A circuit board copper plating monitoring system and method

Abstract

The embodiment of the specification provides a circuit board copper plating monitoring system and method, the system comprises: apparent detection module, light emitting device, detection frame, image acquisition device and processor; wherein the apparent detection module at least comprises an image detection device, the apparent detection module is used to determine the first hole internal defect of the circuit board;The light emitting device is mechanically connected with the detection frame, the light emitting device comprises at least one group of light emitting units and control circuit;The detection frame is used to fix the circuit board, and the detection frame comprises at least one group of light transmission plates;The image acquisition device is mechanically connected with the detection frame, and the image acquisition device and the light emitting device are located on both sides of the detection frame respectively;The processor is in communication connection with the apparent detection module, the light emitting device and the image acquisition device respectively, and the processor is configured to: based on the light emitting parameter, control the light emitting device to perform light emitting operation;Based on the image acquisition device, the detection image of the circuit board is acquired;And based on the detection image, the second hole internal defect of the circuit board is determined.

Description

TECHNICAL FIELD

[0001] The present specification relates to the technical field of circuit board preparation, and in particular to a circuit board copper plating monitoring system and method. BACKGROUND

[0002] With the rapid development of multifunctional and miniaturization of electronic equipment, the design of printed circuit boards also tends to be high density, high precision, high reliability, narrow spacing and fine line direction. In order to make full use of the limited board space and improve the wiring density, POFV (Plating On Filled Via) process and copper increasing process are born.

[0003] POFV refers to copper plating on the resin surface of the filled via hole on the printed circuit board. The copper increasing process refers to the process of making a conductive circuit layer by depositing copper in the resin substrate of the filled via hole on the printed circuit board. Copper plating is a chemical method of depositing a thin layer of chemical copper on the drilled printed circuit board substrate as a base for subsequent copper plating.

[0004] In the invention patent CN103134778B, a plurality of test holes are drilled on the circuit board, and after copper plating, the light transmission of the test hole is detected to determine the quality of copper plating. However, the patent does not consider the problem of poor drilling, and it is impossible to detect the test hole to find the copper plating defects caused by individual holes containing impurities (such as fiber, copper foil, unevenness, etc.) before copper plating.

[0005] Therefore, it is desirable to provide a circuit board copper plating monitoring system and method to achieve high detection accuracy and efficiency before and after copper plating. SUMMARY

[0006] One or more embodiments of the present specification provide a circuit board copper deposition monitoring system, the system comprising: an apparent detection module, a light emitting device, a detection frame, an image acquisition device and a processor; wherein the apparent detection module at least comprises an image detection device, the apparent detection module is used to determine the first in-hole defects of the circuit board; the light emitting device is mechanically connected with the detection frame, the light emitting device comprises at least one group of light emitting units and a control circuit; the detection frame is used to fix the circuit board, and the detection frame comprises at least one group of light transmission plates; the image acquisition device is mechanically connected with the detection frame, and the image acquisition device and the light emitting device are respectively located on both sides of the detection frame; the processor is in communication connection with the apparent detection module, the light emitting device and the image acquisition device respectively, and the processor is configured to: based on the apparent detection module, acquire the apparent data of the circuit board; based on the apparent data, determine the light emitting parameters of the light emitting device, the light emitting parameters at least comprising light emitting brightness; based on the light emitting parameters, control the light emitting device to perform light emitting operation; based on the image acquisition device, acquire the detection image of the circuit board; and based on the detection image, determine the second in-hole defects of the circuit board.

[0007] One or more embodiments of the present specification provide a circuit board copper deposition monitoring method, the method comprising: based on an apparent detection module, acquiring the apparent data of a circuit board; based on the apparent data, determining the light emitting parameters of a light emitting device, the light emitting parameters at least comprising light emitting brightness; based on the light emitting parameters, controlling the light emitting device to perform light emitting operation; based on an image acquisition device, acquiring the detection image of the circuit board; and based on the detection image, determining the second in-hole defects of the circuit board.

[0008] One or more embodiments of the present specification provide a circuit board copper deposition monitoring device, the device comprising a processor, the processor being used to execute the circuit board copper deposition monitoring method of any one of the above-mentioned embodiments.

[0009] One or more embodiments of the present specification provide a computer readable storage medium, the storage medium storing computer instructions, when a computer reads the computer instructions in the storage medium, the computer executes the circuit board copper deposition monitoring method of any one of the above-mentioned embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0010] The present specification will be further illustrated in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same numbers represent the same structures, wherein:

[0011] Figure 1 is an exemplary structural schematic diagram of a circuit board copper deposition monitoring system according to some embodiments of the present specification;

[0012] Figure 2 is an exemplary flowchart of a circuit board copper plating monitoring method according to some embodiments of the present specification;

[0013] Figure 3 is an exemplary flowchart of acquiring a detection image of a circuit board according to some embodiments of the present specification;

[0014] Figure 4 is an exemplary schematic diagram of a defect determination model according to some embodiments of the present specification;

[0015] Figure 5 is an exemplary flowchart of determining a processing parameter of a copper plating process according to some embodiments of the present specification. DETAILED DESCRIPTION

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is clear from the language context or otherwise stated, the same reference numbers in the drawings represent the same structures or operations.

[0017] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0018] As shown in the specification and claims, unless the context clearly indicates otherwise, "one", "a", "an", and / or "the" do not refer to the singular, but can also include the plural. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0019] Flowcharts are used in the present specification to illustrate the operations performed by the system according to the embodiments of the present specification. It should be understood that the preceding or subsequent operations do not necessarily have to be performed in sequence. Instead, the steps can be processed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or more steps of the operation can be removed from these processes.

[0020] Figure 1 is an exemplary structural schematic diagram of a circuit board copper plating monitoring system according to some embodiments of the present specification. As Figure 1As shown, the circuit board copper deposition monitoring system 100 can include an appearance detection module 110, a light emitting device 120, a detection frame 130, an image acquisition device 140, and a processor 150.

[0021] The appearance detection module 110 refers to a device or component for determining the first hole-in defects of the circuit board. For example, the appearance detection module 110 can be used to detect whether there are defects such as unsmoothness, foreign matter, etc. in the hole of the circuit board before the copper deposition process is performed. More information about the first hole-in defects can be found in Figure 2 and related descriptions.

[0022] In some embodiments, the appearance detection module 110 can include an image detection device or other devices that can obtain appearance data of the circuit board, such as an infrared scanning device, etc.

[0023] The light emitting device 120 can emit light of different brightness or light of different angles. In some embodiments, the light emitting device 120 can include at least one group of light emitting units and a control circuit. The light emitting device 120 can be mechanically connected with the detection frame 130.

[0024] The detection frame 130 refers to a device or component for fixing the circuit board. In some embodiments, the detection frame 130 can include at least one group of light transmission plates. The light transmission plates can be used to receive light transmitted through the circuit board.

[0025] The image acquisition device 140 refers to a device or component for acquiring images of the circuit board. For example, the image acquisition device 140 can include but is not limited to a camera, a video camera, etc. The image acquisition device 140 can be mechanically connected with the detection frame 130. The light emitting device 120 and the image acquisition device 140 can be located on the two sides of the detection frame 130, respectively.

[0026] The processor 150 can be used to process data and / or information obtained from other devices or system components. The processor 150 can execute program instructions based on these data, information and / or processing results to perform one or more functions described in this specification. For example, the processor can control the appearance detection module 110 to obtain appearance data of the circuit board; and determine the light emitting parameters of the light emitting device 120 based on the appearance data. In some embodiments, the processor 150 can be in communication connection with the appearance detection module 110, the light emitting device 120, and the image acquisition device 140.

[0027] Figure 2 is an exemplary flowchart of a circuit board copper deposition monitoring method according to some embodiments of the present specification. In some embodiments, the flow 200 can be executed by the processor 150. As shown, Figure 2 the flow 200 can include steps 210, 220, 230, 240 and 250.

[0028] At step 210, the appearance data of the circuit board is obtained based on the appearance detection module.

[0029] More details about the appearance detection module can be found in Figure 1 and related descriptions.

[0030] The appearance data refers to data related to the morphological characteristics of the circuit board. For example, the appearance data can include, but is not limited to, the size, material, thickness of the circuit board, the diameter size, distribution position, and density of the holes on the circuit board.

[0031] In some embodiments, the processor 150 can obtain the appearance data of the circuit board through the appearance detection module. For example, the appearance data of the circuit board is obtained by photographing the circuit board through the image detection device.

[0032] In some embodiments, the processor 150 can determine the first key detection area of the circuit board based on the appearance data.

[0033] The first key detection area refers to an area on the circuit board that needs to be detected by the appearance detection module.

[0034] In some embodiments, the processor 150 can determine the first key detection area based on the appearance data in various ways. For example, the processor 150 can determine the number of holes with first hole-in-defects in different detection areas on the circuit board based on the appearance data, and regard the detection area with a number greater than a first number threshold as the first key detection area. The first number threshold can be a preset value, etc. In some embodiments, the first number threshold can also be determined based on the size, material, and thickness of the circuit board, etc.

[0035] The detection area refers to a sub-area after the circuit board is divided. For example, the detection area can be a sub-area after the circuit board is divided into a grid.

[0036] The first hole-in-defect refers to a defect existing in the hole before the copper plating process is performed. For example, the inside of the hole is not smooth, there are sundries (such as fiber filaments, etc.), etc.

[0037] The copper plating process refers to an operation for plating copper on the circuit board.

[0038] In some embodiments, the processor 150 can determine the first hole-in-defect in various ways. For example, the processor 150 can obtain the image of the circuit board before the copper plating process is performed through the appearance detection module, compare it with the first standard image of the circuit board, and determine the first hole-in-defect of the circuit board. The first standard image can be drawn by a computer based on a sample circuit board before the copper plating process is performed.

[0039] In some embodiments of the present specification, the processor determines a first key detection area of the circuit board through the apparent data determination circuit, and controls the apparent detection module to detect the key detection area, which is beneficial to reduce the data calculation amount of the processor, improve the processing efficiency, and realize the key detection of the hole dense area, thereby improving the detection accuracy.

[0040] In step 220, the light emitting parameter of the light emitting device is determined based on the apparent data. For more information about the light emitting device, please refer to Figure 1 and the related description.

[0041] In some embodiments, the light emitting parameter can at least include the light emitting brightness of the light emitting device. In some embodiments, the light emitting parameter can also include other light emitting related parameters, such as the light emitting angle, etc.

[0042] The light emitting angle refers to the angle between the light emitted by the light emitting device and the detection frame. For more information about the detection frame, please refer to Figure 1 and the related description.

[0043] In some embodiments, the processor 150 can determine the light emitting parameter of the light emitting device based on the apparent data in various ways. For example, the smaller the diameter of the hole in the apparent data of the circuit board, the more dense the hole, and the greater the light emitting brightness of the light emitting device.

[0044] In step 230, the light emitting device is controlled to perform the light emitting operation based on the light emitting parameter.

[0045] In some embodiments, the processor 150 can control the light emitting device to perform the light emitting operation based on the light emitting parameter in various ways. For example, the processor 150 can generate a corresponding light emitting instruction based on the light emitting parameter, and issue the light emitting instruction to the light emitting device to control the light emitting device to perform the light emitting operation.

[0046] In step 240, the detection image of the circuit board is acquired based on the image acquisition device.

[0047] For more information about the image acquisition device, please refer to Figure 1 and the related description.

[0048] The detection image refers to the image related to the electroplating hole of the circuit board. The electroplating hole refers to the hole on the circuit board that needs to be copper-plated.

[0049] In some embodiments, the processor 150 can acquire the image acquisition parameter of different detection areas of the circuit board; and control the image acquisition device to acquire the detection images of different detection areas based on the image acquisition parameter. For more information about acquiring the detection images of different detection areas, please refer to Figure 3 and the related description.

[0050] In some embodiments, the detection image can include a plurality of images acquired by the light emitting device based on a plurality of different sets of light emitting parameters. In some embodiments, the processor 150 can determine the plurality of different sets of light emitting parameters based on the plating hole features of the detection region.

[0051] The plating hole features refer to features related to the plating holes. For example, the plating hole features can include, but are not limited to, the diameter size, depth, distribution position, and density of the plating holes. For more information about the plating holes, please refer to the relevant description above.

[0052] In some embodiments, the processor 150 can acquire the plating hole features of the detection region in various ways. For example, the processor 150 can acquire the plating hole features of the detection region by taking a picture of the circuit board through the image acquisition device 140.

[0053] In some embodiments, the processor 150 can determine the plurality of different sets of light emitting parameters based on the plating hole features of the detection region in various ways. For example, the processor 150 can determine the plurality of different sets of light emitting parameters through a preset data reference table based on the plating hole features of the detection region. In the preset data reference table, a plurality of different sets of light emitting parameters corresponding to different plating hole features are recorded. The preset data reference table can be preset based on prior knowledge or historical data.

[0054] In some embodiments, the processor 150 can generate a plurality of candidate light emitting parameter combinations based on the plating hole features of the detection region of the circuit board; calculate the illumination coverage of each candidate light emitting parameter combination in the plurality of candidate light emitting parameter combinations; determine a target light emitting parameter combination based on the illumination coverage and the number of light emitting parameters in the candidate light emitting parameter combination; and determine the plurality of light emitting parameters in the target light emitting parameter combination as the plurality of different sets of light emitting parameters.

[0055] The candidate light emitting parameter combination refers to a selectable light emitting parameter combination.

[0056] In some embodiments, each candidate light emitting parameter combination in the plurality of candidate light emitting parameter combinations can include one or more light emitting parameters.

[0057] In some embodiments, the processor 150 can generate a plurality of candidate light emitting parameter combinations based on the plating hole features in various ways. For example, the storage device can pre-store the correspondence between different plating hole features of the circuit board and the plurality of candidate light emitting parameter combinations, and the processor 150 can access the storage device based on the determined plating hole features to generate the plurality of candidate light emitting parameter combinations through the correspondence.

[0058] The illumination coverage refers to the coverage degree of the surface of all plating holes irradiated by light. The illumination coverage can be represented by a number, and the larger the number, the greater the coverage degree.

[0059] In some embodiments, the processor 150 can calculate the illumination coverage of each candidate light emitting parameter combination in various ways. For example, the processor 150 can first establish a three-dimensional model of the circuit board and the plating hole based on the plating hole feature through the illumination coverage simulation software; and then simulate the illumination of the circuit board model based on each candidate light emitting parameter combination through the illumination coverage simulation software to calculate the illumination coverage corresponding to the candidate light emitting parameter combination. There can be various ways to calculate the illumination coverage corresponding to the candidate light emitting parameter combination, for example, the processor 150 can divide the area of the plating hole surface irradiated in the simulation process by the total area of the plating hole surface to obtain the illumination coverage.

[0060] The target light emitting parameter combination refers to the finally determined light emitting parameter combination.

[0061] In some embodiments, the processor 150 can determine the target light emitting parameter combination based on the illumination coverage of the candidate light emitting parameter combination and the number of light emitting parameters in various ways. For example, the processor 150 can determine the candidate light emitting parameter combination as the target light emitting parameter combination, which has an illumination coverage greater than the illumination coverage threshold and a number of light emitting parameters less than the second number threshold. The illumination coverage threshold and the second number threshold can be default values, empirical values, pre-set values, or any combination thereof, and can be determined according to actual needs.

[0062] In some embodiments of the present specification, a plurality of candidate light emitting parameter combinations are generated based on the plating hole feature, and the illumination coverage of each candidate light emitting parameter combination is calculated, and finally a plurality of different light emitting parameters are determined, which ensures that when the light emitting device performs light emitting operation based on the plurality of different light emitting parameters, all surfaces of the plating holes can be irradiated as much as possible, which is beneficial for the subsequent image acquisition device to capture the plating holes to obtain a clear detection image.

[0063] In some embodiments, the detection image can also include a plurality of images obtained by the light emitting device based on a plurality of different light emitting parameters and a plurality of different shooting angles. For more information about the plurality of different light emitting parameters, please refer to the relevant description above.

[0064] In some embodiments of the present specification, the light emitting device obtains a plurality of detection images based on a plurality of different light emitting parameters and a plurality of different shooting angles, which avoids the problem that the shooting of the plating hole is not complete or clear enough under a single light emitting parameter or a single shooting angle, and is beneficial to improve the accuracy of subsequent judgment of the second hole defect.

[0065] In some embodiments, the processor 150 can generate a plurality of candidate shooting angle combinations based on the plating hole features of the detection area of the circuit board; calculate the shooting coverage of each candidate shooting angle combination in the plurality of candidate shooting angle combinations; determine a target shooting angle combination based on the shooting coverage and the number of shooting angles in the candidate shooting angle combination; and determine the plurality of shooting angles in the target shooting angle combination as a plurality of different shooting angles.

[0066] The candidate shooting angle combination refers to a selectable shooting angle combination.

[0067] In some embodiments, each candidate shooting angle combination in the plurality of candidate shooting angle combinations can include one or more shooting angles.

[0068] The shooting angle refers to the angle between the image acquisition device and the detection frame when the image acquisition device takes a picture of the circuit board. For more information about the detection frame, see Figure 1 and related descriptions.

[0069] In some embodiments, the processor 150 can generate a plurality of candidate shooting angle combinations based on the plating hole features in various ways. For example, the storage device can pre-store the correspondence between different plating hole features of the circuit board and a plurality of candidate shooting angle combinations, and the processor 150 can access the storage device based on the determined plating hole features to generate a plurality of candidate shooting angle combinations through the correspondence.

[0070] The shooting coverage refers to the degree of coverage of the surface of all plating holes that is captured by the image acquisition device. The shooting coverage can be represented by a number, and the larger the number, the greater the degree of coverage.

[0071] In some embodiments, the processor 150 can calculate the shooting coverage of each candidate shooting angle combination in various ways. For example, the processor 150 can first establish a three-dimensional model of the circuit board and the plating holes based on the plating hole features through the shooting coverage simulation software; and then simulate the shooting of the circuit board model based on each candidate shooting angle combination through the shooting coverage simulation software to calculate the shooting coverage corresponding to the candidate shooting angle combination. There can be various ways to calculate the shooting coverage corresponding to the candidate shooting angle combination, for example, the processor 150 can divide the area of the plating hole surface that is captured during the simulation by the total area of the plating hole surface to obtain the shooting coverage.

[0072] The target shooting angle combination refers to the finally determined shooting angle combination.

[0073] In some embodiments, the processor 150 can determine the target photographing angle combination based on the photographing coverage of the candidate photographing angle combination and the number of photographing angles in a variety of ways. For example, the processor 150 can determine the candidate photographing angle combination corresponding to the photographing coverage greater than the photographing coverage threshold and the number of photographing angles less than the third number threshold as the target photographing angle combination. The photographing coverage threshold and the third number threshold can be default values.

[0074] In some embodiments of the present specification, a plurality of candidate photographing angle combinations are generated through the via hole features, and the photographing coverage of each candidate photographing angle combination is calculated, and finally a plurality of different photographing angles are determined, which ensures that when the image acquisition device photographs the circuit board based on the plurality of different photographing angles, all surfaces of the via holes can be photographed as much as possible, which is beneficial to the subsequent judgment of the second in-hole defects.

[0075] At step 250, the second in-hole defect of the circuit board is determined based on the detection image.

[0076] The second in-hole defect refers to a defect related to the copper plating in the hole after the copper plating process is performed, for example, abnormal thickness of copper plating in the hole and uneven copper plating in the hole.

[0077] In some embodiments, the second in-hole defect can also include other in-hole defects, for example, no copper plating in part of the hole.

[0078] The abnormal thickness of copper plating in the hole can include but is not limited to the overall thickness of copper plating in the via hole being too thick or too thin.

[0079] The uneven copper plating in the hole can include but is not limited to the thickness of the copper plating in part of the via hole being uneven.

[0080] In some embodiments, the processor 150 can determine the second in-hole defect of the circuit board based on the detection image in a variety of ways. For example, the processor 150 can determine the second in-hole defect of the circuit board based on the detection image and image comparison with the second standard detection image. The second standard detection image can be an image drawn by a computer based on a sample circuit board after the copper plating process is performed.

[0081] In some embodiments, the processor 150 can process the detection image through a defect determination model to determine the second in-hole defect. The defect determination model is a machine learning model. For more information about determining the second in-hole defect through the defect determination model, please refer to Figure 4 and related descriptions thereof.

[0082] In some embodiments of the present specification, the light emitting parameters of the light emitting device are determined according to the appearance data of the circuit board, and the detection image of the circuit board is obtained to determine the second hole in-hole defects, so as to realize the monitoring of the copper plating condition of the circuit board, and improve the quality of the processed circuit board.

[0083] Figure 3 FIG. 3 is an example flowchart of obtaining the detection image of the circuit board according to some embodiments of the present specification. In some embodiments, the flow 300 can be executed by the processor 150. As shown in FIG. 3, the flow 300 can include step 310 and step 320. Figure 3

[0084] In step 310, the image acquisition parameters of different detection areas of the circuit board are obtained.

[0085] For more information about the detection area, please refer to Figure 2 and the related description.

[0086] The image acquisition parameters refer to the parameters related to the image acquisition of the circuit board by the image acquisition device. For example, the image acquisition parameters can include but are not limited to the magnification of the image acquisition device, the image resolution, etc.

[0087] In some embodiments, the processor 150 can obtain the image acquisition parameters of different detection areas of the circuit board in various ways. For example, the image acquisition parameters of different detection areas can be preset values, etc. For another example, the processor 150 can determine the image acquisition parameters of different areas of the circuit board based on the appearance data of the circuit board. For example only, the detection area with more holes on the circuit board can correspond to a larger magnification and image resolution.

[0088] In some embodiments, the image acquisition parameters are related to the second key detection area of the circuit board. For example, the magnification and image resolution corresponding to the second key detection area can be set to be larger.

[0089] The second key detection area refers to the area on the circuit board that needs to be detected by the image acquisition device.

[0090] In some embodiments, the processor 150 can determine the second key detection area of the circuit board in various ways. For example, the second key detection area can be a preset area, a default area, etc.

[0091] In some embodiments of the present specification, the magnification and image resolution corresponding to the second key detection area are set to be larger, so that clearer detection images can be obtained, which is conducive to detailed analysis of the plated holes in the second key detection area and improves the accuracy of the judgment of the second hole in-hole defects.

[0092] ​In some embodiments, the processor 150 can determine the second key detection area based on the plating hole features of the detection area. More about the plating hole features can be found in Figure 2 and the related descriptions.

[0093] In some embodiments, the processor 150 can determine the second key detection area based on the plating hole features of the detection area in multiple ways. For example, the processor 150 can determine the number of holes with the second in-hole defects in different detection areas on the circuit board based on the plating hole features, and take the detection area with a larger number (e.g., greater than a number threshold) of holes as the second key detection area. More about the ways of determining the second key detection area based on the plating hole features of the detection area can be found in Figure 2 the ways of determining the first key detection area based on the apparent data.

[0094] In some embodiments of the present specification, the processor determines the second key detection area of the circuit board based on the plating hole features, and controls the image acquisition device to focus on the detection, which is conducive to improving the processing efficiency while reducing the data calculation amount of the processor.

[0095] In step 320, the image acquisition device is controlled to acquire detection images of different detection areas based on the image acquisition parameters. More about the image acquisition device can be found in Figure 1 and the related descriptions. More about the detection images can be found in Figure 2 and the related descriptions.

[0096] In some embodiments, the processor 150 can control the image acquisition device 140 to acquire the detection images of the detection areas in multiple ways. For example, the processor 150 can generate a control instruction based on the image acquisition parameters, and issue it to the image acquisition device 140 to control the image acquisition device 140 to acquire the detection images of the detection areas.

[0097] In some embodiments of the present specification, the processor controls the image acquisition device to acquire detection images of different areas based on the image acquisition parameters, and different detection areas use different image acquisition parameters, which reduces the calculation amount and speeds up the calculation while ensuring the focus on the hole-intensive areas and improving the accuracy of the subsequent second in-hole defect judgment.

[0098] Figure 4 is an exemplary schematic diagram of a defect determination model according to some embodiments of the present specification.

[0099] In some embodiments, the processor 150 can process the detection images 410 through the defect determination model 430 to determine the second in-hole defects 450. More about the detection images and the second in-hole defects can be found in Figure 2 and the related descriptions.

[0100] In some embodiments, the defect determination model 430 can include an object recognition layer 431 and a defect detection layer 432.

[0101] The object recognition layer can be a machine learning model for determining an object box. In some embodiments, the object recognition layer can include a deep neural network model, etc.

[0102] In some embodiments, the input of the object recognition layer 431 can include the detection image 410; and the output can include one or more object boxes 440.

[0103] The object box refers to an image box containing a plated hole.

[0104] The defect detection layer can be a machine learning model for determining whether there is a second-in-hole defect. In some embodiments, the defect detection layer can include a deep neural network model, etc.

[0105] In some embodiments, the input of the defect detection layer 432 can include one or more object boxes 440; and the output can include whether the plated hole in the object box has a second-in-hole defect 450.

[0106] In some embodiments, the input of the object recognition layer 431 can further include detection images of multiple shooting angles of multiple light-emitting angles of the same detection area 420. More details about the detection images of multiple shooting angles of multiple light-emitting angles of the same detection area can be found in Figure 2 and the related description thereof.

[0107] In some embodiments of the present specification, the detection images of multiple shooting angles of multiple light-emitting angles of the same detection area are used as the input of the model, which avoids the misjudgment when only a single detection image is used for judgment, and improves the accuracy of the second-in-hole defect judgment.

[0108] In some embodiments, the object recognition layer 431 and the defect detection layer 432 can be obtained through joint training.

[0109] In some embodiments, the training samples for joint training can include sample detection images corresponding to sample circuit boards. The label can include sample second-in-hole defects of the sample circuit boards corresponding to the set of training samples. In some embodiments, the training samples can be obtained based on historical data (e.g., historical detection images of circuit boards), and the label can be obtained through manual annotation.

[0110] In some embodiments, the sample detection image is input into the object recognition layer to obtain an object frame output by the object recognition layer, the object frame is input into the defect detection layer as training sample data, and a second hole-in-defect output by the defect detection layer is obtained. A loss function is constructed based on the sample second hole-in-defect and the second hole-in-defect output by the defect detection layer, and parameters of the object recognition layer and the defect detection layer are synchronously updated. Through parameter updating, a trained object recognition layer and a trained defect detection layer are obtained.

[0111] As can be seen in the present specification, a large number of features can reflect the second hole-in-defect to some extent. However, sometimes some features do not have effective values, and sometimes available feature values are insufficient to determine the second hole-in-defect alone or through simple rules. Therefore, by using the defect determination model, the second hole-in-defect can be determined based on a large number of and extensive features, breaking the limitations of traditional rule-based methods. The rule-based method is limited by its complexity and can only be based on fewer features and is limited by human rules. By using machine learning technology for prediction, more and richer features can be trained, and the predicted second hole-in-defect can have higher accuracy.

[0112] Figure 5 is an exemplary flowchart of determining processing parameters of a copper plating process according to some embodiments of the present specification. In some embodiments, the flow 500 can be executed by the processor 150. As shown in Figure 5 , the flow 500 includes steps 510 and 520.

[0113] Step 510, based on the second hole-in-defect of the circuit board, determining a risk level of the copper plating process.

[0114] For more information about the copper plating process and the second hole-in-defect, please refer to Figure 2 and related descriptions thereof.

[0115] The risk level refers to an evaluation parameter for measuring the copper plating quality of the circuit board. In some embodiments, the risk level can be represented in the form of a vector. For example, the risk level vector can be represented as (a, b, c, d). Wherein a represents the total number of plated holes with the second hole-in-defect; b represents the number of different types of plated holes with the second hole-in-defect respectively; c represents the number of plated holes with abnormal copper plating thickness in the hole; and d represents the number of plated holes with uneven copper plating in the hole. The type of plated hole can be determined based on the plated hole features, for example, the plated holes are divided into different types according to the diameter size of the plated holes. For more information about the plated hole features, please refer to Figure 2 and related descriptions thereof.

[0116] In some embodiments, the processor 150 can determine the risk level based on the second-in-hole defects of the circuit board in various manners. For example, the processor can input the number and type of the electroplated holes with the second-in-hole defects into an embedding layer for processing to obtain the risk level. The processing of the embedding layer is essentially a process of extracting deep information. For example, the risk level obtained through the embedding layer can include the corresponding relationship features between the second-in-hole defects and the copper plating quality. In some embodiments, the embedding layer can be obtained by joint training with the defect determination model. For more information about the defect determination model, please refer to Figure 4 and the related description thereof.

[0117] At step 520, the processing parameter of the copper plating process is determined based on the risk level.

[0118] The processing parameter refers to a parameter related to the copper plating process. For example, the processing parameter can include, but is not limited to, solution concentration, processing temperature, stirring speed, etc.

[0119] In some embodiments, the processor 150 can determine the processing parameter of the copper plating process based on the risk level in various manners. For example, the processor 150 can determine the processing parameter of the copper plating process based on the risk level through a preset data reference table. In the preset data reference table, the processing parameters of the copper plating process corresponding to different risk levels are recorded. The preset data reference table can be preset based on prior knowledge or historical data.

[0120] In some embodiments, the processor 150 can determine the processing parameter of the copper plating process based on the risk level by matching the vector database. For example, the processor 150 can construct a first target vector based on the risk level; determine a first associated vector based on the first target vector through a first vector database; and determine the reference processing parameter of the copper plating process corresponding to the first associated vector as the processing parameter of the copper plating process corresponding to the first target vector.

[0121] The first target vector can be a vector representation of the risk level. For more information about the risk level, please refer to the related description above.

[0122] The first vector database includes a plurality of first reference vectors, and each of the plurality of first reference vectors has a corresponding reference processing parameter of the copper plating process.

[0123] The first reference vector can be a vector representation of the corresponding historical risk level based on the circuit board produced in a historical time period, and the reference processing parameter of the copper plating process corresponding to the first reference vector can be the preferred historical processing parameter of the copper plating process corresponding to the circuit board produced in the historical time period.

[0124] In some embodiments, the processor 150 can calculate the vector distance between the first target vector and the first reference vector respectively, and determine the processing parameter of the copper plating process of the first target vector. For example, the first reference vector that meets a preset condition with the vector distance between the first target vector is taken as the first associated vector, and the reference processing parameter of the copper plating process corresponding to the first associated vector is taken as the processing parameter of the copper plating process corresponding to the first target vector. The preset condition can be set according to the situation. For example, the preset condition can be that the vector distance is the smallest or the vector distance is less than a distance threshold, etc. The vector distance can include but is not limited to cosine distance, Mahalanobis distance, Euclidean distance, etc.

[0125] In some embodiments, the vector database matching can also consider the illumination coverage and the shooting coverage. For example, the processor 150 can construct a second target vector based on the risk level, the illumination coverage and the shooting coverage; determine a second associated vector through the second vector database based on the second target vector; and determine the reference processing parameter of the copper plating process corresponding to the second associated vector as the processing parameter of the copper plating process corresponding to the second target vector.

[0126] The second target vector refers to a vector constructed based on the risk level, the illumination coverage and the shooting coverage. There can be various ways to construct the second target vector. For example, the processor 150 can input the risk level, the illumination coverage and the shooting coverage into an embedding layer for processing to obtain the second target vector.

[0127] The second reference vector refers to a vector constructed based on the historical risk level, the historical illumination coverage and the historical shooting coverage of the circuit board produced in the historical time period, and the reference processing parameter of the copper plating process corresponding to the second reference vector can be the preferred historical processing parameter of the copper plating process corresponding to the circuit board produced in the historical time period. The construction method of the second reference vector can refer to the construction method of the second target vector described above.

[0128] In some embodiments, the processor 150 can calculate the vector distance between the second target vector and the second reference vector respectively, and determine the processing parameter of the copper plating process of the second target vector. For the method of determining the processing parameter of the copper plating process of the second target vector, please refer to the determination method of the processing parameter of the copper plating process of the first target vector described above.

[0129] In some embodiments of the present specification, the risk level of the copper plating process is determined based on the second hole defect of the circuit board, and then the processing parameter of the copper plating process is determined through vector matching based on the risk level, the illumination coverage and the shooting coverage, so that the finally determined processing parameter is more targeted, and the quality of the circuit board obtained after copper plating is improved.

[0130] It should be noted that the description of processes 200, 300, and 500 above are merely for illustration and explanation and do not limit the applicability of the present description. Various modifications and changes can be made by those skilled in the art to processes 200, 300, and 500 under the guidance of the present description. However, such modifications and changes are still within the scope of the present description.

[0131] Having described the basic concepts, it is obvious that the above detailed disclosure is only for example and does not limit the present description. Although not explicitly described, those skilled in the art can make various modifications, improvements, and changes to the present description. Such modifications, improvements, and changes are suggested in the present description, so such modifications, improvements, and changes are still within the spirit and scope of the exemplary embodiments of the present description.

[0132] Meanwhile, the present description uses specific words to describe the embodiments of the present description. As "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure, or characteristic related to at least one embodiment of the present description. Therefore, it should be emphasized and noted that "an embodiment" or "one embodiment" or "one alternative embodiment" mentioned in the present description twice or more does not necessarily mean the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present description can be properly combined.

[0133] Furthermore, unless the claim explicitly states, the order of processing elements and sequences, the use of numerical letters, or the use of other names in the present description is not intended to limit the order of the processes and methods of the present description. Although some currently considered useful embodiments of the invention are discussed in the above disclosure through various examples, it should be understood that such details are only for illustration and the additional claims are not limited to the disclosed embodiments, but rather the claims are intended to cover all modifications and equivalent combinations within the spirit and scope of the embodiments of the present description. For example, although the above-described system components can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on existing servers or mobile devices.

[0134] Similarly, it should be noted that in order to simplify the description of the present disclosure and to help understand one or more embodiments of the invention, the above description of the embodiments of the present description sometimes combines various features into one embodiment, figure, or description thereof. However, this disclosure method does not mean that the features required by the present description are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the above-described single embodiment.

[0135] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0136] For each patent, patent application, patent application publication, and other material, such as articles, books, specifications, publications, and documents, referenced in this specification, the entire contents of which are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials to this specification and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0137] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. A circuit board copper plating monitoring system, characterized in that, The system includes: an appearance detection module, a light-emitting device, a detection frame, an image acquisition device, and a processor; wherein, The appearance inspection module includes at least an image detection device, and the appearance inspection module is used to determine defects in the first hole of the circuit board. The light-emitting device is mechanically connected to the detection frame, and the light-emitting device includes at least one set of light-emitting units and a control circuit. The testing frame is used to fix the circuit board, and the testing frame includes at least one set of light-transmitting plates; The image acquisition device is mechanically connected to the detection frame, and the image acquisition device and the light emission device are respectively located on both sides of the detection frame; The processor is communicatively connected to the appearance detection module, the light emission device, and the image acquisition device, respectively, and the processor is configured to: Based on the appearance detection module, the appearance data of the circuit board is obtained; Based on the apparent data, the defects in the first hole and the luminous parameters of the light-emitting device are determined. The defects in the first hole refer to the defects that exist in the hole before the copper plating process is performed. The luminous parameters include at least the luminous brightness. Based on the light emission parameters, the light emission device is controlled to perform light emission operation; Based on the image acquisition device, an inspection image of the circuit board is acquired; and Based on the detected image, a second in-hole defect is determined in the circuit board. The second in-hole defect refers to a defect present in the hole after the copper plating process is performed.

2. The system according to claim 1, characterized in that, The second in-hole defect includes at least one of abnormal copper plating thickness and uneven copper plating. The step of acquiring a detection image of the circuit board based on the image acquisition device includes: Obtain image acquisition parameters for different detection areas of the circuit board; Based on the image acquisition parameters, the image acquisition device is controlled to acquire the detection images of different detection areas respectively.

3. The system according to claim 2, characterized in that, The emission parameters also include the emission angle, and the detected image includes multiple images acquired by the emission device based on multiple sets of different emission parameters. The multiple sets of different luminescence parameters are determined based on the electroplating hole characteristics of the detection area.

4. The system according to claim 1, characterized in that, The processor is also used for: Based on the defects in the second hole of the circuit board, the risk level of the copper plating process is determined; Based on the risk level, the processing parameters for the copper plating process are determined.

5. A method for monitoring copper plating on a circuit board, characterized in that, The method includes: Based on the appearance inspection module, obtain the appearance data of the circuit board; Based on the apparent data, the first hole defect and the light emission parameters of the light emission device of the circuit board are determined. The first hole defect refers to the defect that exists in the hole before the copper plating process is performed. The light emission parameters include at least the light emission brightness. Based on the light emission parameters, the light emission device is controlled to perform light emission operation; Based on the image acquisition device, an inspection image of the circuit board is acquired; and Based on the detected image, a second in-hole defect is determined in the circuit board. The second in-hole defect refers to a defect present in the hole after the copper plating process is performed.

6. The method according to claim 5, characterized in that, The second in-hole defect includes at least one of abnormal copper plating thickness and uneven copper plating. The image acquisition device acquires a detection image of the circuit board, including: Obtain image acquisition parameters for different detection areas of the circuit board; Based on the image acquisition parameters, the image acquisition device is controlled to acquire the detection images of different detection areas respectively.

7. The method according to claim 6, characterized in that, The emission parameters also include the emission angle, and the detected image includes multiple images acquired by the emission device based on multiple sets of different emission parameters. The multiple sets of different luminescence parameters are determined based on the electroplating hole characteristics of the detection area.

8. The method according to claim 5, characterized in that, The method further includes: Based on the defects in the second hole of the circuit board, the risk level of the copper plating process is determined; Based on the risk level, the processing parameters for the copper plating process are determined.

9. A circuit board copper plating monitoring device, the device comprising at least one processor and at least one memory; The at least one memory is used to store computer instructions; The at least one processor is configured to execute at least a portion of the computer instructions to implement the method as described in any one of claims 5 to 8.

10. A computer-readable storage medium storing computer instructions that, when executed by a processor, implement the method as described in any one of claims 5 to 8.

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