planar waveguide coupling. Furthermore, it fully realizes high-precision automatic angle adjustment, representing a technological innovation. This invention improves the accuracy of planar waveguide coupling for light alignment and solves the industry-wide problem of automatic angle adjustment. Compared to conventional visual methods, the accuracy is directly improved by 2µm. In the optical communication industry, especially in future laser coupling, silicon photonics chip technology coupling completely replaces expensive foreign equipment and plays a crucial role. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the planar structure of a fully automated planar waveguide coupling device based on nanoscale sensing contact, according to an embodiment of the present invention.
[0022] Figure 2 This is one of the three-dimensional structural schematic diagrams of a fully automated planar waveguide coupling device based on nanoscale sensing contact according to an embodiment of the present invention;
[0023] Figure 3 This is the second three-dimensional structural schematic diagram of a fully automated planar waveguide coupling device based on nanoscale sensing contact according to an embodiment of the present invention.
[0024] In the attached diagram: 1-Chip placement assembly; 2-Input assembly; 3-Output assembly; 11-Chip fixture; 12-Chip mounting base; 21-Input Z-axis; 22-Input X-axis; 23-Input Y-axis; 24-Input θZ-axis; 25-Input θX-axis; 26-Input θY-axis; 27-Input distance sensor; 28-Input moving guide rail; 29-Input fixture; 31-Output Z-axis; 32-Output X-axis; 33-Output Y-axis; 34-Output θZ-axis; 35-Output θX-axis; 36-Output θY-axis; 37-Output distance sensor; 38-Output moving guide rail; 39-Output fixture. Detailed Implementation
[0025] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.
[0026] It should be noted that all directional indicators (such as up, down, left, right, front, back, upper end, lower end, top, bottom, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0027] In this invention, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0028] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination should be considered non-existent and not within the scope of protection claimed by this invention.
[0029] like Figures 1 to 3 As shown, a fully automated planar waveguide coupling device based on nanoscale sensing contact includes a chip placement component 1 and an input component 2 and an output component 3 symmetrically arranged on the left and right sides. Each of the input component 2 and the output component 3 is driven by a stepper motor. The stepper motor is electrically connected to a driver. The coupling software controls the driver to drive the stepper motors to move the input component 2 and the output component 3 in different directions, achieving mode field matching between the FA fiber core and the chip waveguide, thus achieving initial alignment of the optical waveguide. The coupling software automatically switches the displacement step size, achieving precise alignment again through the input component 2 and the output component 3. The coupling software controls the driver to control the step size and movement of the angle stepper motor to achieve multi-channel equalization.
[0030] Specifically, in this embodiment, the input component 2 includes an input Z-axis 21, an input X-axis 22, an input Y-axis 23, an input θZ-axis 24, an input θX-axis 25, an input θY-axis 26, an input ranging sensor 27, an input moving guide rail 28, and an input clamp 29. The input Z-axis 21 is connected to the input X-axis 22; the input X-axis 22 is connected to the input θZ-axis 24; the input θZ-axis 24 is connected to the input Y-axis 23; the input Y-axis 23 is connected to the input θX-axis 25; the input θX-axis 25 is connected to the input θY-axis 26; the input ranging sensor 27 and the input moving guide rail 28 are respectively mounted on the input θX-axis 25; the input clamp 29 is mounted on the input moving guide rail 28; and the FA fiber core is fixed on the input clamp 29.
[0031] Specifically, in this embodiment, the output component 3 includes an output Z-axis 31, an output X-axis 32, an output Y-axis 33, an output θZ-axis 34, an output θX-axis 35, an output θY-axis 36, an output ranging sensor 37, an output moving guide rail 38, and an output clamp 39. The output Z-axis 31 is connected to the output X-axis 32; the output X-axis 32 is connected to the output θZ-axis 34; the output θZ-axis 34 is connected to the output Y-axis 33; the output Y-axis 33 is connected to the output θX-axis 35; the output θX-axis 35 is connected to the output θY-axis 36; the output ranging sensor 37 and the output moving guide rail 38 are respectively mounted on the output θX-axis 35; the output clamp 39 is mounted on the output moving guide rail 38; and the FA fiber core is fixed on the output clamp 39.
[0032] Specifically, in this embodiment, the chip placement assembly 1 includes a chip clamp 11 and a chip mounting base 12; the chip clamp 11 is disposed on top of the chip mounting base 12; the chip is placed on the chip clamp 11. In this invention, the input FA is fixed on the input clamp 29, and the chip is fixed on the chip clamp 11. A stepper motor makes micro-step movements to contact the chip to be coupled. When the FA contacts the chip, the input moving guide rail 28 is displaced. At this time, the input ranging sensor 27 detects the distance of the displacement and feeds it back to the computer coupling software.
[0033] Specifically, in this embodiment, the coupling software controls the stepper motor to automatically adjust the angle and distance between the FA fiber core and the chip. The thickness of the adhesive layer is accurately controlled by measuring the distance through the input ranging sensor 27 and the output ranging sensor 37. The coupling software algorithm automatically and quickly finds the coupling position between the FA fiber core and the chip by inputting the Z-axis 21, inputting the X-axis 22, inputting the Y-axis 23, outputting the Z-axis 31, outputting the X-axis 32, and outputting the Y-axis 33.
[0034] This invention controls the movement of a stepper motor with various step sizes via a coupling software-controlled driver, with the step size set to 1µm. First, the chip is fixed on the chip fixture 11. The stepper motor achieves mode field matching between the FA (fiber optic array) core and the chip waveguide through displacement in three different directions (XYZ axes) of the input and output components 3, thus achieving initial alignment of the optical waveguide. After initial alignment, the coupling software automatically switches the displacement step size to 0.05µm, and precise alignment is achieved again through displacement along the XYZ axes. The coupling software controls the driver to control the step size and movement of the angle stepper motor to achieve multi-channel equalization. The specific steps are as follows:
[0035] Step 1: Select the channels at both ends as the optical power detection channels, where any channel is the center channel for mode field coupling;
[0036] Step 2: Align the center channel using a single-channel mode-field coupling method:
[0037] Step 3: Scan the axis and calculate the extreme offset ε and tilt angle S of the two channels according to the formula; if ε is less than the given threshold (let's assume 0.2 μm), then proceed to step 5;
[0038] Step 4: Drive the six-dimensional alignment platform, adjust angle S, and return to step 2;
[0039] Step 5: Stop.
[0040] The coupling software controls a stepper motor to automatically adjust the angle and distance between the fiber optic array (FA) core and the chip, and uses a distance sensor to precisely control the adhesive layer thickness. Through the XYZ axes and software algorithms, the coupling position between the FA and the chip is automatically and quickly located, and the signal is automatically optimized to its best state. Throughout the process, personnel only need to install the materials on the tooling fixture of the coupling platform; the equipment automatically adjusts the parallel waveguide alignment and maximizes the optical power coupling value. Currently, automatic angle adjustment in the market is basically calculated by visual imaging, with a maximum accuracy of only ±3µm. This invention uses a high-precision nanometer-level sensing sensor to detect the distance, and the coupling software algorithm automatically adjusts the angle with an accuracy of ±1µm, integrating this into an automatic optical alignment platform to achieve high-precision, low-cost, fully automatic planar waveguide coupling.
[0041] Specifically, in this embodiment, the distance A between the FA fiber core and the left side of the chip is detected by displacing the input θX axis 25 to the left, and the distance B between the FA fiber core and the right side of the chip is detected by displacing the input θX axis 25 to the right. The coupling software calculates the horizontal position based on the positional relationship between A and B, and the stepper motor drives the input component 2 to automatically move to a position parallel to the chip.
[0042] Specifically, in this embodiment, the distance C between the FA fiber core and the left side of the chip is detected by displacing the output θX axis 35 to the left, and the distance D between the FA fiber core and the right side of the chip is detected by displacing the output θX axis 35 to the right. The coupling software calculates the horizontal position based on the positional relationship between C and D, and the stepper motor drives the output component 3 to automatically move to a position parallel to the chip. The input component 2 automatically scans to the maximum optical power via the input XY axis, and the output component 3 automatically scans to the maximum optical power via the output XY axis.
[0043] Specifically, in this embodiment, the travel of the input Z-axis 21 is 30mm; the travel of the input X-axis 22 and the input Y-axis 23 is 20mm; and the travel of the input θZ-axis 24, the input θX-axis 25, and the input θY-axis 26 is ±8°.
[0044] Specifically, in this embodiment, the travel of the output Z-axis 31 is 30mm; the travel of the output X-axis 32 and the output Y-axis 33 is 20mm; and the travel of the output θZ-axis 34, output θX-axis 35, and output θY-axis 36 is ±8°.
[0045] Specifically, in this embodiment, the accuracy of both the input ranging sensor 27 and the output ranging sensor 37 is ±0.1µm.
[0046] This invention presents a fully automated coupling system that achieves fully automatic optical coupling and nanometer-level position measurement, ensuring the required coupling accuracy. The invention introduces a docking coupling method for planar waveguide devices and determines whether the stepper motor is in the optimal position by monitoring the loss during optical waveguide coupling. Firstly, the hardware circuit adopts an analog control structure, using a PD to collect optical power and feed it back to the software to control the motor movement, achieving positioning in the XYZ directions and automatic adjustment of the θXYZ angles. Mechanically, tooling fixtures connect the motors, ensuring the optical axis rotation center point, and the coupling fixtures are designed according to the position and size of the devices and proximity sensors. The software and control algorithms employ genetic algorithms and hill-climbing algorithms, combined with high-precision stepper motors, to achieve optical power coupling to the optimal position. The entire process requires only personnel to install materials; the equipment is unattended, achieving fully automated, high-precision optical coupling.
[0047] The device of this invention has the following advanced features: (1) unattended fully automatic coupling; (2) high system stability and repeatability; (3) adhesive layer thickness error within 1µm; (4) single device coupling time within 60 seconds; (5) automatic angle calibration; (6) automatic UV curing; (7) automatic abnormal status alarm feedback.
[0048] The beneficial effects of this invention are:
[0049] This invention employs a high-precision stepper motor in conjunction with a high-precision nanometer-level sensing sensor to detect distance. Through a coupling software algorithm, it automatically adjusts the angle with an accuracy of ±1µm. This is integrated into an automatic light-aligning platform, achieving high-precision, low-cost, fully automatic planar waveguide coupling. Furthermore, it fully realizes high-precision automatic angle adjustment, representing a technological innovation. This invention improves the accuracy of planar waveguide coupling for light alignment and solves the industry-wide problem of automatic angle adjustment. Compared to conventional visual methods, the accuracy is directly improved by 2µm. In the optical communication industry, especially in future laser coupling, silicon photonics chip technology coupling completely replaces expensive foreign equipment and plays a crucial role.
[0050] The technical solutions provided by the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of the present invention. The descriptions of the embodiments above are only for helping to understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.
Claims
1. A fully automated planar waveguide coupling device based on nanoscale sensing contact, comprising a chip placement assembly and an input assembly and an output assembly symmetrically arranged on the left and right sides; wherein the input assembly and the output assembly are respectively drivenly connected to stepper motors, characterized in that: The stepper motor is electrically connected to a driver; the coupling software controls the driver to drive the stepper motor to move the input component and the output component in different directions, realizing mode field matching between the FA fiber core and the chip waveguide, thereby achieving initial alignment of the optical waveguide. The coupling software automatically switches the displacement step size, and then achieves precise alignment again through the input and output components; the coupling software controls the driver to control the step size and movement of the angle stepper motor to achieve multi-channel equalization; the input component includes an input Z-axis, an input X-axis, an input Y-axis, an input θZ-axis, an input θX-axis, an input θY-axis, an input ranging sensor, an input moving guide rail, and an input fixture. The FA fiber core is fixed to the input... The FA fiber core is fixed on the clamp; the output component includes an output Z-axis, an output X-axis, an output Y-axis, an output θZ-axis, an output θX-axis, an output θY-axis, an output ranging sensor, an output moving guide rail, and an output clamp. The accuracy of the input ranging sensor and the output ranging sensor is ±0.1um. The coupling software controls the stepper motor to automatically adjust the angle and distance between the FA fiber core and the chip. The thickness of the adhesive layer is accurately controlled by measuring the distance through the input ranging sensor and the output ranging sensor. The distance is detected by the displacement of the input θX-axis and the output θX-axis, and the horizontal position is calculated. The input component and the output component are driven to automatically move to a position parallel to the chip.
2. The fully automated planar waveguide coupling device based on nanoscale sensing contact according to claim 1, characterized in that: The input Z-axis is connected to the input X-axis; the input X-axis is connected to the input θZ-axis; the input θZ-axis is connected to the input Y-axis; the input Y-axis is connected to the input θX-axis; the input θX-axis is connected to the input θY-axis; the input ranging sensor and the input moving guide rail are respectively mounted on the input θX-axis; the input clamp is mounted on the input moving guide rail.
3. The fully automated planar waveguide coupling device based on nanoscale sensing contact according to claim 1, characterized in that: The output Z-axis is connected to the output X-axis; the output X-axis is connected to the output θZ-axis; the output θZ-axis is connected to the output Y-axis; the output Y-axis is connected to the output θX-axis; the output θX-axis is connected to the output θY-axis; the output ranging sensor and the output moving guide rail are respectively mounted on the output θX-axis; the output clamp is mounted on the output moving guide rail.
4. The fully automated planar waveguide coupling device based on nanoscale sensing contact according to claim 1, characterized in that: The chip placement assembly includes a chip clamp and a chip mounting base; the chip clamp is disposed on top of the chip mounting base; the chip is placed on the chip clamp.
5. The fully automated planar waveguide coupling device based on nanoscale sensing contact according to claim 1, characterized in that: The travel of the input Z-axis is 30mm; the travel of the input X-axis and the input Y-axis is 20mm; the travel of the input θZ-axis, input θX-axis, and input θY-axis is ±8°.
6. The fully automated planar waveguide coupling device based on nanoscale sensing contact according to claim 5, characterized in that: The output Z-axis has a travel of 30mm; the output X-axis and the output Y-axis both have a travel of 20mm; the output θZ-axis, output θX-axis, and output θY-axis all have a travel of ±8°.