Thermal management device and method for space optoelectronic imaging elements on satellites

Abstract

This invention relates to the field of satellite optoelectronic measurement and sensing technology, and particularly to a thermal management device and method for space optoelectronic imaging elements on satellites. The thermal management device includes a bracket, a metal shell, a circuit board, a secondary TEC cooling assembly, a heat sink, micro heat pipes, and a heat transfer fixing plate. Cooling is achieved through the secondary TEC cooling assembly, which is connected in series with the heat sink, micro heat pipes, and the satellite cabin's thermostatic plate. The heat sink, micro heat pipes, and heat transfer fixing plate form an integrated heat conduction chain. A large heat pipe is pre-embedded inside the satellite cabin's thermostatic plate, and heat is dissipated from the heat transfer fixing plate through internal working fluid circulation, completing the entire process of thermal management for the optoelectronic imaging element. This achieves thermal management and miniaturized design for large-area single-photon imaging elements. The heat transfer fixing plate provides the thermal management device with resistance to the space mechanical environment, making it suitable for aerospace engineering applications. The overall thermal management process is simple, convenient to operate, and provides reliable thermal management results.

Description

Technical Field

[0001] This invention relates to the field of satellite optoelectronic measurement and sensing technology, and in particular to a thermal management device and method for space optoelectronic imaging elements on satellites. Background Technology

[0002] With the rapid development of optoelectronic technology, large-area optoelectronic imaging elements have been rapidly applied in the field of aerospace optoelectronic measurement. For example, large-area single-photon imaging elements (128*128 or 256*256, or even larger arrays) should operate at a photosensitive surface temperature of -40℃ in the cryogenic environment of space, but the temperature of the working interface is usually at room temperature of 20℃. How to effectively manage the heat and ensure normal operation is a design challenge.

[0003] Currently, TEC (Transmission Thermoelectric Cooling) or Dewar flasks are commonly used to cool imaging elements to achieve the optimal operating temperature of the photosensitive surface. However, TEC cooling has limited capacity and relatively low efficiency, generates additional heat loss during the cooling process, and has high power consumption requirements. Dewar flask cooling can achieve lower temperatures, but its weight is in the kilogram range and its volume is large, making it unsuitable for aerospace engineering missions requiring lightweight and miniaturized designs. Furthermore, since space optoelectronic imaging elements are installed in space equipment such as satellites, the thermal management devices for these elements must consider the impact of the space environment (vibration, shock, etc.) on the thermal management devices when used in the space environment. Currently available heat dissipation devices are not suitable for the thermal management of space optoelectronic imaging elements. Summary of the Invention

[0004] The purpose of this invention is to provide a thermal management device and method for space optoelectronic imaging elements on satellites, solving the problem of large weight and volume of the cooling structure of existing space optoelectronic imaging elements.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a thermal management device for a space optoelectronic imaging element on a satellite, comprising:

[0006] The support is plate-shaped and has a first through hole;

[0007] A metal casing, with a sapphire window on one side wall and a second through hole on the opposite side wall; and

[0008] The circuit board has a third through hole;

[0009] The metal shell and circuit board are fixed on both sides of the bracket respectively, and the first through hole, the second through hole and the third through hole are connected to each other to form an embedding channel;

[0010] Also includes:

[0011] The secondary TEC cooling component is embedded in the embedding channel. The photoelectric imaging element is located inside the metal shell and connected to the cold end of the secondary TEC cooling component. The temperature control board of the secondary TEC cooling component is connected to the circuit board for signal transmission.

[0012] The heat sink is embedded in the embedded channel, with one end connected to the hot end of the secondary TEC cooling component.

[0013] A miniature heat pipe, with one end of the pipe body bonded to a heat sink;

[0014] A heat transfer mounting plate is fixed to the constant temperature plate of the satellite cabin, with the heat transfer surfaces of the mounting plate and the micro heat pipe in contact. One end of the micro heat pipe is also connected to the mounting plate, and a bracket is perpendicular to the mounting plate.

[0015] A temperature sensor, housed within a metal casing and connected to a circuit board signal, is used to detect the temperature of the photoelectric imaging element.

[0016] Optionally, the thermal management device also includes a pressure plate, which is fixed to a circuit board or bracket to press the micro heat pipe.

[0017] Optionally, the pressure plate also has a bayonet that secures the micro heat pipe.

[0018] Optionally, the temperature control board is fixed to the heat transfer mounting base plate by a fixing frame, and the fixing frame spans above the micro heat pipe.

[0019] Optionally, the metal casing is provided with an air extraction port for evacuation, with a vacuum level not exceeding 1.3 × 10⁻⁶. -3 Pa.

[0020] Optionally, a 0.01mm layer of thermally conductive silicone grease is evenly applied to the side of the heat sink that connects to the hot end of the secondary TEC cooling component;

[0021] Apply 0.01mm of thermal grease evenly to the side where the heat sink connects to the micro heat pipe;

[0022] Apply 0.01mm of thermally conductive silicone grease evenly to the side where the miniature heat pipe connects to the heat transfer mounting plate.

[0023] Alternatively, the circuit board and metal housing are connected to the bracket by screws;

[0024] The heat transfer fixing base plate is fixedly connected to the satellite cabin constant temperature plate by multiple screws.

[0025] Optionally, the metal shell is made of Kovar alloy;

[0026] The heat sink material is tungsten copper;

[0027] The heat transfer fixing base plate is made of high volume fraction SiC / Al composite material.

[0028] Optionally, the number of micro heat pipes is two.

[0029] In a second aspect, the present invention also provides a thermal management method for a space optoelectronic imaging element on a satellite, wherein thermal management is performed using any of the thermal management devices of the first aspect, and the steps are as follows:

[0030] S1. Activate the heat pipe working fluid of the satellite cabin's thermostat plate;

[0031] S2. Activate the working imaging standby mode of the space optoelectronic imaging element;

[0032] S3. Activate the secondary TEC cooling component and cool the photoelectric imaging element to -40℃;

[0033] S4. Use a temperature sensor to detect the temperature and determine whether the photoelectric imaging element has reached -40℃;

[0034] S5. When the temperature of the photoelectric imaging element reaches -40℃, the photoelectric imaging element enters the imaging mode; otherwise, repeat steps S3 to S5.

[0035] The above-described technical solution of the present invention has the following advantages:

[0036] The present invention provides a thermal management device for a space optoelectronic imaging element on a satellite, comprising a bracket, a metal shell, a circuit board, a secondary TEC cooling assembly, a heat sink, a micro heat pipe, and a heat transfer fixing base plate. The metal shell and the circuit board are respectively fixed on both sides of the bracket, and there is an embedding channel between the three. The secondary TEC cooling assembly 4 is embedded in the embedding channel. The optoelectronic imaging element is located inside the metal shell and connected to the cold end of the secondary TEC cooling assembly. The temperature control board of the secondary TEC cooling assembly is connected to the circuit board via a signal connection. The heat sink is embedded in the embedding channel, with one end connected to the hot end of the secondary TEC cooling assembly. A section of one end of the micro heat pipe is fitted and connected to the heat sink. The heat transfer fixing base plate is fixed to the constant temperature plate of the satellite cabin. A section of the other end of the micro heat pipe is fitted and connected to the heat transfer fixing base plate. The bracket is perpendicular to the heat transfer fixing base plate. A temperature sensor is disposed inside the metal shell and is connected to the circuit board via a signal connection. This thermal management device utilizes a two-stage TEC cooling system, connected in series with a heat sink, micro heat pipes, and a satellite cabin thermostat. The heat sink, micro heat pipes, and heat transfer mounting plate form a unified heat conduction chain. A large heat pipe is pre-embedded within the satellite cabin thermostat, and heat is dissipated from the heat transfer mounting plate through internal fluid circulation, completing the entire thermal management process for the photoelectric imaging element. This enables thermal management and miniaturization of a large-area single-photon imaging element. The heat transfer mounting plate also provides the thermal management device with resistance to space mechanical environments, making it suitable for aerospace engineering applications.

[0037] The thermal management method for space optoelectronic imaging elements on satellites provided by this invention uses the above-mentioned thermal management device for thermal management. The overall thermal management process is simple, convenient to operate, and has reliable thermal management effect. Attached Figure Description

[0038] The accompanying drawings are provided for illustrative purposes only, and the proportions and quantities of the components in the drawings may not be consistent with the actual product.

[0039] Figure 1 This is a schematic diagram of the structure of a thermal management device for a space optoelectronic imaging element on a satellite according to Embodiment 1 of the present invention;

[0040] Figure 2 yes Figure 1 Another structural schematic diagram of the intermediate heat management device;

[0041] Figure 3 yes Figure 1 Another structural schematic diagram of the intermediate heat management device;

[0042] Figure 4 This is a schematic diagram of the structure of a pressure plate in Embodiment 1 of the present invention;

[0043] Figure 5 This is a schematic diagram of the structure of a support in Embodiment 1 of the present invention;

[0044] Figure 6 This is a schematic diagram showing the positions of some components of a thermal management device according to Embodiment 1 of the present invention;

[0045] Figure 7 This is a schematic diagram of the structure of a thermal management device for a space optoelectronic imaging element on a satellite, according to Embodiment 2 of the present invention.

[0046] In the picture:

[0047] 100: Photoelectric imaging element;

[0048] 1: Bracket;

[0049] 11: First through hole;

[0050] 2: Metal casing;

[0051] 21: Sapphire window;

[0052] 3: Circuit board;

[0053] 31: Ribbon cable connector;

[0054] 4: Secondary TEC cooling components;

[0055] 41: Temperature control board;

[0056] 5: Heat sink;

[0057] 6: Miniature heat pipe;

[0058] 7: Heat transfer fixing base plate;

[0059] 8: Satellite cabin temperature control plate;

[0060] 9: Pressure plate;

[0061] 91: Checkpoint;

[0062] 10: Fixed frame. Detailed Implementation

[0063] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0064] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0065] Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0066] Example 1

[0067] See Figures 1-6 As shown, the thermal management device for space optoelectronic imaging elements on satellites provided in this embodiment of the invention includes a bracket 1, a metal shell 2, a circuit board 3, a secondary TEC cooling assembly 4, a heat sink 5, a micro heat pipe 6, and a heat transfer fixing base plate 7.

[0068] See Figure 1 , Figure 5 and Figure 6 As shown, the main structure of the bracket 1 is plate-shaped, and a first through hole 11 is provided on it.

[0069] See Figure 1 and Figure 6As shown, a sapphire window 21 is provided on one side wall of the metal shell 2 (the side wall opposite to the support 1), and a second through hole is provided on the other side wall opposite to the sapphire window 21.

[0070] See Figure 2 and Figure 6 As shown, the circuit board 3 has a third through hole. The metal shell 2 and the circuit board 3 are respectively fixed on both sides of the bracket 1, and the first through hole 11, the second through hole and the third through hole are connected to each other to form an embedding channel. The circuit board 3 is provided with a ribbon cable interface 31 for connecting with other components.

[0071] See Figure 6 As shown, the secondary TEC cooling component 4 is embedded in the embedding channel, the photoelectric imaging element 100 is located in the metal shell 2 and connected to the cold end of the secondary TEC cooling component 4, and the temperature control board 41 of the secondary TEC cooling component is connected to the circuit board 3 for signal transmission.

[0072] See Figure 2 and Figure 6 As shown, the heat sink 5 is embedded in the embedding channel, with one end connected to the hot end of the secondary TEC cooling component 4, and the other end located outside the embedding channel. A section of one end of the micro heat pipe 6 is fitted and connected to the heat sink 5. The heat transfer fixing base plate 7 is fixed to the satellite cabin constant temperature plate 8, and the heat transfer surfaces of the heat transfer fixing base plate 7 and the satellite cabin constant temperature plate 8 are in contact. A section of the other end of the micro heat pipe 6 is fitted and connected to the heat transfer fixing base plate 7. The bracket 1 is perpendicular to the heat transfer fixing base plate 7. (See attached image) Figure 2 and Figure 3 As shown, the micro heat pipe 6 is made to be L-shaped or approximately L-shaped, reducing space occupation.

[0073] A temperature sensor is installed inside the metal casing 2 and is connected to the circuit board 3 for signal detection of the temperature of the photoelectric imaging element 100 and feedback to the circuit board 3. The circuit board 3 sends a signal to the temperature control board 41 to adjust the temperature of the secondary TEC cooling component 4.

[0074] The thermal management device for space optoelectronic imaging elements on satellites proposed in this embodiment uses a two-stage TEC cooling assembly 4 for cooling, and is designed in series with a heat sink 5, a micro heat pipe 6, and a satellite cabin thermostat 8. The heat sink 5, micro heat pipe 6, and heat transfer fixing plate 7 form an integrated heat conduction chain. A large heat pipe is pre-embedded inside the satellite cabin thermostat 8, and the heat is discharged from the heat transfer fixing plate 7 through the circulation of the working fluid inside the heat pipe, completing the full-process thermal management of the optoelectronic imaging element. This achieves thermal management and miniaturization of a large-area single-photon imaging element, enabling the imaging component to weigh no more than 200 grams and have a volume no greater than 60*60*130mm. 3With its compact size and weight, this device is suitable for aerospace engineering applications and offers significant engineering benefits. Furthermore, the thermal management device in this embodiment, through the installation of a heat transfer fixing base plate, provides resistance to the space mechanical environment. This ensures that the thermal management performance of the inter-room photoelectric imaging element remains above 99.8% after experiencing random vibration acceleration of 20 grms@10HZ-2000Hz, sinusoidal vibration of 10g@5~100Hz, and impact of 2000g in a space environment. This makes it suitable for the thermal design and management of photoelectric products related to photoelectric measurement and sensing in the field of deep space cryogenic environments.

[0075] The thermal management device of this embodiment is simple in structure, easy to operate, low in cost, and highly safe. It can effectively manage the thermal performance of photoelectric imaging elements in space optoelectronic products, meeting the optimal operating performance requirement of the imaging elements at -40℃. This lays the foundation for the engineering implementation and experimental verification of large-area single-photon imaging elements in the field of space optoelectronic measurement and sensing.

[0076] To further improve adaptability to the space environment and increase heat exchange efficiency, in some implementation methods, see [reference needed]. Figure 2 and Figure 3 As shown, the thermal management device also includes a pressure plate 9, which is fixed to the circuit board 3 or the bracket 1, pressing the miniature heat pipe 6 tightly. This further compresses the miniature heat pipe 6, ensuring it is in close contact with the heat sink 5, thus improving heat exchange efficiency. Furthermore, the compression reduces the impact of vibrations and impacts in the space on heat exchange efficiency. (See also...) Figure 4 As shown, the pressure plate 9 also has a bayonet 91, which clamps the micro heat pipe 6.

[0077] To make full use of space and further reduce the space occupied by thermal management devices, see [link / reference]. Figures 1-3 In some embodiments, the temperature control board 41 is fixed to the heat transfer mounting base plate 7 by a fixing frame 10, and the fixing frame 10 spans above the micro heat pipe 6. The temperature control board 41 is signal-connected to the secondary TEC cooling assembly 4, for example, by a cable connection.

[0078] To prevent moisture buildup within the cavity containing the photoelectric imaging element 100 at low temperatures, in some embodiments, the metal casing 2 is provided with an extraction port for vacuuming. Preferably, the vacuum level is no greater than 1.3 × 10⁻⁶. -3 Pa.

[0079] To improve heat transfer efficiency, in some embodiments, a 0.01mm layer of thermally conductive grease is uniformly applied to the side of the heat sink 5 that connects to the hot end of the secondary TEC cooling component 4. A 0.01mm layer of thermally conductive grease is also uniformly applied to the side of the heat sink 5 that connects to the micro heat pipe 6. Finally, a 0.01mm layer of thermally conductive grease is uniformly applied to the side of the micro heat pipe 6 that connects to the heat transfer mounting plate 7. The thermally conductive grease can be used to contact the tiny recesses on the surface, making the contact surfaces fit better and improving heat transfer efficiency.

[0080] To facilitate installation and ensure a secure fit to the space environment and efficient heat transfer, in some embodiments, the circuit board 3 and the metal casing 2 are connected to the bracket 1 by screws. In one specific embodiment, the photoelectric imaging element 100 is fixed to the bracket 1 by four screws. The circuit board 3 is fixed to the bracket 1 by six screws. The heat transfer mounting base 7 is fixed to the satellite cabin temperature control plate 8 by multiple screws, such as six or eight.

[0081] In some preferred embodiments, the metal shell 2 is made of Kovar alloy. The heat sink 5 is made of tungsten copper. The heat transfer fixing base plate 7 is made of high volume fraction SiC / Al composite material.

[0082] It should be noted that the micro heat pipe 6 can use current technology, and the temperature difference between its two ends is almost zero.

[0083] It should also be noted that the satellite cabin thermostat 8 has an internal heat pipe structure, within which a working fluid circulates for heat exchange. In some preferred embodiments, the satellite cabin thermostat has a "sandwich" structure, with carbon fiber skins on both sides and an aluminum honeycomb structure in the middle. Large heat pipes are pre-formed inside the aluminum honeycomb structure, with an "N"-shaped structure and their size designed according to actual needs. The carbon fiber skins, aluminum honeycomb structure, and large heat pipes are connected and fixed using aerospace-grade rubber. The satellite cabin thermostat dissipates heat from the base plate through the circulation of the working fluid within the heat pipes, completing the entire thermal management process for the photoelectric imaging element.

[0084] The thermal management device of the present invention is also applicable to space optical instruments such as high-resolution space cameras and sky survey telescopes, optoelectronic instruments, high-precision pointing measurement instruments, optical sensors, and other instruments that require thermal management of optoelectronic imaging elements.

[0085] Example 2

[0086] See Figure 7As shown, this embodiment two is basically the same as embodiment one, and the similarities will not be repeated. The difference is that the number of micro heat pipes 6 is two. Preferably, the heat transfer capacity of a single hole of the micro heat pipe at 20°C is not less than 250 W·m. It is recommended to use CDRG-NH3-G1-30×11.4(Ω) or CDRG-NH3-G2-30×9(Ω) to better achieve miniaturization design.

[0087] Example 3

[0088] This third embodiment provides a thermal management method for a space optoelectronic imaging element on a satellite. This thermal management method uses any one of the thermal management devices from either embodiment one or embodiment two. The steps are as follows:

[0089] Step 1: Start the heat pipe working fluid of the satellite cabin thermostat plate.

[0090] Step 2: Activate the working imaging standby mode of the space optoelectronic imaging element.

[0091] Step 3: Activate the secondary TEC cooling unit and cool the photoelectric imaging element to -40°C.

[0092] Step four: Use a temperature sensor to detect the temperature and determine whether the photoelectric imaging element has reached -40℃.

[0093] Step 5: If the temperature of the photoelectric imaging element reaches -40℃, the photoelectric imaging element enters the imaging mode; otherwise, repeat steps 3 to 5.

[0094] This thermal management method is simple, easy to operate, and has reliable thermal management effects.

[0095] The parts of this invention not described in detail are common knowledge to those skilled in the art.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that not every embodiment contains only one independent technical solution, and in the absence of conflict between solutions, the various technical features mentioned in each embodiment can be combined in any way to form other implementation methods that can be understood by those skilled in the art.

[0097] Furthermore, without departing from the scope of the present invention, modifications to the technical solutions described in the foregoing embodiments, or equivalent substitutions of some of the technical features, shall not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thermal management device for a space optoelectronic imaging element on a satellite, characterized in that, include: The support is plate-shaped and has a first through hole; A metal casing, wherein a sapphire window is provided on one side wall, and a second through hole is provided on the opposite side wall at a distance from the sapphire window; and The circuit board has a third through hole; The metal shell and the circuit board are respectively fixed on both sides of the bracket, and the first through hole, the second through hole and the third through hole are connected to each other to form an embedding channel; Also includes: A secondary TEC cooling component is embedded in the embedded channel. A photoelectric imaging element is located inside the metal shell and connected to the cold end of the secondary TEC cooling component. The temperature control board of the secondary TEC cooling component is connected to the circuit board for signal transmission. A heat sink is embedded in the embedded channel, with one end connected to the hot end of the secondary TEC cooling component. A miniature heat pipe, with one end of the pipe body bonded to the heat sink; A heat transfer fixing base plate is fixed to the constant temperature plate of the satellite cabin, and the heat transfer surfaces of the heat transfer fixing base plate and the constant temperature plate of the satellite cabin are in contact. A section of the other end of the micro heat pipe is in contact with the heat transfer fixing base plate, and the bracket is perpendicular to the heat transfer fixing base plate; and A temperature sensor, housed within the metal casing and connected to the circuit board, is used to detect the temperature of the photoelectric imaging element.

2. The thermal management device according to claim 1, characterized in that: It also includes a pressure plate, which is fixed to the circuit board or bracket to press the micro heat pipe.

3. The thermal management device according to claim 2, characterized in that: The pressure plate also has a latch that secures the micro heat pipe.

4. The thermal management device according to claim 1, characterized in that: The temperature control board is fixed to the heat transfer base plate by a fixing frame, and the fixing frame spans above the micro heat pipe.

5. The thermal management device according to claim 1, characterized in that: The metal casing is equipped with an air extraction port for evacuation, with a vacuum level not exceeding 1.3 × 10⁻⁶. -3 Pa.

6. The thermal management device according to claim 1, characterized in that: The side of the heat sink that connects to the hot end of the secondary TEC cooling component is evenly coated with 0.01mm of thermally conductive silicone grease. The side of the heat sink connected to the micro heat pipe is evenly coated with 0.01mm of thermally conductive silicone grease; The side of the micro heat pipe connected to the heat transfer fixing base plate is evenly coated with 0.01mm of thermally conductive silicone grease.

7. The thermal management device according to claim 1, characterized in that: The circuit board and the metal shell are connected to the bracket by screws; The heat transfer fixing base plate is fixedly connected to the satellite cabin constant temperature plate by multiple screws.

8. The thermal management device according to claim 1, characterized in that: The metal shell is made of Kovar alloy; The heat sink is made of tungsten copper. The heat transfer fixing base plate is made of high volume fraction SiC / Al composite material.

9. The thermal management device according to claim 1, characterized in that: The number of micro heat pipes is two.

10. A thermal management method for a space optoelectronic imaging element on a satellite, characterized in that: Thermal management is performed using the thermal management device as described in any one of claims 1-9, with the following steps: S1. Activate the heat pipe working fluid of the satellite cabin thermostat plate; S2. Activate the working imaging standby mode of the space optoelectronic imaging element; S3. Activate the secondary TEC cooling system and cool the photoelectric imaging element to -40°C; S4. Use a temperature sensor to detect the temperature and determine whether the photoelectric imaging element has reached -40℃; S5. When the temperature of the photoelectric imaging element reaches -40℃, the photoelectric imaging element enters the imaging mode; otherwise, repeat steps S3 to S5.

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