An intelligent processing method, device, computer equipment and storage medium

Abstract

The embodiment of the application belongs to the technical field of laser processing, and relates to an intelligent processing method, comprising the following steps: prestoring at least two processing modes; acquiring a task cycle size and a single task maximum size; calculating a processing width according to the acquired task cycle size and single task maximum size, and selecting one processing mode from the prestored processing modes according to the processing width; moving a marking device to a starting position of the marking device and moving a cutting device to a starting position of the cutting device according to the selected processing mode; controlling the marking device to mark according to the selected processing mode, and controlling the cutting device to cut according to the selected processing mode. The application further provides an intelligent processing device, a computer device and a storage medium. The method can adapt to batch processing of different tasks, has strong adaptability, does not need human participation and equipment replacement, and saves the cost of producing products of different sizes.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, and in particular to an intelligent processing method and device, computer equipment and a storage medium. BACKGROUND

[0002] Traditional laser processing of a roll of material generally requires a single repetition of multiple identical tasks to achieve batch processing of the roll of material.

[0003] In order to ensure the stability and continuity of the equipment, the cutting and marking processes are usually divided into two laser processing devices to perform a process separately. Even if the marking and cutting processes are combined into one laser processing device to perform the processing task, only one processing method can be used fixedly, and different laser processing devices or the operating parameters of the laser processing devices need to be replaced or re-adjusted to adapt to various processing task sizes. This method has poor adaptability. SUMMARY

[0004] The embodiments of the present application aim to provide an intelligent processing method, an intelligent processing device, computer equipment and a computer readable storage medium, which can solve the technical problem of poor adaptability of the existing laser processing method.

[0005] To solve the above technical problems, the embodiments of the present application provide an intelligent processing method, which adopts the following technical solutions:

[0006] The intelligent processing method comprises the following steps:

[0007] Pre-storing at least two processing methods;

[0008] Obtaining a task cycle size and a single task maximum size;

[0009] Calculating a processing width according to the obtained task cycle size and single task maximum size, and selecting one processing method from the pre-stored processing methods according to the processing width;

[0010] Moving the marking device to a starting position of the marking device and moving the cutting device to a starting position of the cutting device according to the selected processing method;

[0011] Controlling the marking device to mark according to the selected processing method and controlling the cutting device to cut according to the selected processing method.

[0012] Further, the step of calculating a processing width according to the obtained task cycle size and single task maximum size, and selecting one processing method from the pre-stored processing methods according to the processing width comprises:

[0013] acquiring the number of cutting devices for performing the processing task;

[0014] determining the processing type according to the number of cutting devices;

[0015] calculating the processing width corresponding to the determined processing type according to the task cycle size and the maximum size of single task;

[0016] determining the processing mode of the processing type according to the processing width.

[0017] Further, the step of determining the processing type according to the number of cutting devices comprises:

[0018] when the number of cutting devices for performing the processing task is one, determining the processing type as single-cutting-head processing mode;

[0019] when the number of cutting devices for performing the processing task is two or more, determining the processing type as multi-cutting-head processing mode.

[0020] Further, the step of calculating the processing width corresponding to the determined processing type according to the task cycle size and the maximum size of single task comprises:

[0021] identifying the processing type;

[0022] when the processing type is single-cutting-head processing mode, acquiring a first safety interval from the pre-stored parameters, and calculating the number of allowed processing tasks between the marking device and the cutting device according to the first safety interval, the maximum size of single task and the task cycle size, wherein the first safety interval is the minimum allowed interval between the marking device and the cutting device;

[0023] calculating a first preset interval based on the number of allowed processing tasks and the task cycle size;

[0024] calculating the processing width corresponding to the single-cutting-head processing mode according to the first preset interval.

[0025] Further, the step of determining the processing mode of the processing type according to the processing width comprises:

[0026] judging whether the processing width is less than or equal to a preset maximum allowed processing range;

[0027] if less than or equal to the maximum allowed processing range, selecting a first processing mode;

[0028] if greater than the maximum allowed processing range, selecting a second processing mode;

[0029] The first processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, simultaneously controlling the cutting device to perform single processing task cutting at the starting position of the cutting device during the single processing task marking performed by the marking device, performing feeding operation after the single processing task marking and the single processing task cutting are completed, and the feeding length is the task cycle size.

[0030] The second processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, moving the marking device to the first avoiding position after the single processing task marking is completed, controlling the cutting device to move from the starting position of the cutting device to the starting position of the marking device during the single processing task marking performed by the marking device, and performing single processing task cutting, performing feeding operation after the single processing task cutting is completed, and the feeding length is the task cycle size.

[0031] Further, the step of calculating the processing range corresponding to the processing type according to the task cycle size and the single task maximum size includes:

[0032] identifying the processing type;

[0033] When the processing type is the multi-cutting head processing mode, a first safety interval is obtained from the pre-stored parameters, the allowed processing task number between the marking device and the cutting device closest to the marking device is calculated according to the first safety interval, the single task maximum size, the task cycle size and the number of cutting devices, wherein the first safety interval is the minimum allowed interval between the marking device and the cutting device;

[0034] a second preset interval is calculated based on the allowed processing task number, the task cycle size and the number of cutting devices;

[0035] a first processing range corresponding to the multi-cutting head processing mode is calculated according to the second preset interval, the single task maximum size, the task cycle size and the number of cutting devices.

[0036] Further, the step of determining the processing mode of the processing type according to the processing range includes:

[0037] determining whether the first processing range is less than or equal to a preset maximum allowed processing range;

[0038] if less than or equal to the maximum allowed processing range, a third processing mode is selected;

[0039] if greater than the maximum allowed processing range, a second processing range corresponding to the multi-cutting head processing mode is calculated according to the single task maximum size and the second preset interval;

[0040] determining whether the second processing width is less than or equal to a preset maximum allowable processing range;

[0041] if the second processing width is less than or equal to the maximum allowable processing range, selecting a fourth processing mode;

[0042] if the second processing width is greater than the maximum allowable processing range, selecting a fifth processing mode;

[0043] The third processing mode specifically includes: controlling the marking device to perform single-time processing task marking at the starting position of the marking device, after the single-time processing task marking is completed, controlling the marking device to move a distance of a task cycle size away from the cutting device, and then performing the next processing task marking, when the marking device performs the first processing task marking, controlling n cutting devices to simultaneously perform a processing task cutting at the corresponding starting position, so as to complete n processing task cuttings, after the n-time processing task marking and n processing task cuttings are completed, performing a feeding operation, and the feeding length is n task cycle sizes.

[0044] The fourth processing mode specifically includes: controlling the marking device to perform single-time processing task marking at the starting position of the marking device, after each processing task marking is completed, performing a feeding operation, and the feeding length is a task cycle size, then controlling the marking device to perform the next processing task marking at the starting position of the marking device, when the marking device performs the n-time processing task marking, controlling n cutting devices to simultaneously perform a processing task cutting at the starting position of the n cutting devices, so as to complete n processing task cuttings, after the n-time processing task marking and n processing task cuttings are completed, performing a feeding operation, and the feeding length is a task cycle size.

[0045] The fifth processing mode specifically includes: controlling the marking device to perform single-time processing task marking at the starting position of the marking device, after each processing task marking is completed, controlling the marking device to move a distance of a single task cycle size away from the cutting device, and then performing the next processing task marking, after the n-time processing task marking is completed, moving the marking device to a second avoiding position, n cutting devices are moved to the starting position of the marking device when the n-time processing task marking is performed, n cutting devices simultaneously perform a processing task cutting, so as to complete n processing task cuttings, after the cutting is completed, performing a feeding operation, and the feeding size is n task cycle sizes.

[0046] Wherein, n is the number of cutting devices, and n is an integer greater than 1.

[0047] Further, before the step of controlling the marking device to mark according to the selected processing mode and controlling the cutting device to cut according to the selected processing mode, the method further comprises:

[0048] Feeding materials;

[0049] Detecting the edge position of the material to be processed and comparing the edge position of the material to be processed with the coordinate system position of the marking device;

[0050] When the edge of the material to be processed deviates from the coordinate system position of the marking device by more than a preset threshold, an alarm is issued or the marking device is controlled to correct the position.

[0051] Further, before the step of controlling the marking device to mark according to the selected processing mode and controlling the cutting device to cut according to the selected processing mode, the method further comprises:

[0052] Measuring the distance between the material to be processed and the marking device;

[0053] Obtaining the focal length of the marking device;

[0054] Feeding the distance between the material to be processed and the marking device to the marking device, and adjusting the height of the marking device according to the focal length of the marking device.

[0055] To solve the above technical problems, the embodiments of the present application also provide an intelligent processing device, which adopts the technical solutions as follows:

[0056] The intelligent processing device comprises:

[0057] A pre-storage module for pre-storing at least two processing modes;

[0058] An acquisition module for acquiring a task cycle size and a single task maximum size;

[0059] A selection module for calculating a processing width according to the acquired task cycle size and single task maximum size, and selecting one processing mode from the pre-stored processing modes according to the processing width;

[0060] A moving module for moving the marking device to a starting position of the marking device and moving the cutting device to a starting position of the cutting device according to the selected processing mode;

[0061] A control module for controlling the marking device to mark according to the selected processing mode and controlling the cutting device to cut according to the selected processing mode.

[0062] To solve the above technical problems, the embodiments of the present application also provide a computer device, which adopts the technical solutions as follows:

[0063] The computer device comprises a memory and a processor, the memory stores a computer program, and the processor implements the steps of the intelligent processing method according to any one of the preceding solutions when executing the computer program.

[0064] To solve the above technical problems, the embodiment of the application further provides a computer readable storage medium, which adopts the technical scheme as follows:

[0065] The computer readable storage medium stores a computer program, and the computer program implements the steps of the intelligent processing method according to any one of the preceding solutions when executed by a processor.

[0066] Compared with the prior art, the embodiment of the application has the following beneficial effects:

[0067] The intelligent processing method provided by the application can select different processing methods according to the processing width requirements of different processing tasks by pre-storing at least two processing methods, calculating the processing width according to the obtained task cycle size and single task maximum size, selecting a processing method according to the processing width, and performing the marking process and the cutting process according to the selected processing method in the subsequent processing task process. The method can adapt to batch processing of different tasks, has strong adaptability, does not need human intervention and equipment replacement, saves the cost of producing different size products, and also saves the debugging process of the device when adapting to different tasks. BRIEF DESCRIPTION OF DRAWINGS

[0068] To more clearly illustrate the solutions in the application, the drawings needed in the description of the embodiments of the application will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0069] Figure 1 Flow chart of an embodiment of the intelligent processing method according to the application;

[0070] Figure 2 is Figure 1 Flow chart of a specific embodiment of step S300 in the method;

[0071] Figure 3 is Figure 1 Working principle schematic diagram of step S400 after selecting the first processing method in step S300 of the method;

[0072] Figure 4 is Figure 1 Working principle schematic diagram of step S400 after selecting the second processing method in step S300 of the method;

[0073] Figure 5 When the number of cutting devices performing the processing task is n, and n is 3, in Figure 1 A schematic diagram of the working principle of step S400 after selecting the third processing method in step S300.

[0074] Figure 6 When the number of cutting devices performing the processing task is n, and n is 3, in Figure 1 After selecting the fourth processing method in step S300, the working principle diagram of step S400 is shown.

[0075] Figure 7 When the number of cutting devices performing the processing task is n, and n is 3, in Figure 1 After selecting the fifth processing method in step S300, the working principle diagram of step S400 is shown.

[0076] Figure 8 This is a schematic diagram of the structure of one embodiment of the intelligent processing apparatus according to this application;

[0077] Figure 9 This is a schematic diagram of the structure of one embodiment of the computer device according to this application.

[0078] Figure label:

[0079] 10. Marking device; 20. Cutting device;

[0080] 700. Intelligent processing device; 701. Pre-storage module; 702. Acquisition module; 703. Selection module; 704. Movement module; 705. Control module;

[0081] 80. Computer equipment; 81. Memory; 82. Processor; 83. Network interface. Detailed Implementation

[0082] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0083] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. It is expressly understood that any of the embodiments described herein can be combined with any of the other embodiments unless specifically noted otherwise.

[0084] For those skilled in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings.

[0085] Reference Figures 1 to 8 , Figure 1 A flow chart of one embodiment of the intelligent machining method according to the present application is shown, Figure 2 A flow chart of one specific embodiment of step S300 is shown, which establishes a rectangular coordinate system as shown in Figures 3-7 , wherein the feeding direction is opposite to the coordinate value increasing direction of the X axis, Figure 3 is a schematic diagram of the principle of the first machining method, wherein, Figure 4 is a schematic diagram of the principle of the second machining method; Figure 5 is a schematic diagram of the principle of the third machining method; Figure 6 is a schematic diagram of the principle of the fourth machining method; Figure 7 is a schematic diagram of the principle of the fifth machining method.

[0086] The intelligent machining method comprises the following steps:

[0087] S100, prestore at least two machining methods;

[0088] In the present embodiment, the pre-stored machining methods include the first machining method, the second machining method, the third machining method, the fourth machining method and the fifth machining method, to adapt to the requirements of different machining tasks. In the present embodiment, the first machining method and the second machining method belong to single-cutting-head machining mode. The third machining method, the fourth machining method and the fifth machining method belong to multi-cutting-head machining mode.

[0089] Of course, in some embodiments, when the number of cutting devices performing the machining task is one, the pre-stored machining type can only include single-cutting-head machining mode, i.e. the pre-stored machining methods can only include the first machining method and the second machining method.

[0090] In some other embodiments, when the number of cutting devices performing the machining task is two or more, the pre-stored machining type can only include multi-cutting-head machining mode, i.e. the pre-stored machining methods can only include the third machining method, the fourth machining method and the fifth machining method.

[0091] It can be understood that the pre-stored processing mode has been pre-stored in the pre-stored module before the processing task is executed, and one of the pre-stored processing modes is selected to execute after the number of cutting devices and the processing task parameters to be determined are determined.

[0092] In the embodiment, the first processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, simultaneously controlling the cutting device to perform single processing task cutting at the starting position of the cutting device during the single processing task marking performed by the marking device, and performing feeding operation after the single processing task marking and the single processing task cutting are completed, and the feeding length is the task cycle size.

[0093] It can be understood that the first processing mode can simultaneously perform the cutting process of another processing task in the marking process of the current processing task, so that the cutting process of another processing task and the marking process of the current processing task are overlapped in time, saving the time required to complete the processing task and improving the work efficiency.

[0094] The second processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, moving the marking device to the first avoiding position after the single processing task marking is completed, controlling the cutting device to move from the starting position of the cutting device to the starting position of the marking device during the single processing task marking performed by the marking device, and performing single processing task cutting, and performing feeding operation after the single processing task cutting is completed, and the feeding length is the task cycle size.

[0095] It can be understood that the second processing mode can save the width required by the second processing mode by taking the starting position of the marking process of the current processing task as the starting position of the cutting process of the current processing task, so that the processing task can better adapt to different task sizes and ensure the safety of the processing process.

[0096] The third processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, controlling the marking device to move a distance of a task cycle size away from the cutting device after the single processing task marking is completed, and then performing the marking of the next marking task, controlling n cutting devices to simultaneously perform the cutting of a processing task at the corresponding starting position to complete the cutting of n processing tasks when the marking device performs the marking of the first marking task, and performing feeding operation after the marking of the nth processing task and the cutting of n processing tasks are completed, and the feeding length is n task cycle sizes.

[0097] It can be understood that the third processing mode can perform the cutting process of the n processing tasks at positions spaced apart at the same time in the marking process of the n processing tasks, so that the cutting process of the n processing tasks and the marking process of the n processing tasks are performed at the same time, saving the time required to complete the processing tasks and improving work efficiency.

[0098] The fourth processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, performing feeding operation once after completing the marking of each processing task, and the feeding length is one task period size each time, and then controlling the marking device to perform the marking of the next processing task at the starting position of the marking device, and when the marking device performs the marking of the nth processing task, controlling the n cutting devices to simultaneously perform the cutting of one processing task at the starting positions of the n cutting devices to complete the cutting of the n processing tasks, and after the marking of the nth processing task and the cutting of the n processing tasks are completed, performing feeding operation, and the feeding length is one task period size each time.

[0099] It can be understood that the fourth processing mode can simultaneously perform the cutting process of the n processing tasks except the current processing task in the marking process of the current processing task, so that the cutting process of the n processing tasks except the current processing task and the marking process of the current processing task are performed at the same time, saving the time required to complete the processing tasks and improving work efficiency, and the fourth processing mode can realize the simultaneous performance of the cutting process of the n processing tasks except the current processing task and the marking process of the current processing task, and can also save the processing width.

[0100] The fifth processing mode specifically includes: controlling the marking device to perform single processing task marking at the starting position of the marking device, controlling the marking device to move a distance of single task period size away from the cutting device after completing the marking of each processing task, and then performing the marking of the next processing task, moving the marking device to the second avoiding position after completing the marking of the nth processing task, moving the n cutting devices to the starting positions of the marking device when marking the n processing tasks, and simultaneously performing the cutting of one processing task by the n cutting devices to complete the cutting of the n processing tasks, and after completing the cutting, performing feeding operation, and the feeding size is n task period sizes, wherein n is the number of cutting devices, n is an integer greater than 1, and the first safety distance is the minimum allowable distance between the marking device and the cutting device.

[0101] It can be understood that the fifth processing mode can save the width required by the fifth processing mode by taking the starting position of the marking process as the starting position of the cutting process, so that the processing tasks can better adapt to different task sizes and ensure the safety of the processing process.

[0102] In some embodiments, the feeding operation can be performed by manual operation or by controlling the feeding device.

[0103] S200, acquiring a task cycle size and a single task maximum size;

[0104] The task cycle size is the interval distance of the same position of the current processing task and the next processing task. It can be understood that the task cycle size is the interval distance of the marking start position of the current processing task and the next processing task. The intelligent processing method of the present application is used for batch processing of multiple same processing tasks, so the task cycle size is also the interval distance of the cutting start position of the current processing task and the next processing task.

[0105] It should be noted that the single task maximum size refers to the maximum length of the cutting of a single processing task in batch processing of multiple same tasks.

[0106] Of course, in some other embodiments, the processing task parameters can also include marking coordinates, cutting coordinates, and processing patterns, etc.

[0107] S300, calculating a processing width according to the acquired task cycle size and single task maximum size, and selecting a processing mode from the pre-stored processing modes according to the processing width.

[0108] The above step S300 specifically includes:

[0109] S310, acquiring the number of cutting devices for executing the processing task.

[0110] In the present embodiment, the number of cutting devices for executing the processing task can be determined by the selection module according to the number of cutting devices set by the processing equipment, or can be determined by manual operation.

[0111] S320, determining a processing type according to the number of cutting devices. Specifically, it includes:

[0112] When the number of cutting devices for executing the processing task is one, it is determined that the processing type is a single cutting head processing mode.

[0113] When the number of cutting devices for executing the processing task is two or more, it is determined that the processing type is a multi-cutting head processing mode.

[0114] S330, calculating a processing width corresponding to the determined processing type according to the task cycle size and the single task maximum size. Specifically, it includes:

[0115] Identifying the processing type.

[0116] When the processing type is the single-cutting-head processing mode, a first safety interval is obtained from the pre-stored parameters, and the number of allowed processing tasks between the marking device and the cutting device is calculated according to the first safety interval, the single-task maximum size and the task period size. The specific calculation formula is:

[0117] ;

[0118] wherein N is the number of allowed processing tasks, T is the obtained task period size, L is the obtained single-task maximum size, and D1 is the first safety interval, which is the minimum allowed interval between the marking device and the cutting device. represents upward rounding of an internal result.

[0119] According to the number of allowed processing tasks and the task period size, a first preset interval is calculated. The specific calculation formula is:

[0120] F1=T*N+T;

[0121] or, F1=T*(N+1);

[0122] wherein F1 is the first preset interval, T is the obtained task period size, and N is the number of allowed processing tasks.

[0123] It should be noted that Figures 4 to 8 the obtained task period size T shown in the formula (1) is greater than the obtained single-task maximum size L, which is only one possible implementation of the processing method provided in the present application. In another implementation, when the processing task pattern is a pattern symmetrical about a center line, in order to improve the utilization of the processing width and reduce the gap between the processing tasks, the obtained task period size T can also be equal to the obtained single-task maximum size L; or when the processing task pattern is not a pattern symmetrical about a center line, such as a parallelogram with a bottom edge parallel to the X axis, the obtained task period size T can also be less than the obtained single-task maximum size L.

[0124] According to the first preset interval, the processing width corresponding to the single-cutting-head processing mode is calculated. The specific calculation formula is:

[0125] A1=L+F1;

[0126] wherein A1 is the processing width corresponding to the single-cutting-head processing mode, L is the obtained single-task maximum size, and F1 is the first preset interval.

[0127] When the processing type is the multi-cutting head processing mode, a first safety interval is obtained from the pre-stored parameters, and the allowed processing task quantity between the marking device and the cutting device closest to the marking device is calculated according to the first safety interval, the single-task maximum size, the task cycle size and the number of cutting devices. The specific calculation formula is:

[0128] ;

[0129] wherein N is the allowed processing task quantity, T is the obtained task cycle size, L is the obtained single-task maximum size, D1 is the first safety interval, the first safety interval is the minimum allowed interval between the marking device and the cutting device, represents the upward rounding of the internal result.

[0130] The second preset interval is calculated based on the allowed processing task quantity, the task cycle size and the number of cutting devices. The specific calculation formula is:

[0131] F2=T*N+T*n;

[0132] or, F2=T*(N+n);

[0133] wherein F2 is the second preset interval, T is the obtained task cycle size, N is the allowed processing task quantity, and n is the number of cutting devices.

[0134] The first processing width corresponding to the multi-cutting head processing mode is calculated according to the second preset interval, the single-task maximum size, the task cycle size and the number of cutting devices. The calculation formula is:

[0135] A2=L+F2+T*(n-1);

[0136] wherein A2 is the first processing width corresponding to the multi-cutting head processing mode, L is the obtained single-task maximum size, F2 is the second preset interval, T is the obtained task cycle size, and n is the number of cutting devices.

[0137] S340, determining the processing mode of the processing type according to the processing width.

[0138] When the processing type is the single-cutting head processing mode, it is judged whether the processing width corresponding to the single-cutting head processing mode is less than or equal to the preset maximum allowed processing range. Specifically, it is judged whether the processing width A1 corresponding to the single-cutting head processing mode is less than or equal to the maximum allowed processing range A max ;

[0139] If the processing width corresponding to the single-cutting head processing mode is less than or equal to the maximum allowed processing range, the first processing mode is selected;

[0140] If the processing area corresponding to the single-cutting-head processing mode is larger than the maximum allowable processing range, then the second processing method shall be selected.

[0141] In this embodiment, the maximum allowable processing range A max This refers to the dimensional range between the origin O and the maximum permissible machining coordinate value X0 in the coordinate system. X0 is a pre-stored device parameter. The determination is made based on whether the machining area A1 corresponding to the single-cutting-head machining mode is less than or equal to the maximum permissible machining range A. max At that time, it is determined whether the processing area A1 corresponding to the single cutting head processing mode is less than or equal to the maximum allowable processing range A. max This can be achieved either by determining whether the processing area A1 corresponding to the single cutting head processing mode is less than or equal to the maximum allowable processing coordinate value X0: if X0≥A1, then the first processing method is selected; if X0<A1, then the second processing method is selected.

[0142] When the processing type is multi-cutting head processing mode, it is determined whether the first processing area corresponding to the multi-cutting head processing mode is less than or equal to the preset maximum allowable processing range. Specifically, it is determined whether the first processing area A2 corresponding to the multi-cutting head processing mode is less than or equal to the maximum allowable processing range A. max ;

[0143] If the first processing area corresponding to the multi-cutting head processing mode is less than or equal to the maximum allowable processing range, then the third processing method shall be selected.

[0144] If the first processing area corresponding to the multi-cutting head processing mode is larger than the maximum allowable processing range, then the second processing area corresponding to the multi-cutting head processing mode is calculated based on the maximum size of a single task and the second preset spacing. The specific formula is:

[0145] A3 = L + F2;

[0146] Where A3 is the second processing area corresponding to the multi-cutting head processing mode, L is the maximum size of a single task obtained, and F2 is the second preset spacing.

[0147] Determine whether the second processing area is less than or equal to the preset maximum allowable processing range. Specifically, determine whether the second processing area A3 corresponding to the multi-cutting head processing mode is less than or equal to the maximum allowable processing range A. max ;

[0148] If the value is less than or equal to the maximum allowable processing range, then the fourth processing method shall be selected;

[0149] If the processing range exceeds the maximum allowable range, then the fifth processing method shall be selected.

[0150] In this embodiment, the maximum allowable processing range A maxis a size range between the origin point in the coordinate system and the maximum allowed processing coordinate value X0, and the maximum allowed processing coordinate value X0 is a device parameter stored in advance. When determining whether the first processing range A2 corresponding to the multi-cutting head processing mode and / or the second processing range A3 corresponding to the multi-cutting head processing mode is less than or equal to the maximum allowed processing range A max When determining whether the first processing range A2 corresponding to the multi-cutting head processing mode and / or the second processing range A3 corresponding to the multi-cutting head processing mode is less than or equal to the maximum allowed processing coordinate value X0, the determination principle is the same as that of the single-cutting head processing mode, and thus will not be described herein.

[0151] S400, moving the marking device to a starting position of the marking device and moving the cutting device to a starting position of the cutting device according to the selected processing mode.

[0152] According to the selected processing mode, the maximum allowed processing range is obtained from the pre-stored parameters, the starting position coordinate value of the marking device and the starting position coordinate value of the cutting device are determined according to the maximum allowed processing range, the single-task maximum size and the periodic task size, the marking device is moved to the corresponding starting position coordinate value position, and the cutting device is moved to the corresponding starting position coordinate value position. It should be noted that the starting position of the marking device refers to the preparation position of the marking device before processing according to the selected processing mode, and the starting position of the cutting device refers to the preparation position of the cutting device before processing according to the selected processing mode.

[0153] In the embodiment, the first processing mode further includes: before the step of controlling the marking device to perform single processing task marking at the starting position of the marking device, moving the marking device and the cutting device so that the distance between the starting position of the marking device and the starting position of the cutting device is equal to the first preset distance, and the distance between the starting position of the marking device and the boundary of the maximum allowed processing range is at least one single-task maximum size. This ensures that the marking device and the cutting device can perform processing tasks within the maximum allowed processing range, so that the marking device will not exceed the maximum allowed processing range, causing errors in the processing process or posing a safety hazard, providing a safe operating space for the simultaneous execution of subsequent marking and cutting processes, and ensuring that the marking device and the cutting device will not collide when performing processing tasks, ensuring that the processing process can be orderly and safely performed.

[0154] Specifically, the starting position coordinate value X1 of the cutting device is determined within the range of [0, X0-(L+T*(N+1))], and the starting position coordinate value X2 of the marking device is calculated according to the starting position coordinate value X1 of the cutting unit. m X0-X m ≥L, and the calculation formula is:

[0155] X m = X1+ T*(N+1);

[0156] wherein X1 is the starting position coordinate value of the cutting device, X m is the starting position coordinate value of the marking device, T is the acquired task period size, and N is the allowed number of machining tasks.

[0157] moving the marking device to the starting position coordinate value X m of the marking device and moving the cutting device to the starting position coordinate value X1 of the cutting device.

[0158] The second machining mode further comprises, before the step of controlling the marking device to perform single machining task marking at the starting position of the marking device, moving the marking device and the cutting device so that the distance between the starting position of the marking device and the starting position of the cutting device is equal to the first safety distance, and the distance between the starting position of the marking device and the boundary of the maximum allowed machining range is not less than the distance of one single task maximum size plus the first safety distance. Thus, it is ensured that the marking device and the cutting device can both perform machining tasks within the maximum allowed machining range, so that the marking device will not exceed the maximum allowed machining range to cause errors in the machining process or pose a safety hazard, and it is also ensured that the marking device and the cutting device will not collide when performing machining tasks, thereby improving the safety of the machining process.

[0159] Specifically, the starting position coordinate value X1 of the cutting device is determined within the range of [0, X0-2*D1-L]. According to the starting position coordinate value X1 of the cutting device, the starting position coordinate value X m of the marking device is determined within the range of [D1, X1+D1], or the starting position coordinate value X m of the marking device is determined within the range of [D1, X0-D1-L], wherein L is the acquired single task maximum size, D1 is the first safety distance, and X0 is the maximum allowed machining coordinate value.

[0160] moving the marking device to the starting position coordinate value X m of the marking device and moving the cutting device to the starting position coordinate value X1 of the cutting device.

[0161] The third processing mode further comprises the following steps: before the step of controlling the marking device to perform single processing task marking at the starting position of the marking device, moving the marking device and the n cutting devices, so that the distance between the starting position of the marking device and the starting position of the nth cutting device is equal to the second preset distance, the distance between the starting position of the marking device and the boundary of the maximum allowed processing range is not less than (n-1) task cycle sizes plus a single task maximum size, and the distance between the starting positions of adjacent cutting devices is equal to the task cycle size. This ensures that the marking device and the cutting device can perform processing tasks within the maximum allowed processing range, so that the marking device does not exceed the maximum allowed processing range, causing errors in the processing process or posing a safety hazard. The advantages of multiple cutting devices are fully utilized to improve processing efficiency, providing a safe operating space for the subsequent marking process and cutting process, and ensuring that the marking device and the cutting device do not collide when performing processing tasks, thereby ensuring that the processing process can be carried out efficiently, orderly and safely.

[0162] Specifically, the starting position coordinate value X n of the nth cutting device is determined within the range of [0, X0-(L+T*(N+2n-1))] n The starting position coordinate value X m of the marking device is calculated as follows:

[0163] X m =X n +T*(N+n);

[0164] wherein X m is the starting position coordinate value of the marking device, X n is the starting position coordinate value of the nth cutting device, T is the obtained task cycle size, N is the allowed processing task number, n is the number of cutting devices, and X0 is the maximum allowed processing coordinate value.

[0165] In this embodiment, the distances between the n cutting devices and the marking device increase in order, and the distance between the starting positions of adjacent cutting devices is equal to the task cycle size. The starting position coordinate value X n of the (n-1)th cutting device is calculated as follows: (n-1) , the starting position coordinate value X2 of the second cutting device, and the starting position coordinate value X1 of the first cutting device, and the calculation formula is as follows:

[0166] X （n-1） =X n +T;

[0167] wherein X （n-1）X represents the starting position coordinates of the (n-1)th cutting device; n is the starting position coordinate value of the nth cutting device; T is the obtained task cycle size.

[0168] The coordinates X of the moving marking device to the starting position of the marking device m The starting position coordinate value X of the marking device m The distance to the boundary X0 of the maximum allowable processing range is not less than (n-1) task cycle dimensions T plus the maximum single task dimension L, that is, satisfying: X0-X m ≥L+T*(n-1).

[0169] Move the first cutting device to its starting position coordinate X1, move the second cutting device to its starting position coordinate X2, ..., move the nth cutting device to its starting position coordinate X... n This continues until all n cutting devices have moved to their corresponding starting position coordinates, such that the distance between the starting positions of adjacent cutting devices equals the task cycle size T, i.e., satisfying: X （n-1） -X n =T.

[0170] The fourth processing method further includes: before the step of controlling the marking device to perform a single processing task at its starting position, moving the marking device and n cutting devices such that the distance between the starting position of the marking device and the starting position of the nth cutting device is equal to a second preset distance, and the distance between the starting position of the marking device and the boundary of the maximum allowable processing range is at least one single task maximum size, and the distance between the starting positions of adjacent cutting devices is equal to the task cycle size. This ensures that both the marking device and the cutting device can perform processing tasks within the maximum allowable processing range, preventing the marking device from exceeding the maximum allowable processing range and causing errors or safety hazards in the processing process. It provides a safe operating space for subsequent marking and cutting processes, ensuring that the marking device and the cutting device will not collide when performing processing tasks, and guaranteeing that the processing process can be carried out efficiently, orderly, and safely.

[0171] Specifically, the starting position coordinate value X of the nth cutting device is determined within the range [0, X0-(L+T*(N+n)]. n Based on the starting position coordinates X of the nth cutting device n The starting position coordinates X of the marking device were calculated. m The calculation formula is:

[0172] X m =X n +T*(N+n);

[0173] Among them, X m X represents the starting position coordinates of the marking device. n Let X0 be the starting position coordinates of the nth cutting device, T be the obtained task cycle size, N be the number of allowed processing tasks, n be the number of cutting devices, and X0 be the maximum allowed processing coordinates.

[0174] In this embodiment, the spacing between the n cutting devices and the marking device increases sequentially, and the spacing between the starting positions of adjacent cutting devices is equal to the task cycle size. Based on the starting position coordinate value X of the nth cutting device... n Calculate the starting position coordinates X of the (n-1)th cutting device. (n-1) The starting position coordinates of the second cutting device (X2) and the starting position coordinates of the first cutting device (X1) are calculated using the following formula:

[0175] X （n-1） =X n +T;

[0176] Among them, X （n-1） X represents the starting position coordinates of the (n-1)th cutting device; n is the starting position coordinate value of the nth cutting device; T is the obtained task cycle size.

[0177] The coordinates X of the moving marking device to the starting position of the marking device m The starting position coordinate value X of the marking device m The distance to the boundary X0 of the maximum allowable processing range is not less than the distance of the maximum size of a single task, that is, satisfying: X0-X m ≥L.

[0178] Move the first cutting device to its starting position coordinate X1, move the second cutting device to its starting position coordinate X2, ..., move the nth cutting device to its starting position coordinate X... n This continues until all n cutting devices have moved to their corresponding starting position coordinates, such that the distance between the starting positions of adjacent cutting devices equals the task cycle size T, i.e., satisfying: X （n-1） -X n =T.

[0179] The fifth processing mode further comprises the following steps: before the step of controlling the marking device to perform single processing task marking at the starting position of the marking device, obtaining a second safety distance in the pre-stored parameters, moving the marking device and the n cutting devices, so that the distance between the starting position of the marking device and the starting position of the first cutting device is not less than the first safety distance, the distance between the starting position of the marking device and the boundary of the maximum allowed processing range is not less than the distance of (n-1) task cycle sizes plus a single task maximum size, and the distance between the starting positions of adjacent cutting devices is equal to the second safety distance. It is ensured that the marking device and the cutting device can perform processing tasks within the maximum allowed processing range, so that the marking device does not exceed the maximum allowed processing range to cause errors or safety hazards in the processing process, provides a safe operation space for the subsequent marking process and cutting process, and ensures that the marking device and the cutting device do not collide when performing processing tasks, so that the processing process can be efficiently, orderly and safely performed.

[0180] Specifically, the second safety distance is obtained in the pre-stored parameters, and the starting position coordinate value Xn of the nth cutting device is determined in the range of [0, X0-D1*2-D2*(n-1)-L-T*(n-1)]. n Wherein, D1 is the first safety distance, D2 is the second safety distance, X0 is the maximum allowed processing coordinate value, L is the obtained single task maximum size, T is the obtained task cycle size, and n is the number of cutting devices. In the embodiment, the distances between the n cutting devices and the marking device are sequentially increased in order, and the distance between the starting positions of adjacent cutting devices is equal to the second safety distance D2. According to the starting position coordinate value Xn of the nth cutting device, n the starting position coordinate value Xn-1 of the (n-1)th cutting device is calculated. (n-1) ,..., the starting position coordinate value X2 of the second cutting device, the starting position coordinate value X1 of the first cutting device, and the calculation formula is:

[0181] X （n-1） =X n +D2;

[0182] Wherein, X （n-1） is the starting position coordinate value of the (n-1)th cutting device; X n is the starting position coordinate value of the nth cutting device; and D2 is the second safety distance.

[0183] According to the starting position coordinate value X1 of the first cutting unit, the starting position coordinate value X of the marking device is determined in the range of [D1+D2*(n-1), X1+D1]. m Or, the starting position coordinate value X of the marking device is determined in the range of [D1+D2*(n-1), X0-D1-L-T*(n-1)].m Where D1 is the first safety distance, D2 is the second safety distance, X0 is the maximum allowable machining coordinate value, L is the maximum size of a single task, T is the size of the task cycle, and n is the number of cutting devices.

[0184] The coordinates X of the moving marking device to the starting position of the marking device m The starting position coordinate value X of the marking device m The distance from the starting position X1 of the first cutting device is not less than the first safety distance D1, that is, it satisfies: X m -X1≥D1.

[0185] Move the first cutting device to its starting position coordinate X1, move the second cutting device to its starting position coordinate X2, ..., move the nth cutting device to its starting position coordinate X... n This continues until all n cutting devices have moved to their corresponding starting position coordinates, such that the distance between the starting positions of adjacent cutting devices is equal to the second safety distance D2, i.e., satisfying: X （n-1） -X n =D2.

[0186] The second safety distance D2 is the minimum allowable distance between adjacent cutting devices.

[0187] It should be noted that, in this embodiment, the starting position coordinate value X of the marking device is... m The starting position coordinates of the cutting device are X1 and X1, respectively. n The starting position coordinates X of the (n-1)th cutting device (n-1) All of these are variables determined based on different processing methods. That is, the starting position coordinates of the marking device and the starting position coordinates of the cutting device determined based on different processing methods are not correlated.

[0188] Step S500: Control the marking device to mark according to the selected processing method, and control the cutting device to cut according to the selected processing method.

[0189] Understandably, when the optimal processing method selected in step S300 is the first processing method, step S400 moves the marking device and the cutting device according to the first processing method. Step S500 controls the marking device to perform the marking task and controls the cutting device to perform the cutting task according to the first processing method. Specifically, this includes controlling the marking device to move at coordinate value X. mthe cutting device starts to perform the single cutting task at the position with the coordinate value of X1, and after the single marking task and the single cutting task are completed, the feeding operation is performed, and the feeding length is the task cycle size T.

[0190] When the selected processing mode in step S300 is the second processing mode, step S400 moves the marking device and the cutting device according to the second processing mode, and step S500 controls the marking device to perform the marking of the processing task and controls the cutting device to perform the cutting of the processing task according to the second processing mode. Specifically, the marking device is controlled to start to perform the marking of the single processing task at the position with the coordinate value of Xm, after the marking of the single processing task is completed, the marking device is moved to the first avoiding position, the cutting device is controlled to move from the position with the coordinate value of X1 to the position with the coordinate value of Xm, and starts to perform the cutting of the single processing task, after the cutting of the single processing task is completed, the feeding operation is performed, and the feeding length is the task cycle size T.

[0191] The first avoiding position is any position located outside one single task maximum size plus the first safety interval from the starting position of the marking device, and located within the maximum allowed processing range. It can be understood that the coordinate value X b1 of the first avoiding position is in the range of [X m +L+D1, X0], wherein X m is the coordinate value of the starting position of the marking device, L is the obtained single task maximum size, D1 is the first safety interval, and X0 is the maximum allowed processing coordinate value.

[0192] When the selected processing mode in step S300 is the third processing mode, step S400 moves the marking device and the cutting device according to the third processing mode. Step S500 controls the marking device to perform the marking of the processing task and controls the cutting device to perform the cutting of the processing task according to the third processing mode. Specifically, the marking device is controlled to perform the marking of the single processing task at the position with the coordinate value of X m , after the marking of the single processing task is completed, the marking device is controlled to move a distance of a task cycle size T away from the cutting device and then perform the marking of the next marking task at the position with the coordinate value of X m +T, when the marking device performs the marking of the first marking task at the position with the coordinate value of X m , the n cutting devices are controlled to simultaneously perform the cutting of the n cutting tasks at the corresponding starting position coordinate values, and after the nth marking task and the n cutting tasks are completed, the feeding operation is performed, and the feeding length is n*T.

[0193] When the processing mode selected in step S300 is the fourth processing mode, step S400 moves the marking device and the cutting device according to the fourth processing mode, and step S500 controls the marking device to perform marking of a processing task and controls the cutting device to perform cutting of a processing task according to the fourth processing mode. Specifically, the marking device is controlled to perform marking of a single processing task at a position with a coordinate value of X m , and after marking of a processing task is completed each time, a feeding operation is performed, the feeding length is a task period size T, and the marking device is controlled to perform marking of a next processing task at a position with a coordinate value of X m . When the marking device performs marking of the nth processing task, n cutting devices are controlled to simultaneously perform cutting of n processing tasks at corresponding starting position coordinate values.

[0194] When the processing mode selected in step S300 is the fifth processing mode, step S400 moves the marking device and the cutting device according to the fifth processing mode, and step S500 controls the marking device to perform marking of a processing task and controls the cutting device to perform cutting of a processing task according to the fifth processing mode. Specifically, the marking device is controlled to perform marking of a single processing task at a position with a coordinate value of X m , and after marking of a processing task is completed each time, the marking device is controlled to move a single task period size away from the cutting device, marking of a next processing task is performed at a position with a coordinate value of X m +T, and after completion, the marking device is moved to a position with a coordinate value of X m +2*T to perform marking of a next processing task. It can be understood that when the marking device performs marking of the Mth processing task, M=1, 2, ···, n, the starting position coordinate value of the marking device is X M , where X M =X m +T*(M-1). When M=n, after marking of n processing tasks is completed, the marking device is moved to a second avoidance position, the first cutting device, the second cutting device, ···, the (n-1)th cutting device, and the nth cutting device are moved to positions with coordinate values of X m +(M-1)*T, X m +(M-2)*T, ···, X m +T, and X m , respectively, and n cutting devices simultaneously perform cutting of a processing task to complete cutting of n processing tasks. After cutting is completed, a feeding operation is performed, and the feeding size is n*T.

[0195] The coordinate value X b1 of the second avoidance position ranges from [Xm +L+T*(n-1)+D1,X0], wherein, X m is a starting position coordinate value of the marking device, L is a maximum size of a single task obtained, D1 is a first safety distance, X0 is a maximum allowed machining coordinate value, and n is the number of cutting devices.

[0196] In this embodiment, before step S500, the method further comprises:

[0197] feeding the material to be processed;

[0198] detecting the edge position of the material to be processed by the edge detection device, and comparing the edge position of the material to be processed with the coordinate system position of the marking device;

[0199] when the edge of the material to be processed deviates from the coordinate system position of the marking device by more than a certain threshold, issuing an alarm or controlling the marking device to correct the position.

[0200] In this embodiment, before step S500, the method further comprises:

[0201] measuring the distance between the material to be processed and the marking device;

[0202] obtaining the focal length of the marking device;

[0203] feeding the distance between the material to be processed and the marking device back to the marking device, and adjusting the height of the marking device according to the focal length of the marking device, so that the laser focal point of the marking device can be focused on the material to be processed.

[0204] In this embodiment, the material to be processed is a roll material.

[0205] In summary, compared with the prior art, the embodiments provided in the present application have at least the following technical effects:

[0206] The intelligent processing method provided in the present application pre-stores at least two processing methods, then calculates the processing width according to the task period size and the maximum size of a single task, selects one processing method according to the processing width, and performs the marking process and the cutting process according to the selected processing method in the subsequent execution of the processing task, so that different processing methods can be selected according to the processing width requirements of different processing tasks, the method of the present application can adapt to batch processing of different tasks, has strong adaptability, does not need human intervention and equipment replacement, saves the cost of producing different size products, and also saves the debugging process of the device when adapting to different tasks.

[0207] In the process, the operator only needs to input different processing task parameters to automatically match the best processing method, so that the processing tasks of various product sizes can be matched to the most efficient and safest processing method, realizing the intelligentization and automation of product processing.

[0208] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer readable storage medium. When the program is executed, the processes of the above-mentioned embodiment methods can be included. The storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0209] It should be understood that, although each step in the flowchart of the accompanying drawings is shown in sequence according to the direction of the arrow, these steps are not necessarily executed in sequence according to the direction of the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and they can be executed in other sequences. Moreover, at least part of the steps in the flowchart of the accompanying drawings can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or sub-steps or stages of other steps.

[0210] Further referring to Figure 9 , as an implementation of the method shown in the above Figure 1 , the present application provides an embodiment of an intelligent processing device, which corresponds to the embodiment of the intelligent processing method shown in the figure, and the device can be applied to various electronic devices.

[0211] As shown in Figure 9 , the intelligent processing device 700 described in the embodiment includes a pre-stored module 701, an acquisition module 702, a selection module 703, a movement module 704, and a control module 705. Among them:

[0212] The pre-stored module 701 is configured to pre-store at least two processing methods.

[0213] The acquisition module 702 is configured to acquire a task cycle size and a single task maximum size.

[0214] The selection module 703 is configured to calculate a processing width according to the acquired task cycle size and single task maximum size, and select one of the pre-stored processing methods according to the processing width.

[0215] The movement module 704 is configured to move the marking device 10 to a starting position of the marking device 10 and move the cutting device 20 to a starting position of the cutting device 20 according to the selected processing method.

[0216] The control module 705 is configured to control the marking device 10 to mark according to the selected processing mode, and control the cutting device 20 to cut according to the selected processing mode.

[0217] The intelligent processing device provided in the application pre-stores at least two processing modes in the pre-stored module 701, calculates a processing width according to the task cycle size and the maximum size of a single task obtained by the acquisition module 702, selects one processing mode from the pre-stored processing modes according to the processing width, moves the marking device 10 to the starting position of the marking device 10 and moves the cutting device 20 to the starting position of the cutting device 20 in the subsequent execution of the processing task according to the selected processing mode by the moving module 704, controls the marking device 10 to mark according to the selected processing mode and controls the cutting device 20 to cut according to the selected processing mode by the control module 705, so that the intelligent processing device can adapt to batch processing of different tasks, has strong adaptability, does not need human intervention and replacement of the device, saves the cost of production of products of different sizes, and also saves the debugging process of the device when adapting to different tasks.

[0218] In some optional implementation manners of the embodiment, the intelligent processing device 700 further includes a feeding module, an edge detection module and a warning module, wherein:

[0219] The feeding module is configured to control the feeding device to feed;

[0220] The edge detection module is configured to detect the edge position of the material to be processed, and compare the edge position of the material to be processed with the coordinate system position of the marking device;

[0221] The warning module is configured to issue a warning when the edge of the material to be processed deviates from the coordinate system position of the marking device by more than a certain threshold.

[0222] In some optional implementation manners of the embodiment, the acquisition module can also be configured to acquire the focal length of the marking device, and the intelligent processing device 700 further includes a distance measuring module and an adjusting module, wherein:

[0223] The distance measuring module is configured to measure the distance between the material to be processed and the marking device;

[0224] The adjusting module is configured to feed back the distance between the material to be processed and the marking device to the marking device, and adjust the height of the marking device according to the focal length of the marking device.

[0225] The feeding module, the edge detection module, the warning module, the distance measuring module and the adjusting module make the intelligent processing device have stronger adaptability, improve the processing precision and accuracy, and improve the yield of products.

[0226] To solve the above technical problems, the embodiment of the present application further provides a computer device. For details, please refer to Figure 9 , Figure 9 The basic structure block diagram of the computer device of the embodiment is shown in the figure.

[0227] The computer device 80 comprises a memory 81, a processor 82, and a network interface 83 which are connected to each other through a system bus. It should be noted that only the computer device 80 with components 81-83 is shown in the figure, but it should be understood that all the shown components are not required to be implemented, and more or less components can be alternatively implemented. Among them, the computer device herein can be understood by those skilled in the art as a device capable of automatically performing numerical calculation and / or information processing according to pre-set or stored instructions, and the hardware thereof includes but is not limited to a microprocessor, an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), an embedded device, etc.

[0228] The computer device can be a desktop computer, a notebook computer, a palm computer, a cloud server, and the like. The computer device can perform human-computer interaction with a user through a keyboard, a mouse, a remote controller, a touchpad, a voice control device, and the like.

[0229] The memory 81 includes at least one type of readable storage medium, such as a flash memory, a hard disk, a multimedia card, a card-type memory (e.g., an SD or DX memory, etc.), a random access memory (RAM), a static random access memory (SRAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM), a magnetic memory, a magnetic disk, an optical disk, etc. In some embodiments, the memory 81 can be an internal storage unit of the computer device 80, such as a hard disk or a memory of the computer device 80. In other embodiments, the memory 81 can also be an external storage device of the computer device 80, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the computer device 80. Of course, the memory 81 can also include both an internal storage unit and an external storage device of the computer device 80. In this embodiment, the memory 81 is generally used to store an operating system and various application software installed on the computer device 80, such as program codes of the intelligent machining method, etc. In addition, the memory 81 can also be used to temporarily store various data that have been output or will be output.

[0230] The processor 82 can be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip in some embodiments. The processor 82 is generally used to control the overall operation of the computer device 80. In this embodiment, the processor 82 is used to run program codes or process data stored in the memory 81, such as running program codes of the intelligent machining method.

[0231] The network interface 83 can include a wireless network interface or a wired network interface, which is generally used to establish a communication connection between the computer device 80 and other electronic devices.

[0232] The present application also provides another embodiment, i.e., to provide a computer readable storage medium storing an intelligent machining program, which can be executed by at least one processor to enable the at least one processor to perform the steps of the intelligent machining method as described above.

[0233] Those skilled in the art can clearly understand the above-mentioned embodiment method can be realized by means of software and the necessary general hardware platform, of course, it can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes a plurality of instructions for making a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) execute the method described in each embodiment of the present application.

[0234] Obviously, the above-described embodiments are only some of the embodiments of the present application, not all the embodiments, and the drawings show the preferred embodiments of the present application, but do not limit the patent scope of the present application. The present application can be implemented in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacements to some of the technical features. Any equivalent structure made by using the content of the specification and drawings, directly or indirectly applied to other related technical fields, is also within the scope of the patent protection of the present application.

Claims

1. A method of intelligent machining, characterized in that, The method comprises the following steps: storing at least two processing modes in advance; obtaining a task cycle size and a single task maximum size; calculating a processing width according to the obtained task cycle size and single task maximum size, and selecting a processing mode from the processing modes stored in advance according to the processing width, wherein the processing type is determined according to the number of cutting devices, and the processing type comprises a single cutting head processing mode and a multi-cutting head processing mode; a first safety distance is obtained from the stored parameters, and when the processing type is the single cutting head processing mode, the processing width corresponding to the single cutting head processing mode is calculated according to the first safety distance, the single task maximum size and the task cycle size; when the processing type is the multi-cutting head processing mode, the processing width corresponding to the multi-cutting head processing mode is calculated according to the first safety distance, the single task maximum size, the task cycle size and the number of cutting devices; moving the marking device to a starting position of the marking device and moving the cutting device to a starting position of the cutting device according to the selected processing mode; controlling the marking device to mark according to the selected processing mode and controlling the cutting device to cut according to the selected processing mode.

2. The intelligent machining method of claim 1, wherein, The step of calculating the processing width according to the obtained task cycle size and single task maximum size and selecting a processing mode from the processing modes stored in advance according to the processing width comprises: obtaining the number of cutting devices for executing the processing task; calculating the processing width corresponding to the determined processing type according to the task cycle size and the single task maximum size; determining the processing mode of the processing type according to the processing width.

3. The intelligent machining method of claim 2, wherein, The step of determining the processing type according to the number of cutting devices comprises: when the number of cutting devices for executing the processing task is one, determining that the processing type is the single cutting head processing mode; when the number of cutting devices for executing the processing task is two or more, determining that the processing type is the multi-cutting head processing mode.

4. The intelligent machining method of claim 2, wherein, The step of calculating the processing width corresponding to the single cutting head processing mode according to the first safety distance, the single task maximum size and the task cycle size when the processing type is the single cutting head processing mode comprises: calculating the number of allowed processing tasks between the marking device and the cutting device according to the first safety distance, the single task maximum size and the task cycle size, wherein the first safety distance is the minimum allowed distance between the marking device and the cutting device; calculating a first preset distance based on the number of allowed processing tasks and the task cycle size; calculating the processing width corresponding to the single cutting head processing mode according to the first preset distance.

5. The intelligent machining method of claim 4, wherein, The step of determining the processing mode of the processing type according to the processing width comprises: judging whether the processing width is less than or equal to a preset maximum allowed processing range; if less than or equal to the maximum allowed processing range, selecting a first processing mode; if greater than the maximum allowed processing range, selecting a second processing mode; The first processing mode specifically includes: controlling the marking device to perform marking of a single processing task at a starting position of the marking device, simultaneously controlling the cutting device to perform cutting of the single processing task at a starting position of the cutting device during the marking of the single processing task by the marking device, performing a feeding operation after the marking of the single processing task and the cutting of the single processing task are completed, and the feeding length being a task cycle size; The second processing mode specifically includes: controlling the marking device to perform marking of a single processing task at a starting position of the marking device, moving the marking device to a first avoiding position after the marking of the single processing task is completed, controlling the cutting device to move from a starting position of the cutting device to a starting position of the marking device during the marking of the single processing task by the marking device, and performing cutting of the single processing task, performing a feeding operation after the cutting of the single processing task is completed, and the feeding length being a task cycle size.

6. The intelligent machining method of claim 2, wherein, When the processing type is the multi-cutting-head processing mode, the first processing range corresponding to the multi-cutting-head processing mode is calculated according to the first safety distance, the single-task maximum size, the task cycle size, and the number of cutting devices. The allowed processing task number between the marking device and the cutting device closest to the marking device is calculated according to the first safety distance, the single-task maximum size, the task cycle size, and the number of cutting devices, wherein the first safety distance is the minimum allowed distance between the marking device and the cutting device; The second preset distance is calculated based on the allowed processing task number, the task cycle size, and the number of cutting devices; The first processing range corresponding to the multi-cutting-head processing mode is calculated according to the second preset distance, the single-task maximum size, the task cycle size, and the number of cutting devices.

7. The intelligent machining method of claim 6, wherein, The processing mode of the processing type is determined according to the processing range, and the processing mode specifically includes: It is judged whether the first processing range is less than or equal to a preset maximum allowed processing range; If it is less than or equal to the maximum allowed processing range, a third processing mode is selected; If it is greater than the maximum allowed processing range, a second processing range corresponding to the multi-cutting-head processing mode is calculated according to the single-task maximum size and the second preset distance; It is judged whether the second processing range is less than or equal to a preset maximum allowed processing range; If it is less than or equal to the maximum allowed processing range, a fourth processing mode is selected; If it is greater than the maximum allowed processing range, a fifth processing mode is selected; The third processing mode specifically includes: controlling the marking device to perform marking of a single processing task at a starting position of the marking device, controlling the marking device to move a distance of a task cycle size away from the cutting device after the marking of the single processing task is completed, and then performing marking of a next processing task, controlling n cutting devices to simultaneously perform cutting of n processing tasks at corresponding starting positions when the marking device performs marking of a first processing task, completing the cutting of the n processing tasks, performing a feeding operation after marking of an n-th processing task and the cutting of the n processing tasks are completed, and the feeding length being n task cycle sizes. The fourth processing mode specifically includes: controlling the marking device to perform single-time processing task marking at the starting position of the marking device, performing feeding operation after each time the processing task marking is completed, the feeding length being one task cycle size, and then controlling the marking device to perform the next processing task marking at the starting position of the marking device; when the marking device performs the nth processing task marking, controlling the n cutting devices to simultaneously perform one processing task cutting at the starting positions of the n cutting devices to complete n processing task cuttings; and performing feeding operation after the nth processing task marking and the n processing task cuttings are completed, the feeding length being one task cycle size. The fifth processing mode specifically includes: controlling the marking device to perform single-time processing task marking at the starting position of the marking device, controlling the marking device to move away from the cutting device by a single task cycle size after each time the processing task marking is completed, and then performing the next processing task marking; after the nth processing task marking is completed, moving the marking device to a second avoiding position, moving the n cutting devices to the starting positions of the marking device during the n processing task markings, simultaneously performing one processing task cutting by the n cutting devices to complete n processing task cuttings, and performing feeding operation after the cutting is completed, the feeding size being n task cycle sizes. Wherein, n is the number of cutting devices, and n is an integer greater than 1.

8. The smart machining method according to any one of claims 1 to 7, characterized in that, Before the step of controlling the marking device to perform marking according to the selected processing mode and controlling the cutting device to perform cutting according to the selected processing mode, the method further includes: performing feeding operation; detecting the edge position of the material to be processed, and comparing the edge position of the material to be processed with the coordinate system position of the marking device; when the edge of the material to be processed deviates from the coordinate system position of the marking device by more than a preset threshold, issuing an alarm or controlling the marking device to perform position correction.

9. The intelligent machining method according to any one of claims 1 to 7, characterized in that, Before the step of controlling the marking device to perform marking according to the selected processing mode and controlling the cutting device to perform cutting according to the selected processing mode, the method further includes: measuring the distance between the material to be processed and the marking device; obtaining the focal length of the marking device; feeding the distance between the material to be processed and the marking device to the marking device, and adjusting the height of the marking device according to the focal length of the marking device.

10. An intelligent machining device, characterized by It includes: a pre-storage module for pre-storing at least two processing modes; an acquisition module for acquiring task cycle size and single task maximum size; a selection module for calculating processing width according to the acquired task cycle size and single task maximum size, and selecting one processing mode from the pre-stored processing modes according to the processing width; a moving module for moving the marking device to the starting position of the marking device and moving the cutting device to the starting position of the cutting device according to the selected processing mode; a control module for controlling the marking device to perform marking according to the selected processing mode and controlling the cutting device to perform cutting according to the selected processing mode.

11. A computer device, characterized by An apparatus comprising a memory having stored therein a computer program and a processor that implements the steps of the intelligent machining method of any one of claims 1 to 9 when executing the computer program.

12. A computer-readable storage medium, characterized in that, A computer readable storage medium having stored thereon a computer program that, when executed by a processor, implements the steps of the intelligent machining method of any one of claims 1 to 9.

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