Automatic welding device with purification function for integrated circuit chip processing

Abstract

This invention relates to the field of welding equipment, specifically an automatic welding device for integrated circuit chip processing with a purification function. It includes a base plate, welding device, housing, baffle, telescopic device a, sliding plate, U-shaped frame, plate chain conveyor line, and discharge conveyor line. A three-axis moving assembly is installed on the top of the support column, and a support plate is installed on the top of the support column. Limiting plates are installed on both sides of the housing, and the limiting plates are inserted into two sets of U-shaped frames. A shovel plate is installed at the bottom right side of the housing. A support frame is installed on the sliding plate, and the top of the support frame and the top left side of the housing are connected by multiple sets of springs. The telescopic device a is horizontally installed on the inner wall of the left side of the housing, and a baffle is installed at the telescopic end of the telescopic device a, with multiple sets of suction holes on the baffle. Multiple sets of discharge plates are equidistantly arranged on the plate chain conveyor line. The discharge conveyor line is located below the plate chain conveyor line. This invention is simple and labor-saving to operate, and has high welding efficiency. Furthermore, the welding fumes are immediately absorbed and removed by the suction assembly through the suction holes.

Description

Technical Field

[0001] This invention relates to the field of welding equipment, and more particularly to an automatic welding device for processing integrated circuit chips with a purification function. Background Technology

[0002] When processing integrated circuit boards, components need to be soldered onto the circuit board. This is usually done using an automatic soldering device. Automatic soldering machines use multi-axis motion to complete precise soldering work, resulting in high efficiency.

[0003] Chinese patent CN216462770U discloses a welding device with a stable clamping structure for integrated circuit processing. The device uses a limiting seat on the support base to stabilize the integrated circuit board, a protective panel to protect the surface of the temperature controller to prevent unauthorized personnel from accidentally adjusting the temperature, and a purifier to absorb and remove the welding fumes generated during welding to avoid causing discomfort to the workers.

[0004] However, the above-mentioned publicly available solutions have the following shortcomings: they require manual loading and unloading, have a low degree of automation, which affects work efficiency, and only use the side exhaust pipe to extract and absorb welding fumes, which has a poor absorption effect on welding fumes and makes it easy for welding fumes to leak into the environment. Summary of the Invention

[0005] The purpose of this invention is to address the problems in the prior art where automatic welding devices for integrated circuit chips require manual loading and unloading and have poor smoke extraction effects, and to propose an automatic welding device for integrated circuit chip processing with a purification function.

[0006] On one hand, the present invention proposes an automatic welding device for processing integrated circuit chips with a purification function, including a base plate, a welding device, a box, a baffle, a telescopic device a, a sliding plate, a loop frame, a plate chain conveyor line and a discharge conveyor line;

[0007] Multiple support columns are installed on the base plate. A three-axis moving assembly that drives the welding device is mounted on the top of each support column. A support plate is horizontally mounted on the top of each support column, located below the welding device. Limiting plates are installed on both sides of the box, fitting into two sets of U-shaped frames. A power assembly that drives the U-shaped frames to move laterally is mounted on the support plate. A shovel plate is installed on the bottom right side of the box, with a circuit board positioning groove on it. A sliding plate is horizontally mounted on the U-shaped frame and contacts the bottom of the box. A support frame is mounted on the sliding plate, and the top of the support frame is connected to the top left side of the box by multiple sets of springs. Telescopic device a is horizontally mounted on the inner left side of the box. A baffle is mounted on the telescopic end of telescopic device a, with multiple sets of suction holes on the baffle. A suction assembly is mounted on the support frame, and the suction assembly draws air through the suction holes. A plate chain conveyor is mounted on the base plate via two sets of U-shaped support frames, located to the right of the shovel plate. Multiple discharge plates are equidistantly mounted on the plate chain conveyor, with circuit boards placed on them. When the plate chain conveyor rotates, the circuit boards are shoveled into the circuit board positioning groove by the shovel plate. The discharge conveyor is located below the plate chain conveyor.

[0008] Preferably, a guide angle is provided at the right side opening of the circuit board positioning groove.

[0009] Preferably, a control system is installed on the base plate, and the control system is connected to the three-axis moving component, welding device, power component and plate chain conveyor.

[0010] Preferably, the three-axis moving assembly includes a lateral moving mechanism, a longitudinal moving mechanism, and a vertical moving mechanism; the lateral moving mechanism is located on the top of the support column and moves in the lateral direction; the longitudinal moving mechanism is located on the lateral moving mechanism and moves in the longitudinal direction; the vertical moving mechanism is located vertically on the longitudinal moving mechanism and moves in the up-down direction; and the welding device is located on the vertical moving mechanism.

[0011] Preferably, the power assembly includes a telescopic device b and a mounting base; the mounting base is disposed on the support plate, the telescopic device b is laterally disposed on the mounting base, and the telescopic end of the telescopic device b is connected to the U-shaped frame.

[0012] Preferably, the air intake assembly includes an air box, an air tube, and an air intake device; the air box is mounted on a baffle, the telescopic end of the telescopic device a is connected to the air box, and the air box is connected to multiple sets of air intake holes; the air intake device is mounted on a support frame; both ends of the air tube are connected to the air intake device and the air box, respectively.

[0013] Preferably, the feeding plate is provided with a guide slope a, a plane and a guide slope b in sequence. A feeding groove is provided on the plane. The feeding groove forms an opening on the left side of the plane. The circuit board is placed in the feeding groove. The left side of the circuit board is located above the guide slope a. When the conveyor belt rotates, the shovel plate contacts the guide slope b and rises to shovel the circuit board into the circuit board positioning groove. Then the guide slope b pushes the circuit board to move until it contacts the baffle. At this time, the right side of the circuit board is flush with the right edge of the shovel plate.

[0014] On the other hand, the present invention proposes a welding method for an automatic welding device with a purification function for processing integrated circuit chips, comprising the following steps:

[0015] S1. Place the circuit board in the feeding trough, and the circuit board is conveyed forward along the board chain conveyor line;

[0016] S2. When the conveyor reaches the left side of the plate chain conveyor line, it stops. The telescopic device b pushes the loop frame to move to the right. After the shovel is guided by the guide slope a, it shovels the circuit board into the circuit board positioning groove. Then the guide slope b pushes the circuit board to move until it contacts the baffle. At this time, the right side of the circuit board is flush with the right edge of the shovel. Under the guidance of the guide slope a and the guide slope b, the box moves upward.

[0017] S3. The telescopic device b retracts to its initial position, and the welding device is driven by the three-axis moving component to weld the circuit board. At the same time, the suction device sucks away the welding fumes through the air pipe and suction hole.

[0018] S4. After welding is completed, the telescopic device a extends out and pushes the circuit board into the feeding trough through the baffle before retracting.

[0019] S5. The plate chain conveyor continues to rotate, and the welded circuit board falls onto the discharge conveyor and is conveyed away.

[0020] Compared with existing technologies, this invention has the following beneficial technical effects: Circuit boards can be automatically soldered and unloaded simply by placing them in the feeding trough, eliminating the need for operators to monitor the feeding and unloading processes. This makes operation simple, labor-saving, and highly efficient. Furthermore, the welding fumes are immediately absorbed and removed by the suction component through the suction holes, demonstrating excellent adsorption and purification capabilities. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of one embodiment of the present invention;

[0022] Figure 2 for Figure 1 Partial structural diagram;

[0023] Figure 3 for Figure 2 Top view;

[0024] Figure 4 This is a schematic diagram of the feeding plate.

[0025] Reference numerals: 1. Base plate; 2. Support column; 3. Support plate; 4. Lateral movement mechanism; 5. Longitudinal movement mechanism; 6. Vertical movement mechanism; 7. Welding device; 8. Box body; 9. Shovel plate; 10. Circuit board positioning groove; 11. Guide angle; 12. Baffle; 13. Air box; 14. Telescopic device a; 15. Air pipe; 16. Suction device; 17. Slide plate; 18. Support frame; 19. Spring; 20. Limiting plate; 21. U-shaped frame; 22. Telescopic device b; 23. Mounting base; 24. Discharge plate; 25. Guide slope a; 26. Guide slope b; 27. Discharge trough; 28. Plate chain conveyor line; 29. ​​U-shaped support frame; 30. Discharge conveyor line; 31. Circuit board; 32. Suction hole. Detailed Implementation

[0026] Example 1

[0027] like Figure 1 and Figure 2 As shown, the present invention proposes an automatic welding device for processing integrated circuit chips with purification function, including a base plate 1, a welding device 7, a box 8, a baffle 12, a telescopic device a14, a sliding plate 17, a loop frame 21, a plate chain conveyor line 28, and a discharge conveyor line 30.

[0028] Multiple sets of support columns 2 are installed on the base plate 1. A three-axis moving assembly that drives the welding device 7 is installed at the top of each support column 2. A support plate 3 is horizontally installed at the top of each support column 2, located below the welding device 7. Limiting plates 20 are installed on both sides of the box body 8. The limiting plates 20 are inserted into two sets of loop frames 21. A power assembly that drives the loop frames 21 to move laterally is installed on the support plate 3. A scraper plate 9 is installed at the bottom right side of the box body 8. A circuit board positioning groove 10 is installed on the scraper plate 9. A guide angle 11 is installed at the right opening of the circuit board positioning groove 10 to allow the circuit board 31 to smoothly enter the circuit board positioning groove. The slide plate 17 is horizontally set on the U-shaped frame 21 and in contact with the bottom of the box body 8. A support frame 18 is set on the slide plate 17. The top of the support frame 18 and the top left side of the box body 8 are connected by multiple sets of springs 19. The telescopic device a14 is horizontally set on the inner left side of the box body 8. A baffle 12 is set at the telescopic end of the telescopic device a14. Multiple sets of air suction holes 32 are set on the baffle 12. An air suction assembly is set on the support frame 18. The air suction assembly sucks air through the air suction holes 32. The plate chain conveyor line 28 is set on the bottom plate 1 and located to the right of the shovel plate 9 through two sets of U-shaped support frames 29.

[0029] like Figure 4As shown, the plate chain conveyor line 28 is provided with multiple sets of feeding plates 24 at equal intervals. Circuit boards 31 are placed on the feeding plates 24. Guide slope a25, plane and guide slope b26 are arranged in sequence on the feeding plates 24. Feeding groove 27 is arranged on the plane. The feeding groove 27 forms an opening on the left side of the plane.

[0030] like Figure 2 and 3 As shown, circuit board 31 is placed in the feeding trough 27. The left side of circuit board 31 is located above guide slope a25. When the plate chain conveyor 28 rotates, the shovel 9 contacts the guide slope b26 and rises, shoveling circuit board 31 into the circuit board positioning groove 10. Then, guide slope b26 pushes circuit board 31 to contact baffle 12. At this time, the right side of circuit board 31 is flush with the right edge of shovel 9. The discharge conveyor 30 is located below the plate chain conveyor 28. A control system is installed on the base plate 1. The control system is connected to the three-axis moving assembly, welding device 7, power assembly, and plate chain conveyor 28.

[0031] Working principle: The circuit board 31 is placed in the feeding trough 27. The circuit board 31 is conveyed forward by the plate chain conveyor 28. When it reaches the left side of the plate chain conveyor 28, it stops. The power component pushes the loop frame 21 to the right. The shovel plate 9 is guided by the guide slope a25 and shovels the circuit board 31 into the circuit board positioning groove 10. Then, the guide slope b26 pushes the circuit board 31 to contact the baffle 12. At this time, the right side of the circuit board 31 is flush with the right edge of the shovel plate 9. Under the guidance of the guide slopes a25 and b26, the box 8 moves upward. The power component brings the loop frame 21 to the initial position. The welding device 7 drives the three-axis moving component to weld the circuit board 31. At the same time, the suction component sucks away the welding fumes through the suction hole 32. After welding, the telescopic device a14 extends and pushes the circuit board 31 into the feeding trough 27 through the baffle 12 and then retracts. Then the plate chain conveyor 28 continues to rotate, and the welded circuit board 31 falls onto the discharge conveyor 30 and is conveyed away.

[0032] In this embodiment, the circuit board 31 can be placed in the feeding trough 27 for subsequent automatic welding and automatic unloading, eliminating the need for operators to monitor the feeding and unloading process. This makes operation simple, labor-saving, and highly efficient. Furthermore, the welding fumes are immediately absorbed by the suction component through the suction port 32, demonstrating excellent adsorption and purification capabilities.

[0033] Example 2

[0034] like Figure 1As shown, the automatic welding device for integrated circuit chip processing with purification function proposed in this invention, compared with Embodiment 1, includes a three-axis moving assembly comprising a horizontal moving mechanism 4, a vertical moving mechanism 5, and a vertical moving mechanism 6. The horizontal moving mechanism 4 is disposed on top of the support column 2, and its moving direction is horizontal. The vertical moving mechanism 5 is disposed on the horizontal moving mechanism 4, and its moving direction is vertical. The vertical moving mechanism 6 is vertically disposed on the vertical moving mechanism 5, and its moving direction is up and down. The welding device 7 is disposed on the vertical moving mechanism 6. The three-axis moving assembly is prior art and will not be described in detail here; please refer to the machine tool moving structure.

[0035] like Figure 2 As shown, the power assembly includes a telescopic device b22 and a mounting base 23; the mounting base 23 is mounted on the support plate 3, the telescopic device b22 is horizontally mounted on the mounting base 23, and the telescopic end of the telescopic device b22 is connected to the U-shaped frame 21.

[0036] Example 3

[0037] like Figure 2 As shown, the automatic welding device for integrated circuit chip processing with purification function proposed in this invention, compared with Embodiment 1 or Embodiment 2, includes an air intake assembly comprising an air box 13, an air pipe 15, and an air intake device 16; the air box 13 is disposed on the baffle 12, the telescopic end of the telescopic device a14 is connected to the air box 13, and the air box 13 is connected to multiple sets of air intake holes 32; the air intake device 16 is disposed on the support frame 18; the two ends of the air pipe 15 are connected to the air intake device 16 and the air box 13, respectively.

[0038] In this embodiment, the suction device 16 is connected to multiple sets of suction holes 32 through the air pipe 15 and the air box 13. When the suction device 16 is working, it can quickly suck away the fumes generated in the welding area, and the dust suction and purification effect is good.

[0039] Example 4

[0040] The welding method based on the above embodiment of an automatic welding apparatus for integrated circuit chip processing with purification function includes the following steps:

[0041] S1. Place the circuit board 31 in the feeding trough 27, and the circuit board 31 is conveyed forward along the board chain conveyor line 28.

[0042] S2. When the conveyor reaches the left side of the plate chain conveyor line 28, it stops. The telescopic device b22 pushes the loop frame 21 to the right. After the shovel plate 9 is guided by the guide slope a25, it shovels the circuit board 31 into the circuit board positioning groove 10. Then the guide slope b26 pushes the circuit board 31 to move until it contacts the baffle 12. At this time, the right side of the circuit board 31 is flush with the right edge of the shovel plate 9. Under the guidance of the guide slope a25 and the guide slope b26, the box 8 moves upward.

[0043] S3, the telescopic device b22 retracts to the initial position, and the welding device 7 is driven by the three-axis moving component to weld the circuit board 31. At the same time, the suction device 16 sucks away the welding fumes through the air pipe 15 and the suction hole 32.

[0044] S4. After welding is completed, the telescopic device a14 extends through the baffle 12 to push the circuit board 31 into the material discharge trough 27 and then retracts.

[0045] S5. The plate chain conveyor 28 continues to rotate, and the welded circuit board 31 falls onto the discharge conveyor 30 and is conveyed away.

[0046] In this embodiment, the circuit board 31 can be placed in the feeding trough 27 for subsequent automatic welding and automatic unloading, eliminating the need for operators to monitor the feeding and unloading process. This makes operation simple, labor-saving, and highly efficient. Furthermore, the welding fumes are immediately absorbed by the suction component through the suction port 32, demonstrating excellent adsorption and purification capabilities.

[0047] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. An automatic welding device for integrated circuit chip processing with a purification function, characterized in that, It includes a base plate (1), a welding device (7), a box body (8), a baffle (12), a telescopic device a (14), a sliding plate (17), a loop frame (21), a plate chain conveyor line (28), and a discharge conveyor line (30); Multiple sets of support columns (2) are set on the base plate (1). A three-axis moving component that drives the welding device (7) is set on the top of the support column (2). A support plate (3) is set horizontally on the top of the support column (2). The support plate (3) is located below the welding device (7). Limiting plates (20) are set on both sides of the box body (8). The limiting plates (20) are inserted into two sets of loop frames (21). A power component that drives the loop frame (21) to move laterally is set on the support plate (3). A shovel plate (9) is set on the bottom right side of the box body (8). A circuit board positioning groove (10) is set on the shovel plate (9). A sliding plate (17) is set horizontally on the loop frame (21) and in contact with the bottom of the box body (8). A support frame (18) is set on the sliding plate (17). Between the top of the support frame (18) and the top left side of the box body (8) The telescopic device a (14) is horizontally arranged on the inner left side of the box body (8). The telescopic end of the telescopic device a (14) is equipped with a baffle (12). The baffle (12) is equipped with multiple sets of suction holes (32). The support frame (18) is equipped with a suction component. The suction component sucks air through the suction holes (32). The plate chain conveyor (28) is set on the bottom plate (1) and located to the right of the shovel plate (9) through two sets of U-shaped support frames (29). The plate chain conveyor (28) is equidistantly equipped with multiple sets of discharge plates (24). The discharge plate (24) is used to place the circuit board (31). When the plate chain conveyor (28) rotates, the circuit board (31) is shoveled into the circuit board positioning groove (10) by the shovel plate (9). The discharge conveyor (30) is located below the plate chain conveyor (28).

2. The automatic welding device for integrated circuit chip processing with purification function according to claim 1, characterized in that, A guide angle (11) is set on the right side of the slot of the circuit board positioning groove (10).

3. The automatic welding device for integrated circuit chip processing with purification function according to claim 1, characterized in that, A control system is installed on the base plate (1), and the control system is connected to the three-axis moving assembly, welding device (7), power assembly and plate chain conveyor line (28).

4. The automatic welding device for integrated circuit chip processing with purification function according to claim 1, characterized in that, The three-axis moving assembly includes a horizontal moving mechanism (4), a vertical moving mechanism (5), and a vertical moving mechanism (6); the horizontal moving mechanism (4) is located on the top of the support column (2), and the horizontal moving mechanism (4) moves in the horizontal direction; the vertical moving mechanism (5) is located on the horizontal moving mechanism (4), and the vertical moving mechanism (5) moves in the vertical direction; the vertical moving mechanism (6) is located vertically on the vertical moving mechanism (5), and the vertical moving mechanism (6) moves in the up and down direction; and the welding device (7) is located on the vertical moving mechanism (6).

5. The automatic welding apparatus for integrated circuit chip processing with purification function according to claim 4, characterized in that, The power assembly includes a telescopic device b (22) and a mounting base (23); the mounting base (23) is mounted on the support plate (3), the telescopic device b (22) is horizontally mounted on the mounting base (23), and the telescopic end of the telescopic device b (22) is connected to the loop frame (21).

6. The automatic welding apparatus for integrated circuit chip processing with purification function according to claim 5, characterized in that, The air intake assembly includes an air box (13), an air tube (15), and an air intake device (16); the air box (13) is mounted on a baffle (12), the telescopic end of the telescopic device a (14) is connected to the air box (13), and the air box (13) is connected to multiple sets of air intake holes (32); the air intake device (16) is mounted on a support frame (18); the two ends of the air tube (15) are connected to the air intake device (16) and the air box (13), respectively.

7. The automatic welding apparatus for integrated circuit chip processing with purification function according to claim 6, characterized in that, The feeding plate (24) is provided with guide slope a (25), plane and guide slope b (26) in sequence. The plane is provided with feeding groove (27). The feeding groove (27) forms an opening on the left side of the plane. The circuit board (31) is placed in the feeding groove (27). The left side of the circuit board (31) is above the guide slope a (25). When the plate chain conveyor (28) rotates, the shovel (9) rises after contacting the guide slope b (26) and shovels the circuit board (31) into the circuit board positioning groove (10). Then the guide slope b (26) pushes the circuit board (31) to move until it contacts the baffle (12). At this time, the right side of the circuit board (31) is flush with the right edge of the shovel (9).

8. A welding method for an automatic welding apparatus with purification function for processing integrated circuit chips according to claim 7, characterized in that, Includes the following steps: S1. Place the circuit board (31) in the feeding trough (27), and the circuit board (31) is conveyed forward along the board chain conveyor line (28); S2. When the conveyor reaches the left side of the plate chain conveyor line (28), it stops. The telescopic device b (22) pushes the loop frame (21) to move to the right. After the shovel plate (9) is guided by the guide slope a (25), it shovels the circuit board (31) into the circuit board positioning groove (10). Then the guide slope b (26) pushes the circuit board (31) to move until it contacts the baffle (12). At this time, the right side of the circuit board (31) is flush with the right edge of the shovel plate (9). Under the guidance of the guide slope a (25) and the guide slope b (26), the box (8) moves upward. S3, the telescopic device b (22) retracts to the initial position, and the welding device (7) is driven by the three-axis moving component to weld the circuit board (31). At the same time, the suction device (16) sucks away the welding fumes through the air pipe (15) and the suction hole (32). S4. After welding, the telescopic device a (14) extends through the baffle (12) to push the circuit board (31) into the feeding trough (27) and then retracts. S5. The plate chain conveyor (28) continues to rotate, and the welded circuit board (31) falls onto the discharge conveyor (30) and is conveyed away.

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