Apparatus for transporting components to be arranged in a substrate processing chamber

Abstract

The present invention relates to an apparatus for transporting a member to be arranged in a substrate processing chamber, a substrate processing system, and a method for transporting the member. A technique for transporting a member to be arranged in a substrate processing chamber to a predetermined arrangement position is provided. The apparatus includes a valve body for detachably blocking an opening portion that communicates with a substrate transport chamber and a substrate processing chamber arranged adjacent to each other, and the apparatus is provided with a member holding portion extending toward the substrate processing chamber from the valve body when the opening portion is blocked by the valve body. The member holding portion is configured to transport the member to a predetermined arrangement position in the substrate processing chamber when the opening portion is blocked by the valve body. Further, the apparatus includes a moving mechanism for moving the valve body detached from the opening portion in the substrate transport chamber.

Description

Technical Field

[0001] This disclosure relates to an apparatus for conveying a component to be disposed in a substrate processing chamber, a substrate processing system, and a method for conveying the component. Background Technology

[0002] In an apparatus for processing semiconductor wafers (hereinafter also referred to as "wafers") that serve as substrates, the wafers are transported to a processing chamber for processing using a transport mechanism. Inside the processing chamber are components with various structures corresponding to the processing of the wafers, and these components are regularly maintained and cleaned.

[0003] For example, Patent Document 1 describes a technology in which a plasma processing apparatus having a substrate mounting surface, an edge ring, and a cover ring is configured to transport the edge ring and the cover ring using a support portion of a wafer transport device. The edge ring is a component that surrounds the substrate held on the substrate mounting surface, and the cover ring is a component that is arranged to cover the outer surface of the edge ring.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2021-141305 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] This disclosure provides a technique for conveying a component to be disposed in a substrate processing chamber to a predetermined placement position between a substrate transport chamber and a substrate processing chamber arranged adjacent to each other.

[0009] Solution for solving the problem

[0010] This disclosure discloses an apparatus for conveying a component to be disposed in a substrate processing chamber, wherein the component to be disposed in the substrate processing chamber is conveyed between a substrate transport chamber and the substrate processing chamber disposed adjacent to each other, wherein...

[0011] The device for conveying components to be disposed in the substrate processing chamber includes:

[0012] A valve body configured to be removable relative to an opening that connects the substrate transport chamber and the substrate processing chamber, the valve body being used to block the opening.

[0013] A component holding portion, which is provided such that it extends from the valve body toward the substrate processing chamber when the opening is blocked by the valve body, is used to convey the component to a predetermined configuration position within the substrate processing chamber; and

[0014] A moving mechanism that moves the valve body, which has been removed from the opening, within the substrate conveying chamber.

[0015] The effects of the invention

[0016] According to this disclosure, a component to be disposed in the substrate processing chamber can be transported to a predetermined placement position between a substrate transport chamber and a substrate processing chamber disposed adjacent to each other. Attached Figure Description

[0017] Figure 1 This is a top view showing an example of the structure of a substrate processing system.

[0018] Figure 2 This is a top view showing the substrate processing chamber of the first embodiment.

[0019] Figure 3 This is a longitudinal sectional side view showing the substrate transport chamber and substrate processing chamber of the first embodiment.

[0020] Figure 4 This is an enlarged longitudinal sectional side view showing a portion of the first embodiment.

[0021] Figure 5 This is a perspective view showing a structural example of the moving mechanism of the first embodiment.

[0022] Figure 6A This is a first longitudinal sectional side view showing the function of the first embodiment.

[0023] Figure 6B This is a second longitudinal sectional side view showing the function of the first embodiment.

[0024] Figure 6C This is a third longitudinal sectional side view showing the function of the first embodiment.

[0025] Figure 6D This is a fourth longitudinal sectional side view showing the function of the first embodiment.

[0026] Figure 7 This is a longitudinal sectional side view showing a structural example of the opening of the substrate processing chamber.

[0027] Figure 8A This is a first longitudinal sectional side view showing the substrate transport chamber and substrate processing chamber of the second embodiment.

[0028] Figure 8B This is a second longitudinal sectional side view showing the second embodiment.

[0029] Figure 9 This is a longitudinal sectional side view showing the substrate transport chamber and substrate processing chamber of the third embodiment. Detailed Implementation

[0030] <Substrate Processing System>

[0031] The following is for reference Figure 1 The structure of an apparatus for transporting a component to be disposed in a substrate processing chamber, according to one embodiment of the present disclosure, will be described. The apparatus for transporting the component is provided in the substrate processing system 1.

[0032] Figure 1 A multi-chamber substrate processing system 1 is shown, comprising multiple substrate processing chambers 11 for processing wafers W. For example... Figure 1 As shown, the substrate processing system 1 includes an atmospheric transport chamber 12, a loading interlock chamber 13, a substrate transport chamber 14, and a plurality of substrate processing chambers 11, which are arranged sequentially in a horizontal direction starting from the atmospheric transport chamber 12 side. In the substrate processing system 1, the atmospheric transport chamber 12 is positioned near the front side, and when viewed from the front side, the front-to-back direction is defined as the Y direction, and the left-to-right direction is defined as the X direction, for the following description.

[0033] A loading port 121 is provided near the front of the atmospheric transport chamber 12. The loading port 121 is configured as a mounting stage for holding a carrier C of a wafer W to be processed, and for example, four such stages are arranged in the left-right direction. As the carrier C, for example, a FOUP (Front Opening Unified Pod) can be used.

[0034] The atmospheric transport chamber 12 is equipped with an atmospheric pressure (normal pressure) atmosphere, for example, forming a downward flow of clean air. In addition, an atmospheric transport mechanism 122 composed of multi-jointed arms is provided inside the atmospheric transport chamber 12, configured to transport the wafer W between the carrier C and the loading interlock chamber 13.

[0035] Two loading interlock chambers 13 are arranged, for example, side-by-side, between the atmospheric transport chamber 12 and the substrate transport chamber 14. Each loading interlock chamber 13 is configured to switch between atmospheric pressure and vacuum atmospheres, and includes a stage 130 for placing and transferring the wafer W, and lifting pins 131 that lift and hold the wafer W from below. For example, three lifting pins 131 are evenly spaced along the circumference, allowing for free lifting.

[0036] Openings for transporting the wafer W are formed between the loading interlock chamber 13 and the atmospheric transport chamber 14, and between the loading interlock chamber 13 and the substrate transport chamber 14, respectively. These openings are configured to be freely opened and closed by gate valves GV1 and GV2. Furthermore, as described later, the opening 132 provided between the loading interlock chamber 13 and the substrate transport chamber 14, like the substrate processing chamber 11, is also configured to be openable and closed by the valve body 22.

[0037] like Figure 1As shown, the substrate transport chamber 14 is composed of a shell that is longer in the front-to-back direction and rectangular when viewed from above, and is depressurized to a vacuum atmosphere using a vacuum exhaust mechanism (not shown). Alternatively, it can be configured such that an inert gas supply unit (not shown) for supplying an inert gas (e.g., nitrogen) is connected to the substrate transport chamber 14, and an inert gas is continuously supplied into the depressurized substrate transport chamber 14.

[0038] exist Figure 1 In the substrate processing system 1 shown in the example, four substrate processing chambers 11 are provided on each side of the substrate transport chamber 14, for a total of eight. Each substrate processing chamber 11 is configured to perform vacuum processing on the wafer W. Examples of processing performed on the wafer W include etching, film deposition, cleaning, and ashing.

[0039] <First Embodiment>

[0040] This disclosure relates to an apparatus for conveying a component to be disposed within a substrate processing chamber 11 between two adjacent substrate processing chambers 11 and substrate transport chambers 14. Hereinafter, a first embodiment of the substrate processing chamber 11 and substrate transport chamber 14 will be described. Furthermore, in Figure 1 , Figure 2 The description also includes a sub-coordinate axis, which is set as the base end side of the Y' axis from the view of each substrate processing chamber 11 where the substrate transport chamber 14 is arranged. In the description of each substrate processing chamber 11, the connection position connected to the substrate transport chamber 14 is described as the near-front side (front side).

[0041] like Figures 2-4 As shown, the substrate processing chamber 11 in this example includes a processing container 2 and a communication path 21 connecting the processing container 2 to the substrate transport chamber 14. The wafer W is transported between the processing container 2 and the substrate transport chamber 14 via the communication path 21.

[0042] The connecting path 21 is configured, for example, to be a transport path with a vertical dimension smaller than that of the processing container 2 and the substrate transport chamber 14, and having a width dimension that allows the component containing the wafer W to pass through. The substrate transport chamber 14 is connected to the substrate processing chamber 11 via an opening 20 at one end of the connecting path 21.

[0043] The opening 20 is configured to be opened and closed by a valve body (first valve body) 22. This valve body 22 is configured to be easily attached and detached from the opening 20. Furthermore, the valve body 22 is connected to the moving mechanism 3 (described later), allowing it to move within the substrate transport chamber 14. The valve body 22 includes a component holding part 23 for conveying a component to be disposed within the substrate processing chamber 11. The component holding part 23 is structured such that it can be inserted into the substrate processing chamber 11 when the opening 20 is sealed by the valve body 22, conveying the component to be transported to a pre-set placement position within the substrate processing chamber 11. Additionally, the valve body 22 includes an O-ring 221 for airtightly sealing the opening 20. Moreover, the opening 20 is also configured to be opened and closed by a second valve body 26. The second valve body 26 is a valve body that seals the opening 20 during the removal of the first valve body; its structure will be described later. Figure 7 ).

[0044] The components conveyed by the component holding unit 23 and to be placed in the substrate processing chamber 11 will then be described in detail. In this example, "wafer", "focusing ring", "part of the shielding component", and "part of the rectifier component" are equivalent to these components. Hereinafter, these components will also be referred to as "placement components".

[0045] Furthermore, the preset configuration position within the substrate processing chamber 11 refers to the position in which the component is positioned when wafer W is processed within the substrate processing chamber 11. Hereinafter, "preset configuration position" will sometimes be referred to as "component configuration position".

[0046] Next, we will describe a structural example of the substrate processing chamber 11, taking the case where the processing performed on the wafer W is plasma etching. The processing container 2 of the substrate processing chamber 11 is grounded and connected to the vacuum exhaust mechanism 25 via the exhaust path 24. Inside the processing container 2, there is a mounting stage 41, which in this example has a protrusion 42 on its upper surface. For example, the longitudinal cross-sectional shape of the protrusion 42 is trapezoidal, and its upper surface forms a mounting surface that supports the wafer W from the back side. The mounting surface is configured such that its periphery is located inside the outer edge of the wafer W. The wafer W is subjected to a predetermined vacuum processing while it is placed on this mounting surface (the upper surface of the protrusion 42). In addition, the wafer W placed on the mounting surface will sometimes be referred to as the wafer W placed on the mounting stage 41. Furthermore, a heating element (not shown) is embedded in the mounting stage 41.

[0047] A spray head 43 is provided on the top of the processing container 2, facing the wafer W placed on the mounting stage 41, via an insulating member 44. A high-frequency power supply 45 for plasma generation is connected to the spray head 43, functioning as the upper electrode. On the other hand, the mounting stage 41 is grounded via the processing container 2, functioning as the lower electrode. A parallel-plate type plasma forming mechanism is formed between the spray head 43 and the mounting stage 41. Alternatively, in the substrate processing chamber 11 where plasma-free processing is performed, the high-frequency power supply 45 and other plasma forming mechanisms may not be provided.

[0048] In addition, the spray head 43 includes a plurality of gas ejection holes (not shown) on its lower surface, configured to supply etching gas from the etching gas (processing gas) supply source 46 to the processing container 2 via the spray head 43.

[0049] Therefore, when etching gas is supplied from the spray head 43 and high-frequency power is applied to the spray head 43 from the high-frequency power supply 45, capacitively coupled plasma is formed between the spray head 43 and the stage 41.

[0050] A shielding member 5 is provided inside the processing container 2. The shielding member 5 is a component used to prevent products generated during the processing of the wafer W from adhering to the inner wall of the main body of the substrate processing chamber 11, i.e., the processing container 2. In this example, it is provided to prevent byproducts generated during the etching process from adhering to the processing container 2. The shielding member 5 is constructed by combining a first shielding member 51 installed in the processing container 2 and a second shielding member 52, which is a configuration member fed in by the component holding part 23.

[0051] As described above, the valve body 22 can move within the substrate transport chamber 14 using the moving mechanism 3. Therefore, each of the configuration members including the second shielding member 52 described above is configured to move within the substrate transport chamber 14 together with the valve body 22.

[0052] Regarding this aspect, Figure 2 and Figure 3 This shows the position of the configuration component within the substrate transport chamber 14. Furthermore, Figure 4 This shows the state in which the opening 20 is blocked by the valve body (first valve body) 22, and the component arrangement positions are such that each component is positioned within the processing container 2. Additionally, in Figures 2-4 The illustration of the second valve body 26 is omitted.

[0053] In this example, the shielding member 5 is formed in a generally cylindrical shape and is arranged to surround the side wall of the spray head 43 and the upper side portion of the side wall of the platform 41 with gaps.

[0054] The second shielding member 52 is a structure formed by cutting off the side wall portion of the shielding member 5, which is configured as a cylinder, in the area opposite the opening on the substrate processing chamber 11 side of the connecting path 21. The remaining portion of the shielding member 5 constitutes the first shielding member 51. Hereinafter, the area in the first shielding member 51 from which the second shielding member 52 is cut off is referred to as the "notch area".

[0055] At the location where the second shielding member 52 is cut out, the lower end of the first shielding member 51 is at a height that does not interfere with the feed-out path of the wafer W fed in and out while held in the member holding part 23. Furthermore, as... Figure 3 , Figure 4 As shown, a stepped portion 511 is formed at the lower end in a manner that combines with the upper end of the second shielding member 52.

[0056] A flow-rectifying member 6 is provided around the mounting platform 41. The flow-rectifying member 6 is used to rectify the flow of air within the processing container 2, and is constructed, for example, by forming multiple holes 60 in an annular plate member. Figures 2-4 In the example shown, the rectifier 6 is embedded in the area sandwiched between the side wall of the platform 41 and the shielding member 5, and is configured to face the ground of the processing container 2. The second rectifier 62 is a structure that, when viewed from above as an annular rectifier 6, cuts off the area sandwiched between the second shielding member 52 and the side wall of the platform 41. The remaining portion of the rectifier 6 constitutes the first rectifier 61. The area from which the second rectifier 62 is cut off in the first rectifier 61 is also referred to as the "notch area".

[0057] <Components to be placed in the substrate processing chamber>

[0058] Next, the components (configuration components) to be configured in the substrate processing chamber 11 will be described. In this example, the configuration components include, in addition to the second shielding component 52 and the second rectifier component 62 described above, the wafer W and the focusing ring 47 processed in the substrate processing chamber 11.

[0059] These configuration components are held by component retaining parts 23 that are connected to the valve body 22. For example... Figure 4 As shown, the component holding part 23 is configured to extend from the valve body 22 toward the substrate processing chamber 11 when the opening 20 is blocked by the valve body 22.

[0060] like Figures 2-4 As shown, the component retaining portion 23 is mounted to the front surface of the valve body 22 in a generally horizontal manner. In this example, the component retaining portion 23 includes plate-shaped components 231 arranged parallel to each other vertically, such as... Figure 4As shown, truss members 232 for increasing strength are provided between the upper and lower plate-like members 231.

[0061] The top end of the component holding part 23 is connected to the back end of the second shielding member 52. The second shielding member 52, held from the back end of the component holding part 23, is conveyed to... Figure 4 When the components are positioned as shown, they fit into the notch area of ​​the first shielding member 51 installed on the side of the processing container 2. The shielding member 5 is composed of these first shielding members 51 and second shielding members 52. Furthermore, a step portion 521 is formed at the upper end of the second shielding member 52 in combination with the step portion 511 on the side of the first shielding member 51.

[0062] A second rectifier 62 is connected to the lower end of the front surface of the second shielding member 52. The second rectifier 62 is used to transport... Figure 4 When the components are positioned as shown, they fit into the notch area of ​​the first rectifier 61 installed on the side of the processing container 2. These first rectifiers 61 and second rectifiers 62 constitute an annular rectifier 6.

[0063] Furthermore, a focusing ring 47 is connected to the top side of the second rectifier 6. The focusing ring 47 is disposed around the wafer W to improve the in-plane uniformity of the plasma etching process for the wafer W.

[0064] like Figure 2 As shown, the focusing ring 47 is a ring-shaped component, which is conveyed to... Figure 4 The component is positioned around the protrusion 42 of the stage 41. Furthermore, the focusing ring 47 includes a stepped portion 471 that holds the periphery of the wafer W. The focusing ring 47 is inserted into the substrate processing chamber 11 while holding the wafer W on the stepped portion 471.

[0065] For example, when the focusing ring 47 is positioned in the component placement position, the height of the upper surface of the step portion 471 is set lower than the height of the upper surface (mounting surface) of the convex portion 42. Using this structure, when the focusing ring 47, which holds the wafer W, is lowered, the wafer W connects to the convex portion 42. Furthermore, during the processing of the wafer W, the step portion 471 is positioned below the wafer W.

[0066] In addition, Figure 4In the figures other than those shown, for ease of illustration, it is stated that the height position of the convex portion 42 is consistent with the height position of the step portion 471 of the focusing ring 47. Alternatively, the structure can be configured such that the height position of the convex portion 42 and the height position of the step portion 471 are consistent, or the upper surface of the step portion 471 is located above the upper surface of the convex portion 42, and the processing is performed while the wafer W is held by the focusing ring 47.

[0067] like Figure 4 As shown, a support member 48 for supporting the focusing ring 47 from the lower surface side is provided at the top end of the second rectifier plate 62. On the other hand, a stepped portion 411 is formed on the mounting stage 41, which is used to avoid interference between the second rectifier plate 62 and the focusing ring 47 and the support member 48 when the second rectifier plate 62 and the focusing ring 47 are positioned in the component placement position. Furthermore, in Figure 4 In all other figures, the step portion 411 of the platform 41 is omitted from the illustration.

[0068] <Mobile Organization>

[0069] In the substrate transport chamber 14 described above, the valve body 22 is moved by using a magnetically levitated moving mechanism 3 to transport the components (wafer W, second shielding member 52, second rectifier member 62, focusing ring 47) positioned at the component arrangement location. For example, as Figure 3 and Figure 5 As shown, the moving mechanism 3 includes a ground surface 141 of the substrate transport chamber 14 having a first magnet and a moving body 31 configured to move within the substrate transport chamber 14.

[0070] The movable body 31 is rectangular when viewed from above, and is provided with a second magnet that acts with a reaction force between itself and the first magnet, thus enabling it to move by magnetic levitation using the reaction force.

[0071] like Figure 5 As schematically shown, a plurality of bricks (moving bricks) 30 are provided on the ground surface 141 of the substrate transport chamber 14. These bricks 30 are arranged in the moving area of ​​the moving body 31 near the front of the substrate processing chamber 11 from the junction position of the wafer W between the loading interlock chamber 13 and the substrate interlock chamber 13.

[0072] Within the brick 30, a plurality of movable surface coils 32 are arranged. The movable surface coils 32 are equivalent to the first magnet of this disclosure, which generate a magnetic field by being powered by a power supply unit (not shown).

[0073] On the other hand, multiple module-side magnets 33, composed of permanent magnets, are arranged inside the movable body 31. These module-side magnets 33 correspond to the second magnets of this disclosure, and each module-side magnet 33 has a reaction force (magnetic force) with the magnetic field generated by the moving surface-side coil 31. This action enables the movable body 31 to be magnetically levitated relative to the moving surface of the upper surface of the brick 30. Alternatively, the module-side magnets 33 can also be composed of coils that function as electromagnets and are powered by a battery installed inside the movable body 31. Furthermore, both permanent magnets and coils can be used to construct the module-side magnets 33.

[0074] The brick 30 is configured to allow adjustment of the position and intensity of the generated magnetic field using multiple movable-side coils 32, thereby changing the state of the magnetic field. By controlling this magnetic field, the moving body 31 can be moved in a desired direction on the movable surface, its levitation distance from the movable surface can be adjusted, and the orientation of the moving body 31 can be adjusted. Control of the magnetic field on the brick 30 side is implemented by selecting the energized movable-side coils 32 and adjusting the amount of power supplied to the movable-side coils 32.

[0075] like Figure 3 and Figure 4 As shown, the lower end of the valve body 22 is mounted on the upper surface of the top side of the movable body 31. In this example, as... Figure 4 As shown, the valve body 22 and the movable body 31 are configured to be easily attached and detached using a first threaded mechanism 34. For example, the valve body 22 is provided with a threaded member 341 that can protrude downward from its lower surface and a drive mechanism 342 for the threaded member. On the other hand, a threaded hole 343 for the threaded member 341 to be screwed into is formed on the upper surface of the movable body 31. Thus, by using the drive mechanism 342 to rotate the threaded member 341 in the tightening direction, the threaded member 341 is inserted into the threaded hole 343, and the valve body 22 is fixed to the movable body 31. On the other hand, by rotating the threaded member 341 in a loosening manner, its lower end rises from the upper surface of the movable body 31, thereby separating the valve body 22 from the movable body 31.

[0076] Furthermore, the valve body 22 is configured, for example, to be easily attached to and detached from the wall surrounding the opening 20 of the processing container 2 using a second threaded mechanism 35. For example, the valve body 22 is provided with a threaded member 351 for mounting, which protrudes forward from its front surface, and a drive mechanism 352 for the threaded member 351. On the other hand, a threaded hole 353 for threading the threaded member 351 is formed in the wall of the processing container 2 where the valve body 22 is mounted. Thus, by rotating the threaded member 351 in the tightening direction using the drive mechanism 352, the valve body 22 is fixed to the wall of the processing container 2. By rotating the threaded member 351 in a loosening manner and separating it from the wall, the valve body 22 can be removed from the processing container 2.

[0077] Furthermore, the valve body 22 and the movable body 31, or the valve body 22 and the wall of the processing container 2, can be connected and disconnected by any mechanical mechanism, and are not limited to a threaded mechanism. Alternatively, the valve body 22 can be held by a manipulator provided on the side of the movable body 31 or the wall of the processing container 2.

[0078] When the opening 20 of the device for transporting components disclosed herein is blocked by the valve body 22, the component holding part 23 is configured to extend from the opening 20 toward the substrate processing chamber 11. Thus, the components held by the component holding part 23 are transported to a predetermined position within the substrate processing chamber 11; in this example, this includes the second shielding member 52, the second rectifying member 62, the focusing ring 47, and the wafer W. In this way, the component holding part 23 has the function of transporting the wafer W to a position within the vacuum processing chamber 11 for processing, equivalent to the substrate holding part of this disclosure.

[0079] Next, regarding Figure 1 The structure of the loading interlock chamber 13 in the example shown will be further explained. As described above, the opening 132 for transporting the wafer W formed between the loading interlock chamber 13 and the substrate transport chamber 14 can be opened and closed using either the gate valve GV2 or the valve body 22. Furthermore, the stage 130 for placing the wafer W has, for example, a protrusion with the same shape as the stage 41.

[0080] Therefore, when the valve body 22 is used to block the opening 132 of the loading interlock chamber 13, the component holding part 23 is configured to extend from the valve body 22 toward the stage 130. Using this structure, for example, with... Figure 4 Similarly, the wafer W can be transferred from the focusing ring 47 to the stage 130, just as the transfer operation between the stage 41 and the focusing ring 47 on the substrate processing chamber 11 side is described.

[0081] Alternatively, the stage 130 may not be provided in the loading interlock chamber 13, and the focusing ring 47 may be kept in standby mode with the focusing ring 47 positioned at a predetermined height within the loading interlock chamber 13. In this case, by protruding the lifting pin 131 to a position above the holding height of the wafer W held by the focusing ring 47, the wafer W can be transferred to the atmospheric transport mechanism 122.

[0082] Furthermore, a threaded hole (not shown) is formed in the portion of the wall of the loading interlock chamber 13 around the opening 132, for threading the valve body 22 using the aforementioned second threaded mechanism 35. Additionally, the gate valve GV2 is configured such that, when the valve body 22 performs the opening and closing operation of the opening 132, it retracts to a position that does not obstruct this operation (see also the following description). Figure 7 ).

[0083] exist Figure 1In the example shown, the length of the short side of the rectangular substrate transport chamber 14, when viewed from above, is such that two movable bodies 31, each holding a valve body 22, are staggered in a left-right arrangement. In this example, multiple movable bodies 31 arranged within the substrate transport chamber 14 are used to transport the valve body 22 and the components.

[0084] The device described above, including the valve body 22, the component holding part 23 that holds the component, and the moving mechanism 3, is equivalent to the device of this disclosure for transporting components to be disposed in the substrate processing chamber 11.

[0085] <Control Department>

[0086] The substrate processing system 1 includes a control unit 100. The control unit 100 is a computer comprising a CPU and a storage unit, and controls various parts of the substrate processing system 1. The storage unit contains a program that includes sets of steps (instructions) for controlling the movement of the movable body 31, the operation of the substrate processing chamber 11, etc. This program is stored, for example, on a storage medium such as a hard disk, optical disk, magneto-optical disk, memory card, or non-volatile memory, and is loaded from that storage medium into the computer.

[0087] <Conveying Action>

[0088] Next, an example of the wafer W transport operation in the substrate processing system 1 including the above-described structure will be described. First, the carrier C containing the wafer W to be processed is placed in the loading port 121, and the wafer W is taken out from the carrier C by the atmospheric transport mechanism 122 in the atmospheric transport chamber 12.

[0089] On the other hand, in the loading interlock chamber 13, such as Figure 1 As shown, before transporting the wafer W, the valve body 22 is used to block the opening 132, allowing the component holding part 23 to enter the loading interlock chamber 13, and the focusing ring 47 is pre-positioned on the stage 130.

[0090] Next, the wafer W is fed into the loading interlock chamber 13 using the atmospheric conveying mechanism 122, and lifted and supported by the lifting pin 131. Then, the lifting pin 131 is lowered to transfer the wafer W to the stage 130.

[0091] Subsequently, when the atmospheric transport mechanism 122 retracts from the loading interlock chamber 13, the gate valve GV1 is closed, causing the loading interlock chamber 13 to switch from atmospheric pressure atmosphere to vacuum atmosphere.

[0092] exist Figure 1The loading interlock chamber 13 shown on the right illustrates the process of adjusting the pressure within the loading interlock chamber 13 while the wafer W is placed on the stage 130. In this example, the valve body 22, which seals the opening 132, is removed from the moving body 31. Then, after creating a vacuum atmosphere within the loading interlock chamber 13, the moving body 31 is installed onto the valve body 22. The assembly and disassembly of the moving body 31 and the valve body 22 will be described next. Furthermore, the connection between the valve body 22 and the wall surrounding the opening 132, which is made possible by the second threaded mechanism 35, is released. Next, within the substrate transport chamber 14, the moving body 31 is raised by magnetic levitation using the magnetic field generated by the moving surface side coil 32 provided on the brick 30.

[0093] Then, the moving body 31 is retracted to remove the valve body 22 from the opening 132. At this time, the focusing ring 47 rises along with the moving body 31, and the wafer W is transferred from the stage 130 to the focusing ring 47. Next, the moving body 31 is moved backward to the substrate processing chamber 11 where the wafer W is processed, and the moving body 31 is rotated so that the front end of the component holding part 23 holding the wafer W is facing the opening 20. Next, the moving direction of the moving body 31 is switched to forward to feed the wafer W into the substrate processing chamber 11.

[0094] Thus, as Figure 6A As shown, the component holding portion 23 holding the wafer W is positioned directly opposite the opening 20 of the substrate processing chamber 11. Then, as... Figure 6B As shown, the moving body 31 is advanced to a position above the stage 41, and the center of the wafer W is positioned slightly forward of the center of the stage 41. Additionally, in Figures 6A to 6D , Figure 7 The first shielding member 51 and the second shielding member 52 near the opening on the substrate processing chamber 11 side of the connecting path 21 are shown in a simplified manner. Furthermore, descriptions of the first shielding member 51 and the first rectifier member 61 in other areas are omitted.

[0095] Next, the moving body 31 is moved forward in a straight line while descending, causing the wafer W to move diagonally downwards. Using this action, the wafer W first contacts the upper surface of the protrusion 42 of the stage 41. Then, by continuing the movement of the moving body 31, the wafer W is transferred from the focusing ring 47 to the protrusion 42 (see reference). Figure 6C Next, the moving body 31 is lowered to the component placement position where the focusing ring 47 contacts the stage 41. As described above, for ease of illustration, in Figure 6C In the diagram, the height position of the stepped portion 471 of the focusing ring 47 is the same as the height position of the convex portion 42.

[0096] When the focusing ring 47 contacts the stage 41, the length of the component holding part 23 is adjusted so that the opening 20 is blocked by the valve body 22. In addition, along with the above-mentioned wafer W feeding operation, each component (focusing ring 47, second shielding component 52, second rectifier component 62) held in the component holding part 23 is also transported to its respective component placement position.

[0097] As described above, when the wafer W is placed on the stage 41, the moving body 31 moves toward the downward side. The shapes of the connecting path 21 and the first shielding member 51 are set in a way that allows this movement to be performed, and the height position of the moving body 31 is controlled within the substrate transport chamber 14.

[0098] In this example, the wafer W is moved diagonally downwards to transfer it from the focusing ring 47 to the stage 41. During this transfer, the focusing ring 47 continues to descend in an inclined direction after transferring the wafer W to the stage 41. Therefore, the center of the wafer W placed on the stage 41 and the center of the focusing ring 47 may be slightly offset. In such cases, the direction and amount of the offset between the two centers are determined in advance. Alternatively, the wafer W can be transferred to the focusing ring 47 in advance in the opposite direction to the offset direction within the loading interlock chamber 13.

[0099] The aforementioned transport action, which moves the wafer W diagonally downward, is one example; the wafer W can also be transferred via other transport paths. For instance, the wafer W can be transported to a position above the stage 41 by moving the moving body 31 in a straight line and aligning their centers. Next, the moving body 31 can be lowered to transfer the wafer W to the convex portion 42, and then the moving body 31 can be lowered to position the focusing ring 47 in the component placement position.

[0100] Next, as Figure 6D As shown, the valve body 22 is mounted to the wall of the processing container 2 using the second threaded mechanism 35 to seal the opening 20. Then, the first threaded mechanism 34 is driven to separate the moving body 31 from the valve body 22. The moving body 31, separated from the valve body 22, is used for the movement of other valve bodies 22.

[0101] Thus, in the substrate processing chamber 11 containing the wafer W and with the opening 20 sealed by the valve body 22, the wafer W is heated as needed by the heating section to a preset temperature. Furthermore, etching gas, serving as a processing gas, is supplied into the processing container 2 from the spray head 43, and high-frequency power is applied from the high-frequency power supply 45. As a result, capacitively coupled plasma is generated within the processing container 2, and plasma etching processing is performed on the wafer W using the active species in the etching gas.

[0102] At this time, the focusing ring 47, the second shielding member 52, and the second rectifying member 62 are arranged in the preset member configuration positions. As a result, the flow of etching gas can be controlled by the rectifying member 6, and the in-plane etching process with good uniformity can be performed by the focusing ring 47, while the shielding member 5 prevents the product from adhering to the inner wall of the processing container 2.

[0103] At the end of the plasma etching process, the moving body 31 is installed on the valve body 22. Then, the valve body 22 is removed from the wall of the processing container 2 by driving the second threaded mechanism 35. Afterwards, the moving body 31 is raised and moved to deliver the wafer W from the substrate processing chamber 11 in the reverse order of its insertion. Here, if other processing is performed after the plasma etching process, the wafer W is transported to the substrate processing chamber 11 where that processing is performed. When transporting the wafer W to other substrate processing chambers 11, this process is repeated. Figures 6A to 6D The example illustrates the same feeding action.

[0104] During the period when the valve body (first valve body) 22 is removed from the opening 20, the opening 20 is sealed by the second valve body 26 as described later.

[0105] Furthermore, when the wafer W is transported to the loading interlock chamber 13 after all processing is completed, the gate valve GV2 of the loading interlock chamber 13, which is the destination, is opened. Then, the valve body 22 is moved by the moving body 31 to send the processed wafer W into the loading interlock chamber 13. Next, the opening 132 of the loading interlock chamber 13 is closed by the valve body 22, and the wafer W is placed on the stage 130. In addition, the moving body 31 is detached from the valve body 22 for the movement of other valve bodies 22. Afterward, the loading interlock chamber 13 is adjusted to atmospheric pressure, the gate valve GV1 is opened, and the wafer W is transferred to the atmospheric conveying mechanism 122 by means of the lifting pin 131. After the atmospheric conveying mechanism 122 sends the wafer W out, the gate valve GV1 of the loading interlock chamber 13 is closed, and the wafer W is stored in the carrier C.

[0106] <Component maintenance and cleaning>

[0107] As explained above, the valve body 22 of this disclosure is provided with a focusing ring 47, a second shielding member 52, and a second rectifying member 62 via a member holding portion 23. On the other hand, the members disposed in the substrate processing chamber 11 are subject to periodic maintenance and cleaning. At this time, there are also cases where the members to be maintained and cleaned are removed from the substrate processing chamber 11. In this regard, since the aforementioned members (focusing ring 47, second shielding member 52, and second rectifying member 62) can be transported out of the substrate processing chamber 11 using a moving body 31, these members can be removed without opening the substrate processing chamber 11, which is in a vacuum atmosphere.

[0108] During maintenance, for example, the moving body 31 is connected to the valve body 22 holding the component to be loaded, and the component held by the component holding part 23 is transported to the loading interlock chamber 13. Then, the opening 132 of the loading interlock chamber 13 is closed by the valve body 22, allowing the loading interlock chamber 13 to return to atmospheric pressure. Next, for example, the top plate of the loading interlock chamber 13 is opened, and the operator removes at least one of the components: the focusing ring 47, the second shielding component 52, and the second rectifying component 62. Then, these components are maintained, cleaned, and replaced.

[0109] Thus, after the component maintenance is completed, the component is returned to the state held in the component holding part 23. Then, the top plate of the opened loading interlock chamber 13 is closed, and the transport of the wafer W using the valve body 22 is resumed.

[0110] <Effect>

[0111] According to this embodiment, the component to be placed in the substrate processing chamber 11 is connected to the valve body 22 by means of the component holding part 23. Thus, the structure is such that when the opening 20 connecting the substrate transport chamber 14 and the substrate processing chamber 11 is blocked by the valve body 22, the component is transported to a predetermined placement position within the substrate processing chamber 11. In this way, by making the valve body 22 that blocks the opening 20 and the component to be placed in the substrate processing chamber 11 an integral structure, these components can be sent out of the substrate processing chamber 11 together with the valve body 22.

[0112] Furthermore, the valve body 22 can be moved using the movable body 31 provided outside the substrate processing chamber 11, thus eliminating the need for a separate lifting pin and its drive mechanism for arranging these components within the substrate processing chamber 11. Consequently, the structural elements arranged within the substrate processing chamber 11 can be reduced, enabling miniaturization of the substrate processing chamber 11 and a reduction in manufacturing costs.

[0113] Furthermore, by simultaneously opening and closing the valve body 22 to the opening 20 and transporting the components, the number of processes is reduced compared to performing these actions individually. This simplifies the control of the drive mechanism for substrate processing and reduces operating costs.

[0114] Furthermore, when performing regular maintenance and cleaning on components to be placed in the substrate processing chamber 11, the components are transported to the loading interlock chamber 13, and the opening 132 of the loading interlock chamber 13 is sealed by the valve body 22 to perform the necessary processing. In this way, maintenance and other operations can be performed while the atmosphere in the substrate transport chamber 14 is disconnected, and the substrate processing chamber 11 and the substrate transport chamber 14 can be maintained in a vacuum atmosphere.

[0115] Therefore, when performing maintenance on the aforementioned components, since it is not necessary to open the vacuum atmosphere of the substrate processing chamber 11 and the substrate transport chamber 14 to the atmosphere, the number of maintenance procedures, processing time, and time to stop the substrate processing system can be reduced.

[0116] Furthermore, in structures where components requiring regular maintenance are transported together with the valve body 22, the components can be transported as a single unit, and maintenance of these components can be performed simultaneously. Therefore, compared to performing maintenance on components individually, the time and effort required for maintenance at each stage can be reduced. In addition, since the components and the component holding part 23 are integrally formed, the assembly and operation verification of these components can be performed simultaneously, reducing the number of quality inspection steps required for maintenance.

[0117] Furthermore, in the above embodiment, the valve body 22 and the movable body 31 are configured to be easily detachable. Therefore, the movable body 31 can be removed from the valve body 22 when the opening 20 is blocked, and the movable body 31 can be shared for multiple valve bodies 22. Consequently, the number of movable bodies 31 can be reduced compared to the valve body 22, thus enabling a reduction in the size of the structural components. Moreover, compared to the case where the movable body 31 is fixedly provided on all valve bodies 22, the dedicated area of ​​the movable body 31 can be reduced, enabling miniaturization of the substrate transport chamber 14.

[0118] On the other hand, it is not necessary for the movable body 31 to be detachable from the valve body 22. The movable body 31 can also be fixedly provided relative to all or part of the valve body 22 as needed.

[0119] <Example of the structure of the opening and closing mechanism of the opening>

[0120] Here, refer to Figure 7 The structure of the opening and closing mechanism of the opening is described in the following description. In the following description, common structural parts are labeled as... Figures 1 to 6D The same reference numerals are used in the accompanying drawings, and further explanation is omitted. In this structural example, the second valve body 26 will be described.

[0121] exist Figure 7 In the example shown, the second valve body 26 is configured to move freely between a position blocking the opening 20 and a retracted position above that blocking position, and a valve box 142 is formed in the substrate transport chamber 14 to form the retracted position. However, the retracted position of the second valve body 26 is not limited to... Figure 7 As shown in the example, it can also be placed below or to the side of the location of the blocking opening 20.

[0122] Furthermore, when the wafer W is fed into the substrate processing chamber 11, as described in the first embodiment, the opening 20 is sealed by the valve body (first valve body) 22 to process the wafer W. Additionally, as... Figure 7 As shown, when the wafer W has not been processed and the component holding part 23 and each configured component are on the substrate transport chamber 14 side, the opening part 20 is blocked by the second valve body 26.

[0123] Using this structure, when the wafer W is in the substrate transport chamber 14, the opening 20 is closed by the second valve body 26. Therefore, during the period when the valve body 22 is removed, the possibility of reaction products generated in the substrate processing chamber 11 flowing out to the substrate transport chamber 14 side can be suppressed. In addition, the possibility of temperature and pressure conditions in the substrate processing chamber 11 affecting the substrate transport chamber 14 side is reduced.

[0124] <Second Implementation>

[0125] Reference Figure 8A and Figure 8B The second embodiment of this disclosure will be described. This embodiment is configured to allow the focusing ring 47 and its support member 48 to be separated. In the examples of these figures, a connecting pin 491 is provided at the upper end of the support member 48, and a recess 492 with a shape corresponding to the connecting pin 491 is formed on the lower surface of the focusing ring 47.

[0126] In this example, when the configuration component is transported together with the valve body 22, the focusing ring 47 is supported from below by the support member 48, thereby engaging the connecting pin 491 with the recess 492. Thus, with both connected, the same method as in the first embodiment is used, such as... Figure 8A As shown, the wafer W is transported to the stage 41. Then, after the wafer W is placed on the stage 41, the moving body 31 is further lowered, thereby pulling out the connecting pin 491 of the support member 48 from the recess 492 of the focusing ring 47, separating the two (see reference). Figure 8B ).

[0127] On the other hand, when the processing of the wafer W in the substrate processing chamber 11 is completed, the moving body 31 is raised again, and the connecting pin 491 of the support member 48 is inserted into the recess 492 of the focusing ring 47, thereby holding the focusing ring 47 and the wafer W in the member holding portion 23. Then, using the same method as in the first embodiment, the wafer W is sent from the substrate processing chamber 11 to the substrate transport chamber 14. Alternatively, a connecting pin may be provided on the focusing ring 47 side and a recess on the support member 48 side between the support member 48 and the focusing ring 47. In this example, except that the focusing ring 47 and the support member 48 are configured to be easily detachable, they are configured the same as in the first embodiment.

[0128] In this second embodiment, the same effect as in the first embodiment is achieved. Furthermore, since the focusing ring 47 is separated from the valve body 22 during wafer W processing, the position of the focusing ring 47 does not change due to variations in the connection position of the valve body 22. Considering that the valve body 22 is connected to the processing container 2 via the O-ring 221, slight changes in the position of the valve body 22's sealing opening 20 due to shape changes such as deterioration of the O-ring 221 could affect the configuration of the focusing ring 47. Therefore, as in this example, by equipping the structure with a configuration that separates the focusing ring 47 from the valve body 22 during wafer W processing, an improvement in the accuracy of the focusing ring 47's configuration position can be expected.

[0129] <Third Implementation>

[0130] Reference Figure 9 The third embodiment of this disclosure will be described. This embodiment illustrates another example of a configuration member disposed in a substrate processing chamber, which is a structural example in which the configuration member is a shielding member that covers a non-target surface during the pre-coating process in the substrate processing chamber. The non-target surface refers to the surface in the substrate processing chamber where no pre-coating process is performed.

[0131] Figure 9 The substrate processing chamber shown is configured, for example, to perform film deposition on wafer W using PVD (Physical Vapor Deposition), referring to this... Figure 9 An example of a pre-coated shielding component will be given.

[0132] First, to briefly describe the film deposition process, the substrate processing chamber 11a includes a processing container 7 that communicates with the substrate transport chamber 14 via an opening 20. In this example, a valve body 22 and a valve body 220 are provided. The valve body 22 is equipped with a component holding portion 23 that can transport the wafer W as a substrate holding portion, and the valve body 220 is equipped with a component holding portion 230 that holds a shielding member 8, which is a configuration component.

[0133] Therefore, when processing wafer W, the valve body 22 is moved by the movement of the moving body 31, and the wafer W is transported by the component holding part 23. This aspect is consistent with the use of Figures 6A to 6D The example of substrate processing chamber 11 described is similar.

[0134] After the wafer W is placed into the processing container 7, gas is supplied from the gas supply port 73, and the pressure inside the processing container 7 is reduced using the exhaust mechanism 74. Meanwhile, a voltage is applied to the target 75 disposed inside the processing container 7 by means of a holding member, and a cathode magnet 76 disposed outside the processing container 7 opposite to the target 75 is driven. As a result, plasma concentrates near the target 75, and positive ions in the plasma collide with the target 75. Thus, structural material is released from the target 75 and deposited on the wafer W, thereby performing a film deposition process on the wafer W.

[0135] In the substrate processing chamber 11a described above, a shielding member 8 is arranged before the film formation process is performed, and a pre-coating process is performed within the processing container 7. For example... Figure 9 As shown, when the shielding member 8 is transported to the preset configuration position, it is formed to cover the upper surface and side of the mounting platform 71.

[0136] Valve body 220 and component support 230 are respectively with Figures 1 to 6D The valve body 22 and component support 23 described herein are constructed in the same manner. That is, when the valve body 220 is used to block the opening 20, the component holding part 230 is configured to extend toward the substrate processing chamber 11a, conveying the blocking member 8 to the component placement position. Furthermore, in Figure 9 In the example, as a configuration component, a shielding component 81 is provided in the component holding part 23, which is configured to partially or completely block the opening between the processing container 7 and the connecting path 21.

[0137] During the pre-coating process, the opening 20 is sealed using the valve body 220, and the shielding member 8 is conveyed to the component placement position, covering the upper surface and side surface of the mounting stage 71, which is the non-target surface for pre-coating. Then, for example, the processing container 7 is vented using the venting mechanism 74, and pre-coating gas is supplied from the gas supply port 73. High-frequency electricity is applied to the pre-coating gas, for example, by a plasma forming unit (not shown). This plasma formation process ionizes the pre-coating gas, thereby performing a pre-coating process to form a pre-coating film within the processing container 7.

[0138] A pre-coating film is formed on all surfaces within the processing container 7 except for the non-object surfaces covered by the shielding member 8. Thus, this pre-coating treatment protects the component from the effects of the plasma used during sputtering.

[0139] Thus, after the pre-coating process is performed, for example, the supply of pre-coating gas and the generation of plasma are stopped, and the supply of inactive gas is started to replace the atmosphere in the treatment container 7. After that, the valve body 220 is removed from the opening 20, the opening 20 is opened, and the shielding member 8 is sent out from the substrate processing chamber 11a.

[0140] Furthermore, the components arranged in the substrate processing chamber can also be shielding members that cover non-object surfaces during gas cleaning or plasma cleaning of the substrate processing chamber. When the substrate processing chamber is configured to perform film deposition on wafer W, for example, cleaning is performed after a predetermined number of film deposition processes. For example, shielding members for cleaning and those used... Figure 9 The shielding member 8 used for pre-coating treatment is similarly constructed. In this structure, when the opening is sealed by the valve body and the material is transported to a pre-set configuration position, the shielding member is formed to cover the upper surface and side surfaces of the mounting platform, which is the non-object surface being cleaned.

[0141] During the cleaning process, the valve body seals the opening, and the shielding component is conveyed to the component placement location, covering the upper surface and sides of the platform. Then, cleaning gas is supplied, and plasma is generated if necessary, to clean the interior of the treatment container. During the cleaning process, the upper surface and sides of the platform are protected from the cleaning gas and plasma, thus preventing damage.

[0142] The configuration component can be any component selected from the component group consisting of a wafer, a focusing ring, a shielding component, a rectifying component, and a blocking component. Therefore, the component transported together with the valve body using the component holding part (substrate holding part) can be simply a wafer. Furthermore, not only the aforementioned component group, but any component that is to be disposed within the substrate processing chamber and transported to a predetermined placement position within the substrate processing chamber by the component holding part extending from the valve body when the opening is sealed by the valve body can constitute a configuration component. Moreover, the shape of the component holding part is not limited to the examples described above; any shape that extends from the valve body toward the substrate processing chamber and transports the component to the component placement position when the opening is sealed by the valve body is acceptable.

[0143] Furthermore, the moving mechanism is not limited to the magnetic levitation type moving mechanism described above. It can be any mechanism that moves the valve body and the component held by the component holder between the position where the valve body blocks the opening and the position where the component is transported via the base plate transport chamber to the loading interlock chamber. Therefore, it can be a structure where the moving body with the valve body mounted moves on a guide rail, or a structure where the moving body has wheels. Alternatively, it can be a structure where the valve body and the component held by the component holder move using a transport mechanism with a multi-joint arm. Furthermore, it can be a structure where the valve body is fixed to the moving body and cannot be removed.

[0144] Furthermore, the substrate processing chamber and the substrate transport chamber can be arranged adjacent to each other, and are not limited to the embodiments described above. In the embodiments described above, a connecting path is provided between the substrate processing chamber and the substrate transport chamber, but the length of this connecting path ( Figure 3The size in the Y' direction can be set appropriately, or it can be a structure that does not actually set a connected path.

[0145] Furthermore, the structure of the mounting stage is not limited to the examples described above. It can also be structured as follows: without the aforementioned wafer mounting protrusions, the wafer is transferred and placed on the mounting stage using lifting pins for connection.

[0146] It should be considered that the embodiments disclosed herein are illustrative rather than restrictive in all respects. The above embodiments may also be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

Claims

1. An apparatus for conveying a component to be disposed in a substrate processing chamber, comprising conveying the component to be disposed in the substrate processing chamber between a substrate transport chamber and the substrate processing chamber disposed adjacent to each other, wherein, The device for conveying components to be disposed in the substrate processing chamber includes: A valve body configured to be removable relative to an opening that connects the substrate transport chamber and the substrate processing chamber, the valve body being used to block the opening. A component holding portion, which is provided such that it extends from the valve body toward the substrate processing chamber when the opening is blocked by the valve body, is used to convey the component to a predetermined configuration position within the substrate processing chamber; and A moving mechanism that moves the valve body, which has been removed from the opening, within the substrate conveying chamber. The moving mechanism includes: The ground surface of the substrate transport chamber is provided with a first magnet; and A movable body, on which the valve body is mounted, and provided with a second magnet that exerts a reaction force with the first magnet, is configured to move within the substrate transport chamber by means of magnetic levitation using the reaction force. The movable body is configured to be freely attachable and detachable from the valve body when the opening is blocked.

2. The apparatus for conveying a component to be disposed in a substrate processing chamber according to claim 1, wherein, The component includes a substrate that has been processed in the substrate processing chamber. The component holding portion is configured to hold the substrate and functions as a substrate holding portion for transporting the substrate to a processing position.

3. The apparatus for conveying a component to be disposed in a substrate processing chamber according to claim 1 or 2, wherein, The component includes at least one component selected from a group of components consisting of a focusing ring, a shielding component, a rectifying component, and a blocking component. The focusing ring is disposed around the substrate when the substrate is subjected to plasma treatment. The shielding component is used to prevent products generated during the treatment of the substrate from adhering to the body of the substrate treatment chamber. The rectifying component is used to rectify the flow of air in the substrate treatment chamber. The blocking component covers the non-object surfaces of the substrate when pre-coating or cleaning treatments are performed in the substrate treatment chamber.

4. The apparatus for conveying a component to be disposed in a substrate processing chamber according to claim 1 or 2, wherein, If the valve body that moves within the substrate transport chamber using the moving mechanism is referred to as the first valve body, then the device for transporting the component to be disposed within the substrate processing chamber further includes a second valve body that blocks the opening during the removal of the first valve body.

5. A substrate processing system, which is a system for processing a substrate, wherein, The substrate processing system includes the substrate transport chamber, the substrate processing chamber, and the means for transporting the components to be disposed in the substrate processing chamber as described in any one of claims 1 to 4.

6. A method for conveying a component to be disposed in a substrate processing chamber, comprising conveying the component to be disposed in the substrate processing chamber between a substrate transport chamber and the substrate processing chamber disposed adjacent to each other, wherein, The method for conveying components to be disposed within a substrate processing chamber uses a valve body, a component holder, and a moving mechanism. The valve body is configured to be detachably mounted relative to an opening that connects the substrate conveying chamber and the substrate processing chamber. The valve body is used to seal the opening. The component holder is disposed within the valve body such that it extends from the valve body toward the substrate processing chamber when the opening is sealed by the valve body. The moving mechanism moves the valve body within the substrate conveying chamber. The method for conveying components to be configured in the substrate processing chamber includes the following steps: By using the valve body to block the opening, the component is transported to a pre-set configuration position in the substrate processing chamber; as well as Remove the valve body from the opening and move it within the substrate conveying chamber. The moving mechanism includes: The ground surface of the substrate transport chamber is provided with a first magnet; and A movable body, on which the valve body is mounted, and provided with a second magnet that exerts a reaction force with the first magnet, is configured to move within the substrate transport chamber by means of magnetic levitation using the reaction force. The movable body is configured to be freely attachable and detachable from the valve body when the opening is blocked.

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