Component processing apparatus and component carrier tray device

By designing a tray device with a permeable cavity and an air vent, the problem of cumbersome robotic arm movements was solved, achieving the effect of simplifying robotic arm movements and saving process costs.

CN116705674BActive Publication Date: 2026-02-06AELONG IND CO LTD
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Patent Information

Application Number
CN202210178315.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-02-25
Publication Date
2026-02-06
Estimated Expiration
2042-02-25

AI Technical Summary

Technical Problem

In the prior art, the groove design of the rotating disk makes the robotic arm's movements cumbersome, increases the manufacturing cost, and makes it difficult to observe the wafer.

Method used

The design incorporates a tray device with a perforated cavity, allowing the robotic arm to move through the cavity and enabling precise positioning and transfer of components via vents and stops, thus simplifying the robotic arm's movements.

Benefits of technology

It simplifies the movements of the robotic arm, reduces process costs, and improves equipment space utilization and process convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides an element processing equipment and an element tray device thereof, which is used for a mechanical arm. The element tray device includes a main body and an element tray. The main body has a supporting shaft. The element tray is fixed to the supporting shaft. The element tray is provided with a plurality of through-hollow holding grooves from the outer periphery to the inside and a plurality of air vents arranged on the inner wall of each through-hollow holding groove. The mechanical arm moves above or below the element tray by passing through each through-hollow holding groove. Therefore, the mechanical arm can move through each through-hollow holding groove, and the action and structure of the mechanical arm are simplified, thereby saving the process cost.
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Description

TECHNICAL FIELD

[0001] The present application relates to a conveying device for moving elements, and in particular to an element processing apparatus and an element carrier device thereof. BACKGROUND

[0002] With the development of modern technology, wafers have become an indispensable part of life, but wafers must undergo various tests before shipment to ensure normal function and play a role in the circuit.

[0003] In addition, in order to quickly and continuously test wafers, the prior art places several wafers on a rotating turntable, and then uses the rotating turntable to move the wafers to be tested between different workstations and receive detection and classification.

[0004] However, the above-mentioned rotating turntable is provided with several grooves for accommodating several wafers, and it is not easy to observe each wafer due to the closed side of each groove, and the mechanical arm needs to first extract each wafer from each groove before transporting each wafer to the workstation, resulting in the movement of the mechanical arm being too complicated and increasing the process cost.

[0005] Therefore, the present inventor has carefully studied and applied the theory to solve the above technical problems, which has become the goal of the present inventor's development. SUMMARY

[0006] The present application provides an element processing apparatus and an element carrier device thereof, which can move through each hollow container groove by using a mechanical arm, thereby simplifying the movement and structure of the mechanical arm to save process cost.

[0007] In the embodiments of the present application, an element carrier device for a mechanical arm is provided, which comprises a main body having a support shaft, and a carrier plate fixed to the support shaft, the carrier plate being provided with a plurality of hollow container grooves penetrating the top surface and the bottom surface from the outer periphery and a plurality of air vents arranged on the inner wall of each hollow container groove, and the mechanical arm moves above or below the carrier plate by penetrating each hollow container groove.

[0008] In one embodiment, the main body is an actuator, the support shaft is a rotating shaft, and the carrier plate is a rotating disc fixed to the rotating shaft and rotating with the rotating shaft.

[0009] In one embodiment, the inner wall of each hollow container groove has two corners, each air vent is arranged at one of the two corners, and the carrier plate is provided with a plurality of channels communicating with each air vent.

[0010] In one embodiment, the inner wall of each of the through-holes is provided with a stopper adjacent to the upper or lower edge of each of the air vents, and the cross-sectional shape of each of the through-holes is a cross shape.

[0011] In the embodiments of the present application, an element processing apparatus is provided, which includes: an element carrier device, comprising: a main body having a support shaft; and a carrier plate fixed to the support shaft, the carrier plate being provided with a plurality of through-holes penetrating the top surface and the bottom surface from the outer periphery and a plurality of air vents arranged on the inner wall of each of the through-holes; a plurality of workstations arranged above or below the carrier plate; and at least one robot arm moving to one side of the carrier plate or between the carrier plate and each of the workstations by passing through each of the through-holes.

[0012] In one embodiment, the main body is an actuator, the support shaft is a rotating shaft, and the carrier plate is a rotating disc fixed to the rotating shaft and rotating with the rotating shaft.

[0013] In one embodiment, the inner wall of each of the through-holes has two corners, each of the air vents is arranged at one of the two corners, and the carrier plate is provided with a plurality of channels communicating with each of the air vents.

[0014] In one embodiment, the plurality of workstations are arranged below the carrier plate, and the inner wall of each of the through-holes is provided with a stopper adjacent to the upper edge of each of the air vents.

[0015] In one embodiment, the plurality of workstations are arranged above the carrier plate, and the inner wall of each of the through-holes is provided with a stopper adjacent to the lower edge of each of the air vents.

[0016] In one embodiment, the cross-sectional shape of each of the through-holes is a cross shape.

[0017] Based on the above, the robot arm moves to above or below the carrier plate or between the carrier plate and each of the workstations by passing through each of the through-holes, so that the robot arm can drive the element to be processed to be accommodated in the through-hole or enter the workstation by vertical lifting at a fixed point, thereby simplifying the action and structure of the robot arm and achieving the advantage of saving process cost.

[0018] Based on the above, the robot arm and the plurality of workstations are arranged above or below the carrier plate, respectively, so that the robot arm and each of the workstations are arranged adjacent to the carrier plate, which can further reduce the equipment space and improve the process convenience. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 FIG. 1 is a perspective assembly view of an element carrier device according to the present application.

[0020] Figure 2 FIG. 2 is an exploded perspective view of a carrier plate according to the present application.

[0021] Figure 3 yes Figure 2 A magnified view of a portion of the image.

[0022] Figure 4 This is a top view of the disk containing this application.

[0023] Figure 5 yes Figure 1 A magnified view of a portion of the image.

[0024] Figure 6 This is a cross-sectional view of the component processing equipment in use according to this application.

[0025] Figure 7 This is a three-dimensional assembly diagram of the component processing equipment of this application.

[0026] Figure 8 This is a cross-sectional view of the usage state of another embodiment of the component processing device of this application.

[0027] Figure 9 This is a perspective view of another embodiment of the component processing device of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10: Component processing equipment;

[0030] 1: Component carrier disk assembly;

[0031] 11: Main body;

[0032] 110: Actuator;

[0033] 111: Support shaft;

[0034] 112: Shaft;

[0035] 12: Carrier disk;

[0036] 120: Turntable;

[0037] 121: Transparent tank;

[0038] 1211: Corner;

[0039] 122: Vent;

[0040] 123: Channel;

[0041] 1231: V-shaped turning point;

[0042] 124: Stop block;

[0043] 125: Upper plate body;

[0044] 126: Lower body;

[0045] 2: Workstation;

[0046] 3: Robotic arm;

[0047] 31: Suction nozzle;

[0048] s: Spacing;

[0049] 100: Components to be processed. Detailed Implementation

[0050] The detailed description and technical content of this application will be explained below with reference to the accompanying drawings. However, the drawings are for illustrative purposes only and are not intended to limit the scope of this application.

[0051] Please refer to Figures 1 to 7 As shown, this application provides a component processing device and a component tray device thereof. The component processing device 10 mainly includes a component tray device 1, a plurality of workstations 2 and one or more (at least two) robotic arms 3. The component tray device 1 mainly includes a main body 11 and a tray 12.

[0052] like Figures 1 to 7 As shown, the component carrier device 1 includes a main body 11 and a carrier 12. The main body 11 has a support shaft 111, and the carrier 12 is fixed to the support shaft 111. The carrier 12 has multiple permeable grooves 121 extending through the top and bottom surfaces from the outer periphery inward, and multiple vents 122 disposed on the inner wall of each permeable groove 121.

[0053] In this embodiment, the main body 11 is, for example, an actuator 110 of a motor, a support shaft 111 is a rotating shaft 112 driven to rotate by the actuator 110, and a carrier disk 12 is a turntable 120. The turntable 120 is fixed to the rotating shaft 112 and rotates with the rotating shaft 112, but this is not a limitation. The support shaft 111 can also be a lifting shaft driven to rise and fall by the actuator 110, and the carrier disk 12 is fixed to the lifting shaft and rises or falls with the lifting shaft.

[0054] The following is a detailed description: The carrier tray 12 has multiple channels 123 that communicate with each vent 122. The component carrier tray device 1 also includes an air pump (not shown in the figure). The air pump communicates with each channel 123 and blows or draws air through each channel 123, thereby creating a negative pressure inside each vent 122 to attract the component 100 to be processed. The component 100 is moved by the rotation of the carrier tray 12, and a positive pressure can also be created inside each vent 122 to blow away the component 100 to be processed. The preferred embodiment of the component 100 to be processed is a wafer, but this is not a limitation.

[0055] In addition, the inner wall of each of the hollow holding grooves 121 has two corners 1211, and each of the air vents 122 is formed at one of the two corners 1211. When the air pump generates a negative pressure, suction force can be generated at the air vent 122, and the element 100 to be processed can be aligned with the corner 1211 by the suction force, so as to achieve the effect of accurate positioning of the element 100 to be processed. Each of the passages 123 has a V-shaped turning section 1231 connected to the air vent 122.

[0056] In addition, the carrier plate 12 has a stop block 124 protruding from the inner wall of each of the hollow holding grooves 121 and adjacent to the upper or lower edge of the air vent 122. When the element 100 to be processed is positioned by the stop block 124, the element 100 to be processed is also positioned by the air vent 122.

[0057] In addition, the carrier plate 12 has a stop block 124 protruding from the inner wall of each of the hollow holding grooves 121 and adjacent to the upper or lower edge of the air vent 122. When the element 100 to be processed is positioned by the stop block 124, the element 100 to be processed is also positioned by the air vent 122.

[0058] In addition, the carrier plate 12 has a stop block 124 protruding from the inner wall of each of the hollow holding grooves 121 and adjacent to the upper or lower edge of the air vent 122. When the element 100 to be processed is positioned by the stop block 124, the element 100 to be processed is also positioned by the air vent 122.

[0059] In addition, the carrier plate 12 has a stop block 124 protruding from the inner wall of each of the hollow holding grooves 121 and adjacent to the upper or lower edge of the air vent 122. When the element 100 to be processed is positioned by the stop block 124, the element 100 to be processed is also positioned by the air vent 122.

[0060] In addition, the carrier plate 12 has a stop block 124 protruding from the inner wall of each of the hollow holding grooves 121 and adjacent to the upper or lower edge of the air vent 122. When the element 100 to be processed is positioned by the stop block 124, the element 100 to be processed is also positioned by the air vent 122. Figure 7 As shown in FIG. 1, the plurality of workstations 2 can be arranged above or below the carrier plate 12. The plurality of workstations 2 can be various detection stations for detecting the element 100 to be processed, or various processing stations for processing the element 100 to be processed.

[0061] In addition, the carrier plate 12 has a stop block 124 protruding from the inner wall of each of the hollow holding grooves 121 and adjacent to the upper or lower edge of the air vent 122. When the element 100 to be processed is positioned by the stop block 124, the element 100 to be processed is also positioned by the air vent 122.

[0062] In addition, the plurality of workstations 2 are arranged below the carrier tray 12, and each stop block 124 is adjacent to the upper edge of each air vent 122. Conversely, the plurality of workstations 2 are arranged above the carrier tray 12, and each stop block 124 is adjacent to the lower edge of each air vent 122.

[0063] As shown in FIG. 1, the robotic arm 3 moves above or below the carrier tray 12 by passing through each hollow holding groove 121, i.e. the robotic arm 3 moves to one side of the carrier tray 12 or the other side of the carrier tray 12 between each workstation 2 by passing through each hollow holding groove 121. Figures 6 to 7

[0064] In addition, the robotic arm 3 has a suction nozzle 31 with adjustable internal negative pressure. When the suction nozzle 31 contacts the component 100 to be processed and sucks the component 100 to be processed with negative pressure, the component 100 to be processed can be adsorbed by the suction nozzle 31 to separate from the hollow holding groove 121 and move to the workstation 2. When the suction nozzle 31 sucks the component 100 to be processed and moves back to the hollow holding groove 121, the stop block 124 can stop the component 100 to be processed to separate the suction nozzle 31 and the component 100 to be processed, and at the same time, the component 100 to be processed can be adsorbed by the negative pressure of the air vent 122 to be accommodated in the hollow holding groove 121, thereby controlling the component 100 to be processed to be accommodated in the hollow holding groove 121 or to be driven by the robotic arm 3.

[0065] As shown in FIG. 1, the robotic arm 3 moves above or below the carrier tray 12 by passing through each hollow holding groove 121, i.e. the robotic arm 3 moves to one side of the carrier tray 12 or the other side of the carrier tray 12 between each workstation 2 by passing through each hollow holding groove 121. Figures 1 to 7 In addition, when the robotic arm 3 wants to take the component 100 to be processed, the robotic arm 3 enters the inside of the hollow holding groove 121 from above the hollow holding groove 121, and then the robotic arm 3 contacts the component 100 to be processed by the suction nozzle 31 and sucks the component 100 to be processed with negative pressure, and at the same time, the inside of each air vent 122 also forms a positive pressure to blow away the component 100 to be processed, thereby allowing the component 100 to be processed to be adsorbed by the suction nozzle 31 to separate from the hollow holding groove 121.

[0066]

[0067] ​​Therefore, the robot arm 3 can move above or below the carrier plate 12 or between the carrier plate 12 and the workstations 2 by passing through the hollow holding slots 121, so that the robot arm 3 can drive the component 100 to be processed to be accommodated in the hollow holding slots 121 or to enter the workstations 2 by vertical lifting at a fixed point, thereby simplifying the movement and structure of the robot arm 3 to save the process cost.

[0068] In addition, the plurality of workstations 2 are located between the main body 11 and the carrier plate 12, that is, the robot arm 3 and the plurality of workstations 2 are arranged above and below the carrier plate 12, so that the robot arm 3 and the plurality of workstations 2 are arranged adjacent to the carrier plate 12, thereby reducing the equipment space and improving the process convenience.

[0069] Please refer to Figure 8 , which is another embodiment of the component processing equipment 10 of the present application, Figure 8 , which is substantially the same as the embodiment of Figures 1 to 7 , which is substantially the same as the embodiment of Figure 8 , which is different from the embodiment of Figures 1 to 7 , wherein each stop block 124 is located adjacent to the lower edge of each air port 122.

[0070] Further, as described below, in the embodiment, the plurality of workstations 2 are arranged above the carrier plate 12, and when the robot arm 3 sucks the component 100 to be processed by the suction nozzle 31 and passes through the hollow holding slot 121, because each stop block 124 is located adjacent to the lower edge of each air port 122, the stop block 124 will stop the component 100 to be processed so that the suction nozzle 31 and the component 100 to be processed are separated, and at the same time, the negative pressure of the air port 122 will adsorb the component 100 to be processed, thereby accommodating the component 100 to be processed in the hollow holding slot 121.

[0071] In addition, when the robot arm 3 wants to take the component 100 to be processed, the robot arm 3 will enter the inside of the hollow holding slot 121 from below the hollow holding slot 121, and then the robot arm 3 will contact the component 100 to be processed by the suction nozzle 31 and suck the component 100 to be processed by negative pressure, and at the same time, a positive pressure will be formed in each air port 122 to blow away the component 100 to be processed, thereby adsorbing the component 100 to be processed by the suction nozzle 31 to separate the component 100 to be processed from the hollow holding slot 121, so as to achieve the same functions and effects as the embodiment of Figures 1 to 7 .

[0072] Please refer to Figure 9 , which is still another embodiment of the component processing equipment 10 of the present application, Figure 9 , which is substantially the same as the embodiment of Figures 1 to 7 , which is substantially the same as the embodiment of Figure 9 , which is different from the embodiment of Figures 1 to 7The difference between the embodiment and the embodiment of the application is that the main body 11 is arranged above the carrier disc 12 and has a spacing space s between the main body 11 and the carrier disc 12, a plurality of workstations 2 are arranged above the carrier disc 12, and the mechanical arm 3 is located in the spacing space s, that is, the mechanical arm 3 and the plurality of workstations 2 are arranged above and below the carrier disc 12 respectively, so that the mechanical arm 3 and each workstation 2 are arranged adjacent to the carrier disc 12, so as to achieve the same functions and effects as Figures 1 to 7 the embodiment of the application.

[0073] In summary, the element processing equipment and the element carrier disc device thereof have not been seen in similar products and public use, and have industrial applicability, novelty and creativity, fully meet the requirements of patent application, and therefore, according to the Patent Law, the application is submitted for examination and authorization to protect the applicant's rights.

Claims

1. An element carrier disk device for a robot, characterized in that The element carrier disc device comprises: a main body having a support shaft; and a carrier disc fixed to the support shaft, the carrier disc having a plurality of hollowed-out containers formed from an outer periphery inwards and penetrating through a top surface and a bottom surface, and a plurality of air vents arranged on inner walls of the hollowed-out containers, wherein inner walls of each of the hollowed-out containers have two corners, each of the air vents is arranged at one of the two corners, the carrier disc has a plurality of channels communicating with the air vents, the carrier disc comprises an upper disc body and a lower disc body stacked on top of each other, the inner walls of the hollowed-out containers of the upper disc body have stop blocks protruding immediately above the air vents, and the inner walls of the hollowed-out containers of the lower disc body have inclined inner walls gradually reducing an inner periphery size in a direction approaching the upper disc body.

2. The device according to claim 1, wherein The main body is an actuator, the support shaft is a rotating shaft, and the carrier disc is a rotating disc fixed to the rotating shaft and rotating with the rotating shaft.

3. The device of claim 1, wherein the plurality of elements are arranged in a plurality of rows and columns. A cross-section shape of each of the hollowed-out containers is a cross shape.

4. An apparatus for processing elements, characterized by The element carrier disc device comprises: a main body having a support shaft; and a carrier disc fixed to the support shaft, the carrier disc having a plurality of hollowed-out containers formed from an outer periphery inwards and penetrating through a top surface and a bottom surface, and a plurality of air vents arranged on inner walls of the hollowed-out containers, a plurality of workstations arranged above or below the carrier disc; and at least one robot arm moving to one side of the carrier disc or between the other side of the carrier disc and the workstations by penetrating through the hollowed-out containers. wherein inner walls of each of the hollowed-out containers have two corners, each of the air vents is arranged at one of the two corners, the carrier disc has a plurality of channels communicating with the air vents, the carrier disc comprises an upper disc body and a lower disc body stacked on top of each other, the inner walls of the hollowed-out containers of the upper disc body have stop blocks protruding immediately above the air vents, and the inner walls of the hollowed-out containers of the lower disc body have inclined inner walls gradually reducing an inner periphery size in a direction approaching the upper disc body. The main body is an actuator, the support shaft is a rotating shaft, and the carrier disc is a rotating disc fixed to the rotating shaft and rotating with the rotating shaft. The plurality of workstations are arranged below the carrier disc. A cross-section shape of each of the hollowed-out containers is a cross shape.

5. The component processing apparatus according to Claim 4, wherein ​ 6. The component processing apparatus according to claim 4, wherein ​ 7. The component processing apparatus according to Claim 4, wherein ​

Citation Information

Patent Citations

  • Substrate processing apparatus and method for processing a substrate

    CN104451602A

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    CN104766816A

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