Arc groove microstructure processing device and method

Abstract

The present application discloses a circular arc groove microstructure processing device and method. The circular arc groove microstructure processing device includes a rotating unit and a processing line. The processing line is multiple circles around the side wall of the rotating unit. Abrasives are attached to the processing line so that each circle of the processing line simultaneously cuts a number of grooves on the surface of the workpiece. In the present application, during the rotation of the processing line, the workpiece is fed, constantly approaching and contacting the processing line, thereby performing cutting; at the same time, the workpiece moves along different axial directions so that the grooves cut on the workpiece by the processing line meet the groove shape required by the product; after the groove processing in the first direction is completed, the workpiece is rotated and the processing process is repeated to complete the groove processing in the second direction; because the processing line is set at multiple intervals, each cutting can complete the processing of multiple grooves at the same time, thereby improving processing efficiency; and the processing line is detachably connected to the rotating unit. When the processing line is significantly worn, it is convenient to disassemble and replace the processing line.

Description

Technical Field

[0001] The present application relates to the field of processing and manufacturing, and in particular to a device and method for processing circular arc groove microstructures. Background Art

[0002] Microstructured functional surfaces have been widely applied in fields such as optics, energy, information technology, biomedicine, heat and mass transfer, and microelectromechanical systems. For example, in energy applications, V-shaped microgroove arrays on silicon substrates used in micro fuel cells can guide high-speed gas flows in tiny spaces. Microgroove arrays can also be used as optical fiber splitters, improving the positioning accuracy of optical fibers. Surface array microstructures are primarily created using etching, embossing, specialized machining techniques, mechanical removal, micromolding, and 3D printing.

[0003] Chinese patent document CN115741367A discloses a sapphire surface array microstructure processing device and method, which uses a grinding wheel to process microscopic grooves. Each time the grinding wheel rotates one circle, the indenter can only form one microscopic groove on the workpiece. As the fixture moves horizontally, the indenter grinds on different parts of the sapphire workpiece and forms a strip groove composed of multiple microscopic grooves spliced ​​in sequence. The processing efficiency is low, which is not suitable for mass production and does not meet the application scenarios of high-efficiency mechanical processing. Summary of the Invention

[0004] In order to solve at least one of the above technical problems, the present application provides a circular arc groove microstructure processing device and method, and the technical solutions adopted are as follows:

[0005] The present application provides a circular arc groove microstructure processing device, which includes a rotating unit and a processing line. The rotating unit is capable of rotating; the processing line is surrounded by multiple circles on the side wall of the rotating unit, and each circle of the processing line is arranged at intervals. Abrasives are attached to the processing line. The rotating unit rotates, driving the processing line to rotate, so that each circle of the processing line can simultaneously cut out multiple grooves on the surface of the workpiece.

[0006] In certain embodiments of the present application, a positioning portion is provided on the rotating unit, the positioning portion is spirally wrapped around the side wall of the rotating unit, the positioning portion protrudes from the base side wall of the rotating unit, and the processing line is connected to and protrudes from the outer edge of the positioning portion.

[0007] In certain embodiments of the present application, a connecting groove is provided at an outer edge of the positioning portion, the processing line is embedded in the connecting groove, and the processing line and the connecting groove are bonded by an adhesive.

[0008] In certain embodiments of the present application, the processing line extends to both ends of the rotating unit, and the processing line is detachably connected at both ends of the rotating unit.

[0009] In some embodiments of the present application, a mounting portion is provided on a side wall of the rotating unit, each mounting portion is provided with a mounting groove, and the processing line extends along the mounting groove to both ends of the rotating unit;

[0010] The processing line can be connected to both ends of the rotating unit by fasteners.

[0011] In certain embodiments of the present application, the arc groove microstructure processing device further includes a support frame, which is rotatably connected to the rotating unit.

[0012] In certain embodiments of the present application, the circular arc groove microstructure processing device further comprises a working platform, on which the workpiece can be placed so that the processing line contacts the surface of the workpiece;

[0013] The work platform is provided with a placement structure, and the workpiece can be connected to the placement structure so that the workpiece is held on the work platform.

[0014] In certain embodiments of the present application, the circular arc groove microstructure processing device further includes a driving unit, wherein the driving unit includes a first rotation driving unit, a movement driving unit, and a second rotation driving unit;

[0015] The first rotation driving unit drives the rotating unit to rotate; the movement driving unit drives the working platform to move; and the second rotation driving unit drives the working platform to rotate.

[0016] In certain embodiments of the present application, the circular arc groove microstructure processing device further includes a cooling unit, wherein the cooling unit is provided with a water outlet structure, and the water outlet structure is capable of transporting liquid to the surface of the workpiece.

[0017] The present application provides a circular arc groove microstructure processing method, which is applied to the above-mentioned circular arc groove microstructure processing device, comprising:

[0018] Select the workpiece material, smooth the workpiece surface and place it on the processing position of the arc groove microstructure processing device;

[0019] Installing a rotary unit on the arc groove microstructure processing device, performing tool setting on the rotary unit, setting an initial position of a processing axis in the arc groove microstructure processing device, and setting processing parameters;

[0020] Cutting grooves in a first direction, rotating the workpiece according to the groove shape to be processed, cutting grooves in a second direction, and forming a groove microstructure array;

[0021] After processing for a certain period of time, disassemble the rotating unit, disassemble the processing line on the rotating unit, clean the rotating unit, and install a new processing line.

[0022] The embodiments of the present application have at least the following beneficial effects: in the present application, the processing line and the abrasive are both made of high-strength materials, and the processing line protrudes from the rotating unit. When the rotating unit rotates, the processing line rotates together. During the rotation of the processing line, the workpiece is fed, constantly approaching and contacting the processing line, thereby performing cutting; at the same time, the workpiece moves along different axial directions, so that the grooves cut on the workpiece by the processing line meet the groove shape required by the product; when the groove processing in the first direction is completed, the workpiece is rotated, and the processing process is repeated to complete the groove processing in the second direction; since the processing line is set at multiple turns, each cutting can complete the processing of multiple grooves at the same time, thereby improving processing efficiency; and the processing line and the rotating unit are detachably connected. When the processing line produces a large degree of wear, it is convenient to disassemble and replace the processing line, thereby ensuring the continuous use of the circular arc groove microstructure processing device.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 It is a structural schematic diagram of the arc groove microstructure processing device of the present application;

[0026] Figure 2 This is a schematic structural diagram of the rotating unit in the arc groove microstructure processing device of the present application;

[0027] Figure 3 This is a schematic diagram of the structure of the rotary unit installation processing line in the circular arc groove microstructure processing device of the present application;

[0028] Figure 4 It is a cross-sectional view of the rotating unit in the arc groove microstructure processing device of the present application;

[0029] Figure 5 FIG1 is a partial enlarged view of the rotating unit in the arc groove microstructure processing device of the present application;

[0030] Figure 6 This is a schematic diagram of the structure of the working platform in the arc groove microstructure processing device of the present application;

[0031] Figure 7 The workpiece is processed in the first embodiment of the circular arc groove microstructure processing method of the present application;

[0032] Figure 8 This is the workpiece processed by the second embodiment of the circular arc groove microstructure processing method of the present application.

[0033] Reference numerals:

[0034] Rotating unit 101; processing line 102; abrasive 103; positioning portion 104; connecting groove 105; mounting portion 106; mounting groove 107;

[0035] Working platform 201; placement structure 202; support frame 203;

[0036] Water outlet structure 301. DETAILED DESCRIPTION

[0037] This section will combine Figures 1 to 8 Embodiments of the present application are described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limiting the present application.

[0038] In the description of this application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Features defined as "first" and "second" are used to distinguish feature names, rather than having special meanings. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "multiple" means two or more.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0040] like Figure 1As shown, an embodiment of the present application provides a circular arc groove microstructure processing device, which includes a rotating unit 101 and a processing line 102. The rotation of the rotating unit 101 drives the processing line 102 to rotate. The processing line 102 has a cutting capability. When a workpiece contacts the processing line 102, the processing line 102 performs cutting. Due to the shape of the processing line 102, the cutting process automatically forms a groove. To ensure that the machined groove meets the groove shape requirements of the workpiece, the workpiece also performs adaptive movement during the cutting process, cooperating with the movement of the rotating unit 101 to complete the processing of the groove microstructure.

[0041] like Figure 2 As shown, the rotating unit 101 can rotate, and the processing line 102 is set on the rotating unit 101. In order to arrange the processing line 102 as required, a corresponding positioning structure is set on the rotating unit 101.

[0042] like Figure 3 、 Figure 4 、 Figure 5 As shown, in some examples, the processing line 102, serving as the primary carrier for contacting and cutting the workpiece, surrounds the sidewall of the rotating unit 101. The groove profile of the workpiece to be processed is required to be relatively regular, meaning that the distance between each groove is approximately equal. To facilitate efficient processing of multiple parallel grooves at once and to facilitate the configuration of the processing line 102, the processing line 102 spirals around the rotating unit 101 multiple times. It will be appreciated that, based on the groove profile requirements, the spiral shape formed by the processing line 102 has a relatively fixed pitch, avoiding the need for multiple parallel processing lines 102, thereby reducing the difficulty of securing the processing line 102 and improving the groove quality.

[0043] Furthermore, abrasives 103 are attached to the processing line 102 , and the abrasives 103 are approximately evenly distributed at various positions of the processing line 102 , ensuring that various parts of the groove can be cut approximately equally during the cutting process.

[0044] When machining the arc groove microstructure on the workpiece, the cross-sectional shape of the machining line 102 is set to be approximately circular. When the circular machining line 102 cuts the workpiece, it naturally forms an arc-shaped groove, reducing the subsequent tedious grinding process and indirectly improving machining efficiency. The rotation of the rotating unit 101 drives the machining line 102 to rotate together. At this time, when the workpiece surface contacts the machining line 102, a groove can be cut. To ensure the effectiveness of the cutting process of the machining line 102, the machining line 102 protrudes from the side wall of the rotating unit 101 to prevent the rotating unit 101 from contacting the workpiece surface and causing damage to the workpiece surface.

[0045] Specifically, the processing wire 102 is manufactured by mechanical action, brazing, resin bonding, or electroplating. The processing wire 102 and the granular abrasive 103 are bonded together by a bonding agent. The processing wire 102 can be made of high-strength steel wire, and the bonding agent can be a brazing material such as a Ni-B-Cr matrix alloy, Cu-Sn-Ti, Cu-Ag-Ti, or Ni-Cr-B-Si, a thermosetting resin bond, a light-curing resin bond, or an electroplated nickel alloy. The abrasive 103 can be made of diamond, cubic boron nitride, corundum, or silicon carbide. The outer diameter of the processing wire 102 containing the abrasive 103 layer is set to 0.3 to 2 mm.

[0046] The average particle size of the abrasive 103 ranges from 5 to 500 microns. The abrasive 103 is bonded by a binder, and there is a high bonding strength between the binder and the abrasive 103. During the processing, the binder is worn away, exposing the abrasive 103. The abrasive 103 particles on the processing line 102 form a continuous and effective cutting process on the workpiece surface, and can form controllable arc surface grooves on the workpiece surface.

[0047] like Figure 3 As shown, in some examples, in order to ensure the spiral winding form of the processing line 102 and to ensure the connection strength between the processing line 102 and the rotating unit 101, a positioning portion 104 is provided on the rotating unit 101. The processing line 102 is connected to the positioning portion 104. It can be understood that the positioning portion 104 is spirally wound around the side wall of the rotating unit 101 and ensures a relatively fixed pitch. At the same time, the positioning portion 104 protrudes from the side wall of the rotating unit 101, and the processing line 102 is connected to and protrudes from the outer edge of the positioning portion 104. While stabilizing the position of the processing line 102, it further protrudes from the rotating unit 101 to prevent the rotating unit 101 from touching the workpiece with a large contact area when the workpiece is fed too much, causing irreparable serious damage to the workpiece.

[0048] like Figure 5 As shown in the partial enlarged Figure I, in order to ensure that the processing line 102 is stably located on the outer edge of the positioning portion 104, a connecting groove 105 is provided on the outer edge of the positioning portion 104. The depth of the connecting groove 105 is less than the outer diameter of the processing line 102, so that the processing line 102 can protrude from the positioning portion 104 while being embedded in the connecting groove 105, thereby forming effective cutting of the processing line 102.

[0049] In some examples, in order to facilitate the fixing of the position of the processing line 102, the processing line 102 is extended and connected to both ends of the rotating unit 101, wherein the processing line 102 and the rotating unit 101 are detachably connected, so that the processing line 102 can be replaced in the case of severe wear, thereby improving the durability of the arc groove microstructure processing device.

[0050] In some examples, since it is difficult to ensure that the processing line 102 extends accurately in the form of a spiral line to both ends of the rotating unit 101 for fixation, a mounting portion 106 is provided on the side wall of the rotating unit 101, and the mounting portion 106 is located at both ends of the rotating unit 101.

[0051] Furthermore, mounting portion 106 is provided with mounting grooves 107, which extend to the connection positions at both ends of rotation unit 101. After forming a spiral line, processing line 102 is embedded in mounting grooves 107, thereby extending to both ends of rotation unit 101. It can be understood that mounting grooves 107 are connected to connection grooves 105, facilitating the continuous embedding of processing line 102.

[0052] Specifically, connection holes are provided at both ends of the rotating unit 101 , namely at the end positions of the mounting groove 107 , and fasteners can be installed in the connection holes to squeeze and fix the processing line 102 .

[0053] In some examples, the positioning portion 104, connecting groove 105, connecting hole, and other structures can be prepared by turning, milling, grinding, drilling, etc. The rotating unit 101 is made of 45 steel. The base size parameters of the rotating unit 101 are as follows: the outer diameter is set to 50 to 500 mm, the length is set to 100 to 1000 mm, the area where the positioning portion 104 is located is the working area, and the length of the working area is set to 80 to 800 mm. The depth of the positioning portion 104 is set to 0.1 to 5 mm, the width between two adjacent circles of positioning portions 104 is set to 0.1 to 5 mm, the depth of the connecting groove 105 is set to 0.2 to 2 mm, the width of the connecting groove 105 is set to 0.2 to 2 mm, the width of the edge of the connecting groove 105 is set to 0.1 to 0.5 mm, the pitch is set to 0.2 to 5 mm, and the thread lead angle is set to 2° to 30°.

[0054] Specifically, the processing line 102 and the connection groove 105 are fixed by an adhesive. When the processing line 102 is worn, the adhesive can be removed by heating or dissolving the adhesive to replace the processing line 102.

[0055] In some examples, during the installation of the processing line 102, the rotating unit 101 is first cleaned to remove grease and dust from the surface, and then placed in a drying oven for drying. After drying, the processing line 102 is fixed to one end of the rotating unit 101 by fasteners such as bolts and gaskets. The processing line 102 is then wound along the trajectory of the connecting groove 105 and the installation groove 107. The pre-adjusted adhesive is added simultaneously during the winding process. After the winding is completed, the other end of the processing line 102 is also fixed by fasteners. Finally, it is placed at room temperature for 6 to 72 hours to achieve complete curing. The efficiency of the drying process can be improved by heating. Usually, heating and curing are performed in a hot oven at 50°C to 120°C.

[0056] The rotating unit 101 moves in coordination with the workpiece and utilizes material removal to first machine a continuous arc microgroove array of different sizes on the workpiece surface. The work platform 201 rotates a certain angle and then performs a second machining to obtain an arc microgroove array that intersects with the arc microgroove array machined for the first time. The unmachined areas between the arc grooves form microcolumn or microcone arrays of different sizes and shapes, whose sizes and shapes are determined by the tool size and the worktable rotation angle.

[0057] Specifically, if Figure 7 As shown, in the first embodiment, between two cutting processes, the working platform 201 rotates 90° to form a 90° processing angle microstructure array; Figure 8 As shown, in the second embodiment, between two cutting processes, the working platform 201 rotates at an angle other than 90°, forming a microstructure array with a non-90° processing angle.

[0058] The arc microgroove array is achieved by coordinating the dimensional parameters and movement speed of the rotating unit 101 with the movement direction and speed of the working platform 201. Furthermore, the working platform 201 can move along a first, second, and third axial directions that are perpendicular to each other, wherein the first and second axial directions are horizontal, and the third axial direction is vertical.

[0059] Since the processing line 102 is installed according to the characteristics of a cylindrical spiral line, when processing a continuous arc groove array with the second axis as the forward direction, it needs to be subject to the following conditions: the tangential direction of the rotation of the rotating unit 101 needs to be opposite to the direction of movement of the work platform 201 along the second axis, and the movement direction of the work platform 201 along the first axis is the same as the rotation direction of the processing line 102.

[0060] Comply with L>(l / l q )·X+w,V y =V T , V x =X / t, where t is the time required for the tool to rotate one circle, L is the length of the working area, l is the length of the workpiece, and l q is the length of a single-turn helix, w is the width of the workpiece, V y is the moving speed of the working platform 201 along the second axis, V x is the moving speed of the working platform 201 along the first axis, V T The linear speed at which the processing line 102 rotates.

[0061] like Figure 6As shown, in some examples, the arc groove microstructure processing device also includes a working platform 201, which is used to place the workpiece to be processed. The working platform 201 cooperates with the rotating unit 101 in a moving and rotating manner to perform coordinated movement, thereby cutting the required groove shape of the workpiece.

[0062] Furthermore, a placement structure 202 is provided on the work platform 201, and the workpiece being placed on the placement structure 202 is equivalent to the workpiece being placed on the work platform 201. Specifically, the placement structure 202 can be an electromagnetic chuck or a vacuum chuck to achieve a tight connection with the workpiece or fixture.

[0063] In some examples, the arc groove microstructure processing device further includes a support frame 203 , which is used to connect to the rotating unit 101 . It is understandable that the support frame 203 is rotatably connected to the rotating unit 101 .

[0064] In some examples, the circular arc groove microstructure processing device further includes a driving unit, which is used to drive various moving parts in the circular arc groove microstructure processing device.

[0065] Furthermore, the driving unit includes a first rotation driving unit, a moving driving unit, and a second rotation driving unit. The first rotation driving unit drives the rotating unit 101 to rotate. Considering the miniaturization design of the arc groove microstructure processing device, the first rotation driving unit is disposed inside the support frame 203.

[0066] The mobile drive unit drives the work platform 201 to move, thereby driving the workpiece to move in coordination with the movement of the rotating unit 101. The arc groove microstructure processing device also includes a base, on which the work platform 201 and support frame 203 are both disposed. The mobile drive unit can be disposed within the base. The mobile drive unit can drive the work platform 201 to move horizontally with two degrees of freedom, allowing the workpiece to move in coordination with the rotational cutting of the processing line 102, thereby forming a straight groove on the workpiece surface. Simultaneously, the mobile drive unit can drive the work platform 201 to move longitudinally with a single degree of freedom, providing feed for the workpiece and allowing it to enter the cutting range.

[0067] The second rotary drive unit drives the work platform 201 to rotate. The rotation of the work platform 201 is equivalent to the rotation of the workpiece. After the groove processing in a single direction is completed, the workpiece is rotated by a certain angle according to the desired groove shape under the action of the second rotary drive unit, facilitating further cutting on the processing line 102. In other words, the work platform 201 can move in four degrees of freedom, improving the flexibility of the processing process.

[0068] In some examples, the arc groove microstructure processing device further includes a cooling unit, which includes a water pump, a water outlet structure 301, and a liquid container. The water outlet structure 301 is connected to the base with the water outlet facing the workpiece. The water pump in the liquid container extracts liquid and delivers it to the workpiece surface through the water outlet structure 301, thereby achieving a cooling function. It is understood that by providing a discharge outlet, waste liquid can be diverted to the liquid container for recycling. Specifically, the water outlet structure 301 can be configured as a pipe.

[0069] The embodiment of the present application provides a circular arc groove microstructure processing method, which is applied to the above-mentioned circular arc groove microstructure processing device, including:

[0070] Select the workpiece material, smooth the workpiece surface and place it on the processing position of the arc groove microstructure processing device.

[0071] The workpiece material can be metal, ceramic, silicon and polymer plates. First, the workpiece is flattened by grinding, lapping and polishing, and then installed on the placement structure 202. When the placement structure 202 uses an electromagnetic suction cup or a vacuum suction cup, it is fixed by magnetic adsorption of the electromagnetic suction cup or vacuum adsorption of the vacuum suction cup.

[0072] The rotating unit 101 is installed on the arc groove microstructure processing device, the tool setting of the rotating unit 101 is performed, the initial position of the processing axis in the arc groove microstructure processing device is set, and the processing parameters are set.

[0073] Install the rotary unit 101, turn on the main power supply of the arc groove microstructure machining apparatus, and set the rotation speed of the rotary unit 101 to 10 to 100 rpm. During tool setting, set the initial position of the third axis to 0.1 mm above the point where the rotary unit 101 just contacts the workpiece. Set the initial positions of the first and second axes. In the second axis, the rotary unit 101 is positioned 2 to 5 mm from the edge of the workpiece. In the first axis, the initial position is the center of the workpiece.

[0074] After aligning the tool, set the processing parameters, set the feed depth of the third axis to 0.01 to 4 mm, the feed speed of the third axis to 0.01 to 1 mm / pass, and the tool speed to 5 to 300 rpm, rotating counterclockwise.

[0075] The moving stroke in the second axial direction is the length of the workpiece in the second axial direction plus the distance between the rotating unit 101 and the workpiece during tool setting multiplied by 2. The moving speed of the working platform 201 in the second axial direction is 7 to 50 m / min, and the moving speed of the working platform 201 in the first axial direction is 0.003 to 0.75 m / min. After adjusting the processing parameters, turn on the cooling unit to prepare for processing.

[0076] Cut the grooves in the first direction, rotate the workpiece according to the groove type to be processed, cut the grooves in the second direction, and form a groove microstructure array.

[0077] During the machining process, the machining line 102 and the workpiece move in coordination at the same linear speed. After completing the first cutting pass, the working platform 201 feeds a certain distance along the third axis, the rotating unit 101 rotates in the opposite direction, and the working platform 201 returns to the initial position according to the original motion path to complete the second cutting pass. This process is repeated. The tool line will effectively remove the workpiece material through contact with the abrasive 103, while other solid parts on the rotating unit 101 will not contact the workpiece, and finally a circular arc microgroove array of the required size is obtained.

[0078] The working platform 201 is rotated to a certain angle, the angle range is set to 10° to 180°, which is determined according to the groove requirements of the workpiece. The above steps are repeated for a second processing to obtain microstructure arrays with arc grooves of different shapes and arrangements.

[0079] After a certain processing time, the rotating unit 101 is disassembled, and the processing line 102 is disassembled on the rotating unit 101 , the rotating unit 101 is cleaned, and a new processing line 102 is installed.

[0080] Depending on the properties of the material being processed, the abrasive 103 on the surface of the processing line 102 typically wears out after 3 to 72 hours of use, resulting in a decrease in processing quality and the need to replace the processing line 102. In this case, the rotating unit 101 is removed and placed in a hot oven heated to 300°C to 500°C to melt the adhesive. The worn processing line 102 is then removed and the surface of the rotating unit 101 is cleaned with an alcohol solution and ultrasonically to remove the adhesive. A new processing line 102 is then reinstalled and attached, restoring processing capacity. Specifically, it is advisable to replace the processing line 102 after 2 to 36 hours of cutting to improve processing quality.

[0081] In some examples, when preparing microstructures on 316L stainless steel:

[0082] The cut 316L stainless steel sheet is flattened by grinding, lapping and polishing, and the stainless steel sheet is fixed to ensure stable clamping;

[0083] The processing line 102 is prepared by electroplating CBN abrasive 103 with a particle size of 5 to 500 microns on the surface of a high-strength steel wire. The diameter of the steel wire is set to 0.5 to 1.8 mm. After the processing is completed, the diameter is set to 0.7 to 2 mm.

[0084] The base of the rotating unit 101 is first machined by turning the positioning portion 104. A connecting groove 105 is then machined on the outer edge of the positioning portion 104. The positioning portion 104 and the connecting groove 105 form a composite spiral groove. The mounting groove 107 is then milled, and finally, the connecting hole is machined on a drilling machine. The rotating unit 101 is made of 45-gauge steel, with an outer diameter of 100 to 300 mm, a length of 300 to 600 mm, and a working area length of 200 to 500 mm.

[0085] During workpiece machining, the rotary unit 101 is first installed and its speed is set to 10 to 30 rpm for tool setting. The feed depth in the third axis is set to 1 to 2 mm, the feed rate is set to 0.08 to 0.6 mm / pass, the rotation speed of the rotary unit 101 is set to 50 to 150 rpm, and the counterclockwise rotation speed of the work platform 201 in the second axis is 15 to 50 m / min, and the speed of the work platform 201 along the first axis is 0.055 to 0.6 m / min.

[0086] The work platform 201 is rotated and processed again to obtain a microstructure array with arc grooves; the tool line is replaced when cutting for 6 to 12 hours.

[0087] In some examples, when preparing microstructures on zirconia ceramics:

[0088] The zirconia ceramic plate is flattened by grinding, lapping and polishing, and the stainless steel plate is fixed to ensure stable clamping;

[0089] The processing line 102 is prepared by electroplating a diamond abrasive 103 with a particle size of 5 to 500 microns on the surface of a high-strength steel wire. The diameter of the steel wire is set to 0.3 to 0.8 mm. After the processing is completed, the diameter is set to 0.5 to 1 mm.

[0090] The base of the rotating unit 101 is first machined by turning a positioning portion 104. A connecting groove 105 is then machined on the outer edge of the positioning portion 104. The positioning portion 104 and the connecting groove 105 form a composite spiral groove. The mounting groove 107 is then milled, and finally, the connecting hole is machined on a drill press. The rotating unit 101 is made of 45-gauge steel, with an outer diameter of 100 to 200 mm, a length of 300 to 500 mm, and a working area length of 200 to 400 mm.

[0091] During workpiece machining, the rotary unit 101 is first installed and its speed is set to 15 to 30 rpm for tool setting. The feed depth in the third axis is set to 0.5 to 1 mm, the feed rate is set to 0.01 to 0.1 mm / pass, the rotation speed of the rotary unit 101 is set to 15 to 150 rpm, and the counterclockwise rotation speed of the work platform 201 in the second axis is 10 to 50 m / min, and the speed of the work platform 201 in the first axis is 0.0225 to 0.45 m / min.

[0092] The work platform 201 is rotated and processed again to obtain a microstructure array with arc grooves; the tool line is replaced when cutting for 2 to 8 hours.

[0093] In some examples, when preparing microstructures on PMMA polymer materials:

[0094] The PMMA polymer sheet is flattened by grinding, lapping and polishing, and the stainless steel sheet is fixed to ensure stable clamping;

[0095] Prepare the processing line 102, use ultraviolet curing resin as a binder, and evenly coat the silicon carbide abrasive 103 with a particle size of 5 to 500 microns on the surface of the high-strength steel wire. The diameter of the steel wire is set to 0.3 to 1.8 mm. After processing, the diameter is set to 0.5 to 2 mm.

[0096] The base of the rotating unit 101 is prepared by first turning the positioning portion 104. A connecting groove 105 is then machined on the outer edge of the positioning portion 104. The positioning portion 104 and the connecting groove 105 form a composite spiral groove. The mounting groove 107 is then milled, and finally, the connecting hole is machined on a drilling machine. The rotating unit 101 is made of 45-gauge steel, with an outer diameter of 200 to 400 mm, a length of 400 to 700 mm, and a working area length of 300 to 600 mm.

[0097] During workpiece machining, the rotary unit 101 is first installed and set to 50 rpm for tool setting. The feed depth in the third axis is set to 1 to 2 mm, the feed rate is set to 0.4 to 1 mm / pass, the rotation speed of the rotary unit 101 is set to 15 to 90 rpm, the speed of the work platform 201 in the second axis is set to 20 to 50 m / min, and the speed of the work platform 201 in the first axis is set to 0.015 to 0.525 m / min.

[0098] The work platform 201 is rotated and processed again to obtain a microstructure array with arc grooves; the tool line is replaced when cutting for 8 to 24 hours.

[0099] In the description of this specification, if the reference terms "one embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" appear, it means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0100] The above describes the implementation methods of the present application in detail in conjunction with the accompanying drawings, but the present application is not limited to the above implementation methods. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.

Claims

1. A circular arc groove microstructure processing device, characterized in that: include: a rotating unit, wherein the rotating unit is capable of rotating; The processing line is surrounded by multiple circles on the side wall of the rotating unit, and each circle of the processing line is arranged at intervals. Abrasives are attached to the processing line. The rotating unit rotates, driving the processing line to rotate so that each circle of the processing line can simultaneously cut a plurality of grooves on the surface of the workpiece.

2. The arc groove microstructure processing device according to claim 1, characterized in that: The rotating unit is provided with a positioning portion, which spirally surrounds the side wall of the rotating unit and protrudes from the base side wall of the rotating unit. The processing line is connected to and protrudes from the outer edge of the positioning portion.

3. The arc groove microstructure processing device according to claim 2, characterized in that: A connecting groove is provided on the outer edge of the positioning portion, the processing line is embedded in the connecting groove, and the processing line and the connecting groove are bonded by an adhesive.

4. The arc groove microstructure processing device according to claim 1, characterized in that: The processing line extends to both ends of the rotating unit, and the processing line is detachably connected at both ends of the rotating unit.

5. The arc groove microstructure processing device according to claim 4, characterized in that: The side wall of the rotating unit is provided with a mounting portion, each of the mounting portions is provided with a mounting groove, and the processing line extends along the mounting groove to both ends of the rotating unit; The processing line can be connected to both ends of the rotating unit by fasteners.

6. The arc groove microstructure processing device according to claim 1, characterized in that: The circular arc groove microstructure processing device also includes a support frame, which is rotatably connected to the rotating unit.

7. The arc groove microstructure processing device according to claim 6, characterized in that: The circular arc groove microstructure processing device also includes a working platform, and the workpiece can be placed on the working platform so that the processing line contacts the surface of the workpiece; The work platform is provided with a placement structure, and the workpiece can be connected to the placement structure so that the workpiece is held on the work platform.

8. The arc groove microstructure processing device according to claim 7, characterized in that: The circular arc groove microstructure processing device further includes a driving unit, which includes a first rotation driving unit, a movement driving unit, and a second rotation driving unit; The first rotation driving unit drives the rotating unit to rotate; the movement driving unit drives the working platform to move; and the second rotation driving unit drives the working platform to rotate.

9. The arc groove microstructure processing device according to claim 1, characterized in that: The circular arc groove microstructure processing device also includes a cooling unit, which is provided with a water outlet structure, and the water outlet structure can transport liquid to the surface of the workpiece.

10. A method for machining a circular arc groove microstructure, applied to the circular arc groove microstructure machining device according to any one of claims 1 to 9, characterized in that: Select the workpiece material, smooth the workpiece surface and place it on the processing position of the arc groove microstructure processing device; Installing a rotary unit on the arc groove microstructure processing device, performing tool setting on the rotary unit, setting an initial position of a processing axis in the arc groove microstructure processing device, and setting processing parameters; Cutting grooves in a first direction, rotating the workpiece according to the groove shape to be processed, cutting grooves in a second direction, and forming a groove microstructure array; After processing for a certain period of time, disassemble the rotating unit, disassemble the processing line on the rotating unit, clean the rotating unit, and install a new processing line.

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