Method for multi-power heating of thick film heating disc by self-adapting voltage through PD protocol

Abstract

The application discloses a thick film heating disc multi-power heating method by self-adapting voltage through a PD protocol, and belongs to the technical field of heating discs. The application comprises a heating disc and a PCB board. The heating disc is provided with a resistance wire. The resistance wire is provided with L and N access points at two ends respectively. An A access point is arranged close to the N access point. B+ and C+ access points are arranged close to the L access point. The PCB board is provided with an MCU, a main power supply module, a secondary power supply module and an additional circuit module electrically connected with the MCU. The secondary power supply module is provided with a USBPD controller. The application divides the resistance wire of the existing thick film heating disc into multiple sections and connects the resistance wire to different power supply modules. At the same time, the application adopts an AC100-240V main power supply module and a secondary power supply module with a USBPD controller to realize household 220V power supply, power supply by various charging heads and power supply by various power banks, realize various power heating methods for the thick film heating disc, make the electric kettle, electric coffee pot and hot water cup adopting the technical scheme smaller in size, free from the AC100-240V power supply limitation and capable of realizing multi-scene heating.

Description

Technical Field

[0001] This invention belongs to the field of heating plate technology, and particularly relates to a method for achieving multi-power heating of a thick film heating plate through self-adaptive voltage via PD protocol. Background Technology

[0002] Thick-film heating plates are a type of thick-film heating device widely used in appliances requiring heating components, such as electric kettles, electric coffee makers, and electric water heaters. Thick-film heaters are popular due to their excellent thermal conductivity, large heat dissipation area, and high safety performance. Currently, thick-film heaters are supplied with AC100-240V, three-phase power, and DC12-24V, meaning a single product can only be used in a single voltage environment, limiting its applicability. To address this, Chinese invention patent 2018104405804 discloses a multi-voltage applicable thick-film heating plate, such as... Figure 1 As shown, the proposed solution involves setting up heating layers with both DC and AC inputs on the same thick-film heating plate, allowing a single heating product to be connected to either DC or AC power. However, its heating power is not adjustable, making it incompatible with various chargers on the market. Currently, the widespread use of smart products, especially mobile phones, has led to a proliferation of chargers. To fully utilize chargers and power banks, and to facilitate users' heating of electric cups anytime, anywhere, this paper proposes a method for multi-power heating of thick-film heating plates using a PD protocol with self-adaptive voltage. Summary of the Invention

[0003] The purpose of this invention is to provide a method for multi-power heating of a thick-film heating plate through self-adaptive voltage via the PD protocol, aiming to solve the problem in the background art of insufficient power supply methods for thick-film heating plates in existing electric cups and kettles, and the limitation of a single product to a single voltage environment. To achieve this objective, the technical solution adopted by this invention is: a method for multi-power heating of a thick-film heating plate through self-adaptive voltage via the PD protocol, including a heating plate and a PCB board. The heating plate has a resistance wire with L and N connection points at both ends. Near N is an A- connection point, and near L are B+ and C+ connection points. A-, B+, and C+ are electrically connected to the PCB board. The PCB board has an MCU, a main power supply module, a secondary power supply module, and an additional circuit module electrically connected to the MCU. The secondary power supply module has a USB PD controller. The heating method includes the following steps:

[0004] S1: Determine whether the main power supply module and the auxiliary power supply module are supplying power. If the main power supply module is supplying power, the L and N connection points of the heating element are energized and heated. Otherwise, the A-, B+, and C+ connection points of the heating element are supplied by the auxiliary power supply module.

[0005] S2: The USBPD controller judges the connection state of the auxiliary power supply module input interface, if supporting 20V / 5A, S3 is executed, otherwise S4 is executed;

[0006] S3: The USBPD controller selects 20 / 5A protocol, and after the protocol handshake is completed, the current PDIC information is sent to the MCU, and then S5 is executed;

[0007] S4: The USBPD controller selects the maximum wattage protocol, and after the protocol handshake is completed, the current PDIC information is sent to the MCU, and then S5 is executed;

[0008] S5: The MCU receives the PDIC package and sends the MOS tube demand to the PDIC, the corresponding MOS tube is opened, and the resistance wire starts to heat.

[0009] Compared with the existing power supply mode, the technical scheme supports more power supply schemes, including AC 100-240V power supply, various chargers on the market, power bank power supply, adjustable heating power, realizes fast heating, normal heating, and holding mode, etc., so that the electric kettle, electric coffee pot, and hot water cup using the technical scheme are smaller in size, can be free from the AC 100-240V power supply restriction, and can be used in multiple occasions.

[0010] Further, the voltage of the input end of the main power supply module includes AC 100-240V, the input end is connected with a 220V to 12V isolation power supply, the 220V to 12V isolation power supply is electrically connected with the MCU, the input end of the main power supply module is powered by 220V, and high-power fast heating is realized.

[0011] Further description of the foregoing scheme, the input interface of the auxiliary power supply module is a TYPE-C interface, the USBPD controller supports type-C protocol, USBPD 2.0, 3.0 specification and PPS requirement, and also supports mainstream fast charging protocols including Apple mode, Samsung mode, DCP, HVDCP, FCP, SCP, AFC, VooC, so that various chargers and power banks can supply power to the thick film heating disc.

[0012] The MOS tube includes a first MOS tube and a second MOS tube, the first MOS tube controls 20V or below input, and turns on and off the resistance wire from A- to B+; the second MOS tube controls 15V or below input, and turns on and off the resistance wire from A- to C+.

[0013] Further, a temperature controller is arranged on the thick film heating disc, the temperature controller is electrically connected with the MCU, and the temperature controller monitors according to different input powers.

[0014] Further, the resistance of the resistance wire A-to-B+ segment is 4Ω, the resistance of the resistance wire A-to-C+ segment is 6Ω, and the resistance of the resistance wire N-to-L segment is 160Ω. The 4Ω and 6Ω resistance wires form a double-resistance low-electricity safety voltage corresponding to the thick film heating disc to heat and ensure user safety in electricity use. The additional circuit module includes a display screen, an indicator light, a voltage monitor, a buzzer, a touch button, an optical coupler, etc., to ensure the visual, safe and intelligent use of the thick film heating disc.

[0015] Compared with the prior art, the present application divides the resistance wire of the existing thick film heating disc into multiple segments and connects them to different power supply modules, simultaneously uses an AC 100-240V main power supply module and a secondary power supply module with a USB PD controller, realizes household 220V power supply, power supply by various charging heads and power supply by various power banks, and the fast charging protocol supported by the secondary power supply module with the USB PD controller includes low-voltage large-current, high-voltage low-current and dynamic adjustment, realizes various power heating methods for the thick film heating disc, so that the electric kettle, electric coffee pot and hot water cup using the technical solution are smaller in size, can be free from the AC 100-240V power supply limit, realize multi-scene heating, and ensure user safety in electricity use by using low-power heating. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The schematic diagram provided for Chinese invention patent 2018104405804;

[0017] Figure 2 The thick film heating disc resistance wire schematic diagram provided for the embodiment of the present application;

[0018] Figure 3 The circuit principle block diagram provided for the embodiment of the present application;

[0019] Figure 4 The flowchart provided for the embodiment of the present application;

[0020] Figure 5 The power supply protocol supported by the secondary power supply module provided for the embodiment of the present application;

[0021] Figure 6 The voltage gear output table provided for the embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the related drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] The technical solutions of the patent will be further described in detail in combination with specific embodiments.

[0024] Please refer to Figures 2-6 As shown in the figure, the present application provides a multi-power heating method for thick film heating disc by adapting voltage through a PD protocol, which comprises a heating disc and a PCB board. The heating disc is provided with a resistance wire, and the two ends of the resistance wire are respectively provided with L and N access points. An A- access point is arranged near the N access point, and B+ and C+ access points are arranged near the L access point. The A-, B+ and C+ access points are electrically connected with the PCB board. Figure 2 As shown in the figure, the resistance of the A- to B+ segment of the resistance wire is 4Ω, the resistance of the A- to C+ segment of the resistance wire is 6Ω, and the resistance of the N to L segment of the resistance wire is 160Ω. The PCB board is provided with an MCU, a main power supply module, a secondary power supply module and an additional circuit module electrically connected with the MCU. The secondary power supply module is provided with a USB PD controller. The input end of the main power supply module has a voltage of 220V. The input end of the main power supply module is connected with a 220V to 12V isolation power supply to reduce and rectify the voltage to 12V direct current. The 12V direct current is connected to the MCU. The input end of the main power supply module is supplied with 220V power to realize high-power rapid heating. The heating power can reach 300W. The input interface of the secondary power supply module is a TYPE-C interface. The USB PD controller supports type-C protocol, USB PD2.0, 3.0 specification and PPS requirement, and also supports mainstream fast charging protocols including Apple mode, Samsung mode, DCP, HVDCP, FCP, SCP, AFC, VooC, etc. Figure 6 As shown in the figure, so that various chargers and power banks can supply power to the thick film heating disc. The thick film heating disc is provided with a temperature controller for protection. The temperature controller is electrically connected with the MCU. The temperature controller monitors according to different input power.

[0025] In order to understand the disclosure of the present application more thoroughly and comprehensively, the principle will be further explained in combination with the heating method steps.

[0026] Please refer to Figure 3 、 4 :

[0027] S1: Determine whether the main power supply module and the secondary power supply module supply power. If the main power supply module supplies power, the resistance wire L and N access points of the heating disc are electrified to heat and realize 300W high-power heating. Otherwise, the A-, B+ and C+ access points of the heating disc use the secondary power supply module for variable power heating.

[0028] S2: The USB PD controller determines the connection state of the input interface of the secondary power supply module. If 20V / 5A is supported, S3 is executed. Otherwise, S4 is executed.

[0029] S3: the USBPD controller selects the 20 / 5A protocol, and waits for the protocol handshake to be completed, then sends the current PDIC information to the MCU, and then executes S5;

[0030] S4: the USBPD controller selects the maximum wattage protocol, and waits for the protocol handshake to be completed, then sends the current PDIC information to the MCU, and then executes S5;

[0031] S5: the MCU receives the PDIC package and sends the MOS tube demand to the PDIC, and the corresponding MOS tube is opened, wherein the MOS tube includes a first MOS tube and a second MOS tube, the first MOS tube controls the input below 20V, and turns on and off the resistance wire from A- to B+; the second MOS tube controls the input below 15V, and turns on and off the resistance wire from A- to C+. When the protection module works normally, the resistance wire starts to heat, and other additional circuit modules ensure that the thick film heating disc works visually, safely and intelligently.

[0032] In summary, the present application divides the resistance wire of the existing thick film heating disc into multiple segments and connects them to different power supply modules, simultaneously uses an AC 100-240V main power supply module and a secondary power supply module with a USBPD controller, realizes household 220V power supply, multiple charging head power supply and various power bank power supply modes, the fast charging protocol supported by the secondary power supply module with the USBPD controller includes low voltage and large current, high voltage and low current and dynamic adjustment, realizes multiple power heating methods for the thick film heating disc, so that the electric kettle, electric coffee pot and hot water cup using the technical solution are smaller in size, can be free from the AC 100-240V power supply limit, realize multi-scene heating, and use low-power heating to ensure user safety.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] The above embodiments are only used to illustrate the present application, but not to limit the present application, and the ordinary skilled in the technical field can make various changes and modifications without departing from the spirit and scope of the present application, therefore all equivalent technical solutions also belong to the scope of the present application, and the patent protection scope of the present application should be defined by the claims.

Claims

1. A method for multi-power heating of a thick-film heating disc by adapting voltage through a PD protocol, comprising: a heating disc, which is provided with an integrally formed thick-film resistance wire, the resistance wire being configured as a plurality of heating sections with different resistance values along its length direction, specifically including: a first heating section between a first end (L) and a second end (N) of the resistance wire, a second heating section between a first access point (A-) and a second access point (B+), and a third heating section between the first access point (A-) and a third access point (C+); a control PCB, which is provided with an MCU, a main power supply module, a secondary power supply module, and an additional circuit module; the main power supply module is used for connecting AC 100-240V alternating current and supplying power to the first heating section (L-N); the secondary power supply module is provided with a USB PD controller and a TYPE-C input interface, and is used for connecting an external direct-current power supply conforming to the USB PD protocol; wherein the first access point (A-), the second access point (B+), and the third access point (C+) are all electrically connected with the control PCB, so that the second heating section (A--B+) and the third heating section (A--C+) can be selectively connected to the output loop of the secondary power supply module; the MCU is in communication connection with the USB PD controller, and is used for receiving power capability information (PDIC information) from the USB PD controller; the heating method comprises the following steps: S1: detecting the power supply state, if the main power supply module supplies power, then controlling the first heating section (L-N) to be powered on for full-power heating; S2: if the main power supply module does not supply power but the secondary power supply module connects to an external power supply, then performing protocol handshake between the USB PD controller and the external power supply to obtain voltage / current gear information supported by the current power supply; S3: the USB PD controller sends the obtained power capability information (PDIC information) to the MCU; S4: the MCU determines and selects a heating section matched with the current power capability according to the received power capability information: if the power supply supports 20V / 5A or a corresponding high-power gear, then the MCU controls the second heating section (A--B+) to be connected for heating; if the power supply does not support 20V / 5A but supports other lower-power gears, then the MCU controls the third heating section (A--C+) to be connected for heating; S5: the MCU outputs a control signal to the corresponding switch tube, so that the selected heating section is powered on to start heating.

2. The method of claim 1, wherein the PD protocol adaptive voltage is implemented in the thick film heating disc multi-power heating method. The input end of the main power supply module is connected with a 220V-to-12V isolation power supply, the output of the isolation power supply is electrically connected with the MCU, and is used for supplying power to the control circuit.

3. The method of claim 1, wherein the method is characterized by: The input interface of the secondary power supply module is a TYPE-C interface, the USB PD controller supports type-C protocol, USB PD 2.0, 3.0 specification, and PPS requirement, and also supports mainstream fast charging protocols including Apple mode, Samsung mode, DCP, HVDCP, FCP, SCP, AFC, and VooC.

4. The method of claim 1, wherein the method is characterized by: Also include the first MOS tube, the second MOS tube, the first MOS tube controls 20V below input, to A- to B+ resistance wire on-off power; The second MOS tube controls 15V below input, to A- to C+ resistance wire on-off power.

5. The method of claim 1, wherein the method is characterized by: The thick film heating disc is provided with a temperature controller, and the temperature controller is electrically connected with the MCU.

6. The method of claim 1, wherein the method is characterized by: The resistance of the resistance wire A- to B+ section is 4 Ω, the resistance of the resistance wire A- to C+ section is 6 Ω, and the resistance of the resistance wire N to L section is 160 Ω.

7. The method for multi-power heating of thick film heat disc by self-adapting voltage of PD protocol according to any one of claims 1-6, characterized in that: The additional circuit module comprises a display screen, an indicating lamp, a voltage monitoring device, a buzzer, a touch key and an optical coupler.

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