Rectifier and generator having the same

Abstract

The application discloses a rectifier and a generator with the same, the rectifier comprising: a heat dissipation plate (110); a circuit board assembly (120) fixed on the heat dissipation plate (110) and configured to rectify three-phase alternating current into direct current; and a bus plate (130) having an input port (131) and an output port (132), coupled with the circuit board assembly (120) and fixedly connected with the heat dissipation plate (110), and configured to converge the direct current formed by rectifying the three-phase alternating current inputted through the input port (131) by the circuit board assembly (120) and output the direct current through the output port (132). The rectifier integrates original rectifier diodes into the circuit board assembly, thereby eliminating positive diodes, negative diodes and negative plates, simplifying the structure and assembly process of the existing rectifier and greatly reducing labor cost and material cost.

Description

Technical Field

[0001] This invention relates to the field of electrical equipment, and more particularly to a rectifier and a generator having the same. Background Technology

[0002] A rectifier is a device that converts alternating current (AC) into direct current (DC). Traditional rectifiers have a complex structure, mainly composed of components such as a positive plate, bridge support, negative plate, positive diode, negative diode, output screw, and mounting screw. Due to the large number of components, the assembly process of traditional rectifiers is cumbersome and material control is extremely complex, making it difficult to achieve platform standardization. This leads to a significant increase in labor, material, and management costs. Moreover, traditional rectifiers cannot simultaneously achieve lightweight design and high power. When the motor power is high, the space limitations of press-fit diodes make it difficult for traditional rectifiers to meet heat dissipation requirements while maintaining a small and lightweight design. Currently, traditional rectifiers mainly rely on enlarging the heat sink to meet heat dissipation requirements, resulting in a sharp increase in development costs. Summary of the Invention

[0003] This solution addresses the problems and needs raised above by proposing a rectifier that achieves the aforementioned technical objectives and brings about several other technical benefits due to the adoption of the following technical features.

[0004] One object of the present invention is to provide a rectifier comprising:

[0005] Heat sink;

[0006] The circuit board assembly, fixed on the heat sink, is configured to rectify three-phase alternating current to form direct current.

[0007] The busbar has an input port and an output port, is coupled to the circuit board assembly, and is fixedly connected to the heat sink. It is configured to combine the three-phase AC power input from the input port into DC power rectified by the circuit board assembly, and output the DC power through the output port.

[0008] In this technical solution, three-phase AC power is input through the input port of the busbar and rectified by the circuit board assembly to form DC power. The DC power is then returned by the busbar and finally output through the output port of the busbar. During this process, the heat dissipation plate dissipates the heat generated by the circuit board assembly and the busbar. This rectifier integrates the original rectifier diodes into the circuit board assembly, thereby eliminating the need for positive diodes, negative diodes, and negative plates, simplifying the existing rectifier structure and assembly process, and greatly reducing labor and material costs.

[0009] In addition, the rectifier according to the present invention may also have the following technical features:

[0010] In one example of the invention, a connection groove is formed on the heat sink, and the circuit board assembly is fixed in the connection groove by an adhesive.

[0011] In one example of the present invention, the adhesive is a high thermal conductivity material.

[0012] In one example of the present invention, a plurality of heat dissipation teeth are formed on the heat sink plate, and the plurality of heat dissipation teeth are stacked at the air inlet of the rectifier.

[0013] In one example of the present invention, the circuit board assembly includes:

[0014] A chip assembly and a circuit board connected thereto, the chip assembly being configured to convert three-phase alternating current into direct current, and the circuit board being coupled to the busbar.

[0015] In one example of the present invention, the chip assembly includes:

[0016] The pier module includes an input pier, a negative pier, and an output pier coupled to the circuit board, wherein the input pier is used to input three-phase AC power, the negative pier is used to ground, and the output pier is used to output DC power;

[0017] The chip, coupled to the circuit board, is configured to convert three-phase alternating current into direct current.

[0018] In one example of the present invention, both the input pier and the negative pier include at least two.

[0019] In one example of the present invention, the circuit board is a ceramic copper-clad laminate.

[0020] In one example of the present invention, the busbar and the heat sink are connected by fasteners;

[0021] The busbar is provided with a plurality of first positioning holes;

[0022] The heat sink is provided with a plurality of second positioning holes corresponding to the first positioning hole;

[0023] The fastener is sequentially inserted through the first positioning hole and the second positioning hole.

[0024] Another object of the present invention is to provide a generator comprising a rectifier as described in any of the preceding claims.

[0025] The preferred embodiments of the invention will be described in more detail below with reference to the accompanying drawings, so as to facilitate an understanding of the features and advantages of the invention. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments of the present invention will be briefly described below. The drawings are merely illustrative of some embodiments of the present invention and are not intended to limit the scope of the present invention to all embodiments.

[0027] Figure 1 An exploded view of a rectifier according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of the present invention;

[0029] Figure 3 An exploded view of a circuit board assembly according to an embodiment of the present invention;

[0030] Figure 4 This is a circuit schematic diagram of a rectifier chip according to an embodiment of the present invention.

[0031] List of reference numerals in the attached diagram:

[0032] Rectifier 100;

[0033] Heat sink 110;

[0034] Connection slot 111;

[0035] Heat dissipation teeth 112;

[0036] Second positioning hole 113;

[0037] Circuit board assembly 120;

[0038] Chip component 121;

[0039] Pier Head Module 1211;

[0040] Enter pier head 12111;

[0041] Negative pier head 12112;

[0042] Output pier head 12113;

[0043] Chip 1212;

[0044] Conductive sheet 1213;

[0045] Circuit board 122;

[0046] Busbar 130;

[0047] Input port 131;

[0048] Output port 132;

[0049] First positioning hole 133;

[0050] Fastener 140. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0052] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “an” or “a” and similar terms do not necessarily indicate a quantity limitation. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0053] According to a first aspect of the present invention, a rectifier 100, such as Figures 1 to 4 As shown, it includes:

[0054] Heat sink 110;

[0055] The circuit board assembly 120 is fixed on the heat sink 110 and is configured to rectify the three-phase AC power to form DC power.

[0056] The busbar 130 has an input port 131 and an output port 132, is coupled to the circuit board assembly 120 and fixedly connected to the heat sink 110, and is configured to combine the three-phase AC power input from the input port 131 into DC power rectified by the circuit board assembly 120, and output the DC power through the output port 132.

[0057] In other words, the three-phase AC power is input through the input port 131 of the busbar 130 and rectified by the circuit board assembly 120 to form DC power. The DC power is then returned by the busbar 130 and finally output through the output port 132 of the busbar 130. During this process, the heat dissipation plate 110 dissipates the heat generated by the circuit board assembly 120 and the busbar 130. The rectifier 100 integrates the diodes of the existing rectifier into the circuit board assembly 120, thereby eliminating the need for positive diodes, negative diodes and negative plates, simplifying the existing rectifier structure and assembly process, and greatly reducing labor and material costs.

[0058] In one example of the present invention, a connection groove 111 is formed on the heat sink 110, and the circuit board assembly 120 is fixed in the connection groove 111 by an adhesive; for example, as Figure 1 As shown, the connecting groove 111 includes three sections, and three circuit board assemblies 120 are respectively bonded in the connecting groove 111.

[0059] Since the circuit board assembly 120 is located between the heat sink 110 and the busbar 130, space needs to be left between the heat sink 110 and the busbar 130 to facilitate the connection of the circuit board assembly 120. On the one hand, in order to improve the compactness of the connection between the heat sink 110 and the busbar 130, a connection groove 111 is opened on the heat sink 110; on the other hand, it can also increase the heat dissipation area of ​​the heat sink 110.

[0060] In one example of the present invention, the adhesive is a high thermal conductivity material;

[0061] The adhesive of the high thermal conductivity material can improve the heat conduction between the circuit board assembly 120 and the heat sink 110, thereby facilitating the dissipation of heat by the circuit board assembly 120 and improving the working efficiency and reliability of the rectifier 100.

[0062] In one example of the present invention, a plurality of heat dissipation teeth 112 are formed on the heat sink 110, and the plurality of heat dissipation teeth 112 are stacked at the air inlet of the rectifier 100.

[0063] By setting multiple heat dissipation teeth 112 on the heat sink 110, the heat dissipation area of ​​the heat sink 110 can be increased, and the heat dissipation efficiency of the heat sink 110 can be improved by stacking multiple heat dissipation teeth 112 at the air inlet.

[0064] In one example of the present invention, the circuit board assembly 120 includes:

[0065] A chip assembly 121 and a circuit board 122 connected thereto, the chip assembly 121 being configured to convert three-phase alternating current into direct current, and the circuit board 122 being coupled to the busbar 130;

[0066] The chip component 121 can convert three-phase AC power into DC power. The integrated design of the chip component 121 can eliminate the need for positive diodes, negative diodes and negative plates, simplifying the existing rectifier 100 structure and assembly process, and greatly reducing labor and material costs.

[0067] In one example of the present invention, the chip assembly 121 includes:

[0068] The pier module 1211 includes an input pier 12111, a negative pier 12112, and an output pier 12113 coupled to the circuit board 122. The input pier 12111 is used to input three-phase AC power, the negative pier 12112 is used to ground, and the output pier 12113 is used to output DC power.

[0069] Chip 1212, coupled to circuit board 122, is configured to convert three-phase alternating current into direct current; wherein chip 1212 and circuit board 122 are coupled through conductive sheet 1213; as shown Figure 4 The diagram shown is the circuit schematic of rectifier chip 1212. It should be noted that chip 1212 here is a diode integrated circuit.

[0070] In other words, the three-phase AC power is input from the input terminal 12111 and transmitted to the chip 1212 via the circuit board 122. The chip 1212 converts the three-phase AC power into DC power and transmits it to the output terminal 12113 via the circuit board 122. The integrated design of the terminal module 1211 and the chip 1212 can eliminate the need for positive diodes, negative diodes and negative plates, simplifying the existing rectifier 100 structure and assembly process, and greatly reducing labor and material costs.

[0071] In one example of the present invention, both the input pier head 12111 and the negative pier head 12112 include at least two;

[0072] For example, such as Figure 4 As shown, the rectifier 100 includes three circuit board assemblies 120. Each circuit board assembly 120 includes two input terminals 12111 and two negative terminals 12112, as well as one output terminal 12113, corresponding to... Figure 4 In the schematic diagram, input terminal 12111 is equivalent to A1 and A2 (or B1 and B2, C1 and C2), negative terminal 12112 is equivalent to -, and output terminal 12113 is equivalent to +, thus shunting the input three-phase AC power and thereby achieving the purpose of protection.

[0073] In one example of the present invention, the circuit board 122 is a ceramic copper-clad laminate;

[0074] In other words, the positive and negative diodes of the rectifier 100 in the existing technology are integrated into the ceramic copper-clad laminate, and the circuit board assembly 120 has a unified structure that can be directly reused in subsequent products. Through integration, the negative plate required for the original press-fit can also be removed and connected to the motor housing through the busbar 130; moreover, the ceramic copper-clad laminate is in direct contact with the heat sink, reducing thermal resistance during heat conduction, and greatly reducing the space required for the heat sink 110 without reducing the overall power.

[0075] In one example of the present invention, the busbar 130 and the heat sink 110 are connected by fasteners 140, and the busbar 130 is provided with a plurality of first positioning holes 133;

[0076] The heat sink 110 is provided with a plurality of second positioning holes 113 corresponding to the first positioning hole 133;

[0077] The fastener 140 is sequentially passed through the first positioning hole 133 and the second positioning hole 113;

[0078] The fasteners 140 described above can be used to fix the busbar 130 and the heat sink 110 together, which improves the overall connection reliability of the rectifier 100 and makes disassembly convenient, facilitating maintenance and replacement of parts.

[0079] According to a second aspect of the present invention, a generator includes a rectifier 100 as described in any of the preceding claims.

[0080] Since the rectifier 100 integrates the positive and negative diodes of the existing rectifier 100 into the ceramic copper-clad plate, the circuit board assembly 120 has a unified structure, which can be directly used in subsequent products, thereby increasing the matching rate of motors with the rectifier 100.

[0081] Because the rectifier 100 has better heat dissipation efficiency than the traditional automotive rectifier 100, it can achieve greater power while meeting lightweight design requirements. Therefore, generators equipped with the rectifier 100 are stable in operation, have high power, and simple structure.

[0082] The foregoing description, with reference to preferred embodiments, details exemplary implementations of the rectifier 100 and the generator having therein proposed in this invention. However, those skilled in the art will understand that various modifications and alterations can be made to the above specific embodiments without departing from the spirit of this invention, and various combinations can be made to the various technical features and structures proposed in this invention without exceeding the protection scope of this invention, which is determined by the appended claims.

Claims

1. A rectifier, characterized in that, include: A heat sink (110) has a connecting groove (111) formed thereon, and a circuit board assembly (120) is fixed in the connecting groove (111) by an adhesive. A circuit board assembly (120), fixed on the heat sink (110), is configured to rectify three-phase AC power to form DC power; the circuit board assembly (120) includes: a chip assembly (121) and a circuit board (122) connected thereto, the chip assembly (121) being configured to convert three-phase AC power into DC power, and the circuit board (122) being coupled to a busbar (130); wherein, the chip assembly (121) includes: The pier module (1211) includes an input pier (12111), a negative pier (12112), and an output pier (12113) coupled to the circuit board (122), wherein the input pier (12111) is used to input three-phase AC power, the negative pier (12112) is used to ground, and the output pier (12113) is used to output DC power; The chip (1212), coupled to the circuit board (122), is configured to convert three-phase alternating current into direct current; The busbar (130) has an input port (131) and an output port (132), is coupled to the circuit board assembly (120), and is fixedly connected to the heat sink (110). It is configured to combine the three-phase AC power input from the input port (131) into DC power rectified by the circuit board assembly (120), and output the DC power through the output port (132). The busbar (130) and the heat sink (110) are connected by fasteners (140); the busbar (130) is provided with a plurality of first positioning holes (133); the heat sink (110) is provided with a plurality of second positioning holes (113) corresponding to the first positioning holes (133); the fasteners (140) pass through the first positioning holes (133) and the second positioning holes (113) in sequence.

2. The rectifier according to claim 1, characterized in that, The adhesive is made of a material with high thermal conductivity.

3. The rectifier according to claim 1, characterized in that, The heat sink (110) has a plurality of heat dissipation teeth (112) formed thereon, and the plurality of heat dissipation teeth (112) are stacked at the air inlet of the rectifier.

4. The rectifier according to claim 1, characterized in that, Both the input pier (12111) and the negative pier (12112) include at least two.

5. The rectifier according to claim 1, characterized in that, The circuit board (122) is a ceramic copper-clad board.

6. A generator, characterized in that, Includes the rectifier (100) as described in any one of claims 1 to 5.

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