Laser processing system and method for rapid manufacturing of negative taper microstructures

By using a collaborative control module and a high-precision moving platform in the laser processing system, the problem of achieving negative taper microstructures in laser processing has been solved, enabling efficient manufacturing of large-area negative taper microstructures.

CN116727866BActive Publication Date: 2025-10-28XIAMEN UNIV
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Patent Information

Application Number
CN202310472811.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-27
Publication Date
2025-10-28
Estimated Expiration
2043-04-27

AI Technical Summary

Technical Problem

Existing laser processing technology is difficult to efficiently process negative taper microstructures, especially due to the Gaussian distribution of the laser spot and the high cost and low efficiency of traditional five-axis robotic arms.

Method used

The system employs a laser generator, beam expander, dynamic deflection scanning module, translation module, moving platform, and collaborative control module to achieve negative taper laser processing through collaborative control. This includes dynamic deflection scanning and focus movement, combined with a high-precision moving platform to achieve large-area, high-efficiency processing.

Benefits of technology

It improves laser processing efficiency, expands the processing range of microstructures, and enables the rapid manufacturing of high-precision negative taper microstructures.

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Abstract

A laser processing system and method for rapid fabrication of negative taper microstructures includes a laser generator, a beam expander, a dynamic deflection scanning module, a translation module, a moving platform, and a collaborative control module. The dynamic deflection scanning module deflects and focuses the light beam output from the beam expander. The translation module translates the light beam output from the dynamic deflection scanning module to achieve different taper angles. The moving platform allows for high-precision, wide-range free movement of the workpiece. The collaborative control module is connected to the laser generator, the dynamic deflection scanning module, the translation module, and the moving platform to achieve coordinated motion control for negative taper fabrication of the workpiece. This invention improves the efficiency of laser processing and expands the structural range of laser-processed microstructures.
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Description

Technical Field

[0001] This invention relates to the field of laser-processed microstructures, and in particular to a laser processing system and method for rapid fabrication of negative taper microstructures. Background Art

[0002] Laser manufacturing technology is one of the most widely used fields of laser application, applied in almost everything from computer chips to the manufacture of large aircraft structural components. Compared with traditional mechanical manufacturing technologies, laser manufacturing technology has many outstanding advantages, including being non-contact, having good energy concentration, being simple to operate, being highly efficient, and being energy-saving and environmentally friendly.

[0003] However, because laser spots are typically Gaussian distributed and laser processing is a top-down process, it is difficult to process microstructures with negative taper angles. Furthermore, the rapid development of micro- and nanotechnology has led to increased demands for processing range and precision, as well as for the roundness of circular holes and the variety of negative taper structures that are wider at the top and narrower at the bottom, thus limiting the practical application of laser processing technology.

[0004] To address the aforementioned issues, some inventions have mounted laser heads on five-axis robotic arms to achieve laser processing at different angles. However, this method requires a large amount of space, is costly, and has limited processing efficiency, thus limiting its practical application. Summary of the Invention

[0005] The main objective of this invention is to overcome the aforementioned defects in the prior art and to propose a laser processing system and method for rapid manufacturing of negative taper microstructures, which can realize negative taper laser processing and achieve large-area laser processing while ensuring processing efficiency and accuracy.

[0006] The present invention adopts the following technical solution:

[0007] A laser processing system for rapid manufacturing of negative taper microstructures includes a laser generator and a beam expander. The laser generator generates a laser beam which enters the beam expander. The beam expander collimates the laser beam and controls its divergence or the height of the focal working plane. The system is characterized by further including a dynamic deflection scanning module, a translation module, a moving platform, and a collaborative control module. The dynamic deflection scanning module deflects and moves the focal point of the light beam output from the beam expander. The translation module translates the light beam output from the dynamic deflection scanning module to achieve different taper angles. The moving platform drives the workpiece to move. The collaborative control module is connected to the laser generator, the dynamic deflection scanning module, the translation module, and the moving platform to achieve coordinated motion control for negative taper processing of the workpiece.

[0008] Preferably, the beam expander controls the vertical movement of the laser beam's focal point within a range of 20mm.

[0009] Preferably, the dynamic deflection scanning module includes an X-axis scanning mirror, a Y-axis scanning mirror, and a first rotation driving unit; the first rotation driving unit controls the movement of the X-axis scanning mirror and the Y-axis scanning mirror to drive the light to deflect and scan within the XY plane.

[0010] Preferably, the X-axis scanning mirror and the Y-axis scanning mirror are mounted on different planes, and the first rotation drive unit controls the X-axis scanning mirror and the Y-axis scanning mirror to rotate in perpendicular directions, with a rotation angle range of -30° to +30°.

[0011] Preferably, the translation module includes an upper wedge mirror, a lower wedge mirror, a linear drive unit, and a second rotation drive unit; the upper wedge mirror and the lower wedge mirror are arranged parallel to each other and spaced apart; the linear drive unit drives the upper wedge mirror or the lower wedge mirror to move linearly to change their relative positions; the second rotation drive unit drives the upper wedge mirror and the lower wedge mirror to rotate respectively to change the angle between the inclined planes.

[0012] Preferably, the linear movement range of the upper wedge mirror and the lower wedge mirror is within 100mm; the rotation angle range of the upper wedge mirror and the lower wedge mirror is -90° to +90°.

[0013] Preferably, the mobile platform includes a worktable and a three-axis drive device, which drives the worktable to move in three directions.

[0014] Preferably, the collaborative control module includes a 3D model recognition unit, a machining path planning unit, and a module control unit; the 3D model recognition unit is used to recognize the 3D model of the input workpiece, the machining path planning unit automatically plans and allocates a movement path based on the 3D model, and the module control unit controls the coordinated movement of the dynamic deflection scanning module, the translation module, and the moving platform according to the movement path.

[0015] A laser processing method for rapid fabrication of negative taper microstructures, characterized by comprising the following steps:

[0016] 1) Start the laser generator and import the 3D model of the workpiece into the collaborative control module;

[0017] 2) The collaborative control module automatically plans and allocates movement paths based on the three-dimensional model;

[0018] 3) The collaborative control module controls the laser generator, the dynamic deflection scanning module, the translation module, and the moving platform to move collaboratively along the movement path to perform negative taper machining on the workpiece:

[0019] 4) The dynamic deflection scanning module deflects and moves the focus of the light output from the beam expander according to the assigned movement path; the translation module translates the light output from the dynamic deflection scanning module according to the assigned movement path to achieve different taper angles of the light; the moving platform drives the workpiece to move according to the assigned movement path.

[0020] Preferably, the taper range of the microstructure of the workpiece is -5° to +5°.

[0021] As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention includes a laser generator, a beam expander, a dynamic deflection scanning module, a translation module, a moving platform, and a collaborative control module. The dynamic deflection scanning module deflects and moves the focus of the light emitted from the beam expander. The translation module translates the light emitted from the dynamic deflection scanning module to achieve different taper angles. The moving platform allows for high-precision, wide-range free movement of the workpiece. The collaborative control module is connected to the laser generator, the dynamic deflection scanning module, the translation module, and the moving platform to achieve collaborative motion control for negative taper processing of the workpiece, thereby improving the efficiency of laser processing and expanding the structural range of laser-processed microstructures. Attached Figure Description

[0023] Figure 1 This is a system composition diagram of the present invention;

[0024] Figure 2 This is a flowchart of the method of the present invention;

[0025] Figure 3 This is a schematic diagram of the translation module.

[0026] Figure 4 This is a schematic diagram of the laser tilt angle of the present invention;

[0027] Figure 5 This is a top view (small area) of a workpiece after it has been machined;

[0028] Figure 6 for Figure 5 AA section view;

[0029] Figure 7 for Figure 5 A three-dimensional schematic diagram;

[0030] Figure 8 This is a three-dimensional schematic diagram (large area) of another workpiece after processing.

[0031] in:

[0032] 1. Laser generator, 2. Beam expander, 3. Reflector, 4. Dynamic deflection scanning module, 5. Translation module, 6. Focusing lens, 7. Workpiece, 8. Moving platform, 9. Collaborative control module.

[0033] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Detailed Implementation

[0034] The present invention will be further described below through specific embodiments.

[0035] In this invention, the terms "first," "second," and "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. The use of terms such as "upper," "lower," "left," "right," "front," and "rear" to indicate orientation or positional relationships is based on the orientation or positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention, not to indicate or imply that the device referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the scope of protection of this invention. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0037] See Figure 1 A laser processing system for rapid fabrication of negative taper microstructures includes a laser generator 1, a beam expander 2, a dynamic deflection scanning module 4, a translation module 5, a moving platform 8, and a collaborative control module 9. After generating a laser beam, the laser generator 1 sends the beam to the beam expander 2. The beam expander 2 collimates the laser beam and controls its divergence or the height of the focal working plane, thus achieving Z-axis movement. Preferably, the beam expander 2 is matched to the laser generator 1 and can withstand the corresponding power. The beam expander 2 controls the vertical movement of the laser beam's focal point within a range of 20mm.

[0038] The dynamic deflection scanning module 4 deflects and moves the focus of the light output from the beam expander 2. A reflector 3 can also be placed between the beam expander 2 and the dynamic deflection scanning module 4. The laser beam exiting the beam expander 2 is reflected by the reflector 3 before entering the dynamic deflection scanning module 4. The reflector 3 serves to change the optical path.

[0039] Specifically, the dynamic deflection scanning module 4 includes an X-axis scanning mirror, a Y-axis scanning mirror, and a first rotation drive unit. The first rotation drive unit controls the movement of the X-axis and Y-axis scanning mirrors to drive light rays to deflect and scan within the XY plane. This first rotation drive unit can employ two motors in conjunction with a related transmission structure to drive the rotation of the X-axis and Y-axis scanning mirrors; that is, one motor drives the X-axis scanning mirror to rotate, and the other motor drives the Y-axis scanning mirror to rotate.

[0040] The X-axis scanning mirror and the Y-axis scanning mirror are mounted on different planes. The first rotation drive unit controls the rotation of the X-axis and Y-axis scanning mirrors in a perpendicular direction, with a rotation angle range of -30° to +30°. That is, the X-axis scanning mirror can rotate about the X-axis or an axis parallel to the X-axis, and the Y-axis scanning mirror can rotate about the Y-axis or an axis parallel to the Y-axis. The rotation angle range for both the X-axis and Y-axis scanning mirrors is -30° to +30°.

[0041] Translation module 5 translates the light output from dynamic deflection scanning module 4 to achieve different taper angles of the light beam. Translation module 5 includes an upper wedge mirror, a lower wedge mirror, a linear drive unit, and a second rotation drive unit. The upper and lower wedge mirrors are arranged parallel to each other, i.e., there is a gap between the opposing surfaces of the upper and lower wedge mirrors. The linear drive unit drives the upper or lower wedge mirror to move linearly to change their relative positions. That is, the linear drive unit can be connected to the upper wedge mirror to move linearly towards or away from the lower wedge mirror, or the linear drive unit can be connected to the lower wedge mirror to move linearly towards or away from the upper wedge mirror. The second rotation drive unit drives the upper and lower wedge mirrors to rotate respectively to change the angle between the inclined planes. The second rotation drive unit may include two rotary motors and related transmission structures, with one rotary motor driving the upper wedge mirror to rotate and the other rotary motor driving the lower wedge mirror to rotate.

[0042] In this invention, the rotation of the upper and lower wedge mirrors changes the angle between the inclined planes, and the linear motion of the upper and lower wedge mirrors changes their relative positions. The changes in the angle between the inclined planes and their relative positions are used to achieve different taper angles for the laser beam. Specifically, the linear movement range of the upper and lower wedge mirrors is within 100mm, and the rotation angle range of the upper and lower wedge mirrors is -90° to +90°.

[0043] Furthermore, the optical components of the laser system of the present invention (including beam expander 2, reflector 3, dynamic deflection scanning module 4, translation module 5, etc.) are matched with the laser generator 1 and must be able to withstand the corresponding power.

[0044] The moving platform 8 drives the workpiece 7 to move freely with high precision over a wide range, meaning the workpiece 7 is horizontally fixed on the moving platform 8. A focusing lens 6 can also be provided between the translation module 5 and the moving platform 8. After the laser beam is output from the translation module 5, it passes through the focusing lens 6 and is focused onto the processing surface of the workpiece 7 to achieve the processing of microstructures with different tapers.

[0045] The mobile platform 8 of the present invention can be a three-axis precision motion platform, which may include a worktable and a three-axis drive device. The worktable is used to fix the workpiece 7, and the three-axis drive device is connected to drive the worktable to move in three directions, including the X-axis, Y-axis and Z-axis. The three-axis drive device can be implemented by three high-precision motors in conjunction with relevant slides.

[0046] The collaborative control module 9 is connected to the laser generator 1, the dynamic deflection scanning module 4, the translation module 5, and the moving platform 8 to achieve collaborative motion control for negative taper machining of the workpiece 7. Specifically, the collaborative control module 9 can control the laser generator 1, and the laser generator 1 can provide feedback on relevant work information. The collaborative control module 9 can also drive and control the beam expander 2, the dynamic deflection scanning module 4, and the translation module 5 to process the workpiece 7. Furthermore, the collaborative control module 9 can drive and control the moving platform 8 to achieve rapid processing of large-format workpieces 7. Large-format workpieces 7 refer to workpieces with a large area that require the use of the moving platform 8 for processing. For smaller workpieces 6, the moving platform 8 is not needed.

[0047] The collaborative control module 9 includes a 3D model recognition unit, a machining path planning unit, and a module control unit. The 3D model recognition unit is used to recognize the 3D model of the input workpiece 7. The machining path planning unit automatically plans and allocates a movement path based on the 3D model. This movement path allocation may include the movement paths of the dynamic deflection scanning module 4, the translation module 5, and the moving platform. The module control unit controls the coordinated movement of the dynamic deflection scanning module 4, the translation module 5, and the moving platform 8 according to the movement path. When the area of ​​the workpiece 6 is small, the dynamic deflection scanning module 4 and the translation module 5 are controlled to work according to the allocated movement path. When the area of ​​the workpiece 6 is large, it is also necessary to add control of the moving platform 8 according to the allocated movement path. These modules work together to complete the machining of the workpiece 7.

[0048] Based on this, the present invention also proposes a laser processing method for rapid manufacturing of negative taper microstructures, which is implemented using the aforementioned laser processing system for rapid manufacturing of negative taper microstructures, and includes the following steps:

[0049] 1) Start the laser generator 1 and import the three-dimensional model of the workpiece 7 into the collaborative control module 9.

[0050] 2) The collaborative control module 9 automatically plans and allocates movement paths based on the 3D model. The collaborative control module 9 can determine the cone size and model size of the 3D model, automatically plan and allocate movement paths for the dynamic deflection scanning module 4 and translation module 5, and allocate movement paths for the moving platform 8.

[0051] 3) The collaborative control module 9 controls the laser generator 1, the dynamic deflection scanning module 4, the translation module 5, and the moving platform 8 to move collaboratively along the movement path to perform negative taper machining on the workpiece 7. In this step, it can also be determined whether the moving platform 8 needs to cooperate in the machining. If so, the collaborative control module 9 controls the moving platform 8 to work in conjunction with the dynamic deflection scanning module and the translation module 5; if not, it controls the dynamic deflection scanning module and the translation module 5 to work.

[0052] 4) The dynamic deflection scanning module 4 deflects and moves the focus of the light output from the beam expander 2 according to the assigned moving path; the translation module 5 translates the light output from the dynamic deflection scanning module 4 according to the assigned moving path to achieve different taper tilts of the light; the moving platform 8 performs high-precision, wide-range free movement of the workpiece 7 according to the assigned moving path.

[0053] This invention can process microholes with negative taper, but is not limited to microholes; it can also process other microstructures with taper. By inputting appropriate process parameters, rapid manufacturing of negative taper microstructures can be achieved. The taper range of the microstructure in the workpiece 7 is -5° to +5°.

[0054] During the processing of this invention, the laser tilt angle is shown in the schematic diagram. Figure 4 As shown, the laser tilt angle varies when the taper (AOI) of the processed structure is different.

[0055] See Figure 5 , Figure 6 As shown, this invention enables the processing of three-dimensional structures with an AOI < 0° by changing the laser path and focal point position. Combined with a high-precision moving platform 8, it can achieve large-area processing. See also... Figure 7 This is a three-dimensional schematic diagram of the machined part 7, which has a relatively small area, after processing. Figure 8 This is a three-dimensional schematic diagram of a large workpiece 7 after processing. The present invention can process microstructures with different tapers and can achieve efficient large-area processing.

[0056] The above are merely specific embodiments of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantial modifications made to the present invention using this concept shall be considered as infringing upon the protection scope of the present invention.

Claims

1. A laser processing system for rapid fabrication of negative taper microstructures, comprising a laser generator and a beam expander, wherein the laser generator generates a laser beam which enters the beam expander, and the beam expander collimates the laser beam and controls the divergence of the laser beam or controls the height of the focal working plane; characterized in that: It also includes a dynamic deflection scanning module, a translation module, a moving platform, and a collaborative control module; the dynamic deflection scanning module deflects and moves the focus of the light output from the beam expander; the translation module translates the light output from the dynamic deflection scanning module to achieve different taper inclinations of the light beam; the moving platform drives the workpiece to move; the collaborative control module is connected to the laser generator, the dynamic deflection scanning module, the translation module, and the moving platform to achieve collaborative motion control for negative taper machining of the workpiece; The translation module includes an upper wedge mirror, a lower wedge mirror, a linear drive unit, and a second rotation drive unit; the upper and lower wedge mirrors are arranged parallel to each other and spaced apart; the linear drive unit drives the upper or lower wedge mirror to move linearly to change their relative positions; the second rotation drive unit drives the upper and lower wedge mirrors to rotate respectively to change the angle between the inclined planes.

2. The laser processing system for rapid fabrication of negative taper microstructures as described in claim 1, characterized in that: The beam expander controls the vertical movement of the laser beam's focal point to within 20mm.

3. The laser processing system for rapid fabrication of negative taper microstructures as described in claim 1, characterized in that: The dynamic deflection scanning module includes an X-axis scanning mirror, a Y-axis scanning mirror, and a first rotation driving unit; the first rotation driving unit controls the movement of the X-axis scanning mirror and the Y-axis scanning mirror to drive the light to deflect and scan within the XY plane.

4. The laser processing system for rapid fabrication of negative taper microstructures as described in claim 3, characterized in that: The X-axis scanning mirror and the Y-axis scanning mirror are respectively mounted on different planes. The first rotation drive unit controls the X-axis scanning mirror and the Y-axis scanning mirror to rotate in perpendicular directions, with a rotation angle range of -30° to +30°.

5. The laser processing system for rapid fabrication of negative taper microstructures as described in claim 1, characterized in that: The linear movement range of the upper wedge mirror and the lower wedge mirror is within 100mm; the rotation angle range of the upper wedge mirror and the lower wedge mirror is -90° to +90°.

6. The laser processing system for rapid fabrication of negative taper microstructures as described in claim 1, characterized in that: The mobile platform includes a worktable and a three-axis drive unit, which drives the worktable to move in three directions.

7. The laser processing system for rapid fabrication of negative taper microstructures as described in claim 1, characterized in that: The collaborative control module includes a 3D model recognition unit, a machining path planning unit, and a module control unit. The 3D model recognition unit is used to recognize the 3D model of the input workpiece. The machining path planning unit automatically plans and allocates a movement path based on the 3D model. The module control unit controls the coordinated movement of the dynamic deflection scanning module, the translation module, and the moving platform based on the movement path.

8. A laser processing method for rapid fabrication of negative taper microstructures, characterized in that, The laser processing system for rapid fabrication of negative taper microstructures, as described in any one of claims 1 to 7, comprises the following steps: 1) Start the laser generator and import the 3D model of the workpiece into the collaborative control module; 2) The collaborative control module automatically plans and allocates movement paths based on the three-dimensional model; 3) The collaborative control module controls the laser generator, the dynamic deflection scanning module, the translation module, and the moving platform to move collaboratively along the movement path to perform negative taper machining on the workpiece: 4) The dynamic deflection scanning module deflects and moves the focus of the light output from the beam expander according to the assigned movement path; the translation module translates the light output from the dynamic deflection scanning module according to the assigned movement path to achieve different taper angles of the light; the moving platform drives the workpiece to move according to the assigned movement path.

9. The laser processing method for rapid fabrication of negative taper microstructures as described in claim 8, characterized in that, The taper range of the microstructure of the workpiece is -5° to +5°.

Citation Information

Patent Citations

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  • Laser rotary focusing device

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