A dense pod equipment structure

Abstract

The application relates to a dense cabin section equipment structure, which comprises a cabin section shell and cabinets, the inner wall of the cabin section shell is uniformly provided with a plurality of sector heat dissipation plates in the circumferential direction, each sector heat dissipation plate is provided with a cabinet mounting surface for mounting a corresponding cabinet, so that the cabinets are distributed in a ring array in the cabin section shell, and a plurality of board cards are inserted into the cabinets and are distributed in rows along the width direction of the board cards. The application adopts the ring array distribution form of the cabinets in the cabin section shell, realizes the separate heat dissipation of the cabinets, each sector heat dissipation plate is directly connected with the cabin section shell and separately bears the heat consumption of the corresponding cabinet, the heat dissipation between the cabinets does not interfere with each other, the reliability of the heat dissipation is improved, and stronger heat dissipation and cooling capacity can be realized; meanwhile, the improved cabinet structure and cabin section shell structure are used, the mounting number of the cabinets is improved by several times, and compared with the prior art, the equipment capacity is greatly increased under the condition of the same cabin section shell size.

Description

Technical Field

[0001] This invention belongs to the technical field of heat dissipation structure for compartment equipment, and specifically relates to a dense compartment equipment structure. Background Technology

[0002] Equipment compartments used at high altitudes or underwater have relatively low external ambient temperatures, essentially functioning as temperature-controlled walls. Therefore, these compartments possess excellent heat dissipation capabilities and are widely used for cooling the equipment within them. For example... Figure 1 As shown, the existing compartment equipment structure includes components such as a chassis 01, a support plate 02, and a compartment shell 03; the chassis 01 is fixedly mounted on the support plate 02 via chassis mounting ears 011, and the support plate is fixed inside the compartment shell, as shown. Figure 2 As shown, the chassis is secured to the compartment shell via support plates. The chassis structure is as follows: Figure 3 As shown, the chassis includes a chassis shell 04, a circuit board 05, a pull-out aid, a locking strip 06, and a front panel 07. The circuit board 05 is inserted into the guide rail groove (circuit board mounting slot) inside the chassis shell, and is positioned by the locking strip 06 after insertion. When the equipment is working, the PCB components inside the circuit board generate heat, and the heat dissipation of the PCB components is conducted to the cold plate shell of the circuit board and the chassis shell. At this time, the chassis undergoes natural heat dissipation (radiation, convection) and heat conduction heat dissipation. The heat from natural heat dissipation is eventually conducted to the compartment shell through the surrounding air, achieving heat exchange with the outside. Heat conduction heat dissipation is conducted to the compartment shell through the support plate. It can be seen that the existing compartment equipment structure mainly has the following problems: 1. Long heat transfer path, large temperature rise of PCB components. Under high temperature conditions, the service life and reliability of PCB components are reduced, and the heat dissipation of PCB components is even worse when there are multiple chassis. 2. Without increasing the size of the support plate and the compartment shell, it is impossible to install more than 3 chassis. Figure 5 As shown, assuming the support plate is 440 mm wide and the width of a single chassis is 150 mm, a maximum of three chassis can be installed, and the close proximity between the chassis makes it even more difficult to achieve good heat dissipation. It can be seen that the existing chassis structure cannot make full use of the internal space of the compartment shell and achieve good heat dissipation. Summary of the Invention

[0003] In order to solve the technical problems existing in the prior art, the present invention provides a dense compartment equipment structure.

[0004] The objective of this invention and the technical problem it solves are achieved through the following technical solution. According to this invention, a dense compartment equipment structure includes a compartment shell and a chassis. The inner wall of the compartment shell is evenly distributed with several sector heat dissipation plates along its circumference. Each sector heat dissipation plate has a chassis mounting surface for mounting a corresponding chassis, so that the chassis are arranged in a ring array within the compartment shell. Several circuit boards arranged in rows along the width direction of the circuit boards are inserted into the chassis. The beneficial effects are: the ring array of chassis directly conducts heat to the compartment shell through the sector heat dissipation plates, shortening the heat conduction path, achieving individual heat dissipation for each chassis, improving heat dissipation reliability, and fully utilizing the internal space of the compartment shell, significantly increasing the circuit board capacity.

[0005] Furthermore, the circuit board includes a shape memory alloy plate, a cold plate, and a rear cover mounted on the rear end of the cold plate. When the rear cover is closed, a sealed mounting cavity is formed inside the cold plate to accommodate the PCB components. The shape memory alloy plate is located on the side of the cold plate facing the sector heat sink. When the PCB components generate heat, the shape memory alloy plate expands towards the sector heat sink and adheres to it. The beneficial effect is that by using the shape memory alloy plate on the circuit board, the shape memory alloy plate can contact the sector heat sink to transfer heat during operation, and retracts when not in operation without affecting the disassembly of the circuit board.

[0006] Furthermore, the shape memory alloy plate and the cold plate are connected by brazing.

[0007] Furthermore, the shape memory alloy plate is connected to the cold plate by screws, and silicone grease is applied between the shape memory alloy plate and the cold plate.

[0008] Furthermore, the cold plate is provided with a heat-conducting boss located inside the mounting cavity for contact and mating with PCB components.

[0009] Furthermore, the chassis includes a chassis shell, and the chassis shell is provided with a board mounting slot for inserting the board. Each board mounting position in the chassis shell for accommodating the board is provided with two relatively distributed board mounting slots.

[0010] Furthermore, one end of the chassis housing is provided with a chassis mounting lug, and the other end of the chassis housing is provided with a positioning guide pin; the chassis mounting surface of the sector heat sink is provided with chassis mounting screw holes that cooperate with the chassis mounting lug to achieve chassis fixation; the end of the sector heat sink away from the chassis mounting screw holes is provided with an assembly limiting stage, which is used for chassis housing abutment to achieve chassis assembly limiting; the assembly limiting stage is provided with a positioning pin hole that cooperates with the positioning guide pin.

[0011] Furthermore, two mounting ears are provided at intervals in the board insertion direction, and two positioning guide pins are provided at intervals in the board insertion direction; however, the present invention does not limit the number of mounting ears and positioning guide pins, and can be increased as appropriate according to actual conditions.

[0012] Furthermore, the board is equipped with a locking strip for engaging with the board mounting slot to achieve board insertion and positioning, and the board is also equipped with a puller to facilitate board removal.

[0013] Furthermore, the board includes a cold plate and a rear cover installed at the rear end of the cold plate. After the rear cover is closed, a sealed mounting cavity is formed inside the cold plate to accommodate PCB components. A thermally conductive pad is provided on the side of the cold plate facing the sector heat sink. The thermally conductive pad is used to adhere to the sector heat sink after the chassis is installed onto the sector heat sink.

[0014] Furthermore, the inner wall of the compartment shell is provided with eight sector heat dissipation plates evenly distributed along the circumference.

[0015] By employing the above technical solution, this invention adopts a novel chassis distribution form, using a ring array within the compartment shell to achieve individual heat dissipation for each chassis. Each sector's heat sink is directly connected to the compartment shell, independently handling the heat dissipation of its corresponding chassis. Heat dissipation between chassis does not interfere with each other, improving heat dissipation reliability and achieving stronger cooling capabilities. Simultaneously, the improved chassis and compartment shell structures allow for a significant increase in the number of chassis that can be installed, greatly increasing equipment capacity compared to existing technologies with the same compartment shell size.

[0016] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1 This is a structural diagram of the compartment equipment structure in the existing technology.

[0018] Figure 2 This is a schematic diagram of the fit between the chassis and the support plate in the existing technology.

[0019] Figure 3 This is an exploded structural diagram of the chassis in the existing technology.

[0020] Figure 4 This is a schematic diagram showing the dimensions of the support plate and the chassis in the existing technology.

[0021] Figure 5 This is a perspective view of a dense compartment equipment structure according to the present invention.

[0022] Figure 6 This is a front view schematic diagram of a dense compartment equipment structure according to the present invention.

[0023] Figure 7 This is a schematic diagram of the internal structure of the circuit board in this invention.

[0024] Figure 8 This is a side view of the circuit board in this invention.

[0025] Figure 9 This is a schematic diagram of the cooperation between the compartment shell and the sector heat sink in this invention.

[0026] Figure 10 This is a front view schematic diagram of the compartment shell and the sector heat sink plate after they are assembled in this invention.

[0027] Figure 11 This is a schematic diagram of the assembly of the chassis and the sector heat sink in this invention.

[0028] Figure 12 This is a side view of the chassis and sector heat sink assembled in this invention.

[0029] Figure 13 This is a schematic diagram of the chassis structure in this invention.

[0030] Figure 14 This is a side view of the chassis in this invention.

[0031] Figure 15 This is a perspective view of the sector heat sink in this invention.

[0032] Figure 16 This is a front view schematic diagram of the sector heat sink in this invention.

[0033] Figure 17 This is a schematic diagram of the assembly of the chassis shell and the sector heat sink in this invention.

[0034] Figure 18 This is a side view of the chassis housing and sector heat sink assembled in this invention.

[0035] Figure 19A This is a schematic diagram of a shape memory alloy in a contracted state at low temperatures.

[0036] Figure 19B yes Figure 19A A schematic diagram of shape memory alloys in a stretched state at high temperatures. Detailed Implementation

[0037] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and preferred embodiments.

[0038] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] like Figures 5 to 18 A dense compartment equipment structure includes a compartment shell 1 and a chassis 2. The compartment shell 1 is cylindrical, and a plurality of sector heat sinks 3 are evenly distributed along the circumference of the inner wall of the compartment shell 1. The chassis 2 is mounted on the corresponding sector heat sinks 3. The side of the sector heat sink 3 that connects to the compartment shell is an arc-shaped fixing end 31 that fits and conforms to the inner wall of the compartment shell, and the side of the sector heat sink 3 used for mounting the chassis is the chassis mounting surface 32. A circuit board 4 is installed inside the chassis 2. The sector heat sinks 3 are connected and fixed to the compartment shell 1 to achieve heat conduction. When the circuit board 4 is working, it generates heat, which can be conducted to the compartment shell through the chassis and the sector heat sinks, allowing the compartment shell to exchange heat with the external environment.

[0040] Combination Figures 7 to 8 In this embodiment, the board 4 includes a shape memory alloy plate 43, a cold plate 41, and a rear cover plate 42 mounted on the rear end of the cold plate. When the rear cover plate 42 is closed, a sealed mounting cavity 44 for accommodating PCB components is formed inside the cold plate 41. A heat-conducting boss 412 is provided on the back of the front housing 411 of the cold plate. The heat-conducting boss 412 contacts and engages with heat-generating components on the PCB, thereby facilitating heat transfer to the cold plate. The shape memory alloy plate 43 is attached to the front (outer surface) of the front housing of the cold plate. The shape memory alloy plate 43 utilizes the shape memory effect of the shape memory alloy. The shape memory effect refers to the plastic deformation of the shape memory alloy at low temperatures; when heated to a specific temperature, the alloy generates recovery stress, forcing it to return to its initial shape. Figure 19A The shape memory alloy shown, in strip or sheet form, is in a contracted state at low temperatures; it expands as the temperature rises, as... Figure 19B As shown. Combined with Figure 8After the circuit board is inserted into the chassis, the shape memory alloy plate 43 should face the heat sink of the corresponding sector of the chassis. When the PCB device generates heat, the shape memory alloy plate expands towards the corresponding sector heat sink, automatically adhering to the heat sink and generating a certain adhesion force, allowing the heat from the circuit board to be transferred to the chassis housing through the heat sink. The specific principle is as follows: The shape memory alloy plate and the cold plate are connected in a large-area contact manner. When the PCB device is working, heat is first conducted to the cold plate. For ease of description, the connection point between the shape memory alloy plate and the cold plate is called point A. The temperature at point A varies depending on the heat dissipation W of the PCB device. This establishes the relationship between the board's heat dissipation and the temperature t at point A. A The equation:

[0041] t A =f(W)

[0042] The expansion amount L of the shape memory alloy plate towards the sector heat sink varies depending on the temperature at point A, thus establishing t. A The equation for the expansion amount L:

[0043] L=f(t A )

[0044] When the expansion amount L of the shape memory alloy plate is greater than the gap between the shape memory alloy plate and the sector heat sink, the shape memory alloy plate can fit tightly against the sector heat sink to achieve heat transfer. When the board stops working and the temperature drops, the shape memory alloy plate contracts, thus detaching from the sector heat sink and facilitating board disassembly.

[0045] In this embodiment, the preferred connection methods between the shape memory alloy plate and the cold plate are as follows: First, the shape memory alloy plate and the cold plate are connected by low-temperature brazing; second, the shape memory alloy plate is connected to the cold plate using fasteners such as screws. In this case, silicone grease should be applied between the outer surfaces of the front housing of the shape memory alloy plate and the cold plate to achieve good thermal conductivity. In this embodiment, the front housing dimensions of the shape memory alloy plate and the cold plate are approximately the same. However, in other embodiments, the shape memory alloy plate can be smaller, for example, the shape memory alloy plate may only partially cover the front housing; or multiple shape memory alloy plates may be distributed, allowing for multi-point contact with the sector heat sink when heated and expanding.

[0046] The chassis 2 includes a chassis shell 21, and a plurality of the aforementioned circuit boards 4 are inserted into the chassis shell 21. The plurality of circuit boards 4 are arranged in a row along the width direction of the circuit boards. The circuit boards in the same chassis are at the same height in the thickness direction of the circuit boards. The chassis shell 21 is provided with circuit board mounting slots 211 for inserting circuit boards. Each circuit board mounting position in the chassis shell 21 that accommodates a circuit board has a pair of oppositely distributed circuit board mounting slots 211. It is worth noting that in the prior art, the circuit boards 4 are stacked and arranged along the thickness direction of the boards; while in this invention, the insertion direction of the boards is defined as the length extension direction of the boards, and the width extension direction of the boards is perpendicular to the insertion direction. Compared with the existing board arrangement, this invention is equivalent to rotating the boards by 90°. At this time, the boards and the chassis mounting surface 32 of the sector heat sink are arranged parallel to each other. This allows the larger side of the boards to face or be directly opposite the chassis mounting surface of the sector heat sink, which is beneficial for setting a larger shape memory alloy plate to increase the heat conduction area of ​​the cold plate and the sector heat sink in the working state, thereby achieving better heat conduction effect when the boards are working. In addition, the board distribution of this invention can significantly reduce the height of the chassis and avoid interference between circumferentially adjacent chassis and sector heat sinks, thus adapting to the scenario where the chassis are distributed in a ring array within the compartment shell, and thus allowing for a larger number of chassis to be arrayed in the circumferential direction. Furthermore, the board 4 is also equipped with a locking strip 45 and a pull-out aid 46. The locking strip is used to press against the inner wall of the board insertion slot after the board is inserted into place, thereby positioning the board. The pull-out aid provides a point of force when the board needs to be removed, facilitating the removal of the board. Since the structure and working principle of the locking device and the pull-out aid are existing technologies, they will not be described in detail here.

[0047] Combination Figures 13 to 16One end of the chassis housing 21 is provided with a chassis mounting lug 212, which has a housing mounting screw hole 2121. Correspondingly, a chassis mounting screw hole 321 is provided on the chassis mounting surface 32 of the sector heat sink. The screw passes through the housing mounting screw hole and engages with the chassis mounting screw hole to fix the chassis. The other end of the chassis housing 21 is provided with a positioning guide pin 213. The end (inner end) of the sector heat sink away from the chassis mounting screw hole is provided with an assembly limiting stage 33. The assembly limiting stage is used to indicate the installation position of the chassis. When the chassis abuts against the assembly limiting stage, it is considered that the chassis is installed in the width direction of the board. The assembly limiting stage is provided with a positioning pin hole 331 that engages with the positioning guide pin. Preferably, there are two positioning guide pins 213 in the board insertion direction. Because the installation space inside the compartment shell is limited during chassis installation, a positioning guide pin and positioning pin hole are used inside the compartment shell. This eliminates the need for installation tools to be inserted into the compartment shell. During chassis assembly, the chassis is first pushed inward into the compartment shell. After the positioning guide pin is inserted into the positioning pin hole, the inner end of the chassis abuts against the assembly limit platform. Then, the mounting screw holes of the shell and the mounting screw holes of the chassis automatically align. Finally, the outer end of the chassis is secured by screws. The chassis installation and positioning process is very convenient.

[0048] In another embodiment, the board can also be made of ordinary materials, eliminating the need for a shape memory alloy plate. The board includes a cold plate and a back cover mounted on the rear end of the cold plate. When the back cover is closed, a sealed mounting cavity is formed inside the cold plate to accommodate the PCB components. A thermally conductive pad is provided on the side of the cold plate facing the sector heatsink. This pad is used to adhere to the sector heatsink after the chassis is installed and positioned. During installation, the thermally conductive pad is pre-installed on the board. The thickness of the thermally conductive pad is greater than the gap between the board and the sector heatsink. Therefore, after the chassis is installed and positioned, the thermally conductive pad is compressed in its thickness direction to achieve a tight fit with the sector heatsink, ensuring stable heat conduction.

[0049] In this embodiment, eight sector heat sinks are distributed circumferentially, corresponding to eight chassis. Assuming each chassis consumes 100W of heat, the existing support plate can only accommodate three chassis, meaning the support plate bears three times the heat dissipation load, and the heat dissipation between chassis can interfere with each other. This invention achieves individual chassis heat dissipation. Circumferentially, each chassis is positioned between two adjacent sector heat sinks, with each sector heat sink directly connected to the compartment shell, shortening the heat transfer path and independently handling 100W of heat dissipation. There is virtually no interference between chassis, significantly improving heat dissipation reliability. Furthermore, the chassis of this invention adopt a ring array distribution, fully utilizing the internal space of the compartment shell. It can accommodate a total of eight chassis (boards) compared to the existing technology, which can only accommodate a maximum of three chassis, greatly increasing equipment capacity.

[0050] In summary, the dense compartment equipment structure designed by this invention can effectively shorten the heat transfer path, more effectively reduce the equipment temperature, increase the equipment installation capacity, and improve the reliability and lifespan of the equipment.

[0051] The above description is merely a preferred embodiment of the present invention, and all aspects not detailed herein are existing technologies. Any simple modifications, equivalent changes, and alterations made by those skilled in the art to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A dense pod plant structure comprising a pod shell and a cabinet, characterized by: The inner wall of the cabin section shell is circumferentially and uniformly provided with a plurality of radially extending sector heat dissipation plates, each of which is provided with a chassis mounting surface for mounting a corresponding chassis, so that the chassis are arranged in a ring array in the cabin section shell, and a plurality of boards are inserted into the chassis and arranged in a row along the width direction of the boards, and the insertion direction of the boards is the length extension direction of the boards. The board includes a shape memory alloy plate, a cold plate, and a rear cover mounted at the rear end of the cold plate. After the rear cover is closed, the cold plate forms a closed mounting cavity for accommodating the PCB device. The cold plate is provided with the shape memory alloy plate on the side facing the sector heat dissipation plate. When the PCB device generates heat, the shape memory alloy plate can expand towards the sector heat dissipation plate and adhere to the sector heat dissipation plate.

2. A dense pod section equipment structure according to claim 1, wherein: The shape memory alloy plate and the cold plate are connected by brazing.

3. A dense pod section equipment structure according to claim 1, wherein: The shape memory alloy plate is connected to the cold plate by screws, and silicon grease is coated between the shape memory alloy plate and the cold plate.

4. A dense pod section equipment structure according to claim 1, wherein: The cold plate is provided with a heat-conducting boss inside the mounting cavity for contact with the PCB device.

5. A dense pod section equipment structure according to claim 1, wherein: The chassis includes a chassis shell, and the chassis shell is provided with a board mounting slot for inserting the board. The board mounting slot is provided with two oppositely distributed board mounting slots for accommodating each board.

6. A dense pod section apparatus structure according to claim 5, wherein: One end of the chassis shell is provided with a chassis fixing ear, and the other end of the chassis shell is provided with a positioning guide pin. The chassis mounting surface of the sector heat dissipation plate is provided with a chassis assembly screw hole for cooperating with the chassis fixing ear to fix the chassis. The end of the sector heat dissipation plate away from the chassis assembly screw hole is provided with an assembly limiting table for abutting and cooperating with the chassis shell to limit the assembly of the chassis. The assembly limiting table is provided with a positioning pin hole for cooperating with the positioning guide pin.

7. A dense pod section apparatus structure as claimed in claim 5, wherein: The board is provided with a locking strip for cooperating with the board mounting slot to realize the insertion and positioning of the board. The board is also provided with a puller for facilitating the disassembly of the board.

8. A dense pod section equipment structure according to claim 1, wherein: The inner wall of the cabin section shell is circumferentially and uniformly provided with eight sector heat dissipation plates.

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