Glue removing device and control method thereof

Abstract

The application relates to the technical field of glue removal, and discloses a glue removal device and a control method thereof, wherein the glue removal device comprises a mounting table, a first head cleaning assembly and a second head cleaning assembly; the first head cleaning assembly and the second head cleaning assembly are connected with the mounting table respectively, and the first head cleaning assembly and the second head cleaning assembly are arranged at intervals; the first head cleaning assembly comprises a first driving piece and a first head, and the first head is configured to rotate under the driving of the first driving piece to clean glue on a first region of a glue cleaning component; the second head cleaning assembly comprises a second driving piece and a second head, and the second head is configured to rotate under the driving of the second driving piece to clean glue on a second region of the glue cleaning component, and the first region is different from the second region. The glue removal device provided by the application improves glue removal efficiency.

Description

Technical Field

[0001] This application relates to the field of adhesive removal, specifically to an adhesive removal device and its control method. Background Technology

[0002] A speed reducer is an independent component consisting of various mechanical transmission elements enclosed in a rigid housing. This housing is typically assembled from two parts: a cover and a base. To prevent oil leakage, sealant is usually applied to the mating surfaces of the cover and base. Removing the sealant from these mating surfaces is a crucial step in the development and repair of speed reducers, making the process simple and efficient.

[0003] In related technologies, the removal of adhesive from the box assembly surface mainly relies on manual labor, such as scraping with a knife, sanding with sandpaper, or using other tools to manually remove the adhesive.

[0004] However, these glue removal methods are not only inefficient, but also prone to different results after glue removal due to individual differences in operation. They may even damage the container surface, affecting subsequent testing, analysis and reuse of the container. Summary of the Invention

[0005] In view of this, this application provides a glue removal device that improves glue removal efficiency. Specifically, it includes the following technical solutions:

[0006] One aspect of this application is to provide an adhesive removal device, which includes a mounting platform, a first cleaning head assembly, and a second cleaning head assembly;

[0007] The first cleaning head assembly and the second cleaning head assembly are respectively connected to the mounting platform, and the first cleaning head assembly and the second cleaning head assembly are arranged at intervals;

[0008] The first cleaning head assembly includes a first drive member and a first cleaning head, the first cleaning head being configured to rotate under the drive of the first drive member to clean the first area of ​​the component to be cleaned;

[0009] The second cleaning head assembly includes a second drive member and a second cleaning head, the second cleaning head being configured to rotate under the drive of the second drive member to clean a second region of the component to be cleaned, the first region being different from the second region.

[0010] In one implementation of this application, the plane containing the first region intersects with the plane containing the second region.

[0011] In one implementation of this application, the adhesive removal device further includes an elastic element;

[0012] One end of the elastic element is connected to the mounting platform, and the other end is connected to the second cleaning head assembly. The elastic element is configured to cause the second cleaning head to abut against the second region.

[0013] In one implementation of this application embodiment, the mounting platform is provided with a sliding groove;

[0014] At least a portion of the second cleaning head assembly is located within the groove, and the second cleaning head assembly is movable within the groove under the action of the elastic member.

[0015] In one implementation of this application, the second cleaning head assembly further includes a rotating shaft, which is rotatably connected to the mounting platform.

[0016] The rotating shaft has a through hole, and at least a portion of the second cleaning head assembly is located within the through hole;

[0017] The elastic element is connected to the second driving element;

[0018] The second head assembly is configured to oscillate under the action of the elastic element and drive the rotating shaft to rotate.

[0019] In one implementation of this application, the adhesive removal device further includes a cleaning component;

[0020] The cleaning assembly is connected to the mounting platform and is spaced apart from the first cleaning head assembly and the second cleaning head assembly;

[0021] The cleaning assembly is configured to collect the adhesive removed from the adhesive-to-be-cleaned component by the first cleaning assembly and the second cleaning assembly.

[0022] In one implementation of this application, the adhesive removal device further includes an operating table and at least three positioning components;

[0023] The positioning component is connected to the operating console;

[0024] The positioning component is used to fix the part to be cleaned onto the operating table;

[0025] The lines connecting the at least three positioning components are not on the same straight line.

[0026] In one implementation of this application, the positioning component includes a first screw, a connecting rod, and a second screw;

[0027] The first end of the first screw is fixed to the operating table, and the positioning assembly includes a first screw, a connecting rod, and a second screw.

[0028] The first end of the first screw is fixed to the operating table, and the second end of the first screw is connected to the first end of the connecting rod.

[0029] The connecting rod is perpendicular to the first screw, and the connecting rod can move on the first screw;

[0030] The first end of the second screw is connected to the second end of the connecting rod, and the second screw is parallel to the first screw;

[0031] The second screw is configured to move on the connecting rod so that the second end of the second screw abuts against or separates from the part to be cleaned.

[0032] In one implementation of this application, the adhesive removal device further includes a first adjustment component, a second adjustment component, a third adjustment component, and a fourth adjustment component; wherein,

[0033] The first adjustment component is connected to the mounting platform, and the first adjustment component is configured to adjust the position of the first cleaning head component and the second cleaning head component in the vertical direction;

[0034] The second adjustment component is connected to the first adjustment component, and the second adjustment component is configured to adjust the contact position between the first cleaning head component and the second cleaning head component and the component to be cleaned;

[0035] The third adjustment component is connected to the second adjustment component, and the third adjustment component is configured to adjust the positions of the first cleaning head component and the second cleaning head component in a first horizontal direction;

[0036] The fourth adjustment component is connected to the third adjustment component, and the fourth adjustment component is configured to adjust the position of the first cleaning head component and the second cleaning head component in a second horizontal direction, wherein the first horizontal direction and the second horizontal direction are perpendicular.

[0037] In one implementation of this application, the adhesive removal device further includes at least one pressure sensor, which is connected to the first cleaning head assembly and / or the second cleaning head assembly. The pressure sensor is configured to detect the pressure value between the first cleaning head or the second cleaning head and the component to be removed.

[0038] Another aspect of this application embodiment provides a method for controlling the above-mentioned adhesive removal device, the method comprising:

[0039] The first cleaning head is driven by the first driving component to clean the first area of ​​the component to be cleaned; and / or,

[0040] The second drive unit drives the second cleaning head to clean the second area of ​​the component to be cleaned.

[0041] The beneficial effects of the embodiments of this application are at least as follows:

[0042] The adhesive removal device provided in this application embodiment can automatically remove adhesive from the parts to be cleaned through the cooperation between the first driving member and the first cleaning head, as well as the cooperation between the second driving member and the second cleaning head. Compared with the traditional manual adhesive removal method, the adhesive removal efficiency is improved. Furthermore, through the cooperation between the first cleaning head assembly and the second cleaning head assembly, the adhesive removal device can effectively remove adhesive from parts with complex surface conditions, further improving the adhesive removal efficiency and effect. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 A first structural schematic diagram of the adhesive removal device provided in an embodiment of this application is shown;

[0045] Figure 2 This invention provides a schematic diagram of the structure of the first cleaning head assembly and the second cleaning head assembly of the adhesive removal device according to an embodiment of this application.

[0046] Figure 3 This illustration shows a structural diagram of the mounting platform, the second head assembly, and the elastic element in cooperation according to an embodiment of this application.

[0047] Figure 4 This illustration shows a structural diagram of another mounting platform, second head assembly, and elastic element assembly provided in an embodiment of this application.

[0048] Figure 5 It shows Figure 4 A schematic diagram of the corresponding second cleaning head assembly;

[0049] Figure 6 This illustration shows a structural schematic diagram of another mounting platform, second head assembly, and elastic element provided in an embodiment of this application;

[0050] Figure 7 It shows Figure 6 A schematic diagram of the corresponding second cleaning head assembly;

[0051] Figure 8 This illustration shows a structural schematic diagram of a first cleaning head assembly provided in an embodiment of this application;

[0052] Figure 9 This invention provides a schematic diagram of the structure of another first cleaning head assembly according to an embodiment of the present application.

[0053] Figure 10 This diagram illustrates the structure of a second cleaning head assembly according to an embodiment of this application.

[0054] Figure 11 This paper shows a schematic diagram of the structure of the first cleaning head assembly, the second cleaning head assembly, and the cleaning material assembly of the adhesive removal device provided in an embodiment of this application;

[0055] Figure 12 A second structural schematic diagram of the adhesive removal device provided in an embodiment of this application is shown;

[0056] Figure 13 This paper shows a schematic diagram of the positioning component in the adhesive removal device provided in an embodiment of this application;

[0057] Figure 14 A schematic diagram of the structure of the second adjustment component in the adhesive removal device provided in this application embodiment is shown.

[0058] Figure label:

[0059] 1. Mounting platform; 11. Slide groove; 12. Protrusion;

[0060] 2. First cleaning head assembly; 21. First driving component; 22. First cleaning head; 221. First adhesive removal component;

[0061] 3. Second cleaning head assembly; 31. Second driving component; 32. Second cleaning head; 33. Connecting shaft; 34. Rotating shaft; 321. Second cleaning component; 341. Through hole;

[0062] 4. Elastic components;

[0063] 5. Cleaning assembly; 51. Cleaning interface;

[0064] 6. Pressure sensor;

[0065] 7. Adjustment components; 71. First adjustment component; 72. Second adjustment component; 73. Third adjustment component; 74. Fourth adjustment component; 711. First cylinder; 712. First connecting plate; 721. Second connecting plate; 722. Third driving component; 723. First gear; 724. Second gear; 725. Third connecting plate; 731. Slider; 732. First slide rail; 733. Fourth driving component; 741. Second slider; 742. Second slide rail; 743. Fifth driving component;

[0066] 8. Positioning assembly; 81. First positioning part; 82. First screw; 83. First nut; 84. Connecting rod; 85. Second nut; 86. Second screw; 87. Second positioning part;

[0067] 9. Control panel;

[0068] 100. Adhesive removal device;

[0069] 200. Part to be cleaned of adhesive; 201. First area; 202. Second area. Detailed Implementation

[0070] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. To make the technical solutions and advantages of this application clearer, the adhesive removal device and its control method will be described in detail below with reference to the accompanying drawings.

[0071] like Figure 1 and Figure 2 As shown, this application embodiment provides an adhesive removal device 100, including a mounting platform 1, a first cleaning head assembly 2, and a second cleaning head assembly 3. The first cleaning head assembly 2 and the second cleaning head assembly 3 are respectively connected to the mounting platform 1 and are spaced apart. The first cleaning head assembly 2 includes a first driving member 21 and a first cleaning head 22, and the first cleaning head 22 is configured to rotate under the drive of the first driving member 21 to clean the adhesive in a first region 201 of the component 200 to be cleaned. The second cleaning head assembly 3 includes a second driving member 31 and a second cleaning head 32, and the second cleaning head 32 is configured to rotate under the drive of the second driving member 31 to clean the adhesive in a second region 202 of the component 200 to be cleaned, where the first region 201 is different from the second region 202.

[0072] The adhesive removal device 100 provided in this application embodiment can automatically remove adhesive from the adhesive-containing component 200 through the cooperation between the first driving member 21 and the first cleaning head 22 and the cooperation between the second driving member 31 and the second cleaning head 32. Compared with the traditional manual adhesive removal method, the adhesive removal efficiency is improved. Furthermore, through the cooperation between the first cleaning head assembly 2 and the second cleaning head assembly 3, the adhesive removal device 100 can effectively remove adhesive from the adhesive-containing component 200 with a relatively complex surface condition, further improving the adhesive removal efficiency and effect.

[0073] In some embodiments, the first driving member 21 can be a motor, which is connected to the first cleaning head 22 via an output shaft, so that the first cleaning head 22 can be rotated when the output shaft of the motor rotates. Similarly, the second driving member 31 can also be a motor, which drives the second cleaning head 32 to rotate via an output shaft.

[0074] In some embodiments, the plane containing the first region 201 may intersect the plane containing the second region 202, thereby enabling the adhesive removal device 100 to remove adhesive from multiple surfaces of a three-dimensional structure. For example, the component 200 to be cleaned may be a gearbox housing, wherein the first cleaning head assembly 2 can remove adhesive from the mating surface of the housing, and the second cleaning head assembly 3 can remove adhesive from the surface of the housing adjacent to the mating surface.

[0075] In other embodiments, the plane containing the first region 201 may be on the same plane as the plane containing the second region 202. For example, both the first cleaning assembly 2 and the second cleaning assembly 3 can be used to remove adhesive from the mating surface of the gearbox housing. During the adhesive removal process, the adhesive removal by the first cleaning assembly 2 and the second cleaning assembly 3 can be complementary. For example, a small area of ​​residual adhesive may remain in the area cleaned by the first cleaning assembly 2, which can then be specifically cleaned by the second cleaning assembly 3.

[0076] It is understandable that the first cleaning head assembly 2 and the second cleaning head assembly 3 can operate simultaneously for adhesive removal, or they can operate independently for adhesive removal. In this way, both efficient adhesive removal and corresponding energy savings can be achieved.

[0077] In some embodiments, such as Figure 2 As shown, the adhesive removal device 100 may include a first cleaning head assembly 2 and two second cleaning head assemblies 3, with the two second cleaning head assemblies 3 located on both sides of the first cleaning head assembly 2. It can be understood that the two second cleaning head assemblies 3 may be symmetrically distributed on both sides of the first cleaning head assembly 2, or they may be asymmetrically distributed on both sides of the first cleaning head assembly 2; the two second cleaning head assemblies 3 may be on the same side or on opposite sides.

[0078] When the two second cleaning head assemblies 3 are symmetrically distributed on opposite sides of the first cleaning head assembly 2, simultaneous adhesive removal from both sides can be achieved. When the two second cleaning head assemblies 3 are asymmetrically distributed on opposite sides of the first cleaning head assembly 2, more flexible adhesive removal can be achieved.

[0079] In other embodiments, the number of first cleaning head assemblies 2 on the adhesive removal device 100 may be two or more, and the number of second cleaning head assemblies 3 may be three or more.

[0080] In some embodiments, such as Figure 2As shown, the adhesive removal device 100 may also include an elastic element 4, one end of which may be connected to the mounting platform 1 and the other end of which may be connected to the second cleaning head assembly 3, and the elastic element 4 may be configured to cause the second cleaning head 32 to abut against the second region 202.

[0081] In some embodiments, the elastic element 4 can be a compression spring or a tension spring. For example, when the elastic element 4 is a compression spring, it can be disposed on the side of the second cleaning head assembly 3 away from the first cleaning head assembly 2, and the compression spring can apply a pushing force to the second driving member 31 of the second cleaning head assembly 3 or a region on the second cleaning head assembly 3 near the second driving member 31, thereby driving the second cleaning head 32 to move towards the first cleaning head assembly 2 to abut against the second region 202. When the elastic element 4 is a tension spring, it can be disposed on the side of the second cleaning head assembly 3 near the first cleaning head assembly 2, and the tension spring can apply a pulling force to the second driving member 31 of the second cleaning head assembly 3 or a position on the second cleaning head assembly 3 near the second driving member 31, thereby causing the second cleaning head 32 to move towards the first cleaning head assembly 2 to abut against the second region. Furthermore, when the second cleaning head 32 encounters an obstacle during the glue removal process, the second cleaning head 32 can also move or adjust its posture under the restoring force of the elastic element 4, thereby overcoming the obstacle and maintaining close contact with the second region to improve glue removal efficiency.

[0082] In other words, on the one hand, the elastic member 4 can keep the second cleaning head 32 in contact with the second region 202, so that the second cleaning head 32 can effectively remove the glue on the second region 202 of the part to be cleaned 200; on the other hand, due to the presence of the elastic member 4, when the second cleaning head assembly 3 encounters a protruding structure on the second region 202 during the glue removal process (such as bolts distributed in the second region 202, or large residual glue), the second cleaning head 32 can move relative to the first cleaning head assembly 2 under the action of the elastic member 4 to flexibly avoid the protruding structure without damaging the second cleaning head assembly 3 itself.

[0083] The second cleaning head assembly 3 can be kept in contact with the second region 202 under the action of the elastic element 4 in a variety of ways.

[0084] In some embodiments, the second cleaning head assembly 3 can be driven to translate and abut against the second region 202 by the cooperation of the elastic member 4 and the slide groove. For example... Figure 3 and Figure 4 As shown, the mounting platform 1 may be provided with a slide groove 11, wherein at least a portion of the second cleaning head assembly 3 may be located in the slide groove 11, and the second cleaning head assembly 3 may move within the slide groove 11 under the action of the elastic member 4.

[0085] like Figure 3 and Figure 4As shown, the slide groove 11 can be a through groove extending through the mounting platform 1 along its thickness direction. The output shaft of the second drive member 31 can be located within the slide groove 11. The main body of the second drive member 31 and the second cleaning head 32 can each be located on opposite sides of the slide groove 11, and the dimensions of both the main body of the second drive member 31 and the cleaning head 32 can be larger than the dimensions (width) of the slide groove 11 to prevent the second cleaning head assembly 3 from detaching from the slide groove 11. Figure 3 and Figure 5 As shown, a protrusion 12 may be provided on the mounting platform 1. One end of the elastic member 4 may be connected to or abut against the protrusion 12, and the other end may be connected to or abut against the second driving member 31. When the elastic member 4 is a compression spring, the protrusion 12 may be provided on the side of the second cleaning head assembly 3 away from the first cleaning head assembly 2; when the elastic member 4 is a tension spring, the protrusion 12 may be provided on the side of the second cleaning head assembly 3 closer to the first cleaning head assembly 2.

[0086] In other embodiments, such as Figure 4 and Figure 5 As shown, the second cleaning head assembly 3 may further include a connecting shaft 33, which may be coaxially arranged with the output shaft of the second driving member 31 and sleeved on the outside of the output shaft of the second driving member 31. One end of the connecting shaft 33 may be connected to the body of the second driving member 31 to fix the position of the connecting shaft 33. One end of the elastic member 4 may be connected to or abut against the protrusion 12, and the other end may be connected to or abut against the connecting shaft 33.

[0087] In some embodiments, the second cleaning head assembly 3 can also be driven to swing by the cooperation of the elastic element 4 and the rotating shaft to achieve the contact between the second cleaning head assembly 3 and the second region 202. For example... Figure 6 and Figure 7 As shown, the second cleaning head assembly 3 may further include a rotating shaft 34, which is rotatably connected to the mounting platform 1. The rotating shaft 34 has a through hole 341, and at least a portion of the output shaft of the second drive member 31 of the second cleaning head assembly 3 is located within the through hole 341. One end of the elastic member 4 is connected to the protrusion 12, and the other end is connected to the second drive member 31. The second drive member 31 can be configured to oscillate under the action of the elastic member 4, driving the rotating shaft 34 to rotate, thereby allowing the second cleaning head 32 to oscillate so as to always remain in contact with the second region 202.

[0088] In some embodiments, such as Figure 6 and Figure 7 As shown, the rotating shaft 34 can be arranged perpendicular to the axial direction of the output shaft of the second drive member 31, and the output shaft can rotate freely within the through hole 341 of the rotating shaft 34.

[0089] In this case, the mounting platform 1 may also have the groove 11 and protrusion 12 as described above. The axial direction of the rotating shaft 34 may be perpendicular to the extension direction of the groove 11 and pass through the groove 11 perpendicular to its depth direction. One end of the elastic member 4 may be connected to or abut against the protrusion 12, and the other end may be connected to or abut against the second driving member 31. When the second cleaning head assembly 3 encounters obstacles such as protruding structures during the degumming process, the second driving member 31 may swing under the action of the elastic member 4, thereby driving the rotating shaft 34 to rotate relative to the mounting platform 1, and further driving the second cleaning head 32 to swing, so as to adjust the posture of the second cleaning head 32 relative to the mounting platform 1, for example, from the second cleaning head 32 being perpendicular to the table surface of the mounting platform 1 to the angle between the second cleaning head 32 and the table surface of the mounting platform 1 being an acute angle.

[0090] In some embodiments, the slide 11 may not be provided on the mounting platform 1. In this case, the length of the output shaft of the second drive member 31 can be long enough to allow sufficient room for the swing amplitude of the second cleaning head assembly 3. When the second cleaning head 32 encounters an obstacle during the degumming process, the swing amplitude of the second cleaning head 32 is sufficient to overcome the obstacle.

[0091] In some embodiments, the first cleaning head 22 and the second cleaning head 32 may each be configured as a cylindrical structure. For example... Figure 8 and Figure 9 As shown, the bottom wall of the first cleaning head 22 has a first adhesive removal component 221, which is configured to rotate with the first cleaning head 22 to remove adhesive from the first region 201 of the component to be cleaned 200. Figure 10 As shown, a second degumming member 321 may be provided on the sidewall of the second cleaning head 32. The second degumming member 321 is configured to rotate with the second cleaning head 32 to degumme in the second region 202 of the component to be degummed 200. In other embodiments, such as Figure 10 As shown, the second cleaning head 32 may have the second cleaning element 321 on both its sidewall and bottom wall. Alternatively, the first cleaning head 22 may also have the first cleaning element 221 on its sidewall, and the second cleaning head 32 may only have the second cleaning element 321 on its bottom wall.

[0092] With the first cleaning head 22 having a first cleaning component 221 on its bottom wall and the second cleaning head 32 having a second cleaning component 321 on its side wall, the first cleaning head 22 and the second cleaning head 32 can be arranged axially parallel, which helps to save the installation space of the mounting platform 1. Furthermore, through the cooperation of the first cleaning head assembly 2 and the second cleaning head assembly 3, adhesive can be removed from the intersecting planes on the parts to be cleaned 200. For example, the first cleaning head assembly 2 can be used to remove the packing adhesive from a large area of ​​the packing surface, while the second cleaning head 32 can be used to remove residual adhesive from both sides of a large area of ​​the packing surface.

[0093] It is understandable that both the first adhesive removal component 221 and the second adhesive removal component 321 are structures with a certain rigidity that can effectively remove adhesive from the component 200 to be adhesive removed, such as blades or steel wires.

[0094] In some embodiments, such as Figure 11 As shown, the adhesive removal device 100 may further include a cleaning component 5, which is connected to the mounting platform 1 and is spaced apart from the first cleaning head component 2 and the second cleaning head component 3. The cleaning component 5 may be configured to collect the adhesive removed from the adhesive-to-be-cleaned component 200 by the first cleaning head component 2 and the second cleaning head component 3.

[0095] In some embodiments, the cleaning assembly 5 may include a cleaning interface 51, which may be connected to a negative pressure generating device or other power device to transport the adhesive collected by the cleaning assembly 5 away through the cleaning interface 51.

[0096] The number of cleaning components 5 can be one or more. When the adhesive removal device 100 includes two or more cleaning components 5, the cleaning components 5 can be symmetrically distributed on both sides of the first cleaning head 21 to collect the adhesive removed from the adhesive-to-be-cleaned part 200 by the first cleaning head component 2 and the second cleaning head component 3; alternatively, some cleaning components 5 can be distributed on both sides of the first cleaning head 21, mainly for collecting the adhesive removed from the first area 201, and other cleaning components 5 can be distributed on both sides of the second cleaning head 31, mainly for collecting the adhesive removed from the second area 202.

[0097] In some embodiments, the adhesive removal device 100 may further include a pressure sensor 6 connected to the first cleaning head assembly 2, and the pressure sensor 6 may be configured to detect the pressure value between the first cleaning head 22 and the part 200 to be cleaned. When the pressure value is too high, the position of the first cleaning head 22 can be adjusted to move it away from the part 200 to be cleaned, thereby reducing the pressure value between the first cleaning head 22 and the part 200 to be cleaned and preventing damage to the first cleaning head 22; when the pressure value is too low, the position of the first cleaning head 22 can be adjusted to move it closer to the part 200 to be cleaned, increasing the pressure value between the first cleaning head 22 and the part 200 to be cleaned, thereby ensuring the adhesive removal effect of the first cleaning head 22 on the part 200 to be cleaned. In other words, by setting the pressure sensor 6, the adhesive removal device 100 can meet the requirements of both adhesive removal efficiency and quality, and minimize the damage to the mating surface caused by the adhesive removal process.

[0098] In other embodiments, such as Figure 11As shown, the adhesive removal device 100 may include two pressure sensors 6, which are respectively connected to the first cleaning head assembly 2 and the second cleaning head assembly 3. One pressure sensor 6 may be configured to detect the pressure value between the first cleaning head 22 and the adhesive-to-be-removed part 200, and the other pressure sensor 6 may be configured to detect the pressure value between the second cleaning head 32 and the adhesive-to-be-removed part 200.

[0099] In other embodiments, the adhesive removal device 100 may further include two or more pressure sensors to improve the accuracy of pressure detection on the first cleaning head assembly 2 and the second cleaning head assembly 3; alternatively, a pressure sensor may be provided only at the first cleaning head 22. That is, the adhesive removal device 100 may have at least one pressure sensor 6, and the at least one pressure sensor 6 is connected to the first cleaning head assembly 2 and / or the second cleaning head assembly 3.

[0100] Understandably, when the first cleaning head 22 and the second cleaning head 32 operate simultaneously, or when the first cleaning head 22 operates alone, the pressure value between the first cleaning head 22 and the adhesive-to-be-cleaned component 200 is used to determine whether to adjust the cleaning head's position. When the second cleaning head 32 operates alone, the pressure value between the second cleaning head 32 and the adhesive-to-be-cleaned component 200 is used to determine whether to adjust the cleaning head's position.

[0101] In some embodiments, such as Figure 12 As shown, the adhesive removal device 100 may further include an operating table 9 and at least three positioning components 8. The positioning components 8 are connected to the operating table 9 and are used to fix the component 200 to be cleaned onto the operating table 9. Furthermore, the lines connecting the at least three positioning components 8 are not on the same straight line. In this embodiment, the three positioning components 8, which are not on the same straight line, can stably fix the component 200 to be cleaned onto the operating table 9, facilitating subsequent adhesive removal processing of the component 200 by the first cleaning head assembly 2 and the second cleaning head assembly 3.

[0102] In some embodiments, such as Figure 13 As shown, the positioning assembly 8 may include a first screw 82, a connecting rod 84, and a second screw 86. The first end of the first screw 82 may be fixed to the operating table 9, and the second end of the first screw 82 is connected to the first end of the connecting rod 84. The connecting rod 84 may be perpendicular to the first screw 82 and may move on the first screw 82. The first end of the second screw 86 may be connected to the second end of the connecting rod 84, and the second screw 86 is parallel to the first screw 82. The second screw 86 may be configured to move on the connecting rod 84 so that the second end of the second screw 86 abuts against or separates from the component 200 to be cleaned.

[0103] In some embodiments, the connecting rod 84 may be threadedly engaged with the first screw 82 and the second screw 86 respectively, so as to adjust and fix the position of the connecting rod 84 relative to the first screw 82 and the second screw 86. During the up-and-down movement of the connecting rod 84, the connecting rod 84 also rotates relative to the first screw 82, thereby adjusting the fixed position of the second screw 86.

[0104] To further improve the positioning and adjustment effect, the positioning assembly 8 may further include a first positioning part 81, a first nut 83, a second nut 85, and a second positioning part 87. One side of the first positioning part 81 is fixed to the operating table 9, and the other side is fixedly connected to the first end of the first screw 82. The first nut 83 is disposed at the second end of the first screw 82, thereby limiting the movement range of the connecting rod 84 on the first screw 82 through the first positioning part 81 and the first nut 83. The second nut 85 may be disposed at the first end of the second screw 86, and the second positioning part 87 may be disposed at the second end of the second screw 86, thereby limiting the movement range of the connecting rod 84 on the first screw 82 through the second nut 85 and the second positioning part 87. The bottom area of ​​the second positioning part 87 may be larger than the area of ​​the second end of the second screw 86 to increase the contact area between the positioning assembly 8 and the component 200 to be cleaned, thereby fixing the component 200 to be cleaned more securely.

[0105] In this embodiment, the component to be cleaned 200 can be fixed to the operating table 9 by adjusting the position of the connecting rod 84 on the first screw 82 and the position of the second screw 86 relative to the connecting rod 84. Alternatively, based on the above-mentioned adjustment and fixing, the lengths of the first screw 82, the connecting rod 84, and the second screw 86 in the positioning assembly 8 can be adjusted accordingly, depending on the size and shape of the component to be cleaned 200, so that the positioning assembly 8 can better fix the component to be cleaned 200 to the operating table 9.

[0106] In some embodiments, the control panel 9 may also be provided with an adjustment component to adjust the position and orientation of the first cleaning head assembly 2 and the second cleaning head assembly 3 relative to the glue-to-be-cleaned part 200.

[0107] like Figure 12As shown, the adhesive removal device 100 further includes a first adjustment component 71, a second adjustment component 72, a third adjustment component 73, and a fourth adjustment component 74; wherein, the first adjustment component 71 is connected to the mounting platform 1, and the first adjustment component 71 is configured to adjust the position of the first cleaning head component 2 and the second cleaning head component 3 in the vertical direction; the second adjustment component 72 is connected to the first adjustment component 71, and the second adjustment component 72 is configured to adjust the contact position between the first cleaning head component 2 and the second cleaning head component 3 and the adhesive to be removed part 200; the third adjustment component 73 is connected to the second adjustment component 72, and the third adjustment component 73 is configured to adjust the position of the first cleaning head component 2 and the second cleaning head component 3 in the first horizontal direction; the fourth adjustment component 74 is connected to the third adjustment component 73, and the fourth adjustment component 74 is configured to adjust the position of the first cleaning head component 2 and the second cleaning head component 3 in the second horizontal direction, the first horizontal direction and the second horizontal direction being perpendicular.

[0108] In this embodiment, after the component 200 to be cleaned is fixed on the operating table 9 by the positioning component 8, the first cleaning head component 2 and the second cleaning head component 3 can precisely remove the adhesive from the component 200 by adjusting the coordination of the various components in the adjustment component 7. Specifically, the first adjustment component 71, the second adjustment component 72, the third adjustment component 73, and the fourth adjustment component 74 are interconnected. When the fourth adjustment component 74 moves, it can drive a part of the third adjustment component 73 to move. In addition to being driven to move, the third adjustment component 73 can also move on its own. Furthermore, during its movement (whether actively or passively), it can drive the second adjustment component 72, the first adjustment component 71, and the mounting table 1 to move, thereby adjusting the positions of the first cleaning head component 2 and the second cleaning head component 3 in the first horizontal direction and the second horizontal direction. Furthermore, after the positions in the first and second horizontal directions are adjusted to their proper positions, the second adjustment component 72, based on the appearance shape of the component 200 to be cleaned, drives the mounting platform 1 to rotate via the first adjustment component 71 to adjust the posture of the first cleaning head component 2 and the second cleaning head component 3, thereby adjusting their contact position with the component 200 to be cleaned, so that the first cleaning head component 2 and the second cleaning head component 3 can be basically aligned with the de-adhesion surface (e.g., the mating surface) of the component 200 to be cleaned. After the posture of the first cleaning head component 2 and the second cleaning head component 3 is adjusted to their proper positions, the first adjustment component 71 can control the mounting platform 1 to rise or fall, so that the first cleaning head component 2 and the second cleaning head component 3 are disengaged from or in contact with the component 200 to be cleaned.

[0109] For example, the first cleaning head assembly 2 and the second cleaning head assembly 3 can be adjusted in the first and second horizontal directions via the third adjustment assembly 73 and the fourth adjustment assembly 74, so that the first cleaning head assembly 2 and the second cleaning head assembly 3 are roughly positioned directly above the part of the component 200 to be cleaned (understandably, the third adjustment assembly 73 and the fourth adjustment assembly 74 can adjust the first cleaning head assembly 2 and the second cleaning head assembly 3 to any position directly above the part of the component 200 to be cleaned); then the first adjustment assembly 71 adjusts the first cleaning head assembly 2 and the second cleaning head assembly 3 to be near the part to be cleaned; then the second adjustment assembly 72 is rotated to make the first cleaning head assembly 2 and the second cleaning head assembly 3 basically fit with the part to be cleaned; then the first adjustment assembly 71, the second adjustment assembly 72, the third adjustment assembly 73 and the fourth adjustment assembly 74 are further fine-tuned to make the first cleaning head assembly 2 and the second cleaning head assembly 3 precisely fit with the part 200 to be cleaned, thereby achieving the removal of glue from the part 200 to be cleaned.

[0110] In some embodiments, the first adjustment assembly 71 may include a first cylinder 711 and a first connecting plate 712; wherein the first connecting plate 712 is connected to the first cylinder 711 and the mounting platform 1 respectively. The first cylinder 711 can drive the first connecting plate 712 to move in the vertical direction, thereby driving the mounting platform 1 and the first cleaning head assembly 2 and the second cleaning head assembly 3 located on the mounting platform 1 to move. The vertical direction is the direction perpendicular to the surface of the operating table 9.

[0111] like Figure 14 As shown, the second adjustment assembly 72 may include a second connecting plate 721, a third driving member 722, a first gear 723, a second gear 724, and a third connecting plate 725. The output shaft of the second connecting plate 721 and the third driving member 722 can be connected to the first gear 723. The first gear 723 meshes with the second gear 724, so that when the output shaft rotates to drive the first gear 723 to rotate, the second gear 724 can also rotate accordingly through the meshing of the gears. The third driving member 722 and the first gear 723 can be located on opposite sides of the second connecting plate 721, and the third driving member 722 is configured to drive the first gear 723 to rotate. The second gear 724 and the first gear 723 can be located on the same side of the second connecting plate 721, and the second gear 724 can be rotatably connected to the second connecting plate 721. Simultaneously, the second gear 724 can be connected to the third connecting plate 725 to drive the third connecting plate 725 to rotate under the drive of the third driving member 722. The first adjustment component 71 can be connected to the third connecting plate 725, for example, it can be fixed on the third connecting plate 725, so that when the third connecting plate 725 rotates, it can drive the first cleaning component 2 and the second cleaning component 3 to rotate via the first adjustment component 71 and the mounting platform 1.

[0112] The third adjustment assembly 73 may include a first slider 731 and a first slide rail 732. The first slider 731 may have a through hole, and the first slide rail 732 may pass through the through hole. The first slide rail 732 may extend along a first horizontal direction to guide the movement of the first slider 731. The third adjustment assembly 73 may further include a fourth drive member 733, which is connected to the first slider 731 or the first slide rail 732 to drive the slider 731 to move along the first horizontal direction on the first slide rail 732. In some embodiments, the fourth drive member 733 may be a motor, and the first slide rail 732 may be a lead screw. The motor can drive the lead screw to rotate, thereby enabling the slider 731 to move along the lead screw along the first horizontal direction. The slider 731 may be connected to a second connecting plate 721, which is configured to move along the first horizontal direction with the slider 731.

[0113] In some embodiments, such as Figure 12 As shown, the third adjustment component 73 may include two sets of mating structures consisting of a first slider 731 and a first slide rail 732 arranged in pairs. These two sets of mating structures may be arranged in parallel.

[0114] The fourth adjustment assembly 74 may include a second slider 741 and a second slide rail 742. The second slider 741 may have a through hole, and the second slide rail 742 may pass through the through hole of the second slider 741. The second slide rail 742 may extend along a second horizontal direction to guide the movement of the second slider 741. The fourth adjustment assembly 74 may also include a fifth drive member 743, which is connected to the second slider 741 or the second slide rail 742 to drive the second slider 741 to move along the second horizontal direction on the second slide rail 742. In some embodiments, the fifth drive member 743 may be a motor, and the second slide rail 742 may be a lead screw. The motor may drive the lead screw to rotate, thereby enabling the second slider 741 to move along the lead screw in the second horizontal direction. The second slider 741 may be connected to a first slide rail 732, which is configured to move along the second horizontal direction with the second slider 741.

[0115] In some embodiments, the fourth adjustment component 74 may include a pair of mating structures for two sets of second sliders 741 and second slide rails 742. These two sets of mating structures may be arranged in parallel.

[0116] Understandably, depending on the specific part of the component 200 to be cleaned and the current position of the first cleaning head assembly 2 and the second cleaning head assembly 3, the first adjustment assembly 71, the second adjustment assembly 72, the third adjustment assembly 73 and the fourth adjustment assembly 74 can be operated simultaneously, individually, or any two or three can be operated simultaneously to adjust the position of the first cleaning head assembly 2 and the second cleaning head assembly 3 on the mounting platform, thereby better removing the adhesive from the component 200 to be cleaned.

[0117] In some embodiments, the adhesive removal device 100 may further include a controller, which may control the first drive member 21 to drive the first cleaning head 22 to clean the first region 201 of the adhesive removal component 200; and / or drive the second cleaning head 32 to clean the second region 202 of the adhesive removal component 200 via the second drive member 31.

[0118] In other embodiments, the controller can control the cleaning assembly 5 to collect the adhesive removed from the adhesive-to-be-cleaned component 200 by the first cleaning head assembly 2 and the second cleaning head assembly 3, and to transport the collected adhesive away through the cleaning interface 51. The controller can also adjust the pressure between the first cleaning head 22 or the second cleaning head 32 and the adhesive-to-be-cleaned component 200 by the first adjustment assembly 71 based on the pressure value detected by the pressure sensor 6. The controller can also control the first adjustment assembly 71, the second adjustment assembly 72, the third adjustment assembly 73, and the fourth adjustment assembly 74 to adjust the first cleaning head assembly 2 and the second cleaning head assembly 3 on the mounting platform 1 to the position on the adhesive-to-be-cleaned component 200 where the adhesive needs to be cleaned.

[0119] This application embodiment also provides a method for controlling the above-described adhesive removal device, which can be executed, for example, by the above-described controller. The method includes: driving a first cleaning head 22 to remove adhesive from a first region 201 of the adhesive-to-be-removed component 200 via a first driving member 21; and / or driving a second cleaning head 32 to remove adhesive from a second region 202 of the adhesive-to-be-removed component 200 via a second driving member 31.

[0120] In some embodiments, when the adhesive removal device further includes the cleaning component 5 as described above, the method may further include controlling the cleaning component 5 to collect the adhesive removed from the adhesive-to-be-cleaned component 200 by the first cleaning head component 2 and the second cleaning head component 3, and conveying the collected adhesive away through the cleaning interface 51.

[0121] In some embodiments, when the adhesive removal device further includes the pressure sensor 6 as described above, and the first adjustment component 71, second adjustment component 72, third adjustment component 73, and fourth adjustment component 74, the method may further include adjusting the distance between the first cleaning head 22 or the second cleaning head 32 and the adhesive-to-be-removed component 200 via the first adjustment component 71 based on the pressure value detected by the pressure sensor 6. Specifically, when the first cleaning head 22 and the second cleaning head 32 operate simultaneously or when the first cleaning head 22 operates alone, the distance between the first cleaning head 22 and the adhesive-to-be-removed component 200 is adjusted via the first adjustment component 71 based on the pressure value between the first cleaning head 22 and the adhesive-to-be-removed component 200. When the second cleaning head 32 operates alone, the distance between the second cleaning head 32 and the adhesive-to-be-removed component 200 is adjusted via the first adjustment component 71 based on the pressure value between the second cleaning head 32 and the adhesive-to-be-removed component 200.

[0122] In some embodiments, the method further includes controlling the first adjustment component 71, the second adjustment component 72, the third adjustment component 73 and the fourth adjustment component 74 to adjust the first cleaning head component 2 and the second cleaning head component 3 on the mounting platform 1 to the position on the part to be cleaned 200.

[0123] In this embodiment, a suitable adhesive removal program can be selected based on the specific model or appearance of the component 200 to be cleaned. After selecting the adhesive removal program, the first adjustment component 71, the second adjustment component 72, the third adjustment component 73, and the fourth adjustment component 74 work together to adjust the first cleaning head component 2 and the second cleaning head component 3 to a suitable position and posture, so as to start the subsequent adhesive removal operation.

[0124] Driven by their respective motors, the first cleaning head 22 and the second cleaning head 32 rotate sequentially to begin the adhesive removal process. The second cleaning head 32, under the pressure of the elastic element 4, remains in close contact with a working surface of the component 200 to be cleaned (e.g., the side of the box). Simultaneously, the second cleaning head 32 can swing or move along the slide groove 11, preventing damage from protruding structures on the working surface. While the first and second cleaning heads 22 and 32 are removing adhesive, the cleaning assembly 5 begins operation. Under the action of other components, a negative pressure is generated in the inner cavity, sucking in the waste material removed by the first and second cleaning heads 22 and 32, preventing contamination of the working surface. Furthermore, during the operation of either the first or second cleaning head 22, the pressure sensor 6 continuously monitors the pressure exerted by the first or second cleaning head 22 on the adhesive removal surface to prevent damage to the surface and avoid affecting subsequent analysis and continued use.

[0125] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0126] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0127] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A glue removing device (100), characterized in that, The glue removing device (100) comprises a mounting table (1), a first head cleaning assembly (2) and a second head cleaning assembly (3); The first head cleaning assembly (2) and the second head cleaning assembly (3) are connected with the mounting table (1) respectively, and the first head cleaning assembly (2) and the second head cleaning assembly (3) are arranged at intervals; The first head cleaning assembly (2) comprises a first driving member (21) and a first head (22), and the first head (22) is configured to rotate under the driving of the first driving member (21) to clean glue on a first area (201) of a glue cleaning component (200); The second head cleaning assembly (3) comprises a second driving member (31) and a second head (32), and the second head (32) is configured to rotate under the driving of the second driving member (31) to clean glue on a second area (202) of the glue cleaning component (200), and the first area (201) is different from the second area (202); An end of the first head (22) along its rotation axis abuts against the first area (201) to clean glue; A radial side of the second head (32) along its rotation axis is used to abut against the second area (202) to clean glue; The glue removing device (100) further comprises an elastic member (4); One end of the elastic member (4) is connected with the mounting table (1), and the other end is connected with the second head cleaning assembly (3), and the elastic member (4) is configured to make the second head (32) abut against the second area (202); A first glue cleaning member (221) is arranged on a bottom wall of the first head (22), and the first glue cleaning member (221) is configured to rotate with the first head (22) to clean glue on the first area (201) of the glue cleaning component (200); A second glue cleaning member (321) is arranged on a side wall of the second head (32), and the second glue cleaning member (321) is configured to rotate with the second head (32) to clean glue on the second area (202) of the glue cleaning component (200); The number of the second head cleaning assemblies (3) is two, and the two second head cleaning assemblies (3) are located on opposite sides of the first head (22).

2. The glue removing device (100) according to claim 1, characterized in that A plane where the first area (201) is located intersects with a plane where the second area (202) is located.

3. The glue removing device (100) according to claim 1, characterized in that, The mounting table (1) is provided with a sliding groove (11); At least a part of the second head cleaning assembly (3) is located in the sliding groove (11), and the second head cleaning assembly (3) can move in the sliding groove (11) under the action of the elastic member (4).

4. The glue removing device (100) according to claim 1, characterized in that, The second head cleaning assembly (3) further comprises a rotating shaft (34), and the rotating shaft (34) is rotationally connected with the mounting table (1); The rotating shaft (34) has a through hole (341), and at least a part of the second head cleaning assembly (3) is located in the through hole (341); The elastic member (4) is connected with the second driving member (31). The second head cleaning assembly (3) is configured to swing under the action of the elastic member (4) and drive the rotating shaft (34) to rotate.

5. The glue removing device (100) according to any one of claims 1-4, characterized in that, The glue removing device (100) further comprises a material cleaning assembly (5); The material cleaning assembly (5) is connected with the mounting table (1) and is arranged separately from the first head cleaning assembly (2) and the second head cleaning assembly (3); The material cleaning assembly (5) is configured to collect the glue removed from the glue cleaning part (200) by the first head cleaning assembly (2) and the second head cleaning assembly (3).

6. The glue removing device (100) according to any one of claims 1-4, characterized in that, The glue removing device (100) further comprises an operation table (9) and at least three positioning assemblies (8); The positioning assembly (8) is connected with the operation table (9); The positioning assembly (8) is used for fixing the glue cleaning part (200) on the operation table (9); The connecting lines of the at least three positioning assemblies (8) are not on the same straight line.

7. The device according to claim 6, wherein The positioning assembly (8) comprises a first screw rod (82), a connecting rod (84) and a second screw rod (86); The first end of the first screw rod (82) is fixed on the operation table (9), and the second end of the first screw rod (82) is connected with the first end of the connecting rod (84); The connecting rod (84) is perpendicular to the first screw rod (82), and the connecting rod (84) can move on the first screw rod (82); The first end of the second screw rod (86) is connected with the second end of the connecting rod (84), and the second screw rod (86) is parallel to the first screw rod (82); The second screw rod (86) is configured to move on the connecting rod (84) so that the second end of the second screw rod (86) abuts against or separates from the glue cleaning part (200).

8. The device according to any one of claims 1 to 4, wherein The glue removing device (100) further comprises a first adjusting assembly (71), a second adjusting assembly (72), a third adjusting assembly (73) and a fourth adjusting assembly (74); wherein, The first adjusting assembly (71) is connected with the mounting table (1), and the first adjusting assembly (71) is configured to adjust the positions of the first head cleaning assembly (2) and the second head cleaning assembly (3) in the vertical direction; The second adjusting assembly (72) is connected with the first adjusting assembly (71), and the second adjusting assembly (72) is configured to adjust the contact positions of the first head cleaning assembly (2) and the second head cleaning assembly (3) with the glue cleaning part (200); The third adjusting assembly (73) is connected with the second adjusting assembly (72), and the third adjusting assembly (73) is configured to adjust the positions of the first head cleaning assembly (2) and the second head cleaning assembly (3) in the first horizontal direction; The fourth adjusting assembly (74) is connected with the third adjusting assembly (73), and the fourth adjusting assembly (74) is configured to adjust the positions of the first head cleaning assembly (2) and the second head cleaning assembly (3) in the second horizontal direction, and the first horizontal direction and the second horizontal direction are perpendicular.

9. The device according to any one of claims 1 to 4, wherein The glue removing device (100) further comprises at least one pressure sensor (6) connected with the first head cleaning assembly (2) and / or the second head cleaning assembly (3), and the pressure sensor (6) is configured to detect a pressure value between the first head (22) or the second head (32) and the glue component (200) to be cleaned.

10. A method for controlling a glue removal device as claimed in any one of the claims 1-9, characterized in that, The method comprises: driving the first head (22) by the first driving member (21) to clean glue on the first area (201) of the glue component (200) to be cleaned; and / or, driving the second head (32) by the second driving member (31) to clean glue on the second area (202) of the glue component (200) to be cleaned.

Images