Temperature and humidity control methods, systems, and computer storage media for maintenance and storage devices

Abstract

This invention discloses a temperature and humidity control method, system, and computer storage medium for a maintenance and storage device. The temperature and humidity control method includes: S1, obtaining the temperature setting range and humidity setting range of the storage cavity; S2, obtaining the initial internal temperature of the storage cavity, and adjusting the internal temperature of the storage cavity to the temperature setting range using the temperature adjustment system based on the initial internal temperature and the temperature setting range; S3, obtaining the initial internal humidity of the storage cavity, and adjusting the internal humidity of the storage cavity to the humidity setting range using the humidification system and the dehumidification system based on the initial internal humidity and the humidity setting range. This invention provides a temperature and humidity control method, system, and computer storage medium for a maintenance and storage device that fully considers the influence of the external ambient temperature and humidity on the internal temperature and humidity of the storage cavity, thus improving the storage and maintenance effect of the maintenance and storage device.

Description

Technical Field

[0001] This invention relates to the field of storage equipment technology, and in particular to a method, system, and computer storage medium for temperature and humidity control of a maintenance storage device. Background Technology

[0002] As people's living standards improve, the number of people using tobacco products is increasing. Tobacco products generally include cigars and cigarettes. This article will use cigars as an example.

[0003] Generally speaking, cigars require specific temperature and humidity conditions for storage and maintenance. Typically, the ideal temperature range is between 16°C and 20°C, and the humidity between 60% and 70%. Currently, most cigars are stored in wooden humidors or wine cabinets. However, these existing humidors or wine cabinets cannot effectively control and regulate the temperature and humidity inside, thus failing to achieve the goal of long-term storage and maintenance of cigars.

[0004] To preserve cigars for extended periods, specialized cigar storage boxes have emerged on the market, typically including refrigeration, humidification, and dehumidification systems. However, the dehumidification systems in existing cigar storage boxes generally employ physical methods, using desiccants or other dehumidifying agents. The effectiveness of these agents diminishes over time, leading to inconsistent dehumidification. Therefore, to ensure proper dehumidification, the desiccant in the dehumidification components must be frequently replaced. Furthermore, the dehumidification effect of desiccant-based systems is poorly controllable, making it difficult to adjust the box's performance based on storage needs and other factors, thus failing to meet user requirements.

[0005] In addition, although existing cigar storage boxes can adjust the temperature and humidity inside, their methods often ignore the influence of the environment in which the storage box is used. In particular, when the environment is characterized by low temperature, high temperature, low humidity, and / or high humidity, the existing methods can cause significant discrepancies between the set temperature and humidity and the actual temperature and humidity, resulting in poor storage and maintenance of cigars. Summary of the Invention

[0006] The purpose of this invention is to provide a method, system and computer storage medium for temperature and humidity control of a maintenance storage device, which fully considers the influence of the external ambient temperature and humidity of the maintenance storage device on the internal temperature and humidity of the storage cavity, thereby improving the storage and maintenance effect of the maintenance storage device and overcoming the shortcomings of the prior art.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A method for controlling temperature and humidity in a maintenance and storage device is applied to the maintenance and storage device, wherein the maintenance and storage device includes a storage box body, a temperature regulation system, a humidification system and a dehumidification system, and the storage box body has a storage cavity inside;

[0009] Includes the following steps:

[0010] S1. Obtain the temperature setting range and humidity setting range of the storage cavity;

[0011] S2. Obtain the initial internal temperature of the storage cavity, and adjust the internal temperature of the storage cavity to the set temperature range according to the initial internal temperature and the set temperature range through the temperature adjustment system.

[0012] S3. Obtain the initial humidity inside the storage cavity, and adjust the humidity inside the storage cavity to the set humidity range through the humidification system and the dehumidification system according to the initial humidity inside the cavity and the humidity setting range.

[0013] Preferably, the temperature control system is installed on the storage box body. The temperature control system includes a first conductive component, a semiconductor cooling and heating component, and a second conductive component connected sequentially from the inside to the outside. The semiconductor cooling and heating component includes a first working end face and a second working end face. The first working end face is in contact with the first conductive component, and the second working end face is in contact with the second conductive component. The first conductive component faces the storage cavity, and the second conductive component faces the outside of the storage box body.

[0014] Step S2 includes:

[0015] S21. Obtain the initial internal temperature of the storage cavity and determine whether the initial internal temperature of the storage cavity meets the temperature setting range.

[0016] If the initial internal temperature of the storage cavity does not meet the set temperature range, then step S22 is executed;

[0017] If the initial internal temperature of the storage cavity meets the set temperature range, then step S23 is executed;

[0018] S22. Based on the initial internal temperature and temperature setting range of the storage cavity, determine whether the temperature regulation system performs a cooling action or a heating action;

[0019] If the initial internal temperature of the storage cavity is greater than the upper limit of the temperature setting range, the temperature regulation system performs a cooling action until the current internal temperature of the storage cavity meets the temperature setting range, and then executes step S23.

[0020] If the initial internal temperature of the storage cavity is less than the lower limit of the temperature setting range, the temperature regulation system performs a heating action until the current internal temperature of the storage cavity meets the temperature setting range, and then executes step S23.

[0021] S23. Obtain the heat preservation power, adjust the operating power of the semiconductor cooling and heating element to the heat preservation power, and dynamically adjust the first working end face of the semiconductor cooling and heating element to be a cold end face or a hot end face, so that the real-time cavity temperature of the storage cavity meets the temperature setting range.

[0022] Preferably, in step S23, dynamically adjusting the first working end face of the semiconductor cooling / heating element to be a cold end face or a hot end face includes:

[0023] The real-time internal temperature of the storage cavity is continuously acquired;

[0024] If the real-time internal temperature of the storage cavity is greater than or equal to the lower limit of the temperature setting range, then the first working end face of the semiconductor cooling heating element is adjusted to the cold end face.

[0025] If the real-time internal temperature of the storage cavity is less than the lower limit of the temperature setting range, then the first working end face of the semiconductor cooling heating element is adjusted to the hot end face.

[0026] Preferably, obtaining the insulation power includes:

[0027] Obtain the volume of the storage cavity, and obtain the external ambient temperature and humidity of the maintenance storage device;

[0028] The heat preservation power is obtained based on the volume of the storage cavity, the external ambient temperature, the external ambient humidity, and the temperature setting range.

[0029] Preferably, the temperature control system performs a cooling action, including:

[0030] The external ambient temperature of the maintenance storage device is obtained. Based on the initial internal temperature of the storage cavity, the external ambient temperature, and the temperature setting range, the cooling power of the semiconductor cooling heating element is obtained. The first working end face of the semiconductor cooling heating element is adjusted to the cold end face, and the operating power of the semiconductor cooling heating element is adjusted to the cooling power to perform the cooling action.

[0031] The temperature control system performs a heating action, including:

[0032] The external ambient temperature of the maintenance storage device is obtained. Based on the initial internal temperature of the storage cavity, the external ambient temperature, and the temperature setting range, the heating power of the semiconductor cooling heating element is obtained. The first working end face of the semiconductor cooling heating element is adjusted to the hot end face, and the operating power of the semiconductor cooling heating element is adjusted to the heating power to perform the heating action.

[0033] Preferably, the dehumidification system is installed on the storage box body. The dehumidification system includes a semiconductor cooling chip, a condensation component, and a heat dissipation component connected sequentially from the inside to the outside. The semiconductor cooling chip includes a cold end face and a hot end face. The cold end face is in contact with the condensation component, and the hot end face is in contact with the heat dissipation component. The condensation component faces the storage cavity, and the heat dissipation component faces the outside of the storage box body.

[0034] Step S3 includes:

[0035] S311. Obtain the initial humidity inside the storage cavity and determine whether the initial humidity inside the storage cavity meets the humidity setting range.

[0036] If the initial humidity inside the storage cavity does not meet the humidity setting range, then step S312 is executed;

[0037] If the initial humidity inside the storage cavity meets the humidity setting range, then step S313 is executed;

[0038] S312. Based on the initial humidity inside the storage cavity and the humidity setting range, determine whether to perform a humidification action or a dehumidification action.

[0039] If the initial humidity inside the storage chamber is greater than the upper limit of the humidity setting range, then a dehumidification action is performed until the current humidity inside the storage chamber meets the humidity setting range, and then step S313 is executed.

[0040] If the initial humidity inside the storage chamber is less than the lower limit of the humidity setting range, a humidification action is performed until the current humidity inside the storage chamber meets the humidity setting range, and step S313 is executed.

[0041] S313. Obtain the humidification power, adjust the operating power of the semiconductor cooling chip to the humidification power, dynamically turn on the humidification system and turn off the dehumidification system, or turn on the dehumidification system and turn off the humidification system, so that the real-time humidity inside the storage cavity meets the humidity setting range.

[0042] Preferably, the dehumidification action includes:

[0043] The current internal temperature of the storage chamber is obtained, and the external ambient temperature and humidity of the maintenance storage device are also obtained.

[0044] The temperature compensation value is obtained based on the external ambient temperature, external ambient humidity, and the current internal temperature of the storage cavity;

[0045] The target dehumidification temperature is calculated based on the current internal temperature of the storage chamber and the temperature compensation value.

[0046] Target dehumidification temperature = current internal temperature of the storage chamber - temperature compensation value;

[0047] The target dehumidification power of the semiconductor cooling chip is obtained based on the target dehumidification temperature.

[0048] The dehumidification system is turned on, and the operating power of the semiconductor cooling chip is adjusted to the target dehumidification power to perform the dehumidification action;

[0049] The humidification process is performed as follows:

[0050] The humidification system is activated and performs humidification actions according to preset humidification parameters.

[0051] Preferably, the dehumidification system is installed on the storage box body. The dehumidification system includes a semiconductor cooling chip, a condensation component, and a heat dissipation component connected sequentially from the inside to the outside. The semiconductor cooling chip includes a cold end face and a hot end face. The cold end face is in contact with the condensation component, and the hot end face is in contact with the heat dissipation component. The condensation component faces the storage cavity, and the heat dissipation component faces the outside of the storage box body.

[0052] Step S3 includes:

[0053] S321. The humidification system is started and performs humidification according to the preset humidification parameters; at the same time, the initial dehumidification power is acquired, the dehumidification system is turned on, and the operating power of the semiconductor cooling chip is adjusted to the initial dehumidification power to perform dehumidification.

[0054] S322. Obtain the current humidity inside the storage cavity and determine whether the current humidity inside the storage cavity meets the humidity setting range.

[0055] If the current humidity inside the storage cavity does not meet the humidity setting range, then step S323 is executed;

[0056] If the current humidity inside the storage cavity meets the set humidity range, then step S324 is executed;

[0057] S323. Adjust the operating power of the semiconductor cooling chip according to the current internal humidity and humidity setting range of the storage cavity;

[0058] If the current humidity inside the storage cavity is greater than the upper limit of the humidity setting range, the operating power of the semiconductor cooling chip is gradually increased, and the real-time humidity inside the storage cavity is continuously acquired until the real-time humidity inside the storage cavity meets the humidity setting range, and step S324 is executed.

[0059] If the current humidity inside the storage cavity is less than the lower limit of the humidity setting range, the operating power of the semiconductor cooling chip is gradually reduced, and the real-time humidity inside the storage cavity is continuously acquired until the real-time humidity inside the storage cavity meets the humidity setting range, and step S324 is executed.

[0060] S324. The humidification system performs humidification according to preset humidification parameters; the dehumidification system performs dehumidification according to the current dehumidification power.

[0061] A temperature and humidity control system for a maintenance and storage device is applied to the maintenance and storage device, wherein the maintenance and storage device includes a storage box body, a temperature regulation system, a humidification system and a dehumidification system, and the storage box body has a storage cavity inside;

[0062] It includes an acquisition module, a temperature control module, and a humidity control module;

[0063] The acquisition module is used to acquire the temperature setting range and humidity setting range of the storage cavity;

[0064] The temperature regulation module is used to obtain the initial internal temperature of the storage cavity, and adjust the internal temperature of the storage cavity to the set temperature range according to the initial internal temperature and the set temperature range through the temperature regulation system.

[0065] The humidity control module is used to obtain the initial humidity inside the storage cavity, and adjust the humidity inside the storage cavity to the set humidity range through the humidification system and the dehumidification system according to the initial humidity inside the cavity and the humidity setting range.

[0066] A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the temperature and humidity control method of the above-described maintenance storage device.

[0067] The technical solutions provided by the embodiments of the present invention may include the following beneficial effects:

[0068] This solution proposes a method, system, and computer storage medium for temperature and humidity control of a maintenance storage device. It fully considers the influence of the external ambient temperature and humidity of the maintenance storage device on the internal temperature and humidity of the storage chamber, which is conducive to improving the storage and maintenance effect of the maintenance storage device and overcoming the shortcomings of the prior art. Attached Figure Description

[0069] Figure 1 This is a schematic diagram of the structure of the maintenance and storage device used in the temperature and humidity control method of the maintenance and storage device of the present invention.

[0070] Figure 2 This is a partial structural schematic diagram of the maintenance and storage device used in the temperature and humidity control method of the maintenance and storage device of the present invention.

[0071] Figure 3 This is a schematic diagram of the temperature regulation system in the maintenance and storage device used in the temperature and humidity control method of the maintenance and storage device of the present invention.

[0072] Figure 4 This is a schematic diagram of the dehumidification system in the maintenance and storage device used in the temperature and humidity control method of the maintenance and storage device of the present invention.

[0073] Figure 5 This is a schematic flowchart of a temperature and humidity control method for a maintenance and storage device according to the present invention.

[0074] Figure 6 This is a structural block diagram of the temperature and humidity control system of a maintenance and storage device according to the present invention.

[0075] The components include: storage box body 1, storage cavity 101, temperature regulation system 2, semiconductor cooling and heating component 21, first conduction component 22, second conduction component 23, humidification system 3, dehumidification system 4, semiconductor cooling chip 41, condensation component 42, and heat dissipation component 43. Detailed Implementation

[0076] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0077] This technical solution provides a temperature and humidity control method for a maintenance and storage device, which is applied to the maintenance and storage device. The maintenance and storage device includes a storage box body 1, a temperature regulation system 2, a humidification system 3 and a dehumidification system 4. The storage box body 1 has a storage cavity 101 inside.

[0078] Includes the following steps:

[0079] S1. Obtain the temperature setting range and humidity setting range of the storage cavity 101;

[0080] S2. Obtain the initial internal temperature of the storage cavity 101, and adjust the internal temperature of the storage cavity 101 to the set temperature range according to the initial internal temperature and the set temperature range through the temperature adjustment system 2.

[0081] S3. Obtain the initial humidity inside the storage cavity 101, and adjust the humidity inside the storage cavity 101 to the set humidity range through the humidification system 3 and the dehumidification system 4 according to the initial humidity inside the cavity and the humidity setting range.

[0082] To improve the storage and maintenance effect of a maintenance storage device, this solution proposes a temperature and humidity control method for the device. The maintenance storage device includes a storage box body 1, a temperature regulation system 2, a humidification system 3, and a dehumidification system 4. Figure 1-5 As shown, the temperature control system 2 is used to raise and lower the temperature inside the storage chamber 101, so as to adjust the temperature inside the maintenance storage device as needed. The humidification system 3 is used to increase the humidity inside the storage chamber 101. The dehumidification system 4 is used to reduce the humidity inside the storage chamber 101, so as to adjust the humidity inside the maintenance storage device as needed.

[0083] Under normal circumstances, the two parameters of the storage cavity 101, namely the internal temperature and internal humidity (i.e., the relative humidity inside the storage cavity 101), are interrelated. That is, temperature regulation will affect humidity changes. Therefore, temperature regulation takes precedence over humidity control. Temperature regulation is completed first to keep the internal temperature of the storage cavity 101 within the set temperature range. Once the internal temperature of the storage cavity 101 meets the requirements, humidity control is then completed. In this way, humidity regulation (humidification / dehumidification) has little or no impact on the internal temperature of the storage cavity 101.

[0084] It should be noted that step S1 includes obtaining the temperature setting range and humidity setting range of the storage chamber 101. In one embodiment, the temperature setting range and humidity setting range can be the default range of the temperature and humidity control system of the maintenance storage device, which is usually the factory setting of the maintenance storage device product; or they can be input and set by the user through a control panel, smartphone or other smart terminal. This control method is not limited here.

[0085] To further explain, the temperature regulation system 2 is installed on the storage box body 1. The temperature regulation system 2 includes a first conductive component 22, a semiconductor cooling and heating component 21, and a second conductive component 23 connected sequentially from the inside to the outside. The semiconductor cooling and heating component 21 includes a first working end face and a second working end face. The first working end face is in contact with the first conductive component 22, and the second working end face is in contact with the second conductive component 23. The first conductive component 22 faces the storage cavity 101, and the second conductive component 23 faces the outside of the storage box body 1.

[0086] Step S2 includes:

[0087] S21. Obtain the initial internal temperature of the storage cavity 101 and determine whether the initial internal temperature of the storage cavity 101 meets the temperature setting range.

[0088] If the initial internal temperature of the storage cavity 101 does not meet the temperature setting range, then step S22 is executed;

[0089] If the initial internal temperature of the storage cavity 101 meets the temperature setting range, then step S23 is executed;

[0090] S22. Based on the initial internal temperature and temperature setting range of the storage cavity 101, determine whether the temperature regulation system 2 performs a cooling action or a heating action;

[0091] If the initial internal temperature of the storage cavity 101 is greater than the upper limit of the temperature setting range, the temperature regulation system 2 performs a cooling action until the current internal temperature of the storage cavity 101 meets the temperature setting range, and then executes step S23.

[0092] If the initial internal temperature of the storage cavity 101 is less than the lower limit of the temperature setting range, the temperature regulation system 2 performs a heating action until the current internal temperature of the storage cavity 101 meets the temperature setting range, and then executes step S23.

[0093] S23. Obtain the heat preservation power, adjust the operating power of the semiconductor cooling and heating element 21 to the heat preservation power, and dynamically adjust the first working end face of the semiconductor cooling and heating element 21 to be a cold end face or a hot end face, so that the real-time cavity temperature of the storage cavity 101 meets the temperature setting range.

[0094] Furthermore, this control method is applied to a temperature regulation system 2 with semiconductor refrigeration and heating functions, which includes a first conductive component 22, a semiconductor refrigeration and heating component 21, and a second conductive component 23 connected sequentially from the inside to the outside. The semiconductor refrigeration and heating component 21 includes a first working end face and a second working end face. When the first working end face is a cold end face, the second working end face is a hot end face, and the temperature regulation system 2 achieves a refrigeration function for the storage cavity 101; when the first working end face is a hot end face, the second working end face is a cold end face, and the temperature regulation system 2 achieves a heating function for the storage cavity 101, such as... Figure 3 As shown. The first conductive component 22 is used to transfer the cold or heat generated by the first working end face of the semiconductor cooling and heating element 21 to the storage cavity 101, and the second conductive component 23 is used to transfer the heat or cold generated by the second working end face of the semiconductor cooling and heating element 21 to the outside of the storage box body 1, so as to improve the temperature regulation efficiency of the semiconductor cooling and heating element 21.

[0095] It should be noted that the semiconductor cooling heating element 21 in this solution is made using the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through a thermocouple composed of two semiconductor materials, one end of the thermocouple absorbs heat and the other end releases heat. By utilizing the Peltier effect of the semiconductor cooling material, applying direct current to the semiconductor cooling heating element 21 can realize the cooling function of the temperature regulation system 2 and deliver cold air to the storage cavity 101. By changing the polarity of the input voltage of the semiconductor cooling heating element 21, that is, changing the direction of the current in the semiconductor cooling heating element 21, the heating function of the temperature regulation system 2 can be realized without changing the structure, and hot air can be delivered to the storage cavity 101.

[0096] Specifically, step S2, the temperature regulation process in this control method, includes the following steps:

[0097] In step S21, it is first determined whether the initial internal temperature of the storage cavity 101 meets the temperature setting range. If it does not meet the temperature setting range, the temperature regulation system 2 executes the cooling or heating action in step S22 of the temperature regulation process as needed, so that the internal temperature of the storage cavity 101 can quickly and accurately reach the temperature setting range, and then enters the heat preservation stage in step S23 of the temperature regulation process. If the initial internal temperature of the storage cavity 101 meets the temperature setting range, it directly enters the heat preservation stage in step S23 of the temperature regulation process, and the temperature regulation system 2 executes the heat preservation action.

[0098] When the temperature inside the storage chamber 101 reaches the set temperature range, if the operation of the temperature regulation system 2 is stopped at this time, the temperature inside the storage chamber 101 will change at a certain heating rate (or cooling rate) until it reaches a temperature range similar to the external ambient temperature of the storage device. Therefore, the heat preservation stage in this control method requires the continuous operation of the temperature regulation system 2 to ensure that the temperature inside the chamber is maintained.

[0099] Furthermore, since the internal temperature of the storage chamber 101 has reached the required storage temperature range of the maintenance storage device after step S22, and the external ambient temperature of the maintenance storage device will not change significantly or within the allowable error range in a short period of time, this control method allows the temperature regulation system 2 to operate continuously at a low maintenance power (relative to the cooling power when performing the cooling action and the heating power when performing the heating action) in the heat preservation stage of step S23. It only dynamically adjusts the conversion between its cold end face and hot end face (i.e., the conversion of the DC power direction) to keep the real-time internal temperature of the storage chamber 101 within the set temperature range, which can both meet the storage temperature conditions of cigars and achieve the purpose of energy saving.

[0100] It should be noted that the heat preservation power during the heat preservation stage in this control method can be the default range of the temperature and humidity control system of the curing and storage device, which is usually the factory setting of the curing and storage device product; or it can be calculated by the temperature regulation system. This control method does not limit it here.

[0101] To further explain, in step S23, dynamically adjusting the first working end face of the semiconductor cooling / heating element 21 to be a cold end face or a hot end face includes:

[0102] The real-time internal temperature of the storage cavity 101 is continuously acquired;

[0103] If the real-time internal temperature of the storage cavity 101 is greater than or equal to the lower limit of the temperature setting range, then the first working end face of the semiconductor cooling heating element 21 is adjusted to the cold end face.

[0104] If the real-time internal temperature of the storage cavity 101 is less than the lower limit of the temperature setting range, then the first working end face of the semiconductor cooling heating element 21 is adjusted to be the hot end face.

[0105] In a preferred embodiment of this technical solution, the heat preservation stage in step S23 of this control method requires continuous acquisition of the real-time internal temperature of the storage cavity 101, and the comparison result with the temperature setting range is used as the basis for the conversion between the cold end face and the hot end face. Through simple logical comparison, the internal temperature of the storage cavity 101 can be maintained, and the performance is very reliable.

[0106] To further explain, obtaining the insulation power includes:

[0107] The volume of the storage cavity 101 is obtained, and the external ambient temperature and humidity of the maintenance storage device are obtained;

[0108] The heat preservation power is obtained based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the temperature setting range.

[0109] Existing temperature control methods for cigar storage boxes often neglect the impact of the operating environment on their internal performance indicators. Especially when the environment is characterized by low temperatures, high temperatures, low humidity, and / or high humidity, existing methods can lead to significant discrepancies between the set and actual temperatures, resulting in ineffective cigar storage and preservation. Therefore, this control method incorporates the external temperature and humidity of the storage device into the temperature control process during the insulation phase. This improves the precision of temperature regulation within the storage chamber 101, thereby enhancing the overall storage and preservation effect of the device.

[0110] Furthermore, since the internal temperature of the storage cavity 101 tends to change towards the external ambient temperature of the storage device after the temperature regulation system 2 stops operating, the rate of this change depends not only on the external ambient temperature but also on the volume of the storage cavity 101 and the external ambient humidity. Therefore, in another preferred embodiment of this technical solution, the control method obtains the insulation power of the temperature regulation system 2 during the insulation phase based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the temperature setting range, so as to ensure its insulation effect while saving energy.

[0111] It should be noted that in some embodiments, the mapping relationship between the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, the temperature setting range, and the heat preservation power in this solution can be derived by summarizing a mapping relationship table through preliminary experiments in a simulated environment. Then, during the heat preservation stage of the control method, the heat preservation power is obtained by looking up the table based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the temperature setting range. In other embodiments, the mapping relationship between the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, the temperature setting range, and the heat preservation power in this solution can be derived by summarizing a mapping formula through preliminary experiments in a simulated environment. Then, during the heat preservation stage of the control method, the heat preservation power is calculated based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the temperature setting range. This is not limited here.

[0112] To further explain, the temperature control system 2 performs a cooling action, including:

[0113] The external ambient temperature of the maintenance storage device is obtained. Based on the initial internal temperature of the storage cavity 101, the external ambient temperature, and the temperature setting range, the cooling power of the semiconductor cooling heating element 21 is obtained. The first working end face of the semiconductor cooling heating element 21 is adjusted to the cold end face, and the operating power of the semiconductor cooling heating element 21 is adjusted to the cooling power to perform the cooling action.

[0114] The temperature control system 2 performs a heating action, including:

[0115] The external ambient temperature of the maintenance storage device is obtained. Based on the initial internal temperature of the storage cavity 101, the external ambient temperature, and the temperature setting range, the heating power of the semiconductor cooling heating element 21 is obtained. The first working end face of the semiconductor cooling heating element 21 is adjusted to the hot end face, and the operating power of the semiconductor cooling heating element 21 is adjusted to the heating power to perform the heating action.

[0116] Since the purpose of step S22 of this control method is to quickly and accurately bring the temperature inside the storage cavity 101 to the set temperature range, in the stage of obtaining the cooling power and heating power of the semiconductor cooling and heating element 21, it is only necessary to consider the temperature difference inside and outside the storage cavity 101 and the set temperature range.

[0117] In one embodiment of this technical solution, the dehumidification system 4 is installed on the storage box body 1. The dehumidification system 4 includes a semiconductor cooling chip 41, a condensation assembly 42, and a heat dissipation assembly 43 connected sequentially from the inside to the outside. The semiconductor cooling chip 41 includes a cold end face and a hot end face. The cold end face is in contact with the condensation assembly 42, and the hot end face is in contact with the heat dissipation assembly 43. The condensation assembly 42 faces the storage cavity 101, and the heat dissipation assembly 43 faces the outside of the storage box body 1.

[0118] Step S3 includes:

[0119] S311. Obtain the initial humidity inside the storage cavity 101 and determine whether the initial humidity inside the storage cavity 101 meets the humidity setting range.

[0120] If the initial humidity inside the storage cavity 101 does not meet the humidity setting range, then step S312 is executed;

[0121] If the initial humidity inside the storage cavity 101 meets the humidity setting range, then step S313 is executed;

[0122] S312. Based on the initial humidity inside the storage cavity 101 and the humidity setting range, determine whether to perform a humidification action or a dehumidification action.

[0123] If the initial humidity inside the storage cavity 101 is greater than the upper limit of the humidity setting range, then a dehumidification action is performed until the current humidity inside the storage cavity 101 meets the humidity setting range, and then step S313 is executed.

[0124] If the initial humidity inside the storage cavity 101 is less than the lower limit of the humidity setting range, then a humidification action is performed until the current humidity inside the storage cavity 101 meets the humidity setting range, and then step S313 is executed.

[0125] S313. Obtain the humidification power, adjust the operating power of the semiconductor cooling chip 41 to the humidification power, dynamically turn on the humidification system 3 and turn off the dehumidification system 4, or turn on the dehumidification system 4 and turn off the humidification system 3, so that the real-time humidity inside the storage cavity 101 meets the humidity setting range.

[0126] In some embodiments, the dehumidification system 4 in the maintenance and storage device to which this solution is applicable includes a thermoelectric cooler 41, a condenser assembly 42, and a heat dissipation assembly 43, wherein the cold end face of the thermoelectric cooler 41 is in contact with the condenser assembly 42, and the hot end face of the thermoelectric cooler 41 is in contact with the heat dissipation assembly 43, such as... Figure 4 As shown. When the dehumidification system 4 is started, the gas to be dehumidified in the storage chamber 101 enters the condensation component 42 through the dehumidification inlet, causing the water vapor in the gas to be dehumidified to condense into liquid droplets due to low temperature cooling and separate from the air, thereby achieving the purpose of condensation dehumidification. Then, the dehumidified dry air is discharged from the condensation component 42 through the dehumidification outlet and flows back to the storage chamber 101.

[0127] It should be noted that the semiconductor cooling chip 41 in this solution is made using the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through a thermocouple composed of two semiconductor materials, one end of the thermocouple absorbs heat and the other end releases heat. In other words, the semiconductor cooling chip 41 is made of two semiconductor materials, forming a hot end and a cold end. The cold end continuously absorbs heat to achieve cooling, while the hot end continuously releases heat. This technical solution uses the condensation method of semiconductor cooling to dehumidify the gas, eliminating the need for complex mechanical structures, effectively simplifying the structure and compressing the volume, facilitating silent dehumidification, and is safe, reliable, convenient, practical, low in manufacturing cost, and widely applicable.

[0128] Specifically, in one embodiment of this technical solution, step S3 of the humidity adjustment process in this control method includes the following steps:

[0129] In step S31, it is first determined whether the initial humidity inside the storage cavity 101 meets the humidity setting range. If it does not meet the humidity setting range, the humidification system 3 performs the humidification action in the humidity adjustment process, or the dehumidification system 4 performs the dehumidification action in the humidity adjustment process, so that the humidity inside the storage cavity 101 can quickly and accurately reach the humidity setting range, and then enter the moisturizing stage of step S33 in the humidity adjustment process. If the initial humidity inside the storage cavity 101 meets the humidity setting range, the moisturizing stage of step S33 in the humidity adjustment process is directly entered, and the humidification system 3 and the dehumidification system 4 are turned on alternately to perform the moisturizing action.

[0130] When the humidity inside the storage chamber 101 reaches the set humidity range, if the humidification system 3 and the dehumidification system 4 are stopped at this point, the humidity inside the storage chamber 101 will change at a certain rate of increase (or decrease), eventually reaching a humidity range similar to the external ambient humidity of the storage device. Therefore, the humidification phase in this control method requires the alternating operation of the humidification system 3 and the dehumidification system 4 to ensure that the humidity inside the chamber is maintained. In addition, when the temperature regulation system 2 performs the cooling action, it will also consume some of the moisture inside the storage chamber 101, resulting in a decrease in the humidity inside the chamber.

[0131] Furthermore, since the humidity inside the storage chamber 101 has reached the required storage humidity range for the maintenance storage device after step S32, and the external environmental humidity of the maintenance storage device will not change significantly or within the allowable error range in a short period of time, this control method, in the humidification stage of step S33, keeps the dehumidification system 4 running at a low humidification power (relative to the dehumidification power when performing the dehumidification action), while keeping the operating parameters of the humidification system 3 unchanged. Only by dynamically adjusting the alternating operation of the humidification system 3 and the dehumidification system 4, the real-time humidity inside the storage chamber 101 is maintained within the set humidity range, which can both meet the storage humidity conditions for cigars and achieve the purpose of energy saving.

[0132] It should be noted that the humidification power in the humidification stage of this control method can be the default range of the temperature and humidity control system of the maintenance storage device, which is usually the factory setting of the maintenance storage device product; or it can be calculated by the dehumidification system. This control method does not limit it here.

[0133] Preferably, in step S313, dynamically turning on the humidification system 3 and turning off the dehumidification system 4, or turning on the dehumidification system 4 and turning off the humidification system 3, includes:

[0134] Continuously acquire the real-time humidity inside the storage cavity 101;

[0135] If the real-time humidity inside the storage chamber 101 is less than or equal to the upper limit of the humidity setting range, then the humidification system 3 is turned on and the dehumidification system 4 is turned off.

[0136] If the real-time humidity inside the storage cavity 101 is greater than the upper limit of the humidity setting range, then the dehumidification system 4 is turned on and the humidification system 3 is turned off.

[0137] Since cigars generally require a higher humidity level than the external environment, the humidification system 3 can remain running continuously as long as the real-time humidity inside the storage chamber 101 is less than or equal to the upper limit of the set humidity range. Only when the real-time humidity inside the chamber becomes too high will the dehumidification system 4 be activated for dehumidification. This control method maintains the humidity inside the storage chamber 101 through simple logical comparisons during the humidification phase, demonstrating highly reliable performance.

[0138] Preferably, obtaining moisturizing power includes:

[0139] The volume of the storage cavity 101 is obtained, and the external ambient temperature and humidity of the maintenance storage device are obtained;

[0140] The humidification power is obtained based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the humidity setting range.

[0141] Existing humidity control methods for cigar storage boxes often neglect the impact of the operating environment on internal monitoring parameters. Especially when the environment is characterized by low temperatures, high temperatures, low humidity, and / or high humidity, existing methods can lead to significant discrepancies between the set humidity level and the actual humidity, resulting in poor cigar storage and preservation. Therefore, this control method incorporates the external temperature and humidity of the storage device into the humidification adjustment process to improve the precise control of humidity within the storage chamber 101 and enhance the overall storage and preservation effect.

[0142] Furthermore, when the humidification system 3 and the dehumidification system 4 stop operating, the humidity inside the storage chamber 101 tends to change towards the humidity of the external environment of the storage device. The rate of this change depends not only on the external humidity but also on the volume of the storage chamber 101 and the external temperature. Therefore, in another preferred embodiment of this technical solution, the control method obtains the humidification power of the dehumidification system 4 during the humidification phase based on the volume of the storage chamber 101, the external temperature, the external humidity, and the humidity setting range, so as to ensure its dehumidification effect while saving energy.

[0143] It should be noted that in some embodiments, the mapping relationship between the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, the humidity setting range, and the moisturizing power in this solution can be derived by summarizing a mapping relationship table through preliminary experiments in a simulated environment. Then, in the moisturizing stage of the control method, the moisturizing power is obtained by looking up the table based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the humidity setting range. In other embodiments, the mapping relationship between the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, the humidity setting range, and the moisturizing power in this solution can be derived by summarizing a mapping formula through preliminary experiments in a simulated environment. Then, in the moisturizing stage of the control method, the moisturizing power is calculated based on the volume of the storage cavity 101, the external ambient temperature, the external ambient humidity, and the humidity setting range. This is not limited here.

[0144] To further explain, performing dehumidification includes:

[0145] The current internal temperature of the storage chamber 101 is obtained, as well as the external ambient temperature and humidity of the maintenance storage device;

[0146] The temperature compensation value is obtained based on the external ambient temperature, external ambient humidity, and the current internal temperature of the storage cavity 101;

[0147] Based on the current internal temperature of storage chamber 101 and the temperature compensation value, the target dehumidification temperature is calculated.

[0148] Target dehumidification temperature = Current internal temperature of storage chamber 101 - Temperature compensation value;

[0149] The target dehumidification power of the semiconductor cooling chip 41 is obtained based on the target dehumidification temperature.

[0150] The dehumidification system 4 is turned on, and the operating power of the semiconductor cooling chip 41 is adjusted to the target dehumidification power to perform dehumidification.

[0151] The humidification process is performed as follows:

[0152] The humidification system 3 is activated and performs humidification actions according to the preset humidification parameters.

[0153] Since the dehumidification system 4 of the maintenance storage device to which this control method is applicable uses semiconductor refrigeration for dehumidification, and based on the characteristics of semiconductor refrigeration, condensation dehumidification can only be achieved when the dehumidification temperature of the dehumidification system 4 (i.e., the refrigeration temperature of the semiconductor refrigeration chip 41) and the current internal temperature of the storage cavity 101 reach a certain temperature difference. Simultaneously, since the dehumidification system 4 also affects the internal temperature of the storage cavity 101 during the dehumidification process, the temperature reduction caused by dehumidification needs to be considered for more precise temperature control. Therefore, to fully consider both of these situations, this solution introduces a temperature compensation value during the dehumidification process. Then, using the formula: target dehumidification temperature = current internal temperature of the storage cavity 101 - temperature compensation value, the refrigeration temperature of the semiconductor refrigeration chip 41 in the dehumidification system 4 is calculated, thereby obtaining the dehumidification power of the semiconductor refrigeration chip 41 in the dehumidification system 4. The dehumidification system 4 then performs dehumidification according to this dehumidification power, achieving rapid and precise dehumidification. In this control method, during the dehumidification process, based on different external ambient temperatures and humidity levels, and the current internal temperature of the storage chamber 101, a corresponding temperature compensation value is selected, thereby accurately determining the dehumidification power of the dehumidification system 4 and achieving precise dehumidification control.

[0154] It should be noted that in some embodiments, the mapping relationship between the external ambient temperature, the external ambient humidity, and the temperature inside the storage cavity 101 and the temperature compensation value in this solution can be obtained by summarizing the mapping relationship table through preliminary experiments in a simulated environment. Then, in the dehumidification stage of the control method, the temperature compensation value is obtained by looking up the table based on the external ambient temperature, the external ambient humidity, and the temperature inside the storage cavity 101.

[0155] Furthermore, in the maintenance and storage device to which this control method applies, the humidification system 3 can be an ultrasonic atomizer. Its operating parameters can be set according to the default parameters in the temperature and humidity control system. The humidification action is executed and stopped simply by turning the humidification system 3 on and off. The logic is simple and the performance is reliable. Even further, in the maintenance and storage device to which this control method applies, the humidification system 3 includes a wet sponge and a humidifying fan. The air in the storage chamber 101 is humidified by the wet sponge driven by the humidifying fan and then flows back into the storage chamber 101, thereby achieving air humidification. The humidification action can be executed and stopped by turning the humidifying fan on and off. The structure is simple and the cost is low.

[0156] In another embodiment of this technical solution, step S3 includes:

[0157] S321. The humidification system 3 is started and performs humidification according to the preset humidification parameters; at the same time, the initial dehumidification power is obtained, the dehumidification system 4 is turned on, and the operating power of the semiconductor cooling chip 41 is adjusted to the initial dehumidification power to perform dehumidification.

[0158] S322. Obtain the current humidity inside the storage cavity 101 and determine whether the current humidity inside the storage cavity 101 meets the humidity setting range.

[0159] If the current humidity inside the storage cavity 101 does not meet the humidity setting range, then step S323 is executed;

[0160] If the current humidity inside the storage cavity 101 meets the humidity setting range, then step S324 is executed;

[0161] S323. Adjust the operating power of the semiconductor cooling chip 41 according to the current humidity inside the storage cavity 101 and the humidity setting range;

[0162] If the current humidity inside the storage cavity 101 is greater than the upper limit of the humidity setting range, the operating power of the semiconductor cooling chip 41 is gradually increased to continuously obtain the real-time humidity inside the storage cavity 101 until the real-time humidity inside the storage cavity 101 meets the humidity setting range, and step S324 is executed.

[0163] If the current humidity inside the storage cavity 101 is less than the lower limit of the humidity setting range, the operating power of the semiconductor cooling chip 41 is gradually reduced, and the real-time humidity inside the storage cavity 101 is continuously acquired until the real-time humidity inside the storage cavity 101 meets the humidity setting range, and step S324 is executed.

[0164] S324. The humidification system 3 performs humidification according to the preset humidification parameters; the dehumidification system 4 performs dehumidification according to the current dehumidification power.

[0165] More specifically, in another embodiment of this technical solution, step S3 of the humidity adjustment process in this control method includes the following steps:

[0166] First, the humidification system 3 and dehumidification system 4 in the maintenance storage device are activated simultaneously, meaning that humidification and dehumidification occur concurrently. It should be noted that the humidification parameters of the humidification system 3 and the initial dehumidification power of the dehumidification system 4 can be the default settings of the temperature and humidity control system of the maintenance storage device, which are usually the factory settings of the maintenance storage device product; alternatively, they can be input and set by the user through a control panel, smartphone, or other smart terminal. This control method is not limited here.

[0167] Then, the current humidity inside the storage cavity 101 is compared with the humidity setting range. If the current humidity inside the storage cavity 101 does not meet the humidity setting range, the operating power adjustment step of the semiconductor cooling chip 41 in step S323 is executed as needed. If the current humidity inside the storage cavity 101 meets the humidity setting range, the humidification and dehumidification actions continue to be performed simultaneously according to the current humidification and dehumidification parameters.

[0168] In the humidity control process of the above embodiment, this control method only needs to adjust the operating power of the semiconductor cooling chip 41 in the dehumidification system to regulate the relative humidity of the storage cavity 101, which is very simple. In addition, since the temperature control system 2 continuously adjusts the temperature of the storage cavity 101 during the humidity control process, while the temperature and humidity of the external environment remain unchanged or undergo slight changes, the dehumidification method of this embodiment also fully considers and reflects the temperature of the storage cavity 101, the external ambient temperature, and the external ambient humidity during the dehumidification process, which is beneficial to achieving precise control of the humidity inside the storage cavity 101 with less error.

[0169] In addition, since the adjustment process of the operating power of the semiconductor cooling chip 41 in this dehumidification method is a gradual adjustment, that is, the dehumidification system 4 can gradually increase and decrease the operating power of the semiconductor cooling chip 41 according to the humidity adjustment interval set by the system, so that the humidity inside the storage cavity 101 is more stable and avoids the situation of excessive fluctuation in humidity inside the cavity.

[0170] Preferably, step S321 includes:

[0171] The humidification system 3 is started and performs humidification according to the preset humidification parameters; the initial dehumidification power is obtained; the dehumidification system 4 is turned on and the operating power of the semiconductor cooling chip 41 is adjusted to the initial dehumidification power to perform dehumidification.

[0172] After the first preset time has elapsed, proceed to step S322;

[0173] Step S324 includes:

[0174] The humidification system 3 continues to perform humidification according to the preset humidification parameters; the dehumidification system 4 performs dehumidification according to the current dehumidification power.

[0175] After the second preset time has elapsed, proceed to step S322.

[0176] In addition, during the humidification process of this control method, a first preset time and a second preset time are introduced as the operating time of the humidification system 3 and the dehumidification system 4.

[0177] After the first preset time has elapsed, the humidity inside the storage chamber 101 has fully reflected the effect of the humidification system 3 performing humidification according to the preset humidification parameters and the dehumidification system 4 performing dehumidification according to the initial dehumidification power. At this point, performing the comparison step will be more conducive to improving the accuracy of the comparison.

[0178] After step S324, i.e., the storage chamber 101 has completed the first stage of humidity adjustment, the humidity inside the storage chamber 101 fully reflects the humidity adjustment effect of the humidification system 3 and the dehumidification system 4 in the first stage. To avoid significant temperature changes in the storage chamber 101 after humidity adjustment, which could affect its internal humidity, and also to prevent the user from moving the maintenance storage device to another usage environment after humidity adjustment, thus affecting its humidity, this control method re-enters step S322 for comparison after a second preset time, which is more conducive to ensuring the maintenance of internal humidity.

[0179] It should be noted that the first preset time and the second preset time in this control method can be the default time of the temperature and humidity control system of the maintenance storage device, which is usually the factory setting of the maintenance storage device product; or they can be input and set by the user through the control panel, smartphone or other smart terminal, and this control method does not limit them here.

[0180] This solution also proposes a temperature and humidity control system for a maintenance and storage device, which is applied to the maintenance and storage device. The maintenance and storage device includes a storage box body 1, a temperature regulation system 2, a humidification system 3 and a dehumidification system 4. The storage box body 1 has a storage cavity 101 inside.

[0181] It includes an acquisition module, a temperature control module, and a humidity control module;

[0182] The acquisition module is used to acquire the temperature setting range and humidity setting range of the storage cavity 101;

[0183] The temperature regulation module is used to obtain the initial internal temperature of the storage cavity 101, and adjust the internal temperature of the storage cavity 101 to the set temperature range according to the initial internal temperature and the set temperature range through the temperature regulation system 2.

[0184] The humidity control module is used to obtain the initial humidity inside the storage cavity 101, and adjust the humidity inside the storage cavity 101 to the set humidity range through the humidification system 3 and the dehumidification system 4 according to the initial humidity inside the cavity and the humidity setting range.

[0185] like Figure 6As shown, this solution also proposes a temperature and humidity control system for a maintenance and storage device, which is used to execute the above-mentioned temperature and humidity control method, including an acquisition module, a temperature adjustment module, and a humidity adjustment module.

[0186] This solution also proposes a computer-readable storage medium storing a computer program thereon, characterized in that the computer program, when executed by a processor, implements the steps of the temperature and humidity control method of the above-mentioned maintenance storage device.

[0187] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A method for controlling the temperature and humidity of a preservation and storage device, characterized in that, It is applied to a maintenance and storage device, and the maintenance and storage device includes a storage box body, a temperature control system, a humidification system and a dehumidification system, wherein a storage cavity is opened inside the storage box body; Includes the following steps: S1. Obtain the temperature setting range and humidity setting range of the storage cavity; S2. Obtain the initial internal temperature of the storage cavity, and adjust the internal temperature of the storage cavity to the set temperature range according to the initial internal temperature and the set temperature range through the temperature adjustment system. S3. Obtain the initial humidity inside the storage cavity, and adjust the humidity inside the storage cavity to the set humidity range through the humidification system and the dehumidification system according to the initial humidity inside the cavity and the humidity setting range. The dehumidification system is installed on the storage box body. The dehumidification system includes a semiconductor cooling chip, a condensation component, and a heat dissipation component connected sequentially from the inside to the outside. The semiconductor cooling chip includes a cold end face and a hot end face. The cold end face is in contact with the condensation component, and the hot end face is in contact with the heat dissipation component. The condensation component faces the storage cavity, and the heat dissipation component faces the outside of the storage box body. Step S3 includes: S311. Obtain the initial humidity inside the storage cavity and determine whether the initial humidity inside the storage cavity meets the humidity setting range. If the initial humidity inside the storage cavity does not meet the humidity setting range, then step S312 is executed; If the initial humidity inside the storage cavity meets the humidity setting range, then step S313 is executed; S312. Based on the initial humidity inside the storage cavity and the humidity setting range, determine whether to perform a humidification action or a dehumidification action. If the initial humidity inside the storage chamber is greater than the upper limit of the humidity setting range, then a dehumidification action is performed until the current humidity inside the storage chamber meets the humidity setting range, and then step S313 is executed. If the initial humidity inside the storage chamber is less than the lower limit of the humidity setting range, a humidification action is performed until the current humidity inside the storage chamber meets the humidity setting range, and step S313 is executed. S313. Obtain the humidification power, adjust the operating power of the semiconductor cooling chip to the humidification power, dynamically turn on the humidification system and turn off the dehumidification system, or turn on the dehumidification system and turn off the humidification system, so that the real-time humidity inside the storage cavity meets the humidity setting range. Performing dehumidification actions includes: The current internal temperature of the storage chamber is obtained, and the external ambient temperature and humidity of the maintenance storage device are also obtained. The temperature compensation value is obtained based on the external ambient temperature, external ambient humidity, and the current internal temperature of the storage cavity; The target dehumidification temperature is calculated based on the current internal temperature of the storage chamber and the temperature compensation value. Target dehumidification temperature = Current internal temperature of the storage chamber - Temperature compensation value; The target dehumidification power of the semiconductor cooling chip is obtained based on the target dehumidification temperature. The dehumidification system is turned on, and the operating power of the semiconductor cooling chip is adjusted to the target dehumidification power to perform the dehumidification action; The humidification process is performed as follows: The humidification system is activated and performs humidification actions according to preset humidification parameters.

2. The temperature and humidity control method for a preservation and storage device according to claim 1, characterized in that, The temperature control system is installed on the storage box body. The temperature control system includes a first conductive component, a semiconductor cooling and heating component, and a second conductive component connected sequentially from the inside to the outside. The semiconductor cooling and heating component includes a first working end face and a second working end face. The first working end face is in contact with the first conductive component, and the second working end face is in contact with the second conductive component. The first conductive component faces the storage cavity, and the second conductive component faces the outside of the storage box body. Step S2 includes: S21. Obtain the initial internal temperature of the storage cavity and determine whether the initial internal temperature of the storage cavity meets the temperature setting range. If the initial internal temperature of the storage cavity does not meet the set temperature range, then step S22 is executed; If the initial internal temperature of the storage cavity meets the set temperature range, then step S23 is executed; S22. Based on the initial internal temperature and temperature setting range of the storage cavity, determine whether the temperature regulation system performs a cooling action or a heating action; If the initial internal temperature of the storage cavity is greater than the upper limit of the temperature setting range, the temperature regulation system performs a cooling action until the current internal temperature of the storage cavity meets the temperature setting range, and then executes step S23. If the initial internal temperature of the storage cavity is less than the lower limit of the temperature setting range, the temperature regulation system performs a heating action until the current internal temperature of the storage cavity meets the temperature setting range, and then executes step S23. S23. Obtain the heat preservation power, adjust the operating power of the semiconductor cooling and heating element to the heat preservation power, and dynamically adjust the first working end face of the semiconductor cooling and heating element to be a cold end face or a hot end face, so that the real-time cavity temperature of the storage cavity meets the temperature setting range.

3. The temperature and humidity control method for a preservation and storage device according to claim 2, characterized in that, In step S23, dynamically adjusting the first working end face of the semiconductor cooling / heating element to be a cold end face or a hot end face includes: The real-time internal temperature of the storage cavity is continuously acquired; If the real-time internal temperature of the storage cavity is greater than or equal to the lower limit of the temperature setting range, then the first working end face of the semiconductor cooling heating element is adjusted to the cold end face. If the real-time internal temperature of the storage cavity is less than the lower limit of the temperature setting range, then the first working end face of the semiconductor cooling heating element is adjusted to the hot end face.

4. The temperature and humidity control method for a preservation and storage device according to claim 2, characterized in that, To obtain the insulation power, including: Obtain the volume of the storage cavity, and obtain the external ambient temperature and humidity of the maintenance storage device; The heat preservation power is obtained based on the volume of the storage cavity, the external ambient temperature, the external ambient humidity, and the temperature setting range.

5. The temperature and humidity control method for a preservation and storage device according to claim 2, characterized in that, The temperature control system performs a cooling action, including: The external ambient temperature of the maintenance storage device is obtained. Based on the initial internal temperature of the storage cavity, the external ambient temperature, and the temperature setting range, the cooling power of the semiconductor cooling heating element is obtained. The first working end face of the semiconductor cooling heating element is adjusted to the cold end face, and the operating power of the semiconductor cooling heating element is adjusted to the cooling power to perform the cooling action. The temperature control system performs a heating action, including: The external ambient temperature of the maintenance storage device is obtained. Based on the initial internal temperature of the storage cavity, the external ambient temperature, and the temperature setting range, the heating power of the semiconductor cooling heating element is obtained. The first working end face of the semiconductor cooling heating element is adjusted to the hot end face, and the operating power of the semiconductor cooling heating element is adjusted to the heating power to perform the heating action.

6. The temperature and humidity control method for a maintenance and storage device according to claim 1, characterized in that, The dehumidification system is installed on the storage box body. The dehumidification system includes a semiconductor cooling chip, a condensation component, and a heat dissipation component connected sequentially from the inside to the outside. The semiconductor cooling chip includes a cold end face and a hot end face. The cold end face is in contact with the condensation component, and the hot end face is in contact with the heat dissipation component. The condensation component faces the storage cavity, and the heat dissipation component faces the outside of the storage box body. Step S3 includes: S321. The humidification system is started and performs humidification according to the preset humidification parameters; at the same time, the initial dehumidification power is acquired, the dehumidification system is turned on, and the operating power of the semiconductor cooling chip is adjusted to the initial dehumidification power to perform dehumidification. S322. Obtain the current humidity inside the storage cavity and determine whether the current humidity inside the storage cavity meets the humidity setting range. If the current humidity inside the storage cavity does not meet the humidity setting range, then step S323 is executed; If the current humidity inside the storage cavity meets the set humidity range, then step S324 is executed; S323. Adjust the operating power of the semiconductor cooling chip according to the current internal humidity and humidity setting range of the storage cavity; If the current humidity inside the storage cavity is greater than the upper limit of the humidity setting range, the operating power of the semiconductor cooling chip is gradually increased, and the real-time humidity inside the storage cavity is continuously acquired until the real-time humidity inside the storage cavity meets the humidity setting range, and step S324 is executed. If the current humidity inside the storage cavity is less than the lower limit of the humidity setting range, the operating power of the semiconductor cooling chip is gradually reduced, and the real-time humidity inside the storage cavity is continuously acquired until the real-time humidity inside the storage cavity meets the humidity setting range, and step S324 is executed. S324. The humidification system performs humidification according to preset humidification parameters; the dehumidification system performs dehumidification according to the current dehumidification power.

7. A temperature and humidity control system for a preservation and storage device, characterized in that, The maintenance and storage device is applied to any one of claims 1 to 6, wherein the maintenance and storage device includes a storage box body, a temperature control system, a humidification system and a dehumidification system, and the storage box body has a storage cavity inside; It includes an acquisition module, a temperature control module, and a humidity control module; The acquisition module is used to acquire the temperature setting range and humidity setting range of the storage cavity; The temperature regulation module is used to obtain the initial internal temperature of the storage cavity, and adjust the internal temperature of the storage cavity to the set temperature range according to the initial internal temperature and the set temperature range through the temperature regulation system. The humidity control module is used to obtain the initial humidity inside the storage cavity, and adjust the humidity inside the storage cavity to the set humidity range through the humidification system and the dehumidification system according to the initial humidity inside the cavity and the humidity setting range.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the temperature and humidity control method of the maintenance storage device according to any one of claims 1 to 6.

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