Low profile 1 / 256 taylor weighted suspended ribbon line network and method of manufacture

Abstract

The application discloses a low-profile 1 / 256 Taylor weighting suspended strip line network and a manufacturing method, relates to the technical field of radar electronic antenna and feeder subsystems, and comprises the following steps: step one, manufacturing a Wilkinson mode 1 / 256 Taylor weighting microstrip board; step two, welding resistors and total port connectors on the microstrip board; step three, manufacturing a shell with an air cavity and a cover plate; step four, installing 256 branch port connectors on the shell and KK adapter connectors on the cover plate, and the 256 branch port connectors are located in the air cavity region; and step five, installing the microstrip board to the shell and completing the interconnection of the microstrip board and the 256 branch port connectors. The 1 / 256 Taylor weighting suspended strip line network can be used below the X waveband, the loss is greatly reduced due to the adoption of air medium, in addition, the network is continuous and two-dimensional Taylor weighting is used, the standing wave ratio is less than or equal to 2, the insertion loss is less than or equal to 3.3 dB at 8 GHz, the amplitude consistency is less than or equal to ±0.4 dB, and the isolation degree is greater than or equal to 18 dB, and the electrical performance is excellent.

Description

Technical Field

[0001] This invention relates to the field of radar electronic antenna feed system technology, specifically to a low-profile 1-section 256 Taylor weighted suspended stripline network and its manufacturing method. Background Technology

[0002] Microstrip-based synthesizers offer advantages such as high power capacity and excellent port performance. They can provide specific amplitude and phase distributions for radiating elements, allowing the antenna's radiation pattern to take on specific shapes to meet diverse requirements. As microwave circuits evolve towards wider bandwidths and higher power, synthesizers face demands for low in-band flatness and high output power. Compared to traditional microstrip-based grounded synthesizers, the field distribution of the suspended stripline is primarily in the air, eliminating radiation losses and reducing dielectric losses, resulting in lower transmission line losses. Therefore, it is one of the preferred technologies for fabricating large-scale synthesizers.

[0003] The existing suspended stripline is integrated with the metal housing through insulating supports and metal partitions, allowing the conductors on the microstrip board to levitate within the metal housing containing upper and lower air cavities. Finally, the interconnection between the connector's internal conductors and the network feed is completed on the horizontal plane. When used in a composite network, an antenna system is formed by blindly matching the horizontal antenna with the vertical composite network.

[0004] However, traditional integration methods all have certain drawbacks:

[0005] 1. The dielectric constant of the insulating dielectric support that can be precisely machined and reliably installed is usually above 3.5, which is much greater than the dielectric constant of air (1). It is also greatly affected by temperature. When fabricating large-scale synthetic networks, a large amount of insulating dielectric support is inevitably introduced, which leads to the deformation of the microstrip board, affects the network performance, and cannot improve the resonance phenomenon of large-scale synthetic networks.

[0006] 2. The sandwich structure formed by the metal partition wall provides good support for the microstrip board. At the same time, cutting the shell into multiple small walls can eliminate the resonance phenomenon of the network. However, the metal partition wall has a significant impact on the microwave field structure. The microwave circuit pattern must be kept at a certain distance from the metal partition wall, which increases the network size. In addition, the microstrip board needs to be irregularly cut, which affects the rigidity and assemblability of the microstrip board, and thus affects the network performance.

[0007] 3. Both integrated installation methods require the microstrip board to have a certain installation space and installation strength, that is, the thickness of the microstrip board needs to be more than 1.5mm, which weakens the effect of the air cavity and causes a large amount of heat from the high-power antenna system in the countermeasure field to be coupled to the stripline side, resulting in temperature rise and reduced reliability.

[0008] Traditional integration methods can meet the design requirements of 1-to-32 synthesized networks below C-band, but they are not applicable to the 1-to-256 synthesized network of the X-band with low profile requirements, planar size ≥550mm*550mm, as required in this invention. Therefore, it is urgent to establish a low-profile 1-to-256 Taylor-weighted floating stripline network and its manufacturing method to solve a series of problems such as large size, high profile, difficult integration, and decreased electrical performance and reliability of traditional synthesized networks, improve the consistency and reliability of processing and assembly, simplify and speed up the process flow, improve the excellent telecommunications indicators, and enhance reliability.

[0009] In view of the above-mentioned defects, the inventors of this invention have finally obtained this invention after a long period of research and practice. Summary of the Invention

[0010] The purpose of this invention is to provide a low-profile 1 / 256 Taylor-weighted suspended microstrip network and its manufacturing method, which solves a series of problems in traditional suspended microstrip assembly processes, such as large microstrip board thickness and poor electrical performance, poor dimensional accuracy of irregularly shaped microstrip boards, difficulty in assembling suspended microstrips, and large profile of network vertical interconnect antenna systems. This provides a further solution for the efficient and highly reliable integration of large-scale networks.

[0011] The present invention solves the above-mentioned technical problems through the following technical solution, and the present invention includes the following steps:

[0012] Step 1: Fabricate a Wilkinson pattern 1-to-256 Taylor weighted microstrip board;

[0013] Step 2: Solder the resistors and main connectors onto the microstrip board;

[0014] Step 3: Manufacture the shell and cover plate with air cavity;

[0015] Step 4: Install 256 split connectors on the housing and install KK adapter connectors on the cover plate. All 256 split connectors are located in the air cavity area.

[0016] Step 5: Install the microstrip board into the housing and complete the interconnection between the microstrip board and the 256 split connectors;

[0017] Step 6: Complete the interconnection of the cover plate, microstrip board and housing, and at the same time complete the interconnection of the KK adapter connector and the main port connector.

[0018] Preferably, the specific processing steps of the microstrip board in step one are as follows: drilling, hole metallization, resin plugging, electroplating, pattern making, surface coating, and shape processing are performed sequentially on the raw material copper-clad board; wherein, hole metallization completes the production of metallized through holes, and hole metallization, resin plugging, and electroplating complete the production of metallized plugged holes.

[0019] Preferably, the copper clad laminate material is selected with a dielectric constant of less than 3.0 and a dielectric loss of less than 0.0015.

[0020] Preferably, the surface of the microstrip plate is coated with any one of electroplated gold, electroless gold, electroplated silver, or electroless silver.

[0021] Preferably, the specific steps of step two are as follows: place the microstrip board on a flat welding fixture and flatten it, and interconnect the resistors with resistor pads and the main connector pads with the main connector through soldering.

[0022] Preferably, in step four, both the split connector and the KK adapter connector are assembled using one of the following methods: screw mounting, conductive adhesive bonding, or soldering.

[0023] Preferably, in step six, the housing and cover plate are interconnected using bolts, while the KK adapter connector and the main port connector are blind-matched.

[0024] The present invention also proposes a low-profile 1 / 256 Taylor-weighted suspended strip network, which is manufactured according to the above-mentioned method for manufacturing suspended strip networks, including a shell and a microstrip plate; the shell has a cavity, and the four sides of the microstrip plate are respectively fixed to the four inner walls of the cavity. The network pattern of the microstrip plate is interconnected with KK adapter connectors, 256 split connectors and resistors.

[0025] Preferably, the outer casing includes a housing, a cover plate, and a plurality of bolts; the housing and the cover plate are respectively provided with a first air cavity and a second air cavity, the housing and the cover plate clamp the outer edge of the microstrip plate, and the plurality of bolts pass through the cover plate and the microstrip plate in sequence and are screwed to the housing.

[0026] Preferably, the microstrip board is provided with 256 metallized vias, which are interconnected with the microstrip board's port network pattern. Metallized insertion ports are formed inside the metallized vias. The inner end of the port connector is interconnected with an inner conductor. The inner conductor passes through the metallized insertion port and is soldered to the metallized via. The outer end of the port connector is interconnected with an outer conductor. The outer conductor is soldered to an antenna.

[0027] A resistor is provided on the back side of the microstrip board, and a metallized via is provided on the microstrip board. The resistor and the metallized via are interconnected by soldering, and the metallized via is interconnected with the matching network pattern of the microstrip board.

[0028] The rear side of the microstrip board is interconnected with a main port connector via soldering, and the main port connector is interconnected with a KK adapter connector.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] (1) The 1-256 Taylor weighted floating stripline network prepared in this invention can be used below the X-band. Due to the use of air medium, the loss is greatly reduced. In addition, the network is continuous and uses two-dimensional Taylor weighting, which can achieve a standing wave ratio ≤2, insertion loss ≤3.3dB@8GHz, amplitude consistency ≤±0.4dB, isolation ≥18dB, and excellent electrical performance.

[0031] (2) In this invention, 256-channel network synthesis with a planar size of less than 600mm*600mm can be realized. Compared with traditional multi-combination network synthesis, it has better consistency and the thickness of the planar section is reduced by more than 70%, which meets the higher technical requirements of miniaturization and high consistency of the model products.

[0032] (3) The process method of the present invention has higher production efficiency. The suspended microstrip line does not need to be grounded by large-area welding, which eliminates the influence of thermal history brought by vacuum phase welding on the dimensional stability of the microstrip board, ensures assembly accuracy and reliability, and greatly improves production efficiency. Compared with the traditional multi-combination network production time, it is shortened by more than 50%.

[0033] (4) The 1-point 256 Taylor weighted suspension wire network prepared in this invention has extremely low loss, which reduces the network's operating temperature when used at high power. At the same time, it has a highly reliable mechanical structure with screw fixation, which can meet the environmental test requirements of 500 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, and has good reliability and environmental adaptability. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of a traditional non-suspended strip 1-to-32 network;

[0035] Figure 2 This is a schematic diagram of the structure of a traditional non-suspended strip 1-to-32 network irregular microstrip plate;

[0036] Figure 3 This is a process flow diagram of a traditional non-suspended belt conveyor with a 1-to-32 network.

[0037] Figure 4 This is a schematic diagram of the integrated assembly of a traditional non-suspended strip 1-to-32 network;

[0038] Figure 5 This is a schematic diagram of the structure of the 1-256 Taylor-weighted suspended strip network in Example 1;

[0039] Figure 6 This is a top view schematic diagram of the microstrip board with a 1 / 256 Taylor-weighted suspended strip network in Example 1;

[0040] Figure 7 This is a schematic diagram of the structure of the 1-256 Taylor-weighted suspended strip network in Example 1;

[0041] Figure 8 This is a schematic diagram of the integrated assembly of the 1-minute 256-Taylor weighted floating strip network in Example 1;

[0042] Figure 9 This is a process flow diagram of the 1-256 Taylor-weighted suspended strip network in Example 3. Detailed Implementation

[0043] Comparative Example

[0044] This example is a comparative example. Figure 1-2 This is a schematic diagram of a traditional non-suspended dual 1-to-32 network structure. The antenna unit includes a metal partition wall 2 and a cover plate 11, which are fixed together by bolts 9. There is a cutout 10 inside the metal partition wall 2, and the bottom of the cutout 10 is partially silver-plated. A shaped microstrip board 1 is welded to the inside of the cutout 10 by solder pads 3. The shaped microstrip board 1 has a split network pattern 4. An RF connector 6 is provided on the outer wall of the metal partition wall 2.

[0045] Figure 3 The process flow diagram for assembling a traditional non-suspended dual 1-to-32 network is shown. The irregularly shaped microstrip board 1 is fixed to the bottom of the cutout 10 by welding with 0.1mm Sn63Pb37 solder pads 3. The RF connector 6 is fixed to the outer wall of the metal partition 2 by welding with Sn63Pb37 connector solder wire 5, and the welding is completed using vacuum phase welding. The 32 connector inner conductors 7 are interconnected with the split network pattern 4 one by one using solder wire 8. Finally, the housing 2 and the cover plate 11 are fixed with bolts 9.

[0046] Figure 4 This is an assembly diagram of 8 groups of 1-to-32 network and antenna. The inner conductor 12 of the connector is interconnected with the antenna 13 through solder wire 16. The connector of the power divider and the connector 15 on the antenna 13 are blindly matched through a double female KK adapter connector 14.

[0047] The above-mentioned and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings.

[0048] Example 1

[0049] This embodiment provides a technical solution: a method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network, such as... Figure 5-8 As shown, it includes the following steps:

[0050] Step 1: Fabricate a thin Wilkinson pattern 1-point 256 Taylor weighted microstrip board 19;

[0051] The processing steps of the microstrip board 19 are as follows: drilling, hole metallization, resin plugging, electroplating, pattern making, surface coating, and shape processing are performed sequentially on the copper-clad board; among them, hole metallization completes the production of metallized through holes, and hole metallization, resin plugging and electroplating complete the production of metallized plug holes 23.

[0052] The copper clad laminate material should have a dielectric constant of less than 3.0 and a dielectric loss of less than 0.0015. For example, the copper clad laminate material for microstrip board 19 can be one of the following: Rogers' RT6002, RO3003, CLTE-XT; Taconic's TSM-DS3; Ruilong's RA300B; China Electronics Technology Group Corporation's 46th Research Institute's CF294, CFG294; Guoneng's GNC3004, GNC3003; and Shengyi Technology's SG7300N, SG9294. This avoids introducing too much insulating dielectric support, which would cause deformation of microstrip board 19, improves network performance, and reduces the resonance phenomenon of large network patterns.

[0053] Mounting holes are provided in the area where the microstrip plate 19 is held by the housing 20 and the cover plate 18. Densely shielded metallized holes 26 are provided in the large area of ​​the microstrip plate 19 in contact with the housing and the cover plate at a distance of 0.15-0.3mm. The positional accuracy of the metallized through holes 26 and the non-metallized through holes of the microstrip plate 19 is ±0.05mm. The accuracy of the external machining dimensions of the microstrip plate 19 is -0.1-0mm.

[0054] The surface of the microstrip 19 is coated with any one of electroplated gold, electroless gold, electroplated silver, or electroless silver.

[0055] Solder mask dams and silkscreen reference numbers are added to the surface of microstrip board 19. Solder mask dams are used to prevent solder from overflowing and shifting. Silkscreen reference numbers are used to mark the positions of resistor pads 39 and network interface pads 27.

[0056] Step 2: Solder resistor 38 and main connector 33 onto microstrip board 19;

[0057] Place the microstrip board 19 on the welding fixture. To ensure the flatness of the microstrip board 19, the welding fixture must be a single piece and flatten the microstrip board 19. Align the resistor 38 with the two corresponding resistor pads 39. Use the resistor solder wire 37 to connect the resistor 38 with the resistor pads 39 on the back of the microstrip board 19. Use the connector solder wire 32 to connect the main connector pad 31 and the main connector 33 on the back of the microstrip board 19.

[0058] To achieve interconnection between resistor 38 and matching network pattern 24, metallized vias 23 are used in conjunction with resin vias and electroplating. Specifically, resistor 38 is interconnected with matching network pattern 24 through metallized vias 23; matching network pattern 24 is interconnected with network interface pads 27 through metallized vias 26; to reduce the impact of heating on the dimensional stability of microstrip board 19, localized heating is required.

[0059] Step 3: Manufacture the housing 20 with the air cavity and the cover plate 18;

[0060] The materials used to make the housing 20 and the cover plate 18 are aluminum alloys, such as 5A06 aluminum alloy. Both the housing 20 and the cover plate 18 are made by CNC milling. The structural dimensions of both are ±0.03mm, and the flatness should be ≤0.1mm. The housing 20 is machined with an appropriate number of through holes, and the cover plate 18 is machined with internal thread holes corresponding to the through holes.

[0061] The surfaces of the housing 20 and the cover plate 18 are subjected to an overall conductive oxide process, which gives the surfaces of the housing 20 and the cover plate 18 a rust-proof function, a glossy and beautiful surface, and eliminates residual stress on the surface.

[0062] Step 4: Install 256 split connectors 29 on the housing 20 and install the KK adapter connector 36 of the main port on the cover plate 18;

[0063] Both the split connector 29 and the KK adapter connector 36 are installed and fixed in their corresponding positions by one of the following methods: screw mounting, conductive adhesive bonding, or soldering. When using screws 34 for installation, thread-locking adhesive should be used between the screws 34 and the housing 20 to prevent the screws 34 from falling off. When soldering, the connector solder ring 30 is used to interconnect the split connector 29 and the KK adapter connector 36. When using conductive adhesive bonding, one of the following conductive adhesives can be used: Epo-tek's H20E, Henkel's 84-1A, Heilongjiang Petrochemical Research Institute's J-423, J-425, J-427, J-428, or Zhengzhou Silande's MF1343.

[0064] Step 5: Install the microstrip board 19 on the housing 20 to complete the interconnection between the microstrip board 19 and the split connector 29;

[0065] The microstrip board 19, with the main connector 33 and resistor 38 soldered on, is transferred from the soldering fixture to the housing 20 for positioning. Then, 256 connector inner conductors 41 are installed one by one into the 256 metallized insertion ports 22 of the microstrip board 19. Through manual soldering, inner conductor solder wires 40 are formed to complete the interconnection between the connector inner conductors 41 and the microstrip board 19. The connector inner conductors 41 only have contact with the inner conductor solder wires 40 and have no contact with the metallized through holes 26.

[0066] Step 6: Complete the interconnection between cover plate 18 and microstrip board 19, KK adapter connector 36 and main port connector 33;

[0067] When the cover plate 18 is fitted with the housing 20, the KK adapter connector 36 and the main port connector 33 on the microstrip board 19 are blindly mated. The cover plate 18 and the housing 20 are fixed by passing the bolt 17 through the through hole on the cover plate 18, the mounting hole on the microstrip board 19 and the internal thread. To ensure firmness, thread locking glue is applied to the bolt 17 during installation to prevent the bolt 17 from loosening.

[0068] Example 2

[0069] This embodiment provides a technical solution: a method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network, which is a refinement of Embodiment 1. The parts identical to those in Embodiment 1 will not be repeated here. Figure 5 , Figure 7 and Figure 8 As shown, in order to further and better realize the present invention, the following configuration is specifically adopted: First, a 1-to-256 microstrip board 19 with a size of 550mm*550mm is prepared using 0.254mm CFG294. The surface coating material of the microstrip board 19 is chemical gold plating. Then, it is placed on a soldering fixture and flattened. The resistor 38 is interconnected with the resistor pad 39 on the back of the network through the resistance solder wire 37. The main connector pad 31 and the main connector 33 are interconnected through the connector solder wire 32.

[0070] In order to achieve the interconnection between resistor 38 and the composite network, metallized via 23 is made by resin plugging and electroplating. That is, resistor 38 is connected to the matching composite network 24 through metallized via 23; network split pad 27 is interconnected with the split network pattern 25 of microstrip board 19 through metallized through hole 26.

[0071] The housing 20 with the first air cavity 21 is interconnected with the outer conductor 28 of the connector via the connector solder ring 30 using induction soldering. The solder type is Sn63Pb37. The soldered microstrip board 19 is fitted to the inner conductor 41 of the connector through the metallized insertion hole 22. Then the microstrip board 19 is fixed, and the interconnection between the inner conductor 41 of the connector and the network interface pad 27 of the microstrip board 19 is completed through the inner conductor solder wire 40.

[0072] Secure the flange 35 to the cover plate 18 with screws 34 using the KK adapter connector 36. Then, interconnect the KK adapter connector 36 with the main connector 33. Finally, secure the three components by passing bolts 17 through the cover plate 18, microstrip plate 19, and housing 20 in sequence.

[0073] The other end of the network connector, the outer conductor 28, is interconnected with the antenna 44 via the outer conductor solder wire 43, as shown below. Figure 8 As shown.

[0074] The 1 / 256 Taylor-weighted suspended stripline network fabricated in this embodiment has a VSWR ≤ 2.0, insertion loss ≤ 3.2 dB @ 8 GHz, amplitude uniformity ≤ ±0.4 dB, and isolation ≥ 18 dB, with a profile size reduced by 70% compared to the comparative model. It can meet the environmental test requirements of 500 temperature cycles (-40℃ to +75℃) and 13.88 g random vibration, demonstrating good reliability and environmental adaptability.

[0075] Example 3

[0076] This embodiment provides a technical solution: a method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended stripline network, which is optimized based on the traditional 1 / 32 network structure. The parts identical to the traditional 1 / 32 network structure will not be described again here. Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 8 As shown, in order to further and better realize the present invention, the following configuration is specifically adopted: the copper clad laminate is made of RA300B; the metallized through holes on the microstrip board 19 are replaced with conductive copper paste instead of via-plugging resin; the surface of the microstrip board 19 is coated with silver; the interconnection method of the split connector 29 is conductive adhesive, the material is J-423, and the curing temperature is 30min@120℃; the interconnection method of the main port KK conversion connector 36 is conductive adhesive, the material is J-423, and the curing temperature is 30min@120℃.

[0077] The 1 / 256 Taylor weighted floating stripline network of this embodiment has a VSWR ≤1.8, insertion loss ≤3.0dB@8GHz, amplitude uniformity ≤±0.35dB, and isolation ≥20dB. The cross-sectional dimensions are reduced by 75% compared to the comparison model. It can meet the environmental test requirements of 500 temperature cycles (-40℃~+75℃) and 13.88g random vibration, and has good reliability and environmental adaptability.

[0078] Example 4

[0079] This embodiment provides a technical solution: a low-profile 1-section 256-Taylor weighted floating strip network, such as... Figure 5 , Figure 6 and Figure 8As shown, the microstrip board 19 includes an outer shell with an internal cavity and a microstrip board 19 disposed within the cavity. The outer shell includes a housing 20 and a cover plate 18 that cooperate with each other. The outer edge of the microstrip board 19 is clamped and fixed by the housing 20 and the cover plate 18. The housing 20 and the cover plate 18 are locked and fixed by bolts 17, which also pass through the microstrip board 19 and fix it together. The cavity includes a first air cavity 21 opened in the housing 20 and a second air cavity 42 opened in the cover plate 18. The first air cavity 21 and the second air cavity 42 make both sides of the microstrip board 19 open, so that the suspended strip line eliminates the radiation loss in the traditional microstrip line mode and reduces the dielectric loss, resulting in lower transmission line loss. The thin Wilkinson mode 1 / 256 Taylor weighted microstrip board 19 is a double-sided microstrip board with a dielectric thickness ≤0.508mm and a finished surface copper thickness ≥0.05mm.

[0080] The front side of the microstrip board 19 (i.e., the contact surface with the housing 20) is a network pattern, and the back side of the microstrip board 19 (i.e., the contact surface with the cover plate 18) is a component mounting surface. The front and back sides of the microstrip board 19 have metal cutouts at the positions where they contact the first air cavity 21 and the second air cavity 42, respectively, and a large area of ​​metal layer is retained at the positions where they contact the first air cavity 21 and the second air cavity 42.

[0081] The back of the microstrip board 19 is provided with a main connector pad 31. The main connector pad 31 is interconnected with a main connector 33 by connector solder wire 32. A KK adapter connector 36 is installed on the cover plate 18. The KK adapter connector 36 is a double female connector. The KK adapter connector 36 is installed and fixed on the cover plate 18 by one of the following methods: screw mounting, conductive adhesive bonding, or soldering. The main connector 33 and the KK adapter connector 36 are interconnected. In this embodiment, the KK adapter connector 36 is fixed to the cover plate 18 by screw mounting. The KK adapter connector 36 is inserted into the cover plate 18 and abutted by a flange 35. The flange 35 is fixed to the cover plate 18 by screws 34.

[0082] Resistors 38 are soldered on the back of the microstrip board 19. The number and position of the resistors 38 are set according to actual needs. Each resistor 38 is installed as follows: two corresponding metallized plug holes 23 are set on the microstrip board 19, and the metallized plug holes 23 are interconnected with the matching network pattern 24. On the back of the microstrip board 19, there are resistor pads 39 interconnected with the metallized plug holes 23. The resistors 38 are soldered to the resistor pads 39 by resistance solder wire 37. The pad pattern accuracy is ±0.02mm, which ensures the accuracy of the position of the resistor pads 39.

[0083] 256 split connectors 29 are fixed on the housing 20. The split connectors 29 are installed and fixed on the housing 20 by one of the following methods: screwing, conductive adhesive, and welding. The split connectors 29 are double male, that is, both sides of the installation are plug type.

[0084] The microstrip board 19 has a large area of ​​densely shielded metallized vias 26. The diameter of the metallized vias 26 is 0.3-0.5mm, and there are 256 metallized vias 26. Each of the 256 split connectors 29 corresponds to one of the 256 metallized vias 26. The network split pads 27 are interconnected with the split network pattern 25 using the metallized vias 26. The interior of the metallized vias 26 forms a metallized insertion port 22. The inner port of the split connector 29 is interconnected with the inner conductor 41 of the connector. The inner conductor 41 of the connector is adapted to the metallized insertion port 22. The inner conductor 41 of the connector is interconnected with the network split pad 27 through the inner conductor solder wire 40. The outer port of the split connector 29 is interconnected with the outer conductor 28 of the connector. The outer conductor 28 of the connector is interconnected with the antenna 44 through the outer conductor solder wire 43.

[0085] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network, characterized in that: The process includes the following steps: Step 1: Manufacturing a Wilkinson pattern 1-256 Taylor weighted microstrip board; Step 2: Solder the resistors and main connectors onto the microstrip board; Step 3: Manufacture the shell and cover plate with air cavity; Step 4: Install 256 split connectors on the housing and install KK adapter connectors on the cover plate. All 256 split connectors are located in the air cavity area. Step 5: Install the microstrip board into the housing and complete the interconnection between the microstrip board and the 256 split connectors; Step 6: Complete the interconnection of the cover plate, microstrip board and housing, and at the same time complete the interconnection of the KK adapter connector and the main port connector; The suspended strip network prepared according to the above method includes a shell and a microstrip plate; the shell has a cavity, and the four sides of the microstrip plate are respectively fixed to the four inner walls of the cavity. The network pattern of the microstrip plate is interconnected with KK adapter connectors, 256 split connectors and resistors. The outer casing includes a shell, a cover plate, and multiple bolts; the shell and the cover plate are respectively provided with a first air cavity and a second air cavity, the shell and the cover plate clamp the outer edge of the microstrip plate, and the multiple bolts pass through the cover plate and the microstrip plate in sequence and are screwed to the shell.

2. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 1, characterized in that, The specific processing steps of the microstrip board in step one are as follows: drilling, hole metallization, resin plugging, electroplating, pattern making, surface coating, and shape processing are carried out sequentially on the raw material copper-clad board; among them, hole metallization completes the production of metallized through holes, and hole metallization, resin plugging and electroplating complete the production of metallized plugged holes.

3. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 2, characterized in that, The copper clad laminate material is selected with a dielectric constant of less than 3.0 and a dielectric loss of less than 0.0015.

4. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 2, characterized in that, The surface of the microstrip plate is coated with any one of electroplated gold, electroless gold, electroplated silver, or electroless silver.

5. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 1, characterized in that, The specific steps of step two are as follows: place the microstrip board on a flat welding fixture and flatten it. Then, interconnect the resistors with the resistor pads and the main connector pads with the main connector using a soldering process.

6. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 1, characterized in that, In step four, both the split connector and the KK adapter connector are assembled using one of the following methods: screw mounting, conductive adhesive bonding, or soldering.

7. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 1, characterized in that, In step six, bolts are used to connect the housing and the cover plate, while the KK adapter connector and the main port connector are blind-matched.

8. The method for manufacturing a low-profile 1 / 256 Taylor-weighted suspended strip network according to claim 7, characterized in that, The microstrip board has 256 metallized vias, which are interconnected with the microstrip board's port network pattern. Metallized insertion ports are formed inside the metallized vias. The inner end of the port connector is interconnected with an inner conductor, which passes through the metallized insertion port and is soldered to the metallized via. The outer end of the port connector is interconnected with an outer conductor, which is soldered to an antenna. A resistor is provided on the back side of the microstrip board, and a metallized via is provided on the microstrip board. The resistor and the metallized via are interconnected by soldering. The metallized via is interconnected with the matching network pattern of the microstrip board. The rear side of the microstrip board is interconnected with a main port connector via soldering, and the main port connector is interconnected with a KK adapter connector.

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