Thermal relaxation method for monochromator crystals

Abstract

The application provides a heat relief method for a monochromator crystal, which comprises: a clamping assembly and a cooling base cooperating to clamp a non-light-receiving area of a crystal body and a heat exchange medium; a cooling liquid is introduced into a cooling channel on the cooling base; and an incident light is irradiated on a light-receiving area of the crystal body. In the application, the thickness of the non-light-receiving area is greater than that of the light-receiving area, and the two non-light-receiving areas can play a role in strengthening the structure and heat exchange of the light-receiving area, improving the cooling efficiency and strengthening the anti-warping ability of the crystal body; the heat absorbed by the crystal body can be transferred to the cooling base by the heat exchange medium and taken away by the cooling liquid circulating in the cooling channel, thereby effectively cooling the crystal body. The heat relief method can significantly improve the structural rigidity and anti-warping ability of the crystal body, maintain a high surface shape precision under high heat load, and be suitable for thin spectroscopic crystals.

Description

Technical Field

[0001] This application belongs to the field of thermal slow-release technology of synchrotron radiation optical elements, and more specifically, relates to a thermal slow-release method for monochromator crystals. Background Technology

[0002] The monochromator is one of the core components of a synchrotron radiation beamline, playing a crucial role in the selection and modulation of photon energy during beam transmission. Diamond possesses excellent optical and thermal properties, making it irreplaceable in the field of low-emissivity, diffraction-limited synchrotron radiation optics. In beamline transmission systems, monochromators using diamond crystals with a thickness of 50μm-300μm can improve beamline utilization and user productivity. However, during operation, the diamond crystal is subjected to a high thermal load from X-rays, causing its temperature to rise and its internal temperature gradient to increase. This leads to thermal deformation of the diamond crystal, thereby reducing the excellent optical performance of the diffraction-limited light source.

[0003] To mitigate the problem of thermal deformation in diamond crystals, existing heat-relieving methods include CVD (Chemical Vapor Deposition) patches, single-sided trapezoidal groove clamping, CVD spring clamping, and welding. These methods primarily improve the heat transfer efficiency and radiation damage resistance of the monochromator diamond crystal through appropriate cooling mechanisms and clamping designs. However, these methods are only suitable for diamond crystals with a certain thickness (>1 mm). For thinner diamond crystals (less than 100 μm thick), defects such as easy warping under thermal load and difficulty in controlling surface accuracy still occur. Summary of the Invention

[0004] The purpose of this application is to provide a heat-release method for monochromator crystals to solve the problem that current heat-release methods cannot solve the problem that thin diamond crystals (thickness less than 100μm) are prone to warping and the surface accuracy is difficult to control.

[0005] To achieve the above objectives, the technical solution adopted in the embodiments of this application is as follows:

[0006] A method for sustained heat release of a monochromator crystal is provided, comprising:

[0007] The clamping assembly works with the cooling base to clamp the non-light-receiving area and heat exchange medium of the crystal body;

[0008] Cooling liquid is introduced into the cooling channel on the cooling base to achieve thermal contact between the cooling base, the heat exchange medium and the crystal body;

[0009] Incident light is irradiated onto the light-receiving area of ​​the crystal body, and the two non-light-receiving areas play a role in strengthening the structure and heat transfer of the light-receiving area, so as to achieve precise control of the surface shape of the crystal body.

[0010] The light-receiving area is located between the two non-light-receiving areas, and the thickness of the light-receiving area is less than the thickness of each of the non-light-receiving areas; the heat exchange medium is located between the cooling base and the crystal body.

[0011] In this structure, the thickness of the non-light-receiving area is greater than that of the light-receiving area. These two non-light-receiving areas strengthen the structure and heat transfer of the light-receiving area, improving cooling efficiency and enhancing the crystal's resistance to warping. The clamping assembly brings the non-light-receiving area of ​​the crystal into contact with the heat exchange medium. The heat absorbed by the crystal is transferred to the cooling base by the heat exchange medium and carried away by the circulating cooling liquid in the cooling channel, effectively cooling the crystal. Therefore, this heat-releasing method significantly improves the structural stiffness and warping resistance of the crystal, maintaining high surface accuracy under high heat loads, and is suitable for thinner spectroscopic crystals.

[0012] In one embodiment, a groove is provided on at least one side of the light-receiving area, and the two ends of the groove are inclined to the bottom surface.

[0013] This structure allows for a thinner light-receiving area of ​​the crystal body through slotting, making it suitable for thinner spectroscopic crystals (within 100μm in thickness).

[0014] In one embodiment, the thickness of the light-receiving area irradiated by the incident light is less than or equal to 300 μm.

[0015] This structure further maintains high surface accuracy and can be applied to thinner spectroscopic crystals.

[0016] In one embodiment, the heat exchange medium is in the form of a sheet; the clamping assembly includes a clamping cooling seat disposed opposite to the cooling base, the clamping cooling seat cooperating with the cooling base to clamp one of the non-light-receiving areas of the crystal body.

[0017] This structure, through the clamping and engagement of the cooling seat and the cooling base, enables double-sided heat exchange of the crystal body.

[0018] In one embodiment, there are two heat exchange media, which are respectively disposed on two opposing sides of the clamping cooling seat and the cooling base. One side of a non-light-receiving area of ​​the crystal body is attached to one of the heat exchange media, and the other side of a non-light-receiving area of ​​the crystal body is attached to the other heat exchange media.

[0019] This structure, by setting two heat exchange media, can enhance the heat exchange of the crystal body; moreover, the heat exchange media can isolate the hard contact between the clamping cooling seat and the crystal body, which can further reduce the passive deformation effect of mechanical fixation on the crystal body.

[0020] In one embodiment, the clamping cooling seat is provided with cooling pipes.

[0021] This structure helps to improve the cooling effect on the crystal body.

[0022] In one embodiment, the heat exchange medium is in a liquid state, and the cooling base has a receiving groove for accommodating the heat exchange medium; the clamping assembly includes a clamping piece for clamping one of the non-light-receiving areas of the crystal body and a support base for supporting the clamping piece, and the other non-light-receiving area of ​​the crystal body extends into the heat exchange medium.

[0023] This structure uses clamping plates to hold and fix one non-light-receiving area, while the other non-light-receiving area can extend into the heat exchange medium to achieve heat exchange, thereby realizing the single-sided suspension and fixation of the crystal body. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A three-dimensional structural diagram of the heat-releasing structure provided as a comparative example of this application. Figure 1 ;

[0026] Figure 2 A three-dimensional structural diagram of the heat-releasing structure provided as a comparative example of this application. Figure 2 ;

[0027] Figure 3 This is a three-dimensional structural diagram of the heat-releasing structure of the monochromator crystal provided in Embodiment 1 of this application;

[0028] Figure 4 for Figure 3 A schematic diagram of the decomposition process;

[0029] Figure 5 This is a three-dimensional structural diagram of the crystal body provided in Embodiment 1 of this application;

[0030] Figure 6 This is a three-dimensional structural diagram of the heat-releasing structure of the monochromator crystal provided in Embodiment 2 of this application;

[0031] Figure 7 for Figure 6 Enlarged view of point A in the middle;

[0032] Figure 8 This is a graph showing the relationship between deformation and meridional distance in the comparative examples of this application;

[0033] Figure 9 This is a graph showing the relationship between deformation and meridional distance in Embodiment 1 of this application.

[0034] Figure 10 This is a graph showing the relationship between deformation and meridional distance in Embodiment 2 of this application;

[0035] Figure 11 This is a graph showing the relationship between the slope of the surface and the distance in the meridional direction in the comparative examples of this application;

[0036] Figure 12 This is a graph showing the relationship between the slope of the surface and the distance in the meridional direction in Embodiment 1 of this application.

[0037] Figure 13 This is a graph showing the relationship between the slope of the surface and the distance in the meridional direction in Embodiment 2 of this application.

[0038] The main markings in the attached figures are as follows:

[0039] 1. Crystal body; 11. Non-light-receiving area; 12. Light-receiving area; 121. Groove;

[0040] 2. Cooling base; 21. Long groove; 22. Positioning welding groove; 23. Cooling channel; 24. Receiving groove;

[0041] 3. Heat exchange medium; 31. Indium foil; 32. Indium gallium liquid alloy;

[0042] 4. Clamping assembly; 41. Clamping cooling seat; 411. Cooling pipe; 42. Clamping plate; 43. Support seat; 431. First base; 432. Second base; 433. Abutment; 44. Base; 441. Clamping seat; 45. Elastic element; 46. Cooling pipe. Detailed Implementation

[0043] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0044] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.

[0046] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, and not all refer to the same embodiment. Furthermore, in one or more embodiments, particular features, structures, or characteristics may be combined in any suitable manner.

[0049] Comparative example:

[0050] Currently, diamond crystals with a thickness of 50 micrometers (μm) to 300 micrometers (μm) are used for beam splitting in beamline transmission systems. For the heat-controlled release of this diamond crystal, a welded structure is commonly used, such as... Figure 1 and Figure 2 The heat-releasing structure is shown. The cooling base 2 can be roughly square in shape, with a long groove 21 formed in the center of its top surface. The length of the long groove 21 can be set along the length or width of the cooling base 2. A positioning welding groove 22 for accommodating and positioning the crystal body 1 is formed on the bottom surface of the cooling base 2. A light-transmitting hole communicating with the long groove 21 is formed on the bottom surface of the positioning welding groove 22. The crystal body 1 is positioned directly opposite the light-transmitting hole, and its periphery is welded to the bottom surface of the positioning welding groove 22. Cooling channels 23 are formed on both sides of the long groove 21 on the cooling base 2. Cooling water is introduced into each cooling channel 23 to achieve heat exchange.

[0051] The crystal body 1 can be a diamond crystal, with dimensions of 5 mm long × 5 mm wide × 0.05 mm thick. The cooling base 2 can be made of copper, with dimensions of 20 mm long × 30 mm wide × 5 mm thick. The light-transmitting hole can be 4.5 mm long × 3 mm wide; the elongated groove 21 can be a beveled groove, meaning that the two ends of the light-transmitting hole and the two ends of the elongated groove 21 form a slope, with an inclination angle of 13° between the slope and the horizontal plane. The cross-section of each cooling channel 23 can be circular, with a diameter of 4 mm to 8 mm. The cooling water flowing into each cooling channel 23 can be at a temperature of 30°C, with a flow rate of 1-2 L / min, and can be deionized water. The crystal body 1 and the cooling base 2 are connected by welding. The solder can be 0.5Cu (Cuprum, copper)-3.0Ag (Argentum, silver)-Sn (Stannum, tin), and the welding temperature can be 900℃.

[0052] In the comparative example, the crystal body 1 was welded to the cooling base 2 by welding. The high temperature generated by welding itself will cause some damage to the crystal body 1. Moreover, for thin diamond crystals (thickness within 100μm), there will still be defects such as easy warping under heat load and difficulty in controlling surface accuracy.

[0053] Based on this, this application provides a method for sustained heat release in monochromator crystals. This method employs a sustained heat release structure to solve the aforementioned technical problems, and is described in detail with reference to the sustained heat release structures given in Embodiments 1 and 2. Of course, the sustained heat release method for monochromator crystals provided in this application can be adapted to various operating conditions, and is not limited to the two sustained heat release structures given in Embodiments 1 and 2; therefore, it is not considered the only one.

[0054] Example 1:

[0055] Please see Figures 3 to 5 The heat-relieving structure of the monochromator crystal provided in Embodiment 1 of this application will now be described. This heat-relieving structure includes a crystal body 1, a cooling base 2, a heat exchange medium 3, and a clamping assembly 4. The crystal body 1 may have a square structure, specifically having two non-light-receiving areas 11 and a light-receiving area 12 disposed between the two non-light-receiving areas 11. The two non-light-receiving areas 11 may have the same length and thickness, with one non-light-receiving area 11 having a wider width than the other, in order to increase the contact area with the heat exchange medium 3 and improve the heat exchange effect. The thickness of the light-receiving area 12 is less than the thickness of each non-light-receiving area 11, allowing light to pass through. Because the two non-light-receiving areas 11 at both ends of the light-receiving area 12 are designed to be thicker, this can strengthen the structure of the light-receiving area 12, improving its anti-warping ability, that is, improving the overall anti-warping ability of the crystal body 1. The crystal body 1 can be a diamond crystal, with dimensions of length (8mm-15mm) × width (8mm-15mm) × thickness (0.05mm-1mm). To improve the anti-warping performance of the diamond crystal and considering the cost, the diamond crystal used in this application can have dimensions of length (10mm-15mm) × width (10mm-15mm) × thickness (0.8mm-1.2mm). Specific crystal planes, such as (111), (110), (100), and (220), can be selected as optical diffraction planes according to requirements. The optical diffraction plane is the reciprocal ratio of the intercept coefficients of the crystal plane on the three crystallographic axes. After converting to integer ratios, the three integers obtained are called the Miller indices of the crystal plane. The thickness of the light-receiving area 12 can range from 0.03mm to 0.3mm.

[0056] The cooling base 2 has a cooling channel 23, through which a cooling liquid, gas, or other cooling medium can be introduced to achieve heat exchange. Alternatively, a cooling water pipe can be installed in the cooling channel 23, through which a cooling liquid flows. The cooling base 2 can be made of OFHC (Oxygen-Free High Conductivity) copper with a purity of 99% or higher, and its dimensions can be length (20mm-30mm) × width (20mm-30mm) × thickness (20mm-30mm). The cross-section of the cooling channel 23 can be circular, with a diameter ranging from 6mm to 10mm. In this application, the diameter of the cooling channel 23 can be 8mm, and the flow rate of the cooling liquid flowing through the cooling channel 23 can be 0-5m / s, without being limited to a single value.

[0057] The heat exchange medium 3 is disposed on the cooling base 2. The heat exchange medium 3 can be of two types: one type can be a solid sheet structure, such as indium foil 31; the other type can be a liquid, such as indium gallium liquid alloy 32. These two different heat exchange media 3 are described in Examples 1 and 2, respectively, for detailed explanation.

[0058] The clamping assembly 4 is connected to the crystal body 1 and is used to bring a non-light-receiving area 11 into contact with the heat exchange medium 3. The clamping assembly 4 can adopt different structures to fix the crystal body 1, such as the clamping and fixing structure in Embodiment 1, the single-sided suspension and fixing structure in Embodiment 2, etc., and is not limited to one specific structure here.

[0059] In this structure, the thickness of the non-light-receiving region 11 is greater than the thickness of the light-receiving region 12. The two non-light-receiving regions 11 strengthen the structure and heat transfer of the light-receiving region 12, improving cooling efficiency and enhancing the anti-warping capability of the crystal body 1. The clamping assembly 4 allows the non-light-receiving region 11 of the crystal body 1 to contact the heat exchange medium 3. The heat absorbed by the crystal body 1 can be transferred from the heat exchange medium 3 to the cooling base 2 and carried away by the circulating cooling liquid in the cooling channel 23, effectively cooling the crystal body 1. Therefore, this heat-releasing structure significantly improves the structural stiffness and anti-warping capability of the crystal body 1, maintaining high surface accuracy under high heat loads, and is suitable for thinner spectroscopic crystals (thickness within 100 μm). The spectroscopic crystal can be a diamond crystal.

[0060] In one embodiment, see Figure 5As a specific embodiment of the heat-releasing structure of the monochromator crystal provided in Embodiment 1 of this application, a groove 121 is formed on at least one side of the light-receiving area 12. That is, the groove 121 can be formed on one side of the light-receiving area 12, or it can be formed on two mutually opposite sides of the light-receiving area 12. This application adopts the method of forming grooves 121 on both sides of the light-receiving area 12. With this structure, the light-receiving area 12 of the crystal body 1 can be made thinner by slotting, so as to adapt to the thin diamond crystal (thickness within 100μm).

[0061] The light-receiving area 12 employs a rectangular beveled groove processing scheme, with the groove formed within a ±2° angle deviation from the incident direction of the light path. Specifically, the two ends of the groove 121 are inclined towards the bottom surface. Here, the two ends of the groove 121 refer to the two opposite sides of the groove 121, and the bottom surface refers to the bottom surface of the groove 121. Preferably, picosecond laser processing technology is used, with the groove position offset to one side, and the boundary of one side of the groove 121 being 1mm from the edge of the monochromator. The two ends of the groove 121 are sloped surfaces, and the angle between the slope and the horizontal plane between the two ends and the middle of the groove 121 can be 13°. 13° is a specific Bragg diffraction angle for diamond crystals, which can be considered one of several operating conditions. If the beam is incident at other angles, the groove angle should be basically consistent with the beam incident angle, allowing a deviation of approximately ±2°. Typically, the incident angle of the light source in a diamond monochromator is relatively small. Under such circumstances, the non-light-receiving areas 11 at both ends are more likely to block the light path. The optimal slotting angle should be the same as the incident angle of the beam, and a tolerance range of ±2° is reserved here. If the slotting angle is too large, the non-light-receiving areas 11 at both ends will become smaller, which is not conducive to enhancing heat transfer and controlling the thermal warp of the diamond crystal. Conversely, if the slotting angle is too small, the effective optical area reserved in the middle will be too small (the size of the diamond crystal is inherently difficult to make large), resulting in insufficient reserved spot size and projection tolerance.

[0062] In one embodiment, the effective light-receiving area is preserved to the maximum extent possible while avoiding obstruction of the oblique incident light path. An effective light-receiving area is reserved at the light-receiving position (i.e., the bottom surface of the groove 121), and the dimensions of this effective light-receiving area can be length (7mm-13mm) × width (2.5mm-4mm) × thickness (0.03mm-0.1mm). This reserved effective light-receiving area is essentially the maximum light-receiving area that can be retained in the diamond crystal, excluding the non-light-receiving areas 11 at both ends and the area of ​​the clamping component 4. Specifically, the dimensions of the effective light-receiving area in this application can be 7.5mm long × 4mm wide × 0.05mm thick.

[0063] In one embodiment, see Figure 3 and Figure 4In one specific embodiment of the heat-relieving structure for the monochromator crystal provided in Embodiment 1 of this application, the heat exchange medium 3 is sheet-shaped; the clamping assembly 4 includes a clamping cooling seat 41 disposed opposite to the cooling base 2, which can cooperate with the cooling base 2 to clamp a non-light-receiving area 11 of the crystal body 1. With this structure, when the clamping cooling seat 41 cooperates with the cooling base 2 to clamp the crystal body 1, a non-light-receiving area 11 of the crystal body 1 is in close contact with the heat exchange medium 3, so as to transfer the heat of the crystal body 1 to the cooling base 2 through the heat exchange medium 3, thereby improving the heat exchange efficiency. Furthermore, the heat exchange medium 3 isolates the hard contact between the cooling base 2 and the crystal body 1, reducing the passive deformation effect of the mechanical fixing action on the crystal body 1.

[0064] In one embodiment, the width of the non-light-receiving area 11 that contacts the heat exchange medium 3 is greater than the width of the other non-light-receiving area 11. That is, the wider non-light-receiving area 11 can be clamped and fixed by the clamping cooling seat 41 and the cooling base 2. The width of the wider non-light-receiving area 11 can be 5 mm, of which 4 mm can contact the heat exchange medium 3 to achieve heat exchange.

[0065] In one embodiment, the heat exchange medium 3 may be an indium foil 31 with an In purity of over 90%. In this application, the indium foil 31 may have dimensions of 25 mm in length × 7.5 mm in width × 0.125 mm in thickness.

[0066] In one embodiment, see Figure 3 and Figure 4 In one specific embodiment of the heat-relieving structure for the monochromator crystal provided in Embodiment 1 of this application, there are two heat exchange media 3. One heat exchange media 3 can be installed on the side of the cooling base 2 facing the clamping cooling seat 41, and the other heat exchange media 3 can be installed on the side of the clamping cooling seat 41 facing the cooling base 2. The two sides of the non-light-receiving area 11, which is clamped and fixed by the cooling base 2 and the clamping cooling seat 41, can be respectively attached to the two heat exchange media 3. This structure, by setting two heat exchange media 3, can enhance the heat transfer to the crystal body 1; moreover, the heat exchange media 3 can isolate the hard contact between the clamping cooling seat 41 and the crystal body 1, which can further reduce the passive deformation effect of mechanical fixation on the crystal body 1.

[0067] In one embodiment, the clamping force between the cooling base 2 and the clamping cooling base 41 can be 0.1 MPa-1 MPa. The thermal deformation of diamond crystals can be fundamentally divided into three parts: localized thermal expansion and bulging, thermal warping, and passive deformation caused by the constraint of the fixing mechanism on thermal expansion and contraction. Since diamond crystals have a low thickness (≤100 μm), they can be considered a two-dimensional structure. That is, in this cooling system, the diamond crystal undergoes primarily passive deformation, followed by thermal warping, while the localized thermal bulging can be ignored.

[0068] In one embodiment, see Figure 3 As a specific embodiment of the heat-relieving structure for the monochromator crystal provided in Embodiment 1 of this application, a cooling channel 411 is provided on the clamping cooling base 41. The clamping cooling base 41 can be the aforementioned cooling base 2, and both can be made of OFHC copper. The cooling channel 23 has the same size and function as the cooling channel 411. This structure, by providing the cooling base 2 and the clamping cooling base 41, and by providing the cooling channel 23 on the cooling base 2 and the cooling channel 23 on the clamping cooling base 41, helps to improve the cooling effect on the crystal body 1.

[0069] In some embodiments, four cooling bases 2 can be used to clamp and fix the crystal body 1, that is, two cooling bases 2 clamp one non-light-receiving area 11, two cooling bases 2 clamp another non-light-receiving area 11, and a heat exchange medium 3 (i.e., indium foil 31) is provided between each non-light-receiving area 11 and the cooling base 2. In this way, the heat exchange effect on the crystal body 1 can be further improved and the heat release effect can be enhanced.

[0070] Example 2:

[0071] Please see Figure 6 and Figure 7 The heat-releasing structure of the monochromator crystal provided in Embodiment 2 of this application will now be described. The heat-releasing structure of the monochromator crystal provided in Embodiment 2 differs from that provided in Embodiment 1 in the following ways: In the heat-releasing structure of the monochromator crystal provided in Embodiment 2, the heat exchange medium 3 is liquid, and a receiving groove 24 for accommodating the heat exchange medium 3 is formed on the top surface of the cooling base 2. The clamping assembly 4 includes a clamping piece 42 for clamping one non-light-receiving area 11 of the crystal body 1 and a support base 43 for supporting the clamping piece 42. The other non-light-receiving area 11 of the crystal body 1 extends into the heat exchange medium 3. The clamping piece 42 can be located above the cooling base 2, and can be a clamping spring piece. Multiple clamping pieces can be used, and they can be installed on the support base 43 using screws or other fasteners to improve the clamping and fixing effect on the crystal body 1. In this structure, one non-light-receiving area 11 is clamped and fixed by the clamping plate 42, while the other non-light-receiving area 11 can extend into the heat exchange medium 3 to achieve heat exchange, thereby realizing the single-sided suspension and fixation of the crystal body 1.

[0072] In one embodiment, the receiving tank 24 may be a cuboid tank with dimensions of length (12mm-20mm) × width (2mm-5mm) × thickness (2mm-10mm). The receiving tank 24 used in this application has dimensions of 20mm length × 3mm width × 4mm thickness. The heat exchange medium 3 poured into the receiving tank 24 may be indium gallium liquid alloy 32, with a pouring depth ranging from 2mm to 10mm. In this application, the indium gallium liquid alloy 32 can extend 3.5mm into the tank. The composition ratio of the indium gallium liquid alloy 32 may be: In (Indium) (60-70), Ga (Gallium) (20-25), Sn (Stannum) (10-20). The composition ratio of the indium gallium liquid alloy 32 used in this application may be: In62, Ga22, Sn16. The crystal body 1 is suspended above the receiving groove 24, and the non-light-receiving area 11 below the crystal body 1 extends into the heat exchange medium 3 to a depth of 2mm-5mm. In this application, the non-light-receiving area 11 below the crystal body 1 extends into the heat exchange medium 3 to a depth of 3mm.

[0073] In one embodiment, see Figure 6 As a specific embodiment of the heat-relieving structure for the monochromator crystal provided in Embodiment 2 of this application, the support base 43 includes a first base 431 and a second base 432, with a clamping member 433 movably mounted on the second base 432. The first base 431 may include a first base plate and a first vertical plate connected to the first base plate, with the first vertical plate vertically mounted on the first base plate. The second base 432 may include a second base plate and a second vertical plate connected to the second base plate. The first base plate and the second vertical plate are made of the same plate and form an L-shape. The first base plate is mounted on the first vertical plate using screws or other fasteners, and the second vertical plate is mounted on the first base plate using screws or other fasteners. The first and second vertical plates are parallel and spaced apart to form a receiving cavity, in which the cooling base 2 can be installed. The clamping member 433 can be movably mounted on the second vertical plate. The clamping member 433 can be a bolt, and correspondingly, a screw hole for the bolt to pass through is provided on the second vertical plate. The length of the bolt extending into the accommodating cavity can be adjusted by rotating the bolt to achieve contact between the clamping member 433 and the cooling base 2, thereby achieving clamping and fixing of the cooling base 2.

[0074] In one embodiment, see Figure 6 As a specific embodiment of the heat-relieving structure for the monochromator crystal provided in Embodiment 2 of this application, the heat-relieving structure for the monochromator crystal further includes a base 44 and elastic elements 45. The base 44 can be installed on the bottom of the first base plate of the support 43; the number of elastic elements 45 can be multiple, vertically connecting the base 44 and the first base plate of the support 43. The elastic elements 45 can be springs, etc. In this structure, the base 44 and the elastic elements 45 form an elastic adjustment mechanism, which can satisfy the attitude correction of the monochromator within a small spatial range.

[0075] In one embodiment, see Figure 6 As a specific embodiment of the heat-relieving structure for a monochromator crystal provided in Embodiment 2 of this application, the heat-relieving structure for the monochromator crystal further includes a cooling pipe 46 installed in the cooling channel 23, with both ends of the cooling pipe 46 extending out of the cooling base 2; clamping seats 441 are respectively installed at both ends of the base 44, and both ends of the cooling pipe 46 are respectively installed in the two clamping seats 441. Each clamping seat 441 may include a clamping base installed on the base 44 and a clamping top seat (not shown) installed on the clamping base, with a hole reserved between the clamping base and the clamping top seat for the cooling pipe 46 to pass through. The clamping base and the clamping top seat cooperate to clamp and limit the cooling pipe 46. This structure, through the clamping seats 441, can clamp and limit the cooling pipe 46, preventing the cooling pipe 46 from causing the cooling base 2 to shift position.

[0076] The crystal body 1 in the heat-release structure of the monochromator crystal provided in Embodiment 2 of this application has the same structure as the crystal body 1 provided in Embodiment 1 above, and will not be described in detail here.

[0077] This application also provides a method for sustained heat release of a monochromator crystal, employing the sustained heat release structure of the monochromator crystal provided in Embodiments 1 and 2 above, including:

[0078] The clamping assembly 4 cooperates with the cooling base 2 to clamp the non-light-receiving area 11 of the crystal body 1 and the heat exchange medium 3.

[0079] Cooling liquid is introduced into the cooling channel 23 on the cooling base 2 to achieve thermal contact between the cooling base 2, the heat exchange medium 3, and the crystal body 1. Alternatively, cooling liquid can be introduced directly into the cooling channel 23, or a cooling water pipe can be installed in the cooling channel 23, through which cooling liquid is introduced. The cooling liquid can be cooling water.

[0080] Incident light is irradiated onto the light-receiving area 12 of the crystal body 1. The two non-light-receiving areas 11 play a role in strengthening the structure and heat transfer of the light-receiving area 12, so as to achieve precise control of the surface shape of the crystal body 1.

[0081] The light-receiving area 12 is located between two non-light-receiving areas 11, and the thickness of the light-receiving area 12 is less than the thickness of each non-light-receiving area 11; the heat exchange medium 3 is located between the cooling base 2 and the crystal body 1.

[0082] To demonstrate the performance of the heat-releasing structure of the monochromator crystal provided in this application, this application employs the aforementioned heat-releasing method of the monochromator crystal and conducts comparative experiments on the comparative examples, Example 1, and Example 2. The specific load conditions are as follows: white light incident angle (H×V) (representing the imaging size, where H is the number of horizontal pixels * pixel side length, and V is the number of vertical pixels * pixel side length): 0.027 × 0.027 mrad (milli-radians), grazing Bragg incident angle of 13.7°, and the light spot size projected onto the monochromator surface of 3.8 mm × 0.9 mm. The light beam undergoes both reflection and transmission through the diamond crystal, with both reflection and transmission angles at 13.7°. The total incident power is 14 W, the total absorbed power of the crystal is 2 W, and the maximum power density at perpendicular incidence is 18 W / mm². 2 The maximum actual absorbed power density of the vertical optical path cross section is 2.55 W / mm². 2 .

[0083] The finite element method was used to simulate and calculate the slope error of the surface along the meridional direction. The calculation parameters are shown in Table 1 and Table 2, respectively.

[0084] Table 1 Material Performance Parameters

[0085]

[0086]

[0087] Table 2 Heat transfer coefficients of the interfacial film

[0088] interface <![CDATA[Film heat transfer coefficient (W m -1 K -1 )]]> Diamond / OFHC indium foil (indium foil interlayer) 3000 Diamond / OFHC indium foil (welding) — Diamond / Indium Gallium Liquid Alloy 150000 OFHC Indium Foil / Indium Gallium Liquid Alloy 150000 Water / OFHC Indium Foil 3000

[0089] The statistical calculation results, including the diamond crystal temperature, maximum structural stress (Von Mises), and root mean square (RMS) error of the surface meridional direction in each embodiment, are shown in Table 3 below.

[0090] Table 3 Statistical analysis of calculation results for each embodiment

[0091]

[0092] Figures 8-10 The curves showing the relationship between deformation and meridional distance in the comparative example, Example 1, and Example 2 are presented respectively. Figures 11-13 The curves showing the relationship between the slope of the surface and the distance in the meridional direction are given in the comparative example, Example 1, and Example 2, respectively.

[0093] Based on the above data, it can be seen that the heat-relieving structures of monochromator crystals provided in Embodiments 1 and 2 of this application have significant advantages over the heat-relieving structures of monochromator crystals provided in the comparative examples in terms of crystal thermal stress relief and surface accuracy control.

[0094] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method of thermal relaxation of a monochromator crystal, characterized by, include: The clamping assembly works with the cooling base to clamp the non-light-receiving area of ​​the crystal body and to accommodate the heat exchange medium; Circulating cooling liquid is introduced into the cooling channel on the cooling base to achieve heat exchange between the cooling base, the heat exchange medium and the crystal body; Incident light is irradiated onto the light-receiving area of ​​the crystal body, and the two non-light-receiving areas play a role in strengthening the structure and heat transfer of the light-receiving area, so as to achieve precise control of the surface shape of the crystal body. The light-receiving area is located between the two non-light-receiving areas, and the thickness of the light-receiving area is less than the thickness of each of the non-light-receiving areas; the heat exchange medium is located between the cooling base and the crystal body; A groove is provided on at least one side of the light-receiving area; The heat exchange medium is in a liquid state and is an indium gallium liquid alloy. The cooling base has a receiving groove for accommodating the heat exchange medium. The clamping assembly includes a clamping piece that clamps one of the non-light-receiving areas of the crystal body and a support base that supports the clamping piece. The other non-light-receiving area of ​​the crystal body is immersed in the heat exchange medium. The clamping piece is a spring piece. One non-light-receiving area is clamped and fixed by the clamping piece, and the other non-light-receiving area is immersed in the heat exchange medium to achieve heat exchange, so as to realize the single-sided suspension and fixation of the crystal body.

2. The method of thermal relaxation of a monochromator crystal of claim 1, wherein: The two ends of the groove are inclined to the bottom surface.

3. The method of thermal relaxation of a monochromator crystal of claim 1, wherein: The thickness of the light-receiving area where the incident light irradiates is less than or equal to 300 μm.

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