A seed crystal separation device and use method

Abstract

The present invention discloses a seed crystal separation device and method of use, relating to the field of silicon carbide crystal technology. The device comprises a lifting unit for supporting a crucible cover and a seed crystal and adjusting the overall height; and a wire cutting unit for cutting the high-temperature adhesive layer between the crucible cover and the seed crystal to separate the crucible cover from the seed crystal. The device uses the wire cutting unit to cut the later high-temperature adhesive layer, allowing the crucible cover and the seed crystal with the crystal to be safely and quickly separated. The device also includes an adjustment unit for adjusting the distance between the upper and lower diamond wires and automatically adjusting the tension of the diamond wires. The adjustment unit can automatically maintain the tension of the diamond wires while adjusting the distance between the upper and lower diamond wires to accommodate the cutting of high-temperature adhesive layers of varying thicknesses, thereby expanding its scope of use.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide crystals, and in particular to a seed crystal separation device and a use method thereof. Background Art

[0002] Silicon carbide (SiC) single crystals have excellent semiconductor physical properties such as high thermal conductivity, high breakdown voltage, extremely high carrier mobility, and high chemical stability. They can be made into high-frequency, high-power electronic and optoelectronic devices that operate under high temperature and strong radiation conditions. They have huge application value in national defense, high technology, industrial production, power supply, and power transformation, and are regarded as a third-generation wide bandgap semiconductor material with great development prospects.

[0003] At present, seed crystals are usually required in the preparation of silicon carbide crystals (the crystals serve as starting crystals and provide a template for the growth of new crystals). In actual installation, most seed crystals are bonded to the crucible lid with high-temperature glue. After the crystals are prepared, there are generally two ways to separate the graphite crucible lid from the seed crystals. One is to use a knocking method, which can easily cause the crystals on the seed crystals to break. The other is to use a chemical immersion method, which is to place the graphite crucible lid in a container filled with an acidic solution so that the solution is immersed in the high-temperature glue and the high-temperature glue is dissolved by chemical reaction. The dissolution process is slow and time-consuming, and the seed crystals need to be cleaned later, which is troublesome.

[0004] The thickness of the high-temperature glue used for bonding varies depending on the size of the seed crystal. For large seed crystals, the thickness of the high-temperature glue will exceed 1 mm. It is difficult to safely separate the seed crystal with crystal from the crucible cover by tapping. When using the chemical immersion method, the dissolution time will be greatly extended due to the increase in the thickness of the high-temperature glue. Therefore, this application provides a seed crystal separation device and a method of use to meet the needs. Summary of the Invention

[0005] The purpose of the present application is to provide a seed crystal separation device and a method of use, which are used to solve the technical problem in the prior art that the seed crystal and the crucible cover cannot be quickly and safely separated when thick high-temperature glue is used.

[0006] To achieve the above objectives, the present application provides the following technical solutions: a seed crystal separation device, comprising

[0007] Lifting unit: used to carry the crucible cover and seed crystal and adjust the overall height;

[0008] Wire cutting unit: used to cut the high-temperature adhesive layer between the crucible cover and the seed crystal to separate the crucible cover from the seed crystal.

[0009] Preferably, the wire cutting unit includes a driven guide wheel and a driving guide wheel which are arranged opposite to each other and are sleeved with diamond wires, the driven guide wheel and the driving guide wheel are respectively mounted on corresponding first U-shaped plates, the first U-shaped plates are mounted with motors which drive the driving guide wheels to move, the two first U-shaped plates are respectively mounted on U-shaped frames, the two lower ends of the U-shaped frames are slidably connected to corresponding electric slide rails, and the electric slide rails are mounted on the operating table;

[0010] The lifting unit includes a carrying plate installed above the operating table and having a receiving groove.

[0011] The carrying plate is slidingly sleeved on two limiting columns, a first manual screw is rotatably provided on the operating table, and the upper end of the first manual screw is rotatably connected to the lower end of the carrying plate, and two L-shaped picking cavities are relatively provided on the carrying plate.

[0012] Preferably, the invention further comprises an adjustment unit for adjusting the distance between the upper diamond wire and the lower diamond wire and automatically adjusting the tension of the diamond wire, wherein the adjustment unit comprises two oppositely arranged adjustment guide wheels, the two adjustment guide wheels are respectively mounted on corresponding second U-shaped plates, the upper ends of the two second U-shaped plates are respectively slidably penetrated by square columns fixed to the lower ends of the U-shaped frames, the square columns are in sliding contact with the second U-shaped plates through balls provided on the outer walls, and the two second U-shaped plates are connected by a weight-increasing rod;

[0013] It also includes a second manual screw that is rotatably arranged on the U-shaped frame, the second manual screw is provided with a forward thread segment and a reverse thread segment, the forward thread segment and the reverse thread segment are respectively provided with ball nuts, the two ball nuts are respectively fixed to the upper ends of the corresponding first U-shaped plates, and the two first U-shaped plates are both slidably arranged on the U-shaped frame.

[0014] Preferably, it also includes a magnetic unit, which includes a first magnetic block installed on the weight-increasing rod, a second magnetic block installed in the inner cavity of the magnetic isolation shell on the U-shaped frame, and a movable rod fixed to the second U-shaped plate through a mounting block. The magnetic poles of the opposite ends of the first magnetic block and the second magnetic block are opposite. A magnetic isolation plate is slidingly provided on the magnetic isolation shell. The movable rod is fixedly connected to the magnetic isolation plate and the U-shaped frame respectively through two mounting plates. The movable rod is slidingly engaged with the two mounting plates. A reset spring is fixed on the movable rod, and a contact plate with a universal ball is fixed on the end of the reset spring. An isosceles blocking block is fixed on one end of the movable rod. The movable rod also includes a blocking vertical plate fixed on the operating table and capable of contacting the oblique edge of the isosceles blocking block to form a block to drive the movable rod to move laterally.

[0015] Preferably, two groups of the blocking upright plates are provided, and the two groups of the blocking upright plates are arranged opposite to each other.

[0016] Preferably, the contact edges of the two blocking vertical plates are both inclined and open outward.

[0017] A method for using a seed crystal separation device, characterized by comprising method 1 and method 2, wherein method 1 comprises the following steps:

[0018] S1, using the adjustment unit and the lifting unit to adjust the distance and height between the upper diamond wire and the lower diamond wire, so that the lower end of the lower diamond wire is located above the bonding surface between the high-temperature adhesive layer and the crucible cover, and the upper end of the upper diamond wire is located below the bonding surface between the high-temperature adhesive layer and the seed crystal. After the position is adjusted, the control device is operated to cut the thicker high-temperature adhesive layer;

[0019] S2, after the cutting is completed, the seed crystal is separated from the crucible, and the end surfaces of the seed crystal and the crucible bonded to the high-temperature adhesive layer are immersed in a container filled with sulfuric acid to carry out a chemical reaction and dissolve the residual high-temperature adhesive;

[0020] S3, after the reaction is completed, rinse the immersed surface with water and then dry it;

[0021] Method 2 includes the following steps:

[0022] S1, use the adjustment unit and the lifting unit to adjust the distance and height between the upper diamond wire and the lower diamond wire, so that the lower end of the lower diamond wire is located below the bonding surface between the high-temperature adhesive layer and the crucible cover, and the lower end of the upper diamond wire is located above the bonding surface between the high-temperature adhesive layer and the seed crystal. After the position is adjusted, the control device works to cut the thicker high-temperature adhesive layer.

[0023] Preferably, in step S of the method, the seed crystal can be fixed in the air with the bonding surface between the seed crystal and the crucible facing downwards by a fixture.

[0024] In summary, the technical effects and advantages of the present invention are as follows:

[0025] The invention has a reasonable structure. The device adopts a wire cutting unit to cut the later high-temperature adhesive layer, so that the crucible cover and the seed crystal with the crystal can be separated safely and quickly.

[0026] The present invention also includes an adjustment unit for adjusting the distance between the upper diamond wire and the lower diamond wire and automatically adjusting the tension of the diamond wire. The adjustment unit can automatically maintain the tension of the diamond wire and adjust the distance between the upper diamond wire and the lower diamond wire to adapt to cutting high-temperature adhesive layers of different thicknesses, thereby expanding its scope of use.

[0027] The present invention also includes a magnetic unit. When the device is not working, the magnetic force greatly reduces the gravity of the two adjustment guide wheels and the weight-increasing rod on the diamond wire, thereby preventing the two adjustment guide wheels and the weight-increasing rod from continuously acting on the diamond wire, causing fatigue and stretching of the diamond wire, thereby reducing its service life.

[0028] In the present invention, the contact edges of the two blocking vertical plates are both inclined and open outward, which can automatically increase the magnetic action area according to the stretching of the diamond wire to compensate for the increase in the distance between the first magnetic block and the second magnetic block, so that the gravity acting on the diamond wire does not change significantly, thereby avoiding fatigue stretching of the diamond wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0031] Figure 2 For the present invention Figure 1 Schematic diagram of the position structure of the first magnetic block;

[0032] Figure 3 For the present invention Figure 1 Schematic diagram of the position structure of the second magnetic block;

[0033] Figure 4 For the present invention Figure 1 Schematic diagram of the local structure of the medium magnetic unit;

[0034] Figure 5 For the present invention Figure 1 Schematic diagram of the structure of the middle barrier plate;

[0035] Figure 6 For the present invention Figure 1 Schematic diagram of the front view structure of the middle lifting unit.

[0036] In the figure: 1. Operating table; 2. Wire cutting unit; 21. Driving guide wheel; 22. Motor; 23. First U-shaped plate; 24. Driven guide wheel; 25. U-shaped frame; 26. Electric slide rail; 27. Ball nut; 28. Second manual screw; 3. Adjustment unit; 31. Adjustment guide wheel; 32. Second U-shaped plate; 33. Square column; 34. Ball; 35. Weight-increasing rod; 4. Magnetic unit; 41. First magnetic block; 42. Magnetic isolation shell; 43. Second magnetic block; 44. Magnetic isolation plate; 45. Mounting plate; 46. Movable rod; 47. Mounting block; 48. Reset spring; 49. Contact plate; 410. Isosceles blocking block; 411. Blocking vertical plate; 412. Contact edge; 5. Lifting unit; 51. Carrying plate; 52. L-shaped picking cavity; 53. First manual screw; 54. Limiting column; 6. High-temperature adhesive layer; 7. Seed crystal; 8. Crucible cover. Implementation Method

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] Example: Reference Figure 1 A seed crystal separation device shown includes

[0039] Lifting unit 5: used to carry the crucible cover 8 and the seed crystal 7 and adjust the overall height;

[0040] The wire cutting unit 2 is used to cut the high-temperature adhesive layer 6 between the crucible cover 8 and the seed crystal 7 to separate the crucible cover 8 from the seed crystal 7 .

[0041] As a preferred implementation in this embodiment, Figure 1 and Figure 6 As shown, the wire cutting unit 2 includes a driven guide wheel 24 and a driving guide wheel 21 which are relatively arranged and sleeved with diamond wire. The driven guide wheel 24 and the driving guide wheel 21 are respectively installed on the corresponding first U-shaped plate 23. The first U-shaped plate 23 is installed with a motor 22 for driving the driving guide wheel 21 to move. The two first U-shaped plates 23 are respectively installed on the U-shaped frame 25. The two lower ends of the U-shaped frame 25 are slidingly connected to the corresponding electric slide rails 26, and the electric slide rails 26 are installed on the operating table 1; the lifting unit 5 includes a supporting plate 51 installed above the operating table 1 and with an accommodating groove. The supporting plate 51 is slidably sleeved on two limiting columns 54. A first manual screw 53 is rotatably provided on the operating table 1, and the upper end of the first manual screw 53 is rotatably connected to the lower end of the supporting plate 51. Two L-shaped picking cavities 52 are relatively provided on the supporting plate 51.

[0042] When in use, the crucible cover 8 is placed on the supporting plate 51. After adjusting the height of the crucible cover 8 by rotating the first manual screw 53, the motor is controlled to drive the guide wheel 21 to drive the diamond wire to move, and the electric slide rail 26 is controlled to drive the diamond wire to move along the track of the electric slide rail 26 to perform wire cutting on the high-temperature adhesive layer 6. For thicker high-temperature adhesive layers 6, the wire cutting method used in this device is conducive to the rapid separation of the seed crystal 7 and the crucible cover 8, and will not cause the crystal to be broken.

[0043] It should be noted that, first, after the lifting and lowering adjustment of the lifting unit 5, the upper and lower heights of the upper diamond wire and the lower diamond wire (the two lines are parallel) are consistent with the high-temperature adhesive layer 6, and the high-temperature adhesive layer 6 can be directly ground and cut by the cooperation of the upper diamond wire and the lower diamond wire. After the grinding is completed, a thin sheet of high-temperature adhesive will be left between the upper diamond wire and the lower diamond wire. Second, the diameter of the diamond wire is 0.3 mm; third, a PLC controller is provided on the operating table 1, which is electrically connected to the various electrical equipment of the device; fourth, after cutting is completed, you can put your hands into the two L-shaped picking cavities 52 so that your fingers can contact the bottom of the crucible cover 8 and then lift it out of the groove; fifth, a water spray mechanism can be provided on the carrier plate 51 to cool the diamond wire during the cutting operation.

[0044] As a preferred implementation in this embodiment, Figure 1-3 As shown, it also includes an adjustment unit 3 for adjusting the distance between the upper diamond wire and the lower diamond wire and automatically adjusting the tension of the diamond wire. The adjustment unit 3 includes two relatively arranged adjustment guide wheels 31, and the two adjustment guide wheels 31 are respectively installed on the corresponding second U-shaped plates 32. The upper ends of the two second U-shaped plates 32 are respectively fixed to the square columns 33 at the lower end of the U-shaped frame 25 and slide through. The square columns 33 slide in contact with the second U-shaped plates 32 through the balls 34 provided on the outer wall, and the two second U-shaped plates 32 are connected by a weight-increasing rod 35; it also includes a second manual screw 28 rotatably set on the U-shaped frame 25, and the second manual screw 28 is provided with a forward thread segment and a reverse thread segment. Ball nuts 27 are respectively sleeved on the forward thread segment and the reverse thread segment. The two ball nuts 27 are respectively fixed to the upper ends of the corresponding first U-shaped plates 23, and the two first U-shaped plates 23 are both slidably set on the U-shaped frame 25.

[0045] The device is provided with an adjustment unit 3, which can be used for grinding and cutting high-temperature adhesive layers 6 of different thicknesses, and can automatically adjust the tension of the diamond wire. Two adjustment guide wheels 31 in contact with the upper diamond wire are provided, and the two adjustment guide wheels 31 are weighted by a weight-increasing rod 35. The adjustment guide wheels 31 are limited by a square column 33. The diamond wire is automatically tensioned by the gravity of the adjustment guide wheels 31 and the weight-increasing rod 35 to ensure the stability of the diamond wire tension. When it is necessary to adjust the cutting distance between the upper diamond wire and the lower diamond wire, the second manual screw 28 can be rotated to make the ball nut 27 drive the two first U-shaped plates 23 to move relative or reversely. At this time, the two adjustment guide wheels 31 move downward by gravity or overcome gravity to move upward, thereby changing the distance to adapt to the cutting of high-temperature adhesive layers 6 of different thicknesses and expand its scope of use.

[0046] As a preferred implementation in this embodiment, Figure 1-4 As shown, it also includes a magnetic unit 4, which includes a first magnetic block 41 installed on the weight-increasing rod 35, a second magnetic block 43 installed in the inner cavity of the magnetic isolation shell 42 on the U-shaped frame 25, and a movable rod 46 fixed to the second U-shaped plate 32 through a mounting block 47. The magnetic poles of the opposite ends of the first magnetic block 41 and the second magnetic block 43 are opposite. A magnetic isolation plate 44 is slidingly provided on the magnetic isolation shell 42. The movable rod 46 is fixedly connected to the magnetic isolation plate 44 and the U-shaped frame 25 respectively through two mounting plates 45. The movable rod 46 is slidably engaged with the two mounting plates 45. A reset spring 48 is fixed on the movable rod 46, and a contact plate 49 with a universal ball is fixed on the end of the reset spring 48. An isosceles stop block 410 is fixed on one end of the movable rod 46. It also includes a stop vertical plate 411 fixed on the operating table 1 and capable of contacting the oblique edge of the isosceles stop block 410 to form a stop to drive the movable rod 46 to move laterally.

[0047] After the cutting is completed, the electric slide rail 26 will drive the blocking plate 411 to contact the oblique edge of the isosceles blocking block 410, and the movable rod 46 will drive the magnetic isolation plate 44 to move to the left through the squeezing effect, so that the second magnet 43 located in the magnetic isolation shell 42 is partially exposed, forming a Figure 1In the illustrated state (where the contact plate 49 is in sliding contact with the U-shaped frame 25 and the return spring 48 is compressed), the second magnetic block 43 partially generates an attractive force with the first magnetic block 41. This magnetic force exerts an upward force on the two adjustable guide wheels 31 and the weighting rod 35. This significantly reduces the weight of the two adjustable guide wheels 31 and the weighting rod 35 on the diamond wire when not cutting. This prevents the continuous action of the two adjustable guide wheels 31 and the weighting rod 35 on the diamond wire, which could cause fatigue and stretching of the diamond wire and shorten its service life. When the electric slide 26 drives the U-shaped frame 25 to perform a cutting motion, the isosceles block 410 separates from the stop plate 411. Before the diamond wire contacts the high-temperature adhesive layer 6 for cutting, the magnetic isolation plate 44 returns to its original position under the elastic force of the return spring 48. At this time, the weight of the two adjustable guide wheels 31, the weighting rod 35, and the components of the magnetic unit 4 act on the diamond wire, maintaining a good tension.

[0048] It should be noted that, first, the distance that the electric slide rail 26 drives the U-shaped frame 26 to move can be controlled by the PLC controller; second, the magnetic force cannot cause the two adjusting guide wheels 31 and the weight-increasing rod 35 to move upward, so that the gravity of the two adjusting guide wheels 31, the weight-increasing rod 35 and some components of the magnetic unit 4 act on the diamond wire, making the diamond wire slightly tensioned, which can prevent the diamond wire from detaching from the adjusting guide wheel 31; third, the movable rod 46 can move in the vertical direction along the mounting plate 45.

[0049] As a preferred implementation in this embodiment, Figure 1 As shown, there are two groups of blocking uprights 411, and the two groups of blocking uprights 411 are arranged opposite to each other. The purpose of setting two groups is to enable the electric slide rail 26 of the present device to drive the U-shaped frame 25 to move forward or backward once to complete the sequential cutting. After the U-shaped frame 25 stops each time after completing the cutting, the isosceles blocking block 410 thereon will be aligned with the blocking uprights 411, so that the gravity acting on the diamond wire is reduced through the magnetic effect. At the same time, the front and back alternating cutting can make use of the front and back sides of the diamond wire (when one side is used alone, it is easy to cause serious wear of this side, reducing its grinding and cutting effect), which is conducive to the full utilization of the diamond wire and can extend the replacement time of the diamond wire.

[0050] It should be noted that the carrying plate 51 is arranged in the middle of the operating table 1 to facilitate personnel to place the crucible cover 8 from the front and back sides.

[0051] As a preferred implementation in this embodiment, Figure 5As shown, the contact edges 412 of the two blocking vertical plates 411 are all set to be opened outward and tilted. When the diamond wire is stretched, the distance between the first magnetic block 41 and the second magnetic block 43 will increase, and the attraction between them will become smaller (the gravity of the components acting on the diamond wire becomes larger). When not cutting, the diamond wire will be subjected to a large part of the gravity from the two adjusting guide wheels 31, the weight-increasing rod 35, and some components of the magnetic unit 4, which may easily cause fatigue and stretching of the diamond wire. Therefore, the contact edges 412 are all set to be opened outward and tilted. When the diamond wire is stretched, driven by the electric slide rail 26, the isosceles blocking block 410 contacts the blocking vertical plate 411 (this The time used for contact is shorter than the time used for contact when no rope pulling occurs). This contact point is located below the contact point before stretching. Since the contact edges 412 are all tilted outward and the distance that the electric slide rail 26 drives the isosceles blocking block 410 to move along the track direction is fixed, the movable rod 46 drives the magnetic isolation plate 44 to move to the left. The distance becomes larger, thereby exposing the second magnetic block 43 more. By increasing the magnetic action area (which can automatically change according to the stretching situation) to compensate for the increase in the distance between the first magnetic block 41 and the second magnetic block 43, the gravity of the components acting on the diamond wire does not change significantly, which can avoid fatigue stretching of the diamond wire.

[0052] It should be noted that, first, when the diamond wire is not cutting, the force acting on it is very small, and fatigue stretching is not easy to occur. However, when it is cutting, the diamond wire needs to withstand high-frequency stress loading, constantly contacting and shearing with the cutting material, which can easily cause fatigue stretching of the diamond wire; second, even when the diamond wire is not cutting, when it is stretched due to the force coming from the two adjusting guide wheels 31, the weight-increasing rod 35 and part of the gravity of the magnetic unit 4, its movable rod 46 will slide downward under the drive of the adjusting guide wheel 31 and move to the left, thereby exposing the second magnetic block 43 more, avoiding excessive force on the diamond wire and accelerating fatigue.

[0053] A method for using a seed crystal separation device, characterized by comprising method 1 and method 2, wherein method 1 comprises the following steps:

[0054] S1, using the adjustment unit 3 and the lifting unit 5 to adjust the distance and height between the upper diamond wire and the lower diamond wire, so that the lower end of the lower diamond wire is located above the bonding surface between the high-temperature adhesive layer 6 and the crucible cover 5, and the upper end of the upper diamond wire is located below the bonding surface between the high-temperature adhesive layer 6 and the seed crystal 7. After the position is adjusted, the control device is operated to cut the thicker high-temperature adhesive layer 6;

[0055] S2, after the cutting is completed, the seed crystal 7 is separated from the crucible 8, and the end surfaces of the seed crystal 7 and the crucible 8 bonded to the high-temperature adhesive layer 6 are immersed in a container filled with sulfuric acid to carry out a chemical reaction and dissolve the residual high-temperature adhesive;

[0056] S3, after the reaction is completed, rinse the immersed surface with water and then dry it;

[0057] The advantage of method 1 is that the crucible and seed crystal can be installed and separated without damaging them. The disadvantage is that the subsequent operations (acid leaching and water washing) are more troublesome.

[0058] Method 2 includes the following steps:

[0059] S1, use the adjustment unit 3 and the lifting unit 5 to adjust the distance and height between the upper diamond wire and the lower diamond wire, so that the lower end height of the lower diamond wire is located below the bonding surface between the high-temperature adhesive layer 6 and the crucible cover 5, and the lower end height of the upper diamond wire is located above the bonding surface between the high-temperature adhesive layer 6 and the seed crystal. After the position is adjusted, the control device works to cut the thicker high-temperature adhesive layer 6.

[0060] The advantage of the second method is that the seed crystal can be directly installed and separated from the crucible cover 5 without subsequent operations. The disadvantage is that it will cause certain wear and tear on the seed crystal and the crucible cover.

[0061] As a preferred implementation in this embodiment, in step S2 of method 1, the seed crystal 7 and the crucible 8 can be suspended and fixed with the bonding surface facing downward by a fixture. The purpose of the suspended fixation is to avoid the end with the high-temperature adhesive layer 6 being squeezed against the container wall to prolong the processing time, and at the same time save the amount of sulfuric acid used.

[0062] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A seed crystal separation device, characterized in that: include Lifting unit (5): used to carry the crucible cover (8) and the seed crystal (7) and perform overall height adjustment; Wire cutting unit (2): used for cutting the high-temperature adhesive layer (6) between the crucible cover (8) and the seed crystal (7) to separate the crucible cover (8) from the seed crystal (7); The wire cutting unit (2) comprises a driven guide wheel (24) and a driving guide wheel (21) which are arranged opposite to each other and are sleeved with diamond wires, the driven guide wheel (24) and the driving guide wheel (21) are respectively mounted on corresponding first U-shaped plates (23), a motor (22) for driving the driving guide wheel (21) is mounted on the first U-shaped plate (23), the two first U-shaped plates (23) are respectively mounted on a U-shaped frame (25), the two lower ends of the U-shaped frame (25) are slidably connected to corresponding electric slide rails (26), and the electric slide rails (26) are mounted on the operating table (1); The lifting unit (5) comprises a carrying plate (51) mounted above the operating table (1) and having a receiving groove. The carrying plate (51) is slidably sleeved on two limiting columns (54), a first manual screw (53) is rotatably provided on the operating table (1), and the upper end of the first manual screw (53) is rotatably connected to the lower end of the carrying plate (51), and two L-shaped taking cavities (52) are oppositely provided on the carrying plate (51); It also includes an adjustment unit (3) for adjusting the distance between the upper diamond wire and the lower diamond wire and automatically adjusting the tension of the diamond wire, the adjustment unit (3) including two oppositely arranged adjustment guide wheels (31), the two adjustment guide wheels (31) being respectively mounted on corresponding second U-shaped plates (32), the upper ends of the two second U-shaped plates (32) being respectively fixed to the lower end of the U-shaped frame (25) and slidingly penetrated by square columns (33), the square columns (33) being in sliding contact with the second U-shaped plates (32) via balls (34) provided on the outer wall, and the two second U-shaped plates (32) being connected via a weight-increasing rod (35); The invention also includes a second manual screw (28) rotatably arranged on the U-shaped frame (25), the second manual screw (28) being provided with a forward thread segment and a reverse thread segment, the forward thread segment and the reverse thread segment being respectively sleeved with a ball nut (27), the two ball nuts (27) being respectively fixed to the upper ends of the corresponding first U-shaped plates (23), and the two first U-shaped plates (23) being both slidably arranged on the U-shaped frame (25).

2. A seed crystal separation device according to claim 1, characterized in that: The magnetic unit (4) further comprises a first magnetic block (41) mounted on the weight-increasing rod (35), a second magnetic block (43) mounted in the inner cavity of the magnetic isolation shell (42) on the U-shaped frame (25), and a movable rod (46) fixed to the second U-shaped plate (32) via a mounting block (47), wherein the magnetic poles of the first magnetic block (41) and the second magnetic block (43) are opposite to each other, a magnetic isolation plate (44) is slidably provided on the magnetic isolation shell (42), and the movable rod (46) is respectively connected to the magnetic isolation plate (44) via two mounting plates (45). 4) is fixedly connected to the U-shaped frame (25), the movable rod (46) is slidably engaged with the two mounting plates (45), a return spring (48) is fixed on the movable rod (46), and a contact plate (49) with a universal ball is fixed on the end of the return spring (48), an isosceles stop block (410) is fixed on one end of the movable rod (46), and also includes a stop vertical plate (411) fixed on the operating table (1) and capable of contacting the oblique edge of the isosceles stop block (410) to form a stop to drive the movable rod (46) to move horizontally.

3. A seed crystal separation device according to claim 2, characterized in that: Two groups of the blocking upright plates (411) are provided, and the two groups of the blocking upright plates (411) are arranged opposite to each other.

4. A seed crystal separation device according to claim 3, characterized in that: The contact edges (412) of the two blocking uprights (411) are both inclined and open outwards.

5. A method for using a seed crystal separation device according to any one of claims 1 to 4, characterized in that: The method includes method 1 or method 2, wherein method 1 includes the following steps: S1, using the adjustment unit (3) and the lifting unit (5) to adjust the distance and height between the upper diamond wire and the lower diamond wire, so that the lower end of the lower diamond wire is located above the bonding surface between the high-temperature adhesive layer (6) and the crucible cover (8), and the upper end of the upper diamond wire is located below the bonding surface between the high-temperature adhesive layer (6) and the seed crystal (7). After the position is adjusted, the control device is operated to cut the thicker high-temperature adhesive layer (6); S2, after the cutting is completed, the seed crystal (7) is separated from the crucible cover (8), and the end surfaces of the seed crystal (7) and the crucible cover (8) bonded to the high-temperature adhesive layer (6) are immersed in a container filled with sulfuric acid to carry out a chemical reaction and dissolve the residual high-temperature adhesive; S3, after the reaction is completed, rinse the immersed surface with water and then dry it; Method 2 includes the following steps: S1, using the adjustment unit (3) and the lifting unit (5) to adjust the distance and height between the upper diamond wire and the lower diamond wire, so that the lower end of the lower diamond wire is located below the bonding surface between the high-temperature adhesive layer (6) and the crucible cover (8), and the lower end of the upper diamond wire is located above the bonding surface between the high-temperature adhesive layer (6) and the seed crystal. After the position is adjusted, the control device is operated to cut the thicker high-temperature adhesive layer (6).

6. The method for using the seed crystal separation device according to claim 5, characterized in that: In step S2, the seed crystal (7) and the crucible cover (8) are fixed in the air with the bonding surface facing downwards by a fixture.

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