Insulating glass

Abstract

The embodiment of the present application discloses a hollow glass, comprising a first glass plate and a second glass plate, the first glass plate and the second glass plate are opposite and spaced, a containing space is formed between the first glass plate and the second glass plate, and the containing space is used for filling inert gas; wherein, the first glass plate comprises: a first substrate; a photoelectric component, arranged on the side of the first substrate close to the second glass plate; a glue film layer, covering the side of the photoelectric component away from the first substrate, and adhering the photoelectric component on the first substrate; and an insulating layer, adhered on the side of the glue film layer away from the first substrate. The embodiment of the present application can realize that even if the photoelectric component appears local high temperature, it cannot meet the combustion condition, and then it cannot burn, so as to ensure its safety through the specific hollow structure design of the glass film layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of building energy-saving hollow glass, and particularly relates to a hollow glass. BACKGROUND

[0002] With the double carbon target requirement, in addition to the traditional heat insulation performance, the building outer protective structure also needs to make full use of the sunny side of the building, install power generation glass, and further reduce the comprehensive energy consumption demand of the building. It is an important means for the building to move towards zero carbon target.

[0003] The existing power generation glass is partly made by clamping a crystalline silicon cell between glass and plastic. However, when the crystalline silicon cell fails and generates local high temperature, it is easy to cause the back plastic film to catch fire and further cause building fire. The other part is to use a photovoltaic chip layer to realize photovoltaic power generation, which simultaneously has a protective reinforcement layer, a fireproof glass layer, an outer glass layer, and a plurality of adhesive layers, making the manufacturing process complex. SUMMARY

[0004] In view of at least some of the problems and defects in the prior art, the present application provides a hollow glass. Through the specific hollow structure design of the glass film layer, even if the photoelectric assembly generates local high temperature, it will not meet the combustion condition, and thus it cannot burn, to ensure its safety, and the overall structure manufacturing process is simple and easy to produce.

[0005] Specifically, an embodiment of the present application provides a hollow glass, comprising a first glass plate and a second glass plate, the first glass plate and the second glass plate are oppositely and spacedly arranged, a containing space is formed between the first glass plate and the second glass plate, and the containing space is filled with an inert gas; wherein the first glass plate comprises: a first substrate; a photoelectric assembly arranged on a side of the first substrate close to the second glass plate; a glue film layer covering a side of the photoelectric assembly away from the first substrate, and adhering the photoelectric assembly to the first substrate; and an insulating layer adhered to a side of the glue film layer away from the first substrate.

[0006] In an embodiment of the present application, the second glass plate comprises a second substrate and a low-emissivity film layer, and the low-emissivity film layer is located between the first glass plate and the second substrate.

[0007] In an embodiment of the present application, the hollow glass further comprises an encapsulation assembly, the encapsulation assembly is arranged between the first glass plate and the second glass plate, and the first glass plate and the second glass plate together form the containing space.

[0008] In one embodiment of the present application, the first substrate comprises a first region and a second region adjacent to the second substrate, the first region surrounds the second region; the encapsulation assembly is adhered to the first region of the first substrate and comprises a first adhesive layer, a support and a molecular sieve, the support is arranged between the first adhesive layer and the molecular sieve, the first adhesive layer is arranged on the side of the support away from the accommodation space, and the molecular sieve is arranged on the side of the support close to the accommodation space; wherein the optoelectronic assembly, the adhesive film layer and the insulating layer are adhered to the second region of the first substrate.

[0009] In one embodiment of the present application, the low-emissivity film layer has a transmittance bandwidth ranging from 380 to 1200 nanometers.

[0010] Another embodiment of the present application provides a hollow glass comprising a first glass plate and a second glass plate, the first glass plate and the second glass plate are arranged opposite and spaced apart, and an accommodation space is formed between the first glass plate and the second glass plate for filling inert gas; wherein the second glass plate comprises a second substrate, an adhesive film layer covering the side of the second substrate close to the second glass plate, an insulating layer adhered to the side of the adhesive film layer away from the second substrate, and an optoelectronic assembly arranged on the side of the insulating layer away from the adhesive film layer.

[0011] In one embodiment of the present application, the first glass plate comprises a first substrate and a low-emissivity film layer, and the low-emissivity film layer is arranged between the first substrate and the second substrate.

[0012] In one embodiment of the present application, the hollow glass comprises an encapsulation assembly arranged between the first glass plate and the second glass plate to form a sealed accommodation space.

[0013] In one embodiment of the present application, the second substrate comprises a first region and a second region adjacent to the first substrate, the first region surrounds the second region; the encapsulation assembly is adhered to the first region of the second substrate and comprises a first adhesive layer, a support and a molecular sieve, the support is arranged between the first adhesive layer and the molecular sieve, the first adhesive layer is arranged on the side of the support away from the accommodation space, and the molecular sieve is arranged on the side of the support close to the accommodation space; wherein the adhesive film layer, the insulating layer and the optoelectronic assembly are adhered to the second region of the second substrate.

[0014] In one embodiment of the present application, the low-emissivity film layer has a transmittance bandwidth ranging from 380 to 1200 nanometers.

[0015] The above technical solution has the following advantages or beneficial effects: by setting the photoelectric component on one of the first glass plate or the second glass plate and filling the accommodating space with inert gas, it can be ensured that even if the photoelectric component experiences local high temperature, the combustion conditions will not be met, thus preventing it from burning and ensuring safety; in addition, by setting a low-emissivity film layer on the other glass plate, it can play a role in heat insulation and heat preservation, which can improve the application value and user experience of the insulating glass. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an insulating glass unit disclosed in an embodiment of the present invention.

[0018] Figure 2 for Figure 1 A schematic diagram of one structure of the first substrate is shown.

[0019] Figure 3 This is a schematic diagram of the structure of an insulating glass unit disclosed in another embodiment of the present invention.

[0020] Figure 4 for Figure 3 A schematic diagram of one structure of the second substrate is shown. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that the terms "first", "second", "one side", etc. in the specification and claims of the present application are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. In addition, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, system, product or device comprising a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, products or devices.

[0023] The first embodiment

[0024] Referring to Figure 1 , which shows a hollow glass 100 disclosed by the first embodiment of the present application. The hollow glass 100 comprises, for example, a first glass plate 10 and a second glass plate 30. The first glass plate 10 and the second glass plate 30 are oppositely and spacedly arranged, and a receiving space 21 is formed between the first glass plate 10 and the second glass plate 30, which can be used to fill inert gas.

[0025] The first glass plate 10 comprises, for example, a first substrate 11, a photoelectric assembly 12, a film layer 13 and an insulating layer 14. The photoelectric assembly 12 comprises a plurality of crystalline silicon cell pieces, which are respectively arranged on the side of the first substrate 11 close to the second glass plate 30. The film layer 13 covers the side of the plurality of crystalline silicon cell pieces away from the first substrate 11, and adheres the plurality of crystalline silicon cell pieces to the first substrate 11. The insulating layer 14 is adhered to the side of the film layer 13 away from the first substrate 11.

[0026] Specifically, the first substrate 11 is, for example, a single piece of building glass or multiple pieces of glass arranged on the outdoor side. The photoelectric assembly 12 is, for example, a crystalline silicon battery assembly including multiple crystalline silicon battery pieces, the outer side of the first substrate 11 may, for example, be an outdoor environment, the front side (i.e., the light-absorbing side) of the multiple crystalline silicon battery pieces is arranged toward the first substrate 11, the area of the photoelectric assembly 12 may, for example, be smaller than the area of the first substrate 11, the adhesive film layer 13 is, for example, a film layer formed of PVB (Polyvinylbutyral) or EVA (ethylene-vinyl acetate copolymer) adhesive film, the area of the adhesive film layer 13 may, for example, be larger than the area of the photoelectric assembly to adhere the multiple crystalline silicon battery pieces of the photoelectric assembly 12 to the first substrate 11, and of course, this is not limited herein. The insulating layer 14 is, for example, a plastic film material having insulating properties to achieve the effects of waterproofing and insulation and further protect the photoelectric assembly 12. The crystalline silicon battery piece is an element for converting light energy into electrical energy, in the present embodiment, the power generation process of the photoelectric assembly 12 is as follows: when outdoor light shines on the surface of the crystalline silicon battery piece through the first substrate 11, a portion of the photons is absorbed by the silicon material, the energy of the photons is transferred to the silicon atoms, causing the electrons to migrate and become free electrons that accumulate on both sides of the P-N junction to form a potential difference, when an external circuit is connected, under the action of the voltage, current will flow through the external circuit to generate a certain output power, the essence of this process is the process of converting photon energy into electrical energy, which can be referred to in the prior art and will not be described herein. The inert gas filled in the accommodation space 21 is, for example, argon and other non-combustible gases, and of course, it can also be set to be vacuum, which can avoid the phenomenon of combustion of the photoelectric assembly 12 due to local overheating, and further, the embodiment of the present application can realize the function of generating electricity while ensuring its safety performance.

[0027] Further, the second glass plate 30 includes, for example, a second substrate 31 and a low-emissivity film layer 32, wherein the low-emissivity film layer 32 is located between the first substrate 11 and the second substrate 31.

[0028] The second substrate 31, for example, is a single piece of building glass or multiple pieces of glass arranged on the indoor side, and the material thereof can be the same as or different from the first substrate 11, and the embodiments of the present application are not limited in this regard. The low-emissivity film layer 32, for example, is a low-emissivity coated glass, and the low-emissivity film layer 32 is arranged on the second substrate 31 by coating or adhesion, etc., to transmit light in the wavelength range of 380-1200 nm. That is, the transmission bandwidth range of the low-emissivity film layer 32 is 380-1200 nm. In the present embodiment, the second glass plate 30 is provided with the low-emissivity film layer 32, and can transmit light in the wavelength range of 380-1200 nm, and the corresponding photovoltaic component 12, i.e., the crystalline silicon cell, can generate electricity in response to the light spectrum of 380-1200 nm, and the second glass plate 30 can play a role of heat insulation and heat preservation with respect to the indoor side, thereby improving the application value of the hollow glass 100 and the user experience.

[0029] Further, the hollow glass 100 further comprises an encapsulation assembly 22. The encapsulation assembly 22 is arranged between the first glass plate 10 and the second glass plate 30, and forms the accommodation space 21 together with the first glass plate 10 and the second glass plate 30.

[0030] The first substrate 11, for example, comprises a first region A and a second region B adjacent to the second substrate 31, and the first region A surrounds the second region B. The encapsulation assembly 22 is adhered to the first region A of the first substrate 11, and comprises a first adhesive layer 221, a support 222 and a molecular sieve 224. The support 222 is arranged between the first adhesive layer 221 and the molecular sieve 224, the first adhesive layer 221 is arranged on the side of the support 222 away from the accommodation space 21, and the molecular sieve 224 is arranged on the side of the support 222 close to the accommodation space 21. The photovoltaic component 12, the adhesive film layer 13 and the insulating layer 14 are adhered to the second region B of the first substrate 11.

[0031] For example, referring to Figure 2 For example, a region of 10-20 cm in width is left on the four peripheral portions of the first substrate 11 as the first region A, to serve as an encapsulation region for the encapsulation assembly 22, to ensure its firmness and sealing property. The internal region of the first substrate 11, which surrounds the first region A, serves as the second region B, and the photovoltaic component 12, the adhesive film layer 13 and the insulating layer 14 are adhered to the second region B.

[0032] The first glue layer 221 is formed by structural glue, for example, and has the characteristics of high strength, anti-peeling, impact resistance and simple construction process. The support 222 is a frame formed by a plurality of aluminum spacing strips, for example, and is arranged between the first substrate 11 and the second substrate 12 to have strong support performance. In addition, the hollow glass 100 also includes a second glue layer formed by a butyl rubber strip, for example, for bonding the support 222 between the first substrate 11 and the second substrate 12 and playing a role of water vapor sealing. The molecular sieve 224 can be understood as a crystalline aluminosilicate mineral ball, which is covered on the surface of the support 222 and used for absorbing moisture and residual organic matter in the hollow glass 100. Of course, in another embodiment, the support 222 is also a hollow aluminum strip, for example, and has small holes on the surface. The molecular sieve 224 is filled in the aluminum strip and can absorb moisture and residual organic matter in the hollow glass 100 through the small holes on the surface of the aluminum strip to play a role of dry anti-condensation. Of course, in this case, it is not limited as long as the same effect can be achieved. The arrangement of the first glue layer 221, the support 222 and the second glue layer can make the packaging assembly 22 have the characteristics of anti-tearing, non-deformation and strong sealing performance.

[0033] In summary, the first embodiment of the present application provides a kind of hollow glass, by arranging photoelectric assembly, i.e. a plurality of crystalline silicon battery pieces on the first glass plate, and filling inert gas in the accommodation space, even if crystalline silicon battery piece appears local high temperature, it cannot meet the combustion condition, and then it cannot burn, to ensure safety;In addition, by arranging low radiation film layer on the second glass plate, heat insulation can be achieved, and the application value and user experience of the hollow glass can be improved;In addition, by arranging molecular sieve on the support, the dryness of the hollow glass can be maintained, and the dry anti-condensation effect can be achieved;Furthermore, the overall structure of the hollow glass is simple, and the manufacturing process is relatively simple and easy to produce.

[0034]

Second embodiment

[0035] Referring to Figure 3 It shows a kind of hollow glass 200 disclosed by another embodiment of the present application, compared with the first embodiment described above, photoelectric assembly 74 is arranged on the second glass plate 70, and low radiation film layer 52 is coated or bonded on the first glass plate 50.

[0036] The hollow glass 200 includes a first glass plate 50 and a second glass plate 70, for example. The first glass plate 50 and the second glass plate 70 are arranged opposite and spaced apart. An accommodation space 61 is formed between the first glass plate 50 and the second glass plate 70, and the accommodation space 61 is used to fill inert gas.

[0037] The second glass plate 70 comprises a second substrate 71, an adhesive film layer 72, an insulating layer 73, and a photoelectric assembly 74. The adhesive film layer 72 is arranged on the side of the second substrate 71 close to the second glass plate 70. The insulating layer 73 is adhered to the side of the adhesive film layer 72 away from the second substrate 71. The photoelectric assembly 74 comprises a plurality of crystalline silicon cell pieces, and the plurality of crystalline silicon cell pieces are arranged on the side of the insulating layer 73 away from the adhesive film layer 72.

[0038] The second substrate 71, the adhesive film layer 72, the insulating layer 73, and the photoelectric assembly 74 can refer to the above-mentioned first embodiment, and will not be described herein. In the embodiment, the outer side of the first glass plate 50 is set as an outdoor environment, and the front side (i.e., the light-absorbing side) of the photoelectric assembly 74 is arranged towards the first glass plate 50. The power generation process of the photoelectric assembly 74 is as follows: the outdoor light successively transmits through the first glass plate 50 and the accommodating space 61 to irradiate on the surface of the photoelectric assembly 74, a part of photons are absorbed by the silicon material on the surface of the photoelectric assembly 74, the energy of the photons is transmitted to the silicon atoms, the electrons are transferred to become free electrons, and the potential difference is formed by the aggregation of the free electrons on both sides of the P-N junction. When the external circuit is connected, under the action of the voltage, the current will flow through the external circuit to generate a certain output power. The essence of the process is that the photon energy is converted into electric energy. The technology has been the prior art, and will not be described in detail herein.

[0039] Further, the first glass plate 50 comprises a first substrate 51 and a low-emissivity film layer 52, wherein the low-emissivity film layer 52 is located between the first substrate 51 and the second substrate 71.

[0040] In the embodiment, the first glass plate 50 can be understood as the second glass plate 30 in the above-mentioned embodiment, i.e., a low-emissivity glass (LOW-E glass). The first glass plate 50 is arranged to play a role of heat insulation and heat preservation relative to the indoor environment, so as to improve the use value of the hollow glass 200 and the experience of the user.

[0041] Further, the hollow glass 200 further comprises an encapsulation assembly 62, which is arranged between the first glass plate 50 and the second glass plate 70 and cooperates with the first glass plate 50 and the second glass plate 70 to form the accommodating space 61.

[0042] The second substrate 71 includes a first region C and a second region D adjacent to the first substrate 51, and the first region C surrounds the second region D. The encapsulation assembly 62 is adhered to the first region C of the second substrate 71 and includes a first adhesive layer 621, a support 622, and a molecular sieve 624. The support 622 is disposed between the first adhesive layer 621 and the molecular sieve 624. The first adhesive layer 621 is disposed on a side of the support 622 away from the accommodation space 61. The molecular sieve 624 is disposed on a side of the support 622 close to the accommodation space 61. The adhesive film layer 72, the insulating layer 73, and the optoelectronic assembly 74 are adhered to the second region D of the second substrate 71.

[0043] For example, referring to Figure 4 For example, a region of 10-20 cm is left on the four peripheral portions of the second substrate 71 as the first region C for encapsulation of the encapsulation assembly 62 to ensure firmness and sealing. The inner region of the second substrate 71 surrounds the first region C as the second region D. The adhesive film layer 72, the insulating layer 73, and the optoelectronic assembly 74 are adhered to the second region D.

[0044] The first adhesive layer 621 is formed of structural adhesive, for example, and has the characteristics of high strength, anti-peeling, impact resistance, and simple construction process. The support 622 is formed of a frame of multiple aluminum spacing strips, for example, and is disposed between the first substrate 51 and the second substrate 71 to have strong support performance. In addition, the hollow glass 200 further includes a second adhesive layer formed of butyl rubber strips, for example, to bond the support 622 between the first substrate 51 and the second substrate 71 and play a role of water vapor sealing. The molecular sieve 624 can be understood as a crystalline aluminosilicate mineral ball that covers the surface of the support 622 and is used to absorb moisture and residual organic matter in the hollow glass 200. In another embodiment, the support 622 is also a hollow aluminum strip, for example, with small holes on the surface. The molecular sieve 624 is filled in the aluminum strip, for example, and can absorb moisture and residual organic matter in the hollow glass 200 through the small holes on the surface of the aluminum strip to play a role of dry anti-frosting. Of course, in this case, it is not limited as long as the same effect can be achieved. The first adhesive layer 621, the support 622, and the second adhesive layer are arranged to make the encapsulation assembly 62 have the characteristics of anti-tearing, not easy to deform, and strong sealing.

[0045] In summary, the second embodiment of the present application provides a hollow glass, by setting the photoelectric assembly, i.e. multiple crystalline silicon cell pieces on the second glass plate, and filling the inclusions with inert gas, even if the crystalline silicon cell pieces appear local high temperature, it will not meet the combustion conditions, so that it cannot burn, to ensure safety; In addition, by setting a low-emissivity film layer on the first glass plate, it can play a role in heat preservation, and can improve the application value and user experience of the hollow glass; In addition, by setting a molecular sieve on the support, the dryness of the hollow glass can be maintained, and the dry anti-frosting effect can be achieved; Furthermore, the overall structure of the hollow glass is simple, and the relative manufacturing process is simple, easy to produce.

[0046] In addition, it can be understood that the foregoing various embodiments are only exemplary descriptions of the present application, and under the premise that the technical features do not conflict, the structure does not contradict, and does not violate the purpose of the application, the technical solutions of each embodiment can be arbitrarily combined and used.

[0047] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A hollow glass, characterized by, The hollow glass (100) comprises a first glass plate (10) and a second glass plate (30), the first glass plate (10) and the second glass plate (30) are oppositely and spacedly arranged, and a containing space (21) is formed between the first glass plate (10) and the second glass plate (30), and the containing space (21) is used for filling inert gas. The first glass plate (10) comprises: a first substrate (11); a photoelectric assembly (12) arranged on a side of the first substrate (11) close to the second glass plate (30), the photoelectric assembly (12) comprises a plurality of crystalline silicon cell pieces, and the front surface of the plurality of crystalline silicon cell pieces is arranged towards the first substrate (11), the area of the photoelectric assembly (12) is smaller than the area of the first substrate (11); a glue film layer (13) covering a side of the photoelectric assembly (12) away from the first substrate (11) and adhering the photoelectric assembly (12) to the first substrate (11), the area of the glue film layer (13) is greater than the area of the photoelectric assembly (12); and an insulating layer (14) adhered to a side of the glue film layer (13) away from the first substrate (11). The first substrate (11) comprises a first area (A) and a second area (B) on a side adjacent to the second substrate (31), the first area (A) surrounds the second area (B), and the width of the first area (A) ranges from 10 cm to 20 cm; the hollow glass (100) further comprises an encapsulation assembly (22) arranged between the first glass plate (10) and the second glass plate (30) and forming the containing space (21) together with the first glass plate (10) and the second glass plate (30), the encapsulation assembly (22) is adhered to the first area (A) of the first substrate (11), and the photoelectric assembly (12), the glue film layer (13) and the insulating layer (14) are adhered to the second area (B) of the first substrate (11).

2. The hollow glass according to claim 1, characterized in that The second glass plate (30) comprises a second substrate (31) and a low-emissivity film layer (32), and the low-emissivity film layer (32) is located between the first substrate (11) and the second substrate (31).

3. The hollow glass according to claim 2, wherein, The encapsulation assembly (22) comprises a first glue layer (221), a support (222) and a molecular sieve (224), the support (222) is arranged between the first glue layer (221) and the molecular sieve (224), the first glue layer (221) is arranged on a side of the support (222) away from the containing space (21), and the molecular sieve (224) is arranged on a side of the support (222) close to the containing space (21).

4. The hollow glass of claim 2, wherein, The low-emissivity film layer (32) has a transmission bandwidth ranging from 380 nm to 1200 nm.

5. A hollow glass, characterized by, The hollow glass (200) comprises a first glass plate (50) and a second glass plate (70), the first glass plate (50) and the second glass plate (70) are oppositely and spacedly arranged, and a containing space (61) is formed between the first glass plate (50) and the second glass plate (70), and the containing space (61) is used for filling inert gas. The second glass plate (70) comprises: a second substrate (71); a film layer (72) covering a side of the second substrate (71) close to the second glass plate (70); an insulation layer (73) adhered to a side of the film layer (72) away from the second substrate (71); a photoelectric assembly (74) arranged on a side of the insulation layer (73) away from the film layer (72), the photoelectric assembly (74) comprises a plurality of crystalline silicon cell pieces, and the front surface of the plurality of crystalline silicon cell pieces is arranged towards the first glass plate (50), the area of the photoelectric assembly (74) is smaller than the area of the first substrate (11), and the area of the film layer (72) is greater than the area of the photoelectric assembly (74); a first area (C) and a second area (D) are arranged on a side of the second substrate (71) close to the first substrate (51), the first area (C) surrounds the second area (D), and the width of the first area (C) ranges from 10 cm to 20 cm; the hollow glass (200) comprises an encapsulation assembly (62), the encapsulation assembly (62) is arranged between the first glass plate (50) and the second glass plate (70) and cooperates with the first glass plate (50) and the second glass plate (70) to form the containing space (61), the encapsulation assembly (62) is adhered to the first area (C) of the second substrate (71), and the film layer (72), the insulation layer (73), and the photoelectric assembly (74) are adhered to the second area (D) of the second substrate (71).

6. The hollow glass of claim 5, wherein, The first glass plate (50) comprises a first substrate (51) and a low-emissivity film layer (52), and the low-emissivity film layer (52) is arranged between the first substrate (51) and the second substrate (71).

7. The hollow glass of claim 6, wherein, The encapsulation assembly (62) comprises a first adhesive layer (621), a support (622), and a molecular sieve (624), the support (622) is arranged between the first adhesive layer (621) and the molecular sieve (624), the first adhesive layer (621) is arranged on a side of the support (622) away from the containing space (61), and the molecular sieve (624) is arranged on a side of the support (622) close to the containing space (61).

8. The hollow glass of claim 7, wherein, The low-emissivity film layer (52) has a transmittance bandwidth ranging from 380 nm to 1200 nm.

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