A method for heating and coating a high-temperature substrate and substrate

Abstract

This invention discloses a high-temperature substrate and a method for heating and coating a substrate. The substrate includes a substrate disk, a hollow spindle, a pressure regulating component, a lifting device, a heating device, and a cooling device. The heating device is located at the bottom of the substrate disk and is used to heat the substrate. The pressure regulating component is provided on the substrate disk, and the process gas provided by the pressure regulating component fills the space between the substrate and the substrate disk. The cooling device includes an external cooling pipe, a water tank, and a cooling plate. The cooling plate is located at the bottom of the heating device, and the external cooling pipe surrounds the outer periphery of the heating device. Cooling water flows sequentially through the interior of the heating device, the external cooling pipe, and the cooling plate before circulating to the water tank. The hollow spindle is fixedly connected to the cooling plate and the lifting device. Driven by the lifting device, the hollow spindle drives the substrate disk to reciprocate up and down within a vacuum chamber. This invention has the advantages of compact structure, high heating uniformity, and precise control, solving the problems of low substrate coating quality caused by uneven heating, easy substrate displacement, and difficulty in substrate clamping, thus achieving high-quality substrate coating.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor vacuum coating technology, specifically relating to a high-temperature substrate and substrate heating coating method, used to realize the lifting and high-temperature heating of the coating substrate. Background Technology

[0002] Existing high-temperature substrates for vacuum coating utilize a combination of vertical movement (with varying strokes) to raise and lower the substrate, and a heater to uniformly heat the substrate at different temperatures, ensuring good heating uniformity and thus guaranteeing coating quality. Simultaneously, the heater must be cooled to prevent overheating and potential equipment safety issues.

[0003] However, traditional heaters are difficult to meet the requirements of vacuum coating. For example, heating by solid contact is difficult to achieve high uniformity, heating with back pressure gas assistance is easy to change the position of the substrate, and vacuum adsorption of the substrate is not suitable for vacuum coating. Furthermore, the substrate is too thin and inconvenient to clamp. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a high-temperature base and substrate heating coating method that is compact in structure, simple in operation, highly uniform in heating, precise in control and widely applicable.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A high-temperature substrate includes: a substrate disk, a hollow spindle, a pressure regulating assembly, a lifting device, a heating device, and a cooling device. The substrate disk supports a substrate, and the heating device, located at the bottom of the substrate disk, heats the substrate. The pressure regulating assembly is provided on the substrate disk, and the process gas provided by the pressure regulating assembly fills the space between the substrate and the substrate disk to achieve uniform heating of the substrate. The cooling device includes an external cooling pipe, a water tank, and a cooling plate. The cooling plate is located at the bottom of the heating device, and the external cooling pipe surrounds the outer periphery of the heating device. Cooling water in the water tank flows sequentially through the interior of the heating device, the external cooling pipe, and the cooling plate before circulating back into the water tank. The top of the hollow spindle is fixedly connected to the bottom of the cooling plate, and the bottom of the hollow spindle is located on the water tank. The hollow spindle is connected to a lifting device located at the top of the water tank. Driven by the lifting device, the hollow spindle reciprocates, driving the cooling plate and the heating device to reciprocate, thereby raising and lowering the substrate disk to a preset coating position within the vacuum chamber.

[0007] As a further improvement of the present invention, the substrate disk is provided with multiple arc-shaped platforms on its edge, and multiple positioning grooves are provided on the arc-shaped platforms. The positioning grooves include fixed positioning grooves and movable positioning grooves. The outer side of the substrate is placed on the arc-shaped platforms and is fixedly connected to the positioning grooves.

[0008] As a further improvement of the present invention, the pressure regulating component includes: an air groove, an air inlet, an air storage groove, and an air inlet pipe. The air inlet pipe passes through the hollow main shaft and is connected to the substrate disk. The substrate disk has multiple air grooves evenly distributed on it, and the air grooves are connected to the air inlet. The substrate disk also has multiple air storage grooves evenly distributed on it, and adjacent air grooves form an air storage groove. The process gas transported by the air inlet pipe and the air inlet diffuses through the air grooves and is evenly distributed in the air storage groove, thereby achieving a uniform back pressure gas distribution between the substrate and the substrate disk.

[0009] As a further improvement of the present invention, the heating device includes: a mounting plate, a main heater, and an auxiliary heater. A plurality of the main heaters are arranged in a ring and embedded at the bottom of the mounting plate, and a plurality of the auxiliary heaters are arranged in a ring and embedded at the top of the mounting plate. An annular inner cooling pipe is also embedded at the bottom of the mounting plate. The main heaters and the inner cooling pipes are arranged at intervals. A third water inlet on the inner cooling pipe is connected to a water tank, and a third water outlet on the inner cooling pipe is connected to an outer cooling pipe. The auxiliary heaters are arranged in positions corresponding to the inner cooling pipes, and the auxiliary heaters are used to compensate for heating the interval area between adjacent main heaters.

[0010] As a further improvement of the present invention, the embedding depth of the inner cooling pipe is less than the embedding depth of the main heater, and the embedding depth of the auxiliary heater is the same as the embedding depth of the main heater.

[0011] As a further improvement of the present invention, the top of the cooling plate is provided with an annular main heating filler block, which matches the main heater and is used to fill the pit on the bottom surface of the main heater; the main heating filler block is provided with a water pipe channel that matches the inner cooling pipe, the bottom edge of the cooling plate is provided with a fourth water inlet that communicates with the outer cooling pipe, and the top center of the cooling plate is provided with a fourth water outlet that communicates with the water tank, and the cooling water enters from the bottom and exits from the top in the water pipe channel.

[0012] As a further improvement of the present invention, the external cooling pipes are arranged in a ring below the heating device. The external cooling pipes are provided with a first water inlet and a first water outlet. The first water inlet is connected to the third water outlet, and the first water outlet is connected to the fourth water inlet.

[0013] As a further improvement of the present invention, the lifting device includes: a balance bar, a transmission assembly, and a lifting drive assembly. One end of the transmission assembly is slidably connected to the balance bar, and the other end of the transmission assembly is connected to the lifting drive assembly. The hollow main shaft is connected to the transmission assembly. Under the drive of the lifting drive assembly, the transmission assembly moves the hollow main shaft up and down reciprocally.

[0014] As a further improvement of the present invention, the transmission assembly includes a moving block and a connecting rod. One end of the moving block is slidably connected to the balance bar, and the other end of the moving block is connected to the lifting drive assembly through the connecting rod. The hollow main shaft passes through the middle of the moving block.

[0015] As a further improvement of the present invention, the lifting drive assembly includes a cam, a drive motor and a fixed base. The fixed base is set on the top of the water tank, the drive motor is set on the upper part of the fixed base, the cam is connected to the output end of the drive motor, and the side of the cam is connected to the bottom of the connecting rod. Under the drive of the drive motor, the cam rotates and the connecting rod rolls along the side of the cam to realize the reciprocating lifting of the hollow main shaft.

[0016] As a general technical concept, the present invention also provides a substrate heating coating method based on the above-mentioned high-temperature substrate, comprising the following steps:

[0017] S1. Open the water valve in the water tank to circulate and cool the sides and bottom of the heating device, and ensure that there is cooling water stored in the cooling tray.

[0018] S2. When the vacuum level of the vacuum chamber meets the preset requirements, the substrate disk is moved to the predetermined position by the lifting device, and then the substrate is placed on the substrate disk by the substrate loading and unloading system. The substrate is then fixed by aligning the substrate with the center of the substrate disk using the positioning groove.

[0019] S3. Determine the temperature required for the current coating process based on the coating process. First, determine the heating power of the main heater. After the main heater is running stably, measure the temperature distribution in different areas of the substrate disk. Then, determine the heating power of the auxiliary heater. After adjustment, make the temperature uniform in all parts of the substrate disk.

[0020] S4. Open the gas valve connected to the air inlet pipe to deliver the process gas, and control the flow rate and leakage of the process gas to ensure that the back pressure process gas is evenly distributed in the gas storage groove of the substrate disk.

[0021] S5. Perform the coating process; after the process is completed, first turn off the main heater and auxiliary heater, then turn off the process gas, then fill the vacuum chamber with gas to restore atmospheric pressure, loosen the connection between the substrate and the positioning groove, take out the coated substrate, and after the heating device cools down to the preset temperature, turn off the cooling cycle to end one coating process.

[0022] Compared with the prior art, the advantages of the present invention are as follows:

[0023] 1. The high-temperature base of the present invention uses a heating device at the bottom of the substrate disk for heating and a pressure regulating component. The pressure regulating component provides process gas that is uniformly filled between the substrate and the substrate disk. When the substrate is placed on the substrate disk, it ensures a uniformly distributed back pressure gas layer between the effective coating area on the substrate and the substrate disk. Based on the heating device, the high-energy agitation of the back pressure gas in the high-temperature environment ensures that the heat generated by the heating device is in full contact with the substrate, effectively improving the heating uniformity of the substrate. Simultaneously, the heating device at its bottom and outer periphery... A cooling plate and an external cooling pipe are respectively set up. The cooling water in the water tank flows sequentially through the interior of the heating device, the external cooling pipe and the cooling plate before circulating back to the water tank. This achieves rapid cooling of the interior, sides and bottom of the heating device through a single cooling water channel, improving the operational stability of the heating device. At the same time, driven by the lifting device, the hollow spindle drives the cooling plate and the heating device to move up and down reciprocally, realizing the raising and lowering of the substrate plate to the preset coating position in the vacuum chamber. This improves the flexibility of the high-temperature base. This invention has the advantages of large stroke, small size, good heating uniformity and low cost.

[0024] 2. The high-temperature base of the present invention utilizes the combined action of the main heater and the auxiliary heater to achieve good heating uniformity at different process temperatures. Combined with the high-energy collision of back pressure gas, it overcomes the disadvantage that the two solids, the substrate and the substrate disk, are difficult to adhere evenly, further improving the heating uniformity of the substrate surface.

[0025] 3. The substrate heating coating method of the present invention first utilizes a cooling system to cool the heating device, ensuring stable operation of the heating device; once the preset vacuum level is reached, the substrate disk can be moved to a preset position within the vacuum chamber via a lifting device, the substrate is placed on the substrate disk, and then the substrate is fixed using a positioning groove, achieving a stable connection between the substrate and the substrate groove and preventing the substrate from deviating during the coating process; according to the preset coating temperature, the heating power of the main heater and the auxiliary heater is adjusted to achieve a basically uniform temperature across the substrate disk, and combined with the back pressure gas, uniform heating is achieved across the substrate, ultimately resulting in high-quality substrate coating. Attached Figure Description

[0026] Figure 1 This is a schematic diagram illustrating the structural principle of the high-temperature base of the present invention.

[0027] Figure 2 This is a schematic diagram illustrating the structural principle of the substrate disk in this invention.

[0028] Figure 3 This is a schematic diagram of the structural principle of the substrate disk from another perspective in this invention.

[0029] Figure 4 This is a schematic diagram illustrating the structural principle of the hollow spindle in this invention.

[0030] Figure 5 This is a schematic diagram illustrating the structural principle of the water tank in this invention.

[0031] Figure 6 This is a schematic diagram illustrating the structural principle of the heating device in this invention.

[0032] Figure 7 This is a schematic diagram of the structural principle of the heating device in this invention from another perspective.

[0033] Figure 8 This is one of the schematic diagrams illustrating the structural principle of the cooling plate in this invention.

[0034] Figure 9 This is the second schematic diagram of the structural principle of the cooling plate in this invention.

[0035] Figure 10 This is the third schematic diagram illustrating the structural principle of the cooling plate in this invention.

[0036] Figure 11 This is a schematic diagram illustrating the structural principle of the transmission component in this invention.

[0037] Figure 12 This is a schematic diagram illustrating the structural principle of the lifting drive assembly in this invention.

[0038] Figure 13 This is a schematic diagram illustrating the structural principle of the external cooling pipe in this invention.

[0039] Figure 14 This is a schematic diagram of the process of heating and coating the substrate in this invention.

[0040] Legend: 1. Substrate disk; 2. External cooling pipe; 3. Balance bar; 4. Hollow spindle; 5. Water tank; 6. Heating device; 7. Cooling plate; 8. Bellows; 9. Transmission assembly; 10. Lifting drive assembly; 11. Positioning slot; 12. Air slot; 13. Air inlet; 14. Arc-shaped stage; 15. Auxiliary heating filler block; 16. Air storage groove; 21. Annular pipe; 22. First water inlet; 23. First water outlet; 41. Air inlet pipe; 42. Water outlet. Pipe; 43. Inlet pipe; 51. Second inlet; 52. Second outlet; 60. Mounting plate; 61. Main heater; 62. Internal cooling pipe; 63. Auxiliary heater; 64. Third inlet; 65. Third outlet; 71. Main heating filler block; 72. Fourth inlet; 73. Water pipe channel; 74. Fourth outlet; 75. Base plate; 91. Moving block; 92. Connecting rod; 101. Cam; 102. Drive motor; 103. Fixed base. Detailed Implementation

[0041] The present invention will be further described below with reference to the accompanying drawings and specific preferred embodiments, but this does not limit the scope of protection of the present invention.

[0042] Example 1

[0043] like Figures 1 to 13 As shown, the high-temperature base of the present invention includes: a substrate disk 1, a hollow spindle 4, a pressure regulating assembly, a lifting device, a heating device 6, and a cooling device. The substrate disk 1 is used to support the substrate, and the heating device 6 is located at the bottom of the substrate disk 1 for heating the substrate. The pressure regulating assembly is provided on the substrate disk 1, and the process gas provided by the pressure regulating assembly fills the space between the substrate and the substrate disk 1 to achieve uniform heating of the substrate. The cooling device includes an external cooling pipe 2, a water tank 5, and a cooling plate 7. The cooling plate 7 is located at the bottom of the heating device 6, and the external cooling pipe 2 surrounds the outer periphery of the heating device 6. The cooling water in the water tank 5 flows sequentially through the interior of the heating device 6, the external cooling pipe 2, and the cooling plate 7 before circulating back into the water tank 5. The top of the hollow spindle 4 is fixedly connected to the bottom of the cooling plate 7. The bottom of the hollow spindle 4 is located on the water tank 5, and the hollow spindle 4 is connected to the lifting device set on the top of the water tank 5. Driven by the lifting device, the hollow spindle 4 reciprocates and lifts, and drives the cooling plate 7 and the heating device 6 to reciprocate and lift, so as to realize that the substrate plate 1 is lifted and lowered to the preset coating position in the vacuum chamber.

[0044] In this embodiment, a heating device 6 is installed at the bottom of the substrate disk 1 for heating, and a pressure regulating component is also provided. The pressure regulating component provides process gas to be uniformly filled between the substrate and the substrate disk 1. When the substrate is placed on the substrate disk 1, it can be ensured that there is a uniformly distributed back pressure gas between the effective coating area on the substrate and the substrate disk 1. Based on the heating device, the high-energy agitation of the back pressure gas in the high-temperature environment ensures that the heat energy generated by the heating device is in full contact with the substrate, effectively improving the heating uniformity of the substrate. At the same time, by installing a cooling plate 7 and an external cooling pipe 2 at the bottom and outer periphery of the heating device 6, respectively, the cooling water in the water tank 5 flows sequentially through the interior of the heating device 6, the external cooling pipe 2, and the cooling plate 7 before circulating back to the water tank 5. This achieves rapid cooling of the interior, sides, and bottom of the heating device through a single cooling water channel, improving the operational stability of the heating device. Furthermore, driven by the lifting device, the hollow spindle 4 drives the cooling plate 7 and the heating device 6 to reciprocate up and down, realizing the lifting and lowering of the substrate plate 1 in the vacuum cavity to the preset coating position, which improves the flexibility of the high temperature base. The present invention has advantages such as large stroke, small size, good heating uniformity and low cost.

[0045] like Figure 2 and Figure 3 As shown, in this embodiment, the substrate disk 1 has three arc-shaped platforms 14 on its edge, and three positioning grooves 11 on the arc-shaped platforms 14. The positioning grooves 11 include two fixed positioning grooves and one movable positioning groove. The outer side of the substrate is placed on the arc-shaped platforms 14 and fixed in the positioning grooves 11.

[0046] like Figure 2 and Figure 3 As shown, in this embodiment, the pressure regulating component includes: a gas groove 12, an air inlet 13, a gas storage groove 16, and an air inlet pipe 41. The air inlet pipe 41 passes through the hollow main shaft 4 and connects to the substrate disk 1. Multiple gas grooves 12 are evenly distributed on the substrate disk 1, and the gas grooves 12 communicate with the air inlet 13. Multiple gas storage grooves 16 are also evenly distributed on the substrate disk 1, with adjacent gas grooves 12 forming a gas storage groove 16. The process gas supplied by the air inlet pipe 41 and the air inlet 13 diffuses through the gas grooves 12 and is evenly distributed within the gas storage groove 16, achieving uniform back pressure gas distribution between the substrate and the substrate disk 1. After the process is completed, the back pressure gas is discharged through an exhaust device in the vacuum chamber.

[0047] Specifically, the substrate disk 1 has uniformly distributed gas grooves 12 on its surface. The number of gas grooves 12 at the edge of the substrate disk 1 is twice that in the central area, allowing gas to be rapidly transported outwards from the substrate disk 1 as the center. The edge of the substrate disk 1 is a curved stage 14, ensuring that only the outermost area of ​​the substrate directly contacts the curved stage 14, while the effective coating area does not directly contact the curved stage 14. Three positioning grooves 11 are evenly distributed on the curved stage 14, two of which are fixed and one is movable. The ejector pin engages with the movable positioning groove 11, ensuring the substrate remains centered on the substrate disk 1 and fixing the substrate to prevent displacement during the coating process. It can be understood that the ejector pin embedded in the curved stage 14 can fix substrates of different thicknesses.

[0048] Furthermore, the central area of ​​the substrate disk 1 is configured as a gas storage groove 16, meaning the central area of ​​the substrate disk 1 is lower than the edge area by a certain distance, allowing for the storage of a certain amount of back pressure gas. When the substrate is placed on the substrate disk 1, this ensures a uniformly distributed layer of back pressure gas between the effective coating area on the substrate and the substrate disk 1. With the heating device 6 in place, the high-energy agitation of the back pressure gas in a high-temperature environment ensures that the heat generated by the heating device 6 makes full contact with the substrate, effectively improving the heating uniformity of the substrate. It can be understood that the back pressure gas is consistent with the process gas to ensure that the gas in the vacuum chamber meets the process requirements during coating.

[0049] like Figure 6 and Figure 7As shown, in this embodiment, the heating device 6 includes: a mounting plate 60, main heaters 61, and auxiliary heaters 63. Multiple main heaters 61 are arranged in a ring and embedded in the bottom of the mounting plate 60, and multiple auxiliary heaters 63 are arranged in a ring and embedded in the top of the mounting plate 60. A ring-shaped inner cooling pipe 62 is also embedded in the bottom of the mounting plate 60. The main heaters 61 and the inner cooling pipes 62 are arranged at intervals, with the inner cooling pipes 62 positioned in the center of adjacent main heaters 61. A third water inlet 64 on the inner cooling pipe 62 communicates with a water tank 5, and a third water outlet 65 on the inner cooling pipe 62 communicates with an outer cooling pipe 2. The auxiliary heaters 63 are positioned corresponding to the inner cooling pipes 62, and are used to compensate for heating the spaced areas between adjacent main heaters 61. A through hole is provided at the center of the mounting plate 60 to facilitate the passage of an air inlet pipe 41 and an air outlet pipe 42.

[0050] In this embodiment, the main heaters 61 are embedded in a ring on the mounting plate 60, and the auxiliary heaters 63 are embedded on the other side of the mounting plate 60, positioned directly above the inner cooling pipe 62, i.e., in the middle of the two main heaters 61. Based on the principle of equal heating area, the spacing between the ring-shaped main heaters 61 in the outer region of the mounting plate 60 is smaller than that in the inner region. The distance between two adjacent main heaters 61 is based on the distance at which they are uniformly heated when at maximum power. When the actual power is less than the maximum power, compensation is made by adjusting the auxiliary heaters 63.

[0051] In this embodiment, the embedding depth of the inner cooling pipe 62 is less than that of the main heater 61, ensuring that the inner cooling pipe 62 does not affect the heating of the substrate disk 1 surface by the main heater 61. The inner cooling pipe 62 cools the area below and inside the heating device 6. The embedding depth of the auxiliary heater 63 is the same as that of the main heater 61, which can compensate for the heating of the area between the two main heaters 61 to meet the uniform heating requirements of the substrate under different power levels. By utilizing the combined action of the main heater and the auxiliary heater, good heating uniformity is achieved at different process temperatures. Combined with the high-energy collision of back pressure gas, the disadvantage of the substrate and the substrate disk being difficult to adhere evenly is overcome, further improving the heating uniformity of the substrate surface.

[0052] like Figures 8 to 10As shown, the top of the cooling plate 7 is provided with an annular main heating filler block 71, which matches the main heater 61 and is used to fill the recess on the bottom surface of the main heater 61. The bottom of the substrate plate 1 is provided with an annular auxiliary heating filler block 15, which matches the auxiliary heater 63 and is used to fill the recess between the top of the auxiliary heater 63 and the bottom of the substrate plate 1. The main heating filler block 71 is provided with a water pipe channel 73 that matches the inner cooling pipe 62. The bottom edge of the cooling plate 7 is provided with a fourth water inlet 72 that communicates with the outer cooling pipe 2. The top center of the cooling plate 7 is provided with a fourth water outlet 74 that communicates with the water tank 5. The cooling water enters from the bottom and exits from the top within the water pipe channel 73. The low-entry, high-exit configuration ensures that a certain amount of cooling water is stored in the cooling plate 7 for heat dissipation from the bottom of the heating device 6.

[0053] A through hole is provided at the center of the cooling plate 7, and the cooling plate 7 is fixedly connected to the hollow spindle 4 through the through hole.

[0054] like Figure 1 and Figure 13 As shown, in this embodiment, the external cooling pipe 2 is arranged in a ring below the side of the heating device 6, which can fully cool the side of the heating device 6. The external cooling pipe 2 is provided with a first water inlet 22 and a first water outlet 23. The first water inlet 22 is connected to the third water outlet 65, and the first water outlet 23 is connected to the fourth water inlet 72.

[0055] In this embodiment, the cooling circuit of the cooling device is as follows: First, water flows into the inlet pipe 43 from the second outlet 52 on the water tank 5, then into the inner cooling pipe 62 from the third inlet 64. After flowing in a ring inside the heating device 6, it enters the outer cooling pipe 2 through the third outlet 65 and the first inlet 22. Then, it flows into the cooling plate 7 through the first outlet 23 and the fourth inlet 72. Finally, it returns to the water tank 5 through the fourth outlet 74, the outlet pipe 42, and the second inlet 51. The interior, sides, and bottom of the heating device 6 are rapidly cooled through a cooling water channel.

[0056] like Figure 1 As shown, in this embodiment, the lifting device includes: a balance bar 3, a transmission assembly 9, and a lifting drive assembly 10. The balance bar 3 is vertically mounted on the top of the water tank 5. One end of the transmission assembly 9 is slidably connected to the balance bar 3, and the other end of the transmission assembly 9 is connected to the lifting drive assembly 10. The hollow main shaft 4 is connected to the transmission assembly 9. Under the drive of the lifting drive assembly 10, the transmission assembly 9 drives the hollow main shaft 4 to reciprocate up and down.

[0057] like Figure 11As shown, in this embodiment, the transmission component 9 includes a moving block 91 and a connecting rod 92. One end of the moving block 91 is slidably connected to the balance bar 3 through an opening, and the other end of the moving block 91 is connected to the lifting drive component 10 through the connecting rod 92. The hollow main shaft 4 passes through the opening in the middle of the moving block 91.

[0058] In this embodiment, a transmission assembly 9 is formed by a moving block 91 and a connecting rod 92. The moving block 91 is connected to the hollow main shaft 4 in the middle, which can drive the hollow main shaft 4 to move up and down. One end of the moving block 91 is connected to the balance bar 3, which can stabilize the movement direction of the hollow main shaft 4. The other end of the moving block 91 is connected to the connecting rod 92, which can transmit motion. Furthermore, a bellows 8 is provided at the upper end of the hollow main shaft 4 to ensure the vacuum level of components such as the heating device 6 in the vacuum chamber.

[0059] like Figure 12 As shown, in this embodiment, the lifting drive assembly 10 includes a cam 101, a drive motor 102, and a fixed base 103. The fixed base 103 is disposed on the top of the water tank 5, and the drive motor 102 is disposed on the upper part of the fixed base 103. The cam 101 is connected to the output end of the drive motor 102, and the side of the cam 101 is engaged with the bottom of the connecting rod 92. Under the drive of the drive motor 102, the cam 101 rotates, and the connecting rod 92 rolls along the side of the cam 101 to realize the reciprocating lifting of the hollow main shaft 4.

[0060] In this embodiment, the cam 101 is composed of three arc segments, with two ends being arcs of different radii and a middle arc tangent to both ends. This allows the bottom of the connecting rod 92 to move along the side of the cam 101 between the two arc segments, and the stroke of the hollow main shaft 4 can be adjusted by adjusting the size of the arc segments at both ends. By using the three tangent arc segments to form the cam 101, combined with the transmission component 9 and the balance bar 3, a lifting device with adjustable stroke, definite direction, and precise movement is formed, which also has the advantages of simple structure and low cost.

[0061] Example 2

[0062] like Figure 14 As shown, the present invention provides a substrate heating coating method based on the high-temperature substrate in Example 1, comprising the following steps:

[0063] S1. Open the water valve in the water tank 5 to circulate and cool the sides and bottom of the heating device 6, and ensure that there is enough cooling water stored in the cooling plate 7.

[0064] S2. When the vacuum level of the vacuum chamber meets the preset requirements, the substrate disk 1 is moved to the predetermined position by the lifting device, and then the substrate is placed on the substrate disk 1 by the substrate loading and unloading system. Then, the substrate is fixed by the cooperation of the ejector pin and the movable positioning groove 11 to achieve center alignment between the substrate and the substrate disk 1.

[0065] S3. Determine the temperature required for the current coating process according to the coating process. First, determine the heating power of the main heater 61. After the main heater 61 is running stably, measure the temperature distribution in different areas on the substrate disk 1. Then, determine the heating power of the auxiliary heater 63. After fine adjustment, make the temperature in all places on the substrate disk 1 basically the same.

[0066] S4. Open the gas valve connected to the inlet pipe 41 to deliver back-pressure process gas, and control the flow rate and leakage of the process gas to ensure that the back-pressure process gas is evenly distributed in the gas storage groove 16 of the substrate disk 1, so as to improve the temperature uniformity of the coating area on the substrate surface. Determine the delivery speed of the process gas according to the leakage of the back-pressure gas to keep the concentration and pressure of the process gas in the vacuum chamber in line with the process requirements.

[0067] S5. Perform the coating process; after the process is completed, first turn off the main heater 61 and the auxiliary heater 63, then turn off the process gas, then fill the vacuum chamber with gas to restore atmospheric pressure, and loosen the connection between the ejector pin and the movable positioning groove 11. Take out the coated substrate from the substrate plate. After the heating device 6 cools to the preset temperature, turn off the cooling cycle to end one coating process.

[0068] In this embodiment, the heating device is first cooled by a cooling system to ensure stable operation. Once the preset vacuum level is reached, the substrate disk is moved to a preset position within the vacuum chamber via a lifting device. After the substrate is placed on the substrate disk, it is fixed using a positioning groove, achieving a stable connection between the substrate and the substrate groove and preventing the substrate from shifting during the coating process. The heating power of the main heater and auxiliary heater is adjusted according to the preset coating temperature to ensure that the temperature is basically uniform across the substrate disk. Combined with the back pressure gas, uniform heating is achieved across the substrate, ultimately resulting in high-quality coating of the substrate.

[0069] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, without departing from the spirit and technical essence of the invention. Therefore, any simple modifications, equivalent substitutions, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention, shall still fall within the scope of protection of the present invention.

Claims

1. A high-temperature base, characterized in that, include: The device comprises a substrate disk (1), a hollow spindle (4), a pressure regulating assembly, a lifting device, a heating device (6), and a cooling device. The substrate disk (1) is used to support the substrate. The heating device (6) is located at the bottom of the substrate disk (1) and is used to heat the substrate. The substrate disk (1) is equipped with a pressure regulating assembly, and the process gas provided by the pressure regulating assembly is filled between the substrate and the substrate disk (1) to achieve uniform heating of the substrate. The cooling device includes an external cooling pipe (2), a water tank (5), and a cooling plate (7). The cooling plate (7) is located at the bottom of the heating device (6), and the external cooling pipe (2) surrounds the heating device. The cooling water in the water tank (5) flows through the heating device (6), the outer cooling pipe (2), and the cooling plate (7) in sequence before circulating back to the water tank (5); the top of the hollow spindle (4) is fixedly connected to the bottom of the cooling plate (7), the bottom of the hollow spindle (4) is located on the water tank (5), and the hollow spindle (4) is connected to the lifting device set on the top of the water tank (5). Under the drive of the lifting device, the hollow spindle (4) reciprocates and lifts, and drives the cooling plate (7) and the heating device (6) to reciprocate and lift, so as to realize that the substrate disk (1) is lifted and lowered to the preset coating position in the vacuum cavity; The heating device (6) includes: a mounting plate (60), a main heater (61) and an auxiliary heater (63). A plurality of the main heaters (61) are embedded in the bottom of the mounting plate (60) in a ring arrangement, and a plurality of the auxiliary heaters (63) are embedded in the top of the mounting plate (60) in a ring arrangement. An annular inner cooling pipe (62) is also embedded in the bottom of the mounting plate (60). The main heaters (61) and the inner cooling pipes (62) are arranged at intervals. The third inlet (64) on the inner cooling pipe (62) is connected to the water tank (5), and the third outlet (65) on the inner cooling pipe (62) is connected to the outer cooling pipe (2). The auxiliary heaters (63) are arranged in a position corresponding to the inner cooling pipes (62). The auxiliary heaters (63) are used to compensate for heating the interval area between adjacent main heaters (61). The substrate disk (1) has multiple arc-shaped platforms (14) on its edge. The arc-shaped platforms (14) have multiple positioning grooves (11). The positioning grooves (11) include fixed positioning grooves and movable positioning grooves. The outer side of the substrate is placed on the arc-shaped platforms (14) and is fixedly connected to the positioning grooves (11).

2. The high-temperature base according to claim 1, characterized in that, The pressure regulating component includes: a gas groove (12), an air inlet (13), a gas storage groove (16), and an air inlet pipe (41). The air inlet pipe (41) passes through the hollow main shaft (4) and connects to the substrate disk (1). Multiple gas grooves (12) are evenly distributed on the substrate disk (1), and the gas grooves (12) are connected to the air inlet (13). Multiple gas storage grooves (16) are also evenly distributed on the substrate disk (1), and adjacent gas grooves (12) form a gas storage groove (16). The process gas transported by the air inlet pipe (41) and the air inlet (13) diffuses through the gas grooves (12) and is evenly distributed in the gas storage groove (16), so as to achieve uniform back pressure gas distribution between the substrate and the substrate disk (1).

3. The high-temperature base according to claim 1, characterized in that, The embedding depth of the inner cooling pipe (62) is less than that of the main heater (61), and the embedding depth of the auxiliary heater (63) is the same as that of the main heater (61).

4. The high-temperature base according to claim 1, characterized in that, The cooling plate (7) is provided with an annular main heating filler block (71) at the top. The main heating filler block (71) matches the main heater (61) and is used to fill the pit on the bottom surface of the main heater (61). The main heating filler block (71) is provided with a water pipe channel (73) that matches the inner cooling pipe (62). The bottom edge of the cooling plate (7) is provided with a fourth water inlet (72) that communicates with the outer cooling pipe (2). The top middle of the cooling plate (7) is provided with a fourth water outlet (74) that communicates with the water tank (5). The cooling water enters from the bottom and exits from the top in the water pipe channel (73).

5. The high-temperature base according to claim 4, characterized in that, The external cooling pipe (2) is arranged in a ring below the heating device (6). The external cooling pipe (2) is provided with a first water inlet (22) and a first water outlet (23). The first water inlet (22) is connected to the third water outlet (65), and the first water outlet (23) is connected to the fourth water inlet (72).

6. The high-temperature base according to any one of claims 1 to 5, characterized in that, The lifting device includes: a balance bar (3), a transmission assembly (9) and a lifting drive assembly (10). One end of the transmission assembly (9) is slidably connected to the balance bar (3), and the other end of the transmission assembly (9) is connected to the lifting drive assembly (10). The hollow main shaft (4) is connected to the transmission assembly (9). Under the drive of the lifting drive assembly (10), the transmission assembly (9) moves the hollow main shaft (4) up and down.

7. The high-temperature base according to claim 6, characterized in that, The transmission assembly (9) includes a moving block (91) and a connecting rod (92). One end of the moving block (91) is slidably connected to the balance bar (3), and the other end of the moving block (91) is connected to the lifting drive assembly (10) through the connecting rod (92). The hollow main shaft (4) passes through the middle of the moving block (91).

8. The high-temperature base according to claim 7, characterized in that, The lifting drive assembly (10) includes a cam (101), a drive motor (102), and a fixed base (103). The fixed base (103) is located on the top of the water tank (5), and the drive motor (102) is located on the upper part of the fixed base (103). The cam (101) is connected to the output end of the drive motor (102), and the side of the cam (101) is connected to the bottom of the connecting rod (92). Under the drive of the drive motor (102), the cam (101) rotates, and the connecting rod (92) rolls along the side of the cam (101) to realize the reciprocating lifting of the hollow main shaft (4).

9. A method for substrate heating and coating based on a high-temperature substrate according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1. Open the water valve in the water tank (5) to circulate and cool the side and bottom of the heating device (6), and ensure that there is cooling water stored in the cooling plate (7); S2. When the vacuum level of the vacuum chamber meets the preset requirements, the substrate disk (1) is moved to the predetermined position by the lifting device, and then the substrate is placed on the substrate disk (1) by the substrate loading and unloading system. The substrate is then fixed by aligning the center of the substrate disk (1) with the positioning groove (11). S3. Determine the temperature required for the current coating process according to the coating process. First, determine the heating power of the main heater (61). After the main heater (61) is running stably, measure the temperature distribution of different areas on the substrate disk (1). Then determine the heating power of the auxiliary heater (63). After adjustment, make the temperature on the substrate disk (1) uniform. S4. Open the gas valve connected to the inlet pipe (41) to deliver the process gas, and control the flow rate and leakage of the process gas to ensure that the back pressure process gas is evenly distributed in the gas storage groove (16) of the substrate disk (1). S5. Perform the coating process. After the process is completed, first turn off the main heater (61) and auxiliary heater (63), then turn off the process gas, then fill the vacuum chamber with gas to restore atmospheric pressure, and loosen the connection between the substrate and the positioning groove (11). Take out the coating substrate, and after the heating device (6) cools to the preset temperature, turn off the cooling cycle to end one coating process.

Images