Substrate handling apparatus and substrate handling method

Abstract

A substrate transport apparatus includes: a transport unit that transports a substrate from an inlet end of a transport path to a predetermined stop position; a substrate sensor that projects detection light onto the substrate at a predetermined position on the transport path closer to the inlet end than the stop position, and detects the presence or absence of the substrate at the predetermined position based on the amount of light transmitted or reflected; a setting unit that, when the transport unit transports the substrate, sets a subsequent transport distance to the stop position at the moment when the detection result of the substrate sensor changes from "no substrate" to "substrate present" and back to "no substrate"; a monitoring unit that monitors whether the detection result changes back to "substrate present" before the substrate reaches the stop position; and a reset unit that, if the detection result changes back to "substrate present", resets the set transport distance and resets the subsequent transport distance at the moment when the detection result changes back to "no substrate".

Description

Technical Field

[0001] This specification relates to a substrate transport apparatus and a substrate transport method for transporting a substrate to a predetermined stop position on a transport path. Background Technology

[0002] The technology of mass-producing substrate products by performing substrate-mounting operations on substrates with printed wiring is becoming increasingly common. Furthermore, multiple substrate-mounting machines are typically arranged to form a substrate-mounting production line. Generally, a substrate-mounting machine includes a substrate transport device. This device transports substrates brought in from the upstream side of the production line to a predetermined stop position on the transport path, and then transports the substrates, after substrate-mounting operations have been performed at the stop position, to the downstream side of the production line. Most substrate transport devices are equipped with substrate passing sensors that detect the position of the transported substrates. Patent Document 1 discloses a technical example related to such a substrate transport device.

[0003] The substrate detection sensor disclosed in Patent Document 1 compares the level of the light-receiving signal with a first threshold when it determines that there is "no substrate," and determines that there is "substrate present" when the level is below the first threshold. Furthermore, when it determines that there is "substrate present," the substrate detection sensor compares the level of the light-receiving signal with a second threshold that is higher than the first threshold, and determines that there is "no substrate present" when the level is above the second threshold. Therefore, even if the substrate moves from a predetermined position due to vertical vibration after determining that there is a substrate, the determination of "substrate present" is maintained, reducing false detections of substrate position changes.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-183630 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in the prior art, beginning with the substrate detection sensor in Patent Document 1, detection light is projected onto the substrate, and the presence or absence of the substrate is detected based on changes in the amount of light transmitted or reflected. However, in slit substrates with gaps, the amount of light transmitted at the gaps temporarily increases, or the amount of light reflected decreases, making it difficult to accurately detect the presence or absence of the substrate. Furthermore, the area of ​​the substrate blocking the detection light may change during transport due to warping or other deformations, potentially leading to misjudgments of the substrate's presence or absence.

[0009] As a countermeasure to the aforementioned problems, timers have been conventionally used to avoid the influence of temporary fluctuations in the amount of light transmitted or reflected. That is, if the duration of the temporary fluctuation is less than the timer duration, the fluctuation is ignored, thereby avoiding false detections caused by gaps in the slotted substrate, warped portions of the substrate, etc. Furthermore, due to the timer setting, the detection delay at the rear end of the substrate is a corresponding amount to the distance obtained by multiplying the timer time by the substrate's transport speed; therefore, the subsequent transport distance after reaching the predetermined stop position is adjusted (offset distance adjustment).

[0010] Even with such timer settings and transport distance adjustments, it is difficult to eliminate erroneous stops of the substrate assembly machine and reduced accuracy of the substrate's stopping position caused by transport abnormalities. Furthermore, since the timer settings and transport distance adjustments vary depending on the type of substrate and require individual adjustments to multiple substrate assembly machines constituting the substrate assembly line, operators expend a significant amount of time.

[0011] Therefore, the problem to be solved in this specification is to provide a substrate handling apparatus and a substrate handling method that, compared with the past, can reduce the erroneous stops of the substrate handling machine caused by handling abnormalities and the decrease in the accuracy of the substrate stopping position.

[0012] Technical solutions for solving the problem

[0013] This specification discloses a substrate transport apparatus comprising: a transport unit that transports a substrate from an inlet end of a transport path to a predetermined stop position; a substrate sensor that projects detection light onto the substrate at a predetermined position on the transport path closer to the inlet end than the stop position, and detects the presence or absence of the substrate at the predetermined position based on the amount of light transmitted or reflected; a setting unit that, when the transport unit transports the substrate, sets a subsequent transport distance to the stop position at the moment when the detection result of the substrate sensor changes from "no substrate" to "substrate present" and back to "no substrate"; a monitoring unit that monitors whether the detection result changes back to "substrate present" before the substrate reaches the stop position; and a reset unit that, if the detection result changes back to "substrate present", resets the set transport distance and resets the subsequent transport distance at the moment when the detection result changes back to "no substrate".

[0014] Furthermore, this specification discloses a substrate handling method executed by a control unit in a substrate handling apparatus. The substrate handling apparatus includes: a handling unit that handles a substrate from an inlet end of a handling path to a predetermined stop position; a substrate passing through a sensor that projects detection light onto the substrate at a predetermined position on the inlet side of the handling path, which is closer to the stop position than the inlet end, and detects whether the substrate is present at the predetermined position based on the amount of light transmitted or reflected; and a control unit that controls the handling unit based on the detection result of the substrate passing through the sensor. Specifically, when the handling unit handles the substrate, at the moment when the detection result changes from "no substrate" to "substrate present" and back to "no substrate," the control unit sets a subsequent handling distance to the stop position. Before the substrate reaches the stop position, it monitors whether the detection result changes back to "substrate present," and if the detection result changes back to "substrate present," it resets the set handling distance and resets the subsequent handling distance when the detection result subsequently changes back to "no substrate."

[0015] Invention Effects

[0016] In the substrate handling apparatus and method disclosed in this specification, when the substrate's detection result by the sensor changes from "no substrate" through "with substrate" back to "no substrate," it is determined to be the rear end of the substrate, and a subsequent handling distance is set. Furthermore, if the detection result changes back to "with substrate," and then changes back to "no substrate," the determination of the substrate's rear end is corrected, and the set handling distance is reset, thus resetting the subsequent handling distance. Therefore, even if the rear end is incorrectly determined due to the presence of gaps in the slotted substrate or warped portions of the substrate, the subsequent handling distance can be reset when the true rear end of the substrate is subsequently determined. Consequently, the detection accuracy of the substrate's rear end is improved compared to conventional methods, resulting in reduced erroneous stops of the substrate handling machine and decreased accuracy of the substrate's stopping position caused by handling anomalies compared to conventional methods. Attached Figure Description

[0017] Figure 1 This is a top view showing the overall structure of the component mounting machine using the substrate handling apparatus of the first embodiment.

[0018] Figure 2 This is a schematic top view of the substrate handling apparatus according to the first embodiment.

[0019] Figure 3 This is a schematic side view of the substrate handling apparatus according to the first embodiment.

[0020] Figure 4This is a block diagram illustrating the control structure of the substrate handling device.

[0021] Figure 5 This is a diagram illustrating the operation flow of the substrate handling device.

[0022] Figure 6 This is a top view showing the state of the rear end of a typical substrate reaching the designated position (inlet end) of the transport path.

[0023] Figure 7 This is a top view showing the typical state where the substrate stops at the stop position on the transport path.

[0024] Figure 8 This is a top view showing the state before the transfer of the slotted substrate begins.

[0025] Figure 9 It is a top view showing the state in which the rear edge of the small substrate on the front side of the slotted substrate reaches the designated position (inlet end) of the transport path.

[0026] Figure 10 This is a top view showing the state in which the leading edge of the small substrate on the rear side of the slotted substrate reaches the designated position (inlet end) of the transport path.

[0027] Figure 11 This is a top view showing the state of the rear end of the slotted substrate reaching the designated position (inlet end) of the transport path.

[0028] Figure 12 This is a top view showing the state where the slotted substrate stops at the stop position of the transport path.

[0029] Figure 13 This is a schematic top view of the substrate handling apparatus according to the second embodiment.

[0030] Figure 14 This is a side view schematically showing the state of the warped substrate during transport in the second embodiment.

[0031] Figure 15 This is a schematic front view of the substrate handling apparatus according to the third embodiment. Detailed Implementation

[0032] 1. Overall structure of component mounting machine 1

[0033] First, refer to Figure 1 The overall structure of the component mounting machine 1, which utilizes the substrate handling apparatus 2 of the first embodiment, will be described. The component mounting machine 1 performs component mounting operations on the substrate K. A solder printer or similar device is positioned upstream of the component mounting machine 1, and a substrate inspection machine or similar device is positioned downstream, thus forming a substrate processing line. Figure 1The direction from the left side of the paper to the right is the X-axis direction for transporting substrate K, and the direction from the bottom (front) side of the paper to the top (rear) side of the paper is the Y-axis direction. The component mounting machine 1 comprises a substrate transport device 2, a component supply device 3, a component transfer device 4, a component identification camera 49, and a control device 5 (see reference 5). Figure 4 It is composed of components such as ) assembled on base 10.

[0034] The substrate transport device 2 includes a pair of guide rails 21. The pair of guide rails 21 extend along the X-axis on the base 10, are parallel to each other, and are separated in the Y-axis direction. The separation distance between the pair of guide rails 21 can be adjusted according to the width of the substrate K. The pair of guide rails 21 and the space between them constitute the transport path of the substrate K. The substrate transport device 2 transports the horizontally positioned substrate K from the loading end 22 of the guide rails 21 (transport path) to a predetermined stop position PS (see reference). Figure 2 The positioning mechanism (not shown) located below the stop position PS is used to position and release the substrate K. Details regarding the substrate transport device 2 will be described later.

[0035] The component supply device 3 consists of multiple feeders 31 arranged side by side in the X-axis direction. Each feeder 31 feeds a carrier belt containing a large number of components in a row to the supply position 32 at the front end. The carrier belt supplies the components at the supply position 32 in a pick-up manner.

[0036] The component transfer device 4 comprises a Y-axis moving body 41, an X-axis moving body 42, a mounting head 43, an automatic tool 44, a suction nozzle 45, a substrate recognition camera 46, and a side-view camera 47. The Y-axis moving body 41 is driven by a linear motion mechanism to move in the Y-axis direction. The X-axis moving body 42 is mounted on the Y-axis moving body 41 and is driven by a linear motion mechanism to move in the X-axis direction. The mounting head 43 is mounted to a clamping mechanism (not shown) provided on the front surface of the X-axis moving body 42 and moves together with the X-axis moving body 42 in both horizontal directions.

[0037] An automatic tool 44 is rotatably mounted on the underside of the mounting head 43. Multiple (in) replaceable parts are held on the underside of the automatic tool 44. Figure 1 (In this example, there are 12) suction nozzles 45. The suction nozzles 45 are driven to rise and fall by a lifting drive mechanism (not shown), and are selectively supplied with negative or positive pressure air by an air supply mechanism (not shown). The suction nozzles 45 pick up and hold components from the supply position 32 of the component supply device 3, and mount the components onto the substrate K. The mounting head 43, automatic tool 44, and suction nozzles 45 can be replaced by an operator or automatically. In the case of an automatic replacement structure, a replacement station is provided on the upper surface of the base 10, and replacement equipment is prepared.

[0038] A substrate recognition camera 46 is arranged side-by-side with the mounting head 43 on the X-axis moving body 42. The substrate recognition camera 46 is configured with its optical axis facing downwards to capture images of the position reference mark attached to the substrate K from above. The acquired image data is processed to accurately determine the stopping position of the substrate K. A side-view camera 47 is located on the front side of the automatic tool 44 below the mounting head 43. The side-view camera 47 captures and recognizes the component held in the suction nozzle 45 and the lower part of the suction nozzle 45 from the side. As the substrate recognition camera 46 and the side-view camera 47, examples can be shown of digital imaging devices with imaging elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor).

[0039] A component identification camera 49 is mounted on a base 10 between the substrate transport device 2 and the component supply device 3. The component identification camera 49 is configured with its optical axis facing upwards. The component identification camera 49 captures and identifies the component held in the suction nozzle 45 from below as the mounting head 43 moves from the component supply device 3 to the substrate K. Examples of component identification cameras 49 include digital imaging devices with imaging elements such as CCD and CMOS.

[0040] The control device 5 is assembled on the base 10, and its placement is not particularly limited. The control device 5 is constructed using a computer device with a CPU and operates via software. Alternatively, the control device 5 can be configured with multiple CPUs distributed within the device and interconnected. Based on the operation data for each type of substrate K, the control device 5 controls the substrate handling device 2, the component supply device 3, the component transfer device 4, and the component identification camera 49 to advance the component installation operation. The operation data describes the detailed process and implementation method of the installation operation.

[0041] 2. Structure of the substrate transport device 2 according to the first embodiment

[0042] Moving on to the description of the substrate transport apparatus 2 according to the first embodiment. In addition to the pair of guide rails 21 described above, the substrate transport apparatus 2 also includes a transport unit 6, a substrate passing sensor 7, and a transport control unit 8. (As...) Figure 2 As shown, a predetermined stop position PS is set at the center of the transport direction (X-axis direction) of a pair of guide rails 21 (transport path) to stop the substrate K. Figure 3 As shown, the conveying unit 6 has a conveyor belt 61 independently arranged relative to each guide rail 21, two support pulleys (62, 63), a tension pulley 64, and a drive pulley 65. Furthermore, the conveying unit 6 also has a drive motor 66 shared with the two drive pulleys 65.

[0043] The conveyor belt 61 is formed into a seamless loop using a flexible, strip-shaped component. The conveyor belt 61 is embedded in a groove formed in the guide rail 21 and is held in a rotating manner (see reference). Figure 15 The substrate K is horizontally positioned, spanning the upper surfaces of the two conveyor belts 61. A support pulley 62 is rotatably mounted at the feed end 22 of the guide rail 21. A support pulley 63 is rotatably mounted at the discharge end 23 of the guide rail 21. The two support pulleys (62, 63) support the conveyor belts 61 in a rotating manner.

[0044] The tension pulley 64 is rotatably positioned below the support pulley 62 on the input end 22 side. The tension pulley 64 is tensioned by a force-applying mechanism (not shown) to provide tension to the conveyor belt 61 and prevent slack. The drive pulley 65 is positioned below the support pulley 63 on the output end 23 side and engages with the conveyor belt 61. The conveyor belt 61 is supported by the aforementioned four pulleys and moves towards... Figure 3 The wheels rotate clockwise. The drive motor 66 drives the two drive pulleys 65 to rotate at the same speed via a transmission mechanism (not shown).

[0045] Thus, the two drive pulleys 65 drive the conveyor belts 61 to rotate. The two conveyor belts 61 transport the substrate K. The drive motors 66 are pulse motors, stepper motors, or similar motors with good controllability. Therefore, the transport speed and transport distance of the substrate K can be freely adjusted, and the accurate transport distance of the substrate K can be obtained.

[0046] The substrate is detected by sensor 7 to determine whether substrate K is present at a predetermined position. In the first embodiment, the predetermined position is set to coincide with the loading end 22 of the guide rail 21 (transport path). However, this is not a limitation; the predetermined position can also be a position further forward from the loading end 22 towards the stop position PS, provided it is a position closer to the loading end 22 than the stop position PS. In the first embodiment, the substrate is detected by sensor 7 using a vertically projected detection light DL, and the presence or absence of substrate K is determined based on the amount of light DL passing through it.

[0047] The substrate is connected to the light-emitting part 71, the light-receiving part 72, and the determination part 73 via the sensor 7 (see reference). Figure 4 ) constitutes. For example Figure 3 As shown, the light-emitting unit 71 is positioned above the loading end 22. The light-emitting unit 71 projects a vertically downward detection light DL onto the substrate K, which is in a horizontal position passing through the loading end 22. The light-emitting unit 71 remains lit throughout the entire operating period of the component mounting machine 1.

[0048] On the other hand, the light-receiving part 72 is positioned on the opposite side of the light-projecting part 71, separated from the substrate K; in other words, it is positioned below the receiving end 22. The light-receiving part 72 detects the amount of detection light DL passing through it. The amount of detection light DL passing through the receiving end 22 is greater when there is no substrate K, and decreases or disappears when there is substrate K. Alternatively, the arrangement of the light-projecting part 71 and the light-receiving part 72 can be reversed vertically, with the light-projecting part 71 projecting the vertically upward detection light DL.

[0049] The determination unit 73 receives information about the amount of light DL passing through the light receiving unit 72. The determination unit 73 determines "no substrate" if the amount of light passing through is above a predetermined threshold, and determines "substrate present" if the amount of light passing through is below the threshold. The predetermined threshold is determined in advance considering various conditions, including the performance of the light-emitting unit 71 and the light receiving unit 72, performance changes over time, configuration tolerances, and light transmittance depending on the material and thickness of the substrate K. The determination unit 73 outputs the determination result to the transport control unit 8. The determination result of the determination unit 73 is equivalent to the detection result of the substrate passing through the sensor 7. Furthermore, the determination unit 73 may be integrated with the light receiving unit 72, or it may be located within the transport control unit 8.

[0050] 3. Control structure of substrate handling device 2

[0051] Next, refer to Figure 4 The control structure of the substrate transport apparatus 2 will be described. The transport control unit 8 is configured using a computer device. The transport control unit 8 controls the transport of the substrate K based on instructions from the upper control device 5 connected via a communication link, and reports the control status to the control device 5. As will be described in detail later, the transport control unit 8 executes the substrate transport method of the embodiment.

[0052] The transport control unit 8 receives the determination result from the determination unit 73 of the substrate sensor 7, and controls the drive motor 66 of the transport unit 6 based on the determination result. Additionally, the transport control unit 8 may also have control functions for the illumination unit 71, such as adjusting the brightness of the detected light DL. The transport control unit 8 can calculate the transport distance of the substrate K based on the operation history of the drive motor 66. Furthermore, the transport control unit 8 identifies the arrival of the substrate K at the stop position PS based on the determination result of the determination unit 73 and the transport distance calculated according to the operation history of the drive motor 66. Various known methods can be applied as control methods for the drive motor 66, such as a smooth deceleration control method that prevents the substrate K from rapidly stopping at the stop position PS.

[0053] The transport control unit 8 has four control function units configured using software: a setting unit 81, a monitoring unit 82, a reset unit 83, and an anomaly detection unit 84. The four control function units operate in parallel with the transport action of the transport unit 6.

[0054] When the transfer unit 81 moves the substrate K in the transfer unit 6, at the moment when the determination result of the determination unit 73 of the substrate passing through the sensor 7 changes from "no substrate" to "with substrate" and back to "no substrate", the setting unit 81 sets the subsequent transfer distance D1 for moving the substrate K to the stop position PS. The change in determination result from "no substrate" to "with substrate" means that the front end of the substrate K has reached the loading end 22. Furthermore, the moment when the determination result changes from "with substrate" to "no substrate" corresponds to the moment when the rear end of the substrate K normally passes through the loading end 22. Here, "normal substrate K" means a regular rectangular substrate K without gaps. Therefore, the transfer distance D1 represents the distance that should be moved after the rear end of the substrate K passes through the loading end 22 (see reference). Figure 6 , Figure 7 ).

[0055] The monitoring unit 82 operates no later than immediately after the setting unit 81 sets the transport distance D1. The monitoring unit 82 monitors whether the determination result of the determination unit 73 changes back to "substrate present" until the substrate K reaches the stop position PS. The monitoring unit 82 stores the case where the determination result changes back to "substrate present" by resetting the flag. The case where the determination result of the determination unit 73 changes back to "substrate present" does not occur with a normal substrate K, but does occur with the slotted substrate KB (see below). Figure 8 This occurs during the process. In the first embodiment, the monitoring unit 82 operates independently of the setting unit 81, continuously monitoring changes in the determination result of the determination unit 73.

[0056] The reset unit 83 operates when the monitoring unit 82 detects that the determination result of the determination unit 73 has changed back to "substrate present". In other words, the reset unit 83 operates when the reset flag is set during the transport of the slotted substrate KB. When the determination result of the determination unit 73 changes from "substrate present" to "substrate absent" again, the reset unit 83 resets the set transport distance. Furthermore, the reset unit 83 resets the subsequent transport distance D1. The term "reset" means that although the initially set transport distance D1 is gradually corrected to a smaller value as the substrate K is transported after the setting operation of the setting unit 81, the reduced transport distance is reset, and the same transport distance D1 as the initial value is set again at the current moment.

[0057] The anomaly determination unit 84 determines whether there is any anomaly related to the transport of substrate K. Based on the operation history of the drive motor 66 of the transport unit 6 and the determination result of the determination unit 73 of the substrate passing sensor 7, the anomaly determination unit 84 calculates the estimated length of the transport direction of substrate K. Specifically, the anomaly determination unit 84 calculates the first moment when the determination result of the determination unit 73 changes from "no substrate" to "substrate present," and the second moment when it changes from "substrate present" to "no substrate." In other words, the anomaly determination unit 84 calculates the first moment when the front end of substrate K passes through the loading end 22 and the second moment when the rear end of substrate K passes through the loading end 22.

[0058] Furthermore, the anomaly determination unit 84 calculates the transport distance of the substrate K carried by the drive motor 66 from the first moment to the second moment, and uses it as the estimated length of the substrate K. The anomaly determination unit 84 compares this estimated length with the known length LK of the transport direction of the substrate K stored in advance, and determines that there is an anomaly if the length error exceeds a predetermined tolerance value. Thus, it is possible to detect anomalies such as two substrates K being transported in a state of contact in the transport direction, and anomalies such as a component extending backward from the substrate K being mistakenly detected as the rear end of the substrate K.

[0059] The functions and operations of the setting unit 81, monitoring unit 82, and reset unit 83 will be described in detail later in the explanation of the operation of the substrate transport device 2. On the other hand, the anomaly determination unit 84 is not a necessary component and can be omitted. The anomaly determination unit 84 can determine whether there is an anomaly during the operation of the substrate transport device 2, when the substrate is detected by the sensor 7 at the rear end of the substrate K.

[0060] 4. Transport distance D1 (D2, D3)

[0061] Next, refer to Figure 2 , Figure 7 The aforementioned transport distance D1 will be explained. As described above, a stop position PS, indicated by a dashed line, is set at the center of the X-axis direction of the guide rail 21 (transport path). The separation distance between the stop position PS and the loading end 22 (prescribed position) is D0. On the other hand, the length of the substrate K in the transport direction is LK. In addition, the midpoint PK of the substrate K in the transport direction is indicated by a dashed line. The separation distance D0 and the length LK of the substrate K are known, and the transport distance D1 is calculated in advance before the transport operation begins.

[0062] In the first embodiment, the substrate K is stopped so that its intermediate position PK overlaps with the stop position PS (see reference). Figure 7 In this case, the transport distance D1 is calculated using the following formula (1).

[0063] The transport distance D1 = D0 - (LK / 2)……(1)

[0064] That is, the transport distance D1 is the distance obtained by subtracting half of the length LK of the transport direction of the substrate K from the separation distance D0 between the stop position PS and the specified position (transport end 22).

[0065] In addition, when stop control is performed so that the rear end of the substrate K overlaps with the stop position PS, the transport distance D2 is calculated by the following formula (2).

[0066] The transport distance D2 = D0…………………………………(2)

[0067] That is, the transport distance D2 is the same as the separation distance D0 between the stop position PS and the specified position (transport end 22).

[0068] In addition, when stop control is performed so that the front end of the substrate K overlaps with the stop position PS, the transport distance D3 is calculated by the following formula (3).

[0069] The transport distance D3 = D0 - LK……………………(3)

[0070] That is, the transport distance D3 is the distance obtained by subtracting the length LK of the transport direction of the substrate K from the separation distance D0 between the stop position PS and the specified position (transport end 22).

[0071] 5. Slotted substrate KB

[0072] Next, refer to Figure 8 The structure of the slotted substrate KB will be described. The slotted substrate KB consists of a frame portion KF in the shape of a border and two small substrate pieces (K1, K2). Each of the small substrate pieces (K1, K2) is attached to the inside of the frame portion KF at three locations. After the production of the slotted substrate KB is completed, each of the small substrate pieces (K1, K2) is cut off from the frame portion KF for individual use.

[0073] The length of the slotted substrate KB in the transport direction is LB. For the slotted substrate KB, the length LB can also be applied to equations (1), (2), and (3) to calculate the subsequent transport distances (D1, D2, D3). A gap KG is formed between the small substrate K1 on the front side and the small substrate K2 on the rear side in the transport direction of the slotted substrate KB. Furthermore, the slotted substrate KB may have three or more small substrates and multiple gaps KG. In the prior art, it is possible to mistakenly detect the trailing edge of the front small substrate K1 as the rear end of the slotted substrate KB. The first embodiment eliminates this possibility of misdetection.

[0074] 6. Operation of substrate handling device 2

[0075] Next, refer to Figures 5-12 The operation of the substrate handling device 2 will be explained. Figure 5 This describes the operation flow of the substrate handling device 2. Figure 6 and Figure 7 This represents an example of a typical action involving the handling of substrate K. Figures 8-12 This describes an example of a movement involving the transfer of the slotted substrate KB. In the initial state before the transfer operation begins, the reset flag used by the monitoring unit 82 is in a reset state.

[0076] First, the operation for handling a typical substrate K will be explained. Figure 5 In step S1, the transport control unit 8 initiates the transport operation of the transport unit 6. Afterward, the transport unit 6 automatically continues the transport operation of the substrate K. On the other hand, the transport control unit 8 repeats the series of operations following step S2 in each control cycle. In step S2, the transport control unit 8 obtains the determination result (hereinafter simply referred to as the "determination result") from the determination unit 73; in other words, it obtains the detection result of the substrate passing through the sensor 7.

[0077] In the next step S3, the monitoring unit 82 checks whether the previous determination result was "no substrate" and whether the current determination result has changed to "substrate present". If the monitoring unit 82 has changed as described above, the execution of the operation flow proceeds to step S4; otherwise, the execution of the operation flow proceeds to step S11. In step S11, the monitoring unit 82 checks whether the previous determination result was "substrate present" and whether the current determination result has changed to "no substrate". If the monitoring unit 82 has changed as described above, the execution of the operation flow proceeds to step S12; otherwise, the execution of the operation flow proceeds to step S15.

[0078] In step S15, the monitoring unit 82 checks whether the substrate K has reached the stop position PS. If it has not reached it, the monitoring unit 82 returns the execution of the operation flow to step S2. At the initial stage of starting the transport of substrate K, the leading edge of substrate K has not reached the loading end 22. Therefore, the transport control unit 8 obtains a "no substrate" determination result each time step S2 is executed. Thus, the operation cycle consisting of steps S2, S3, S11, and S15 is repeatedly executed.

[0079] When the front end of substrate K reaches the loading end 22, in step S2, the transport control unit 8 obtains a "substrate present" determination result. Therefore, the execution of the operation flow exits the operation loop from step S3 and proceeds to step S4. In step S4, the monitoring unit 82 determines whether this is the first operation (whether step S4 is being executed for the first time). If it is the first operation, the monitoring unit 82 returns the execution of the operation flow to step S2. Since the arrival of the front end of substrate K at the loading end 22 is the first operation, the execution of the operation flow returns to step S2.

[0080] Subsequently, during the passage of substrate K through the loading end 22, the transport control unit 8 obtains a "substrate present" determination result each time step S2 is executed. This process is repeated in the aforementioned operation cycle. Figure 6 As shown, when the rear end of the substrate K reaches the loading end 22, in step S2, the transport control unit 8 obtains a "no substrate" determination result. As a result, the execution of the operation process leaves the operation loop in step S11 and proceeds to step S12.

[0081] In step S12, the monitoring unit 82 determines the branch destination of the operation flow based on whether the reset flag is in the set state. When the rear end of the substrate K reaches the loading end 22, the reset flag is set to the initial reset state, and the execution of the operation flow proceeds to step S13. In step S13, the setting unit 81 determines the rear end of the substrate K and performs the setting operation for the subsequent transport distance D1. Afterwards, the execution of the operation flow returns to step S2 via step S15.

[0082] After the substrate K passes through the loading end 22 at its rear end, the transport control unit 8 determines "no substrate" each time step S2 is executed. This operation cycle is then repeated. During this repetition, the transport control unit 8 gradually reduces the subsequent transport distance D1 as the substrate K progresses. Furthermore, when the substrate K approaches the stop position PS, the transport control unit 8 appropriately decelerates the transport unit 6.

[0083] like Figure 7 As shown, when the substrate K reaches the stop position PS and stops, the execution of the operation flow ends at step S15, exiting the operation cycle. During normal substrate K handling, steps S5 and S14 of the operation flow are not executed, and the reset flag is not used. Furthermore, the reset unit 83 does not operate.

[0084] Second, the operation in the case of handling the slotted substrate KB will be explained. Figure 5 In step S1, the transport control unit 8 initiates the transport operation of the transport unit 6. In the following step S2, the transport control unit 8 obtains the determination result from the determination unit 73. In the initial stage of transporting the slotted substrate KB, the transport control unit 8 obtains a "no substrate" determination result each time step S2 is executed. Thus, the operation cycle consisting of steps S2, S3, S11, and S15 is repeatedly executed.

[0085] When the front end of the slotted substrate KB reaches the loading end 22, in step S2, the transport control unit 8 obtains a "substrate present" determination result. Therefore, the execution of the operation flow exits the operation loop from step S3 and proceeds to step S4. In step S4, since it is the first operation, the monitoring unit 82 returns the execution of the operation flow to step S2. Thereafter, during the passage of the front portion of the frame KF and the front small substrate K1 through the loading end 22, the transport control unit 8 obtains a "substrate present" determination result each time step S2 is executed. Thus, the above-described operation loop is repeatedly executed.

[0086] like Figure 9 As shown, when the trailing edge of the small substrate K1 reaches the loading end 22, in step S2, the transport control unit 8 obtains a "no substrate" determination result. Therefore, the execution of the operation flow exits the operation loop from step S11 and proceeds to step S12. In step S12, since the reset flag is set, the monitoring unit 82 causes the execution of the operation flow to proceed to step S13. In step S13, the setting unit 81 determines the trailing edge of the slotted substrate KB and performs a setting operation for the subsequent transport distance D1. However, this determination and setting operation is incorrect because it is not for the trailing edge of the slotted substrate KB. Afterwards, the execution of the operation flow returns to step S2 via step S15.

[0087] During the passage of the gap KG in the slotted substrate KB through the loading end 22, the transport control unit 8 obtains a "no substrate" determination result each time step S2 is executed. This operation cycle is then repeatedly executed. During this repetition, the transport control unit 8 gradually reduces the subsequent transport distance D1 as the substrate K is transported further.

[0088] like Figure 10 As shown, when the leading edge of the rear small substrate K2 reaches the loading end 22, in step S2, the transport control unit 8 obtains a determination result of "substrate present". Therefore, the monitoring unit 82 recognizes that the determination result has changed to "substrate present" again. As a result, the execution of the operation flow leaves the operation loop in step S3 and enters step S4. In step S4, since it is the second operation, the monitoring unit 82 causes the execution of the operation flow to enter step S5.

[0089] After the monitoring unit 82 sets the reset flag in step S5, the execution of the operation flow returns to step S2. Then, during the passage of the rear portion of the small substrate K2 and the frame KF through the loading end 22, the transport control unit 8 obtains a "substrate present" determination result each time step S2 is executed. This operation cycle is then repeatedly executed. During this repetition, the transport control unit 8 gradually reduces the subsequent transport distance.

[0090] like Figure 11As shown, when the rear end of the slotted substrate KB reaches the loading end 22, in step S2, the transport control unit 8 obtains a "no substrate" determination result. Therefore, the execution of the operation flow exits the operation loop from step S11 and proceeds to step S12. In step S12, since the reset flag is set to the set state (already set in step S5), the monitoring unit 82 causes the execution of the operation flow to proceed to step S14.

[0091] In step S14, the reset unit 83 corrects the determination of the rear end of the slotted substrate KB and performs a reset operation on the subsequent transport distance D1. Thus, the transport distance that was set and gradually corrected to be too small in step S13 is reset, and the same transport distance D1 as initially set is set again at the current moment. In other words, the incorrect setting in step S13 is reset, and the correct setting is performed in step S14. After the reset operation is completed normally, the reset unit 83 resets the reset flag. Then, the execution of the operation flow returns to step S2 via step S15.

[0092] After the slotted substrate KB passes through the loading end 22 at its rear end, the transport control unit 8 obtains a "no substrate" determination result each time step S2 is executed. This process is repeated. During this repetition, the transport control unit 8 appropriately controls the transport unit 6 based on the transport distance D1 reset in step S14.

[0093] Ultimately, as Figure 12 As shown, the slotted substrate KB stops at the stop position PS. Then, the execution of the operation flow ends at step S15, exiting the operation cycle. Furthermore, when transporting a slotted substrate KB formed by multiple gaps KG arranged separately in the transport direction, steps S5 and S14 are executed a number of times corresponding to the number of gaps KG. Therefore, the reset unit 83 operates a number of times corresponding to the number of gaps KG. On the other hand, regardless of the presence or number of gaps KG, step S13 is executed only once. Therefore, the reset unit 81 operates only once regardless of the type of substrate (K, KB).

[0094] In the substrate transport apparatus 2 of the first embodiment, when the detection result of the substrate by the sensor 7 changes from "no substrate" to "with substrate" and back to "no substrate", it is determined to be the rear end of the substrate (K, KB) and a subsequent transport distance D1 is set. Furthermore, if the detection result changes back to "with substrate", when the detection result subsequently changes back to "no substrate", the determination is corrected to be the rear end of the slotted substrate KB, and the set transport distance is reset, thus resetting the subsequent transport distance D1. Therefore, even if the rear end is incorrectly determined due to the presence of the gap KG in the slotted substrate KG, the subsequent transport distance D1 can be reset when the true rear end of the slotted substrate KB is subsequently determined. Therefore, the detection accuracy of the rear end of the substrate (K, KB) can be improved compared to the conventional method. As a result, compared to the conventional method, erroneous stops of the substrate handling machine (component mounting machine 1) caused by transport abnormalities and a decrease in the accuracy of the stopping position of the substrate (K, KB) can be reduced.

[0095] Furthermore, the control method of the transport control unit 8, based on the detection results of the substrate passing through the sensor 7, is applicable to all types of substrates (K, KB). Therefore, compared with the prior art, which sets timers and adjusts transport distances for each of multiple substrate handling machines according to each type of substrate, the first embodiment significantly reduces the operator's burden.

[0096] 7. Substrate transport apparatus 2A according to the second embodiment

[0097] Next, regarding the substrate transport apparatus 2A of the second embodiment, refer to... Figure 13 and Figure 14 This section mainly explains the differences from the first embodiment. In the second embodiment, the structures of the transport unit 6 and the transport control unit 8 are the same as in the first embodiment. On the other hand, the substrate passage sensor 7A in the second embodiment employs a horizontally projected detection light DL and detects the presence or absence of substrate K in the horizontal direction based on the amount of light DL transmitted. The substrate passage sensor 7A consists of a light-projecting unit 74, a light-receiving unit 75, and a determination unit 73, which is the same as in the first embodiment.

[0098] like Figure 13 As shown, the light-projecting unit 74 is positioned outside the Y-axis direction of the loading end 22 (predetermined position) of one guide rail 21. The light-projecting unit 74 projects a detection light DL in a horizontal direction orthogonal to the transport direction onto the substrate K, which is in a horizontal position passing through the loading end 22. The light-receiving unit 75 is positioned on the opposite side of the light-projecting unit 74, separated from the substrate K; in other words, it is positioned outside the Y-axis direction of the loading end 22 (predetermined position) of the other guide rail 21. The light-receiving unit 75 detects the amount of detection light DL passing through.

[0099] In the substrate handling apparatus 2A of the second embodiment, the detection accuracy at the rear end can be improved compared to the conventional method when handling a warped substrate KS. Specifically, in... Figure 14 In the figure, the warped substrate KS is warped so that its middle portion protrudes upward in the transport direction, and the degree of warping is exaggerated. During the transport operation of the warped substrate KS, the throughput of the detection light DL decreases when the front and rear portions of the warped substrate KS pass through the loading end 22. Moreover, when the middle portion of the warped substrate KS passes through the loading end 22, the throughput of the detection light DL temporarily increases as it passes through the lower side of the warp, as shown in the figure.

[0100] That is, in the middle portion of the warp of the warped substrate KS, the same effect as the gap portion KG of the slotted substrate KB is generated. As a result, when the warped substrate KS is transported, the determination result of the determination unit 73 of the sensor 7A follows the same movement as when transporting the slotted substrate KB in the first embodiment. Therefore, even if the rear end is incorrectly determined due to the presence of the warped portion of the warped substrate KS, the subsequent transport distance D1 can be reset after the time when the true rear end of the substrate KS is determined. Therefore, the detection accuracy of the rear end of the warped substrate KS can be improved compared to the past, and as a result, the erroneous stops of the substrate handling machine (component mounting machine 1) caused by transport abnormalities and the decrease in the accuracy of the stop position of the warped substrate KS can be reduced compared to the past.

[0101] 8. Substrate transport apparatus 2B according to the third embodiment

[0102] Next, regarding the substrate transport apparatus 2B of the third embodiment, refer to... Figure 15 The main difference from the first and second embodiments is explained. In the third embodiment, the substrate uses a sensor 7B to project a vertical detection light DL and detects the presence or absence of vertical reflection of the substrate K based on the amount of reflection of the detection light DL. The substrate sensor 7B consists of a light-projecting part 76, a light-receiving part 77, and a determination part (not shown).

[0103] like Figure 15 As shown, the light-projecting unit 76 is positioned above the receiving end 22 at a slightly inclined angle from the vertical direction. The light-projecting unit 76 projects a downward-sloping detection light DL onto the substrate K, which is positioned horizontally through the receiving end 22. On the other hand, the light-receiving unit 77 is positioned parallel to the light-projecting unit 76 at a slightly inclined angle from the vertical direction, corresponding to the travel path of the detection light DL reflected by the substrate K. The light-receiving unit 77 detects the amount of reflection of the detection light DL.

[0104] The determination unit receives information about the amount of reflection of the detection light DL from the light receiving unit 77. The determination unit determines "no substrate" if the amount of reflection is less than a predetermined threshold, and determines "substrate present" if the amount of reflection is above the threshold. The substrate detection method of the substrate transport device 2B in the third embodiment is different from that in the first embodiment, but its operation, function and effect are substantially the same as those in the first embodiment.

[0105] 9. Applications and variations of the implementation methods

[0106] Furthermore, the substrate handling devices (2, 2A, 2B) can also be applied to substrate handling machines other than component mounting machines 1, such as solder printing machines and substrate inspection machines. Additionally, the substrate can be detected by projecting horizontal detection light using sensors and determining the presence or absence of substrate K based on the amount of reflection of the detection light. Moreover, even if the length LK of the substrate K in the transport direction is unknown, the substrate handling devices (2, 2A, 2B) can use the estimated length calculated by the anomaly determination unit 84 to calculate the subsequent transport distance D1, stopping the substrate K at a predetermined stop position PS. However, anomaly determination cannot be performed by the anomaly determination unit 84. Various applications and modifications are possible beyond the first to third embodiments.

[0107] Explanation of reference numerals in the attached figures

[0108] 1: Component mounting machine 2, 2A, 2B: Substrate handling device 21: Guide rail 22: Loading end 3: Component supply device 4: Component transfer device 6: Handling unit 61: Conveyor belt 65: Drive pulley 66: Drive motor 7, 7A, 7B: Substrate passing sensor 71: Light projection unit 72: Light receiving unit 73: Judgment unit 74: Light projection unit 75: Light receiving unit 76: Light projection unit 77: Light receiving unit 8: Handling control unit 81: Setting unit 82: Monitoring unit 83: Resetting unit 84: Abnormal judgment unit DL: Detection light PS: Stop position D0: Separation distance D1: Handling distance K: Substrate PK: Middle position LK: Length KB: Slit substrate KF: Frame portion K1, K2: Small substrate KG: Gap portion LB: Length KS: Warped substrate

Claims

1. A substrate handling device, comprising: The transport unit moves the substrate from the inlet of the transport path to a predetermined stop position; The substrate is equipped with a sensor that projects detection light onto the substrate at a predetermined position on the transport end side, which is located closer to the stop position than the transport end position, through the transport path, and detects whether the substrate is present at the predetermined position based on the amount of transmission or reflection of the detection light. The setting unit sets the subsequent transport distance to the stop position when the substrate is transported by the transport unit, at the moment when the detection result of the substrate by the sensor changes from "no substrate" to "with substrate" and back to "no substrate". The monitoring unit monitors whether the detection result changes to "substrate present" again before the substrate reaches the stop position; and The reset unit, if the detection result changes to "with substrate" again, will reset the set transport distance and reset the transport distance thereafter when the detection result changes to "without substrate".

2. The substrate handling apparatus according to claim 1, wherein, The substrate projects detection light in the vertical direction onto the substrate being transported in a horizontal position via a sensor.

3. The substrate handling apparatus according to claim 1, wherein, The substrate projects detection light in a horizontal direction, which intersects with the transport direction, onto the substrate being transported in a horizontal posture via a sensor.

4. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The substrate includes, via a sensor: The light-projecting section projects the detection light onto the substrate; The light-receiving portion is disposed on the opposite side of the light-emitting portion, separated by the substrate, and detects the amount of light transmitted by the detection light, wherein the amount of detection light is reduced when the substrate is present compared to when the substrate is not present. and The determination unit determines "no substrate" when the throughput is above a predetermined threshold, and determines "substrate present" when the throughput is below the threshold.

5. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The substrate includes, via a sensor: The light-projecting section projects the detection light onto the substrate; A light-receiving section is arranged side by side with the light-projecting section and detects the amount of reflection of the detection light, wherein the amount of detection light increases when the substrate is present compared to when the substrate is absent. and The determination unit determines "no substrate" when the reflection amount is less than a predetermined threshold, and determines "substrate present" when the reflection amount is greater than or equal to the threshold.

6. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The transport distance is one of the following: the separation distance between the stop position and the specified position, the distance obtained by subtracting half the length of the transport direction of the substrate from the separation distance, and the distance obtained by subtracting the length of the transport direction of the substrate from the separation distance.

7. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The substrate handling device includes an anomaly determination unit. This anomaly determination unit calculates the estimated length of the substrate's handling direction based on the operation history of the handling unit and the detection results of the substrate via the sensor, and determines whether there is an anomaly by comparing the estimated length with the known length of the substrate's handling direction.

8. A substrate handling method, executed by a control unit in a substrate handling apparatus, the substrate handling apparatus comprising: The transport unit moves the substrate from the inlet of the transport path to a predetermined stop position; The substrate is equipped with a sensor that projects detection light onto the substrate at a predetermined position on the transport end side, which is located closer to the stop position than the transport end position, through the transport path, and detects whether the substrate is present at the predetermined position based on the amount of transmission or reflection of the detection light. and The control unit controls the transport unit based on the detection results of the sensors on the substrate. When the transport unit transports the substrate, at the moment when the detection result changes from "no substrate" through "with substrate" to "no substrate", the control unit sets the subsequent transport distance to transport the substrate to the stop position. Before the substrate reaches the stop position, the control unit monitors whether the detection result changes to "substrate present" again. If the detection result changes to "with substrate" again, and then changes to "without substrate" later, the control unit will reset the set transport distance and reset the transport distance thereafter.

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