Heat sink device and heat sink system

Abstract

A heat dissipation device is provided for supplying liquid to a heat source (S1). The heat dissipation device includes a liquid distribution chamber (11) and a heat dissipation chamber (12) connected by a plurality of jet holes (14h). The liquid distribution chamber (11) forms an inlet (10a) for the liquid. The heat source (S1) is at least partially contained within the heat dissipation chamber (12). The liquid distribution chamber (11) includes at least two sub-cavities. The liquid flows sequentially through each of the sub-cavities before entering the heat dissipation chamber (12). In the flow path of the liquid, adjacent sub-cavities are connected by a plurality of liquid distribution holes (11h). This application also provides a heat dissipation system.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment, and more specifically to a heat dissipation device and a heat dissipation system. Background Technology

[0002] Taking chips as an example, especially for chips in highly integrated electronic devices that use a large number of small electronic components, their power consumption density is very high.

[0003] There are two main methods for cooling chips: air cooling and liquid cooling. Air cooling has a simple structure and high reliability, but its heat dissipation capacity is limited and cannot meet the heat dissipation requirements of high-power and high-heat-flux-density components. Liquid cooling generally uses a flow channel cold plate as a heat exchange device. Ordinary flow channel cold plates need to be connected to the chip by a thermal interface material. The heat dissipation capacity of the flow channel cold plate is limited by the heat transfer performance of the thermal interface material. Therefore, for chips with high heat flux density and high power consumption, ordinary flow channel cold plates cannot provide efficient heat dissipation.

[0004] Therefore, how to adopt an efficient heat dissipation solution to avoid high or overheating in local areas of chips (or electronic devices) in order to improve the relevant performance and reliability of the devices is an urgent problem to be solved in this field. Summary of the Invention

[0005] In view of this, this application provides a heat dissipation device and a heat dissipation system.

[0006] In a first aspect, embodiments of this application provide a heat dissipation device.

[0007] In a first possible implementation of the first aspect, the heat dissipation device is used to supply liquid to a heat source, and includes a liquid distribution chamber and a heat dissipation chamber connected by a plurality of jet holes, the liquid distribution chamber forming a liquid inlet, and the heat source being at least partially contained within the heat dissipation chamber.

[0008] The liquid separation chamber includes at least two sub-cavities. Liquid flows through each sub-cavity in sequence before entering the heat dissipation chamber.

[0009] Along the flow path of the liquid, two adjacent sub-cavities are connected by multiple dispensing holes.

[0010] The progressively arranged sub-cavities within the liquid distribution chamber guide and distribute the liquid during the flow process. For example, the liquid in a later sub-cavity flows at a similar speed to the liquid in a previous sub-cavity, resulting in uniform flow and good heat dissipation after the liquid enters the heat dissipation chamber.

[0011] According to the first possible implementation of the first aspect, in the second possible implementation of the heat dissipation device, a plurality of tubular jet columns communicating with jet holes are provided in the heat dissipation cavity, and the jet columns extend from the jet holes toward the heat source.

[0012] The jet column guides the liquid to the vicinity of the heat source. After the liquid flows out of the jet column, it forms a jet impact, which is equivalent to reducing the distance between the liquid in the free impact state and the heat source, reducing the velocity loss of the liquid during the flow process, and ensuring the effect of the jet impact.

[0013] According to any of the above possible implementations of the first aspect, in a third possible implementation of the heat dissipation device, the liquid distribution chamber includes at least three sub-cavities.

[0014] In the flow path of a liquid, the opening area of ​​the upstream distributor is larger than that of the downstream distributor.

[0015] The opening area (orifice diameter) of the upstream distribution orifice is larger than that of the downstream distribution orifice, which makes it less likely for the liquid to become blocked during the flow process, ensuring smooth flow.

[0016] According to any possible implementation of the first aspect, in a fourth possible implementation of the heat dissipation device, the axis of at least one upstream liquid distribution hole does not coincide with the axes of all downstream liquid distribution holes.

[0017] The multiple liquid distribution holes located upstream are at least partially staggered from the multiple liquid distribution holes located downstream, which improves the liquid distribution capability of the liquid distribution holes and makes the liquid flow more uniformly during the flow process.

[0018] According to any possible implementation of the first aspect, in a fifth possible implementation of the heat dissipation device, the opening area of ​​the liquid distribution hole is larger than the opening area of ​​the jet hole.

[0019] The opening area (orifice diameter) of the liquid separator is larger than that of the jet orifice, which makes it less likely for the liquid to become clogged during flow, ensuring smooth flow.

[0020] According to the fifth possible implementation of the first aspect, in the sixth possible implementation of the heat dissipation device, the opening area of ​​the liquid distribution hole is more than three times the opening area of ​​the jet hole.

[0021] Compared to the jet orifice, the liquid distribution orifice has a large opening area (orifice diameter), which ensures that the liquid has a large pressure when it flows into the jet orifice, or in other words, the liquid does not experience a large pressure drop during the flow of the liquid distribution chamber, thus ensuring the subsequent jetting effect.

[0022] According to the fifth or sixth possible implementation of the first aspect, in the seventh possible implementation of the heat dissipation device, at least two of the multiple jet holes have different opening areas.

[0023] Differentiated settings of the opening area (orifice diameter) of the jet orifice enable the delivery of liquids with different jet velocities in different areas, thereby providing stronger jet impact to key cooling areas of the heat source as needed.

[0024] According to the second possible implementation of the first aspect, in the eighth possible implementation of the heat dissipation device, the cross-sectional area of ​​the internal through hole of the jet column is equal to the cross-sectional area of ​​the jet hole.

[0025] The cross-sectional area (inner diameter) of the jet column and the jet orifice are equal, which makes the pressure drop during the flow of liquid in the jet column very small. In other words, increasing the length of the jet column has little impact on the system pressure drop of the heat dissipation device and does not easily cause additional loss of liquid pumping power.

[0026] According to the second or eighth possible implementation of the first aspect, in the ninth possible implementation of the heat dissipation device, the peripheral wall of the heat dissipation cavity is formed with multiple outlets for liquid to flow out of the heat dissipation cavity.

[0027] The jet column has a guide section formed on the outer periphery at least near the end of the heat source, and the guide section has a surface that can guide the liquid to the direction of the outlet.

[0028] The surface structure of the guide section can guide the liquid to the outlet, avoiding flow blockage and / or unstable flow of the liquid in the heat dissipation cavity, so that the liquid in the heat dissipation device flows smoothly and the cooling effect is good.

[0029] According to the ninth possible implementation of the first aspect, in the tenth possible implementation of the heat dissipation device, multiple jet columns are connected to each other to form a jet layer, and an opening is formed between adjacent jet columns that penetrates the jet layer and is connected to the outlet.

[0030] The jet layer structure formed by interconnected jet columns has high strength, is easy to manufacture, and is not easily damaged.

[0031] According to the tenth possible implementation of the first aspect, in the eleventh possible implementation of the heat dissipation device, the heat dissipation device includes a jet baffle for separating the liquid distribution chamber and the heat dissipation chamber, and jet holes penetrate the jet baffle in the thickness direction of the jet baffle.

[0032] The jet layer is welded to the jet baffle, or

[0033] The jet layer and the jet baffle are integrated into one unit.

[0034] The connection between the jet layer and the jet baffle is simple and flexible; they can be welded or manufactured as a single piece.

[0035] According to the ninth possible implementation of the first aspect, in the twelfth possible implementation of the heat dissipation device, the inlet is connected to multiple outlets.

[0036] The interconnected inlet and outlet enable continuous circulation of the liquid within the heat dissipation device.

[0037] According to any possible implementation of the first aspect, in a thirteenth possible implementation of the heat dissipation device, the heat dissipation cavity includes a sidewall that surrounds the outer periphery of the heat source and does not contact the heat source.

[0038] The heat dissipation cavity includes a side cavity located between the heat source and the side wall.

[0039] When the liquid flows into the side cavity, it can come into contact with the outer peripheral surface of the heat source, resulting in a large contact area between the heat source and the liquid and a good heat dissipation effect.

[0040] According to the thirteen possible implementations of the first aspect, in the fourteenth possible implementation of the heat dissipation device, the heat dissipation device is used to dissipate heat from an electronic device including a heat source, the electronic device further including a base, and the heat source being disposed on a surface of the base.

[0041] The sidewalls are used to abut against a surface of the base.

[0042] The heat dissipation device also includes a sealing ring, which is sleeved on the outer periphery of the heat source and embedded in the inner periphery of the side wall, with one end face of the sealing ring abutting against a surface of the base.

[0043] The sealing ring forms a seal between the heat source and the sidewall, and the sealing ring abuts against a surface of the base, making the sealing structure more robust.

[0044] According to any possible implementation of the first aspect, in the fifteenth possible implementation of the heat dissipation device, the liquid distribution chamber is located above the heat dissipation chamber, and the lower part of the heat dissipation chamber is used to set the heat source.

[0045] The vertical arrangement of the liquid separation chamber and the heat dissipation chamber allows the liquid to flow within the heat dissipation device not only to be powered by the pump but also to utilize its own gravity, resulting in a good jet impact effect.

[0046] According to any possible implementation of the first aspect, in the sixteenth possible implementation of the heat dissipation device, the heat source includes a chip.

[0047] The heat dissipation device according to this application can provide efficient heat dissipation for chips with high power density, and avoid high temperature or overheating in local areas of the chip.

[0048] Secondly, embodiments of this application provide a heat dissipation system.

[0049] In a first possible implementation of the second aspect, the heat dissipation system includes a pump, a reservoir, and at least one heat dissipation device according to any possible implementation of the first aspect of this application.

[0050] The pump is used to pump the liquid in the storage tank to the heat dissipation device and pump the liquid flowing out of the heat dissipation device back to the storage tank.

[0051] The liquid in the cooling system can circulate internally under the drive of the pump, and a cooling system can provide heat dissipation for one or more devices, or one or more heat sources of the devices.

[0052] According to the first possible implementation of the second aspect, in the second possible implementation of the heat dissipation system, the heat dissipation system further includes a cooler and a preheater.

[0053] The cooler is located downstream of the heat dissipation device and upstream of the liquid storage tank. The cooler is used to cool the flowing liquid.

[0054] The preheater is located downstream of the liquid storage tank and upstream of the heat dissipation device. The preheater is used to heat the flowing liquid to a predetermined temperature.

[0055] The cooler facilitates the cooling of overheated liquid flowing through the heat dissipation device in the system, while the preheater heats the liquid that is about to flow into the heat dissipation device to a suitable temperature, so that factors such as the density, viscosity, pressure difference and flow rate of the liquid reach the optimal state under temperature control, thereby improving the heat exchange performance of the system. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of the state of a liquid jet impacting the surface being impacted.

[0057] Figure 2 and Figure 3 These are schematic diagrams of two possible implementations of the heat dissipation system according to this application;

[0058] Figure 4 and Figure 5 These are schematic diagrams of two possible embodiments of the heat dissipation device according to this application.

[0059] Explanation of reference numerals in the attached figures:

[0060] j is the jet orifice; f is the impacted surface; s is the stagnation zone;

[0061] S0 base; S1 heat source;

[0062] 10. Heat dissipation device; 10a. Inlet; 10b. Outlet; 10c. Upper wall; 10d. Side wall;

[0063] 11. Dispensing chamber; 11a. Primary sub-chamber; 11b. Secondary sub-chamber; 11c. Tertiary sub-chamber; 11h. Dispensing orifice; 11p. Dispensing baffle;

[0064] 12. Heat dissipation cavity; 121. Jet cavity; 122. Return cavity; 123. Side cavity;

[0065] 13 Jet baffle; 14 Jet layer; 14h Jet orifice; 140 Jet column; 141 Main body; 142 Guide section; 143 Outer periphery; 144 Opening; 15 Sealing ring;

[0066] 20 Pump; 30 Liquid storage tank; 40 Refrigerator; 50 Preheater; 60 Flow meter; 71 Shut-off valve; 72 Flow valve; 73 Side valve; 80 Filter; 90 Visual inspection lens; p Pressure protector. Detailed Implementation

[0067] Exemplary embodiments of this application are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are for teaching those skilled in the art how to implement this application only, and are not intended to exhaustively describe all possible methods of this application, nor to limit the scope of this application.

[0068] Unless otherwise specified, the heat dissipation system and heat dissipation device according to this application will be described below using the vertical relationship shown in the figures. It should be understood that the vertical relationship of the components in the device is relative, and the vertical position of each component will change accordingly depending on the usage state of the device.

[0069] It should be understood that in the specification and claims, "and / or" means at least one of the connected objects, and the character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0070] Taking a chip as an example, the heat dissipation device and system according to this application are described. However, it should be understood that the heat dissipation device of this application is not limited to heat dissipation for chips.

[0071] Microchannel heat sinks (also known as microchannel heat exchangers) are a promising and highly efficient heat dissipation device. Microchannel heat sinks have a large specific surface area, compact structure, small temperature difference during heat transfer, and high heat transfer efficiency, making them suitable for applications such as heat dissipation devices for semiconductor chips.

[0072] However, the liquid experiences significant temperature rise and pressure drop as it flows within the microchannels, causing the heat dissipation capacity of the microchannel heat sink to gradually decrease in the flow direction, resulting in a gradual increase in the temperature of the chip's heat source. This temperature non-uniformity within the chip leads to a series of reliability issues, such as material thermal stress and deformation.

[0073] Based on microchannel heat sinks, the heat dissipation device provided by jet liquid cooling technology (also known as jet cooling technology) is another promising high-efficiency heat dissipation device.

[0074] This type of heat dissipation device (hereinafter also referred to as a jet device) allows liquid (also called working fluid) to pass through micro-holes or slits under a certain pressure difference, and then impacts the chip surface in the form of a high-speed jet of liquid. For example... Figure 1 As shown, in the stagnation region s of the impacted surface f directly opposite the jet orifice j, the boundary layer in this region is thin and the local heat transfer coefficient is large. Typically, the cooling effect can be improved by aligning the stagnation region s with a region of high heat flux density.

[0075] However, on the one hand, the heat transfer performance of impingement jets is affected by many parameters, such as impingement jet velocity, nozzle shape, nozzle array arrangement, nozzle diameter, distance between nozzle and chip surface, nozzle angle relative to chip and nozzle spacing, making it difficult to control the heat transfer performance; on the other hand, due to the relatively complex structure of microchannels, the friction resistance of the working fluid flow is large, which will significantly increase the pump power loss of the system and increase the risk of system blockage.

[0076] To improve the cooling effect of the jet device, one possible method is to reduce the distance between the jet orifice j and the impacted surface f (or the height of the jet cavity), for example, by setting the distance to less than 0.5 mm.

[0077] At the same inlet flow rate, reducing the height of the jet cavity improves the jet cooling effect, but it also significantly increases the overall pressure drop of the jet cavity. In practical applications, the pressure drop of the jet cavity needs to be constrained (e.g., less than 30 kPa); the increased pressure drop will lead to a decrease in the working fluid flow rate, which in turn reduces the heat dissipation effect. Furthermore, a smaller jet cavity height results in a smaller distance between the inlet and outlet, leading to a higher inlet liquid temperature and further affecting the jet cooling effect.

[0078] The applicant made this application considering several factors, including those mentioned above. The heat dissipation device according to this application is installed in a heat dissipation system that provides a circulating flow path, and the heat dissipation device can provide a heat source with a coolant (hereinafter also referred to as liquid) with a uniform flow rate and sufficient volume.

[0079] Figure 2 A heat dissipation system according to one embodiment of this application is shown. It includes a heat dissipation device 10 and a piping system that provides external liquid circulation to the heat dissipation device 10.

[0080] The piping system includes a pump 20 and a liquid storage tank 30. Optionally, the piping system also includes a cooler 40, a preheater 50, a flow meter 60, a shut-off valve 71, a flow valve 72, a bypass valve 73, a filter 80, a sight glass 90, and a pressure protector p.

[0081] In this embodiment, there are two flow meters 60, which are respectively installed upstream and downstream of the heat dissipation device 10 to accurately measure the liquid flow rate and provide a basis for controlling the liquid flow rate in the heat dissipation device 10.

[0082] The cooler 40 is positioned near the outlet of the heat dissipation device 10 to cool the liquid flowing through the heat dissipation device 10 that has absorbed heat from the heat source S1. The preheater 50 is positioned near the inlet of the heat dissipation device 10 to stabilize the liquid in the system at a suitable temperature.

[0083] Specifically, following the direction of liquid flow, the components in the heat dissipation system are connected in series as follows: liquid storage tank 30, pump 20, shut-off valve 71, preheater 50, filter 80, flow meter 60, sight glass 90, flow valve 72, pressure protector p, heat dissipation device 10, flow meter 60, and cooler 40.

[0084] The liquid storage tank 30 is used to hold a certain amount of coolant.

[0085] The liquid storage tank 30 is connected to the pump 20 downstream, and the pump 20 pumps the liquid to the downstream heat dissipation device 10 at a certain pressure.

[0086] Pump 20 is connected downstream to shut-off valve 71. When the cooling system 10 is operating normally, shut-off valve 71 is open, allowing liquid to flow through it. When liquid circulation needs to be interrupted, such as during maintenance of the cooling system, shut-off valve 71 is closed.

[0087] The shut-off valve 71 is connected downstream to the preheater 50. The preheater 50 is used to heat the liquid to a suitable temperature, such as 40°C. This is because, after the cooler 40 in the piping system cools the liquid, a liquid at too low a temperature may not necessarily have optimal heat exchange performance. The temperature of the liquid affects its density, viscosity, pressure, and flow rate; a liquid at a suitable temperature allows the liquid flowing through the heat dissipation device 10 to have higher heat exchange performance.

[0088] The preheater 50 is connected downstream to the filter 80. The filter 80 filters out impurities in the liquid, preventing blockage of the piping system or a reduction in the liquid's flow properties.

[0089] Filter 80 is connected downstream to flow meter 60. Flow meter 60 is used to measure the flow rate of liquid to be flowed into heat dissipation device 10.

[0090] The flow meter 60 is connected downstream to the eyepiece 90. The eyepiece 90 has a transparent observation area to facilitate observation of the liquid's state, such as whether the liquid is flowing or whether there are impurities in the liquid.

[0091] The eyepiece 90 is connected downstream to the flow valve 72. The flow valve 72 is used to regulate the liquid flow rate in the pipeline based on the reading of the flow meter 60.

[0092] A pressure protector p is provided between the flow valve 72 and the inlet of the heat dissipation device 10, for example, to release pressure to protect the components in the system in the event of system pressure overload.

[0093] The outlet of the heat dissipation device 10 is connected to another flow meter 60, which is connected downstream to the cooler 40. The cooler 40 is connected downstream to the inlet of the liquid storage tank 30, forming a complete system loop.

[0094] Downstream of pump 20, there is a branch line that allows liquid to flow back to storage tank 30. This branch line is equipped with a side valve 73, which is used to adjust the flow rate of liquid in the system when needed.

[0095] It should be understood that the connection order of the components in the above-mentioned piping system is not unique. In other possible implementations, the connection order of some components can be interchanged. In addition, some components can be omitted.

[0096] In addition, refer to Figure 3 A heat dissipation system may also include multiple heat dissipation devices 10, or multiple heat dissipation devices 10 may share a single external piping system. Optionally, these multiple heat dissipation devices 10 may be connected together in parallel.

[0097] Next, refer to Figure 4 and Figure 5 The heat dissipation device 10 according to this application is described.

[0098] (First embodiment of the heat dissipation device)

[0099] Reference Figure 4 First, we will introduce the first embodiment of the heat dissipation device.

[0100] The heat dissipation device 10 is formed in the shape of a cover, having an upper wall 10c and a side wall 10d. The side wall 10d surrounds the outer periphery of the upper wall 10c in a ring shape. Optionally, the side wall 10d and the upper wall 10c can be two connected parts, or they can be formed as one piece.

[0101] The side wall 10d has an opening at one end opposite to the upper wall 10c, which is used to allow the heat source S1 of the heat-dissipating component to extend into, or in other words, the shroud-shaped heat dissipation device 10 covers the heat source S1 inside.

[0102] In this embodiment, the heat source S1 is a chip. The heat source S1 is disposed on the base S0 (e.g., the substrate of the chip). The sidewall 10d abuts against the surface of the base S0, and a sealing structure is formed between the sidewall 10d and the base S0.

[0103] It should be understood that the heat source S1 can also be other electronic devices and their components, which are different from the chip.

[0104] Optionally, the heat dissipation device 10 further includes a sealing ring 15 between the outer periphery of the heat source S1 and the inner periphery of the sidewall 10d. The lower bottom surface of the sealing ring 15 abuts against the surface of the base S0 to ensure a seal between the sidewall 10d and the base S0.

[0105] The heat dissipation device 10 has a jet baffle 13 in its inner cavity, which divides the inner cavity into a liquid distribution chamber 11 and a heat dissipation chamber 12 located on both sides of the jet baffle 13. A plurality of jet holes 14h are formed in the jet baffle 13, which connect the liquid distribution chamber 11 and the heat dissipation chamber 12, so that liquid can enter the heat dissipation chamber 12 from the liquid distribution chamber 11.

[0106] The liquid distribution chamber 11 has an inlet 10a, which can also be referred to as a liquid inlet or a liquid inlet for a heat dissipation device. Optionally, the inlet 10a is located at the top of the liquid distribution chamber 11 (for example, formed on the upper wall 10c in this embodiment). Liquid from the external piping system enters the liquid distribution chamber 11 through the inlet 10a. The liquid distribution chamber 11 can regulate the flow of liquid, allowing the liquid to pass through the jet orifice 14h at a certain pressure and flow rate.

[0107] Liquid passing through the jet orifice 14h flows into the heat dissipation chamber 12 and impacts the surface of the heat source S1 in a jet manner, carrying away the heat from the heat source S1. The peripheral wall of the heat dissipation chamber 12 has one or more outlets 10b surrounding the chamber, through which liquid can flow out of the heat dissipation chamber 12 to enter the external piping system for the next cycle. These outlets 10b can also be referred to as liquid outlets or liquid outlets of the heat dissipation device.

[0108] In this embodiment, the liquid distribution chamber 11 includes a primary sub-chamber 11a and a secondary sub-chamber 11b. These two sub-chambers are separated by a liquid distribution baffle 11p. The outer periphery of the liquid distribution baffle 11p is connected to the sidewall 10d, and a plurality of liquid distribution holes 11h are formed within the liquid distribution baffle 11p, which connect the primary sub-chamber 11a and the secondary sub-chamber 11b. Optionally, the liquid distribution baffle 11p is positioned directly opposite the inlet 10a, or in other words, the axis of the liquid distribution holes 11h is parallel to the axis of the inlet 10a. Optionally, the plurality of liquid distribution holes 11h are evenly distributed on the liquid distribution baffle 11p.

[0109] It should be understood that although the descriptions of holes or openings above or below use terms such as axis and aperture, this application does not limit the shape of various holes and openings, and these holes and openings do not necessarily have to be cylindrical as a whole. When the cross-section of a hole or opening is not circular, the aperture size is used to express the size of the hole or opening, that is, the area of ​​the region surrounded by the hole or opening; for the sake of convenience, the area of ​​the region surrounded by the hole or opening will also be replaced by the aperture or opening area below.

[0110] In the flow direction, the liquid will flow sequentially through inlet 10a, primary sub-cavity 11a, dispensing orifice 11h and secondary sub-cavity 11b. Figure 4 The dashed arrows in the diagram schematically illustrate the flow method of liquid within the heat dissipation device 10.

[0111] The liquid distribution hole 11h guides and distributes the liquid, making the liquid flowing into the secondary sub-cavity 11b flow more evenly than the liquid in the primary sub-cavity 11a. This, in turn, makes the liquid flowing into the heat dissipation cavity 12 flow more evenly, thus enabling the liquid to achieve better heat dissipation during the jet impact on the heat source S1.

[0112] Optionally, the shroud-shaped heat dissipation device 10 is arranged with its opening (on the side where the heat source S1 is located) facing downwards; optionally, the liquid distribution chamber 11 is located above the heat dissipation chamber 12; optionally, the primary sub-chamber 11a is located above the secondary sub-chamber 11b; optionally, the inlet 10a is located above the outlet 10b. This arrangement allows the liquid to flow within the heat dissipation device not only by the pressure provided by the pump but also by its own gravity, resulting in a good jet impact effect.

[0113] It should be understood that the orientation of the heat dissipation device 10 can be changed accordingly depending on the different structures and arrangements of the heat source S1. For example, referring to... Figure 4 When the base S0 is vertically mounted, the heat dissipation device 10 can be used as follows: Figure 4 The structure is rotated 90° and arranged with the opening facing horizontally. In addition, the specific positions of each cavity inside the heat dissipation device 10, as well as the inlet 10a and outlet 10b, can be adjusted according to the actual application scenario.

[0114] Optionally, to prevent a significant pressure drop in the liquid within the heat dissipation device 10 before it enters the heat dissipation chamber 12, the diameter (or opening area or cross-sectional area) of the distributing orifice 11h is much larger than that of the jet orifice 14h. For example, the diameter (or opening area or cross-sectional area) of the distributing orifice 11h is more than three times that of the jet orifice 14h. This ensures that the liquid within the distributing chamber 11 experiences balanced flow regulation without excessive flow velocity loss due to significant obstruction, thus guaranteeing the subsequent jet impact effect.

[0115] Optionally, a jet layer 14 is also formed within the heat dissipation cavity 12. The jet layer 14 includes a plurality of jet columns 140 arranged in an array, each jet column 140 being aligned with a jet hole 14h.

[0116] The jet column 140 is a hollow tube, with one end connected to the surface of the jet baffle 13, allowing the internal channel of the jet column 140 to communicate with the jet orifice 14h. The other end extends to the vicinity of the heat source S1, thereby generating a liquid column impacted by the jet in a region very close to the heat source S1. For example, the distance between the liquid outlet of the jet column 140 (i.e., the other end mentioned above) and the heat source S1 is no more than 1 mm. Optionally, the distance between the liquid outlet of the jet column 140 and the heat source S1 is 0.35 to 0.7 mm.

[0117] Optionally, the orifice diameter of the internal channel of the jet column 140 is equal to that of the jet orifice 14h, and the two orifices are perfectly aligned. This results in a very small pressure drop during the flow of liquid within the jet orifice 14h and the jet column 140; and even if the length of the jet column 140 is increased, the impact on the system pressure drop of the heat dissipation device 10 is minimal, and it is unlikely to cause additional loss of liquid pumping power. Since the outlet 10b is located near the liquid outlet of the jet column 140 in the direction of liquid flow, the length occupied by the jet column 140 also serves to increase the distance between the inlet 10a and the outlet 10b, thus minimizing interference between the liquids near the inlet 10a and the outlet 10b.

[0118] Optionally, the apertures of the jet holes 14h (and the jet column 140 connected to the jet holes 14h) at different locations are not exactly the same, so as to adjust the flow rate of the liquid column impacted by the jet in different regions, thereby adjusting and controlling the heat dissipation capacity of the heat dissipation device 10 to different regions of the heat source S1. For example, in the region of the heat source S1 where the heat generation is more severe (also known as the hot spot region), the jet hole 14h directly opposite this region is set to a structure with a corresponding jet intensity of greater intensity.

[0119] Optionally, the axis of the jet column 140 may not be perpendicular to the surface of the heat source S1, thereby enabling the jet column 140 to adjust the flow direction of the liquid and accurately guide the liquid to the hot spot area.

[0120] In addition to the columnar body 141, the jet column 140 may optionally include a guide section 142. The guide section 142 is located in the outer peripheral region of the body 141 near the end of the heat source S1. The surface of the guide section 142 is formed into a generally conical shape, and the generatrix of the cone extends approximately toward the location of the outlet 10b in the direction away from the heat source S1, thereby guiding the liquid that has completed the jet impact to the outlet 10b, avoiding flow blockage and / or flow instability of the liquid in the heat dissipation cavity 12, and ensuring smooth liquid flow in the heat dissipation device 10.

[0121] Optionally, the jet layer 14 further includes a connecting structure connecting adjacent jet columns 140, and the jet layer 14 also forms an opening 144 between adjacent jet columns 140. The opening 144 connects the liquid outlet and the outlet 10b of the jet column 140. The heat dissipation cavity 12 forms a return cavity 122 in the cavity near the outlet 10b of the opening 144. After the liquid ejected from the jet column 140 impacts the heat source S1, it flows through the opening 144 into the return cavity 122, and then flows out of the heat dissipation device 10 through the outlet 10b.

[0122] Optionally, the outer periphery 143 of the jet layer 14 is connected to the sidewall 10d to stabilize the structure of the jet layer 14. Optionally, the jet layer 14 may be welded to the sidewall 10d and / or the jet baffle 13; or at least two of the jet layer 14, the jet baffle 13, and the sidewall 10d may be integrally formed.

[0123] Optionally, the sidewall 10d does not contact the heat source S1, and the space between the sidewall 10d and the heat source S1 is formed as a side cavity 123. The side cavity 123 surrounds the outer periphery of the heat source S1, allowing liquid to flow to the outer peripheral wall of the heat source S1 and cool the outer peripheral wall of the heat source S1 in direct contact.

[0124] It is understandable that the number of heat sources or chips within a heat dissipation device is not limited to one. A heat dissipation device can contain multiple heat sources or chips, or multiple different types of heat sources.

[0125] (Second embodiment of the heat dissipation device)

[0126] Reference Figure 5 This section introduces a second embodiment of the heat dissipation device. The second embodiment is a variation of the first embodiment. For features that are the same as or similar to those in the first embodiment, the same reference numerals are used in this embodiment, and detailed descriptions of these features are omitted.

[0127] In this embodiment, the liquid distribution chamber 11 has three sub-cavities, namely a primary sub-cavity 11a, a secondary sub-cavity 11b, and a tertiary sub-cavity 11c connected in series in the direction of liquid flow. The primary sub-cavity 11a and the secondary sub-cavity 11b are separated by a liquid distribution baffle 11p (hereinafter also referred to as the upstream liquid distribution baffle), and a plurality of liquid distribution holes 11h (hereinafter also referred to as upstream liquid distribution holes) are formed in the upstream liquid distribution baffle, which connects the primary sub-cavity 11a and the secondary sub-cavity 11b. The secondary sub-cavity 11b and the tertiary sub-cavity 11c are separated by another liquid distribution baffle 11p (hereinafter also referred to as the downstream liquid distribution baffle), and a plurality of liquid distribution holes 11h (hereinafter also referred to as downstream liquid distribution holes) are formed in the downstream liquid distribution baffle, which connects the secondary sub-cavity 11b and the tertiary sub-cavity 11c.

[0128] Optionally, the diameter of the upstream distribution orifice is larger than that of the downstream distribution orifice. Optionally, the number of downstream distribution orifices is greater than the number of upstream distribution orifices. This ensures that the pressure change is stable as the liquid flows through the distribution orifices, resulting in smooth liquid flow and reducing the likelihood of blockage.

[0129] Optionally, the upstream and downstream distribution orifices are at least partially offset, or in other words, the axis of at least one of the multiple upstream distribution orifices does not coincide with the axes of all the downstream distribution orifices. This offset arrangement improves the guiding and distributing capability of the multi-stage distribution orifices, making the liquid flow more uniform.

[0130] It should be understood that this application does not limit the number of sub-cavities within the liquid separation chamber. The number of sub-cavities can be increased depending on the size of the heat dissipation device and different heat dissipation requirements.

[0131] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipating device for supplying a liquid to a heat source (S1), characterized in that, the heat dissipating device comprises a distribution chamber (11) and a heat dissipating chamber (12) communicated by a plurality of jet holes (14h), the distribution chamber (11) is formed with an inlet (10a) of the liquid, the heat source (S1) is at least partially accommodated in the heat dissipating chamber (12), the distribution chamber (11) comprises at least three sub-chambers, the liquid flows through each of the sub-chambers in sequence and then enters the heat dissipating chamber (12), on the flow path of the liquid, only a plurality of distribution holes (11h) are communicated between two adjacent sub-chambers, the opening area of the distribution hole (11h) located upstream is larger than that of the distribution hole (11h) located downstream.

2. The heat dissipating device according to claim 1, wherein A plurality of tubular jet columns (140) are arranged in the heat dissipating chamber (12) and communicated with the jet holes (14h), the jet columns (140) extend from the jet holes (14h) towards the heat source (S1).

3. The heat dissipating device according to claim 1 or 2, characterized in that, The axis of at least one distribution hole (11h) located upstream does not coincide with the axis of all the distribution holes (11h) located downstream.

4. The heat dissipating device according to claim 1 or 2, wherein The opening area of the distribution hole (11h) is larger than the opening area of the jet hole (14h).

5. The heat dissipating device of claim 4, wherein The opening area of the distribution hole (11h) is more than 3 times the opening area of the jet hole (14h).

6. The heat dissipating device of claim 4, wherein The opening areas of at least two of the plurality of jet holes (14h) are different.

7. The heat dissipating device of claim 2, wherein The cross-sectional area of the internal through hole of the jet column (140) is equal to the cross-sectional area of the jet hole (14h).

8. The heat dissipating device according to claim 2 or 7, wherein The peripheral wall of the heat dissipating chamber (12) is formed with a plurality of outlets (10b) for the liquid to flow out of the heat dissipating chamber (12), The outer periphery of at least the end portion of the jet column (140) close to the heat source (S1) is formed with a flow guide portion (142), the flow guide portion (142) has a surface capable of guiding the liquid to the direction where the outlet (10b) is located.

9. The heat dissipating device of claim 8, wherein, A plurality of the jet columns (140) are connected to each other and form a jet layer (14), and an opening (144) is formed between adjacent jet columns (140), the opening (144) penetrates the jet layer (14) and is communicated with the outlet (10b).

10. The heat dissipating device of claim 9, wherein, The heat dissipating device comprises a jet partition plate (13) for spacing the distribution chamber (11) and the heat dissipating chamber (12), the jet holes (14h) penetrate the jet partition plate (13) in the thickness direction of the jet partition plate (13), The jet layer (14) is welded to the jet partition plate (13), or The jet layer (14) and the jet partition plate (13) are formed in one piece.

11. The heat dissipating device of claim 8, wherein, The inlet (10a) is communicated with the plurality of outlets (10b).

12. The heat dissipating device according to claim 1 or 2, wherein The heat dissipating chamber (12) comprises a side wall (10d) surrounding the outer periphery of the heat source (S1), the side wall (10d) is not in contact with the heat source (S1), The heat dissipating chamber (12) comprises a side edge chamber (123) located between the heat source (S1) and the side wall (10d).

13. The heat dissipating device of claim 12, wherein, The heat dissipation device is used for dissipating heat of an electronic device comprising the heat source (S1), the electronic device further comprising a base (S0), the heat source (S1) being arranged on one surface of the base (S0), The side wall (10d) is used for abutting to the one surface of the base (S0), The heat dissipation device further comprises a sealing ring (15), the sealing ring (15) being sleeved on the outer periphery of the heat source (S1), and the sealing ring (15) being embedded in the inner periphery of the side wall (10d), one end surface of the sealing ring (15) abutting to the one surface of the base (S0).

14. The heat dissipating device according to claim 1 or 2, wherein The distribution cavity (11) is located above the heat dissipation cavity (12), and the lower part of the heat dissipation cavity (12) is used for arranging the heat source (S1).

15. The heat dissipating device according to claim 1 or 2, wherein The heat source (S1) comprises a chip.

16. A heat dissipation system characterized by, The heat dissipation system comprises a pump (20), a liquid storage tank (30) and at least one heat dissipation device according to any one of claims 1 to 15, The pump (20) is used for pumping the liquid in the liquid storage tank (30) to the heat dissipation device, and pumping the liquid flowing out of the heat dissipation device back to the liquid storage tank (30).

17. The heat dissipation system of claim 16, wherein, The heat dissipation system further comprises a refrigeration device (40) and a preheater (50), The refrigeration device (40) is arranged downstream of the heat dissipation device and upstream of the liquid storage tank (30), and is used for cooling the liquid flowing therethrough, The preheater (50) is arranged downstream of the liquid storage tank (30) and upstream of the heat dissipation device, and is used for heating the liquid flowing therethrough to a predetermined temperature.

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