Flexible interferometric modulation display device and method of fabricating the same

Abstract

The application discloses a flexible interference adjustment type display device and a manufacturing method thereof. The display device comprises: a deformable reflective conductive layer arranged on the side of a semi-transparent conductive layer away from a flexible substrate, a first support structure arranged between the deformable reflective conductive layer and the semi-transparent conductive layer, and the first support structure is used for supporting the deformable reflective conductive layer, so that the deformable reflective conductive layer and the semi-transparent conductive layer have a gap; and a flexible encapsulation layer attached to the surface of a second support structure away from the flexible substrate, the flexible encapsulation layer is used for encapsulating the semi-transparent conductive layer and the deformable reflective conductive layer, and the second support structure is used for supporting the flexible encapsulation layer, so that the flexible encapsulation layer and the deformable reflective conductive layer have a gap. The application provides a flexible and bendable interference adjustment type display device, and the requirement of diversified use of users is met.

Description

Technical Field

[0001] This invention relates to the field of interference-adjustable display technology, and in particular to a flexible interference-adjustable display device and its manufacturing method. Background Technology

[0002] Reflective displays include electronic paper, reflective liquid crystal displays, and interferometric modulation displays. Among them, reflective displays based on interferometric modulator display (IMOD) mode utilize microcavities to control the absorption and reflection of light in specific wavelengths, thereby achieving display effects by controlling the reflection of ambient light.

[0003] Interference-adjustable displays have the following advantages: 1) They feature low driving voltage and can achieve steady-state operation, consuming power only when switching displays, resulting in extremely low power consumption; 2) They have a very fast refresh rate, even suitable for video playback; typically, reflective electronic paper displays have slow pixel movement, leading to slow refresh rates and an inability to display dynamic images. Interference-adjustable displays, however, have extremely fast pixel response times, resulting in no ghosting in video playback; 3) Interference-adjustable displays do not require backlights, relying on reflected external light sources like common e-books and print magazines, allowing for better matching with ambient light and protecting eyesight. Furthermore, their pixel colors are rich, and their resolution is close to that of a high-quality print magazine, with excellent readability even in sunlight.

[0004] Although interference-adjustable displays have the advantages mentioned above, existing interference-adjustable displays cannot be bent and cannot meet the diverse usage requirements of users. Summary of the Invention

[0005] This invention provides a flexible interference-adjustable display device and its manufacturing method, so as to provide a flexible and bendable interference-adjustable display device to meet the diverse usage requirements of users.

[0006] According to one aspect of the present invention, a flexible interference-adjustable display device is provided, comprising:

[0007] A flexible substrate and a semi-transparent conductive layer and a deformable reflective conductive layer disposed on the flexible substrate;

[0008] The deformable reflective conductive layer is disposed on the side of the semi-permeable conductive layer away from the flexible substrate. A first support structure is disposed between the deformable reflective conductive layer and the semi-permeable conductive layer. The first support structure is used to support the deformable reflective conductive layer, so that there is a gap between the deformable reflective conductive layer and the semi-permeable conductive layer.

[0009] The deformable reflective conductive layer is further provided with a second support structure and a flexible encapsulation layer on the side away from the flexible substrate.

[0010] The flexible encapsulation layer is attached to the surface of the second support structure away from the flexible substrate. The flexible encapsulation layer is used to encapsulate the semi-transparent conductive layer and the deformable reflective conductive layer. The second support structure is used to support the flexible encapsulation layer, so that there is a gap between the flexible encapsulation layer and the deformable reflective conductive layer.

[0011] Optionally, the vertical projection of the second support structure onto the deformable reflective conductive layer is located within the vertical projection of the first support structure onto the deformable reflective conductive layer.

[0012] Optionally, the height of the second support structure is greater than or equal to 5 micrometers.

[0013] Optionally, the vertical projection of the second support structure onto the deformable reflective conductive layer coincides with the vertical projection of the first support structure onto the deformable reflective conductive layer.

[0014] Alternatively, the second support structure may include a plurality of support columns arranged around the gap between the deformable reflective conductive layer and the semi-transparent conductive layer.

[0015] Optionally, the flexible encapsulation layer includes a raised structure on the surface adjacent to the flexible substrate, and the raised structure is bonded together with the second support structure.

[0016] Optionally, an adhesive layer is provided on the surface of the flexible encapsulation layer adjacent to the second support structure, and the flexible encapsulation layer is attached to the surface of the second support structure through the adhesive layer;

[0017] The thickness of the adhesive layer is less than the height of the second support structure.

[0018] Optionally, the adhesive layer may contain a desiccant.

[0019] Optionally, the flexible interference-adjustable display device includes multiple strip-shaped deformable reflective conductive layers and multiple strip-shaped semi-transparent conductive layers; each of the deformable reflective conductive layers extends along a first direction, the multiple deformable reflective conductive layers are arranged sequentially along a second direction, each of the semi-transparent conductive layers extends along the second direction, the multiple semi-transparent conductive layers are arranged sequentially along the first direction, wherein the first direction and the second direction intersect each other.

[0020] The position where the deformable reflective conductive layer overlaps with each half of the translucent conductive layer forms a light-emitting unit.

[0021] Optionally, the flexible encapsulation layer includes a metal layer and / or an inorganic layer.

[0022] Optionally, the flexible substrate includes an ultrathin glass or a polyimide substrate;

[0023] When the flexible substrate includes a polyimide substrate, the display device further includes a barrier layer;

[0024] The barrier layer is disposed on the surface of the flexible substrate adjacent to the semi-permeable conductive layer, and the barrier layer covers the flexible substrate, the barrier layer being used to block water and oxygen.

[0025] Optionally, the flexible interferometric adjustment type display device also includes:

[0026] The light-absorbing structure comprises a first transparent insulating layer, a second transparent insulating layer, and an etching barrier layer.

[0027] The light-absorbing structure is disposed on one side of the flexible substrate adjacent to the semi-transparent conductive layer, and the light-absorbing structure is grid-shaped; the vertical projection of the first support structure on the flexible substrate is located within the vertical projection of the light-absorbing structure on the flexible substrate.

[0028] The first transparent insulating layer is disposed between the light-absorbing structure and the semi-transparent conductive layer, and the first transparent insulating layer covers the light-absorbing structure and the flexible substrate;

[0029] The second transparent insulating layer and the etching barrier layer are disposed between the semi-permeable conductive layer and the first support structure. The etching barrier layer is disposed on the side of the second transparent insulating layer adjacent to the first support structure. The second transparent insulating layer covers the semi-permeable conductive layer, and the etching barrier layer covers the second transparent insulating layer.

[0030] According to another aspect of the present invention, a method for manufacturing a flexible interference-adjustable display device is provided, comprising:

[0031] A semi-permeable conductive layer, a first support structure, and a deformable reflective conductive layer are sequentially disposed on the surface of a flexible substrate; wherein, the deformable reflective conductive layer is disposed on the side of the semi-permeable conductive layer away from the flexible substrate, and the first support structure is disposed between the deformable reflective conductive layer and the semi-permeable conductive layer, the first support structure being used to support the deformable reflective conductive layer, thereby creating a gap between the deformable reflective conductive layer and the semi-permeable conductive layer.

[0032] A second support structure is provided on the side of the deformable reflective conductive layer away from the flexible substrate;

[0033] A flexible encapsulation layer is attached to the surface of the second support structure away from the flexible substrate. The flexible encapsulation layer is used to encapsulate the semi-transparent conductive layer and the deformable reflective conductive layer. The second support structure is used to support the flexible encapsulation layer, so that there is a gap between the flexible encapsulation layer and the deformable reflective conductive layer.

[0034] Optionally, the vertical projection of the second support structure onto the deformable reflective conductive layer is located within the vertical projection of the first support structure onto the deformable reflective conductive layer.

[0035] The flexible interference-adjustable display device provided in this embodiment of the invention includes a flexible substrate and a semi-transparent conductive layer and a deformable reflective conductive layer disposed on the flexible substrate. A second support structure and a flexible encapsulation layer are further disposed on the side of the deformable reflective conductive layer away from the flexible substrate. The flexible encapsulation layer is attached to the surface of the second support structure away from the flexible substrate. The second support structure supports the flexible encapsulation layer, creating a gap between the flexible encapsulation layer and the deformable reflective conductive layer. In other words, the flexible interference-adjustable display device of this embodiment of the invention uses a flexible substrate and a flexible encapsulation layer, achieving flexibility and bendability. Furthermore, the second support structure supports the flexible encapsulation layer, creating a gap between the flexible encapsulation layer and the deformable reflective conductive layer. This prevents the flexible encapsulation structure from scratching the deformable reflective conductive layer and minimizes its impact on the attraction and separation between the deformable reflective conductive layer and the semi-transparent conductive layer.

[0036] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of a flexible interference-adjustable display device provided in an embodiment of the present invention;

[0039] Figure 2 This is a top view of a deformable reflective conductive layer and a semi-transparent conductive layer provided in an embodiment of the present invention;

[0040] Figure 3 This is an overall diagram of a flexible interference-adjustable display device provided in an embodiment of the present invention;

[0041] Figure 4 This is a partial top view of a flexible interference-adjustable display device provided in an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of another flexible interference adjustment type display device provided in an embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of another flexible interference adjustment type display device provided in an embodiment of the present invention;

[0044] Figure 7 This is a flowchart of a method for manufacturing a flexible interference-adjustable display device according to an embodiment of the present invention. Detailed Implementation

[0045] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0046] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0047] This invention provides a flexible interferometric adjustment type display device. Figure 1 This is a schematic diagram of a flexible interference-adjustable display device provided in an embodiment of the present invention, with reference to... Figure 1 Flexible interferometric adjustment type display devices include:

[0048] Flexible substrate 10 and a semi-permeable conductive layer 20 and a deformable reflective conductive layer 30 disposed on the flexible substrate 10;

[0049] A deformable reflective conductive layer 30 is disposed on the side of the semi-permeable conductive layer 20 away from the flexible substrate 10. A first support structure 40 is disposed between the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20. The first support structure 40 is used to support the deformable reflective conductive layer 30, so that there is a gap between the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20.

[0050] The deformable reflective conductive layer 30 is further provided with a second support structure 50 and a flexible encapsulation layer 60 on the side away from the flexible substrate 10.

[0051] The flexible encapsulation layer 60 is attached to the surface of the second support structure 50 away from the flexible substrate 10. The flexible encapsulation layer 60 is used to encapsulate the semi-transparent conductive layer 20 and the deformable reflective conductive layer 30. The second support structure 50 is used to support the flexible encapsulation layer 60, so that there is a gap between the flexible encapsulation layer 60 and the deformable reflective conductive layer 30.

[0052] The flexible substrate 10 can be a substrate made of organic materials or ultrathin glass. The semi-transparent conductive layer 20 can be made of Mo / Al or NiAl materials, and the deformable reflective conductive layer 30 can be made of Al and / or Ni materials. For example, the deformable reflective conductive layer 30 can include an Al layer and a Ni layer.

[0053] The gap between the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20 forms an optical microcavity. This optical microcavity selectively emits ambient light incident from the flexible substrate 10, allowing only light of a specific wavelength to exit from the flexible substrate 10. The first support structure 40 creates multiple gaps between the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20. At each gap, the deformable reflective conductive layer 30, the semi-transparent conductive layer 20, and the gap itself form a light-emitting unit 11. The height of the gaps can be changed by adjusting the height of the first support structure 40, thereby changing the cavity length of the light-emitting unit and thus altering the wavelength of the light emitted from that unit. The display device of this embodiment can include light-emitting units of one color, or it can include light-emitting units of two or more different colors. That is, in this embodiment, the height of the first support structure 40 can remain constant, using the same height for all units. In this case, the display device includes light-emitting units of one color. Alternatively, the first support structure 40 can use two or more different heights to correspondingly form light-emitting units of two or more different colors. Figure 1 The illustration shows only one light-emitting unit 11 as an example and is not intended to limit the invention.

[0054] also, Figure 2 This is a top view of a deformable reflective conductive layer and a semi-transparent conductive layer 20 provided in an embodiment of the present invention, with reference to... Figure 2Optionally, the display device may include multiple strip-shaped deformable reflective conductive layers 30 and multiple strip-shaped semi-transparent conductive layers 20. Each deformable reflective conductive layer 30 extends along a first direction Y, and the multiple deformable reflective conductive layers 30 are arranged sequentially along a second direction X. Each semi-transparent conductive layer 20 extends along the second direction X, and the multiple semi-transparent conductive layers 20 are arranged sequentially along the first direction Y, wherein the first direction Y and the second direction X intersect each other. The overlapping positions of the deformable reflective conductive layer 30 and each semi-transparent conductive layer 20 correspond to the formation of a light-emitting unit 11. For example, the second direction X can be a row direction, and the first direction Y can be a column direction.

[0055] refer to Figure 1 and Figure 2 The switching on / off control of the light-emitting unit 11 can be achieved by energizing or de-energizing the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20. For example, when an electrical signal is applied to the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20, the deformable reflective conductive layer 30 deforms and adheres to the semi-permeable conductive layer 20, eliminating the gap between them and thus preventing light emission from the corresponding light-emitting unit 11, thereby turning off the light-emitting unit 11. When light emission is required, no electrical signal is applied to the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20, leaving a gap between them and allowing the light-emitting unit 11 to emit light. Alternatively, the light-emitting unit 11 can emit light when energized and be turned off when de-energized by adhering to the deformable reflective conductive layer 30 to the semi-permeable conductive layer 20.

[0056] The second support structure 50 and the first support structure 40 can be made of the same material or different materials. The vertical projection of the second support structure 50 onto the deformable reflective conductive layer 30 can partially overlap with the vertical projection of the first support structure 40 onto the deformable reflective conductive layer 30. For example, the vertical projection of the second support structure 50 onto the deformable reflective conductive layer 30 is located within the vertical projection of the first support structure 40 onto the deformable reflective conductive layer 30, which can avoid the second support structure 50 having a significant impact on the attraction and separation of the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20.

[0057] The flexible encapsulation layer 60 is used to block water and oxygen, preventing water vapor and oxygen from affecting the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20. The flexible encapsulation layer 60 can extend from the surface of the second support structure 50 to the side of the display device, covering the various film layers inside the display device at the side of the display device. Figure 3 This is an overall diagram of a flexible interference-adjustable display device provided in an embodiment of the present invention, which is exemplary and can be referenced. Figure 3The flexible encapsulation layer 60 can wrap the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20, etc., of the internal film layers of the display device together with the flexible substrate 10.

[0058] The second support structure 50 is used to support the flexible encapsulation layer 60, so that there is a gap between the flexible encapsulation layer 60 and the deformable reflective conductive layer 30, so as to prevent the flexible encapsulation layer 60 from affecting the attraction and separation of the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20, and to prevent the flexible encapsulation layer 60 from scratching the deformable reflective conductive layer 30.

[0059] The flexible interference-adjustable display device provided in this embodiment of the invention includes a flexible substrate 10 and a semi-transparent conductive layer 20 and a deformable reflective conductive layer 30 disposed on the flexible substrate 10. A second support structure 50 and a flexible encapsulation layer 60 are further disposed on the side of the deformable reflective conductive layer 30 away from the flexible substrate 10. The flexible encapsulation layer 60 is attached to the surface of the second support structure 50 away from the flexible substrate 10. The second support structure 50 supports the flexible encapsulation layer 60, creating a gap between the flexible encapsulation layer 60 and the deformable reflective conductive layer 30. In other words, the flexible interference-adjustable display device of this embodiment of the invention uses a flexible substrate 10 and a flexible encapsulation layer 60, achieving flexibility and bendability. Furthermore, the second support structure 50 supports the flexible encapsulation layer 60, creating a gap between the flexible encapsulation layer 60 and the deformable reflective conductive layer 30, preventing the flexible encapsulation layer 60 from scratching the deformable reflective conductive layer 30 and minimizing its impact on the attraction and separation between the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20.

[0060] Optionally, the vertical projection of the second support structure 50 onto the deformable reflective conductive layer 30 is located within the vertical projection of the first support structure 40 onto the deformable reflective conductive layer 30, which can prevent the second support structure 50 from having a significant impact on the attraction and separation of the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20.

[0061] Optionally, the height of the second support structure 50 is greater than or equal to 5 micrometers.

[0062] Specifically, if the height of the second support structure 50 is too small, the flexible encapsulation layer 60 may come into contact with the deformable reflective conductive layer 30 during and after the application of the flexible encapsulation layer 60, which may scratch the deformable reflective conductive layer 30 and affect its performance. Setting the height of the second support structure 50 to be greater than or equal to 5 micrometers can avoid affecting the deformable reflective conductive layer 30 during and after the application of the flexible encapsulation layer 60.

[0063] For example, the height of the second support structure 50 can be set to a few micrometers, tens of micrometers, or hundreds of micrometers as needed. For instance, the height of the second support structure 50 can be 10 micrometers, 30 micrometers, 50 micrometers, 100 micrometers, 200 micrometers, 300 micrometers, or 500 micrometers, etc.

[0064] Optionally, the vertical projection of the second support structure 50 onto the deformable reflective conductive layer 30 coincides with the vertical projection of the first support structure 40 onto the deformable reflective conductive layer 30; or, the second support structure 50 includes a plurality of support columns 51, which are arranged around the gap between the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20.

[0065] Specifically, when the vertical projection of the second support structure 50 onto the deformable reflective conductive layer 30 coincides with the vertical projection of the first support structure 40 onto the deformable reflective conductive layer 30, the second support structure 50 can provide better support for the flexible encapsulation layer 60. Furthermore, the second support structure 50 and the first support structure 40 can be fabricated using the same mask, reducing process costs.

[0066] also, Figure 4 This is a partial top view of a flexible interferometric adjustment type display device provided in an embodiment of the present invention, with reference to... Figure 4 The second support structure 50 may include multiple support pillars 51. The multiple support pillars 51 are arranged around the gap between the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20. In this way, the multiple support pillars 51 can also provide good support for the flexible encapsulation layer 60. Moreover, the contact area between the support pillars 51 and the deformable reflective conductive layer 30 is small, which can better avoid the support pillars 51 affecting the attraction and separation of the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20.

[0067] For example, each of the four corners of the light-emitting unit 11 is provided with a support post 51 to better support the flexible encapsulation layer 60.

[0068] Figure 5 This is a schematic diagram of another flexible interference-adjustable display device provided in an embodiment of the present invention. Optional, refer to... Figure 5 The flexible encapsulation layer 60 has a raised structure 61 on the surface adjacent to the flexible substrate 10, and the raised structure 61 is bonded together with the second support structure 50.

[0069] Specifically, the protrusion structure 61 protrudes outward toward the flexible substrate 10 relative to other areas of the flexible encapsulation layer 60. By bonding the protrusion structure 61 to the second support structure 50, the distance between the area of ​​the flexible encapsulation layer 60 other than the protrusion structure 61 and the deformable reflective conductive layer 30 is equal to the sum of the height of the second support structure 50 and the height of the protrusion structure 61. This makes the distance between the area of ​​the flexible encapsulation layer 60 other than the protrusion structure 61 and the deformable reflective conductive layer 30 greater, thus better preventing the flexible encapsulation layer 60 from scratching the deformable reflective conductive layer 30.

[0070] Optional, see reference Figure 5 A flexible encapsulation layer 60 is provided with an adhesive layer 70 on the surface adjacent to the second support structure 50. The flexible encapsulation layer 60 is attached to the surface of the second support structure 50 through the adhesive layer 70, and the thickness of the adhesive layer 70 is less than the height of the second support structure 50.

[0071] Specifically, the flexible encapsulation layer 60 is attached to the surface of the second support structure 50 through the adhesive layer 70. The process is simple and does not easily damage the deformable reflective conductive layer 30.

[0072] After the adhesive layer 70 is attached to the surface of the second support structure 50, it will undergo a certain deformation. If the adhesive layer 70 is too thick, it may stick to the deformable reflective conductive layer 30 after it is attached to the second support structure 50, thereby scratching the deformable reflective conductive layer 30. Setting the thickness of the adhesive layer 70 to be less than the height of the second support structure 50 can prevent the adhesive layer 70 from scratching the deformable reflective conductive layer 30.

[0073] The higher the height of the second support structure 50, the thicker the adhesive layer 70 can be. For example, when the height of the second support structure 50 is 5 micrometers, the thickness of the adhesive layer 70 can be set to less than 3 micrometers; when the height of the second support structure 50 is tens of micrometers, the thickness of the adhesive layer 70 can be set to tens of micrometers; and when the height of the second support structure 50 is greater than or equal to 50 micrometers, the thickness of the adhesive layer 70 can be set to 20-30 micrometers.

[0074] Optionally, a desiccant is incorporated into the adhesive layer 70. The desiccant can absorb moisture that enters the gap between the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20, preventing moisture from affecting the adhesion and separation between the deformable reflective conductive layer 30 and the semi-permeable conductive layer 20.

[0075] Optionally, the flexible encapsulation layer 60 may include a metal layer and / or an inorganic layer.

[0076] Specifically, both metals and inorganic materials have good water and oxygen barrier properties. The flexible encapsulation layer 60 adopts a water and oxygen barrier layer such as a metal layer or an inorganic layer, which can better meet the requirements for water and oxygen barrier performance.

[0077] It should be noted that this embodiment only illustrates, by way of example, that the flexible encapsulation layer 60 includes a metal layer and / or an inorganic layer, and is not intended to limit this embodiment. In other embodiments, the flexible encapsulation layer 60 may also include an organic layer.

[0078] Optionally, the flexible substrate 10 includes an ultrathin glass or polyimide substrate;

[0079] Figure 6 This is a schematic diagram of another flexible interference-adjustable display device provided in an embodiment of the present invention. Optional, refer to... Figure 6 When the flexible substrate 10 includes a polyimide substrate, the display device further includes a barrier layer 80; the barrier layer 80 is disposed on the surface of the flexible substrate 10 adjacent to the semi-permeable conductive layer 20, and the barrier layer 80 covers the flexible substrate 10, and the barrier layer 80 is used to block water and oxygen.

[0080] Specifically, both ultra-thin glass and polyimide substrates have good flexibility and mature technology. Using ultra-thin glass or polyimide substrates for the flexible substrate 10 can reduce the cost of the display device and make the display device more flexible.

[0081] In addition, by setting the barrier layer 80, water and oxygen can be prevented from entering the display device from the flexible substrate 10, and the deformable reflective conductive layer 30 and the semi-transparent conductive layer 20 can be better prevented from being affected by water and oxygen. The barrier layer 80 may include alternating SiOx layers and SiNx layers, which can be prepared by chemical vapor deposition (CVD) process.

[0082] Optional, see reference Figure 6 The display device also includes:

[0083] The light-absorbing structure 90, the first transparent insulating layer 100, the second transparent insulating layer 110, and the etching barrier layer 120;

[0084] The light-absorbing structure 90 is disposed on one side of the flexible substrate 10 adjacent to the semi-transparent conductive layer 20, and the light-absorbing structure 90 is in the form of a grid; the vertical projection of the first support structure 40 on the flexible substrate 10 is located within the vertical projection of the light-absorbing structure 90 on the flexible substrate 10.

[0085] The first transparent insulating layer 100 is disposed between the light-absorbing structure 90 and the semi-transparent conductive layer 20, and the first transparent insulating layer 100 covers the light-absorbing structure 90 and the flexible substrate 10.

[0086] The second transparent insulating layer 110 and the etching barrier layer 120 are disposed between the semi-permeable conductive layer 20 and the first support structure 40. The etching barrier layer 120 is disposed on the side of the second transparent insulating layer 110 adjacent to the first support structure 40. The second transparent insulating layer 110 covers the semi-permeable conductive layer 20, and the etching barrier layer 120 covers the second transparent insulating layer 110.

[0087] The light-absorbing structure 90 is used to absorb ambient light, preventing incident ambient light from escaping. The light-absorbing structure 90 is arranged around each light-emitting unit and is used to define the light-emitting unit, separating adjacent light-emitting units. The light-absorbing structure 90 can be made of Mo / Al.

[0088] Both the first transparent insulating layer 100 and the second transparent insulating layer 110 can be made of insulating materials such as silicon oxide and / or silicon nitride. The first transparent insulating layer 100 is used to insulate between the light-absorbing structure 90 and the semi-transparent conductive layer 20, and is used to include the light-absorbing structure 90.

[0089] The etching barrier layer 120 can be fabricated using materials such as AlOx. The etching barrier layer 120 is used to prevent damage to the second transparent insulating layer 110 during the etching process in fabricating the first support structure 40, including the film layers such as the second transparent insulating layer 110. For example, in fabricating the first support structure 40, a sacrificial layer is first formed on the surface of the second transparent insulating layer 110, and the sacrificial layer is imaged. Then, a transparent insulating layer is fabricated, and the transparent insulating layer is imaged. Finally, the sacrificial layer is removed, and the remaining transparent insulating layer is the first support structure 40. The etching barrier layer 120 is used to prevent damage to the second transparent insulating layer 110 during the fabrication and removal of the sacrificial layer.

[0090] Furthermore, it should be noted that, to increase the conductivity of the semi-permeable conductive layer 20, a conductive layer 130 can also be prepared on the semi-permeable conductive layer 20. For example, the vertical projection of the conductive layer 130 on the flexible substrate 10 can be positioned within the vertical projection of the first support structure 40 on the flexible substrate 10.

[0091] This invention also provides a method for manufacturing a flexible interference-adjustable display device. Figure 7 This is a flowchart illustrating a method for manufacturing a flexible interferometric adjustment display device according to an embodiment of the present invention. (Refer to...) Figure 7 The method includes:

[0092] S110. A semi-permeable conductive layer, a first support structure, and a deformable reflective conductive layer are sequentially disposed on the surface of a flexible substrate; wherein, the deformable reflective conductive layer is disposed on the side of the semi-permeable conductive layer away from the flexible substrate, the first support structure is disposed between the deformable reflective conductive layer and the semi-permeable conductive layer, and the first support structure is used to support the deformable reflective conductive layer, so that there is a gap between the deformable reflective conductive layer and the semi-permeable conductive layer.

[0093] S120. A second support structure is provided on the side of the deformable reflective conductive layer away from the flexible substrate.

[0094] S130. A flexible encapsulation layer is attached to the surface of the second support structure away from the flexible substrate. The flexible encapsulation layer is used to encapsulate the semi-transparent conductive layer and the deformable reflective conductive layer. The second support structure is used to support the flexible encapsulation layer, so that there is a gap between the flexible encapsulation layer and the deformable reflective conductive layer.

[0095] Optionally, the vertical projection of the second support structure onto the deformable reflective conductive layer lies within the vertical projection of the first support structure onto the deformable reflective conductive layer.

[0096] For details, please refer to Figure 5 The specific manufacturing process of the display device may include:

[0097] A Mo / Al layer is deposited on a flexible substrate 10 using ultrathin glass, and this layer is fabricated into a grid layer as a light-absorbing structure 90. A first transparent insulating layer 100 (which can be an insulating material such as silicon oxide or silicon nitride) is deposited on the above pattern, and a semi-transparent metal layer is deposited on the first transparent insulating layer 100 to form a semi-transparent conductive layer 20. This layer can be made of Mo / Al or NiAl material, and the metal layer is fabricated into a strip extending along the row direction.

[0098] Based on the above pattern, a second transparent insulating layer 110 (which can be an insulating material such as silicon oxide or silicon nitride) is deposited, and AlOx is deposited on the above layer as an etch barrier layer 120. A partial opening is made in the etch barrier layer 120, which is used to set up connection structures such as pads or connecting lines for bonding external circuit boards.

[0099] Based on the above layers, a sacrificial layer (e.g., Mo, Si, etc.) is deposited and etched; this layer is then patterned. For color or multi-color screens (display devices include light-emitting units of at least two colors), this layer requires multiple depositions and etchings. A transparent insulating layer is deposited on the sacrificial layer and patterned. Based on this layer, a deformable reflective conductive layer is deposited (the deformable reflective conductive layer can be Al, Ni, etc.).

[0100] Finally, a sacrificial layer etching is performed to form the first support structure 40. At the corresponding positions of the first support structure at the four corners of the light-emitting unit, a second support structure 50 with a height >5µm is further fabricated using a coating, exposure, and etching process. This support pillar is responsible for attaching to the subsequent thin-film encapsulation layer, preventing the subsequent encapsulation layer from scratching the deformable reflective conductive layer.

[0101] Finally, a flexible encapsulation layer is applied to the support surface of the second support structure 50. This flexible encapsulation layer contains an adhesive film with a desiccant component inside. The thickness of the adhesive film is less than 3 μm to prevent damage to the second support structure 50. Finally, the screen body is thinned, polished, and slit to obtain an independent display device.

[0102] In addition, refer to Figure 6 When fabricating a display device using a PI substrate on the flexible substrate 10, a PI layer is first coated onto a glass or plastic substrate. After the PI layer is cured, SiOx and SiNx layers are alternately deposited using CVD to form a barrier layer 80. Then, other structures such as a light-absorbing structure 90 are fabricated. After the flexible encapsulation layer 60 is attached, the PI layer is peeled off from the substrate using laser peeling or mechanical peeling to obtain a flexible interferometric adjustable display screen. Finally, the large board is slit to obtain individual display devices.

[0103] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0104] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A flexible interference-adjustable display device, characterized in that, include: A flexible substrate and a semi-transparent conductive layer and a deformable reflective conductive layer disposed on the flexible substrate; The deformable reflective conductive layer is disposed on the side of the semi-permeable conductive layer away from the flexible substrate. A first support structure is disposed between the deformable reflective conductive layer and the semi-permeable conductive layer. The first support structure is used to support the deformable reflective conductive layer, so that there is a gap between the deformable reflective conductive layer and the semi-permeable conductive layer. The deformable reflective conductive layer is further provided with a second support structure and a flexible encapsulation layer on the side away from the flexible substrate; the vertical projection of the second support structure on the deformable reflective conductive layer is located within the vertical projection of the first support structure on the deformable reflective conductive layer. The flexible encapsulation layer is attached to the surface of the second support structure away from the flexible substrate. The flexible encapsulation layer is used to encapsulate the semi-transparent conductive layer and the deformable reflective conductive layer. The second support structure is used to support the flexible encapsulation layer, so that there is a gap between the flexible encapsulation layer and the deformable reflective conductive layer.

2. The flexible interferometric adjustment type display device according to claim 1, characterized in that: The height of the second support structure is greater than or equal to 5 micrometers.

3. The flexible interferometric adjustment type display device according to claim 2, characterized in that: The vertical projection of the second support structure onto the deformable reflective conductive layer coincides with the vertical projection of the first support structure onto the deformable reflective conductive layer. Alternatively, the second support structure may include a plurality of support columns arranged around the gap between the deformable reflective conductive layer and the semi-transparent conductive layer.

4. The flexible interferometric adjustment type display device according to claim 1, characterized in that: The flexible encapsulation layer includes a raised structure on the surface adjacent to the flexible substrate, and the raised structure is bonded together with the second support structure.

5. The flexible interference adjustment type display device according to claim 1, characterized in that: An adhesive layer is disposed on the surface of the flexible encapsulation layer adjacent to the second support structure, and the flexible encapsulation layer is attached to the surface of the second support structure through the adhesive layer; The thickness of the adhesive layer is less than the height of the second support structure; The adhesive layer contains a desiccant.

6. The flexible interferometric adjustment type display device according to claim 1, characterized in that: The flexible interference-adjustable display device includes multiple strip-shaped deformable reflective conductive layers and multiple strip-shaped semi-transparent conductive layers; each of the deformable reflective conductive layers extends along a first direction, the multiple deformable reflective conductive layers are arranged sequentially along a second direction, each of the semi-transparent conductive layers extends along the second direction, the multiple semi-transparent conductive layers are arranged sequentially along the first direction, wherein the first direction and the second direction intersect each other. The position where the deformable reflective conductive layer overlaps with each half of the transparent conductive layer forms a light-emitting unit.

7. The flexible interferometric adjustment type display device according to claim 1, characterized in that: The flexible encapsulation layer includes a metal layer and / or an inorganic layer; The flexible substrate includes an ultrathin glass or a polyimide substrate; When the flexible substrate includes a polyimide substrate, the display device further includes a barrier layer; The barrier layer is disposed on the surface of the flexible substrate adjacent to the semi-permeable conductive layer, and the barrier layer covers the flexible substrate, the barrier layer being used to block water and oxygen.

8. The flexible interferometric adjustment type display device according to claim 1, characterized in that... It also includes: The light-absorbing structure comprises a first transparent insulating layer, a second transparent insulating layer, and an etching barrier layer. The light-absorbing structure is disposed on one side of the flexible substrate adjacent to the semi-transparent conductive layer, and the light-absorbing structure is grid-shaped; the vertical projection of the first support structure on the flexible substrate is located within the vertical projection of the light-absorbing structure on the flexible substrate. The first transparent insulating layer is disposed between the light-absorbing structure and the semi-transparent conductive layer, and the first transparent insulating layer covers the light-absorbing structure and the flexible substrate; The second transparent insulating layer and the etching barrier layer are disposed between the semi-permeable conductive layer and the first support structure. The etching barrier layer is disposed on the side of the second transparent insulating layer adjacent to the first support structure. The second transparent insulating layer covers the semi-permeable conductive layer, and the etching barrier layer covers the second transparent insulating layer.

9. A method for manufacturing a flexible interference-adjustable display device, characterized in that, include: A semi-permeable conductive layer, a first support structure, and a deformable reflective conductive layer are sequentially disposed on the surface of a flexible substrate; wherein, the deformable reflective conductive layer is disposed on the side of the semi-permeable conductive layer away from the flexible substrate, and the first support structure is disposed between the deformable reflective conductive layer and the semi-permeable conductive layer, the first support structure being used to support the deformable reflective conductive layer, thereby creating a gap between the deformable reflective conductive layer and the semi-permeable conductive layer. A second support structure is provided on the side of the deformable reflective conductive layer away from the flexible substrate; the vertical projection of the second support structure on the deformable reflective conductive layer is located within the vertical projection of the first support structure on the deformable reflective conductive layer. A flexible encapsulation layer is attached to the surface of the second support structure away from the flexible substrate. The flexible encapsulation layer is used to encapsulate the semi-transparent conductive layer and the deformable reflective conductive layer. The second support structure is used to support the flexible encapsulation layer, so that there is a gap between the flexible encapsulation layer and the deformable reflective conductive layer.

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