Semiconductor leveling and focusing stage

Abstract

The application provides a semiconductor leveling and focusing workbench, which comprises a work platform for containing wafers, a plurality of sets of adjusting devices are uniformly arranged on the work platform, and the wafers contained on the work platform are simultaneously leveled and focused through the adjusting devices; a mounting plate is arranged on the side of the work platform far from the wafers, the fixed end of the adjusting device is connected to the upper surface of the mounting plate, the driving end of the adjusting device is connected to the work platform, and the fixed end of the adjusting device drives the driving end to displace along the direction perpendicular to the horizontal surface in the state of no contact with the driving end. The application is used to solve the problem that the leveling and focusing of the wafers before exposure in the prior art need to be carried out in two steps, so that the preparation time before exposure is too long and the production capacity is affected, and further, the leveling mechanism and the focusing mechanism applied to the existing workbench are usually composed of a DC motor and a screw rod, so that high-frequency vibration is easily generated and the precision and stability of the wafer leveling and focusing are affected.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing, and more specifically to a semiconductor leveling and focusing stage. Background Technology

[0002] Semiconductor substrates are represented by four types: gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), and diamond (C). Among them, silicon carbide (SiC) semiconductor substrates are also called wafers. A crucial step in wafer fabrication is the use of a photolithography machine to expose the wafer. This involves using a technique similar to photo printing to transfer the fine pattern on a photomask onto the wafer through light exposure.

[0003] In the wafer fabrication process, to avoid wafer scrap due to exposure failure and to ensure the precise pattern of the photomask is completely printed onto the wafer, the wafer needs to be leveled and focused before exposure. For example... Figure 1 The diagram illustrates the leveling principle. When the infrared light emitted by the infrared lamp 8 passes through the slit 81 and the reflector 82 and hits the surface of the wafer 1, the beam is reflected back at a certain angle. When the reflected light passes through the center of the light-receiving slit 83, it indicates that the wafer 1 is level. Otherwise, the stage 7 needs to be adjusted to level the wafer 1. In the prior art, at least two sets of leveling mechanisms are typically used to fine-tune the height of various parts of the stage 7 to achieve the purpose of leveling the pre-exposure grid area of ​​the wafer.

[0004] After wafer leveling is completed, wafer focusing adjustment is required, such as... Figure 2 The diagram illustrates the principle of autofocus. When the halogen light emitted by the halogen lamp 9 passes through the slit 91 and the reflector 92 onto the surface of the wafer 1, the beam is reflected at a certain angle. When the reflected light passes through the center of the light-receiving slit 93, it indicates that the wafer is at the optimal focal length. Otherwise, the height of the stage 7 needs to be adjusted to achieve the optimal focal length. As can be seen from the above, in the prior art, wafer leveling and focusing before exposure require two separate steps, resulting in excessive preparation time before exposure and affecting production capacity. Furthermore, the leveling and focusing mechanisms used in the existing stage are typically composed of DC motors and lead screws, which are prone to high-frequency vibrations, thus affecting the accuracy and stability of wafer leveling and focusing.

[0005] In view of this, it is necessary to improve the existing leveling and focusing stage to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to disclose a semiconductor leveling and focusing stage to solve the problems of excessive pre-exposure preparation time and reduced production capacity caused by the need to perform leveling and focusing in two separate steps before wafer exposure in the prior art, as well as the problems of high-frequency vibration affecting the accuracy and stability of wafer leveling and focusing.

[0007] To achieve the above objectives, the present invention provides a semiconductor leveling and focusing stage, including a work platform for holding wafers, wherein multiple sets of adjustment devices are evenly installed on the work platform, and the wafers placed on the work platform are simultaneously leveled and focused by the adjustment devices.

[0008] The working platform is provided with a mounting plate on the side away from the wafer. The fixed end of the adjustment device is connected to the upper surface of the mounting plate. The driving end of the adjustment device is connected to the working platform. The fixed end of the adjustment device drives the driving end to move the connection point with the working platform in a direction perpendicular to the horizontal plane without contacting the driving end.

[0009] As a further improvement of the present invention, the adjustment device is configured as a voice coil motor, the fixed end of the adjustment device includes the stator of the voice coil motor, the driving end of the adjustment device is the mover of the voice coil motor, and the top end of the mover is connected to the working platform through a connecting member;

[0010] The fixed end also includes a guide component, which is arranged parallel to the stator on both sides of the mover along its length. The mover moves up and down between the guide component and the stator to drive the displacement of the work platform.

[0011] As a further improvement of the present invention, the stator includes a back plate and a permanent magnet connected to each side of the back plate along its length. The mover is configured in two groups, with the two groups of movers respectively disposed on the side of the two permanent magnets away from the back plate. The bottom surface of the connecting member is fixed to the top surface of the two groups of movers respectively. The guide assembly is configured in two groups and symmetrically disposed on the side of the two groups of movers away from each other.

[0012] The guiding assembly includes a guide plate and at least one limiting member. The limiting member is installed on the side of the mover away from the permanent magnet. The guide plate has a limiting opening for each limiting member to pass through. Each limiting member moves within the limiting opening along with the mover.

[0013] As a further improvement of the present invention, both the back plate and the guide plate are connected to the upper surface of the mounting plate by a fixing seat, and a cooling liquid path for cooling the entire regulating device is formed in the back plate.

[0014] The limiting component includes a first guide block and a second guide block. The first guide block is installed at the axis of symmetry of the moving part. Two second guide blocks are provided and symmetrically distributed on both sides of the first guide block. The guide plate is fixedly connected to the connecting component. An elastic reset component is connected between the first guide block and the connecting component.

[0015] As a further improvement of the present invention, the back plate extends from the fixed seat on both sides perpendicular to the length direction and has inlet and outlet holes respectively connected to the cooling liquid path. The cooling liquid path includes staggered rising liquid path and falling liquid path, and the rising liquid path and the falling liquid path are connected end to end.

[0016] As a further improvement of the present invention, the length of the mover is equal to that of the permanent magnet, and guide plates are vertically fixed on both sides of the mover perpendicular to the length direction. A guide flange is vertically fixed on the side of the guide plate away from the mover, and the permanent magnet forms a guide groove adapted to the guide flange. The permanent magnet and the guide plate slide together.

[0017] As a further improvement of the present invention, the number of the adjustment devices evenly distributed on the mounting plate is three sets, and the working platform is provided with a placement seat for holding the wafer on the side away from the mounting plate, and the angle between the line connecting the midpoint of each pair of adjustment devices and the center of the placement seat is 120°.

[0018] Each set of adjustment devices has a grating sensor fixed to its connecting component, and the mounting plate is equipped with a grating reader for each grating sensor.

[0019] As a further improvement of the present invention, the fixing seats are configured as two sets symmetrically distributed along the length direction of the back plate, and the top ends of the two positioning seats are connected by a reinforcing plate.

[0020] The connecting member includes a top plate distributed above the reinforcing plate and a bottom plate distributed below the reinforcing plate. The lower surface of the bottom plate is fixed to the top wall of the two moving parts. The top plate is connected to the axis along the length direction of the bottom plate after passing through the reinforcing plate via a mounting block. The width of the bottom plate is greater than the width of the top plate.

[0021] The working platform has a connection port for accommodating the reinforcing plate for each adjustment device. The top plate passes through the connection port, and the bottom plate is fixed to the working platform near the installation port.

[0022] As a further improvement of the present invention, the limiting port includes a first limiting port for the first guide block to pass through and a second limiting port adapted to the second guide block, wherein the first guide block slides along the height direction of the first limiting port;

[0023] The width of the first limiting port is greater than the width of the first guide block extending into the first limiting port. A connecting piece is fixedly installed on the side of the first limiting port away from the first guide block. The elastic reset piece is a tension spring with its two ends connected to the first guide block and the connecting piece, respectively.

[0024] As a further improvement of the present invention, the sidewall of the base plate in the length direction forms a relief groove, the connector is fixed to the first limiting opening by a fastener, and the top end of the fastener is inserted into the relief groove.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows: First, multiple sets of adjustment devices are uniformly installed on the working platform. The fixed end of the adjustment device is connected to the mounting plate, and the driving end of the adjustment device is connected to the working platform. The fixed end drives the connection of the working platform to move in a direction perpendicular to the horizontal plane without contacting the driving end. In actual use of the working platform, the devices for leveling and focusing the wafer are installed above the working platform. Infrared lamps and halogen lamps simultaneously emit light beams to the wafer placed on the working platform. After reflection, the two light beams are reflected to the infrared light-receiving slit and the halogen light-receiving slit, respectively. At this time, the multiple sets of adjustment devices are activated according to the offset between the two light beams and their corresponding light-receiving slits to adjust the working platform. That is, the required height of each adjustment device is determined based on the offset between the infrared beam and its corresponding light-receiving slit, and then the required height of each adjustment device is determined based on the offset between the halogen beam and its corresponding light-receiving slit. The height that each adjustment device needs to adjust is the sum of the heights determined in the two above steps. This solves the problem of production capacity being affected by the need to separately level and focus the worktable in the prior art. Furthermore, since the drive end and the fixed end do not contact each other during the relative lifting process, the problem of high-frequency vibration affecting the accuracy and stability of wafer leveling and focusing in the prior art is avoided.

[0026] Secondly, the adjustment device is set as a voice coil motor, and the structure of the voice coil motor has been improved to suit wafer focusing and leveling operations. The permanent magnets constituting the stator are set in two sets symmetrically installed on both sides of the back plate, and the corresponding movers are two sets that cooperate with the two permanent magnets respectively. The connecting component connected to the work platform is fixed to the top of the two movers. With the above settings, the two movers are fixed to the connecting component through synchronous lifting, and then connected to the work platform through the connecting component. First, the magnetic levitation principle of the voice coil motor is applied. The lifting effect is achieved by the permanent magnets and movers not contacting each other due to magnetic force. At the same time, the top surfaces of the two movers are connected to the connecting component respectively, so that the whole structure forms a stable arch, further realizing the purpose of driving the work platform to lift and lower stably.

[0027] Finally, the main components of the fixed end, namely the back plate and guide assembly, are stably installed on the mounting plate via the mounting brackets connected to the mounting plate. At the same time, the back plate passes through two mounting brackets at both ends along its length, and liquid inlet and outlet holes are respectively opened at the ends of the back plate passing through the two mounting brackets. When the height of the working platform is adjusted using the adjustment device, cooling liquid is introduced into the liquid inlet hole. The cooling liquid passes through the cooling liquid path consisting of the rising liquid path and the falling liquid path in sequence, effectively increasing the residence time of the cooling liquid in the cooling liquid path, thereby achieving the purpose of cooling the entire adjustment device and providing a guarantee for the wafer focusing operation. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the wafer leveling principle in existing technology;

[0029] Figure 2 This is a schematic diagram of the wafer focusing principle in existing technology;

[0030] Figure 3 This is an overall diagram illustrating the structure of the wafer leveling and focusing stage in this invention;

[0031] Figure 4 for Figure 3 Schematic diagram of the cross section in the middle FF direction;

[0032] Figure 5 This is a schematic diagram illustrating the connection method of the three sets of adjustment devices on the mounting plate in this invention;

[0033] Figure 6 This is a schematic diagram illustrating the specific structure of the regulating device in this invention;

[0034] Figure 7 This is an exploded view illustrating the cooperation relationship between the driving end and the fixed end of the adjustment device in this invention;

[0035] Figure 8 for Figure 4 Enlarged view of section A in the middle;

[0036] Figure 9 for Figure 6 Schematic diagram of the cross section in the middle GG direction;

[0037] Figure 10 for Figure 6 Enlarged view of section B in the middle. Detailed Implementation

[0038] The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not intended to limit the present invention. Equivalent changes or substitutions in function, method, or structure made by those skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0039] Please refer to Figures 3 to 10 a disclosed semiconductor leveling and focusing workbench. Compared with the existing semiconductor leveling and focusing workbench, by setting the adjusting device 3 to synchronously control the lifting of the work platform 1, the purpose of synchronously leveling and focusing the wafers placed on the work platform 1 is achieved. In contrast to the prior art where it is necessary to first level the wafers 1 through an adjusting mechanism (not shown) connected to the workbench 7 (such as Figure 1 and Figure 2 shown), and then focus the wafers 1 through a focusing mechanism (not shown) connected to the workbench 7 (such as Figure 1 and Figure 2 shown), that is, it takes two steps to make the wafers 1 reach a horizontal state and be at an appropriate focal length for exposure. In actual production, the work platform 2 disclosed in the present invention Figure 1 and Figure 2 shown, the leveling mechanism and the focusing mechanism are both installed above the work platform 2. The infrared lamp 8 and the halogen lamp 9 simultaneously emit light beams to the wafers 1 placed on the work platform 2. After the two light beams are reflected, they are respectively reflected to near the infrared light receiving slit 83 and the halogen light receiving slit 93. At this time, according to the offset between the two light beams and their corresponding light receiving slits, multiple groups of adjusting devices 3 are activated to adjust the work platform 2. That is, the height that each adjusting device needs to lift or lower is determined according to the offset between the infrared light beam and its corresponding light receiving slit, and then the height that each adjusting device needs to lift or lower is determined according to the offset between the halogen light beam and its corresponding light receiving slit. The number of heights that each adjusting device needs to adjust is the sum of the heights determined in the above two judgments, thus solving the problem of affecting production capacity in the prior art where the workbench needs to be leveled and focused separately. Moreover, since there is no contact between the driving end 32 and the fixed end 31 during the relative lifting and lowering process, the problem of high-frequency vibration affecting the accuracy and stability of wafer leveling and focusing in the prior art is avoided.

[0040] Refer Figures 3 to 10 shown, in this embodiment, the semiconductor leveling and focusing workbench (hereinafter referred to as the leveling and focusing workbench) includes: a wafer holder 1 (such as Figure 1 and Figure 2A work platform 2 (as shown) is provided with multiple groups of adjusting devices 3 evenly installed thereon. The wafer 1 placed on the work platform 2 is leveled and focused synchronously through the adjusting devices 3. On the side of the work platform 2 away from the wafer 1, there is an installation plate 5. The fixed end 31 of the adjusting device 3 is connected to the upper surface of the installation plate 5, and the driving end 32 of the adjusting device 3 is connected to the work platform 2. The fixed end 31 of the adjusting device 3 drives the connection part of the driving end 32 and the work platform 2 to displace in a direction perpendicular to the horizontal plane in a state where there is no contact with the driving end 32. The adjusting device 3 is set as a voice coil motor. The fixed end 31 of the adjusting device 3 includes the stator 4 of the voice coil motor, and the driving end 32 of the adjusting device 3 is the mover 321 of the voice coil motor. The top of the mover 321 is connected to the work platform 2 through a connecting member 6. The fixed end 31 further includes a guiding component 34. The guiding component 34 and the stator 4 are arranged in parallel on both sides of the length direction of the mover 321. The mover 321 moves up and down between the guiding component 34 and the stator 4 to drive the work platform 2 to displace.

[0041] Figure 1 The wafer leveling mechanism as shown, and Figure 2 The wafer focusing mechanism as shown are respectively arranged above the work platform 2. The specific arrangement method is the same as that of the wafer adjusting mechanism and the wafer focusing mechanism above the conventional workbench, and will not be elaborated here. In this embodiment, the adjusting device 3 is set as a voice coil motor. Therefore, the component of the fixed end 31 of the adjusting device 3 for driving the driving end 32 to move up and down is the stator 4 of the voice coil motor, and the component of the driving end 32 of the adjusting device 3 is the mover 321 of the voice coil motor. The voice coil motor belongs to the category of special linear motors and has the advantage of omitting the intermediate transmission link and greatly simplifying the driving mechanism. It is mainly composed of a permanent magnet and a coil. Among them, the permanent magnet is used as the stator and the coil is used as the mover. Its principle is that after the coil moves in the permanent magnet stator, the coil mover will be affected by the Ampere force and generate a movement in a direction perpendicular to the plane of the coil. The direction of the coil movement can be controlled by controlling the direction of the coil current, and the magnitude of the thrust received by the coil can be controlled by controlling the magnitude of the current passing through the coil. During the movement of the mover 321 relative to the stator 4, they are always in a magnetic floating state and there is no contact between the mover 321 and the stator 4, thus avoiding the problem of friction caused by mutual contact. Therefore, during the process of controlling the lifting of the mover 321 of the adjusting device 3 to level and focus the wafer placed on the work platform 2, there is no friction between the mover 321 and the stator 4, effectively avoiding the problem that the work platform 2 vibrates and affects the wafer focusing accuracy.

[0042] Refer Figures 3 to 6As shown, the adjustment devices 3 are evenly distributed in three groups on the mounting plate 5. A wafer holder 21 is set on the side of the work platform 2 away from the mounting plate 5. The angle between the line connecting the midpoint of each pair of adjustment devices 3 and the center of the wafer holder 21 is 120°. Each group of adjustment devices 3 has a connecting member 6 fixed with a grating sensor 63, and a grating reader 51 is set on the mounting plate 5 corresponding to each grating sensor 63. Since the adjustment device 3 is a voice coil motor, which, as a type of linear motor, has the characteristics of fast response and high precision, it is suitable for high-precision height adjustment of wafer leveling and focusing. The wafer is placed on the wafer holder 21, and the wafer holder is mounted above the work platform 2. Figure 1 The infrared lamp 8 in the wafer leveling mechanism shown emits infrared light. After being reflected by the slit 81 and the reflector 82, the infrared light hits the surface of wafer 1 and is then reflected back out through the light-receiving slit 83; as shown Figure 2 The halogen lamp 9 in the wafer focusing mechanism shown emits halogen light. After being reflected by the slit 91 and the reflector 92, the halogen light hits the surface of the wafer 1 and is then reflected out through the light-receiving slit 93.

[0043] Combination Figure 1 As shown, when there is an angle between the working platform 2 and the horizontal plane, the infrared light is reflected by the wafer 1 to a position near the light-receiving slit 83 but cannot pass through the light-receiving slit 83. The height that the adjustment device 3 needs to adjust can be obtained by the offset of the infrared light; combined with Figure 2As shown in the figure, when the wafer 1 placed on the placement base 21 is not at the appropriate focal length, the halogen light is reflected by the wafer 1 and reaches near the light-receiving slit 93 but cannot pass through the light-receiving slit 93. The height that the adjusting device 3 needs to adjust can be obtained again through the offset of the halogen light. It should be noted that the purpose of leveling is to adjust the tilted working platform 2 to a horizontal state. Only by making the higher part of the working platform 2 descend or the lower part ascend so that the infrared light can pass through the light-receiving slit 83. Specifically, it is necessary to judge according to the actual situation and adjust the lifting of a certain adjusting device 3 by a certain value (hereinafter referred to as the leveling value); the purpose of focusing is to adjust the overall height of the working platform 2 to enable the halogen light to pass through the light-receiving slit 93. In this process, the value that the three adjusting devices 3 need to lift and lower synchronously (hereinafter referred to as the focusing value). Therefore, after obtaining the focusing value that the three adjusting devices 3 need to lift and lower synchronously according to the focusing offset, the adjusting device 3 responsible for the leveling task needs to sum the focusing value and the leveling value to obtain the lifting value of the adjusting device 3. It should be noted that when the leveling value is positive, the driving end 32 of the corresponding adjusting device 3 rises, and when the leveling value is negative, the driving end 32 of the corresponding adjusting device 3 descends; when the focusing value is positive, the driving end 32 of each adjusting device 3 rises, and when the focusing value is negative, the driving end 32 of each adjusting device 3 descends. Taking the leveling value of -0.5 mm and the focusing value of 1 mm as an example, the actual lifting value of the adjusting device 3 responsible for the leveling task is 0.5 mm, and the lifting values of the other two leveling devices 3 are 1 mm. When the three adjusting devices 3 rise 1 mm, 1 mm, and 0.5 mm respectively, the leveling and focusing operations of the wafer placed on the placement base 21 are completed simultaneously. Compared with the prior art where the leveling and focusing of the wafer need to be carried out in separate steps, the efficiency of leveling and focusing the wafer is effectively improved.

[0044] It should be noted that the number of adjusting devices 3 connected to the working platform 2 can be two, three, four, five, up to the maximum number that the mounting plate 5 and the working platform 2 can be installed. In this embodiment, the number of adjusting devices 3 is three. Each adjusting device 3 is responsible for adjusting the height of 1 / 3 area of the working platform 2, ensuring accurate adjustment of the height of the working platform 2 within a limited number of adjustments (three times), which is convenient for the overall adjustment of the leveling and focusing workbench. The grating reader 51 connected to the mounting plate 5 and the grating sensing piece 63 connected to the connecting member 6 can sensitively and accurately identify the lifting height of each connecting member 6, further improving the leveling and focusing accuracy of the wafer.

[0045] Refer Figures 6 to 8As shown, the stator 4 includes a back plate 41 and permanent magnets 42 respectively connected to both sides of the back plate 41 in the length direction of the back plate 41. The rotors 321 are arranged in two groups, and the two groups of rotors 321 are respectively arranged on the side of the two permanent magnets 42 away from the back plate 41. The bottom surfaces of the connecting members 6 are respectively fixed to the top surfaces of the two groups of rotors 321. The guiding components 34 are arranged in two groups and symmetrically arranged on the sides where the two groups of rotors 321 are away from each other; the guiding components 34 include guiding plates 341 and not less than one limiting member 322. The limiting member 322 is installed on the side of the rotor 321 away from the permanent magnet 42. The guiding plate 341 is provided with limiting ports 3411 for each limiting member 322 to pass through respectively. Each limiting member 322 displaces in the limiting port 3411 along with the rotor 321. Both the back plate 41 and the guiding plate 341 are connected to the upper surface of the mounting plate 5 through fixing seats 33.

[0046] Combined with the above and the principle of the voice coil motor, it can be seen that in this embodiment, the component that generates the Ampere force between the stator 4 and the rotor 321 to make the rotor 321 lift and lower is the permanent magnet 42. After the two permanent magnets 42 respectively installed on both sides of the back plate 41 are powered on, the two permanent magnets 42 respectively generate Ampere forces with the two rotors 321 to drive the two rotors 321 to lift and lower. A stable arch structure is formed between the connecting member 6 connected to the tops of the two rotors 321 and the two rotors 321. Objectively, the contact area between the connecting member 6 and the working platform 2 is increased, so that the lifting and lowering process of the rotor 321 driving the working platform 2 is more stable. Further, since the two permanent magnets 42 respectively generate Ampere forces with the two rotors 321, compared with the cooperation of a single permanent magnet 42 and the rotor 321, a greater supporting force is provided to the working platform 2, while ensuring the stability of the lifting and lowering of the working platform 2, improving the stability of the overall structure of the adjusting device 3, and enabling the overall adjusting device 3 to support a greater weight. See Figure 7 As shown, the length of the rotor 321 is equal to that of the permanent magnet 42. Guide pieces 3211 are vertically fixed to both sides of the rotor 321 perpendicular to the length direction. Guide flanges 3212 are vertically fixed to the sides of the guide pieces 3211 away from the rotor 321. The permanent magnet 42 forms a guide groove 421 adapted to the guide flange 3212. The permanent magnet 42 is in sliding fit with the guide piece 3211. The settings of the guide piece 3211, the guide flange 3212 and the guide groove 421 effectively limit the lifting and lowering process of the rotor 321. The rotor 321 always slides along the direction in which the guide flange 3212 and the guide groove 421 cooperate with each other, avoiding the generation of component forces in other directions.

[0047] See Figures 5 to 9As shown, the limiting member 322 includes a first guiding block 3221 and a second guiding block 3222. The first guiding block 3221 is installed at the symmetry axis of the mover 321. The number of the second guiding blocks 3222 is two, and they are symmetrically distributed on both sides of the first guiding block 3221. The guiding plate 341 is fixedly connected to the connecting member 3414. An elastic reset member 3223 is connected between the first guiding block 3221 and the connecting member 3414. The limiting opening 3411 includes a first limiting opening 3412 for the first guiding block 3221 to pass through and a second limiting opening 3413 adapted to the second guiding block 3222. The first guiding block 3221 slides along the height direction of the first limiting opening 3412. The width of the first limiting opening 3412 is greater than the width of the first guiding block 3221 extending into the first limiting opening 3412. A connecting member 3414 is fixedly installed on the side of the first limiting opening 3412 away from the first guiding block 3221. The elastic reset member 3223 is set as a tension spring, and its two ends are respectively connected to the first guiding block 3221 and the connecting member 3414. The fixed seats 33 are set as two groups symmetrically distributed along the length direction of the back plate 41. The tops of the two fixed seats 33 are connected by a reinforcement plate 331. A connecting port 22 for accommodating the reinforcement plate 331 is opened on the working platform 2 corresponding to each adjusting device 3.

[0048] Since the fixed seats 33 are two groups symmetrically distributed on both sides of the back plate 41, first, the fixed seats 33 play a role in limiting the back plate 41, achieving the purpose of stably installing the back plate 41 on the mounting plate 5. In addition, the tops of the two fixed seats 33 are fixed with the reinforcement plate 331, and the two fixed seats 33 fix the two guiding plates 341 parallel to both sides of the back plate 41, so as to form a stable six-sided support structure outside the mover 321, effectively improving the stability of the overall structure of the adjusting device 3. Further, due to the reinforcement plate 331 connected to the top surfaces of the two fixed seats 33, when connecting the whole adjusting device 3 to the working platform 2, by making the reinforcement plate 331 pass through the connecting port 22, it can be determined that the installation angle of the adjusting device 3 is appropriate, and then the connecting member 6 is fixed to the lower surface of the working platform 2, achieving an effective installation alignment effect. After the permanent magnet 42 is powered off, the mover 321 and the connecting member 6 as a whole fall due to gravity. Until the two second guiding blocks 3222 fall to the upper surface close to the second limiting opening 3413, the elastic reset member 3223 connected between the first guiding block 3221 and the connecting member 3414 is stretched by the pulling force, providing a buffer for the contact between the second guiding block 3222 and the second limiting opening 3413, so as to avoid rigid contact between the second guiding block 3222 and the second limiting opening 3413 and further damage to the mover 321. During the lifting and lowering process of the mover 321, the first guiding block 3221 slidingly matched with the first limiting opening 3412 rises and falls synchronously, further improving the lifting and lowering stability of the mover 321 on the basis of the guiding piece 3211.

[0049] See Figure 7 、 Figure 8 and Figure 10 As shown in Figure 10 , the connecting member 6 includes a top plate 61 distributed above the reinforcing plate 331 and a bottom plate 62 distributed below the reinforcing plate 331. The lower surface of the bottom plate 63 is fixed to the top walls of the two movers 321. The top plate 61 is connected to the axis in the length direction of the bottom plate 62 after passing through the reinforcing plate 331 through the mounting block 64. The width of the bottom plate 62 is greater than the width of the top plate 61. The top plate 61 passes through from the connection port 22, and the bottom plate 62 is fixed to the workbench 2 near the connection port 22. A relief groove 621 is formed on the side wall in the length direction of the bottom plate 62. The connecting member 3414 is fixedly connected to the first limiting port 3412 through the fixing member 3415, and the top end of the fixing member 3415 is inserted into the relief groove 621. First, the bottom plate 62 is used to connect to the workbench 2 so that the workbench 2 can be lifted and lowered together with the mover 321. Further, the top plate 61 is connected to the bottom plate 62 after passing through the reinforcing plate 331 through the mounting block 64. When the mover 321 is lifted and lowered, the bottom plate 62 drives the workbench 2 to be lifted and lowered. Since the reinforcing plate 331 is connected to the fixed seat 33, the height of the reinforcing plate 331 remains unchanged during the movement of the bottom plate 62, and the mounting block 64 is lifted and lowered at the place where it passes through the reinforcing plate 331 during the process of the top plate 61 following the bottom plate 62 and the workbench 2 being lifted and lowered, so as to effectively limit the lifting direction of the bottom plate 62, ensure that the bottom plate 62 drives the workbench 2 to displace in the vertical direction, and thus avoid the possibility that the wafer placed on the workbench 2 is misaligned with the mask plate (not shown) due to a slight horizontal displacement of the bottom plate 62 driving the workbench 2, which may affect the exposure effect of the wafer.

[0050] As Figures 5 to 9 shown in Figures 5 to 9 , a cooling liquid path 411 for cooling the whole adjusting device 3 is formed inside the back plate 41. The two sides perpendicular to the length direction of the back plate 41 pass through from the fixed seat 33 and are respectively provided with a liquid inlet hole 412 and a liquid outlet hole 413 communicated with the cooling liquid path 411. The cooling liquid path 411 includes an ascending liquid path 4111 and a descending liquid path 4112 which are distributed alternately, and the ascending liquid path 4111 and the descending liquid path 4112 are connected end to end. Coolant is introduced into the liquid inlet hole 412. After the coolant enters the cooling liquid path 411, it descends through the uniformly arranged descending liquid paths 4112, and then ascends through the ascending liquid paths 4111 communicated with the descending liquid paths 4112. The above process is carried out repeatedly for many times until the coolant is discharged from the back plate 41 through the liquid outlet hole 413. Through the above arrangement of the cooling liquid path 411, the internal area of the back plate 41 can be covered to the greatest extent, and the heat generated can be taken away at the fastest speed during the operation of the adjusting device 3, so as to ensure the stability of the wafer leveling and focusing process.

[0051] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0052] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor leveling and focusing stage, characterized by, The utility model relates to a kind of work platform for containing wafer, the work platform is evenly installed multiple sets of adjusting device, and the wafer contained in the work platform is simultaneously leveled and focused by the adjusting device; The fixing end of the adjusting device is connected to the upper surface of the mounting plate, and the driving end of the adjusting device is connected to the work platform. The fixing end of the adjusting device includes a stator of the voice coil motor, and the driving end of the adjusting device is a rotor of the voice coil motor. The stator includes a back plate and two permanent magnets connected to the length direction of the back plate, and the rotor is provided in two groups. The two groups of rotors are arranged on the side of the two permanent magnets away from the back plate. The connecting member is fixed to the top surface of the two groups of rotors. The guide assembly includes a guide plate and at least one limiting piece. The limiting piece is installed on the side of the rotor away from the permanent magnet.

2. The semiconductor leveling and focusing stage according to claim 1, wherein, The guide plate is provided with a limiting hole for each limiting piece.

3. The semiconductor levelling and focusing stage according to claim 2, characterised in that, The limiting piece includes a first guide block and a second guide block.

4. The semiconductor levelling and focusing stage according to claim 3, characterized in that The first guide block is installed on the symmetry axis of the rotor.

5. The semiconductor leveling and focusing stage of claim 1, wherein, The second guide block is provided in two groups and symmetrically distributed on both sides of the first guide block. The guide plate is fixedly connected to the connecting block. The first guide block and the connecting block are connected by an elastic return piece. The back plate and the guide plate are connected to the upper surface of the mounting plate by a fixing seat. The back plate is provided with an inlet hole and an outlet hole for the cooling liquid path. The cooling liquid path includes an ascending liquid path and a descending liquid path. The length of the rotor is equal to the length of the permanent magnet. The permanent magnet is provided with a guide groove adapted to the guide fold. The permanent magnet and the guide plate are in sliding cooperation. The adjusting device is evenly distributed on the mounting plate in three groups. The work platform is provided with a placing seat for containing wafers on the side away from the mounting plate. The angle between the midpoint of each adjusting device and the center line of the placing seat is 120°. Each adjusting device is fixed with a grating sensing sheet. The mounting plate is provided with a grating code reader corresponding to each grating sensing sheet.

6. The semiconductor leveling and focusing stage of claim 2, wherein, The fixing seats are symmetrically arranged in two groups along the length direction of the back plate, and the top ends of the two fixing seats are connected by a reinforcing plate; The connecting member comprises a top plate arranged above the reinforcing plate and a bottom plate arranged below the reinforcing plate, the lower surface of the bottom plate is fixed to the top wall of the two movers, the top plate is connected to the bottom plate at the length direction axis of the bottom plate after penetrating the reinforcing plate through the mounting block, and the width of the bottom plate is greater than the width of the top plate; The working platform is provided with a connecting port for accommodating the reinforcing plate corresponding to each adjusting device, the top plate penetrates the connecting port, and the bottom plate is fixed to the working platform near the mounting port.

7. The semiconductor leveling and focusing stage of claim 6, wherein, The limiting port comprises a first limiting port for the first guide block to penetrate and a second limiting port matched with the second guide block, and the first guide block slides along the height direction of the first limiting port; The width of the first limiting port is greater than the width of the first guide block penetrating into the first limiting port, a connecting piece is fixedly installed on the side of the first limiting port away from the first guide block, and the elastic reset member is a tension spring and is connected to the first guide block and the connecting piece at two ends.

8. The semiconductor leveling and focusing stage of claim 7, wherein, The side wall of the bottom plate in the length direction forms a giving slot, the connecting piece is fixedly connected into the first limiting port through a fixing piece, and the top end of the fixing piece is inserted into the giving slot.

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