Star sensor CMOS circuit board target surface automatic assembling and adjusting method

Abstract

The application belongs to the field of spacecraft precision assembly technology, and relates to a star sensor CMOS circuit board target surface automatic assembly and adjustment method. The assembly and adjustment equipment mainly comprises a feeding module, a measuring module, an assembly and adjustment module and a tool locking module. The method is divided into an assembly process, an inspection process and a locking process with the parallelism detection process as a demarcation point. The inspection process is divided into two cases. If the accuracy requirement is met after inspection, the locking process is directly continued. If the accuracy requirement is not met, a plurality of new parts are measured for parallelism while waiting for the adjustment pad to be ground. The application can realize alignment positioning of the adjustment pad, automatic adjustment and assembly of the relative position of the CMOS circuit board and the star sensor support, automatic measurement of the parallelism of the target surface and the reference surface, and the assembly and adjustment process is visual. The parts are positioned and locked by the clamp tool during the measurement process, and do not need to be locked, measured and disassembled for adjustment, thereby reducing the damage of the parts.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of precise assembly of spacecraft devices, and relates to an automatic assembly and adjustment method for a target surface of a CMOS circuit board of a star sensor, which is a kind of automatic assembly and adjustment technology for a CMOS circuit board containing a target surface in a starlight sensitive processing unit of a miniaturized star sensor. BACKGROUND

[0002] The star sensor is a high-precision space attitude measurement device taking the starry sky as a working object, and is used to provide accurate space orientation and reference for an aerospace vehicle. The star sensor has the characteristics of high attitude determination precision, fast data processing speed, small size, and greatly reduced mass and power consumption. The star sensor mainly consists of three parts, i.e., a miniaturized structure unit, an optical system unit, and a starlight sensitive processing unit. After the image processor and the imaging circuit in the starlight sensitive processing unit are welded, the two are collectively referred to as a CMOS circuit board. The CMOS circuit board is a core component of the star sensor, and the target surface is located at a specified position in the CMOS circuit board. The manufacturing and assembly precision of the target surface have an important influence on the performance of the star sensor. Therefore, the assembly method of the target surface in the starlight sensitive processing unit is of great significance to improve the attitude measurement precision of the star sensor.

[0003] The installation and adjustment of the CMOS circuit board and the star sensor support in the star sensor requires that the installation tilt range of the target surface relative to the reference surface at the bottom of the star sensor support be less than or equal to 2', and the installation tilt range of the x and y axes of the pixel point rectangle in the target surface relative to the edge line of the reference surface be less than or equal to 1'. The current installation and adjustment method mainly uses manual assembly with special fixture tools and screws, pins and screws and other tools. For example, the inventor Chen Ting et al. invented a high-precision and high-stability installation method for a star-borne star sensor in the invention patent No. CN201810202225.3. The installation and adjustment process is to install the star sensor on a specially-made installation structure, tighten the screws of the diagonal installation holes by hand and apply the required torque to ensure the accuracy requirement. This method is difficult to guarantee the accurate application of torque, and the torque of the diagonal screws is different, which is easy to damage the workpiece. The inventor Zhai Zhengyi et al. invented a high-efficiency installation and adjustment system and method for a reference prism of a star sensor in the invention patent No. CN201811549719.5. The installation and adjustment are performed by using a six-dimensional adjustment frame and a double autocollimator. The assembly process mainly relies on manual assembly, which has a certain effect on the adjustment of parts during the assembly process, but the six-dimensional adjustment needs to be continuously adjusted, and the efficiency is low. In the paper "Research on the attitude detection method of star sensor imaging plane", Qin Guohua designed a star sensor imaging plane attitude detection device with a two-dimensional guide rail and a gantry structure. The device uses a cube mirror on the base as a reference reference, realizes the tilt angle detection of the imaging plane by a laser displacement sensor and a camera, and completes the calculation of the tilt angle by using the least square method. The device and method in the paper can realize the detection of the assembly effect, but do not involve the specific part assembly method. Moreover, the workpieces to be detected are located on the same surface of the fixed base, while in the installation and adjustment task of the present application, the target surface of the CMOS circuit board and the reference surface are located in different planes, and the measurement difficulty is relatively increased.

[0004] As can be seen from the above, the installation and adjustment accuracy of the existing installation and adjustment method depends on the technical level, operation habit, work experience and the like of workers, and the installation and adjustment accuracy is low and the scrap rate is high. In view of the above problems, it is difficult to improve the operation level of workers to achieve high installation and adjustment accuracy, the output-input ratio is small, the automation degree is low, and it is difficult to guarantee the installation and adjustment accuracy. Therefore, it is necessary to invent a reasonable and feasible installation and adjustment method and cooperate with the self-developed automatic installation and adjustment equipment to meet the requirements of the current installation and adjustment efficiency and installation and adjustment accuracy. SUMMARY

[0005] The technical problem to be solved by the present application is to overcome the precision and efficiency defects caused by the current installation and adjustment process of the CMOS circuit board and the star sensor support, and to invent an automatic installation and adjustment method for the target surface of the star sensor CMOS circuit board, which can quickly and accurately realize the assembly and adjustment of the CMOS circuit board and the star sensor support, and improve the installation and adjustment accuracy and efficiency.

[0006] The technical solution of the present application is as follows:

[0007] The application discloses an automatic assembling and adjusting method for a star sensor CMOS circuit board target surface.

[0008] The measuring module is mainly composed of a three-axis precision displacement slide table 5, a measuring head support a 6, a combined laser displacement measuring head 7, a measuring head support b 8, a measuring assembly support 9 and an industrial camera a 10. The measuring head support a 6 and the measuring head support b 8 are installed at the bottom of one side of the measuring assembly support 9, the industrial camera a 10 is installed at the other side of the measuring assembly support 9, the measuring assembly support 9 is installed on the Z-axis of the three-axis precision displacement slide table 5, the three-axis precision displacement slide table 5 is installed at the bottom of the optical platform 4, and the combined laser displacement measuring head 7 is locked in front of and behind the measuring head support a 6 and the measuring head support b 8. The combined laser displacement measuring head 7 is composed of three small split-beam interferometer displacement meters which are arranged in an equilateral triangle shape. The combined laser displacement measuring head 7 realizes the parallelism measurement function of the target surface of the CMOS circuit board 1 and the reference surface below the star sensor support 3 after the CMOS circuit board 1 is assembled. The industrial camera a 10 realizes the parallelism measurement function of the pixel point rectangular target surface edge line on the CMOS circuit board 1 and the reference surface edge line of the star sensor support 3 during the assembly of the CMOS circuit board 1. The three-axis precision displacement slide table 5 has three-dimensional linear motion capability and can realize the function of adjusting different measurement positions of the combined laser displacement measuring head 7 and the industrial camera a 10.

[0009] The tool locking module is mainly composed of a bearing with seat 33, a rotating shaft support 34, a rotating shaft 35, a guide rod cylinder 36, a clamp assembly base 37, a corner cylinder 38, a reflector 39, a V-shaped block 40, a linear precision displacement slide table d41, a precision rotary table b42 and a tool locking assembly support 43. The tool locking assembly support 43 is in a U-shaped structure, the middle part of which is provided with the reflector 39, one end side of which is provided with the bearing with seat 33, and the other end side of which is provided with the precision rotary table b42, and the bottom of which is installed on the linear precision displacement slide table d41, and the bottom of the linear precision displacement slide table d41 is installed on the optical platform 4. The clamp assembly base 37 is in an L-shaped structure, one end of which is provided with the rotating shaft support 34, one end of the rotating shaft 35 is inserted through the opening of the rotating shaft support 34 and is locked and fixed, and the other end of the rotating shaft 35 is inserted through the bearing with seat 33 and is fixed. The other end of the clamp assembly base 37 is installed on the rotary table surface of the precision rotary table b42. The guide rod cylinder 36 is installed at one end of the clamp assembly base 37, the corner cylinder 38 is installed vertically in the middle of the clamp assembly base 37, and the V-shaped block 40 is installed on the other end side of the clamp assembly base 37. The reflector 39 realizes the function of observing the pixel point rectangular target surface on the CMOS circuit board 1 and the reference surface of the star sensor support 3 from the side, from bottom to top, by the industrial camera a10. The L-shaped clamp assembly base 37, the rotating shaft support 34, the rotating shaft 35, the bearing with seat 33, the precision rotary table b42 and other components form a swing-like rotating structure, which, under the drive of the precision rotary table b42, can make the clamp assembly base 37, the star sensor support 3 parts and the rotating shaft support 34, the rotating shaft 35, the guide rod cylinder 36, the corner cylinder 38 and the V-shaped block 40 and other components rotate around the rotating shaft of the precision rotary table b42, and realize the functions of adjusting the CMOS circuit board 1, adjusting the gasket 2 and adjusting the attitude of the star sensor support 3 parts during assembly and measurement. The V-shaped block 40 is adapted to the outer contour design of the star sensor support 3 and realizes the positioning function in the positioning and clamping of the star sensor support 3. The top rod of the guide rod cylinder 36 can move in and out along the opening direction of the V-shaped block 40, and realizes the clamping function in the positioning and clamping of the star sensor support 3. The corner cylinder 38 can rotate 90° around its rotating shaft and is locked, and realizes the locking function of the CMOS circuit board 1 after the adjustment and assembly of the CMOS circuit board 1. The linear precision displacement slide table d41 can displace in a single direction, and realizes the functions of adjusting the working position of the parts thereon and assembly adjustment.

[0010] The assembly and adjustment module is mainly composed of a profile support 11, a linear precision displacement slide table a12, a slide table support 16, an assembly and adjustment module and a locking module. The slide table support 16 is in a U-shaped structure, and the two ends thereof are respectively provided with the assembly and adjustment module and the locking module, and the middle part thereof is installed on the linear precision displacement slide table a12. The bottom of the linear precision displacement slide table a12 is installed on the profile support 11, and the bottom of the profile support 11 is installed on the optical platform 4. The assembly and adjustment module is mainly composed of an industrial camera b13, an assembly and adjustment component support 14, a linear precision displacement slide table b15, a precision rotary table a26, a cylindrical force sensor 27 and a part suction head 28. The top of the part suction head 28 is installed on the bottom of the cylindrical force sensor 27, the top of the cylindrical force sensor 27 is installed on the rotary table surface at the bottom of the precision rotary table a26, the top of the precision rotary table a26 is installed on the mounting surface at the bottom of the assembly and adjustment component support 14, the industrial camera b13 is installed on the assembly and adjustment component support 14, the side surface of the assembly and adjustment component support 14 is installed on the table surface of the linear precision displacement slide table b15, and the linear precision displacement slide table b15 is installed on the side surface of the slide table support 16. The locking module is mainly composed of a slide table cylinder 17, a locking cylinder 18, a locking component base 19, a linear guide rail 20, an electric screwdriver 21, an electric screwdriver support 22 and a screw suction head 23. The electric screwdriver 21 is installed on the electric screwdriver support 22, the electric screwdriver support 22 is in an L-shaped structure, the side surface thereof is installed on the linear guide rail 20, the bottom of the linear guide rail 20 is installed on the locking component base 19, the locking component base 19 is in an L-shaped structure, the side surface thereof is installed on the table surface of the slide table cylinder 17, the bottom of the slide table cylinder 17 is installed on the side surface of the slide table support 16, the locking cylinder 18 is fixedly installed on the locking component base 19, the top rod thereof is connected with the electric screwdriver support 22, and the screw suction head 23 is installed on the bottom of the locking component base 19.The linear precision displacement slide table a12, the linear precision displacement slide table b15 and the linear precision displacement slide table d41 are combined to form a three-dimensional motion structure of part picking assembly; the linear precision displacement slide table a12, the slide cylinder 17 and the linear precision displacement slide table d41 are combined to form a three-dimensional motion structure of screw adsorption material taking and part locking process; the precision turntable a26 can drive the part adsorbed on the part adsorption head 28 to rotate around the rotation shaft, that is, to realize the function of adjusting the parallelism of the edge line of the pixel point rectangular target surface of the CMOS circuit board 1 and the edge line of the reference surface of the star sensor support 3; the industrial camera b13 realizes the function of part position identification; the cylindrical force sensor 27 realizes real-time feedback of the contact force between the part adsorption head 28 and the part in the assembly process, which can not only avoid insufficient contact to cause part picking failure, but also avoid excessive contact force to damage the part and the equipment; the locking module can realize the functions of screw adsorption and part locking, wherein the locking cylinder 18 realizes the function of driving the electric screwdriver support 22 and the electric screwdriver 21 thereon to reciprocatingly move up and down, the linear guide rail 20 realizes the guiding function of the reciprocating movement of the electric screwdriver support 22 and the electric screwdriver 21 thereon up and down, and the screw adsorption head 23 realizes the screw adsorption material taking function provided by the screw feeder 24.

[0011] The feeding module mainly comprises a screw feeder 24, a screw feeder base 25, a tray 29, a pressing block 30, a linear precision displacement slide table c31 and a feeding assembly base 32. The bottom of the screw feeder 24 is installed on the screw feeder base 25, and the bottom of the screw feeder base 25 is installed on the optical platform 4; the bottom of the tray 29 is installed on the linear precision displacement slide table c31, the bottom of the linear precision displacement slide table c31 is installed on the feeding assembly base 32, and the bottom of the feeding assembly base 32 is installed on the optical platform 4; the pressing block 30 is placed on the fixed area of the tray. The screw feeder 24 realizes the function of screw feeding; the tray 29 is adapted to the hole positions on the CMOS circuit board 1, the adjustment pad 2 and the pressing block 30, is designed with a boss-shaped limiting structure, so that the three adjustment pads 2 are directly distributed in a triangular shape on the tray 29, so that the adjustment pad 2 and the pressing block 30 are limited by the limiting structure on the plane of the tray 29 and do not produce excessive rotation, facilitating the adsorption and picking of the part adsorption head 28; the bottom of the pressing block 30 is coated with a buffer material, after the CMOS circuit board 1 is installed, the pressing block 30 is picked up by the assembly module and is pressed and assembled on the CMOS circuit board 1, and then the corner cylinder 38 is pressed tightly, avoiding damage to the part by directly pressing the CMOS circuit board 1 on the corner cylinder 38, and since the CMOS circuit board 1 and the star sensor support 3 finally need to be locked by screws, an opening structure is designed corresponding to the screw hole position on the CMOS circuit board 1 after the CMOS circuit board 1 is pressed by the pressing block 30, to ensure that the screw locking is not affected in the pressed state.

[0012] In the whole assembly process, after the parallelism detection of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 is completed, it is necessary to compare whether it meets the accuracy requirements. If it meets the installation tilt range requirements, the next assembly process can be continued; if it does not meet the installation tilt range requirements, the assembly must be stopped immediately, the required grinding amount of the adjusting pad is calculated according to the algorithm, and after the grinding process is completed, the parallelism is detected again with the new adjusting pad until it is qualified to complete the whole assembly process. Therefore, taking the parallelism detection process as the dividing point, the automatic assembly method of the star sensor CMOS circuit board target surface is divided into three processes, namely the assembly process, the inspection process and the locking process, and the specific steps are as follows:

[0013] First step, parts feeding: before assembly, the star sensor support 3 is positioned on the V-shaped block 40 of the tool locking module by manual operation, and the star sensor support 3 is clamped in the V-shaped block 40 by the push rod of the guide rod cylinder 36; then the pressing block 30, the CMOS circuit board 1 to be assembled and the adjusting pad 2 are placed on the tray 29 with a limiting structure, and the feeding is completed. Among them, the tray 29 corresponds to the hole positions of the CMOS circuit board 1, the adjusting pad 2 and the pressing block 30, and is designed with a limiting structure in the shape of a boss, so that the three adjusting pads 2 are directly distributed in a triangular shape on the tray 29, so that the adjusting pad 2 and the pressing block 30 are limited by the limiting structure when placed on the plane of the tray 29 and do not produce too much rotation, facilitating the suction and picking up of the parts suction head 28.

[0014] Second step, adjust the gasket 2 assembly: after the feeding is completed, adjust the gasket 2 assembly. The adjustment module is driven by the linear precision displacement slide a12 to move to the adjustment gasket 2 suction pickup working position, under the assistance of the industrial camera b13, the two-dimensional plane motion is formed by the combination of the linear precision displacement slide a12 and the linear precision displacement slide c31, the relative position between the adjustment part suction head 28 and the adjustment gasket 2 is adjusted, the relative attitude between the adjustment part suction head 28 and the adjustment gasket 2 is adjusted by the precision turntable a26, after alignment, the adjustment part suction head 28 is driven downward by the linear precision displacement slide b15, the adjustment gasket 2 is suctioned and picked up, after successful picking up, the adjustment part suction head 28 drives the adjustment gasket 2 on it to move upward, and the adjustment gasket 2 picking up is completed. When the part suction head 28 contacts with the adjustment gasket 2 for picking up, the mutual contact force is fed back in real time by the cylindrical force sensor 27, so that appropriate contact force is ensured, and the parts and equipment are not damaged; the positions of the three adjustment gaskets 2 relative to each other have been limited by the triangularly distributed boss-shaped structure on the tray 29 during feeding, so that the part suction head 28 can suction and pick up three adjustment gaskets 2 at a time, and the assembly efficiency is improved. After picking up is completed, the adjustment module is driven by the linear precision displacement slide a12 to move to the adjustment gasket 2 assembly adjustment working position, under the assistance of the industrial camera b13, the two-dimensional plane motion is formed by the combination of the linear precision displacement slide a12 and the linear precision displacement slide d41, the relative position between the adjustment part suction head 28 and the adjustment gasket 2 on the star sensor support 3 is adjusted, the relative attitude between the adjustment part suction head 28 and the adjustment gasket 2 on the star sensor support 3 is adjusted by the precision turntable a26, after alignment, the adjustment part suction head 28 is driven downward by the linear precision displacement slide b15, the adjustment gasket 2 is assembled on the assembly hole position of the star sensor support 3, after assembly is completed, the adjustment part suction head 28 is driven upward by the linear precision displacement slide b15 to restore the initial position, and the adjustment gasket 2 assembly is completed. When the adjustment gasket 2 suctioned on the part suction head 28 is assembled with the assembly hole position of the star sensor support 3, the mutual contact force is fed back in real time by the cylindrical force sensor 27, so that appropriate contact force is ensured, and the parts and equipment are not damaged.

[0015] Third step, CMOS circuit board 1 assembly: after the adjustment of gasket 2 assembly is completed, the CMOS circuit board 1 assembly is carried out. The adjustment module is driven to move to the CMOS circuit board 1 adsorption picking work position under the linear precision displacement slide a12, and the relative position between the part adsorption head 28 and the CMOS circuit board 1 is adjusted by the combination of the linear precision displacement slide a12 and the linear precision displacement slide c31 to form two-dimensional plane motion, the relative attitude between the part adsorption head 28 and the CMOS circuit board 1 is adjusted by the precision turntable a26, after alignment, the part adsorption head 28 is driven downward by the linear precision displacement slide b15, the CMOS circuit board 1 is adsorbed and picked up, after successful picking, the part adsorption head 28 drives the CMOS circuit board 1 thereon to move upward, and the CMOS circuit board 1 picking is completed. The mutual contact force when the part adsorption head 28 contacts the CMOS circuit board 1 for picking is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force without damaging the parts and equipment. After picking is completed, the adjustment module is driven to move to the CMOS circuit board 1 assembly adjustment work position under the linear precision displacement slide a12, and the relative position between the CMOS circuit board 1 adsorbed on the part adsorption head 28 and the assembly hole position on the star sensor support 3 is adjusted by the combination of the linear precision displacement slide a12 and the linear precision displacement slide d41 to form two-dimensional plane motion, the parallelism of the pixel point rectangular target surface edge of the CMOS circuit board 1 adsorbed on the part adsorption head 28 and the reference surface edge of the star sensor support 3 is adjusted by the precision turntable a26; wherein the industrial camera a10 is on the side, observes the pixel point rectangular target surface edge of the CMOS circuit board 1 and the reference surface edge of the star sensor support 3 from bottom to top through the reflector 39, assists the precision turntable a26 to adjust the attitude of the edge line parallelism, the industrial camera b13 is on the top, observes the assembly hole position on the star sensor support 3 from top to bottom, assists the linear precision displacement slide a12 and the linear precision displacement slide d41 to adjust the position between the CMOS circuit board 1 and the star sensor support 3; after the position and attitude adjustment is completed, the CMOS circuit board 1 adsorbed on the part adsorption head 28 is driven downward by the linear precision displacement slide b15, the CMOS circuit board 1 is stacked on the adjustment gasket 2, after assembly is completed, the part adsorption head 28 is driven upward by the linear precision displacement slide b15 to restore the initial position, and the CMOS circuit board 1 assembly is completed. The mutual contact force when the CMOS circuit board 1 adsorbed on the part adsorption head 28 and the adjustment gasket 2 are assembled is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force without damaging the parts and equipment.

[0016] Fourth step, CMOS circuit board 1 and adjusting gasket 2 compression: after the assembly of CMOS circuit board 1 is completed, it needs to be fixed by the corner cylinder 38, and the pressing block 30 is used as an intermediate buffer part to protect the parts from being damaged. The assembly and adjustment module moves to the pressing block 30 adsorption pickup working position under the drive of the linear precision displacement slide table a12, and the industrial camera b13 is used as an auxiliary, the relative position between the part adsorption head 28 and the pressing block 30 is adjusted by the combination of the linear precision displacement slide table a12 and the linear precision displacement slide table c31 to form two-dimensional plane motion, the relative attitude between the part adsorption head 28 and the pressing block 30 is adjusted by the precision turntable a26, and after alignment, the part adsorption head 28 is driven downward by the linear precision displacement slide table b15 to adsorb and pick up the pressing block 30, and after successful picking up, the part adsorption head 28 drives the pressing block 30 on it to move upward, and the pressing block 30 picking up is completed. When the part adsorption head 28 contacts the pressing block 30 to pick up, the mutual contact force is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and not to damage the parts and equipment. After picking up is completed, the assembly and adjustment module moves to the pressing block 30 assembly adjustment working position under the drive of the linear precision displacement slide table a12, and the industrial camera b13 is used as an auxiliary, the relative position between the pressing block 30 adsorbed on the part adsorption head 28 and the CMOS circuit board 1 is adjusted by the combination of the linear precision displacement slide table a12 and the linear precision displacement slide table d41 to form two-dimensional plane motion, the relative attitude between the pressing block 30 adsorbed on the part adsorption head 28 and the CMOS circuit board 1 is adjusted by the precision turntable a26, and after alignment, the pressing block 30 adsorbed on the part adsorption head 28 is driven downward by the linear precision displacement slide table b15 to stack the pressing block 30 on the CMOS circuit board 1, and after assembly is completed, the part adsorption head 28 is driven upward by the linear precision displacement slide table b15 to restore the initial position, and the pressing block 30 assembly is completed. When the pressing block 30 adsorbed on the part adsorption head 28 is stacked with the CMOS circuit board 1, the mutual contact force is fed back in real time by the cylindrical force sensor 27 to ensure appropriate contact force and not to damage the parts and equipment. After the assembly of the pressing block 30 is completed, the corner cylinder 38 rotates 90° and then presses, and the pressing rod thereof directly acts on the pressing block 30 to press the pressing block 30 on the CMOS circuit board 1, indirectly press the CMOS circuit board 1 on the adjusting gasket 2, and then indirectly press the adjusting gasket 2 on the star sensor support 3 to complete the compression of all parts. The lower surface of the pressing block 30 is coated with a buffer material, so that the compression force is evenly distributed on the back of the CMOS circuit board 1, avoiding damage to the CMOS circuit board 1. Thus the assembly process is completed.

[0017] Fifth step, the parallelism detection between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3: after the CMOS circuit board 1 and the adjusting gasket 2 are pressed on the star sensor 3, the parallelism between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 is measured. The tool locking module is driven by the linear precision displacement slide table d41 to move to the parallelism detection working position of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3. The attitude of the V-shaped block 40, the CMOS circuit board 1, the adjusting gasket 2 and the star sensor support 3 assembly on which the corner cylinder 38 has been clamped is adjusted by the precision rotary table b42, so that the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 are directed towards the combined laser displacement measuring head 7. The combined laser displacement measuring head 7 is driven by the three-axis precision displacement slide table 5 to move, and the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 are measured respectively. The data is transmitted to the industrial computer, and the parallelism between the two planes is calculated. After the parallelism detection between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 is completed, the attitude of the V-shaped block 40, the CMOS circuit board 1, the adjusting gasket 2 and the star sensor support 3 assembly on which the corner cylinder 38 has been clamped is adjusted by the precision rotary table b42, so that the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 return to the vertical downward state. If the parallelism between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 is qualified, the screw locking process is carried out; if the parallelism between the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 is unqualified, the adjustment amount of the three adjusting gaskets 2 is calculated and recorded and fed back to the operator, and then the pressing block 30, the CMOS circuit board 1 and the adjusting gasket 2 are unloaded by the assembly and adjustment module. The specific steps are opposite to the assembly process steps, and the adjusting gasket 2 is taken away by the operator for grinding processing. After processing, the adjusting and measuring are reassembled. At this stage, the assembly process stops, and the device can continue to measure the parallelism of another new group of parts, avoiding time-consuming and ineffective waiting, and at the same time, the batch measurement effect can be achieved. Thus, the inspection process is completed.

[0018] In the sixth step, if the accuracy requirement is met, the CMOS circuit board 1 is locked: after the parallelism detection of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 is qualified, the CMOS circuit board 1 is locked. The tool locking module is driven by the linear precision displacement sliding table d41 to move to the CMOS circuit board 1 locking working position, the locking module is driven by the linear precision displacement sliding table a12 to move to the adsorption material taking position on the screw feeder 24, the screw adsorption head 23 in the locking module is driven by the sliding table air cylinder 17 to move downward to adsorb and take the screw, after the successful taking, the screw adsorption head 23 and the adsorbed screw are driven by the sliding table air cylinder 17 to move upward to complete the adsorption and taking of the screw. The position of the screw adsorbed and taken each time is fixed, the screw outlet of the screw feeder 24 has been adjusted in advance, the locking module is driven by the linear precision displacement sliding table a12 to move to the same position each time to adsorb and take, and visual positioning feedback is not required. After the adsorption and taking of the screw are completed, the locking module is driven by the linear precision displacement sliding table a12 to move to the CMOS circuit board 1 locking working position, the two-dimensional plane motion is formed by the linear precision displacement sliding table a12 and the linear precision displacement sliding table d41 under the assistance of the industrial camera b13, the relative position between the screw adsorption head 23 in the locking module and the assembly hole position on the star sensor support 3 is adjusted, and after alignment, the screw adsorption head 23 and the adsorbed screw are driven by the sliding table air cylinder 17 to move downward, the electric screwdriver holder 22 and the electric screwdriver 21 mounted thereon are driven by the top rod of the locking air cylinder 18 to move downward under the guidance of the linear guide rail 20, the screw is pushed out of the screw adsorption head 23, the CMOS circuit board 1 and the adjusting pad 2 are locked on the star sensor support 3, and the taking and locking of the remaining two screws are completed in turn, the CMOS circuit board 1 locking is completed, and finally the modules of the equipment are reset, and the locked CMOS circuit board 1, adjusting pad 2 and star sensor support 3 assembly are taken down by the operator to complete the assembly.

[0019] If the accuracy requirement is not met, after the adjusting pad 2 is ground and processed, the processes of part feeding, adjusting pad 2 assembly, CMOS circuit board 1 assembly, CMOS circuit board 1 and adjusting pad 2 pressing, and parallelism detection of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 are repeated. If the accuracy requirement is still not met after detection, the adjustment amount is calculated, the part is discharged for regrinding and processing, until the detection result meets the installation inclination range requirement, the CMOS circuit board 1 is locked, and the entire assembly and adjustment process is completed. Thus, the locking process is completed.

[0020] The present application has the following beneficial effects:

[0021] a. Except for manual feeding before starting assembly, the assembly and adjustment process can be automatically controlled by programs, the assembly efficiency is improved, and errors caused by manual assembly are avoided;

[0022] b. The assembly and adjustment process can be visualized, and the target surface adjustment and hole alignment can be fed back by visual technology. Precise displacement slides are combined with precise rotary table actions to realize automatic adjustment and alignment functions.

[0023] c. The entire assembly and adjustment process can be completed at one time, or batch measurement can be performed while waiting for grinding processing, thus having a dual role. BRIEF DESCRIPTION OF DRAWINGS

[0024] Fig. 1(a) and Fig. 1(b) are exploded and overall schematic diagrams of star sensor parts;

[0025] Figure 2 It is a front overall schematic diagram of the assembly and adjustment equipment;

[0026] Figure 3 It is a back overall schematic diagram of the assembly and adjustment equipment;

[0027] Figure 4 It is a measurement module schematic diagram;

[0028] Figure 5 It is a tool locking module schematic diagram;

[0029] Figure 6 It is an assembly and adjustment module schematic diagram.

[0030] In the drawings: 1 CMOS circuit board; 2 adjustment gasket; 3 star sensor support; 4 optical platform; 5 three-axis precise displacement slide; 6 measuring head support a; 7 combined laser displacement measuring head; 8 measuring head support b; 9 measurement assembly support; 10 industrial camera a; 11 profile support; 12 linear precise displacement slide a; 13 industrial camera b; 14 assembly and adjustment assembly support; 15 linear precise displacement slide b; 16 slide support; 17 slide cylinder; 18 locking cylinder; 19 locking assembly base; 20 linear guide rail; 21 electric screwdriver; 22 electric screwdriver support; 23 screw suction head; 24 screw feeder; 25 screw feeder base; 26 precise rotary table a; 27 cylindrical force sensor; 28 part suction head; 29 tray; 30 pressing block; 31 linear precise displacement slide c; 32 feeding assembly base; 33 bearing with seat; 34 rotary shaft support; 35 rotary shaft; 36 guide rod cylinder; 37 clamp assembly base; 38 angle cylinder; 39 mirror; 40 V-shaped block; 41 linear precise displacement slide d; 42 precise rotary table b; 43 tool locking assembly support. DETAILED DESCRIPTION

[0031] The present application will be described in detail below in combination with the drawings and specific embodiments.

[0032] The structure of the star sensor parts is shown in Fig. 1(a) and Fig. 1(b), and the assembly and adjustment equipment used in the method of the present application is specifically as shown in Figure 2 、 Figure 3 、 Figure 4 ,Figure 5 and Figure 6 as shown.

[0033] Before assembly, the star sensor support 3 is clamped on the tool locking module through the V-block 40 and the guide rod cylinder 36; the tray 29 is horizontally installed on the linear precision displacement slide table c31, the CMOS circuit board 1 and the adjusting shims 2 are placed on the tray 29 and have a certain pre-limiting, and the feeding of the parts to be assembled is completed.

[0034] The position and posture of the parts to be assembled are obtained by the industrial camera b13, so as to realize the precise movement of the part suction head 28 driven by the linear precision displacement slide table a12 to the feeding position, and the linear precision displacement slide table a12 and the part suction head 28 complete the automatic precise suction and feeding of the three adjusting shims 2 and the CMOS circuit board 1 twice under the feedback of the industrial camera b13 (the CMOS circuit board 1 needs to be placed above the adjusting shims 2, and the three adjusting shims 2 are picked up at one time). After the parts are picked up, when the adjusting shims 2 are assembled, the position and posture of the parts are adjusted by the linear precision displacement slide tables a12, c31 and the precision turntable a26 under the feedback of the industrial camera b13, so as to ensure that the three adjusting shims 2 are accurately placed in the preset hole positions of the star sensor support 3; when the CMOS circuit board 1 is assembled, the industrial camera a10 observes the bottom reference surface edge line of the star sensor support 3 and the target surface edge line in the CMOS circuit board 1 from bottom to top through the 45° reflector 39, and then the target surface posture is adjusted by the precision turntable a26, so as to achieve the installation inclination range requirement of the x, y axes of the pixel point rectangle in the target surface relative to the reference surface edge line, and also ensure the alignment of the mounting hole positions on the CMOS circuit board 1, avoid affecting the subsequent locking process, and then assemble after the adjustment is completed.

[0035] After the adjustment pad 2 and the CMOS circuit board 1 are assembled, the screw locking cannot be directly carried out, and it is necessary to detect whether the parallelism of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 meets the accuracy requirement, so the current state of the assembly is maintained by the way that the rotary air cylinder 38 acts on the pressing block 30, and the measurement of the reference surface and the target surface is completed by the combination of the precise rotary table b42 and the laser displacement sensor 7. The specific process is as follows: the linear precise displacement slide table a12 drives the part suction head 28 to move to the material taking position, sucks the pressing block 30 and stacks it on the CMOS circuit board 1, wherein the corresponding position of the pressing block 30 is notched to facilitate screw locking, the pressure during stacking is measured by the cylindrical force sensor 27, the force signal is transmitted to the industrial computer through the control loop to realize closed-loop control; the rotary air cylinder 38 acts on the pressing block 30 to press the CMOS circuit board 1 tightly, so that the subsequent actions do not affect the assembly accuracy and reduce the damage of the parts. The precise rotary table b42 drives the star sensor assembly on the V-shaped block 40 to rotate 90°, so that the reference surface and the target surface face the measurement module, and the combination of the laser displacement sensor 7 and the three-axis precise displacement slide table 5 completes the measurement of the reference surface and the target surface, and the parallelism between the target surface and the reference surface is calculated by the algorithm.

[0036] After the parallelism detection is completed, if the accuracy requirement is met, the screw locking process is carried out; if the accuracy requirement is not met, the adjustment amount of the three adjustment pads 2 is calculated and recorded and fed back to the operator, and then the pressing block 30, the CMOS circuit board 1 and the adjustment pad 2 are unloaded in sequence by the assembly and adjustment module, the operator takes away the adjustment pad 2 for grinding and processing, and after processing, the assembly and measurement are reassembled. At this stage of stopping the assembly process, the equipment can continue to measure the parallelism of another new group of parts, avoiding time-consuming and ineffective waiting, and at the same time, the batch measurement effect can be achieved.

[0037] If the accuracy requirement is met, the CMOS circuit board 1 is directly locked, the precise rotary table b42 rotates the star sensor assembly 90° to restore the vertical downward state of the target surface of the CMOS circuit board 1 and the standard surface of the star sensor support 3, and the linear precise displacement slide table d41 drives the star sensor assembly to move to the locking position; the locking module is driven by the linear precise displacement slide table a12 to move to the suction material taking position, the screw suction head 23 in the locking module is driven by the slide air cylinder 17 to move downward, and the material is sucked and taken, wherein the screw automatic feeder 24 is used to realize automatic screw feeding; then the locking module is driven by the linear precise displacement slide table a12 and the slide air cylinder 17 to move to the locking working position, the electric screwdriver 21 is driven by the locking air cylinder 18 to lock the screw on the star sensor assembly, and the CMOS circuit board 1 is locked three times; the assembly is driven by the linear precise displacement slide table d41 to exit to the unloading position, the rotary air cylinder 38 and the guide rod air cylinder 36 are loosened, the operator takes the material, and the assembly is completed.

[0038] If the accuracy requirement is not met, the part loading, the assembly of the adjusting shim 2, the assembly of the CMOS circuit board 1, the compression of the CMOS circuit board 1 and the adjusting shim 2, the parallelism detection process of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor support 3 need to be repeated after the grinding process of the adjusting shim 2 is completed. If the accuracy requirement is still not met after the detection, the adjustment amount is calculated, the part is discharged for regrinding, and the whole assembly and adjustment process is completed until the detection result meets the installation inclination range requirement, and the CMOS circuit board 1 is locked.

[0039] The application is an automatic assembly and adjustment method for a star sensor CMOS circuit board target surface of a spacecraft. The application is not limited to the automatic assembly of star sensor parts, and the adaptability of the method can be enhanced by modifying part of the assembly and adjustment process. The assembly and adjustment of other specifications of parts can still use the assembly and adjustment method.

Claims

1. A star sensor CMOS circuit board target surface automatic alignment method, characterized in that, The adopted assembling and adjusting equipment is composed of a feeding module, a measuring module, an assembling and adjusting module and a tool locking module, wherein the bottoms of the three modules are installed on the optical platform (4) from left to right as the measuring module, the tool locking module and the feeding module, and the assembling and adjusting module is horizontally arranged above the equipment in a gantry structure for realizing the automatic locking function of the parts; The measuring module is composed of a three-axis precision displacement slide table (5), a measuring head support a (6), a combined laser displacement measuring head (7), a measuring head support b (8), a measuring assembly support (9) and an industrial camera a (10); the measuring head support a (6) and the measuring head support b (8) are installed at the bottom of one side of the measuring assembly support (9), the industrial camera a (10) is installed at the other side of the measuring assembly support (9), the measuring assembly support (9) is installed on the Z-axis of the three-axis precision displacement slide table (5), the three-axis precision displacement slide table (5) is installed at the bottom of the optical platform (4), the combined laser displacement measuring head (7) is locked by the measuring head support a (6) and the measuring head support b (8) in front and back, wherein the combined laser displacement measuring head (7) is composed of three small split-beam interferometer displacement meters installed on a combined clamp and arranged in an equilateral triangle shape; after the combined laser displacement measuring head (7) is assembled on the CMOS circuit board (1), the parallelism measurement function of the target surface of the CMOS circuit board (1) and the reference surface under the star sensor support (3) is realized; when the CMOS circuit board (1) is assembled, the industrial camera a (10) realizes the parallelism measurement function of the pixel point rectangular target surface edge line on the CMOS circuit board (1) and the reference surface edge line of the star sensor support (3); the three-axis precision displacement slide table (5) has three-dimensional linear motion capability, and realizes the function of adjusting different measurement positions of the combined laser displacement measuring head (7) and the industrial camera a (10); The tool locking module is composed of a bearing with seat (33), a rotating shaft support (34), a rotating shaft (35), a guide rod cylinder (36), a clamp assembly base (37), a corner cylinder (38), a reflector (39), a V-shaped block (40), a linear precision displacement slide table d (41), a precision rotary table b (42) and a tool locking assembly support (43). The tool locking assembly support (43) is in U-shaped structure, the middle part of which is provided with the reflector (39), one end side of which is provided with the bearing with seat (33), and the other end side of which is provided with the precision rotary table b (42), and the bottom of which is installed on the linear precision displacement slide table d (41), and the bottom of the linear precision displacement slide table d (41) is installed on the optical platform (4). The clamp assembly base (37) is in L-shaped structure, one end of which is provided with the rotating shaft support (34), one end of the rotating shaft (35) passes through the opening of the rotating shaft support (34) and is locked and fixed, and the other end of the rotating shaft (35) passes through the bearing with seat (33) and is fixed. The other end of the clamp assembly base (37) is installed on the rotary table surface of the precision rotary table b (42). The guide rod cylinder (36) is installed at one end of the clamp assembly base (37), the corner cylinder (38) is vertically installed in the middle part of the clamp assembly base (37), and the V-shaped block (40) is installed on the other end side of the clamp assembly base (37). The reflector (39) realizes the function that the industrial camera a (10) observes the pixel point rectangular target surface on the CMOS circuit board (1) and the reference surface of the star sensor support (3) from the side from bottom to top. The clamp assembly base (37), the rotating shaft support (34), the rotating shaft (35), the bearing with seat (33), the precision rotary table b (42) and the V-shaped block (40) constitute a swing-like rotating structure, under the driving of the precision rotary table b (42), the clamp assembly base (37) and the star sensor support (3) parts thereon and the rotating shaft support (34), the rotating shaft (35), the guide rod cylinder (36), the corner cylinder (38) and the V-shaped block (40) rotate around the rotating shaft of the precision rotary table b (42), and the functions of adjusting the CMOS circuit board (1), adjusting the gasket (2) and adjusting the attitude of the star sensor support (3) part are realized during assembly and measurement. The V-shaped block (40) is adapted to the outer contour design of the star sensor support (3) and realizes the positioning function in the positioning and clamping of the star sensor support (3). The top rod of the guide rod cylinder (36) moves in the opening direction of the V-shaped block (40) and realizes the clamping function in the positioning and clamping of the star sensor support (3). The corner cylinder (38) rotates 90° around its rotating shaft and is locked, and realizes the locking function of the CMOS circuit board (1) after the CMOS circuit board (1) is adjusted and assembled. The linear precision displacement slide table d (41) moves in a single direction and realizes the functions of adjusting the working position of the parts thereon and assembling adjustment. The assembly and adjustment module is composed of a profile support (11), a linear precision displacement slide table a (12), a slide table support (16), an assembly and adjustment module and a locking module. The slide table support (16) is in U-shaped structure, and the two ends thereof are respectively provided with the assembly and adjustment module and the locking module, and the middle part thereof is installed on the linear precision displacement slide table a (12). The bottom of the linear precision displacement slide table a (12) is installed on the profile support (11), and the bottom of the profile support (11) is installed on the optical platform (4). The assembly and adjustment module is composed of an industrial camera b (13), an assembly and adjustment component support (14), a linear precision displacement slide table b (15), a precision rotary table a (26), a cylindrical force sensor (27) and a part suction head (28). The top of the part suction head (28) is installed on the bottom of the cylindrical force sensor (27), the top of the cylindrical force sensor (27) is installed on the rotary table surface at the bottom of the precision rotary table a (26), the top of the precision rotary table a (26) is installed on the mounting surface at the bottom of the assembly and adjustment component support (14), the industrial camera b (13) is installed on the assembly and adjustment component support (14), the side surface of the assembly and adjustment component support (14) is installed on the table surface of the linear precision displacement slide table b (15), and the linear precision displacement slide table b (15) is installed on the side surface of the slide table support (16). The locking module is composed of a slide table cylinder (17), a locking cylinder (18), a locking component base (19), a linear guide rail (20), an electric screwdriver (21), an electric screwdriver support (22) and a screw suction head (23). The electric screwdriver (21) is installed on the electric screwdriver support (22), the electric screwdriver support (22) is in L-shaped structure, the side surface thereof is installed on the linear guide rail (20), the bottom of the linear guide rail (20) is installed on the locking component base (19), the locking component base (19) is in L-shaped structure, the side surface thereof is installed on the table surface of the slide table cylinder (17), the bottom of the slide table cylinder (17) is installed on the side surface of the slide table support (16), the locking cylinder (18) is fixedly installed on the locking component base (19), the top rod thereof is connected with the electric screwdriver support (22), and the screw suction head (23) is installed on the bottom of the locking component base (19). The linear precision displacement slide table a (12), the linear precision displacement slide table b (15) and the linear precision displacement slide table d (41) are combined to form a three-dimensional movement structure for part picking and assembling. The linear precision displacement slide table a (12), the slide table cylinder (17) and the linear precision displacement slide table d (41) are combined to form a three-dimensional movement structure for screw suction and part locking. The precision rotary table a (26) drives the part suction head (28) to rotate around the rotation shaft, so as to realize the function of adjusting the parallelism between the pixel point rectangular target surface side line of the CMOS circuit board (1) and the reference surface side line of the star sensor support (3). The industrial camera b (13) realizes the function of position recognition of the part to be assembled.The cylindrical force sensor (27) feeds back the contact force between the part suction head (28) and the part in real time during the assembly process, which avoids insufficient contact leading to part picking failure and avoids excessive contact force damaging the part and the equipment; the locking module realizes the screw suction and part locking functions, wherein the locking cylinder (18) realizes the function of driving the electric screwdriver support (22) and the electric screwdriver (21) thereon to reciprocate up and down for locking, the linear guide rail (20) realizes the guiding function of the electric screwdriver support (22) and the electric screwdriver (21) thereon reciprocating up and down, and the screw suction head (23) realizes the screw suction and feeding function provided by the screw feeder (24). The feeding module is composed of a screw feeder (24), a screw feeder base (25), a tray (29), a pressing block (30), a linear precision displacement slide table c (31) and a feeding assembly base (32); the bottom of the screw feeder (24) is installed on the screw feeder base (25), and the bottom of the screw feeder base (25) is installed on the optical platform (4); the bottom of the tray (29) is installed on the linear precision displacement slide table c (31), the bottom of the linear precision displacement slide table c (31) is installed on the feeding assembly base (32), and the bottom of the feeding assembly base (32) is installed on the optical platform (4); the pressing block (30) is placed on the fixed area of the tray; the screw feeder (24) realizes the feeding function of the screw; the tray (29) is adapted to the CMOS circuit board (1), the adjustment pad (2) and the hole position on the pressing block (30), is designed with a boss-shaped limiting structure, so that the three adjustment pads (2) placed on the tray (29) are directly distributed in a triangular shape, so that the adjustment pad (2) and the pressing block (30) placed on the plane of the tray (29) are limited by the limiting structure and do not produce excessive rotation, facilitating the adsorption and picking of the part adsorption head (28); the bottom of the pressing block (30) is coated with a buffer material, after the CMOS circuit board (1) is installed, the pressing block (30) is picked up by the assembly and adjustment module and is press-fitted on the CMOS circuit board (1), and then the corner cylinder (38) is pressed tightly against the pressing block (30), so as to avoid damaging the part by directly pressing the corner cylinder (38) against the CMOS circuit board (1), and since the CMOS circuit board (1) and the star sensor support (3) need to be finally screwed, an opening structure is designed corresponding to the screw hole position on the CMOS circuit board (1) after the pressing block (30) is pressed against the CMOS circuit board (1), so as to ensure that the screwing is not affected under the pressing state; The automatic assembly and adjustment method of the star sensor CMOS circuit board target surface is divided into three processes, namely, an assembly process, an inspection process and a locking process, with the parallelism detection process as the dividing point, and the specific steps are as follows: First step, part feeding: before assembly, the star sensor support (3) is positioned on the V-shaped block (40) of the tool locking module by manual operation, and the star sensor support (3) is clamped in the V-shaped block (40) by the push rod of the guide rod cylinder (36); then the pressing block (30), the CMOS circuit board (1) to be assembled and the adjustment pad (2) are placed on the tray (29) with a limiting structure, and the feeding is completed; wherein the tray (29) corresponds to the hole positions on the CMOS circuit board (1), the adjustment pad (2) and the pressing block (30), and is designed with a boss-shaped limiting structure, so that the three adjustment pads (2) placed on the tray (29) are directly distributed in a triangular shape, so that the adjustment pad (2) and the pressing block (30) placed on the plane of the tray (29) are limited by the limiting structure and do not produce excessive rotation, facilitating the adsorption and picking of the part adsorption head (28); Second step, adjust the gasket (2) assembly: after the feeding is completed, adjust the gasket (2) assembly; The assembly is driven by the linear precision displacement slide a (12) to move to the adjustment gasket (2) suction pickup work position, assisted by the industrial camera b (13), the combination of linear precision displacement slide a (12) and linear precision displacement slide c (31) forms two-dimensional plane motion, adjusts the relative position between the part suction head (28) and the adjustment gasket (2), adjusts the relative attitude between the part suction head (28) and the adjustment gasket (2) by the precision turntable a (26), aligns, drives the part suction head (28) downward by the linear precision displacement slide b (15), and the adjustment gasket (2) is adsorbed and taken, after the material is taken successfully, the part suction head (28) drives the adjustment gasket (2) on it to move upward, and the adjustment gasket (2) is taken; When the part suction head (28) and the adjustment gasket (2) contact and take material, the mutual contact force is fed back in real time by the cylindrical force sensor (27), the contact force is guaranteed, and the parts and equipment are not damaged; The positions of the three adjustment gaskets (2) are limited by the triangularly distributed boss-shaped structure on the tray (29) during feeding, so that the part suction head (28) can pick up three adjustment gaskets (2) at a time; After the material is taken, the assembly is driven by the linear precision displacement slide a (12) to move to the adjustment gasket (2) assembly adjustment work position, assisted by the industrial camera b (13), the combination of linear precision displacement slide a (12) and linear precision displacement slide d (41) forms two-dimensional plane motion, adjusts the relative position between the part suction head (28) and the adjustment gasket (2) on the star sensor support (3), adjusts the relative attitude between the part suction head (28) and the adjustment gasket (2) on the star sensor support (3) by the precision turntable a (26), aligns, drives the part suction head (28) to move downward, and the adjustment gasket (2) is assembled on the assembly hole of the star sensor support (3), after the assembly is completed, the part suction head (28) is driven upward by the linear precision displacement slide b (15) to restore the initial position, and the adjustment gasket (2) assembly is completed; When the adjustment gasket (2) on the part suction head (28) and the assembly hole of the star sensor support (3) are assembled, the mutual contact force is fed back in real time by the cylindrical force sensor (27), the contact force is guaranteed, and the parts and equipment are not damaged; Third step, CMOS circuit board (1) assembly: after the adjustment of the gasket (2) assembly is completed, the CMOS circuit board (1) assembly is carried out; the adjustment module is driven by the linear precision displacement slide a (12) to move to the CMOS circuit board (1) adsorption picking work position, and is observed by the industrial camera b (13) to assist in the combination of the linear precision displacement slide a (12) and the linear precision displacement slide c (31) to form two-dimensional plane movement, the relative position between the part adsorption head (28) and the CMOS circuit board (1) is adjusted, the relative attitude between the part adsorption head (28) and the CMOS circuit board (1) is adjusted by the precision turntable a (26), after alignment, the part adsorption head (28) is driven downward by the linear precision displacement slide b (15) to adsorb and pick the CMOS circuit board (1), after successful picking, the part adsorption head (28) and the CMOS circuit board (1) thereon are driven upward by the linear precision displacement slide b (15), and the CMOS circuit board (1) picking is completed; wherein, the mutual contact force when the part adsorption head (28) contacts with the CMOS circuit board (1) for picking is fed back in real time by the cylindrical force sensor (27), the contact force is ensured, and the parts and the equipment are not damaged; after the picking is completed, the adjustment module is driven by the linear precision displacement slide a (12) to move to the CMOS circuit board (1) assembly adjustment work position, and is observed by the industrial camera a (10) and the industrial camera b (13) to assist in the combination of the linear precision displacement slide a (12) and the linear precision displacement slide d (41) to form two-dimensional plane movement, the relative position between the CMOS circuit board (1) adsorbed on the part adsorption head (28) and the assembly hole position on the star sensor support (3) is adjusted, and the parallelism of the pixel point rectangular target surface edge of the CMOS circuit board (1) adsorbed on the part adsorption head (28) and the reference surface edge of the star sensor support (3) is adjusted by the precision turntable a (26); wherein, the industrial camera a (10) is on the side, observes the pixel point rectangular target surface edge of the CMOS circuit board (1) and the reference surface edge of the star sensor support (3) from bottom to top through the reflector (39), assists the precision turntable a (26) to adjust the attitude of the edge parallelism, the industrial camera b (13) is on the top, observes the assembly hole position on the star sensor support (3) from top to bottom, and assists the linear precision displacement slide a (12) and the linear precision displacement slide d (41) to adjust the position between the CMOS circuit board (1) and the star sensor support (3); after the position and attitude adjustment is completed, the CMOS circuit board (1) adsorbed on the part adsorption head (28) is driven downward by the linear precision displacement slide b (15), the CMOS circuit board (1) is stacked on the adjustment gasket (2), after the assembly is completed, the part adsorption head (28) is driven upward by the linear precision displacement slide b (15) to restore the initial position, and the CMOS circuit board (1) assembly is completed;The mutual contact force between the CMOS circuit board (1) adsorbed on the part adsorption head (28) and the adjusting gasket (2) during assembly is fed back in real time by the cylindrical force sensor (27), so that the contact force is ensured and the parts and equipment are not damaged. Fourth step, CMOS circuit board (1) and adjusting gasket (2) compression: CMOS circuit board (1) assembly is completed, need by the corner cylinder (38) compression fixed, for protection parts not to be damaged, adopt the pressing block (30) as the intermediate buffer parts; Adjusting module moves to the pressing block (30) adsorption pickup work position under the drive of linear precision displacement slide table a (12), under the assistance of industrial camera b (13), by linear precision displacement slide table a (12) and linear precision displacement slide table c (31) combination forms two-dimensional plane motion, adjusts the relative position between the parts adsorption head (28) and the pressing block (30), by precision turntable a (26) adjusts the relative attitude between the parts adsorption head (28) and the pressing block (30), aligns, by linear precision displacement slide table b (15) drive parts adsorption head (28) downward movement, adsorbs the pressing block (30) and takes the material, after taking the material successfully, by linear precision displacement slide table b (15) drive parts adsorption head (28) drives the pressing block (30) on it upward movement, completes the pressing block (30) taking material; Wherein, the mutual contact force when the parts adsorption head (28) and the pressing block (30) contact taking material, by the cylindrical force sensor (27) real-time feedback, guarantee contact force, do not damage the parts and equipment; After taking the material, adjusting module moves to the pressing block (30) assembly adjustment work position under the drive of linear precision displacement slide table a (12), under the assistance of industrial camera b (13), by linear precision displacement slide table a (12) and linear precision displacement slide table d (41) combination forms two-dimensional plane motion, adjusts the relative position between the pressing block (30) adsorbed on the parts adsorption head (28) and the CMOS circuit board (1), by precision turntable a (26) adjusts the relative attitude between the pressing block (30) adsorbed on the parts adsorption head (28) and the CMOS circuit board (1), aligns, by linear precision displacement slide table b (15) drive the pressing block (30) adsorbed on the parts adsorption head (28) downward movement, stacks the pressing block (30) on the CMOS circuit board (1), after assembly is completed, by linear precision displacement slide table b (15) drive parts adsorption head (28) upward movement recovers the initial position, completes the pressing block (30) assembly; Wherein, the mutual contact force when the pressing block (30) adsorbed on the parts adsorption head (28) and the CMOS circuit board (1) stack, by the cylindrical force sensor (27) real-time feedback, guarantee contact force, do not damage the parts and equipment; After the pressing block (30) assembly is completed, the corner cylinder (38) rotates 90 ° and then presses, its pressure rod directly acts on the pressing block (30), the pressing block (30) is compressed on the CMOS circuit board (1), indirectly compresses the CMOS circuit board (1) on the adjusting gasket (2), again indirectly compresses the adjusting gasket (2) on the star sensor support (3), completes the compression of all parts; Wherein, the lower surface of the pressing block (30) is coated with buffer material, so that the compression force is evenly distributed on the back of the CMOS circuit board (1), avoiding damaging the CMOS circuit board (1); Thus for assembly process; In the fifth step, the parallelism between the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) is detected. After the CMOS circuit board (1) and the adjusting shims (2) are pressed against the star sensor support (3), the parallelism between the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) is measured. The tool locking module is driven by the linear precision displacement slide table d (41) to move to the parallelism detection working position of the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3). The attitude of the V-shaped block (40), the CMOS circuit board (1), the adjusting shims (2), and the star sensor support (3) assembly clamped by the corner cylinder (38) is adjusted by the precision rotary table b (42), so that the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) face the combined laser displacement measuring head (7). The combined laser displacement measuring head (7) is driven by the three-axis precision displacement slide table (5) to move, and the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) are measured respectively. The data is transmitted to the industrial computer, and the parallelism between the two planes is calculated. After the parallelism detection of the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) is completed, the attitude of the V-shaped block (40), the CMOS circuit board (1), the adjusting shims (2), and the star sensor support (3) assembly clamped by the corner cylinder (38) is adjusted by the precision rotary table b (42), so that the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) return to the vertical downward state. If the parallelism detection of the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) is qualified, the screw locking process is performed. If the parallelism detection of the target surface of the CMOS circuit board (1) and the reference surface of the star sensor support (3) is not qualified, the adjustment amount of the three adjusting shims (2) is calculated and recorded and fed back to the operator. The pressing block (30), the CMOS circuit board (1), and the adjusting shims (2) are unloaded by the assembly and adjustment module. The specific steps are opposite to the assembly process steps. The operator takes away the adjusting shims (2) for grinding and processing, and then reassembles and measures after processing. At this stage, the assembly process stops, and the device can continue to measure the parallelism of another group of new parts. Thus, the inspection process is completed. The sixth step, if the accuracy requirement is met, the CMOS circuit board (1) locking: the CMOS circuit board (1) target surface and the star sensor support (3) reference surface parallelism detection qualified, the CMOS circuit board (1) locking is carried out; The tool locking module is driven by the linear precision displacement slide table d (41) to move to the CMOS circuit board (1) locking working position, the locking module is driven by the linear precision displacement slide table a (12) to move to the adsorption material taking position on the screw feeder (24), the screw adsorption head (23) in the locking module is driven by the slide cylinder (17) to move downward, the screw is adsorbed and taken, after successful taking, the screw adsorption head (23) and the screw adsorbed thereon are driven by the slide cylinder (17) to move upward, the screw adsorption and taking are completed; Wherein, the position of the screw adsorbed and picked up each time is fixed, the screw discharge port of the screw feeder (24) has been adjusted in advance, the locking module is driven by the linear precision displacement slide table a (12) to move to the same position each time to adsorb and take, without visual positioning feedback; After the screw adsorption and taking are completed, the locking module is driven by the linear precision displacement slide table a (12) to move to the CMOS circuit board (1) locking working position, under the assistance of the industrial camera b (13), the linear precision displacement slide table a (12) and the linear precision displacement slide table d (41) are combined to form two-dimensional plane motion, the relative position between the screw adsorption head (23) in the locking module and the assembly hole position on the star sensor support (3) is adjusted, after alignment, the screw adsorption head (23) and the screw adsorbed thereon are driven by the slide cylinder (17) to move downward, the electric screwdriver support (22) and the electric screwdriver (21) installed thereon are pushed by the top rod of the locking cylinder (18) to move downward under the guidance of the linear guide rail (20), the screw is pushed out of the screw adsorption head (23), the CMOS circuit board (1) and the adjusting pad (2) are locked on the star sensor support (3), and the picking and locking of the remaining two screws are completed in turn, the CMOS circuit board (1) locking is completed, finally, the modules of the equipment are reset, the locked CMOS circuit board (1), adjusting pad (2) and star sensor support (3) assembly are taken down by the operator, and the assembly is completed. If the accuracy requirement is not met, after the adjusting pad (2) is ground and processed, the part feeding, adjusting pad (2) assembly, CMOS circuit board (1) assembly, CMOS circuit board (1) and adjusting pad (2) pressing, CMOS circuit board (1) target surface and star sensor support (3) reference surface parallelism detection process are repeated, after detection, if the accuracy requirement is still not met, the adjustment amount is calculated, the material is discharged for regrinding and processing, until the detection result meets the installation inclination range requirement, the CMOS circuit board (1) locking is carried out, and the whole assembly process is completed; Thus, the locking process is completed.

Images