A detector system and imaging apparatus

Abstract

The embodiments of the present specification provide a detector system and an imaging device, the system comprising a first photosensor array and a second photosensor array which are arranged oppositely and identically, and a readout module, the first photosensor array and the second photosensor array being configured to output an electrical signal associated with a radiation photon, the readout module comprising a first readout unit and a second readout unit which are configured identically and configured to process the electrical signal.

Description

TECHNICAL FIELD

[0001] The present specification relates to the field of medical equipment, in particular to a detector system and an imaging device. BACKGROUND

[0002] Emission Computed Tomography (ECT) detector is a kind of detection device for measuring or detecting radiation photon energy, which is widely used in the field of nuclear medicine, such as Positron Emission Tomography (PET) / Single-Photon Emission Computed Tomography (SPECT). The dual-end readout detector can read the output of the sensor array at the top and bottom of the detector crystal, and based on the difference between the readout values of the two ends, the depth of the radiation photon occurring in the crystal is located, so as to eliminate errors and improve the resolution and sensitivity of the detector. In some dual-end readout detectors, the structures of the dual-end sensor array board and the signal readout board are designed separately, and the coding mode, channel lead-out and signal processing of the sensor array are relatively complex, with high cost and poor maintainability.

[0003] Therefore, it is desirable to provide a detector system and an imaging device. SUMMARY

[0004] One of the embodiments of the present specification provides a detector system. The system comprises: a first photosensor array and a second photosensor array which are oppositely arranged and configured identically, for outputting optical signals related to radiation photons; and a readout module comprising a first readout unit and a second readout unit which are configured identically, for processing the electrical signals.

[0005] In some embodiments, the coding mode of the first photosensor array divides the first photosensor array into a first part and a second part along a first direction; the coding mode of the second photosensor array divides the second photosensor array into a third part and a fourth part along the first direction; the coding mode of the first part of the first photosensor array is the same as that of the third part of the second photosensor array, and the coding mode of the second part of the first photosensor array is the same as that of the fourth part of the second photosensor array; the first part and the second part of the first photosensor array are centrosymmetric in shape, and the third part and the fourth part of the second photosensor array are centrosymmetric in shape.

[0006] In some embodiments, the first photosensor array and the second photosensor array comprise two or more detection units; the first portion, the second portion, the third portion, and the fourth portion comprise the same number of detection units.

[0007] In some embodiments, the first readout unit is connected to the first portion of the first photosensor array and the third portion of the second photosensor array; the second readout unit is connected to the second portion of the first photosensor array and the fourth portion of the second photosensor array. The first portion of the first photosensor array and the third portion of the second photosensor array correspond in position, the coding order of the detection units of the first portion of the first photosensor array is mirror-symmetrical about the first direction to the coding order of the detection units of the third portion of the second photosensor array along the second direction; the second portion of the first photosensor array and the fourth portion of the second photosensor array correspond in position, the coding order of the detection units of the second portion of the first photosensor array is mirror-symmetrical about the first direction to the coding order of the detection units of the fourth portion of the second photosensor array.

[0008] In some embodiments, the first readout unit is connected to the first portion of the first photosensor array and the fourth portion of the second photosensor array; the second readout unit is connected to the second portion of the first photosensor array and the third portion of the second photosensor array. The first portion of the first photosensor array and the fourth portion of the second photosensor array correspond in position, the coding order of the detection units of the first portion of the first photosensor array is mirror-symmetrical about the second direction to the coding order of the detection units of the third portion of the second photosensor array; the second portion of the first photosensor array and the third portion of the second photosensor array correspond in position, the coding order of the detection units of the second portion of the first photosensor array is mirror-symmetrical about the second direction to the coding order of the detection units of the fourth portion of the second photosensor array; wherein the second direction is perpendicular to the first direction.

[0009] In some embodiments, the first portion comprises a first interface, the second portion comprises a second interface, the third portion comprises a third interface, and the fourth portion comprises a fourth interface, the readout module is connected to the first photosensor array and the second photosensor array through the first interface, the second interface, the third interface, and the fourth interface.

[0010] In some embodiments, the first photosensor array includes two oppositely positioned first and second surfaces, and the second photosensor array includes two oppositely positioned third and fourth surfaces; the first and second interfaces are disposed on the first surface of the first photosensor array, and the third and fourth interfaces are disposed on the third surface of the second photosensor array; the second surface of the first photosensor array and the fourth surface of the second photosensor array are oppositely positioned.

[0011] One of the embodiments of the present specification provides an imaging device, which includes a plurality of the described detector systems, the plurality of detector systems are arranged around an axis and enclose a cylindrical scanning region. BRIEF DESCRIPTION OF DRAWINGS

[0012] The present specification will be further described in the manner of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same numbers refer to the same structures, in which:

[0013] Figure 1 is a schematic diagram of an application scenario of a detector system according to some embodiments of the present specification;

[0014] Figure 2 is a schematic diagram of a detector system according to some embodiments of the present specification;

[0015] Figure 3 is a structural schematic diagram of a detector system according to some embodiments of the present specification;

[0016] Figure 4 is a schematic diagram of a detector array according to some embodiments of the present specification;

[0017] Figure 5 is a schematic diagram of a connection of components of a detector system according to some embodiments of the present specification.

[0018] Figure 6A , Figure 6B is a coding schematic diagram of a detector array according to some embodiments of the present specification;

[0019] Figure 7 is a schematic diagram of a connection of components of a detector system according to some embodiments of the present specification;

[0020] Figure 8 is a schematic diagram of a sensor array according to some embodiments of the present specification. DETAILED DESCRIPTION

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is clear from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structure or operation.

[0022] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, sections or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0023] As shown in the specification and claims, unless the context clearly indicates otherwise, the words "one", "a", "an", and / or "the" do not refer to the singular, but can also include the plural. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0024] Flowcharts are used in the present specification to illustrate the operations performed by the system according to the embodiments of the present specification. It should be understood that the preceding or subsequent operations are not necessarily performed in sequence. On the contrary, each step can be processed in reverse order or simultaneously. At the same time, other operations can be added to these processes, or one or more steps of the operation can be removed from these processes.

[0025] In some application scenarios, a medical imaging device can be included, and the medical imaging device can include the detector system disclosed in the present specification, thereby realizing multiplexing of the sensor array board and the signal readout board, reducing the design and maintenance difficulty, reducing the maintenance and research and development cost, improving the maintainability of the device, and achieving better economic benefits.

[0026] Figure 1 is a schematic diagram of an application scenario of the detector system according to some embodiments of the present specification.

[0027] As Figure 1 shown, in some embodiments, the system 100 can include a medical imaging device 110, a processing device 120, a storage device 130, a terminal 140, and a network 150.

[0028] The medical imaging device 110 refers to a device that reproduces the structure inside a target object as an image using different media in a medical field. In some embodiments, the target object can be a living being such as a patient, an animal, etc., or a man-made object such as a phantom, etc. The target object can be a specific part of a patient, for example, an organ and / or tissue. In some embodiments, the medical imaging device 110 can be any medical device that includes a detector to image or treat a specific body part of a patient using a radionuclide, for example, SPECT, PET, PET-CT, MRI (magnetic resonance imaging)-PET, SPECT-CT, etc. The medical imaging device 110 provided above is for illustrative purposes only and is not intended to limit the scope thereof. The detector in the medical imaging device 110 can receive radiation from a radiation source and measure the received radiation. In some embodiments, the medical imaging device 110 can include a plurality of detector systems as shown in some embodiments of the present specification, which are arranged around an axis and enclose a cylindrical scanning region. In some embodiments, the medical imaging device 110 can acquire medical imaging data by scanning and transmit the same to the processing device 120. The medical imaging device 110 can receive instructions, etc. sent by the terminal 140 of a doctor and perform relevant operations such as irradiation imaging, etc. according to the instructions. In some embodiments, the medical imaging device 110 can exchange data and / or information with other components (e.g., the processing device 120, the storage device 130, the terminal 140) in the system 100 through the network 150. In some embodiments, the medical imaging device 110 can be directly connected to other components in the system 100.

[0029] The processing device 120 can process data and / or information obtained from other devices or system components. In some embodiments, the processing device 120 can process medical imaging data obtained from the medical imaging device 110. In some embodiments, the processing device 120 can obtain stored data and / or information from the storage device 130. In some embodiments, the processing device 120 can include one or more sub-processing devices (e.g., single-core processing devices or multi-core multi-core processing devices).

[0030] The storage device 130 can store data or information generated by other devices. In some embodiments, the storage device 130 can store data and / or information generated by other components (e.g., the medical imaging device 110, the processing device 120) in the system 100. The storage device 130 can include one or more storage components, each of which can be a separate device or a part of other devices. The storage device can be local or implemented through the cloud.

[0031] The terminal 140 can control the operation of the medical imaging device 110. A physician can issue an operation instruction to the medical imaging device 110 through the terminal 140 to cause the medical imaging device 110 to perform a designated operation, such as irradiating a designated body part of a patient for imaging. In some embodiments, the terminal 140 can be one or any combination of a mobile device 140-1, a tablet computer 140-2, a laptop computer 140-3, a desktop computer, and other devices with input and / or output functions.

[0032] The network 150 can connect the components of the system and / or connect the system with external resources. The network 150 enables communication between the components and with other parts outside the system, facilitating exchange of data and / or information. In some embodiments, one or more components in the system 100 (e.g., the medical imaging device 110, the processing device 120, the storage device 130, the terminal 140) can send data and / or information to other components through the network 150. In some embodiments, the network 150 can be any one or more of a wired network or a wireless network.

[0033] It should be noted that the foregoing description is provided for illustrative purposes only and is not intended to limit the scope of the present specification. Various changes and modifications can be made to the present specification under the guidance of one of ordinary skill in the art. The features, structures, methods, and other characteristics of the exemplary embodiments described in the present specification can be combined in various ways. For example, the processing device 120 can be based on a cloud computing platform, such as a public cloud, a private cloud, a community cloud, and a hybrid cloud. However, these changes and modifications do not depart from the scope of the present specification.

[0034] Figure 2 is a schematic diagram of a detector system according to some embodiments of the present specification.

[0035] As Figure 2 shown, in some embodiments, the detector system 200 can include a dual-end readout detector. In some embodiments, the detector system 200 can include a first photodetector array 210, a second photodetector array 220, and a readout module 230.

[0036] In some embodiments, the detector system can include a sensor array composed of a plurality of sensors, such as the first photodetector array 210 and the second photodetector array 220. The sensor array (photodetector array) can include a plurality of detection units (also referred to as sensors or sensor units), each of which can be an independent sensor (photocurrent conversion element), such as a photomultiplier tube, an avalanche photodiode, a silicon photomultiplier (SiPM), and the like.

[0037] In some embodiments, a plurality of detection units adjacent to each other can form a detector unit (combination of detection units), for example, as shown in Figure 8 A 2*2 detection units form a detector unit. In some embodiments, a sensor array can be composed of detector units of a fixed size, for example, as shown in Figure 8 The sensor array shown in the figure is composed of 2*2 detector units, including a total of 16*14 detection units, 4*14 detector units. In some embodiments, the detector units can also be of other sizes, for example, 2*3, 3*3, etc.

[0038] In some embodiments, the first photoelectric sensor array 210 and the second photoelectric sensor array 220 can be oppositely arranged and configured identically; oppositely arranged means that one surface of the first photoelectric sensor array 210 is placed opposite to one surface of the second photoelectric sensor array 220; configured identically can mean that the structure and encoding manner of the first photoelectric sensor array 210 and the second photoelectric sensor array 220 are identical, and the first photoelectric sensor array 210 and the second photoelectric sensor array 220 are in a mirror-symmetrical relationship. For example, the first photoelectric sensor array 210 and the second photoelectric sensor array 220 can be physically identical. For another example, the second photoelectric sensor array 220 identical to the first photoelectric sensor array 210 can be obtained by copying the first photoelectric sensor array 210. In some embodiments, configured identically can mean that the encoding and the encoding order are identical. For example, the first photoelectric sensor array 210 and the second photoelectric sensor array 220 both include 16*14 detection units as shown in Figure 8 The encoding manner is

[0039] In some embodiments of the present specification, the multiplexing of the dual-end array board is realized by using the same sensor array board, which reduces the design and maintenance complexity of the detector system in the medical imaging device (for example, PET, SPECT, etc.), and effectively reduces the design and maintenance cost.

[0040] In some embodiments, the first photoelectric sensor array 210 and the second photoelectric sensor array 220 can be used to output an electrical signal related to a radiation photon (for example, a gamma photon). In some embodiments, the sensors in the first photoelectric sensor array 210 and the second photoelectric sensor array 220 can be any sensor capable of receiving scintillation light and converting it into an electrical signal, for example, a photomultiplier tube, an avalanche photodiode, a silicon photomultiplier (SiPM), etc., or any combination thereof.

[0041] In some embodiments, the detector system 200 can further include a scintillation crystal arrayFigure 2 The scintillation crystal array can include a plurality of scintillation crystals (crystals), which can be used to convert the incident radiation photons into scintillation light, and the first photosensor array 210 and the second photosensor array 220 can be used to convert the scintillation light into electrical signals.

[0042] In some embodiments, the first photosensor array 210 and the second photosensor array 220 can include two or more detection units, for example, the first photosensor array 210 can include at least a detection unit 211 and a detection unit 212, and the second photosensor array 220 can include at least a detection unit 221 and a detection unit 222. In some embodiments, each detection unit can correspond to an encoding for identifying the location of the detection unit.

[0043] In some embodiments, the correspondence between the number of scintillation crystals and the number of detection units of the first photosensor array 210 and / or the second photosensor array 220 can not be limited, and can be any one of one-to-one, one-to-many, many-to-one, many-to-many, or any combination thereof. For example, for the detection units of the first photosensor array 210 or the second photosensor array 220, one detection unit can be configured to detect scintillation light from one scintillation crystal; or one detection unit can be configured to detect scintillation light from two or more scintillation crystals; or scintillation light from one scintillation crystal can be detected by two or more detection units; or one detection unit can be configured to detect scintillation light from two or more scintillation crystals, and scintillation light from one scintillation crystal can be detected by two or more detection units.

[0044] In some embodiments, the first photosensor array 210 can include a first portion and a second portion, and the second photosensor array 220 can include a third portion and a fourth portion.

[0045] In some embodiments, the number of detection units included in the first portion, the second portion, the third portion, and the fourth portion can be the same, for example, 2*2. For more details about the first portion, the second portion, the third portion, and the fourth portion, please refer to the related content of Figure 4 、 Figure 6A and Figure 6B , which will not be repeated here.

[0046] In some embodiments, the readout module 230 can be used to process the electrical signals output by the first photoelectric sensor array 210 and the second photoelectric sensor array 220. For example, the readout module 230 can read the electrical signals output by the detection units in the first photoelectric sensor array 210 and the second photoelectric sensor array 220, and output the position of the detection unit according to the encoding and decoding corresponding to the detection unit. In some embodiments, the readout module 230 may include a first readout unit 231 and a second readout unit 232, and the configuration of the first readout unit 231 and the second readout unit 232 may be the same. The same configuration of the first readout unit 231 and the second readout unit 232 may mean that the structure of the first readout unit 231 and the second readout unit 232 and the readout logic of the electrical signals are the same. For example, the first readout unit 231 and the second readout unit 232 may be completely identical. For another example, a second readout unit 232 identical to the first readout unit 231 can be obtained by copying the first readout unit 231. Here, copying means obtaining an integrated circuit or semiconductor device with the same structure through the same design scheme.

[0047] The first readout unit 231 can be used to process electrical signals output from a portion of the first photoelectric sensor array 210 and a portion of the second photoelectric sensor array 220. The second readout unit 232 can be used to process electrical signals output from another portion of the first photoelectric sensor array 210 and another portion of the second photoelectric sensor array 220.

[0048] In some embodiments of this specification, by using the same readout board at both ends under a preset encoding method, the readout board is reused, which reduces the design and maintenance complexity of the detector system in medical imaging equipment (e.g., PET, SPECT, etc.) and effectively reduces design and maintenance costs.

[0049] In some embodiments, the detector system 200 may include a main control module ( Figure 2 (Not shown), the main control module can be connected to the readout module 230 (e.g., electrically connected).

[0050] In some embodiments, the main control module can be used to determine the radiation photon information based on the readout signal of the readout module 230, such as the incident position, energy deposition, incident time, and the depth information of the radiation photon's interaction within the crystal.

[0051] In some embodiments, for SPECT imaging, the main control module can send the determined radiation photon information to the processing device 120 to reconstruct the image.

[0052] In some embodiments, for PET imaging, the detector system 200 may further include a coincidence plate ( Figure 2The determined radiation photon information can be transmitted to a coincidence circuit (not shown) of the processing device 120. The coincidence circuit can determine coincidence events based on the radiation photon information, and transmit the coincidence events to the processing device 120 for image reconstruction.

[0053] For PET imaging, a target object (e.g., a patient) can be injected with a radioactive source (e.g., a radioactive tracer isotope) before scanning. The radioactive tracer isotope can emit one or more positrons upon decay. The positrons can travel a short distance (e.g., about 1-3 mm) inside the target object before interacting with an electron, annihilating and generating photons (e.g., one positron annihilation can generate a pair of gamma photons, each with an energy of 511 keV). The annihilation event can be referred to as a radiation event. Meanwhile, the pair of gamma photons can move in opposite directions and can be received by the detector system 200. The path of the pair of gamma photons can be referred to as a line of response, and the pair of gamma photons can be referred to as a coincidence event if they are received or detected by two detection elements located on the same line of response. Upon receiving the gamma photons, the detection elements of the detector system 200 can record the time of receiving the gamma photons and convert the optical signals into electrical signals, such as timing pulses. The electrical signals, such as timing pulses, can then be transmitted to a coincidence circuit for discrimination and coincidence determination based on a coincidence time window to determine coincidence events.

[0054] In some embodiments, the detector system 200 can include a scan region for accommodating a target object. The array of scintillation crystals can be arranged around an axial direction of the scan region. The axial direction of the scan region can refer to a direction in which the target object is moved into or out of the scan region. The first array of photosensors 210 and the second array of photosensors 220 can be located at a first end (e.g., an end away from the target object) and a second end (e.g., an end close to the target object) of the array of scintillation crystals, respectively.

[0055] As an example, the first array of photosensors 210, the second array of photosensors 220, and the array of scintillation crystals can be arranged in a ring shape around the axial direction of the scan region. The first array of photosensors 210 and the second array of photosensors 220 can be radially located at the two ends of the array of scintillation crystals, respectively. For example, the array of scintillation crystals can be radially located between the first array of photosensors 210 and the second array of photosensors 220.

[0056] Figure 3 is a structural diagram of a detector system according to some embodiments of the present disclosure. In some embodiments, the detector system 200 can be implemented according to the detector system 300. Optionally, the detector system 200 can include a plurality of detector systems 300 arranged around an axis, and the plurality of detector systems 300 can enclose a substantially cylindrical scan region.

[0057] In some embodiments, the detector system 300 may include a first photoelectric sensor array, a second photoelectric sensor array, a scintillation crystal array, a readout module, and a main control module.

[0058] The first photoelectric sensor array may include one or more first SiPM array boards (e.g., SiPM array board 313), and the second photoelectric sensor array may include one or more second SiPM array boards (e.g., SiPM array board 314). The SiPM array board may include one or more detection units.

[0059] The readout module may include a first readout unit and a second readout unit. The first readout unit may include one or more first readout boards (e.g., readout board 331, readout board 333, readout board 335), and the second readout unit may include one or more second readout boards (e.g., readout board 332, readout board 334, readout board 336). The scintillation crystal array may include two or more scintillation crystals (e.g., crystal 322).

[0060] In some embodiments, the first SiPM array plate and the second SiPM array plate may be located at a first end (e.g., the end away from the target object) and a second end (e.g., the end closer to the target object) of the scintillation crystal array, respectively. In some embodiments, the number of the first SiPM array plate and the second SiPM array plate may be the same or different.

[0061] In some embodiments, a first readout board (e.g., readout board 333) may be used to process a portion of the electrical signals output from a first SiPM array board (e.g., SiPM array board 313) and a portion of the electrical signals output from a second SiPM array board (e.g., SiPM array board 314), and a second readout board (e.g., readout board 334) may be used to process another portion of the electrical signals output from the first SiPM array board (e.g., SiPM array board 313) and another portion of the electrical signals output from the second SiPM array board (e.g., SiPM array board 314). In some embodiments, the number of SiPM array boards and signal readout boards may be the same, for example, both being integer multiples of 2.

[0062] In some embodiments, such as Figure 3 As shown, the first readout plate and the second readout plate can be located on the same side of the scintillation crystal (e.g., the side away from the target object).

[0063] In some embodiments, the main control module may include one or more main control boards connected (electrically connected) to all signal readout boards for processing readout signals output by the readout boards (e.g., determining radiated photon information based on the readout signals). For example, the main control board 340 may be electrically connected to readout boards 331-336. Optionally, a containment channel may be formed between the main control board 340, readout boards 331-336, and SiPM array board 314, through which cooling air may be introduced for cooling or drying of the main control board 340, readout boards 331-336, and SiPM array board 314.

[0064] by Figure 5 For example, the first readout board 530 can be electrically connected to the first SiPM array board 510 and the second SiPM array board 520 to read the electrical signals output by a portion of the detection units of the first SiPM array board 510 and the second SiPM array board 520. The second readout board 540 can be electrically connected to the first SiPM array board 510 and the second SiPM array board 520 to read the electrical signals output by another portion of the detection units of the first SiPM array board 510 and the second SiPM array board 520.

[0065] Figure 5 This is a schematic diagram showing the connection of detector system components according to some embodiments of this specification.

[0066] like Figure 5 As shown, in system 500, the first readout board 530 may include interfaces 531 and 532, which are used to connect a portion of the detection units of the first SiPM array board 510 and the second SiPM array board 520, respectively. The first readout board 530 may also include interface 533 for connecting to the main control module. The first readout board 530 may include a second readout board 540, which may include interfaces 541 and 542, which are used to connect another portion of the detection units of the first SiPM array board 510 and the second SiPM array board 520, respectively. The second readout board 540 may also include interface 543 for connecting to the main control module. The first readout board 530 can be connected to the first SiPM array board 510 and the second SiPM array board 520 via a flexible circuit board, the two ends of which are equipped with plugs for connecting to interfaces 531, 532, 541, and 542, respectively.

[0067] It should be noted that the above description is for illustrative purposes only and does not limit the scope of this specification. Various modifications and changes can be made by those skilled in the art based on the guidance of this specification. However, these modifications and changes remain within the scope of this specification. For example, for PET imaging, the detector system 300 may also include a coincidence plate.

[0068] Figure 4is a schematic diagram of a sensor array according to some embodiments of the present specification.

[0069] As shown in Figure 4 , the sensor array 400 includes a first photosensor array and a second photosensor array. In some embodiments, the first photosensor array can be the first photosensor array 210, and the second photosensor array can be the second photosensor array 220.

[0070] In some embodiments, the encoding of the first photosensor array and the second photosensor array can respectively divide the first photosensor array and the second photosensor array into two parts of equal area along the same direction (e.g., the first direction).

[0071] In some embodiments, the encoding of the first photosensor array can divide the first photosensor array into a first part 410 and a second part 420 along the first direction; and the encoding of the second photosensor array can divide the second photosensor array into a third part 430 and a fourth part 440 along the first direction.

[0072] Figure 8 is a schematic diagram of a sensor array according to some embodiments of the present specification.

[0073] In some embodiments, the sensor array as shown in Figure 8 may correspond to Figure 4 the first photosensor array and / or the second photosensor array in Figure 8 the first part 810 in Figure 4 may correspond to Figure 8 the first part 410 and / or the third part 430 in Figure 4 the second part 820 in may correspond to the second part 420 and / or the fourth part 440 in

[0074] each cell corresponds to a detection unit, and the encoding in the cell is the encoding of the detection unit; and each 2*2 detection units form a detector unit, for example, Figure 4

[0075] In some embodiments, the encoding methods of the first portion 410 of the first photoelectric sensor array and the third portion 430 of the second photoelectric sensor array may be the same, and the encoding methods of the second portion 420 of the first photoelectric sensor array and the fourth portion 440 of the second photoelectric sensor array may be the same. In some embodiments, the same encoding method may refer to the same encoding and encoding order. For example, both the first portion 410 of the first photoelectric sensor array and the third portion 430 of the second photoelectric sensor array include the following: Figure 8 The 16*7 detection unit shown in Part 1, 810, is encoded in the following way: Figure 8 As shown in the first part 810; the second part 420 of the first photoelectric sensor array and the fourth part 440 of the second photoelectric sensor array both include as shown in the first part 810. Figure 8 The 16*7 detection unit shown in Part 2, 820, is encoded in the following way: Figure 8 As shown in Part 2, 820.

[0076] In some embodiments, the division of the first photoelectric sensor array and the second photoelectric sensor array can be such that the detection units included in the first and second parts of the first photoelectric sensor array, and the third and fourth parts of the second photoelectric sensor array, all belong to a complete detector unit; that is, a complete detector unit is not divided into multiple different parts. For example, as... Figure 8 As shown, the 16*14 sensor array is divided into a first part 810 and a second part 820 along a broken line segment, rather than along the center line of the sensor array. This ensures that the detector units, for example, Instead of being divided into two separate parts, 810 and 820, it is classified as a single, complete detector unit within 810. The aforementioned broken line segment extends first along the x-direction, then along the y-direction, and then back along the x-direction. The direction of this broken line segment, representing the first direction, is used to divide the photoelectric sensor array into the first and second parts, or the third and fourth parts. Specifically, the first and second parts (detector units) have an asymmetrical structure along the x-direction and a symmetrical structure along the y-direction; similarly, the third and fourth parts (detector units) have an asymmetrical structure along the x-direction and a symmetrical structure along the y-direction.

[0077] In some embodiments of this specification, dual-end readout can be achieved by using sensor array boards with the same structure at both ends through a preset encoding method. This successfully enables the reuse of dual-end array boards in detector systems of medical imaging equipment (e.g., PET, SPECT, etc.), thereby reducing design and maintenance costs.

[0078] In some embodiments, the first portion 410 of the first photoelectric sensor array can be centrosymmetric to the shape of the second portion 420, and the third portion 430 of the second photoelectric sensor array can be centrosymmetric to the shape of the fourth portion 440. In some embodiments, the first portion, the second portion, the third portion, and the fourth portion include the same number of detection units.

[0079] Figure 6A 、 Figure 6B is a structural schematic diagram of a detector system according to some embodiments of the present specification. Figure 6A and Figure 6B The x direction and the y direction in Figure 4 correspond to the x direction and the y direction in

[0080] In some embodiments, the first portion of the first photoelectric sensor array can include a first interface, the second portion can include a second interface, the third portion of the second photoelectric sensor array can include a third interface, and the fourth portion can include a fourth interface. The readout module can be connected to the first photoelectric sensor array and the second photoelectric sensor array through the first interface, the second interface, the third interface, and the fourth interface.

[0081] As shown in Figure 6A and Figure 6B , the coding mode of the first photoelectric sensor array 610 can divide the first photoelectric sensor array 610 into a first portion 611 and a second portion 612 along a first direction (for example, the y direction), and the coding mode of the second photoelectric sensor array 620 can divide the second photoelectric sensor array 620 into a third portion 621 and a fourth portion 622 along the first direction (for example, the y direction).

[0082] The first portion 611 of the first photoelectric sensor array 610 can include an interface 613, and the second portion 612 can include an interface 614. The third portion 621 of the second photoelectric sensor array 620 can include an interface 623, and the fourth portion 622 can include an interface 624.

[0083] In some embodiments, the first photoelectric sensor array 610 can include a first surface 615 and a second surface 616 opposite in position, and the second photoelectric sensor array 620 can include a third surface 625 and a fourth surface 626 opposite in position.

[0084] In some embodiments, the first interface 613 and the second interface 614 of the first photosensor array 610 can be disposed on the first surface 615 of the first photosensor array 610, and the third interface 623 and the fourth interface 624 of the second photosensor array 620 can be disposed on the third surface 625 of the second photosensor array 620. In some embodiments, for the first surface 615 and the second surface 616 of the first photosensor array 610, and the third surface 625 and the fourth surface 626 of the second photosensor array 620, the surfaces without the interfaces can be disposed opposite to each other, for example, the second surface 616 of the first photosensor array 610 and the fourth surface 626 of the second photosensor array 620 are disposed opposite to each other.

[0085] As shown in FIG. 6A, the first photosensor array 610 and the second photosensor array 620 can each include 4*3 detection units. The first portion 611 can include detection units coded as 1-4 and 7, 8, and the second portion 612 can include detection units coded as 5, 6 and 9-12; the third portion 621 includes detection units coded as 1-4 and 7, 8, and the fourth portion 622 can include detection units coded as 5, 6 and 9-12. Figure 6A 6B As shown in FIG. 6A, the first photosensor array 610 and the second photosensor array 620 can each include 4*3 detection units. The first portion 611 can include detection units coded as 1-4 and 7, 8, and the second portion 612 can include detection units coded as 5, 6 and 9-12; the third portion 621 includes detection units coded as 1-4 and 7, 8, and the fourth portion 622 can include detection units coded as 5, 6 and 9-12.

[0086] As shown in FIG. 6A, the first photosensor array 610 and the second photosensor array 620 can each include 4*3 detection units. The first portion 611 can include detection units coded as 1-4 and 7, 8, and the second portion 612 can include detection units coded as 5, 6 and 9-12; the third portion 621 includes detection units coded as 1-4 and 7, 8, and the fourth portion 622 can include detection units coded as 5, 6 and 9-12. Figure 6A As shown in FIG. 6A, the first photosensor array 610 and the second photosensor array 620 can each include 4*3 detection units. The first portion 611 can include detection units coded as 1-4 and 7, 8, and the second portion 612 can include detection units coded as 5, 6 and 9-12; the third portion 621 includes detection units coded as 1-4 and 7, 8, and the fourth portion 622 can include detection units coded as 5, 6 and 9-12.

[0087] Figure 6A As shown in FIG. 6A, the first photosensor array 610 and the second photosensor array 620 can each include 4*3 detection units. The first portion 611 can include detection units coded as 1-4 and 7, 8, and the second portion 612 can include detection units coded as 5, 6 and 9-12; the third portion 621 includes detection units coded as 1-4 and 7, 8, and the fourth portion 622 can include detection units coded as 5, 6 and 9-12.

[0088] In some embodiments, the coding order of the detection units of the first portion 611 of the first photosensor array 610 can be mirror-symmetrical about the first direction to the coding order of the detection units of the third portion 621 of the second photosensor array 620. As shown in FIG. 6A, the coding order of the detection units of the first portion 611 of the first photosensor array 610 can be mirror-symmetrical about the first direction to the coding order of the detection units of the third portion 621 of the second photosensor array 620. Figure 6A ​​As shown, the coding order of the detection units 1-4 and 7, 8 included in the first portion 611 in the x and y directions is mirror-symmetrical about the first direction (e.g., the y direction) to the coding order of the detection units 1-4 and 7, 8 included in the third portion 621 in the x and y directions, i.e., the first portion 611 can coincide with the third portion 621 after mirror-symmetry about the first direction (e.g., the y direction) of the first portion 611.

[0089] In some embodiments, the coding order of the detection units of the first photosensor array 610 included in the second portion 612 can be mirror-symmetrical about the first direction to the coding order of the detection units of the second photosensor array 620 included in the fourth portion 622. As shown, Figure 6A As shown, the coding order of the detection units 5, 6 and 9-12 included in the second portion 612 in the x and y directions is mirror-symmetrical about the first direction (e.g., the y direction) to the coding order of the detection units 5, 6 and 9-12 included in the fourth portion 622 in the x and y directions, i.e., the second portion 612 can coincide with the fourth portion 622 after mirror-symmetry about the first direction (e.g., the y direction) of the second portion 612.

[0090] In order to realize the implementability on hardware, the interfaces on the first photosensor array 610 and the second photosensor array 620 need to be respectively towards the side away from the scintillation crystal array. Since the configurations of the first photosensor array 610 and the second photosensor array 620 are the same, when the first photosensor array 610 and the second photosensor array 620 are oppositely arranged, the positions of the first portion 611 of the first photosensor array 610 and the third portion 621 of the second photosensor array 620 correspond to each other, the positions of the second portion 612 of the first photosensor array 610 and the fourth portion 622 of the second photosensor array 620 correspond to each other, and the interfaces on the first photosensor array 610 and the second photosensor array 620 are respectively towards the side away from the scintillation crystal array, the position of the second photosensor array 620 in the detector system in this assembly mode can be understood as that the first photosensor array 610 is flipped by 180 degrees about the y direction. Therefore, in the above assembly mode, the coding order of the detection units 1-4 and 7, 8 included in the first portion 611 in the x and y directions is mirror-symmetrical about the first direction (e.g., the y direction) to the coding order of the detection units 1-4 and 7, 8 included in the third portion 621 in the x and y directions, and the coding order of the detection units 5, 6 and 9-12 included in the second portion 612 in the x and y directions is mirror-symmetrical about the first direction (e.g., the y direction) to the coding order of the detection units 5, 6 and 9-12 included in the fourth portion 622 in the x and y directions.

[0091] As shown, Figure 6BAs shown, in some embodiments, the first readout unit may be connected to the first portion 611 of the first photoelectric sensor array 610 and the fourth portion 622 of the second photoelectric sensor array 620; the second readout unit may be connected to the second portion 612 of the first photoelectric sensor array 610 and the third portion 621 of the second photoelectric sensor array 620.

[0092] like Figure 6B As shown, in some embodiments, when the first photoelectric sensor array 610 and the second photoelectric sensor array 620 are installed in the detector system, the first part 611 of the first photoelectric sensor array 610 can correspond to the position of the fourth part 622 of the second photoelectric sensor array 620, and the second part 612 of the first photoelectric sensor array 610 can correspond to the position of the third part 621 of the second photoelectric sensor array 620.

[0093] In some embodiments, the encoding order of the detection units of the first photoelectric sensor array 610 included in the first part 611 may be mirror-symmetrical with the encoding order of the detection units of the second photoelectric sensor array 620 included in the third part 621 about a second direction, wherein the second direction may be perpendicular to the first direction. Figure 6B As shown, the encoding order of the detection units 1-4 and 7, 8 included in the first part 611 in the x and y directions is mirror-symmetric with the encoding order of the detection units 1-4 and 7, 8 included in the third part 621 in the x and y directions about the second direction (e.g., the x direction). That is, after the first part 611 is mirror-symmetric about the second direction (e.g., the x direction), it can coincide with the third part 621.

[0094] In some embodiments, the encoding order of the detection units of the first photoelectric sensor array 610 included in the second part 612 may be mirror-symmetrical with the encoding order of the detection units of the second photoelectric sensor array 620 included in the fourth part 622 about a second direction, wherein the second direction may be perpendicular to the first direction. Figure 6B As shown, the encoding order of the detection units 5, 6 and 9-12 included in the second part 612 in the x and y directions is mirror-symmetric to the encoding order of the detection units 5, 6 and 9-12 included in the fourth part 622 in the x and y directions about the second direction (e.g., the x direction). That is, after the second part 612 is mirror-symmetric about the second direction (e.g., the x direction), it can coincide with the fourth part 622.

[0095] To realize the implementability on hardware, the interfaces on the first photosensor array 610 and the second photosensor array 620 need to be respectively directed to the side away from the scintillation crystal array. Since the configurations of the first photosensor array 610 and the second photosensor array 620 are the same, when the first photosensor array 610 and the second photosensor array 620 are oppositely arranged, the positions of the first portion 611 of the first photosensor array 610 and the fourth portion 622 of the second photosensor array 620 correspond to each other, the positions of the second portion 612 of the first photosensor array 610 and the third portion 621 of the second photosensor array 620 correspond to each other, and the interfaces on the first photosensor array 610 and the second photosensor array 620 are respectively directed to the side away from the scintillation crystal array, the position of the second photosensor array 620 in the detector system in this assembly can be understood as that the first photosensor array 610 is flipped by 180 degrees around the y direction and rotated by 180 degrees around an axis perpendicular to the x-y plane. Therefore, in the above assembly, the encoding order of the detection units 1-4 and 7, 8 included in the first portion 611 in the x and y directions is mirror-symmetrical about the second direction (for example, the x direction) to the encoding order of the detection units 1-4 and 7, 8 included in the third portion 621 in the x and y directions, and the encoding order of the detection units 5, 6 and 9-12 included in the second portion 612 in the x and y directions is mirror-symmetrical about the second direction (for example, the x direction) to the encoding order of the detection units 5, 6 and 9-12 included in the fourth portion 622 in the x and y directions.

[0096] Figure 7 is a schematic diagram of the connection of the components of the detector system according to some embodiments of the present specification.

[0097] As shown in Figure 7 , the readout board 700 can include an interface 711, an interface 712 and an interface 722, and a connector 721 and a connector 722. The interface 711 can connect the first photosensor array or the second photosensor array through the connector 721. The interface 712 can connect the first photosensor array or the second photosensor array through the connector 722. The interface 722 can be used to connect the master module.

[0098] The first photosensor array and the second photosensor array can be oppositely arranged at the first end and the second end of the scintillation crystal array, respectively. The readout board 700 is arranged at the first end of the scintillation crystal array. The connector 721 is a short connector and can be used to connect the interface 711 and the interface of the first photosensor array located at the first end of the scintillation crystal array. For example, Figure 6AFor example, connector 721 can be plugged into interface 613 of first photosensor array 610, and connector 722 can be plugged through interface 613 into interface 623 of second photosensor array 620. In this case, the first photosensor array 610 and the second photosensor array 620 are connected in series. Figure 6B For example, connector 721 can be plugged into interface 613 of first photosensor array 610, and connector 722 can be plugged through interface 613 into interface 624 of second photosensor array 620.

[0099] The foregoing detailed description has set forth various embodiments of the application via the use of specific terminology. As such, it is to be understood that whenever a term is referred to in the description, it is not to be limited to the common meanings of such terms, and is to be limited to the meanings of such terms as used in the context of the specification and claims. For example, the term "another" is used in the description interchangeably with the term "additional" or "one or more," and refers to at least one. Furthermore, the use of the term "about" is intended to cover variations known or inherent to the skill of the art that would require undue experimentation but for which the present disclosure would not want to be pigeonholed into a specific embodiment. In addition, from the outset, it will be understood that the various agents, components, and / or devices described herein can be implemented in a variety of ways.

[0100] Also, the use of "a" or "an" to describe the various disclosed elements and components is intended to be illustrative and not restrictive. Unless specifically set forth herein, the terms "comprising," "comprises," and like terms do not exclude other elements or components not specifically listed. Also, except as otherwise indicated, the use of "or" is intended to represent an inclusive "or," and not a disjunctive "or," unless expressly indicated to the contrary. Also, the use of "one" or "another" is intended to be inclusive of one and / or the other, unless otherwise indicated or unless it is clear from the context that only one of the other is meant.

[0101] In addition, the order of presentation of the treatment elements and sequences, the use of numerical terms, or the use of other designations, in the description is not intended to limit the order in which the processes and methods of the present disclosure are performed unless expressly stated in the claims. While the above detailed description has described certain inventive embodiments, it is to be understood that other

[0102] Similarly, it is to be noticed that the term "comprising", used in the description, is not used in the sense restricting itself to the features of the present disclosure. Rather, it is used in the sense that the products and methods described in the description can comprise some of the features of the present disclosure, but not necessarily all of them. Similarly, it is to be noticed that the terms "first", "second", "third", "fourth", etc. are used in the description for distinguishing between similar elements or steps and are not necessarily used to designate the order or hierarchy of such elements or steps. It is to be noted that any reference signs in the appended claims should not be construed as limiting the scope of the claims. The herein disclosed embodiments and their equivalents can cover all modifications, enhancements and alterations of the present disclosure.

[0103] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0104] For each patent, patent application, patent application publication, and other material, such as articles, books, specifications, publications, and documents, referenced in this specification, the entire contents of which are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials to this specification and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0105] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. A detector system, comprising: a first photosensor array and a second photosensor array arranged oppositely and identically, for outputting electrical signals related to radiation photons; and a readout module comprising a first readout unit and a second readout unit arranged identically, for processing the electrical signals, wherein the first readout unit is configured to process electrical signals outputted by a first part of the first photosensor array and a first part of the second photosensor array, and the second readout unit is configured to process electrical signals outputted by a second part of the first photosensor array and a second part of the second photosensor array. 2.The system of claim 1, wherein: the first photosensor array is divided into the first part and the second part along a first direction according to a coding manner; the second photosensor array is divided into a third part and a fourth part along the first direction according to the coding manner; the first part of the first photosensor array and the third part of the second photosensor array are coded identically, and the second part of the first photosensor array and the fourth part of the second photosensor array are coded identically; and the first part and the second part of the first photosensor array are center-symmetric in shape, and the third part and the fourth part of the second photosensor array are center-symmetric in shape. 3.The system of claim 2, wherein: the first photosensor array and the second photosensor array comprise at least two detection units; and the first part, the second part, the third part, and the fourth part comprise the same number of detection units. 4.The system of claim 2, wherein: the first readout unit is connected to the first part of the first photosensor array and the third part of the second photosensor array; and the second readout unit is connected to the second part of the first photosensor array and the fourth part of the second photosensor array. 5.The system of claim 4, wherein: the first part of the first photosensor array and the third part of the second photosensor array are located oppositely, and a coding order of the detection units of the first photosensor array included in the first part is mirror-symmetric about a first direction to a coding order of the detection units of the second photosensor array included in the third part; and the second part of the first photosensor array and the fourth part of the second photosensor array are located oppositely, and a coding order of the detection units of the first photosensor array included in the second part is mirror-symmetric about the first direction to a coding order of the detection units of the second photosensor array included in the fourth part. 6.The system of claim 2, wherein: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ the first readout unit is connected with the first part of the first photo sensor array and the fourth part of the second photo sensor array; the second readout unit is connected with the second part of the first photo sensor array and the third part of the second photo sensor array.

7. The system of claim 6, wherein, the first part of the first photo sensor array and the fourth part of the second photo sensor array are corresponding in position, the coding order of the detection units of the first photo sensor array included in the first part is mirror symmetric about a second direction to the coding order of the detection units of the second photo sensor array included in the third part; the second part of the first photo sensor array and the third part of the second photo sensor array are corresponding in position, the coding order of the detection units of the first photo sensor array included in the second part is mirror symmetric about the second direction to the coding order of the detection units of the second photo sensor array included in the fourth part; wherein the second direction is perpendicular to the first direction.

8. The system of any one of claims 2-7, wherein, the first part includes a first interface, the second part includes a second interface, the third part includes a third interface, and the fourth part includes a fourth interface, the readout module is connected with the first photo sensor array and the second photo sensor array through the first interface, the second interface, the third interface and the fourth interface.

9. The system of claim 8, wherein, the first photo sensor array includes two opposite first surface and second surface, and the second photo sensor array includes two opposite third surface and fourth surface; the first interface and the second interface are disposed on the first surface of the first photo sensor array, and the third interface and the fourth interface are disposed on the third surface of the second photo sensor array; the second surface of the first photo sensor array and the fourth surface of the second photo sensor array are disposed opposite in position.

10. An imaging device comprising a plurality of detector systems according to any one of claims 1-9, the plurality of detector systems are arranged around an axis and enclose a cylindrical scanning region.

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