Coil member and camera module including the same

Abstract

A coil member according to an embodiment includes a substrate including a first surface and a second surface opposite the first surface; a wiring pattern disposed on the substrate; and a metal coating pattern connected to the wiring pattern, the metal coating pattern being thinner than the wiring pattern.

Description

Technical Field

[0001] The embodiments relate to a coil component and a camera module including the coil component. Background Technology

[0002] With the widespread use of various portable terminals and the commercialization of wireless internet services, consumer demand for portable terminals has diversified, and correspondingly, various add-on devices have been installed in portable terminals.

[0003] A representative example is a camera module that can capture photos or videos of a subject, store the image data, and then edit and transmit the image data as needed.

[0004] In recent years, there has been an increasing demand for small camera modules and image input devices (such as information terminals for surveillance cameras and video recorders) used in various multimedia fields (such as personal laptops, camera phones, PDAs, smart devices, toys, etc.).

[0005] Traditional camera modules are broadly classified into fixed-focus (FF), autofocus (AF), and optical image stabilization (OIS) camera modules.

[0006] On the other hand, in the case of OIS type, a coil component mounted on a circuit board can be included as a component to realize the camera's image stabilization function.

[0007] Such coil components can be formed by setting coil-shaped electrodes on a substrate.

[0008] Alternatively, the coil components can be formed by forming multiple coil components on a large-area substrate and then laser-cutting each coil component. In this case, since a plating process is required when forming the electrodes of each coil component, plating lines can be connected to each coil component. Accordingly, after the coil components are cut, the cut plating lines may remain on each coil component.

[0009] In this case, since the plating lines of the substrate and the coil components have different laser absorptivity, the plating lines may protrude beyond the substrate as the substrate around the plating lines is removed in the area where the plating lines are cut.

[0010] Correspondingly, since no protective layer is provided on the outwardly protruding plating lines, there is a problem that the reliability of the coil components deteriorates due to corrosion of the plating lines.

[0011] Therefore, there is a need for a coil component that can solve the above problems and a camera module that includes such a component. Summary of the Invention

[0012] Technical issues

[0013] The embodiments are intended to provide a coil component with improved reliability and a camera module including the coil component.

[0014] Technical solution

[0015] According to an embodiment, the coil component includes: a substrate, the substrate including a first surface and a second surface opposite to the first surface; a wiring pattern disposed on the substrate; and a plating pattern connected to the wiring pattern, wherein the thickness of the plating pattern is smaller than the thickness of the wiring pattern.

[0016] Beneficial effects

[0017] According to the embodiment, the coil component can reduce the protruding length of the plating pattern protruding from the end of the substrate by forming a plating pattern so as to have a relatively small thickness.

[0018] In detail, when cutting along the cutting line of the coil component area with a laser, the intensity or irradiation time of the laser can be greater than the intensity or irradiation time of the laser in other areas, so as to remove the plating pattern in the area where the plating pattern is set on the substrate.

[0019] Accordingly, while removing the plating pattern, the substrate in the peripheral area where the plating pattern is located can also be removed. In this case, the extent to which the substrate is removed can be increased proportionally to the laser intensity and irradiation time. Therefore, as the thickness of the plating pattern increases, the laser intensity and irradiation time increase, thereby increasing the area of ​​the substrate removed in the region where the plating pattern is located. In other words, the extent to which the substrate is removed during the plating pattern cutting process can be proportional to the thickness of the plating pattern.

[0020] Accordingly, when the coil component is cut, the substrate in the peripheral area where the plating pattern is set is removed together. After the coil component is cut, the plating pattern can be configured to protrude from the end of the substrate. Therefore, due to corrosion of the protruding plating pattern, poor appearance and decreased reliability of the coil component may occur, which may lead to defects when the coil component is bonded to the printed circuit board.

[0021] Therefore, the coil component according to embodiments of the present invention can reduce the thickness of the plating pattern. Accordingly, the laser intensity and irradiation time are reduced when cutting the coil component, thereby solving the above-mentioned problems.

[0022] In other words, in the coil component according to the embodiment, the thickness of the plating pattern can be made smaller than the thickness of other patterns. Accordingly, when the coil component is cut, the removal of the substrate in the peripheral region of the plating pattern can be minimized. Therefore, after cutting the coil component, the length of the plating pattern protruding from the end of the substrate can be minimized. Attached Figure Description

[0023] Figure 1 This is a view used to describe the cutting process of the coil component according to an embodiment;

[0024] Figure 2 yes Figure 1 A magnified view of region A in the middle;

[0025] Figure 3 This is a view used to describe the exposure of the plating lines of the coil component according to an embodiment;

[0026] Figure 4 This is a bottom view showing a coil component according to an embodiment;

[0027] Figure 5 This is a top view showing a coil component according to an embodiment;

[0028] Figure 6 It shows along Figure 4 A view of the cross section intercepted by line B-B';

[0029] Figure 7 It shows along Figure 4 A view of the cross-section taken by line C-C';

[0030] Figure 8 and Figure 9 It shows along Figure 4 The view of the cross-section intercepted by line D-D';

[0031] Figure 10 It shows along Figure 4 A cross-sectional view taken by line E-E';

[0032] Figures 11 to 13 This is a view used to describe the masking process and cutting process of the plating line formed in the manufacturing process of the coil component according to the embodiment;

[0033] Figure 14 This is a perspective view showing a camera module including a coil member according to an embodiment. Detailed Implementation

[0034] Embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present disclosure are not limited to the portion of the described embodiments, and may be implemented in various other forms. Furthermore, one or more elements of the embodiments may be selectively combined and substituted within the spirit and scope of the present disclosure.

[0035] Furthermore, unless explicitly defined and described otherwise, the terms (including technical and scientific terms) used in the embodiments of this disclosure may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains, and terms such as those defined in common dictionaries may be interpreted as having a meaning consistent with their meaning in the relevant technical context.

[0036] Furthermore, the terminology used in the embodiments of this disclosure is for describing embodiments and not for limiting this disclosure. In this specification, singular forms may also include plural forms unless specifically stated in the phrase, and when described as “at least one (or more) of A, B, and C,” it may include at least one of all combinations of A, B, and C.

[0037] Furthermore, in describing the elements of embodiments of this disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish elements from other elements, and these terms are not limited to the nature, order, or sequence of the elements.

[0038] Furthermore, when an element is described as being “connected,” “joined,” or “linked” to another element, it can include not only cases where the element is directly “connected,” “joined,” or “linked” to other elements, but also cases where the element is “connected,” “joined,” or “linked” to other elements through yet another element between the element and other elements.

[0039] Furthermore, when described as being formed or positioned “above” or “below” each element, “above” or “below” can include not only the case where two elements are directly connected to each other, but also the case where one or more other elements are formed or positioned between the two elements.

[0040] Furthermore, when expressed as "above" or "below", it may include not only the upward direction based on a component, but also the downward direction based on a component.

[0041] The coil component according to an embodiment will now be described with reference to the accompanying drawings.

[0042] Figures 1 to 3 This is a view used to describe the manufacturing process of a coil component according to an embodiment.

[0043] refer to Figure 1 and Figure 2 Multiple coil member regions CA can be formed on the substrate 110, and a circuit pattern (not shown) for forming coil members can be set inside each coil member region.

[0044] In this case, the circuit pattern set within the coil component region CA can be formed by a plating process. Accordingly, plating lines PL for forming the plating can be connected to each coil component region CA to set the circuit pattern within the coil component region CA.

[0045] Accordingly, the circuit pattern formed by the plating can be formed in the coil component region CA by the current transmitted through the plating line PL.

[0046] The plating lines PL may include two plating lines PL for the cathode and the anode, and the two plating lines PL may be connected to a coil member region CA. That is, each coil member region CA may be connected to two plating lines that transmit current to one surface of the substrate 110 and two plating lines that transmit current to the other surface of the substrate 110.

[0047] Optionally, a plating line for transmitting current to one surface of the substrate 110 may be connected to each of the coil member regions CA, and a plating line for transmitting current to the other surface of the substrate 110 may be connected to each of the coil member regions CA. In other words, at least two or more plating lines in the coil member regions may be connected to one surface or the other surface of the substrate.

[0048] Subsequently, the substrate 110 can be cut. Specifically, the substrate 110 can be cut along cutting lines CL of multiple coil member regions CA disposed on the substrate 110. Specifically, each unit coil member can be separated from the substrate 110 by irradiating a laser along the cutting lines CL of the multiple coil member regions.

[0049] The cutting line CL may include a region where only the substrate 110 is provided and a region where a plating line PL is provided on the substrate 110. In this case, the substrate 110 and the plating line PL may have different laser absorptivity. Specifically, the laser absorptivity of the plating line PL may be smaller than that of the substrate 110. That is, the laser absorptivity of the plating line PL, which includes metal, may be smaller than that of the substrate 110, which includes plastic.

[0050] Accordingly, when cutting along the cutting line CL, the laser intensity in the area where the plating line is provided may be greater than the laser intensity in the area where only the substrate 110 is provided, or the irradiation time of the laser in the area where the plating line is provided may be longer than the irradiation time in the area where only the substrate 110 is provided.

[0051] Therefore, the substrate 110 can also be removed simultaneously with cutting the plating line in the area surrounding the plating line during the process of removing the plating line PL. Accordingly, as Figure 3 As shown, the plating line PL can protrude from the end of the substrate 100 in the last cut coil component to be exposed to the outside.

[0052] Since no separate protective layer is provided on such a prominent plating line PL, corrosion may occur in the coil component 1000 through the prominent plating line PL, and the reliability of the coil component may be degraded because such corrosion may extend and reach the circuit pattern of the coil component.

[0053] Therefore, the coil component according to the embodiments described below is intended to provide a coil component that minimizes the size of the protrusions of the plating lines produced in the cutting process of the coil component as described above.

[0054] Figure 4 This is a bottom view showing a coil component according to an embodiment. Figure 5 This is a top view showing a coil component according to an embodiment of the present invention.

[0055] refer to Figure 4 and Figure 5 The coil component 1000 may include a substrate 100, multiple circuit patterns, and a protective layer.

[0056] The substrate 100 can be formed by cutting the substrate 110 into unit coil components 1000.

[0057] The substrate 100 may be a flexible substrate. That is, the substrate 100 may include flexible plastic. For example, the substrate 100 may be a polyimide (PI) substrate. However, this embodiment is not limited to this, and the substrate 100 may be a substrate made of polymer materials such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).

[0058] The substrate 100 can be an insulating substrate. That is, the substrate 100 can be an insulating substrate that supports various circuit patterns.

[0059] The substrate 100 can have a thickness of 20 μm to 100 μm. For example, the substrate 100 can have a thickness of 25 μm to 75 μm. For example, the substrate 100 can have a thickness of 30 μm to 40 μm. When the thickness of the substrate 100 exceeds 100 μm, the overall thickness of the coil component may increase. Furthermore, when the thickness of the substrate 100 is less than 20 μm, the substrate 100 may be susceptible to the effects of heat, pressure, etc., during the formation of the coil electrodes on the substrate 100.

[0060] A hole h can be formed on the substrate 100. Specifically, the hole h passing through the substrate 100 can be formed in the central region of the substrate 100. When the coil member 1000 is applied to a camera module, the hole h can function as a drive for the camera module, such as a sensing hole.

[0061] The circuit pattern can be disposed on the substrate 100. Specifically, the circuit pattern can be disposed on both surfaces of the substrate 100. That is, the circuit pattern can be disposed on a first surface 1S and a second surface 2S opposite to the first surface 1S of the substrate 100. Alternatively, the circuit pattern can be disposed on either the first surface 1S or the second surface 2S opposite to the first surface 1S of the substrate 100. In other words, the circuit pattern can be disposed on at least one of the first surface 1S and the second surface 2S opposite to the first surface 1S of the substrate 100.

[0062] Circuit patterns can include various types of patterns. Specifically, circuit patterns can include wiring patterns, plating patterns, and dummy patterns, depending on their function, location, and connection relationships.

[0063] Wiring patterns 210 and 220 may include a first wiring pattern 210 and a second wiring pattern 220. More specifically, wiring patterns 210 and 220 may include a first wiring pattern 210 disposed on a first surface 1S of the substrate 100 and a second wiring pattern 220 disposed on a second surface 2S of the substrate 100.

[0064] Here, the first surface 1S of the substrate 100 can be defined as the surface facing the printed circuit board of the camera module on which the coil member 1000 is provided, and the second surface 2S of the substrate 100 can be defined as the surface opposite to the first surface 1S.

[0065] The first wiring pattern 210 can be disposed on the lower surface of the coil member 1000. The first wiring pattern 210 can be disposed on the first surface 1S of the substrate 100 in the shape of a closed-loop coil. That is, the first wiring pattern 210 can be a first coil pattern disposed on the first surface 1S of the substrate 100.

[0066] The first wiring pattern 210 may include a wiring portion 211 and pad portions 212a and 212b. The first wiring pattern 210 can be electrically connected to a printed circuit board disposed below the coil member 1000 via the pad portions 212a and 212b.

[0067] The second wiring pattern 220 can be disposed on the upper surface of the coil member 1000. The second wiring pattern 220 can be disposed on the second surface 2S of the substrate 100 in a closed-loop coil shape. That is, the second wiring pattern 220 can be a second coil pattern disposed on the second surface 2S of the substrate 100.

[0068] The first wiring pattern 210 and the second wiring pattern 220 can be connected to each other. In more detail, the first wiring pattern 210 and the second wiring pattern 220 can be connected to each other through through holes formed in the substrate 100.

[0069] In detail, the first wiring pattern 210 may include a 1-1 connection area and a 1-2 connection area. A first through-hole V1 may be formed in the 1-1 connection area, and a second through-hole V2 may be formed in the 1-2 connection area.

[0070] Furthermore, the second wiring pattern 220 may include a 2-1 connection area and a 2-2 connection area. A first through-hole V1 may be formed in the 2-1 connection area, and a second through-hole V2 may be formed in the 2-2 connection area.

[0071] The first through hole V1 or the second through hole V2 can be formed as one, two or more. When multiple first through holes V1 or second through holes V2 are formed, even if a connection failure occurs in any one through hole during the process, a connection can be made in other through holes, thereby minimizing the characteristic defects of the coil component.

[0072] Furthermore, in order to form multiple through-holes, the wiring pattern in the connecting area can be made wider than the wiring pattern forming the closed roof. Therefore, when the first wiring pattern and the second wiring pattern are connected through the connecting area, misalignment of the first wiring pattern, the connecting area, and the second wiring pattern can be prevented from being disconnected.

[0073] The first wiring pattern 210 may include a first pad portion 212a and a second pad portion 212b. When a signal is transmitted from the first pad portion 212a on the first surface 1S of the substrate 100 connected to the printed circuit board, the signal can be transmitted from the outside to the inside along the first wiring pattern 210 in a coil shape to the 1-1 connection area, and can be transmitted from the 1-1 connection area to the 2-1 connection area of ​​the second surface 2S through the first through hole V1.

[0074] Subsequently, the signal can be transmitted from the inside out in a coil shape along the second wiring pattern 220 to the 2-2 connection area, and can also be transmitted through the second via V2 to the 1-2 connection area of ​​the first surface 1S. Then, the signal can be transmitted along the first wiring pattern 220 to the second pad portion 212b, and the signal can be transmitted again to the printed circuit board.

[0075] The first pad portion 212a or the second pad portion 212b can each be formed from one, two, or more pad portions. In other words, the first pad portion 212a or the second pad portion 212b can be formed in multiple ways. Therefore, poor contact that may occur when the pad portion is connected to the printed circuit board can be prevented.

[0076] The plating pattern can be obtained by cutting the above reference. Figures 1 to 3 The plating line PL described is the plating line PL that remains on the substrate 100 after the plating line PL.

[0077] The plating pattern may include a first plating pattern and a second plating pattern. The plating pattern may include a first plating pattern disposed on a first surface 1S of the substrate 100 and including a 1-1 plating pattern 311 and a 1-2 plating pattern 312, and a second plating pattern disposed on a second surface 2S of the substrate 100 and including a 2-1 plating pattern 321 and a 2-2 plating pattern 322.

[0078] Optionally, the plating pattern may include a first plating pattern or a second plating pattern. The first plating pattern is disposed on a first surface 1S of the substrate 100 and includes at least one of a 1-1 plating pattern 311 and a 1-2 plating pattern 312. The second plating pattern is disposed on a second surface 2S of the substrate 100 and includes at least one of a 2-1 plating pattern 321 and a 2-2 plating pattern 322. That is, the plating pattern may include at least one of a first plating pattern and a second plating pattern.

[0079] Plating pattern 311 (1-1) and plating pattern 312 (1-2) can be connected to the first wiring pattern 210. Specifically, plating pattern 311 (1-1) and plating pattern 312 (1-2) can be connected to the first wiring pattern 210 located at the outermost portion of the first wiring pattern 210. Accordingly, the first wiring pattern 210 may include a plating layer formed by an electrolytic plating process using current transmitted through plating pattern 311 (1-1) and plating pattern 312 (1-2).

[0080] Furthermore, plating patterns 321 (2-1) and 322 (2-2) can be connected to the second wiring pattern 220. Specifically, plating patterns 321 (2-1) and 322 (2-2) can be connected to the second wiring pattern 220 located at the outermost portion of the second wiring pattern 220. Accordingly, the second wiring pattern 220 may include a plating formed by an electrolytic plating process using current transmitted through plating patterns 321 (2-1) and 322 (2-2).

[0081] The first plating pattern may be configured to extend to the end of the substrate 100. Alternatively, the first plating pattern may be configured to extend further out from the end of the substrate 100.

[0082] Furthermore, the second plating pattern may be configured to extend to the end of the substrate 100. Alternatively, the second plating pattern may be configured to extend further out from the end of the substrate 100.

[0083] For example, the plating pattern can be configured to protrude from the end of the substrate 100. In this case, the protrusion length 1 of the plating pattern can be 30 μm or less.

[0084] In detail, the protruding length 1 of the plating pattern can be smaller than a first distance d, which is defined as the maximum distance between the substrate 100 and the first wiring pattern disposed at the outermost portion of the first wiring pattern.

[0085] Optionally, the protruding length l of the plating pattern can be greater than the width of the wiring patterns 210 and 220. Optionally, the protruding length l of the plating pattern can be greater than the spacing between the wiring patterns 210 and 220.

[0086] When the protruding length l of the coating pattern exceeds 30 μm or exceeds the first distance d, the design freedom of the camera module decreases due to the increase in the size of the coil component, and correspondingly, the size of the camera module can also be increased.

[0087] According to the embodiment, the length of the plating pattern protruding from the end of the substrate 100 can be reduced in the coil member. Accordingly, the length of the plating pattern exposed to the outside in the coil member can be reduced. That is, the length of the plating pattern exposed to the outside can be reduced in the coil member without a protective layer.

[0088] This prevents corrosion of the exposed plating pattern and avoids degradation of the reliability of coil components extending into the circuit pattern due to corrosion.

[0089] According to the embodiment, the coil component can have a thinner layer structure for the plating pattern than other patterns to reduce the protruding length of the plating pattern.

[0090] For example, the first plating pattern and the second plating pattern can be formed with a layer structure different from that of the first wiring pattern 210 and the second wiring pattern 220. Furthermore, the first plating pattern and the second plating pattern can be formed with a height different from that of the first wiring pattern 210 and the second wiring pattern 220. Additionally, the first plating pattern and the second plating pattern can be formed with a width different from that of the first wiring pattern 210 and the second wiring pattern 220.

[0091] The layer structure, height, and width of the first plating pattern, the second plating pattern, the first wiring pattern 210, and the second wiring pattern 220 will be described in detail below.

[0092] The dummy patterns 410 and 420 may include a first dummy pattern 410 and a second dummy pattern 420. In more detail, the dummy patterns 410 and 420 may include a first dummy pattern 410 disposed on a first surface 1S of the substrate 100 and a second dummy pattern 420 disposed on a second surface 2S of the substrate 100.

[0093] The first dummy pattern 410 and the second dummy pattern 420 can be respectively disposed on the areas on the first surface 1S and the second surface 2S of the substrate 100 where the wiring patterns 210 and 220 and the plating pattern are not disposed. That is, the first dummy pattern 410 and the second dummy pattern 420 can be disposed separately from the wiring patterns 210 and 220 and the plating pattern.

[0094] Furthermore, the first dummy pattern 410 and the second dummy pattern 420 can be configured to be disconnected and not connected to other patterns. That is, signals may not be transmitted to the first dummy pattern 410 and the second dummy pattern 420. Specifically, no signals are transmitted to the first dummy pattern 410 and the second dummy pattern 420. The first dummy pattern 410 and the second dummy pattern 420 can be disposed on both sides or one side of the substrate 100 to adjust the plating degree at each location of the circuit pattern. This is caused by areas with wiring patterns and areas without wiring patterns, thus ensuring the uniformity of the width or thickness of the circuit pattern and serving as alignment marks when forming the wiring pattern.

[0095] On the other hand, the first plating pattern and the second plating pattern can be formed with a layer structure different from that of the first dummy pattern 410 and the second dummy pattern 420. Furthermore, the first plating pattern and the second plating pattern can be formed with a height different from that of the first dummy pattern 410 and the second dummy pattern 420. Additionally, the first plating pattern and the second plating pattern can be formed with a width different from that of the first dummy pattern 410 and the second dummy pattern 420.

[0096] The layer structure, height, and width of the first plating pattern, the second plating pattern, the first dummy pattern 410, and the second dummy pattern 420 will be described in detail below.

[0097] Figure 6 It shows along Figure 4 The view of the cross-section intercepted by line B-B'. That is, Figure 6 This is a cross-sectional view showing the wiring pattern of the coil component according to an embodiment.

[0098] refer to Figure 6The first wiring pattern 210 and the second wiring pattern 220 can be disposed on the substrate 100. In detail, the first wiring pattern 210 disposed on the first surface 1S of the substrate 100 and the second wiring pattern 220 disposed on the second surface 2S of the substrate 100 can be disposed on the substrate 100.

[0099] Wiring patterns 210 and 220 may include multiple layers. In more detail, wiring patterns 210 and 220 may include multiple conductive layers. For example, wiring patterns 210 and 220 may include a first layer L1, a second layer L2, a third layer L3, and a fourth layer L4 configured to be sequentially stacked on the substrate 100.

[0100] The first layer L1 can be disposed on the substrate 100. In detail, the first layer L1 can be configured to be in direct contact with the substrate 100.

[0101] The first layer L1 can be formed as multiple layers. For example, the first layer L1 may include at least one of nickel, chromium, and titanium. That is, the first layer L1 may include at least one of a nickel layer, a chromium layer, and a titanium layer. For example, the first layer L1 may include a nickel layer and a chromium layer on the nickel layer.

[0102] The first layer L1 can be formed by electroless plating or sputtering processes. The first layer L1 can be configured to have a thin film thickness. Specifically, the first layer L1 can be configured to have a thickness of 20 nm or less.

[0103] The first layer L1 can be a layer that improves the adhesion between the second layer L2 disposed on the first layer L1 and the substrate 100. For example, a nickel layer can have good adhesion to the substrate 100, and a chromium layer can have good adhesion to both the nickel layer and the second layer L2. Therefore, the adhesion of the second layer L2 disposed on the substrate 100 can be improved.

[0104] The second layer L2 can be disposed on the first layer L1. The second layer L2 can include materials that are the same as or different from the material of the first layer L1. Specifically, the second layer L2 can include a metallic material with excellent electrical conductivity. For example, the second layer L2 can include a metal layer containing at least one of copper (Cu), aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag) or molybdenum (Mo), gold (Au), titanium (Ti), and their alloys. Preferably, the second layer L2 can include copper. That is, the second layer L2 can be a copper layer.

[0105] The second layer L2 can be formed by electroless plating. The second layer L2 can be set to have a thickness greater than that of the first layer L1. Specifically, the second layer L2 can be set to have a thickness of 0.1 μm to 1 μm.

[0106] The third layer L2 can be disposed on the second layer L2. The third layer L3 can include the same material as the second layer L2. For example, both the second layer L2 and the third layer L3 can include copper. That is, the third layer L3 can be a copper layer. In wiring patterns 210 and 220, the second layer L2 and the third layer L3, which include the same material, can be distinguished from each other by the difference in the texture of each layer.

[0107] The third layer L2 can be formed by electroplating using the second layer L2 as a seed layer. That is, the second layer L2 can be a seed layer for the electroplated third layer L3, and the third layer L3 can be a plating layer formed by electroplating. The third layer L3 can be configured to have a thickness greater than that of the first layer L1 and the second layer L2. Specifically, the third layer L3 can be configured to have a thickness of 20 μm to 50 μm.

[0108] The fourth layer L4 can be disposed on the third layer L3. Specifically, the fourth layer L4 can be configured to contact the side and top surfaces of the third layer L3. More specifically, the fourth layer L4 can be configured to contact the side and top surfaces of the third layer L3 while being spaced apart from the substrate 100. In other words, the fourth layer L4 can be spaced apart from the substrate 100.

[0109] Since the fourth layer L4 is spaced apart from the substrate 100, when the fourth layer L4 is formed through a plating process, the height of the circuit pattern can be increased more than the width of the circuit pattern. Accordingly, by increasing the height of the coil member to ensure its function as a coil while minimizing the increase in width, more wiring patterns can be formed in the same area, thereby reducing the overall width of the coil member.

[0110] The fourth layer L4 can include the same material as the second layer L2 and the third layer L3. For example, the second layer L2, the third layer L3, and the fourth layer L4 can all consist of copper. That is, the fourth layer L4 can be a copper layer.

[0111] The fourth layer L4 can be a plating layer formed by electrolytic plating. Specifically, after the third layer L3 is formed, the fourth layer L4 can be formed by applying current again through the plating lines. The fourth layer L4 can be formed by one or more plating processes, and multiple layers with different textures can be formed on the fourth layer L4 depending on the number of plating processes.

[0112] The fourth layer, L4, can be configured to have a thickness smaller than that of the third layer, L3. Specifically, the fourth layer, L4, can be configured to have a thickness of 5 μm to 15 μm.

[0113] On the other hand, wiring patterns 210 and 220 may further include a fifth layer. Specifically, the fifth layer may be disposed on the pad portions 212a and 212b of the wiring pattern. The fifth layer may be disposed on the fourth layer L4. The fifth layer may be disposed on the pad portions to facilitate bonding when the coil components and the terminals of the printed circuit board are connected.

[0114] The fifth layer may include materials that are the same as or different from those of the second through fourth layers. Specifically, the fifth layer may include tin (Sn). That is, the fifth layer may include a tin layer. Alternatively, the fifth layer may include both copper and tin. For example, the tin content may increase as the fifth layer extends from the fourth layer L4 towards the upper surface of the fifth layer.

[0115] The fifth layer can have a thickness smaller than that of the second to fourth layers. Specifically, the thickness of the fifth layer can be from 0.3 μm to 0.8 μm.

[0116] Protective layers 510 and 520 can be disposed on wiring patterns 210 and 220. Protective layers 510 and 520 can be disposed around wiring patterns 210 and 220. Accordingly, the wiring patterns can be prevented from being oxidized by external moisture, air, etc., and the wiring patterns can be prevented from peeling off.

[0117] Protective layers 510 and 520 can be configured to partially expose the wiring pattern. Specifically, protective layers 510 and 520 can be provided on the wiring portion 211 and may not be provided on the pad portions 212a and 212b. That is, the protective layers can be configured to expose the pad portions 212a and 212b. Therefore, the wiring pattern provided on the first surface 1S of the substrate 100, i.e., the lower surface of the coil member, can be connected to the terminals of the printed circuit board of the camera module on which the coil member is provided, via the pad portions 212a and 212b.

[0118] Protective layers 510 and 520 may include a first protective layer 510 and a second protective layer 520. More specifically, protective layers 510 and 520 may include a first protective layer 510 disposed on a first surface 1S of the substrate 100 and a second protective layer 520 disposed on a second surface 2S of the substrate 100.

[0119] The first protective layer 510 and the second protective layer 520 can be configured to have different thicknesses. For example, the first protective layer 510 can be configured to have a thickness smaller than that of the second protective layer 520. That is, in order to connect the pad portion and the terminal of the printed circuit board, the first protective layer 510 disposed on a surface 1S of the substrate on which the wiring pattern is arranged can be configured to have a thickness smaller than that of the second protective layer 520.

[0120] For example, the thickness of protective layers 510 and 520 can be from 10 μm to 40 μm, and within the above range, the first protective layer 510 can be configured to have a thickness smaller than that of the second protective layer 520.

[0121] However, this embodiment is not limited to this. By forming the second protective layer 520 of the substrate with a smaller thickness, the thicknesses of the first protective layer and the second protective layer can be formed to be the same or similar.

[0122] When the thickness of protective layers 510 and 520 exceeds 40 μm, the thickness of the coil components may increase. When the thickness of protective layers 510 and 520 is less than 10 μm, the reliability of the wiring pattern of the coil components may deteriorate.

[0123] Protective layers 510 and 520 may include insulating materials. Protective layers 510 and 520 may include various materials that can be cured by heating after coating to protect the surface of the wiring pattern.

[0124] Protective layers 510 and 520 may be resist layers. For example, protective layers 510 and 520 may be solder resist layers comprising organic polymer materials. As an example, protective layers 510 and 520 may comprise epoxy acrylate-based resins. More specifically, protective layers 510 and 520 may comprise resins, curing agents, photoinitiators, pigments, solvents, fillers, additives, acrylic monomers, etc. However, this embodiment is not limited thereto, and protective layers 510 and 520 may be any of photoresist layers, cover layers, and polymer materials.

[0125] Figure 7 It shows along Figure 4 A view of the cross-section taken by line C-C'. That is, Figure 7 This is a cross-sectional view showing the plating pattern of the coil component according to an embodiment.

[0126] refer to Figure 7 The first plating pattern 310 and the second plating pattern 320 may be included on the substrate 100. More specifically, it may include a first plating pattern 310 disposed on a first surface 1S of the substrate 100 and a second plating pattern 320 disposed on a second surface 2S of the substrate 100. Figure 7 The first plating pattern 310 and the second plating pattern 320 are shown to overlap in the thickness direction of the substrate 100, but this embodiment is not limited to this. The plating pattern 310 and the second plating pattern 320 may be configured to be offset from each other in the thickness direction of the substrate 100.

[0127] Alternatively, this embodiment is not limited to this, and only one of the first plating pattern 310 and the second plating pattern 320 may be disposed on the substrate 100.

[0128] The first plating pattern 310 and the second plating pattern 320 may include multiple layers. The first plating pattern 310 and the second plating pattern 320 may include multiple conductive layers. More specifically, the first plating pattern 310 and the second plating pattern 320 may include a first layer L1, a second layer L2, and a third layer L3 stacked sequentially.

[0129] In other words, the first plating pattern 310 and the second plating pattern 320 can be configured as layer structures different from the layer structures of the wiring patterns 210 and 220 described above. Specifically, the first plating pattern 310 and the second plating pattern 320 can be different from the wiring patterns 210 and 220, excluding the fourth layer L4.

[0130] Optionally, this embodiment is not limited to this, and the first plating pattern 310 and the second plating pattern 320 may include a first layer L1 and a second layer L2 stacked sequentially.

[0131] In detail, the first plating pattern 310 and the second plating pattern 320 may be different from the wiring patterns 210 and 220, and do not include the third layer L3 and the fourth layer L4.

[0132] Since the first plating pattern 310 and the second plating pattern 320 are different from the wiring patterns 210 and 220 and do not include the fourth layer L4, the thickness T1 of the first plating pattern 310 and the thickness T2 of the second plating pattern 320 can be smaller than the thickness of the wiring patterns 210 and 220. Specifically, the thickness T1 of the first plating pattern 310 and the thickness T2 of the second plating pattern 320 can be smaller than the thickness of the fourth layer L4 than the thickness of the wiring patterns 210 and 220.

[0133] Furthermore, since the first plating pattern 310 and the second plating pattern 320 differ from the wiring patterns 210 and 220 in that they do not include the fourth layer L4, the width W1 of the first plating pattern 310 and the width W2 of the second plating pattern 320 can also be smaller than the widths of the wiring patterns 210 and 220. More specifically, since the fourth layer L4, which is disposed on the side surfaces of the wiring patterns 210 and 220, is not disposed on the side surfaces of the first plating pattern 310 and the second plating pattern 320, the width W1 of the first plating pattern 310 and the width W2 of the second plating pattern 320 can also be smaller than the widths of the wiring patterns 210 and 220 than the width of the fourth layer L4.

[0134] According to the embodiment, the coil component can reduce the protruding length of the plating pattern protruding from the end of the substrate by forming the plating pattern with a relatively small thickness.

[0135] As described above, when cutting along the cutting line of the coil component area with a laser, the intensity or irradiation time of the laser can be greater than the intensity or irradiation time of other areas to remove the plating pattern in the area where the plating pattern is set on the substrate.

[0136] Accordingly, while removing the plating pattern, the substrate in the peripheral area where the plating pattern is located can also be removed. In this case, the extent to which the substrate is removed can be increased proportionally to the laser intensity and irradiation time. Therefore, as the thickness of the plating pattern increases, the laser intensity and irradiation time increase, and correspondingly, the area of ​​the substrate removed in the region where the plating pattern is located can increase. In other words, the extent to which the substrate is removed during the plating pattern cutting process can be proportional to the thickness of the plating pattern.

[0137] Accordingly, when the coil component is cut, the substrate in the peripheral area where the plating pattern is set is removed together. After the coil component is cut, the plating pattern can be configured to protrude from the end of the substrate. Therefore, due to corrosion of the protruding plating pattern, poor appearance and decreased reliability of the coil component may occur, potentially leading to defects when the coil component is bonded to the printed circuit board.

[0138] Therefore, the coil component according to the embodiment reduces the thickness of the plating pattern, thereby reducing the laser intensity and laser irradiation time when cutting the coil component, thus solving the aforementioned problems. In other words, in the coil component according to the embodiment of the invention, the thickness of the plating pattern can be formed to be smaller than the thickness of other patterns. Therefore, when the coil component is cut, the removal of substrate from the area surrounding the plating pattern can be minimized. Correspondingly, the length of the plating pattern protruding from the end of the substrate after cutting the coil component can be minimized.

[0139] On the other hand, protective layers 510 and 520 can be disposed on plating patterns 310 and 320. Protective layers 510 and 520 can be disposed around wiring patterns 210 and 220. Therefore, oxidation of the plating patterns by external moisture, air, etc., can be prevented, and delamination of the wiring patterns can be prevented. Specifically, the plating patterns 310 and 320 disposed on the substrate 100 can be protected from external moisture and other influences by protective layers 510 and 520.

[0140] Protective layers 510 and 520 may be partially disposed on plating patterns 310 and 320. More specifically, protective layers 510 and 520 may be disposed on plating patterns 310 and 320 supported by substrate 100, and protective layers 510 and 520 may not be disposed on plating patterns 310 and 320 protruding from the ends of substrate 100. This will be referred to... Figure 8 and Figure 9 To describe in more detail.

[0141] Figure 8 and 9 It shows along Figure 4 A cross-sectional view taken by line D-D'. That is, Figure 8 and 9 This is a cross-sectional view of the area where the plating pattern and wiring pattern of the coil component according to the embodiment are connected.

[0142] refer to Figure 8 and 9 The plating patterns 310 and 320 can be configured to be connected to the wiring patterns 210 and 220. More specifically, the plating patterns 310 and 320 can be integrally formed with the wiring patterns 210 and 220. Specifically, the first plating pattern 310 can be connected to the first wiring pattern 210 located at the outermost portion of the first wiring pattern, and the second plating pattern 320 can be connected to the second wiring pattern 220 located at the outermost portion of the second wiring pattern.

[0143] That is, the first plating pattern 310 and the first wiring pattern 210 can be integrally formed, and the second plating pattern 320 and the second wiring pattern 220 can be integrally formed.

[0144] As described above, the thickness T1 of the first plating pattern 310 can be smaller than the thickness T3 of the first wiring pattern 210, and the thickness T2 of the second plating pattern 320 can be smaller than the thickness T4 of the second wiring pattern 220.

[0145] The plating patterns 310 and 320 may include a first region 1A and a second region 2A, depending on whether protective layers 510 and 520 are provided. Specifically, the plating patterns 310 and 320 may include a first region 1A with protective layers 510 and 520 and a second region 2A without protective layers 510 and 520. The second region 2A may be a region where the plating pattern protrudes from the ends of the protective layers 510 and 520.

[0146] Furthermore, in the second region 2A (the region where plating patterns 310 and 320 protrude), the side surface of the substrate between the first plating pattern 310 and the second plating pattern 320 can be formed as convex. Specifically, when... Figure 9 When cutting the coil component as shown, in the side surface LE of the substrate between the second regions 2A, the area closer to the plating pattern is removed more by the laser than the area farther away. Therefore, after cutting the coil component, the side surface of the substrate between the second regions 2A can be formed as a convex shape.

[0147] Figure 10 It shows along Figure 4 A cross-sectional view taken along line E-E'. (Reference) Figure 10Dummy patterns can be formed on the substrate 100. Specifically, the first dummy pattern 410 and the second dummy pattern 420 can be configured to overlap or not overlap each other in the thickness direction of the substrate 100.

[0148] Dummy patterns 410 and 420 may include multiple layers. In detail, dummy patterns 410 and 420 may include a first layer L1, a second layer L2, a third layer L3, and a fourth layer L4 arranged in sequence.

[0149] In other words, the dummy patterns 410 and 420 can be set to the same layer structure as the wiring patterns 210 and 220 described above.

[0150] Accordingly, since the first plating pattern 310 and the second plating pattern 320 are different from the dummy patterns 410 and 420 and do not include the fourth layer L4, the thickness T1 of the first plating pattern 310 and the thickness T2 of the second plating pattern 320 can be smaller than the thickness T5 of the dummy patterns 410 and 420. More specifically, the thickness T1 of the first plating pattern 310 and the thickness T2 of the second plating pattern 320 can be smaller than the thickness of the fourth layer L4 than the thickness of the dummy patterns 410 and 420.

[0151] Furthermore, since the first plating pattern 310 and the second plating pattern 320 differ from the dummy patterns 410 and 420 in that they do not include the fourth layer L4, the width W1 of the first plating pattern 310 and the width W2 of the second plating pattern 320 can be smaller than the widths of the dummy patterns 410 and 420. Specifically, since the fourth layer L4, which is disposed on the side surfaces of the dummy patterns 410 and 420, is not disposed on the side surfaces of the first plating pattern 310 and the second plating pattern 320, the width W1 of the first plating pattern 310 and the width W2 of the second plating pattern 320 can be smaller than the width of the wiring patterns 410 and 420 than the width of the fourth layer L4.

[0152] In the coil component according to the embodiment, when multiple coil components are formed on a large-area substrate and then cut, the length of the residual plating pattern of the coil component protruding from the substrate during the cutting process can be minimized.

[0153] That is, the plating pattern of the coil component protrudes from the end of the substrate. Because the substrate in the outer area of ​​the plating pattern is removed together during the cutting process due to the thickness of the plating pattern, the intensity and time of the laser used to cut the plating pattern area can be reduced by reducing the thickness of the plating pattern during the cutting process.

[0154] Accordingly, the area of ​​the substrate removed together with the plating pattern in the outer region during the process of cutting the coil component is reduced, thereby reducing the protruding length of the plating pattern on the coil component protruding from the substrate after the cutting process.

[0155] Therefore, the external design of the coil components can be improved, and short circuits between protruding plating patterns and patterns on other components can be prevented. Furthermore, the reliability of the coil components can be prevented from decreasing due to corrosion of the protruding plating patterns.

[0156] Figures 11 to 13 This is a view used to describe the masking process and cutting process of the plating line formed in the manufacturing process of the coil component according to the embodiment.

[0157] Figure 11 It is shown Figure 1 A view of an area. Figure 12 It is along Figure 11 A cross-sectional view taken by line F-F'. (Reference) Figure 11 and Figure 12 A mask can be formed on the plating lines PL on the substrate 100.

[0158] The plating line PL is the area that becomes the plating pattern after the unit coil component is cut.

[0159] In detail, the mask material 600 can be disposed on the plating line PL that is connected to the coil member region CA in the plating line PL arranged on the substrate 100.

[0160] The mask material 600 can be applied after the third layer L3 and before the fourth layer L4 in the layers forming the circuit pattern of the coil component. Alternatively, the mask material 600 can be applied after the second layer L2 and before the third layer L3 in the layers forming the circuit pattern of the coil component. The mask material may include the same or similar material as the material of the protective layer described above.

[0161] Accordingly, before forming the fourth layer L4 on the circuit pattern of the coil component, a mask material can be placed on the plating line PL. Subsequently, the fourth layer L4 can be formed on the circuit pattern of the coil component.

[0162] refer to Figure 12 Since the mask material 600 is set on the plating line PL, the fourth layer L4 is not set on the plating line PL. However, the fourth layer L4 can be set only on the wiring pattern 200 connected to the plating line.

[0163] Subsequently, reference Figure 11 and 13 The coil component can be cut along the cutting line CL.

[0164] At this time, since the plating line PL of the cutting line CL does not include the third layer L3 and / or the fourth layer L4, the plating line PL can be set with a thickness smaller than the thickness of the wiring pattern of the coil component.

[0165] Accordingly, when the cutting line CL is laser-cut, the laser intensity and irradiation time based on the coating in the cutting line can be reduced. Consequently, since the area of ​​substrate removal can be reduced in the peripheral region of the coating line PL, the length of the coating pattern formed by the remaining coating line after cutting the coil component protruding from the substrate can be minimized.

[0166] Below, we will refer to Figure 14 The description includes a camera module with coil components according to an embodiment. Figure 14 This is a view showing a combined perspective view of a camera module according to an embodiment.

[0167] refer to Figure 14 According to an embodiment, the camera module 10 includes a cover can 1100, a first mover 1200, a second mover 1300, a stator 1400, a base 1500, and an elastic unit 1600. Furthermore, although in Figure 14 Not shown, but the camera module 10 according to the embodiment may further include a printed circuit board, an infrared filter, an image sensor, etc.

[0168] The lid 1100 houses the elastic unit 1600, the first mover 1200, the stator 1400, and the second mover 1300, and is mounted on the base 1500 to form the exterior of the lens drive motor. Specifically, the inner surface of the lid 1100 is in close contact with a portion or all of the side surfaces of the base 1500 for mounting on the base 1500, and the lid 1100 has the function of protecting the internal components from external impacts and preventing the penetration of external contaminants.

[0169] Furthermore, the lid 1100 should also protect components of the lens drive motor or camera module from external radio wave interference generated by mobile phones, etc. Therefore, the lid 1100 is preferably made of a metallic material.

[0170] The lid can 1100 can be implemented as a yoke unit itself, as will be described below, or it can be fixed by forming a yoke unit inside it. Furthermore, an opening 1110 (through which the lens unit (not shown) is exposed) can be formed on the upper surface of the lid can 1100, and an inner yoke (not shown) curving inwards can be formed at the lower end portion of the upper surface of the lid can 1100. This inner yoke can be positioned in a recess 1213 formed in the bobbin 1210. In this case, the inner yoke can be provided at a corner around the opening on the upper surface of the yoke, or it can be provided on the side surface of the yoke, and the recess of the bobbin can be formed at the corresponding location.

[0171] Furthermore, the lid can 1100 may have at least one fastener 1120 extended on each surface of its lower end, and a more robust sealing and fastening function for the lens drive motor can be achieved by forming a fastening groove 1520 for the fastener 1120 to be inserted into the base 1500. Additionally, the fastener and the fastening groove may not exist separately, but only one of them may be formed.

[0172] On the other hand, a first mover 1200 is disposed on the side surface of the lens unit to move the lens unit (not shown). The first mover 1200 includes a spool 1210 for fixing the lens unit and a first coil member 1220 disposed on the outer peripheral surface of the spool 1210.

[0173] The lens unit (not shown) may be a lens barrel provided with one or more lenses (not shown), but this embodiment is not limited to this, and may include any retainer structure capable of supporting the lens.

[0174] The inner peripheral surface of the spool 1210 is joined to the outer peripheral surface of the lens unit to secure the lens unit. Furthermore, the spool 1210 may have a guide portion 1211 that guides the winding or mounting of the first coil member 1220 on its outer peripheral surface. The guide portion 1211 may be integrally formed with the outer surface of the spool 1210 and may be formed continuously along the outer surface of the spool 1210, or it may be formed at predetermined intervals.

[0175] In addition, spring fastening protrusions 1212 can be formed on the upper and lower surfaces of the spool 1210, and the upper spring 1710 or lower spring 1720 provided on the upper side of the base 1500 for supporting the spool 1210 is fastened to the spring fastening protrusions 1212.

[0176] Furthermore, the spool 1210 may further include a recess 1213 formed on its outer peripheral surface so that the inner yoke of the lid 1100 can be positioned between the spool 1210 and the first coil member 1220 wound around the spool 1210.

[0177] Furthermore, the first coil member 1220 can be guided by the guide portion 1211 and wound around the outer surface of the coil 1210, but four separate coils can be formed at 90° intervals on the outer surface of the coil 1210. The first coil member 1220 can receive power applied from a printed circuit board (not shown), which will be described later, to form an electromagnetic field.

[0178] On the other hand, the second mover 1300 can be positioned facing the first mover 1200 on the side surface of the first mover 1200, and can include a magnet portion 1310 facing the first coil member 1220 and a housing 1320 to which the magnet portion 1310 is fixed.

[0179] Specifically, the magnet part 1310 can be mounted onto the housing 1320 by adhesive or the like, so that it can be positioned at a location corresponding to the outer surface of the first coil member 1220, and can be mounted at equal intervals at the four corners inside the housing 1320 to promote efficient use of the internal volume.

[0180] The housing 1320 can be formed in a shape corresponding to the inner surface of the lid 1100 that forms the exterior of the lens drive motor. Furthermore, the housing 1320 can be formed of an insulating material and, considering productivity, can be manufactured as an injection-molded product. The housing 1320 can be a moving part for OIS driving and can be configured to be spaced at a specific distance from the lid 1100.

[0181] In one embodiment, the housing 1320 may be formed in a hexahedral shape to correspond to the shape of the lid 1100 and be spaced apart by a predetermined distance, and the upper and lower sides of the housing 1320 may be open to support the first mover 1200. Furthermore, the housing 1320 may include magnet part fastening holes 1311 or magnet part fastening grooves on its side surfaces, formed in a shape corresponding to the magnet part 1310.

[0182] In addition, at least two stops 1312 may be formed, the stops being configured to protrude from the upper surface of the housing 1320 at a predetermined distance to contact the upper surface of the lid 1100 to absorb external impacts. The stops 1312 may be integrally formed with the housing 1320.

[0183] In addition, spring fastening protrusions 1313 may be formed on the upper and lower surfaces of the housing 1320, and provided on the upper side of the base 1500 (described later) to support the upper spring 1710 or the lower spring 1720 of the housing 1320 being fastened to the spring fastening protrusions 1313.

[0184] On the other hand, the stator 1400 is positioned to face the lower side of the second mover 1300 to move the second mover 1300, and has through holes 1411 and 1421 corresponding to the lens unit formed at its center.

[0185] Specifically, the stator 1400 may include a second coil member 1410 and a substrate. The second coil member 1410 is positioned facing the lower side of the magnet portion 1310. The second coil member 1410 is disposed on the upper side of the substrate to apply power, and an OIS chip is mounted thereon. The substrate may be a printed circuit board 1420. That is, the second coil member 1410 may be the aforementioned reference... Figures 1 to 13 The coil component described.

[0186] The second coil member 1410 can be mounted on a printed circuit board 1420 disposed on the upper side of the base 1500, or formed on a flexible printed circuit board or substrate, and a through hole 1411 is formed at the center to transmit the optical signal of the lens unit (not shown). On the other hand, when considering the miniaturization of the lens drive motor, specifically, when considering the reduction of the height in the Z-axis direction (i.e., the optical axis direction), the second coil member 1410 can be formed as a fine patterned (FP) coil, which is a patterned coil disposed on a flexible printed circuit board.

[0187] A flexible printed circuit board 1420 may be disposed on the upper surface of the base 1500 to apply power to the second coil member 1410, and a through hole 1421 corresponding to the through hole 11 of the second coil member 1410 is formed on the flexible printed circuit board 1420. Furthermore, the printed circuit board 1420 may include a terminal portion 1422, one end of which or both facing ends are bent to protrude toward the lower side of the base 1500, and the printed circuit board 1420 may supply external power through the terminal portion 1422.

[0188] Furthermore, this embodiment may further include a Hall sensor unit (not shown) mounted on the lower or upper surface of the printed circuit board 1420 such that it corresponds to the position of the magnet portion 1310.

[0189] The Hall sensor unit senses the intensity and phase of the voltage applied to detect the movement of the magnet 310 and the current flowing through the coil, and interacts with the printed circuit board 1420 to be set up to precisely control the actuator.

[0190] The Hall sensor unit can be arranged in a straight line relative to the magnet part 1310 and the optical axis direction. Since the Hall sensor unit must detect displacement on both the X and Y axes, it can include two Hall sensors respectively located at two adjacent corners of the corners of the printed circuit board 1420. A Hall sensor receiving slot 1540 capable of accommodating the Hall sensors can be formed in the base 1500. Furthermore, one or more Hall sensors can be provided.

[0191] Although the Hall sensor unit is positioned closer to the second coil member 1410 than the magnet part 1310, the influence of the second coil member 1410 when detecting the movement of the magnet part 1310 is not considered, considering that the magnetic field strength formed in the magnet part is hundreds of times greater than the electromagnetic field strength formed in the coil.

[0192] The lens unit moves in various directions through the independent or organic interaction of the first mover 1200, the second mover 1300 and the stator 1400, thus focusing the image of the subject through the interaction of the first mover 1200 and the second mover 1300, and correcting camera shake through the interaction of the second mover 1300 and the stator 1400.

[0193] On the other hand, the base 1500 supports the stator 1400 and the second mover 1300, and forms a hollow hole 1510 at its center corresponding to the through holes 1411 and 1421.

[0194] The base 1500 can function as a sensor holder to protect an image sensor (not shown) and can be configured to simultaneously position an infrared filter (not shown). In this case, the infrared filter can be installed in a hollow hole 1510 formed at the center of the base 1500, and an infrared ray (IR) filter can be provided. Furthermore, the infrared filter can be formed of, for example, a membrane material or a glass material, and an infrared blocking coating material can be provided on a plate-like filter, such as a cover glass or cover glass used to protect the imaging surface. In addition, a separate sensor holder can be provided below the base.

[0195] Furthermore, the base 1500 may be formed with one or more fixing protrusions 1530, which protrude from the upper corner to face or engage with the inner surface of the lid 1100, and such fixing protrusions 1530 can easily guide the tightening of the lid 1100 and achieve a firm fixation after tightening. In addition, two or more fixing protrusions may be formed.

[0196] Furthermore, the base 1500 may have a fastening groove 1520 into which the fastener 1120 of the lid 1100 is inserted. The fastening groove 1520 may be partially formed on the outer surface of the base 1500, the shape of which corresponds to the length of the fastener 1120, or it may be formed entirely on the outer surface of the base 1500 so that a predetermined portion of the lower end of the lid 1100, including the fastener 1120, is inserted.

[0197] The features, structures, and effects described in the above embodiments are included in at least one embodiment, but are not limited to one embodiment. Furthermore, the features, structures, and effects illustrated in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, it should be understood that content relating to such combinations and modifications is included within the scope of this disclosure.

[0198] Furthermore, while most of the above descriptions are of embodiments, these embodiments are merely examples and do not limit the scope of this disclosure. Those skilled in the art will understand that numerous variations and applications not described above can be made without departing from the fundamental characteristics of the embodiments. For example, each component specifically represented in the embodiments can be varied. Moreover, it should be understood that differences relating to such variations and applications are included within the scope of this disclosure as defined in the following claims.

Claims

1. A coil component, comprising: A substrate, the substrate including a first surface and a second surface opposite to the first surface; Wiring pattern, wherein the wiring pattern is disposed on the substrate; as well as The plating pattern is connected to the wiring pattern. Wherein, the thickness of the plating pattern is smaller than the thickness of the wiring pattern. The plating pattern is configured to protrude from the end of the substrate. Wherein, the protruding length of the plating pattern is smaller than the first distance between the end of the substrate and the outermost wiring pattern in the wiring pattern. The coating pattern includes a first region and a second region. A protective layer is provided on the first region, while no protective layer is provided on the second region.

2. The coil component according to claim 1, wherein, The protruding length of the coating pattern is less than 30 μm.

3. The coil component according to claim 1, wherein, The layer structure of the plating pattern is different from the layer structure of the wiring pattern.

4. The coil component according to claim 1, wherein, The wiring pattern is formed by sequentially stacking the first, second, third, and fourth layers. The coating pattern is formed by sequentially stacking the first layer and the second layer.

5. The coil component according to claim 1, wherein, The wiring pattern is formed by sequentially stacking the first, second, third, and fourth layers. The plating pattern is formed by sequentially stacking the first layer, the second layer, and the third layer.

6. The coil component according to claim 5, wherein, The first layer includes at least one of a nickel layer, a chromium layer, and a titanium layer. The second, third, and fourth layers contain at least one of copper, aluminum, chromium, nickel, silver, molybdenum, gold, titanium, and alloys of the aforementioned metals.

7. The coil component according to claim 5, wherein, The thickness of the plating pattern is less than the thickness of the wiring pattern and the thickness of the fourth layer.

8. The coil component according to claim 7, wherein, The thickness of the fourth layer is 5 μm to 15 μm.

9. The coil component according to claim 1, wherein, The protruding length of the plating pattern is greater than at least one of the width and spacing of the wiring pattern.

10. The coil component according to claim 1, wherein, The width of the plating pattern is smaller than the width of the wiring pattern.

11. The coil component according to claim 1, further comprising a dummy pattern disposed on at least one of the first surface and the second surface. in, The thickness of the plating pattern is smaller than the thickness of the dummy pattern.

12. The coil component according to claim 11, wherein, The layer structure of the dummy pattern is the same as the layer structure of the wiring pattern.

13. The coil component according to claim 11, wherein, The width of the plating pattern is smaller than the width of the dummy pattern.

14. The coil component according to claim 1, wherein, The second region is the area where the coating pattern protrudes.

15. The coil component according to claim 1, wherein, The side surface of the substrate is formed in a convex shape.

16. The coil component according to claim 1, wherein, The wiring pattern includes a first wiring pattern disposed on the first surface and a second wiring pattern disposed on the second surface. The wiring pattern further includes a first protective layer disposed on the first surface and a second protective layer disposed on the second surface, and The thickness of the first protective layer is different from the thickness of the second protective layer.

17. The coil component according to claim 16, wherein, The first wiring pattern includes wiring portions and pad portions, and The thickness of the first protective layer is smaller than the thickness of the second protective layer.

18. The coil component according to claim 17, wherein, The thickness of the first protective layer and the second protective layer is 10 μm to 40 μm.

19. A camera module, comprising: A first moving element is disposed on a side surface of the lens unit to move the lens unit; The second mover is disposed opposite to the first mover on the side surface of the first mover; The stator is arranged opposite to the lower side of the second mover to allow the second mover to move, and a through hole corresponding to the lens unit is formed in the center of the stator; as well as A base supporting the stator and the second rotor, and a hollow hole corresponding to the through hole of the second rotor is formed at the center of the base. The stator includes a circuit board and coil components disposed on the circuit board. The coil component includes: A substrate, the substrate including a first surface and a second surface opposite to the first surface; Wiring pattern, the wiring pattern being disposed on the substrate; and The plating pattern is connected to the wiring pattern. Wherein, the thickness of the plating pattern is smaller than the thickness of the wiring pattern. The plating pattern is configured to protrude from the end of the substrate. Wherein, the protruding length of the plating pattern is smaller than the first distance between the end of the substrate and the outermost wiring pattern in the wiring pattern. The coating pattern includes a first region and a second region. A protective layer is provided on the first region, while no protective layer is provided on the second region.

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