Spot welding inspection method and device, electronic equipment and storage medium

Abstract

The application is suitable for the technical field of spot welding level inspection of gold-tin cover plate, and provides a spot welding inspection method, device, electronic equipment and storage medium. The spot welding inspection method comprises the following steps: placing the gold-tin cover plate treated by spot welding into a heating device; controlling the heating device to perform temperature changing heating on the gold-tin cover plate according to preset packaging process conditions; taking out the gold-tin cover plate from the heating device and cooling it to a preset temperature after the temperature changing heating is completed; obtaining the morphology of the solder of the gold-tin cover plate after the gold-tin cover plate is cooled to the preset temperature; and determining whether the spot welding process level of the gold-tin cover plate is qualified according to the morphology of the solder of the gold-tin cover plate. The application can determine whether the spot welding process level of the gold-tin cover plate is qualified before packaging, thereby helping to investigate whether the air leakage problem of the sealed gold-tin cover plate is caused by the spot welding process level.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of spot welding level inspection of gold-tin cover plates, and particularly relates to a spot welding inspection method and device, an electronic device, and a storage medium. BACKGROUND

[0002] Currently, a spot welding process is used to realize solder prepositioning of a gold-tin cover plate, that is, solder is first horizontally placed on the surface of the cover plate, and then local heating is performed on the solder at positions such as four corners of the solder through resistance heating, laser heating, ultrasonic resonance, and the like. After the solder is locally melted, the solder is fused to the surface of the cover plate to form a welding spot, and solder prepositioning is realized. This method can greatly improve the convenience of cover plate sealing.

[0003] However, in actual application, if a leakage phenomenon occurs at the spot welding position after the cover plate is sealed, it is impossible to determine whether the fault reason is the solder itself or the spot welding process level. Moreover, in the current factory entry test of the cover plate, the detection standard for the spot welding level still stays in the aspect of appearance detection, such as observing the roundness of the welding spot, the size consistency of the welding spot, and whether the welding spot falls off or not. However, for the welding spot process problem causing the leakage phenomenon of the cover plate, it is impossible to determine the problem through the above appearance detection. SUMMARY

[0004] The embodiments of the application provide a welding inspection method and device, an electronic device, and a storage medium to solve the problem that it is difficult to determine the reason for the leakage of a gold-tin cover plate after sealing.

[0005] The application is implemented through the following technical solutions:

[0006] In a first aspect, the embodiments of the application provide a spot welding inspection method, including: horizontally placing a gold-tin cover plate processed by spot welding into a heating device, controlling the heating device to perform temperature changing heating on the gold-tin cover plate according to preset packaging process conditions; after the temperature changing heating ends, taking the gold-tin cover plate out of the heating device and cooling it to a preset temperature; after the gold-tin cover plate is cooled to the preset temperature, obtaining the morphology of solder of the gold-tin cover plate; and determining whether the spot welding process level of the gold-tin cover plate is qualified according to the morphology of the solder of the gold-tin cover plate.

[0007] In combination with the first aspect, in some embodiments, the preset packaging process conditions include a first preset temperature range, a second preset temperature range, a third preset temperature range, a first preset time length, and a second preset time length, wherein the maximum value of the first preset temperature range is less than the minimum value of the second preset temperature range, the maximum value of the third preset temperature range is less than the minimum value of the first preset temperature range, and the first preset time length is less than or equal to the second preset time length.

[0008] The method of controlling the heating device to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions includes: raising the temperature of the heating device to the first preset temperature range, heating the gold-tin cover plate, and keeping it warm for the first preset time; after keeping it warm for the first preset time, raising the temperature of the heating device to the second preset temperature range, heating the gold-tin cover plate, and keeping it warm for the second preset time; after keeping it warm for the second preset time, cooling the heating device to the third preset temperature range according to a preset cooling rate.

[0009] In combination with the first aspect, in some embodiments, obtaining the morphology of the solder of the gold-tin cover plate includes: obtaining a high-magnification image of the solder of the gold-tin cover plate under a microscope, wherein the high-magnification image includes morphology information of the solder of the gold-tin cover plate;

[0010] The determining whether the spot welding process level of the gold-tin cover plate is qualified based on the morphology of the solder portion of the gold-tin cover plate includes: inputting the high-magnification image into a solder point analysis model to obtain a detection result of the spot welding process level of the gold-tin cover plate; wherein the input data of the solder point analysis model is an image containing morphology information of the solder portion of the cover plate, and the output data of the solder point analysis model is a detection result of whether the spot welding process level is qualified.

[0011] In combination with the first aspect, in some embodiments, the solder joint analysis model includes an image processing unit and a spot welding judgment unit. The image processing unit determines the solder color and solder joint status at the solder joint of the cover plate based on an image containing morphological information of the solder joint of the cover plate. The spot welding judgment unit determines whether the solder color at the solder joint of the cover plate is bright and whether the solder has changed color according to the solder color at the solder joint of the cover plate, and determines whether the solder joint is smooth and flat and whether the solder joint has abnormal protrusions according to the solder joint status. If the solder color at the solder joint is bright, the solder has not changed color, the solder joint is smooth and flat, and there is no abnormal protrusion on the solder joint, then the spot welding process level is judged to be qualified.

[0012] In combination with the first aspect, in some embodiments, inputting the high-magnification image into the solder joint analysis model to obtain the detection result of the spot welding process level of the gold-tin cover plate includes: preprocessing the high-magnification image, wherein the preprocessing includes adjusting the image size to a preset size and / or image normalization; inputting the preprocessed high-magnification image into the solder joint analysis model to obtain the detection result of the spot welding process level of the gold-tin cover plate.

[0013] In combination with the first aspect, in some embodiments, the first preset temperature range is 230°C to 270°C, the second preset temperature range is 310°C to 350°C, the third preset temperature range is less than 100°C, the first preset time length is 2min to 5min, and the second preset time length is 2min to 10min.

[0014] In combination with the first aspect, in some embodiments, the heating device is one of a heater, a tubular brazing furnace, a chain brazing furnace, a reflow furnace, and a vacuum furnace.

[0015] In a second aspect, an embodiment of the present application provides a spot welding inspection device, comprising: a heating test module, used to place a gold-tin cover plate after spot welding horizontally into a heating device, and control the heating device to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions; a cooling module, used to remove the gold-tin cover plate from the heating device and cool it to a preset temperature after the variable temperature heating is completed; an inspection target acquisition module, used to obtain the morphology of the solder of the gold-tin cover plate after the gold-tin cover plate is cooled to the preset temperature; and an inspection module, used to determine whether the spot welding process level of the gold-tin cover plate is qualified based on the morphology of the solder of the gold-tin cover plate.

[0016] In a third aspect, an embodiment of the present application provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the spot welding inspection method as described in any one of the first aspects is implemented.

[0017] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the spot welding inspection method as described in any one of the first aspects is implemented.

[0018] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on an electronic device, the electronic device executes the spot welding inspection method described in any one of the first aspects above.

[0019] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0020] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0021] The embodiment of the present application provides a spot welding inspection method, device, electronic device and storage medium. The method first places a gold-tin cover plate after spot welding horizontally into a heating device. According to preset packaging process conditions, the heating device is controlled to perform variable temperature heating on the gold-tin cover plate. After heating, the gold-tin cover plate is removed from the heating device and cooled to a preset temperature. Then, the morphology of the solder of the gold-tin cover plate is obtained. Finally, based on the morphology of the solder of the gold-tin cover plate, it is determined whether the spot welding process level of the gold-tin cover plate is qualified. That is, the embodiment of the present application performs variable temperature heating on the gold-tin cover plate under preset packaging process conditions, and then determines whether the spot welding process level is qualified based on the morphology of the solder. Therefore, it is possible to determine whether the spot welding process level of such a gold-tin cover plate is qualified before packaging and use, thereby helping to troubleshoot whether the leakage problem after the gold-tin cover plate is sealed is caused by the spot welding process level.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 This is the appearance of a solder joint at one corner of the solder of a gold-tin cover plate after spot welding provided in one embodiment of the present application under a 40x microscope;

[0025] Figure 2 This is the appearance of a solder joint at one corner of the solder of a gold-tin cover plate after spot welding provided in one embodiment of the present application under a 200x microscope;

[0026] Figure 3 is a schematic flow chart of a spot welding inspection method provided in one embodiment of the present application;

[0027] Figure 4 The gold-tin cover plate after spot welding provided in one embodiment of the present application;

[0028] Figure 5 The gold-tin cover plate provided in one embodiment of the present application and having passed the spot welding inspection and qualified process level;

[0029] Figure 6 This is a schematic diagram showing an unusual protrusion at a solder joint of a gold-tin cover plate after variable temperature heating according to an embodiment of the present application;

[0030] Figure 7Schematic diagram of the structure of the spot welding inspection device provided in an embodiment of the present application;

[0031] Figure 8 It is a structural diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0033] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0034] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0035] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0036] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0037] Reference within the specification of this application to "one embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" in various places within specifications are not necessarily all referring to the same embodiment, however, are meant to signify that "one or more, but not all embodiments" of the application so described are contemplated to develop a fully enabled application. The terms "including," "comprising," "having," and variations thereof, mean "including but not limited to," unless expressly specified otherwise.

[0038] In the related art, the way of pre-placing gold-tin solder on the cover plate through the spot welding process greatly improves the convenience of the cover plate sealing, but at the same time introduces new reliability risks. In actual packaging application process, if the cover plate leaks after sealing, it is usually difficult to effectively locate the fault cause as the solder itself or the spot welding process level, because the cover plate has been sealed and the internal welding point situation cannot be specifically investigated.

[0039] Exemplary, Figure 1 The figure shows the morphology of the welding spot at the corner of the gold-tin solder of the cover plate after spot welding treatment in an embodiment of the application under 40 times microscope, Figure 2 The figure shows the morphology of the welding spot at the corner of the gold-tin solder of the cover plate after spot welding treatment in an embodiment of the application under 200 times microscope.

[0040] Regarding the spot welding process, the spot welding process level is affected by the power size and heating time of the spot welding equipment. Specifically, the smaller the power of the spot welding equipment and the shorter the heating time, the lower the reliability risk of the welding spot, that is, the smaller the risk of leakage after sealing, but the welding spot will also be smaller, and the smaller the welding spot, the worse the firmness of the welding spot, and the solder is more likely to fall off; the larger the power of the spot welding equipment and the longer the heating time, the larger the welding spot, so the firmness of the solder is better, but at this time the reliability risk of the welding spot will be higher, that is, the risk of leakage after sealing is larger. Therefore, the spot welding process level is closely related to the leakage problem after the cover plate is sealed, but the detection standard of the current spot welding process level still stays in the appearance aspect, such as welding spot roundness inspection, welding spot size consistency inspection and welding spot falling off inspection. These detection items cannot determine whether the cover plate will have the problem of leakage after sealing, therefore, at present, a more effective spot welding process level inspection method is urgently needed to inspect whether the cover plate after spot welding treatment has the risk of leakage after sealing, and to solve the problem that the cause of the leakage problem of the gold-tin cover plate after sealing is difficult to locate.

[0041] Based on the above problems, an embodiment of the present application provides a spot welding inspection method, which performs variable temperature heating treatment on the gold-tin cover plate under preset packaging process conditions, and then determines whether the spot welding process level is qualified based on the morphology of the solder. In this way, it is possible to determine whether the spot welding process level of the gold-tin cover plate is qualified before packaging and use, and then help to check whether the air leakage problem after the gold-tin cover plate is sealed is caused by the spot welding process level.

[0042] Optionally, Figure 3 This is a schematic flow chart of a spot welding inspection method provided in one embodiment of the present application, with reference to Figure 3 , the spot welding inspection method is described in detail as follows:

[0043] S101, placing the gold-tin cover plate after spot welding horizontally into a heating device, and controlling the heating device to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions.

[0044] The gold-tin cover plate is placed with the solder surface facing upwards.

[0045] In some embodiments, the above-mentioned gold-tin cover plates can be a preset number of products from the same batch of gold-tin cover plates from the same manufacturer, which are used as random inspection samples for spot welding process level inspection. The quality of the spot welding process level of the preset number of random inspection samples can reflect the overall quality of the spot welding process level of the batch of gold-tin cover plates.

[0046] In some embodiments, the heating device can be a heater, a tubular brazing furnace, a chain brazing furnace, a reflow oven, or a vacuum furnace, or other heating equipment capable of performing packaging processing. During the actual inspection process, the heating device used for inspection can be determined based on the packaging equipment model of the user of the current batch of gold-tin cover plates.

[0047] In the embodiments of the present application, to ensure that the heating process of the AuSn cover plate is consistent with the actual sealing test process and to prevent the generation of excess oxides, a protective gas can be introduced into the heating device before the heating device begins, and the protective gas can be continuously introduced during the variable temperature heating process. For example, the protective gas can be nitrogen.

[0048] In some embodiments, the preset packaging process conditions may include a first preset temperature range, a second preset temperature range, a third preset temperature range, a first preset duration, and a second preset duration. The maximum value of the first preset temperature range is less than the minimum value of the second preset temperature range, the maximum value of the third preset temperature range is less than the minimum value of the first preset temperature range, and the first preset duration is less than or equal to the second preset duration.

[0049] Exemplarily, in one possible implementation, the first preset temperature range can be 230°C to 270°C, the second preset temperature range can be 310°C to 350°C, the third preset temperature range can be less than 100°C, the first preset time length can be 2min to 5min, and the second preset time length can be 2min to 10min.

[0050] In some embodiments, the above step S101 of controlling the heating device to perform variable temperature heating on the AuSn cover plate according to the preset packaging process conditions may specifically include the following steps S201 to S203:

[0051] S201, raising the temperature of the heating device to a first preset temperature range, heating the gold-tin cover plate, and keeping the temperature for a first preset time.

[0052] S202, after keeping the temperature for the first preset time, raising the temperature of the heating device to a second preset temperature range, heating the gold-tin cover plate, and keeping the temperature for the second preset time.

[0053] S203, after keeping the temperature for the second preset time, cool the heating device to a third preset temperature range according to a preset cooling rate.

[0054] S102, after the variable temperature heating is completed, the gold-tin cover plate is taken out from the heating device and cooled to a preset temperature.

[0055] In other embodiments, the above-mentioned packaging process conditions may be the packaging process conditions of the user of the current batch of gold-tin cover plates, which can ensure that the test conditions during the inspection process are the same as the test conditions during actual packaging use, thereby making the inspection results more accurate.

[0056] In some embodiments, the preset temperature may be room temperature. For example, after the variable temperature heating is completed, the AuSn cover plate may be removed from the heating device and cooled to room temperature (25 degrees Celsius).

[0057] S103 , after the AuSn cover plate is cooled to a preset temperature, the morphology of the solder of the AuSn cover plate is obtained.

[0058] In some embodiments, obtaining the morphology of the solder of the gold-tin cover plate in step S103 may include obtaining a high-magnification image of the solder of the gold-tin cover plate under a microscope, wherein the high-magnification image includes morphology information of the solder of the gold-tin cover plate.

[0059] In other embodiments, obtaining the morphology of the solder of the gold-tin cover plate in the above step S103 may include: taking a cover plate image of the solder of the gold-tin cover plate by a camera device, and the cover plate image includes morphology information of the solder of the gold-tin cover plate.

[0060] S104, determining whether the spot welding process level of the gold-tin cover plate is qualified based on the morphology of the solder portion of the gold-tin cover plate.

[0061] In some embodiments, when spot welding a gold-tin cover plate, local high-temperature heating causes the gold-tin solder at the soldering point to undergo a chemical reaction, oxidizing it into gold-tin oxides. The melting point of these gold-tin oxides is generally higher than that of the Au80Sn20 alloy. When the spot welding heating time is too long, a large amount of gold-tin oxides is easily generated, causing the proportion of gold-tin oxides to be too large; when the spot welding power is too high, gold-tin oxides with extremely high melting points are easily generated. When the proportion of these gold-tin oxides is too large, or when gold-tin oxides with extremely high melting points are generated, the airtightness of the gold-tin cover plate will eventually be affected. In the embodiments of the present application, this phenomenon that affects the airtightness of the cover plate can be determined as a change in solder joint properties.

[0062] In the above step S104, whether the spot welding process level of the gold-tin cover plate is qualified is determined based on the morphology of the solder part of the gold-tin cover plate. That is, based on the morphology of the solder part of the gold-tin cover plate, it is judged whether there is solder joint deformation of the gold-tin cover plate subjected to variable temperature heating under the packaging process conditions. If solder joint deformation is detected, the spot welding process level of the gold-tin cover plate is unqualified. If solder joint deformation is detected, the spot welding process level of the gold-tin cover plate is qualified.

[0063] In some embodiments, the specific implementation process of the above step S104 may include: inputting the above high-magnification image into a solder joint analysis model to obtain a test result of the spot welding process level of the gold-tin cover plate. The input data of the solder joint analysis model is an image containing morphological information of the solder portion of the cover plate, and the output data of the solder joint analysis model is a test result of whether the spot welding process level is qualified.

[0064] Optionally, the above-mentioned welding spot analysis model may include an image processing unit and a spot welding judgment unit.

[0065] The image processing unit determines the color of the solder and the state of the solder joints at the solder joints of the cover plate based on an image containing topographic information of the solder joints of the cover plate. The spot welding judgment unit determines, based on the color of the solder at the solder joints of the cover plate, whether the solder color at the solder joints is bright and whether the solder has changed color. Furthermore, based on the state of the solder joints, the unit determines whether the solder joints are smooth and flat and whether they have any unusual protrusions. If the solder color at the solder joints is bright, the solder has not changed color, the solder joints are smooth and flat, and there are no unusual protrusions, the spot welding process is judged to be qualified.

[0066] It should be noted that the above-mentioned cover plate includes but is not limited to a gold-tin cover plate.

[0067] In some embodiments, the solder color determined by the image processing unit can include at least one of gray, silver white, black, and blue, and other conventional solder colors are not listed here. When the solder color includes black or blue, it can be determined that the solder has changed color. The change in solder color can reflect that too much gold-tin oxide or gold-tin oxide with a very high melting point is generated during spot welding, resulting in incomplete melting of the solder when heated under packaging process conditions, and the appearance of gold-tin oxide on the surface of the solder.

[0068] Similarly, the above-mentioned solder color, smooth and flat weld, and no unusual protrusions on the weld, etc. can reflect that the processing conditions during spot welding are reasonable and do not produce too much or gold-tin oxide with a very high melting point.

[0069] Further, the above-mentioned inputting the high-magnification image into the weld analysis model to obtain the detection result of the spot welding process level of the gold-tin cover plate can further include steps S301 to S302:

[0070] S301, pre-processing the high-magnification image, which can include adjusting the image size to a predetermined size and / or image normalization.

[0071] S302, inputting the pre-processed high-magnification image into the weld analysis model to obtain the detection result of the spot welding process level of the gold-tin cover plate.

[0072] Here, the embodiment can adjust the size of the image input into the weld analysis model based on actual conditions, and can also normalize the image input into the weld analysis model, thereby meeting different application needs.

[0073] In addition, after obtaining the above-mentioned high-magnification image, when determining whether the spot welding process level of the gold-tin cover plate is qualified according to the above-mentioned high-magnification image, the above-mentioned high-magnification image can also be compared with a pre-stored high-magnification image, which is a morphology image of the solder of the gold-tin cover plate obtained by a microscope when the spot welding process level of the gold-tin cover plate is qualified, and then, according to the comparison result, it is determined whether the spot welding process level of the gold-tin cover plate is qualified. For example, the embodiment can compare the similarity of the above-mentioned high-magnification image and the pre-stored high-magnification image, and when the similarity obtained by comparison is greater than a pre-set similarity threshold, it is determined that the spot welding process level of the above-mentioned gold-tin cover plate is qualified. The pre-set similarity threshold can be set according to actual conditions, for example, 95%.

[0074] Figure 4 An image of a gold-tin cover plate after spot welding processing provided by an embodiment of the present application is shown, referring to FIG. 1. Figure 4 There is a weld at each corner of the gold-tin cover plate. Figure 5 An image of a gold-tin cover plate whose spot welding inspection process level is qualified after inspection provided by an embodiment of the present application is shown, referring to FIG. 2.Figure 5 After the gold-tin cover plate is heated and melted at variable temperatures, the solder is bright in color, the solder joints are smooth and flat, and there are no unusual protrusions on the solder joints. Since the color is not reflected in the attached drawings, the above does not directly state that the solder has not changed color. In the actual test results, the solder of the gold-tin cover plate has neither turned black nor bluish, that is, the solder has not changed color. Figure 6 A schematic diagram of an embodiment of the present application showing that the solder joints of the gold-tin cover plate have unusual protrusions after variable temperature heating, as shown in FIG. Figure 6 As shown, solder bumps 610, 620, and 630 are all abnormal bumps. These abnormal bumps are gold-tin oxides that are not easily melted under packaging process conditions, which can reflect that the spot welding process level of the gold-tin cover plate is unqualified.

[0075] In some embodiments, in order to more clearly distinguish the morphological changes at the solder of the gold-tin cover plate that has been heated under packaging process conditions, thereby making the inspection results more accurate, before the above-mentioned step S101, the above-mentioned spot welding inspection method may further include: obtaining an initial cover plate image of the gold-tin cover plate after spot welding treatment.

[0076] In some embodiments, the image processing unit can also determine the solder state at the solder of the cover plate based on an image containing the topographic information of the solder of the cover plate. The spot welding judgment unit determines whether the solder has no breakpoints or gaps based on the solder state at the solder of the cover plate. The spot welding judgment unit can also determine the solder width based on the solder state at the solder, and determine whether the solder width exceeds a preset ratio compared to the diffusion or retraction before melting, combined with the initial cover plate image of the gold-tin cover plate after spot welding. For example, it can be determined whether the solder width exceeds 20% compared to the diffusion or retraction before melting. If it exceeds 20%, it means that the processing conditions during the spot welding process are unreasonable.

[0077] The spot welding inspection method provided in the embodiment of the present application first places the gold-tin cover plate after spot welding horizontally into a heating device, and controls the heating device to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions. After the heating is completed, the gold-tin cover plate is taken out of the heating device and cooled to a preset temperature, and then the morphology of the solder of the gold-tin cover plate is obtained. Finally, based on the morphology of the solder of the gold-tin cover plate, it is determined whether the spot welding process level of the gold-tin cover plate is qualified. The qualification of the spot welding process level of the gold-tin cover plate can be determined before packaging and use, thereby helping to check whether the leakage problem after the gold-tin cover plate is sealed is caused by the spot welding process level.

[0078] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0079] Corresponding to the spot welding inspection method described in the above embodiment,Figure 7 A structural block diagram of a spot welding inspection device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0080] See also Figure 7 The spot welding inspection device in the embodiment of the present application may include a heating test module 710 , a cooling module 720 , an inspection target acquisition module 730 and an inspection module 740 .

[0081] The heating test module 710 is used to place the gold-tin cover plate after spot welding horizontally into the heating device, and control the heating device to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions.

[0082] The cooling module 720 is used to remove the AuSn cover plate from the heating device and cool it to a preset temperature after the variable temperature heating is completed.

[0083] The inspection target acquisition module 730 is used to acquire the morphology of the solder of the AuSn cover plate after the AuSn cover plate is cooled to a preset temperature.

[0084] The inspection module 740 is used to determine whether the spot welding process level of the AuSn cover plate is qualified according to the morphology of the solder portion of the AuSn cover plate.

[0085] Optionally, the heating test module may further include a first heating unit 711 , a second heating unit 712 and a cooling unit 713 .

[0086] The first heating unit 711 is used to heat the heating device to a first preset temperature range, heat the gold-tin cover plate, and keep it warm for a first preset time.

[0087] The second heating unit 712 is used to heat the heating device to a second preset temperature range after keeping the temperature at a first preset time, to heat the gold-tin cover plate, and to keep the temperature at a second preset time.

[0088] The cooling unit 713 cools the heating device to a third preset temperature range according to a preset cooling rate after keeping the temperature for the second preset time period.

[0089] Optionally, the inspection target acquisition module 730 may be specifically configured to: acquire a high-magnification image of the solder portion of the gold-tin cover plate under a microscope, wherein the high-magnification image includes morphology information of the solder portion of the gold-tin cover plate.

[0090] Optionally, the inspection module 740 can be specifically used to: input the high-magnification image into the solder point analysis model to obtain the detection result of the spot welding process level of the gold-tin cover plate; wherein, the input data of the solder point analysis model is an image containing the morphology information of the solder at the cover plate, and the output data of the solder point analysis model is the detection result of whether the spot welding process level is qualified.

[0091] Furthermore, the inspection module 740 can be specifically used to: preprocess the high-magnification image, the preprocessing including adjusting the image size to a preset size and / or image normalization; inputting the preprocessed high-magnification image into the solder joint analysis model to obtain the detection results of the spot welding process level of the gold-tin cover plate.

[0092] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment section and will not be repeated here.

[0093] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0094] The present application also provides an electronic device. Figure 8 The electronic device 800 may include: at least one processor 810, a memory 820, and a computer program stored in the memory 820 and executable on the at least one processor 810. When the processor 810 executes the computer program, the steps in any of the above-mentioned method embodiments are implemented, for example Figure 1 Alternatively, when the processor 810 executes the computer program, the functions of the modules / units in the above-mentioned device embodiments are realized, for example, Figure 7 Functions of modules 710 to 740 are shown.

[0095] For example, the computer program may be divided into one or more modules / units, one or more modules / units being stored in the memory 820 and executed by the processor 810 to complete the present application. The one or more modules / units may be a series of computer program segments capable of completing specific functions, and the program segments are used to describe the execution process of the computer program in the electronic device 800.

[0096] Those skilled in the art will understand that Figure 8 These are merely examples of electronic devices and do not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown in the figure, or a combination of certain components, or different components, such as input and output devices, network access devices, buses, etc.

[0097] The processor 810 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0098] The memory 820 can be an internal storage unit of the electronic device or an external storage device of the electronic device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. The memory 820 is used to store the computer program and other programs and data required by the electronic device. The memory 820 can also be used to temporarily store data that has been output or is about to be output.

[0099] The spot welding inspection method provided in the embodiment of the present application can be applied to electronic equipment such as industrial management equipment and computers. The embodiment of the present application does not impose any restrictions on the specific type of electronic equipment.

[0100] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in each embodiment of the above-mentioned spot welding inspection method can be implemented.

[0101] An embodiment of the present application provides a computer program product. When the computer program product is run on a mobile terminal, the mobile terminal can implement the steps in each embodiment of the above-mentioned spot welding inspection method when executing the computer program product.

[0102] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process in the above-mentioned embodiment method by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, it can implement the steps of each of the above-mentioned method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the camera / electronic device, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. For example, USB flash drive, mobile hard disk, magnetic disk or optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0103] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0104] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0105] In the embodiments provided in the present application, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely schematic. For example, the division of the modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0106] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may also be distributed to multiple network units. Part or all of the units can be selected to achieve the purpose of the embodiment scheme according to actual needs.

[0107] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A spot welding inspection method, characterized in that: include: The gold-tin cover plate after spot welding is placed horizontally in a heating device, and the heating device is controlled to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions; After the variable temperature heating is completed, the gold-tin cover plate is taken out from the heating device and cooled to a preset temperature; After the AuSn cover plate is cooled to the preset temperature, a high-magnification image of the solder portion of the AuSn cover plate is obtained under a microscope, wherein the high-magnification image includes morphological information of the solder portion of the AuSn cover plate; The high-magnification image is input into a solder joint analysis model to obtain a detection result of the spot welding process level of the gold-tin cover plate; wherein, the input data of the solder joint analysis model is an image containing the morphology information of the solder at the cover plate, and the output data of the solder joint analysis model is a detection result of whether the spot welding process level is qualified; the solder joint analysis model includes an image processing unit and a spot welding judgment unit, and the image processing unit determines the solder color and solder joint status of the solder at the cover plate based on the image containing the morphology information of the solder at the cover plate; the spot welding judgment unit determines whether the solder color at the solder at the cover plate is bright and whether the solder has changed color according to the solder color at the solder at the cover plate, and determines whether the solder is smooth and flat and whether the solder has abnormal protrusions according to the solder joint status; if the solder color at the solder is bright, the solder has not changed color, the solder is smooth and flat, and there is no abnormal protrusion on the solder, then the spot welding process level is judged to be qualified.

2. The spot welding inspection method according to claim 1, wherein: The preset packaging process conditions include a first preset temperature range, a second preset temperature range, a third preset temperature range, a first preset time, and a second preset time, wherein the maximum value of the first preset temperature range is less than the minimum value of the second preset temperature range, the maximum value of the third preset temperature range is less than the minimum value of the first preset temperature range, and the first preset time is less than or equal to the second preset time; According to the preset packaging process conditions, controlling the heating device to perform variable temperature heating on the gold-tin cover plate includes: Raising the temperature of the heating device to the first preset temperature range, heating the gold-tin cover plate, and keeping the temperature for the first preset time; After the first preset time period, the heating device is heated to the second preset temperature range to heat the gold-tin cover plate and the heat is maintained for the second preset time period; After keeping the temperature for the second preset time period, the heating device is cooled down to the third preset temperature range according to a preset cooling rate.

3. The spot welding inspection method according to claim 1, wherein: Inputting the high-magnification image into a solder joint analysis model to obtain a detection result of the spot welding process level of the gold-tin cover plate includes: Preprocessing the high-magnification image, wherein the preprocessing includes adjusting the image size to a preset size and / or normalizing the image; The pre-processed high-magnification image is input into the solder joint analysis model to obtain the detection result of the spot welding process level of the gold-tin cover plate.

4. The spot welding inspection method according to claim 2, wherein: The first preset temperature range is 230°C to 270°C, the second preset temperature range is 310°C to 350°C, the third preset temperature range is less than 100°C, the first preset time length is 2min to 5min, and the second preset time length is 2min to 10min.

5. The spot welding inspection method according to claim 1, wherein: The heating equipment is one of a heater, a tubular brazing furnace, a chain brazing furnace, a reflow furnace, and a vacuum furnace.

6. A spot welding inspection device, characterized in that: include: A heating test module is used to place the gold-tin cover plate after spot welding horizontally into a heating device, and control the heating device to perform variable temperature heating on the gold-tin cover plate according to preset packaging process conditions; A cooling module, used for removing the gold-tin cover plate from the heating device and cooling it to a preset temperature after the variable temperature heating is completed; an inspection target acquisition module, configured to acquire a high-magnification image of the solder portion of the gold-tin cover plate under a microscope after the gold-tin cover plate cools to the preset temperature, wherein the high-magnification image includes morphological information of the solder portion of the gold-tin cover plate; An inspection module is used to input the high-magnification image into a solder joint analysis model to obtain a detection result of the spot welding process level of the gold-tin cover plate; wherein the input data of the solder joint analysis model is an image containing the morphology information of the solder at the cover plate, and the output data of the solder joint analysis model is a detection result of whether the spot welding process level is qualified; the solder joint analysis model includes an image processing unit and a spot welding judgment unit, the image processing unit determines the solder color and solder joint status of the solder at the cover plate based on the image containing the morphology information of the solder at the cover plate, the spot welding judgment unit determines whether the solder color at the solder at the cover plate is bright and whether the solder has changed color according to the solder color at the solder at the cover plate, and determines whether the solder is smooth and flat and whether the solder has abnormal protrusions according to the solder joint status; if the solder color at the solder is bright, the solder has not changed color, the solder joint is smooth and flat, and there is no abnormal protrusion on the solder joint, then the spot welding process level is judged to be qualified.

7. An electronic device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and is characterized in that when the processor executes the computer program, it implements the method according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein the computer program implements the method according to any one of claims 1 to 5 when executed by a processor.

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