An intelligent gateway with heat dissipation function

Abstract

This application relates to an intelligent gateway with heat dissipation capabilities, belonging to the technical field of FTTR equipment. The gateway comprises a P-type semiconductor disposed on a splitter housing, a heat sink disposed outside the splitter housing, and an N-type semiconductor disposed on the heat sink. The N-type semiconductor and the P-type semiconductor are each connected to a power source. A heat storage tank is fixedly connected to one side of the heat sink, and a heat storage disk is rotatably disposed within the heat storage tank. The heat storage tank is provided with a heat dissipation hole that communicates with the heat sink. The heat storage disk is embedded and fixed along its circumference with a number of heat storage balls for storing heat storage material; the heat storage material is a phase change material. A heat collection tank is fixedly connected to the heat storage tank. An N-type semiconductor is fixedly connected to the heat collection tank, electrically connected to the P-type semiconductor. The heat storage tank is provided with a heat dissipation hole that communicates with the heat collection tank. A humidity box is fixedly connected to the side wall of the heat storage tank, for storing hygroscopic material that absorbs water and releases heat. This application improves the heat dissipation efficiency of the splitter.

Description

Technical Field

[0001] The present application relates to the technical field of FTTR equipment, and in particular to an intelligent gateway with a heat dissipation function. Background Art

[0002] FTTR equipment is a gateway device consisting of a master optical modem, slave optical modems, and an optical splitter. The master, slave optical modems, and splitter are connected by optical fiber. Slave optical modems are typically installed indoors; the optical splitter distributes the downlink signal from the master optical modem to multiple slave optical modems, or combines the uplink signals from multiple slave optical modems onto the master optical modem. Some businesses, due to site conditions or fiber optic lines, need to install the splitter outdoors when installing FTTR equipment.

[0003] Optical splitters are typically housed in sealed enclosures to isolate them from external heat and moisture. However, in summer, outdoor temperatures can reach 25-40°C, necessitating heat dissipation from the optical splitter to prevent damage to the optical fiber. Summer is also prone to heavy rain and sudden drops in temperature, which can cause the relative humidity inside the optical splitter to reach saturation and form water droplets on the walls of the splitter enclosure. Therefore, a desiccator must be installed inside the optical splitter enclosure to keep the optical fiber dry.

[0004] Semiconductor cooling involves the absorption and release of heat when direct current flows through a circuit formed by a thermocouple pair of P-type and N-type semiconductors. Semiconductor cooling can be applied to optical splitters to provide a low-temperature environment. However, since optical splitters are located outdoors, the heat release end of the semiconductor cooling system cannot quickly dissipate heat, causing the heat to remain around the splitter, resulting in low heat dissipation efficiency. Summary of the Invention

[0005] In order to improve the problem that the heat dissipation end cannot quickly dissipate heat when applying semiconductor refrigeration and splitters, the present application provides an intelligent gateway with heat dissipation function.

[0006] The present application provides a smart gateway with heat dissipation function using the following technical solutions:

[0007] A smart gateway with a heat dissipation function includes a P-type semiconductor arranged on a splitter box body, a heat dissipation box arranged outside the splitter box body, and an N-type semiconductor arranged on the heat dissipation box; the N-type semiconductor and the P-type semiconductor are respectively connected to a power supply, a heat storage box is fixedly connected to one side of the heat dissipation box, and a heat storage disk is rotatably arranged in the heat storage box; a heat dissipation hole that can be connected to the heat dissipation box is opened on the heat storage box, and a plurality of heat storage balls for storing heat storage material are embedded and fixed along the circumference of the heat storage disk; the heat storage material is a phase change material.

[0008] Optionally, a heat collecting box is fixedly connected to the heat storage box; a second N-type semiconductor is fixedly connected to the heat collecting box, and the second N-type semiconductor is electrically connected to the P-type semiconductor; and a second heat dissipation hole that can be connected to the heat collecting box is opened on the heat storage box.

[0009] Optionally, a humidity box for storing hygroscopic material is fixedly connected to the side wall of the heat storage box, and the hygroscopic material absorbs water and releases heat.

[0010] Optionally, a dehumidification box connected to the spectrometer box body is fixedly connected to the spectrometer box body, a rotatable dehumidification disk is provided in the dehumidification box, and a plurality of dehumidification holes are evenly distributed along the circumference of the dehumidification disk; a mesh bag for placing a desiccant is provided in the dehumidification hole; a cover for sealing is fixed to the side of the dehumidification box close to the spectrometer box body; a heat dissipation hole three is provided on the side of the dehumidification box close to the heat storage box, so that the heat collection box is connected to the dehumidification box.

[0011] Optionally, a micro motor for driving the heat storage disk to rotate is provided on the inner wall of the heat storage box, and the output shaft of the micro motor is fixedly connected to the heat storage disk; a telescopic tube is fixedly connected to the side wall of the heat storage disk close to the dehumidification disk; the telescopic tube includes a tube body and a tube shaft slidably arranged in the tube body; a tension spring is fixedly provided in the tube body, and the end of the tension spring is fixedly connected to the tube shaft, for driving the tube shaft to reset within the tube body; a socket that can be plugged into the tube shaft is provided on the dehumidification disk; a reserved hole for the tube shaft to be passed through is provided on the dehumidification box; an electromagnet is fixed in the reserved hole, and a magnetic ring that can be attracted by the electromagnet is rotatably connected to the outer circumference of the tube shaft.

[0012] 20. The water discharging opening of claim 19, wherein the water discharging opening is located adjacent to the lid of the water tank, wherein the lid has a bottom portion for receiving the water discharging opening, and the bottom portion for receiving the water discharging opening is connected to the lid of the water tank.

[0013] Optionally, a switch slot is provided on the inner top surface of the water level box; a sliding piece is provided in the switch slot for vertical sliding; a switch 1 is provided on the connection circuit between the N-type semiconductor 1 and the P-type semiconductor, and the switch 1 includes a stator 1 and a movable piece 1 that can be electrically connected; a switch 2 is provided on the connection circuit between the N-type semiconductor 2 and the P-type semiconductor, and the switch 2 includes a stator 2 and a movable piece 2 that can be electrically connected; a guide piece is fixed on the side wall of the sliding piece, and a guide groove that can be vertically slidably connected to the guide piece is provided on the inner side wall of the switch slot; the movable piece 1 is fixed to the bottom surface of the guide piece, and the movable piece 2 is fixed to the top surface of the guide piece; the stator 1 is fixed to the bottom surface of the guide groove, and the stator 2 is fixed to the top surface of the guide groove.

[0014] Optionally, a second chute connected to the first chute is provided at the bottom of the water level box; a pressure plate is provided in the second chute and slides circumferentially along the water level box; the bottom end of the pressure plate can contact the pressure block, and the contact surfaces of the pressure plate and the pressure block are respectively provided with inclined surfaces; a magnet is fixed on the top of the second chute; a second magnet that can be magnetically attracted to the first magnet is fixed on the side wall of the floating block; a connecting hole one connected to the water level box is provided at the top of the second chute, and the pressure plate is provided with a connecting hole two along its own thickness direction.

[0015] In summary, this application includes at least one of the following beneficial technical effects:

[0016] 1. This application uses semiconductor cooling to provide heat dissipation for the optical splitter. To quickly dissipate the heat released by the N-type plate conductor, this application uses a heat storage material. The heat storage material absorbs the heat released by the semiconductor during phase change, improving heat dissipation efficiency.

[0017] 2. The heat storage material of this application absorbs heat and, by lowering the ambient temperature of the heat storage material, achieves the purpose of causing the heat storage material to undergo a phase change and release heat. At the same time, it continues to utilize the principle that semiconductors can continue to cool down when there is a temperature difference in the environment in which they are located, thereby reducing power consumption.

[0018] 3. This application utilizes the principle that some hygroscopic materials react with water to form crystals and absorb heat. In rainy weather, the hygroscopic materials react with water to absorb heat, promoting the phase change of the heat storage material and releasing heat. At the same time, the heat released by the heat storage material is used for the thermal regeneration of the desiccant, ensuring that the desiccant can be recycled. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural diagram of the heat dissipation system, dehumidification system, and heat storage unit of an embodiment of the present application.

[0020] Figure 2 It is a structural diagram of the rainwater collection box according to an embodiment of the present application.

[0021] Figure 3 It is a cross-sectional view of the heat storage tank according to an embodiment of the present application.

[0022] Figure 4 It is a cross-sectional view of the dehumidification box according to an embodiment of the present application.

[0023] Figure 5 It is a cross-sectional view of the rainwater collection box according to an embodiment of the present application.

[0024] Figure 6 yes Figure 5 Enlarged schematic diagram of point A in the middle.

[0025] Figure 1: Spectrometer box; 11: P-type semiconductor; 12: Tube; 13: Tube axis; 14: Tension spring; 15: Jack; 16: Reserved hole; 17: Electromagnet; 18: Magnetic ring; 2: Heat dissipation system; 21: Heat dissipation box; 22: N-type semiconductor 1; 3: Dehumidification system; 31: N-type semiconductor 2; 4: Heat storage unit; 41: Heat storage box; 42: Heat storage plate; 43: Heat dissipation hole 1; 44: Heat storage ball; 5: Dehumidification box; 51: Humidity box; 52: Cover plate; 53: Dehumidification plate; 54: Dehumidification hole; 55: Mesh bag; 6: Heat collection box; 61: Heat dissipation hole 2; 62: Heat dissipation hole 3; 63: Heat dissipation unit Heat hole four; 7. Rainwater collection box; 71. Collection box; 72. Slide; 73. Water inlet; 74. Float; 75. Waterproof ring; 8. Switch slot; 81. Stator one; 82. Moving plate one; 83. Stator two; 84. Moving plate two; 85. Guide plate; 86. Guide slot; 9. Water level box; 91. Slide one; 92. Slide two; 93. Pressure block; 94. Spring one; 95. Pressure plate; 96. Inclined surface; 97. Magnet one; 98. Connecting hole two; 99. Connecting hole one; 10. Valve plate; 101. Valve slot; 102. Water outlet hole one; 103. Water outlet hole two; 104. Water outlet pipe one; 105. Water outlet pipe two. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1-6 This application is described in further detail.

[0027] The embodiment of the present application discloses an intelligent gateway with heat dissipation function. Figure 1 and Figure 2The heat dissipation gateway includes a heat dissipation system 2 for reducing the temperature within the splitter housing 1 and a dehumidification system 3 for reducing the humidity within the splitter housing 1. It also includes a heat storage unit 4 for storing heat released by the heat dissipation system 2. The heat dissipation system 2 includes a P-type semiconductor 11 disposed within the splitter housing 1 and an N-type semiconductor 22 disposed outside the splitter housing 1. The P-type semiconductor 11 absorbs heat within the splitter housing 1, while the N-type semiconductor 22 releases heat to the outside. The heat released by the N-type semiconductor 22 is collected by the heat storage unit 4. The dehumidification system 3 includes a dehumidification box 5 connected to the splitter housing 1 and an N-type semiconductor 31 disposed outside the splitter housing 1. A desiccant is provided in the dehumidification box 5 for absorbing moisture in the spectrometer box 1; the N-type semiconductor 2 31 is connected to the P-type semiconductor 11; when the heat storage unit 4 releases heat to the outside, a temperature difference is generated between the N-type semiconductor 2 31 and the P-type semiconductor 11, triggering the heat absorption effect of the P-type semiconductor 11; the heat released by the heat storage unit 4 is also used to regenerate the desiccant.

[0028] Reference Figure 1 The heat dissipation system 2 specifically includes a P-type semiconductor 11 disposed on the spectrometer box 1, a heat sink 21 disposed outside the spectrometer box 1, and an N-type semiconductor 22 disposed on the heat sink 21. The P-type semiconductor 11 is embedded in the side wall of the spectrometer box 1, so that the cold end of the P-type semiconductor 11 is located inside the spectrometer box 1, and the hot end is located outside the spectrometer box 1. The N-type semiconductor 22 is embedded in the side wall of the heat sink 21, so that the hot end of the N-type semiconductor 22 is located inside the heat sink 21, and the cold end is located outside the heat sink 21. The hot end of the N-type semiconductor 22 and the cold end of the P-type semiconductor 11 are respectively connected to a power source; and a switch 1 is provided on the connection circuit between the N-type semiconductor 22 and the P-type semiconductor 11.

[0029] After the circuit between the N-type semiconductor 22 and the P-type semiconductor 11 is connected, under the action of the power supply, current flows from the hot end of the N-type semiconductor 22 to the cold end of the P-type semiconductor 11. The cold end of the P-type semiconductor 11 absorbs the heat of the spectrometer box, and the hot end of the N-type semiconductor 22 releases heat.

[0030] Reference Figure 3The heat storage unit 4 specifically comprises a heat storage box 41 connected to the heat dissipation box 21 and a heat storage tray 42 rotatably disposed within the heat storage box 41. The heat storage box 41 is provided with a heat dissipation hole 43 that communicates with the heat dissipation box 21, facilitating heat exchange with the N-type semiconductor 22. Both the heat storage box 41 and the heat storage tray 42 have circular cross-sections. Several heat storage balls 44 are embedded and fixed along the circumference of the heat storage tray 42. The heat storage balls 44 are hollow spheres that store heat storage material. The heat storage balls 44 are made of heat-conducting material. When the heat storage balls 44 rotate to the heat dissipation hole 43, the heat storage material absorbs heat released by the N-type semiconductor 22 and undergoes a phase change, thereby dissipating heat from the N-type semiconductor 22. The heat storage box 41 and the heat storage tray 42 are made of insulating material to reduce the impact of external temperature on the heat storage material. This also reduces the impact of phase change within each heat storage ball 44 on the heat storage material within adjacent balls 44. The side walls of the heat dissipation box 21 are provided with ventilation holes for dissipating excess heat that is not absorbed by the heat storage material.

[0031] In this embodiment, the heat storage material is pentaerythritol. Pentaerythritol has a phase transition temperature of 16-18°C. When pentaerythritol comes into contact with the exothermic N-type semiconductor 22, it absorbs heat and transforms from a crystalline state to a plastic crystalline state, dissipating heat from the hot end of the N-type semiconductor 22. When the pentaerythritol comes into contact with a heat sink, it transforms from a plastic crystalline state to a crystalline state, releasing heat. By sequentially contacting the N-type semiconductor 22 with multiple pentaerythritols, heat can be continuously dissipated from the N-type semiconductor 22.

[0032] Reference Figure 3 A micromotor is provided on the inner wall of heat storage box 41 to drive heat storage disk 42. The output shaft of the micromotor is coaxially fixedly connected to heat storage disk 42. The micromotor, which can be a stepping motor, is used to drive heat storage disk 42 to rotate a unit angle per unit time. This causes heat storage ball 44 to stop rotating when it reaches heat dissipation hole 1 43 and remain at heat dissipation hole 1 43 for a unit time, allowing the heat storage material to absorb heat released by N-type semiconductor 1 22 and undergo phase change.

[0033] Reference Figure 4 The dehumidification system 3 specifically includes a dehumidification box 5 fixedly connected to the spectrometer box body 1, a humidity box 51 fixedly connected to the heat storage box 41 and used to place water-absorbing material, and a rainwater collection box 7 fixedly connected to the heat storage box 41 and used to measure rainfall.

[0034] Reference Figure 4, the spectrometer box body 1 is fixed to the dehumidification box 5 in the direction away from the heat storage box 41, and the spectrometer box body 1 is connected to the dehumidification box 5. A rotatable dehumidification disk 53 is provided in the dehumidification box 5, and a number of dehumidification holes 54 are evenly distributed along the circumference of the dehumidification disk 53. A mesh bag 55 is provided in each dehumidification hole 54. The mesh bag 55 is used to place a desiccant. In this embodiment, the cross-section of the dehumidification box 5 is circular; the cross-section of the spectrometer box body 1 is semicircular, and the cover is provided on the dehumidification box 5 so that half of the area of ​​the dehumidification disk 53 is covered on the spectrometer box body 1. A semicircular cover plate 52 is fixed to the side of the dehumidification box 5 close to the spectrometer box body 1; the cover plate 52 cooperates with the spectrometer box body 1 to cover the entire circular surface of the dehumidification box 5. The side plane of the cover plate 52 is fixed to the outer wall of the spectrometer box body 1 to reduce the entry of water molecules into the dehumidification box 5.

[0035] In this embodiment, the desiccant is montmorillonite, which relies on its internal cations to adsorb water molecules. When the temperature is increased, the water molecules in the montmorillonite can be desorbed, and the montmorillonite can be regenerated through thermal regeneration to restore its water absorption capacity.

[0036] During sunny weather, the dehumidification tray 53 remains stationary, allowing the desiccant to dehumidify the spectrometer housing 1. During rainy weather, the dehumidification tray 53 rotates with the heat storage tray 42 to replace the desiccant, allowing the desiccant initially located in the area covered by the cover 52 to move into the area covered by the spectrometer housing 1. Both the dehumidification box 5 and the dehumidification tray 53 are constructed of insulating material to minimize the effects of ambient temperature on the spectrometer housing 1.

[0037] Reference Figure 4 The circular surface of the heat storage tank 41 is fixedly connected to the thermal collector tank 6. The thermal collector tank 6 is a cylindrical structure with two open ends. N-type semiconductor 2 31 is embedded in the wall of the thermal collector tank 6, with the hot end of N-type semiconductor 2 31 located inside the thermal collector tank 6 and the cold end located outside. The hot end of N-type semiconductor 2 31 is connected to the cold end of P-type semiconductor 11, and a switch 2 is provided in the circuit connecting N-type semiconductor 2 31 and P-type semiconductor 11. When a temperature difference occurs between the thermal collector tank 6 and the optical splitter housing 1, and the temperature of the thermal collector tank 6 is high, a current flows between N-type semiconductor 2 31 and P-type semiconductor 11 due to the temperature difference. Simultaneously, N-type semiconductor 2 31 releases heat while P-type semiconductor 11 absorbs heat.

[0038] Reference Figure 4The heat dissipation box 21 and the heat collecting box 6 are fixedly connected to the plane of the dehumidification box 5 away from the spectrometer box body 1 on the side away from the heat storage box 41. The heat storage box 41 is provided with a heat dissipation hole 2 61 that can be connected to the heat collecting box 6, so as to facilitate heat exchange with the N-type semiconductor 2 31. The heat dissipation box 21 and the heat collecting box 6 are symmetrically arranged along the radial line of the heat storage box 41, so that when one heat storage ball 44 on the heat storage disk 42 rotates to the position of the heat dissipation hole 1 43, the other heat storage ball 44 rotates to the position of the heat dissipation hole 2 61. When the heat storage ball 44 releases heat, a temperature difference will appear between the heat collecting box 6 and the spectrometer box body 1, and the N-type semiconductor 2 31 will release heat. The dehumidification box 5 is provided with a heat dissipation hole 3 62 on the circular plane close to the heat storage box 41, which is coaxial with the heat dissipation hole 2 61, so that the heat collecting box 6 is connected to the dehumidification box 5. When the dehumidification plate 53 stops rotating, the mesh bag 55 is positioned at the heat dissipation hole 3 62, allowing the desiccant in the mesh bag 55 to undergo thermal regeneration. The cover plate 52 includes a heat dissipation hole 4 63 coaxially positioned with the heat dissipation hole 3 62. When the dehumidification hole 54 rotates to the heat dissipation hole 4 63, air convection occurs on both sides of the dehumidification hole 54, dissipating excess heat released by the N-type semiconductor 2 31 and the heat storage material.

[0039] Reference Figure 2 The humidity box 51 is used to store hygroscopic materials. After absorbing moisture, the hygroscopic materials absorb heat and reduce the ambient temperature to below the phase change temperature of the heat storage material, thereby causing the heat storage material to undergo a phase change and release heat. The humidity box 51 is embedded in the side wall of the heat storage box 41 away from the dehumidification box 5, and the humidity box 51 is coaxial with the heat dissipation hole 3 62 and the heat dissipation hole 4 63. The side wall of the humidity box 51 away from the heat dissipation hole 3 62 is a closed side, and the side wall close to the heat dissipation hole 3 62 is an open side, which reduces the heat exchange between the hygroscopic material and the outside world when absorbing moisture. The side wall of the humidity box 51 close to the heat dissipation hole 3 62 is fixed with a heat transfer plate made of heat transfer material.

[0040] In this embodiment, the hygroscopic material is calcium chloride or magnesium chloride. When calcium chloride or magnesium chloride comes into contact with a small amount of water, it forms a crystalline hydrate, which absorbs ambient heat. When the crystalline pentaerythritol rotates to the position of heat dissipation hole 3 62 and encounters the heat-absorbing hygroscopic material, the temperature inside heat dissipation hole 3 62 drops below the phase transition temperature of the pentaerythritol. The pentaerythritol then transforms from a plastic crystalline state to a crystalline state, releasing heat. The heat released by the pentaerythritol creates a temperature difference between the N-type semiconductor 2 31 and the P-type semiconductor 11, causing the N-type semiconductor 2 31 to release heat while the P-type semiconductor 11 absorbs heat. Simultaneously, the heat released by the pentaerythritol and the N-type semiconductor 2 31 enters the heat dissipation hole 3 62, thermally regenerating the desiccant.

[0041] Reference Figure 3 and Figure 4A telescopic tube is fixedly connected to the side wall of the heat storage disk 42 near the dehumidification disk 53; the telescopic tube includes a tube body 12 and a tube shaft 13 slidably arranged in the tube body 12; in order to allow the tube shaft 13 to rotate with the tube body 12, the longitudinal sections of the tube shaft 13 and the tube body 12 can be square. A tension spring 14 is fixedly arranged in the tube body 12, and the end of the tension spring 14 is fixedly connected to the tube shaft 13, which is used to drive the tube shaft 13 to reset into the tube body 12. A socket 15 that can be plugged into the tube shaft 13 is opened at the center position of the dehumidification disk 53; in order for the tube shaft 13 to drive the dehumidification disk 53 to rotate, the socket 15 can be set as a square hole; a reserved hole 16 for the tube shaft 13 to pass through is opened on the wall of the heat storage box 41 and the dehumidification box 5.

[0042] Reference Figure 4 An electromagnet 17 is fixedly mounted within the reserved hole 16 of the dehumidifier box 5. This electromagnet 17 is connected in series with switch 2. When switch 2 is closed, electromagnet 17 is turned on. A magnetic ring 18 is rotatably connected to the outer surface of the tubular shaft 13, which can attract the electromagnet 17. An annular groove may be formed on the outer surface of the tubular shaft 13, allowing the magnetic ring 18 to rotate within the groove. When electromagnet 17 is energized to attract the magnetic ring 18, the tubular shaft 13 is plugged into the socket 15, causing the dehumidifier 53 to rotate along with the heat storage disc 42. When the electromagnetic ring 18 is de-energized, the tension spring 14 separates the tubular shaft 13 from the socket 15.

[0043] Reference Figure 5 The rainwater collection box 7 includes a fan-shaped collection box 71 and a water level box 9 fixed to the bottom of the collection box 71. The longitudinal section of the collection box 71 is arc-shaped, and the water level box 9 fits in with the arc surface of the bottom of the collection box 71. A water inlet 73 connected to the water level box 9 is provided on the bottom surface of the water level box 9; the collection box 71 is used to collect rainwater, and the water level of the water level box 9 rises with the water level in the collection box 71. A float 74 is provided in the water level box 9 to slide along its own circumference; the longitudinal section of the float 74 is arc-shaped, which is convenient for moving in the water level box 9 with the rise and fall of the water level. A switch slot 8 is provided on the inner top surface of the water level box 9. A slide 72 is provided in the switch slot 8 for vertical sliding. A waterproof ring 75 is fixed to the outer surface of the slide 72, and both the slide 72 and the waterproof ring 75 are made of waterproof material. After the slide 72 moves upward, the waterproof ring 75 can abut against the inner top surface of the water level box 9 to prevent the water level from rising and entering the switch slot 8.

[0044] Reference Figure 6Switch 1 includes stator 1 81 and rotor 1 82. When stator 1 81 and rotor 1 82 make electrical contact, N-type semiconductor 1 22 and P-type semiconductor 11 are electrically connected. Switch 2 includes stator 2 83 and rotor 2 84. When stator 2 83 and rotor 2 84 make electrical contact, N-type semiconductor 2 31 and P-type semiconductor 11 are electrically connected. Guide plates 85 are fixed to the sidewalls of slider 72, and guide grooves 86 are defined within the inner sidewalls of switch slot 8, allowing for vertical sliding engagement with guide plates 85. Rotating plate 1 82 is fixed to the bottom surface of guide plate 85, while rotating plate 2 84 is fixed to the top surface of guide plate 85. Stator 1 81 is fixed to the bottom surface of guide groove 86, while stator 2 83 is fixed to the top surface of guide groove 86. When the water level rises, float 74 contacts slider 72, causing it to rise, closing switch 2 and opening switch 1. When the water level drops, float 74 descends under its own weight, closing switch 1 and opening switch 2.

[0045] Reference Figure 5 The arc plate on the side of the water level box 9 away from the collection box 71 is provided with a chute 1 91 and a chute 2 92 that are interconnected; the chute 1 91 is arranged along the radial direction of the water level box 9 and is arranged at the end of the arc plate close to the vertical side wall of the water level box 9; the chute 2 92 is arranged along the circumference of the arc plate. A pressure block 93 is slidably arranged in the chute 1 91; a spring 1 94 is fixed to the bottom of the pressure block 93, and the bottom surface of the spring 1 94 is fixed to the bottom wall of the chute 1 91, which is used to drive the pressure block 93 to reset upward. An arc-shaped pressure plate 95 is slidably arranged in the chute 2 92, and the bottom end of the pressure plate 95 can contact the pressure block 93, and the contact surfaces of the pressure plate 95 and the pressure block 93 are respectively provided with inclined surfaces 96; the inclined surfaces 96 are respectively located at the bottom corner position of the pressure block 93 and the top corner position of the pressure plate 95. As the water level in collection box 71 rises, pressure block 93 moves downward under the pressure of the water, pushing pressure plate 95 upward via inclined surface 96. When the water level drops, pressure block 93 returns to its original position under the action of spring 1 94, and pressure plate 95 slides downward under its own weight. An overflow hole is provided on the curved wall of chute 2 92, away from collection box 71, to drain water that has entered chute 1 91 and chute 2 92. The overflow hole is located at the bottom of water level box 9.

[0046] Reference Figure 5A magnet 97 is fixed to the top of the second chute 92, on the side away from the collection box 71. A second magnet is fixed to the side of the float 74 away from the collection box 71, which is magnetically attracted to the first magnet 97. A connecting hole 99 is provided on the top of the second chute 92, near the collection box 71, and connects to the water level box 9. When the float 74 rises to the top of the water level box 9, the magnetic attraction between the first magnet 97 and the second magnet attracts the float 74, preventing the float 74 from following the water level fluctuations. When the float 74 rises to the top of the water level box 9, the attraction between the first magnet 97 and the second magnet maintains electrical contact between the second stator 83 and the second movable plate 84. The end of the pressure plate 95 away from the pressure block 93 is made of magnetically insulating material and has a connecting hole 98 formed along its thickness. When the pressure plate 95 moves upward, the connecting hole aligns with the second magnet, allowing the first magnet 97 and the second magnet to magnetically attract each other. When the pressure plate 95 moves downward, the connecting hole 1 99 is misaligned with the magnet 2, and the magnet 1 97 is separated from the magnet 2 by the magnetic insulating material on the pressure plate 95, so that the floating block 74 loses the positioning function of the magnet 2, and the floating block 74 will drop with the water level; at this time, the stator 1 81 is in electrical contact with the movable plate 1 82. At the same time, due to the drop in water level, the pressure block 93 rises, the pressure plate 95 drops, and the water level in the collection box 71 tends to drop.

[0047] Reference Figure 5A valve slot 101 is defined within the vertical sidewall of the water level box 9, communicating with the first chute 91. A valve plate 10 slides within the valve slot 101. A water outlet hole 102 and a second water outlet hole 103 are defined within the vertical sidewall of the water level box 9, each communicating with the water level box 9. A water outlet pipe 104, communicating with the first water outlet hole 102, and a second water outlet pipe 105, communicating with the second water outlet hole 103, are fixedly attached to the outer wall of the water level box 9. The bottom end of the second water outlet pipe 105 is connected to the humidity box 51, directing water discharged from the water level box 9 through the second water outlet pipe 105 into the humidity box 51 for reaction with the hygroscopic material. A water flow hole is defined at the bottom of the humidity box 51 to drain excess water. A water outlet hole 3 is defined on the valve plate 10. When the valve plate 10 moves upward, water outlet hole 3 overlaps with water outlet hole 102. The speed of water flowing out of the water level box 9 can be controlled by adjusting the aperture of water outlet hole 102. When the speed at which external water enters the collection box 71 is slower than the water outflow rate of water outlet pipe 104, the water level in the collection box 71 will not rise. When rainfall exceeds the water outflow rate of water outlet pipe 104, the water level in the collection box 71 and the water level box 9 can maintain an upward trend. When the valve plate 10 moves downward, water outlet hole 3 overlaps with water outlet hole 2 103. The valve plate 10 is fixedly connected to the pressure plate 95, causing the water level in the collection box 71 to rise. The valve plate 10 can then follow the pressure plate 95 downward and direct water into the humidity box 51 for reaction. That is, when rainfall exceeds the discharge rate of water outlet hole 102, the reaction between the hygroscopic material and water is controlled by adjusting the valve plate 10. By setting the aperture of the second water outlet hole 103 , when the valve plate 10 moves downward, the water level in the collection box 71 can rise at a speed that is the same as the water level when the valve plate 10 is in the initial state.

[0048] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An intelligent gateway with a heat dissipation function, comprising a P-type semiconductor (11) arranged on a splitter box (1), a heat dissipation box (21) arranged outside the splitter box (1), and an N-type semiconductor (22) arranged on the heat dissipation box (21); the N-type semiconductor (22) and the P-type semiconductor (11) are respectively connected to a power supply, characterized in that: A heat storage box (41) is fixedly connected to one side of the heat dissipation box (21), and a heat storage disk (42) is rotatably arranged in the heat storage box (41); a heat dissipation hole (43) that can be communicated with the heat dissipation box (21) is opened on the heat storage box (41), and a plurality of heat storage balls (44) for storing heat storage material are embedded and fixed on the heat storage disk (42) along its own circumference; the heat storage material is a phase change material; The heat storage tank (41) is fixedly connected to a heat collecting tank (6); a second N-type semiconductor (31) is fixedly connected to the heat collecting tank (6), and the second N-type semiconductor (31) is electrically connected to the P-type semiconductor (11); a second heat dissipation hole (61) is provided on the heat storage tank (41) and is communicable with the heat collecting tank (6); A humidity box (51) for storing hygroscopic material is fixedly connected to the side wall of the heat storage box (41), and the hygroscopic material absorbs water and releases heat.

2. The intelligent gateway with heat dissipation function according to claim 1, characterized in that: A dehumidification box (5) connected to the spectrometer box body (1) is fixedly connected to the spectrometer box body (1), and a rotatable dehumidification disk (53) is provided in the dehumidification box (5), and a plurality of dehumidification holes (54) are evenly distributed along the circumference of the dehumidification disk (53); a mesh bag (55) for placing a desiccant is provided in the dehumidification hole (54); a cover plate (52) for sealing is fixed to the side of the dehumidification box (5) close to the spectrometer box body (1); a heat dissipation hole three (62) is opened on the side of the dehumidification box (5) close to the heat storage box (41), so that the heat collection box (6) is connected to the dehumidification box (5).

3. The intelligent gateway with heat dissipation function according to claim 2, characterized in that: A micro motor for driving the heat storage disk (42) to rotate is provided on the inner wall of the heat storage box (41), and the output shaft of the micro motor is fixedly connected to the heat storage disk (42); a telescopic tube is fixedly connected to the side wall of the heat storage disk (42) close to the dehumidification disk (53); the telescopic tube includes a tube body (12) and a tube shaft (13) slidably provided in the tube body (12); a tension spring (14) is fixedly provided in the tube body (12), and the end of the tension spring (14) is fixedly provided with a tension spring (14). The dehumidifying plate (53) is provided with a socket (15) which can be plugged into the tube shaft (13); the dehumidifying box (5) is provided with a reserved hole (16) which can pass through the tube shaft (13); an electromagnet (17) is fixedly connected to the reserved hole (16), and a magnetic ring (18) which can be attracted by the electromagnet (17) is rotatably connected to the outer peripheral surface of the tube shaft (13).

4. The intelligent gateway with heat dissipation function according to claim 1, characterized in that: A rainwater collecting box (7) is fixedly connected to the heat storage box (41); the rainwater collecting box (7) includes a collecting box (71) and a water level box (9) fixed to the bottom of the collecting box (71); a water inlet (73) communicating with the water level box (9) is provided on the bottom surface of the collecting box (71); a floating block (74) is provided in the water level box (9) for sliding along its own circumferential direction; a chute (91) is provided on the bottom of the water level box (9); a pressure block (93) is provided in the chute (91) for vertical sliding; a spring (94) is fixed to the bottom of the pressure block (93), and the bottom surface of the spring (94) is fixed to the inner bottom wall of the chute (91) for driving the pressure block (93) to move. The block (93) is reset upward; a valve slot (101) is provided in the side wall of the water level box (9) and is connected to the slide slot 1 (91); a valve plate (10) is slidably provided in the valve slot (101); a water outlet hole 1 (102) and a water outlet hole 2 (103) are provided on the side wall of the water level box (9) and are respectively connected to the water level box (9); and a water outlet pipe 1 (104) connected to the water outlet hole 1 (102) and a water outlet pipe 2 (105) connected to the water outlet hole 2 (103) are fixedly connected to the outer wall of the water level box (9); the bottom end of the water outlet pipe 2 (105) is connected to the humidity box (51), and a water outlet hole 3 is provided on the valve plate (10).

5. The intelligent gateway with heat dissipation function according to claim 4, characterized in that: A switch slot (8) is provided on the inner top surface of the water level box (9); a slide (72) is provided in the switch slot (8) for vertical sliding; a switch 1 is provided on the connection circuit between the N-type semiconductor 1 (22) and the P-type semiconductor (11), and the switch 1 includes a stator 1 (81) and a moving plate 1 (82) that can be electrically connected; a switch 2 is provided on the connection circuit between the N-type semiconductor 2 (31) and the P-type semiconductor (11), and the switch 2 includes a stator 2 (83) and a moving plate 1 (82) that can be electrically connected. The sliding plate (72) is fixed with a guide plate (85) on its side wall, and the inner side wall of the switch slot (8) is provided with a guide slot (86) which can be connected to the guide plate (85) in a vertical sliding direction; the movable plate (82) is fixed to the bottom surface of the guide plate (85), and the movable plate (84) is fixed to the top surface of the guide plate (85); the fixed plate (81) is fixed to the bottom surface of the guide slot (86), and the fixed plate (83) is fixed to the top surface of the guide slot (86).

6. The intelligent gateway with heat dissipation function according to claim 5, characterized in that: The water level box (9) is provided with a second chute (92) at the bottom thereof and connected to the first chute (91); a pressure plate (95) is provided in the second chute (92) and slides along the circumference of the water level box (9); the bottom end of the pressure plate (95) can contact the pressure block (93), and the contact surfaces of the pressure plate (95) and the pressure block (93) are respectively provided with inclined surfaces (96); a magnet (97) is fixed on the top of the second chute (92); a magnet (97) that can be magnetically attracted to the magnet (97) is fixed on the side wall of the floating block (74); a connecting hole (99) that is connected to the water level box (9) is provided at the top of the second chute (92), and the pressure plate (95) is provided with a connecting hole (98) along its thickness direction.

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