A topological structure forming part preparation device and preparation method

Abstract

The present invention provides a topological structure molded part preparation device and preparation method, including a molding component, the molding component includes an equipment housing, a controller and a workbench, a powder filling tank is fixed at the bottom of the workbench, the powder filling tank is filled with mixed powder, an additive substrate is provided at the bottom of the powder filling tank, an additive pressing plate is provided above the powder filling tank, the additive substrate and the additive pressing plate are respectively provided with a first copper electrode unit and a second copper electrode unit, a conveying component, which includes a conveyor belt; an electroplating component, the electroplating component includes an electroplating tank, an electroplating power supply, and an anode mechanical clamp and a cathode mechanical clamp. The present invention not only effectively avoids the problems of cracking, warping, deformation and the like that are prone to occur in resistive thermal additive manufacturing, but also simplifies the operation, further improves the production efficiency, and through the subsequent electroplating dissolution technology, a porous, dense and defect-free topological structure molded part can be quickly prepared, which has great application potential in the field of additive manufacturing and topological structure materials.

Description

Technical Field

[0001] The invention belongs to the technical field of special structural material manufacturing, and specifically relates to a topological structure molded part preparation device and preparation method. Background Art

[0002] The main purpose of topological structure in material manufacturing is to reduce the weight and materials as much as possible while ensuring the shape and strength of parts or to apply them to certain special functions. Among them, the structure with the widest application range is mainly porous microstructure / lattice structure, which is generally used as a lightweight and multifunctional (heat insulation, impact resistance, shock absorption, noise reduction, etc.) structure, and is widely used in aerospace, mechanical manufacturing, bioengineering and other fields.

[0003] Resistive thermal additive manufacturing is an additive manufacturing method that uses the resistance heat generated by electric current passing through powder, wire or foil as a heat source to heat and shape powder, wire or foil. The electrode design of existing resistive thermal additive manufacturing equipment mainly adopts a roller structure, which can apply a certain pressure to the material, effectively solving the problems of low density and poor interlayer bonding. However, since the position of the pressure action will change with the roller, it is prone to cracking, warping and deformation. In addition, there is a Chinese patent with patent number CN201910460280.7 that discloses a dot matrix powder 3D printing device and printing method based on resistive heating. The electrode adopts a conical structure. This dot matrix structure effectively improves production efficiency, but due to its electrode structure problem, it is difficult to apply pressure to the material, and it can only be stacked layer by layer, which can easily lead to problems such as low density and poor interlayer bonding.

[0004] Electroplating is a process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. At the anode, the metal loses electrons and dissolves in the solution, and at the cathode, the metal ions gain electrons and precipitate metal. At present, patents on the use of electroplating to prepare porous structures include patent numbers CN201511035097.0, a metal porous surface structure and its preparation method and inlaid electroplating device, and CN201610345100.7, a method for preparing micro-nano porous structures on the surface of titanium or titanium alloys. However, these methods all use the method of placing the plated part at the cathode and preparing a porous structure on the surface of the plated part, and cannot truly obtain a porous topological structure that is evenly distributed and interconnected. Summary of the invention

[0005] In order to solve the above-mentioned technical problems, the present invention provides a device and method for preparing topological structure molded parts, so as to avoid the technical problems of poor interlayer bonding, cracking, warping and deformation in the manufacturing technology of topological structure molded parts, further simplify the process, reduce processing time, improve efficiency, and obtain a porous topological structure molded part with no deformation, no cracks and strong bonding through subsequent electroplating dissolution.

[0006] On the one hand, the invention provides the following technical solution, a device for preparing a topological structure molded part, comprising:

[0007] A molding component is used for molding molded parts, the molding component includes an equipment housing, a controller connected to one side of the equipment housing and a workbench arranged in the equipment housing, a concave powder filling slot is fixed at the bottom of the workbench, the powder filling slot is filled with mixed powder, the mixed powder includes alloy powder and metal powder, the melting point, particle diameter and oxidizability of the metal powder are higher than those of the alloy powder, the electrical conductivity of the alloy powder is greater than that of the metal powder, an additive substrate is provided at the bottom of the powder filling slot, an additive pressure plate corresponding to the additive substrate is provided above the powder filling slot, the additive pressure plate is connected to the top of the equipment housing through a first lifter, The additive substrate and the additive platen are respectively provided with a plurality of first copper electrode units and second copper electrode units which are arranged correspondingly, the additive platen is provided with a plurality of insulating partitions which are distributed in a dot matrix, the insulating partitions are slidably connected in the additive platen, the second copper electrode units are arranged between adjacent insulating partitions, the first lifter is used to drive the additive platen and the insulating partitions to move toward the additive substrate, so that a closed loop is formed between the first copper electrode unit, the mixed powder and the second copper electrode unit, a powder feeding mechanism for conveying the mixed powder to the powder filling tank is provided on one side of the workbench, and a molded part outlet is provided on one side of the equipment housing;

[0008] A conveying assembly installed on one side of the molding assembly, which is used to convey the moldings, and the conveying assembly includes a conveyor belt arranged on one side of the molding outlet;

[0009] An electroplating assembly is installed on one side of the conveying assembly, and is used to electroplate the molded part to form a topological structure molded part. The electroplating assembly includes an electroplating tank arranged on one side of the conveyor belt, an electroplating power supply arranged on one side of the electroplating tank, and an anode mechanical clamp and a cathode mechanical clamp respectively connected to the positive and negative poles of the electroplating power supply. The molded part is clamped at the end of the anode mechanical clamp, and the end of the cathode mechanical clamp holds a cathode graphite strip.

[0010] Compared with the prior art, the beneficial effects of the present application are as follows: the present application extrude the mixed powder through the additive pressing plate, and energize the first copper electrode unit and the second copper electrode unit at the shape position corresponding to the molded part, so that the alloy powder with lower melting point and smaller particle size used for molding in the mixed powder is thermally melted by self-heating, and the metal powder with higher melting point, larger particle size and stronger oxidizability is evenly distributed and interconnected under pressure and embedded in the molten alloy powder to obtain a molded part, and then the molded part is placed in an electroplating tank for electroplating to remove the unmelted metal powder to obtain a dense, porous and defect-free topological structure molded part. The present invention not only effectively avoids the problems of cracking, warping, deformation and the like that are prone to occur in resistive thermal additive manufacturing, but also simplifies the operation and further improves the production efficiency. Moreover, through the subsequent electroplating dissolution technology, a porous, dense and defect-free topological structure molded part can be quickly prepared, which has great application potential in the fields of additive manufacturing and topological structure materials.

[0011] Preferably, a scraper push block is provided on one side of the workbench, the scraper push block is arranged corresponding to the molded part outlet, a push block guide rail is provided in the equipment housing, the scraper push block is slidably connected to the push block guide rail, and the bottom surface of the scraper push block is flush with the surface of the workbench.

[0012] Preferably, a mesh screen is connected between the conveyor belt and the equipment housing, the mesh screen is arranged on one side of the molded part outlet, a powder conveyor belt is fixed to the bottom of the mesh screen, and a powder recovery groove is provided at one end of the powder conveyor belt.

[0013] Preferably, a second lifter is provided at the bottom of the additive substrate, the second lifter is used to drive the additive substrate to move toward the workbench, and the second lifter is fixed to the bottom of the device housing.

[0014] Preferably, the additive substrate comprises an insulating substrate, the first copper electrode units are embedded in the insulating substrate in a dot matrix, and the first copper electrode units are not interconnected.

[0015] Preferably, the additive press plate includes an insulating press plate, the insulating partitions are distributed in the insulating press plate in a lattice pattern, and the insulating press plate is made of an insulating alumina ceramic material.

[0016] Preferably, a baffle is provided on one side of the conveyor belt, and a pneumatic dust removal spray gun is provided at the bottom of the conveyor belt, and the output end of the pneumatic dust removal spray gun faces the conveyor belt.

[0017] Preferably, the powder filling tank comprises an inner tank and an outer tank, the inner tank is made of insulating alumina ceramic material, the outer tank is made of stainless steel material, the outer tank is integrally arranged with the workbench, and the mixed powder is filled in the inner tank.

[0018] Preferably, the alloy powder is titanium alloy powder, and the metal powder is metal iron powder.

[0019] On the other hand, the invention provides the following technical solution: a method for preparing a topological structure molded part, using the above-mentioned topological structure molded part preparation device, the method comprising:

[0020] Molding: the mixed powder is filled into the powder filling tank by the powder feeding mechanism, the additive pressing plate is lowered to the surface of the mixed powder by the first lifter, and the insulating partition corresponding to the shape of the molded part is pushed out, and then the additive pressing plate is pressed down as a whole so that the insulating partition is against the surface of the additive substrate, and the first copper electrode unit and the second copper electrode unit at the position corresponding to the shape of the molded part are energized, so that the alloy powder for molding with a lower melting point and a smaller particle size in the mixed powder is thermally melted by a self-heating method, and the metal powder with a higher melting point, a larger particle size and a stronger oxidizability is uniformly distributed and interconnected under pressure and embedded in the molten alloy powder to obtain the molded part;

[0021] Molding of topological structure molded parts: the molded part is grabbed by the anode mechanical clamp and placed in the electroplating tank, and the cathode graphite strip is grabbed by the cathode mechanical clamp and placed in the electroplating tank, and the electroplating power supply is started to start electroplating of the molded part, so that the unmelted metal powder in the molded part is dissolved in the electroplating solution in the electroplating tank, so as to obtain a dense, porous, and defect-free topological structure molded part. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1 A structural diagram of a device for preparing a topological structure molded part provided in an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the molding of a molded part provided in an embodiment of the present invention;

[0025] Figure 3 A schematic diagram of the structure of an additive press plate provided in an embodiment of the present invention;

[0026] Figure 4 A schematic diagram of the structure of an insulating partition provided by an embodiment of the present invention;

[0027] Figure 5 A schematic structural diagram of an additive substrate provided in an embodiment of the present invention;

[0028] Figure 6 A flow chart of a method for preparing a topological structure molded part provided in an embodiment of the present invention.

[0029] Description of reference numerals:

[0030] Equipment housing 1 Controller 2 Workbench 3 Powder filling tank 4 Additive Substrate 5 Insulation substrate 501 First copper electrode unit 502 Second lifter 6 Scraper push block 7 Push block guide rail 8 Additive Platen 9 Insulation plate 901 Insulation partition 902 The second copper electrode unit 903 Mixed powder 10 alloy powder 101 Metal powder 102 Powder feeding mechanism 11 First lifter 12 Moulded parts export 13 Mesh Screen 14 Powder conveyor belt 15 Powder recovery tank 16 Transmission belt 17 Bezel 18 Pneumatic dust removal spray gun 19 Molded parts 20 Anode Mechanical Gripper 21 Cathode mechanical gripper 22 Cathode graphite strip 23 Plating tank 24 Electroplating power supply 25

[0031] The present invention will be further described below in conjunction with the accompanying drawings and the accompanying descriptions. DETAILED DESCRIPTION

[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0033] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0036] In one embodiment of the present invention, Figure 1 As shown, a topological structure molded part preparation device includes a molding component, a conveying component and an electroplating component;

[0037] Among them, the molding component is used to energize the mixed powder so that the alloy powder used for molding with a lower melting point and smaller particle size in the mixed powder is thermally melted by a self-heating method, while the metal powder with a higher melting point, larger particle size and stronger oxidizability is evenly distributed and interconnected under pressure and embedded in the molten alloy powder to obtain the molded part. The conveying component is used to convey the molded part. The electroplating component is used to dissolve the unmelted metal powder in the molded part in the electroplating solution in the electroplating tank to obtain a dense, porous, defect-free topological structure molded part.

[0038] The molding assembly is used for molding a molded part 20, and the molding assembly includes an equipment housing 1, a controller 2 connected to one side of the equipment housing 1, and a workbench 3 arranged in the equipment housing 1. A concave powder filling slot 4 is fixed at the bottom of the workbench 3, and the powder filling slot 4 is filled with a mixed powder 10. The mixed powder 10 includes an alloy powder 101 and a metal powder 102. The melting point, particle diameter, and oxidizability of the metal powder 102 are higher than those of the alloy powder 101, and the electrical conductivity of the alloy powder 101 is greater than that of the metal powder 102. An additive substrate 5 is provided at the bottom of the powder filling slot 4, and an additive pressing plate 9 corresponding to the additive substrate 5 is provided above the powder filling slot 4. The additive pressing plate 9 is connected to the top of the equipment housing 1 through a first lifter 12. A plurality of correspondingly arranged first copper electrode units 502 and second copper electrode units 903 are respectively arranged on the substrate 5 and the additive platen 9, a plurality of dot-matrix-distributed insulating partitions 902 are arranged in the additive platen 9, the insulating partitions 902 are slidably connected in the additive platen 9, the second copper electrode unit 903 is arranged between two adjacent insulating partitions 902, the first lifter 12 is used to drive the additive platen 9 and the insulating partition 902 to move toward the additive substrate 5, so that a closed loop is formed between the first copper electrode unit 502, the mixed powder 10 and the second copper electrode unit 903, a powder feeding mechanism 11 for conveying the mixed powder 10 to the powder filling tank 4 is provided on one side of the workbench 3, and a molded part outlet 13 is provided on one side of the equipment housing 1;

[0039] like Figure 2 , 34, wherein the insulating partitions 902 are distributed in a dot matrix manner in the additive platen 9, a plurality of insulating partitions 902 form a grid structure and each of the insulating partitions 902 is independent of each other, and each of the insulating partitions 902 can be controlled by the controller 2 to control the first lifter 12 and then control the movement of a separate insulating partition 902, so in the actual molding process, the shape of the corresponding molded part 20 can be manually set in the controller 2, and the insulating partition 902 of the corresponding shape can be driven to move so that the insulating partition 902 of the corresponding shape extends, and then the additive platen is controlled. 9 is pressed downward as a whole, so that the insulating partition 902 can be inserted into the mixed powder 10, and the mixed powder 10 of corresponding shape is arranged in the insulating partition 902 of corresponding shape, and finally the first copper electrode unit 502 and the second copper electrode unit 903 are energized, so that the alloy powder 101 used for molding with lower melting point and smaller particle size in the mixed powder 10 is melted by self-heating, and the metal powder 102 with higher melting point, larger particle size and stronger oxidizability is evenly distributed and interconnected under pressure and embedded in the molten alloy powder 101 to obtain the molded part 20.

[0040] Specifically, during the molding process of the molded part, the mixed powder 10 is transported to the powder filling tank 4 by the powder feeding mechanism 11, and then the additive pressing plate 9 is controlled to be pressed down as a whole by the first lifter 12, so that the additive pressing plate 9 is on the upper surface of the mixed powder 10, and then the insulating partition 902 of the corresponding shape is controlled to be pressed down by the first lifter 12 according to the shape set by the controller 2 to control the additive pressing plate 9 to be pressed down so that the insulating partition 902 contacts the surface of the additive substrate 5, and then the first copper electrode unit 502 and the second copper electrode unit 903 are energized to complete the molding of the molded part 20;

[0041] It is worth noting that the powder feeding mechanism 11 includes a powder feeding pipe, a valve arranged on the powder feeding pipe and a movable bracket. The powder feeding pipe is movably connected to the equipment housing 1 through the movable bracket, and the valve can control the powder feeding speed of the powder feeding pipe, and the movable bracket can control the powder feeding position of the powder feeding pipe. The powder feeding position and powder feeding speed of the powder feeding pipe can be controlled by the controller 2, and the first lifter 12 is used to control the movement of the additive platen 9, and its moving speed, moving position and pressure can be controlled by the controller 2.

[0042] The conveying assembly is installed at one side of the molding assembly, and is used to convey the molding 20. The conveying assembly includes a conveyor belt 17 arranged at one side of the molding outlet 13.

[0043] Specifically, after the molded part 20 is formed, the molded part 20 is output from the molded part outlet 13 , and then the molded part 20 can be transported to the electroplating assembly through the conveyor belt 17 to complete the electroplating of the molded part 20 .

[0044] The electroplating assembly is installed on one side of the conveying assembly, and is used to electroplate the molded part 20 to form a topological structure molded part. The electroplating assembly includes an electroplating tank 24 arranged on one side of the conveyor belt 17, an electroplating power supply 25 arranged on one side of the electroplating tank 24, and an anode mechanical clamp 21 and a cathode mechanical clamp 22 respectively connected to the positive and negative electrodes of the electroplating power supply 25. The molded part 20 is clamped at the end of the anode mechanical clamp 21, and the end of the cathode mechanical clamp 22 clamps a cathode graphite strip 23;

[0045] Specifically, after the molded part 20 is formed, since the metal powder 12 is not melted in the molded part 20, in order to form a dense, porous, and defect-free topological structure molded part, the molded part 20 needs to be electroplated. Therefore, the molded part 20 is grabbed into the electroplating tank 24 by the anode mechanical clamp 21, and the cathode mechanical clamp 22 grabs the cathode graphite strip 23 into the electroplating tank 24, and the electroplating power supply 25 is started to start the electroplating process. During the electroplating process, the unmelted metal powder 102 in the molded part 20 will be gradually electroplated and dissolved into the electroplating solution, and the corresponding dissolved metal powder 102 will gradually adsorb on the cathode graphite strip 23. When the metal powder 102 is completely dissolved, a dense, porous, and defect-free topological structure molded part can be prepared, and the cathode graphite strip 23 can recover the dissolved metal powder 102;

[0046] It is worth noting that the parts of the anode mechanical clamp 21 and the cathode mechanical clamp 22 extending into the electroplating solution in the electroplating tank 24 are made of conductive carbon fiber material.

[0047] In this embodiment, a scraper push block 7 is provided on one side of the workbench 3, and the scraper push block 7 is arranged corresponding to the molded part outlet 13. A push block guide rail 8 is provided in the equipment housing 1, and the scraper push block 7 is slidably connected to the push block guide rail 8. The bottom surface of the scraper push block 7 is flush with the surface of the workbench 3.

[0048] Specifically, before the molded part 20 is formed, the mixed powder 10 is mainly flattened to keep its surface flat so that the molded part 20 is complete. Although the mixed powder 10 can be flattened by the additive pressing plate 9, since the mixed powder 10 includes alloy powder 101 and metal powder 102 respectively, the effect of flattening the mixed powder 10 by the additive pressing plate 9 is not good. Therefore, after the powder feeding mechanism 11 fills the mixed powder 10 into the powder filling trough 4, the mixed powder 10 is made to exceed the upper surface of the workbench 3, and then the scraper push block 7 is controlled by the controller 2 to move to scrape the surface of the mixed powder 10 flat, and the excess mixed powder 10 will be output from the molded part outlet 13 under the pushing action of the scraper push block 7. At the same time, after the molded part 20 is formed, the molded part 20 can be controlled to rise onto the workbench 3, and the scraper push block 7 can push the molded part 20 through the molded part outlet 13 to the conveyor belt 17.

[0049] In this embodiment, a mesh screen 14 is connected between the conveyor belt 17 and the device housing 1. The mesh screen 14 is arranged on one side of the molded part outlet 13. A powder conveyor belt 15 is fixed to the bottom of the mesh screen 14. A powder recovery tank 16 is provided at one end of the powder conveyor belt 15.

[0050] Specifically, after the scraper push block 7 pushes the excess mixed powder 10 out of the molded part outlet 13, the mixed powder 10 will be filtered by the mesh screen 14 and fall onto the powder conveyor belt 15. The excess mixed powder 10 will be transported to the powder recovery tank 16 by the powder conveyor belt 15 to complete the recycling of the mixed powder 10.

[0051] In this embodiment, a second lifter 6 is provided at the bottom of the additive substrate 5, and the second lifter 6 is used to drive the additive substrate 5 to move toward the workbench 3, and the second lifter 6 is fixed to the bottom of the device housing 1;

[0052] Specifically, after the molded piece 20 is formed, the molded piece 20 is lifted up by the second lifter 6 so that its bottom surface is flush with the surface of the workbench 3, and then the molded piece 20 is pushed onto the conveyor belt 17 by the scraper push block 7 to complete the transportation of the molded piece 20.

[0053] like Figure 5 As shown, in this embodiment, the additive substrate 5 includes an insulating substrate 501, and the first copper electrode units 502 are embedded in the insulating substrate 501 in a dot matrix manner, and the first copper electrode units 502 are not connected to each other;

[0054] Specifically, the insulating substrate 501 has a grid structure and is integrally formed. It is provided with a plurality of mounting holes distributed in a dot matrix. The mounting holes are used to wrap all the first copper electrode units 502. Two adjacent first copper electrode units 502 are isolated by the insulating substrate 501 to ensure that the first copper electrode units 502 are not connected to each other. The insulating substrate 501 is made of high-temperature resistant insulating alumina ceramic material.

[0055] In this embodiment, the additive press plate 9 includes an insulating press plate 901, and the insulating partitions 902 are distributed in the insulating press plate 901 in a dot matrix manner. The insulating press plate 901 is made of an insulating alumina ceramic material;

[0056] Specifically, the insulating pressure plate 901 is arranged on the periphery of the second copper electrode unit 903, and the insulating partition 902 is a grid structure, while the second copper electrode unit 903 is fixed, and each insulating partition 902 can be moved individually to meet the molding of molded parts 20 of different shapes, and the insulating pressure plate 901 is made of high-temperature resistant insulating alumina ceramic material.

[0057] In this embodiment, a baffle 18 is provided on one side of the conveyor belt 17, and a pneumatic dust removal spray gun 19 is provided at the bottom of the conveyor belt 17, and the output end of the pneumatic dust removal spray gun 19 faces the conveyor belt 17;

[0058] Specifically, the baffle 18 can play a blocking role to prevent the molded part 20 from falling off the transmission belt 17. During the process of molding the molded part 20 and pushing it out of the powder filling trough 4, its surface may be contaminated with part of the mixed powder 10. Therefore, the pneumatic dust removal spray gun 19 can blow away the excess mixed powder 10 attached to the surface of the molded part 20.

[0059] In this embodiment, the powder filling tank 4 includes an inner tank and an outer tank, the inner tank is made of insulating alumina ceramic material, the outer tank is made of stainless steel material, the outer tank is integrally arranged with the workbench 3, and the mixed powder 10 is filled in the inner tank;

[0060] Specifically, the inner groove can play an insulating role, and the outer groove can play a protective role, so as to ensure that the molded part 20 can be smoothly molded in the powder filling groove 4.

[0061] In this embodiment, the alloy powder 101 is titanium alloy powder, and the metal powder 102 is metal iron powder;

[0062] Specifically, the titanium alloy powder has a greater heat generation, heats up faster, and melts and forms first due to its smaller particle size and lower melting point, while the metal iron powder has better conductivity, is not easy to heat up, and has a larger particle size and a higher melting point. It remains in a powder particle state under high temperature conditions. At the same time, under the action of pressure, after the molded part 20 is formed, the metal iron powder is interconnected and evenly embedded in the molded part 20. Subsequently, the metal iron powder with stronger oxidizability in the molded part 20 is dissolved at the anode in the electroplating solution, so that the molded part 20 forms a dense, uniform and porous topological structure molded part;

[0063] It is worth noting that the particle diameter of the alloy powder 101 is at least one order of magnitude smaller than the particle diameter of the metal powder 102 , and the alloy powder 101 may also be a nickel-titanium alloy or a cobalt-based alloy.

[0064] Embodiment 2

[0065] like Figure 6 As shown, the second embodiment of the present invention provides a method for preparing a topological structure molded part, using the topological structure molded part preparation device in the first embodiment, and the method comprises:

[0066] S1, forming of molded parts: the mixed powder 10 is filled into the powder filling tank 4 through the powder feeding mechanism 11, the additive pressing plate 9 is lowered to the surface of the mixed powder 10 through the first lifter 12, and then the insulating partition 902 corresponding to the shape of the molded part 20 is pushed out, and then the additive pressing plate 9 is pressed down as a whole so that the insulating partition 902 is against the surface of the additive substrate 5, and the first copper electrode unit 502 and the second copper electrode unit 903 at the position corresponding to the shape of the molded part 20 are energized, so that the alloy powder 101 for molding with a lower melting point and a smaller particle size in the mixed powder 10 is thermally melted by a self-heating method, and the metal powder 102 with a higher melting point, a larger particle size and a stronger oxidizability is uniformly distributed and interconnected under pressure and embedded in the molten alloy powder 101, so as to obtain the molded part 20;

[0067] S2. Topological structure molded part molding: the molded part 20 is grasped by the anode mechanical clamp 21 and placed in the electroplating tank 24, and the cathode graphite strip 23 is grasped by the cathode mechanical clamp 22 and placed in the electroplating tank 24, and the electroplating power supply 25 is started to start electroplating of the molded part 20, so that the unmelted metal powder 102 in the molded part 20 is dissolved in the electroplating solution in the electroplating tank 24, so as to obtain a dense, porous, and defect-free topological structure molded part.

[0068] In summary, the topological structure molded part preparation device and preparation method in the above-mentioned embodiment of the present invention extrude the mixed powder 10 through the additive pressing plate 9, and energize the first copper electrode unit 502 and the second copper electrode unit 903 at the shape position corresponding to the molded part 20, so that the alloy powder 101 for molding with a lower melting point and a smaller particle size in the mixed powder 10 is thermally melted by a self-heating method, and the metal powder 102 with a higher melting point, a larger particle size and a stronger oxidizability is evenly distributed and interconnected under the action of pressure and embedded in the melted alloy powder. 101, to obtain a molded part 20, and then put the molded part 20 into the electroplating tank 24 for electroplating treatment to remove the unmelted metal powder 102, so as to obtain a dense, porous and defect-free topological structure molded part. The present invention not only effectively avoids the problems of cracking, warping, deformation and the like that are prone to occur in resistive thermal additive manufacturing, but also simplifies the operation and further improves the production efficiency. Moreover, through the subsequent electroplating dissolution technology, a porous, dense and defect-free topological structure molded part can be quickly prepared, which has great application potential in the field of additive manufacturing and topological structure materials.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for preparing a topological structure molded part, characterized in that: include: A molding component is used for molding a molded part, the molding component includes an equipment housing, a controller connected to one side of the equipment housing, and a workbench arranged in the equipment housing, a concave powder filling slot is fixed at the bottom of the workbench, the powder filling slot is filled with mixed powder, the mixed powder includes alloy powder and metal powder, the melting point, particle diameter, and oxidizability of the metal powder are higher than those of the alloy powder, the electrical conductivity of the alloy powder is greater than that of the metal powder, an additive substrate is provided at the bottom of the powder filling slot, an additive pressure plate corresponding to the additive substrate is provided above the powder filling slot, the additive pressure plate is connected to the top of the equipment housing through a first lifter, and the The additive substrate and the additive platen are respectively provided with a plurality of correspondingly arranged first copper electrode units and second copper electrode units, the additive platen is provided with a plurality of insulating partitions distributed in a dot matrix, the insulating partitions are slidably connected in the additive platen, the second copper electrode unit is arranged between two adjacent insulating partitions, the first lifter is used to drive the additive platen and the insulating partition to move toward the additive substrate, so that a closed loop is formed between the first copper electrode unit, the mixed powder and the second copper electrode unit, a powder feeding mechanism for conveying the mixed powder to the powder filling tank is provided on one side of the workbench, and a molded part outlet is provided on one side of the equipment housing; A conveying assembly installed on one side of the molding assembly, which is used to convey the moldings, and the conveying assembly includes a conveyor belt arranged on one side of the molding outlet; An electroplating assembly is installed on one side of the conveying assembly, and is used to electroplate the molded part to form a topological structure molded part. The electroplating assembly includes an electroplating tank arranged on one side of the conveyor belt, an electroplating power supply arranged on one side of the electroplating tank, and an anode mechanical clamp and a cathode mechanical clamp respectively connected to the positive electrode and the negative electrode of the electroplating power supply. The molded part is clamped at the end of the anode mechanical clamp, and the end of the cathode mechanical clamp holds a cathode graphite strip; The metal powder is metal iron powder.

2. The topological structure molded part preparation device according to claim 1, characterized in that: A scraper push block is provided on one side of the workbench, and the scraper push block is arranged corresponding to the molded part outlet. A push block guide rail is provided in the equipment shell, and the scraper push block is slidably connected to the push block guide rail. The bottom surface of the scraper push block is flush with the surface of the workbench.

3. The topological structure molded part preparation device according to claim 2, characterized in that: A mesh screen is connected between the conveyor belt and the equipment housing, the mesh screen is arranged on one side of the molded part outlet, a powder conveyor belt is fixed to the bottom of the mesh screen, and a powder recovery groove is provided at one end of the powder conveyor belt.

4. The topological structure molded part preparation device according to claim 1, characterized in that: A second lifter is provided at the bottom of the additive substrate, and the second lifter is used to drive the additive substrate to move toward the workbench, and the second lifter is fixed to the bottom of the device housing.

5. The topological structure molded part preparation device according to claim 1, characterized in that: The additive substrate includes an insulating substrate, the first copper electrode units are embedded in the insulating substrate in a dot matrix, and the first copper electrode units are not connected to each other.

6. The topological structure molded part preparation device according to claim 1, characterized in that: The additive press plate comprises an insulating press plate, the insulating partitions are distributed in the insulating press plate in a lattice manner, and the insulating press plate is made of an insulating alumina ceramic material.

7. The topological structure molded part preparation device according to claim 1, characterized in that: A baffle is provided on one side of the conveyor belt, and a pneumatic dust removal spray gun is provided at the bottom of the conveyor belt, and the output end of the pneumatic dust removal spray gun faces the conveyor belt.

8. The topological structure molded part preparation device according to claim 1, characterized in that: The powder filling tank comprises an inner tank and an outer tank, the inner tank is made of insulating alumina ceramic material, the outer tank is made of stainless steel material, the outer tank is integrally arranged with the workbench, and the mixed powder is filled in the inner tank.

9. The topological structure molded part preparation device according to claim 1, characterized in that: The alloy powder is titanium alloy powder.

10. A method for preparing a topological structure molded part, using the topological structure molded part preparation device according to any one of claims 1 to 9, the method comprising: Molding: the mixed powder is filled into the powder filling tank by the powder feeding mechanism, the additive pressing plate is lowered to the surface of the mixed powder by the first lifter, and the insulating partition corresponding to the shape of the molded part is pushed out, and then the additive pressing plate is pressed down as a whole so that the insulating partition is against the surface of the additive substrate, and the first copper electrode unit and the second copper electrode unit at the position corresponding to the shape of the molded part are energized, so that the alloy powder for molding with a lower melting point and a smaller particle size in the mixed powder is thermally melted by a self-heating method, and the metal powder with a higher melting point, a larger particle size and a stronger oxidizability is uniformly distributed and interconnected under pressure and embedded in the molten alloy powder to obtain the molded part; Molding of topological structure molded parts: the molded part is grabbed by the anode mechanical clamp and placed in the electroplating tank, and the cathode graphite strip is grabbed by the cathode mechanical clamp and placed in the electroplating tank, and the electroplating power supply is started to start electroplating of the molded part, so that the unmelted metal powder in the molded part is dissolved in the electroplating solution in the electroplating tank, so as to obtain a dense, porous, and defect-free topological structure molded part.

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