An apparatus for wire bonding electroplating

Abstract

The present invention discloses a device for wire bonding electroplating, which relates to the technical field of electroplating equipment and includes an electroplating tank. A plurality of bases are fixedly installed at the lower end of the electroplating tank, and the bases are arranged at the corner positions of the lower end of the electroplating tank. A plurality of reinforcing frames are fixedly installed on the outer side of the electroplating tank. Columns are fixedly installed on one of the reinforcing frames located on both sides of the electroplating tank. A telescopic groove is opened in the column, and a through hole concentric and of the same diameter as the telescopic groove is opened in the reinforcing frame located at the upper end of the column. A penetrating insertion through groove is opened on one side of the telescopic groove. A C-shaped lifting column and a connecting column are respectively arranged on both sides of the electroplating tank, and a wire wheel with a height difference is respectively arranged at one end of the C-shaped lifting column and the connecting column, so as to facilitate winding the copper wire at the lower inner position of the wire wheel. With the help of a motor, a connecting rod and a fixed rod, the C-shaped lifting column and the connecting column can be driven to move downward, so as to quickly realize the assembly of the copper wire and press it into the electroplating solution in the electroplating tank.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating equipment, and particularly relates to an equipment for electroplating bonding wires. Background Art

[0002] Bonding wires are metal wires used in the ball bonding process, mainly for welding electronic components such as integrated circuits, large-scale integrated wafers, and transistors. It can achieve the best balance among electrical conductivity, thermal conductivity, corrosion resistance, stability, and processability. The electroplating of bonding wires is to improve the strength of the second bonding. Copper wires are prone to oxidation during the second bonding, resulting in a decrease in bonding strength. To solve this problem, an antioxidant metal layer such as gold, silver, palladium, or nickel can be electroplated on the surface of the copper wire. This can not only improve the strength of the second bonding but also maintain the stability of the first bonding.

[0003] An existing processing equipment for a bonding wire protection coating with a publication number of CN210796668U can complete all the electroplating processes through one equipment through its structural settings. Therefore, the copper wire can be processed in one step without repeated operations, and this equipment is a fully automatic equipment without manual operation by staff, which is more convenient. However, in this application document, the copper wire needs to pass through the sealing rings in multiple partitions inside the equipment in sequence. And due to the small diameter of the copper wire, when the copper wire undergoes electroplating treatment in the electroplating equipment, it needs to pass through multiple sealing rings in sequence. And to ensure that the copper wire can be placed in the electroplating solution, the position of the sealing ring is in the middle of the partition inside the electroplating equipment. As a result, the insertion and installation of the initial section of the copper wire are very inconvenient during the electroplating of the copper wire. At the same time, if the hand touches the electroplating solution, some chemical components may cause irritation to the skin and mucous membranes. Summary of the Invention

[0004] The purpose of the present invention is to provide an equipment for electroplating bonding wires, which can effectively solve the problems in the background art.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0006] An apparatus for electroplating bonding wires, comprising an electroplating tank. A plurality of bases are fixedly installed at the lower end of the electroplating tank, and the bases are arranged at the corner positions of the lower end of the electroplating tank. A plurality of reinforcing frames are fixedly installed outside the electroplating tank. Columns are fixedly installed on each of the reinforcing frames on both sides of the electroplating tank. A telescopic groove is formed in the column, and a through hole concentric and of the same diameter as the telescopic groove is formed in the reinforcing frame at the upper end of the column. A through-type insertion through groove is formed on one side in the telescopic groove. A C-shaped lifting column is movably installed in the telescopic groove. One end of the C-shaped lifting column is provided with a connecting column. One end of the connecting column is fixedly installed with an arc-shaped fixing block and an arc-shaped movable block at one end of the C-shaped lifting column through the arc-shaped fixing block. The other end of the C-shaped lifting column is fixedly installed with a limiting rod. A connecting rod is fixedly connected between the two limiting rods. A motor is fixedly installed at the front end of the electroplating tank. A screw rod is fixedly installed on the output end of the motor, and the motor is electrically connected to an external controller through a connecting wire.

[0007] As a further preferred embodiment of the present invention, a first insertion slot is formed at one end of the C-shaped lifting column, and the end of the C-shaped lifting column provided with the first insertion slot is inserted and installed in the telescopic groove.

[0008] As a further preferred embodiment of the present invention, an insertion block is fixedly installed at one end of the limiting rod relative to the C-shaped lifting column. The insertion block passes through the insertion through groove and is inserted and installed in the first insertion slot.

[0009] As a further preferred embodiment of the present invention, a limiting ring is fixedly installed at the end of the C-shaped lifting column away from the first insertion slot, and two positioning blocks are fixedly installed on the C-shaped lifting column at a position above the limiting ring.

[0010] As a further preferred embodiment of the present invention, the connecting column is L-shaped, and the arc-shaped fixing block is fixedly installed at one end of the connecting column. Positioning grooves are respectively formed on the opposite sides of the arc-shaped fixing block and the arc-shaped movable block. Fixed seats are also respectively fixedly installed on the outer sides of the arc-shaped fixing block and the arc-shaped movable block. The arc-shaped fixing block and the arc-shaped movable block are respectively inserted and installed on the outside of the C-shaped lifting column, and the positioning grooves are inserted and installed on the corresponding positioning blocks. The two adjacent fixed seats on the outer sides of the arc-shaped fixing block and the arc-shaped movable block are fixed by screws.

[0011] As a further preferred embodiment of the present invention, a wire guide wheel is provided on the longitudinal part of the connecting column. The wire guide wheel is rotatably installed at the front end of the connecting column through a pin shaft. A wire guide wheel is also rotatably installed at one end of the C-shaped lifting column through a pin shaft. The wire guide wheel at one end of the C-shaped lifting column is higher in height than the wire guide wheel at one end of the connecting column.

[0012] As a further preferred embodiment of the present invention, fixing rods are fixedly installed at both ends of the connecting rod. Second slots are respectively formed on the opposite sides of the two fixing rods. The fixing rods are inserted and installed at one end of the corresponding limiting rod through the second slots, and the fixing rods are fixed to the limiting rod and the C-shaped lifting column by screws. A fixing block is fixedly installed at the central position of the front end of the connecting rod, and a threaded hole is formed in the fixing block. The threaded hole is threadedly connected to the screw rod at the upper end of the motor.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] For the equipment for bonding wire electroplating of the present invention, a C-shaped lifting column and a connecting column are respectively arranged on both sides of the electroplating tank, and a wire wheel with a height difference is respectively arranged at one end of the C-shaped lifting column and the connecting column, so as to facilitate winding the copper wire at the lower position inside the wire wheel. With the help of the motor, the connecting rod and the fixing rod, the C-shaped lifting column and the connecting column can be driven to move downward, so as to quickly realize the assembly of the copper wire and press it into the electroplating solution in the electroplating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the main structure of the present invention;

[0016] Figure 2 is an exploded view of the structure of the C-shaped lifting column, the connecting column and the connecting rod of the present invention;

[0017] Figure 3 is Figure 1 an enlarged view of part A in

[0018] Figure 4 is Figure 2 an enlarged view of part B in

[0019] Figure 5 is Figure 2 an enlarged view of part C in

[0020] Figure 6 is a schematic perspective view of the equipment for bonding wire electroplating according to Embodiment 2;

[0021] Figure 7 is a schematic diagram of the structure of the electrode assembly.

[0022] In the figure: 1, electroplating bath; 2, base; 3, strengthening frame; 4, column; 5, telescopic groove; 6, insertion through groove; 7, C-shaped lifting column; 8, connecting column; 9, arc-shaped fixing block; 10, arc-shaped movable block; 11, wire wheel; 12, connecting rod; 13, first slot; 14, limiting rod; 15, insertion block; 16, second slot; 17, fixing block; 18, screw hole; 19, pin shaft; 20, positioning block; 21, limiting ring; 22, fixed seat; 23, positioning groove; 24, motor; 25, fixed rod, 26, electrode assembly; 27, gas collecting hood;

[0023] 26.1, cathode plate; 26.2, anode plate; 26.3, insulating plate; 26.4, lower wire ring, 26.5, upper wire ring, 26.6, connecting screw, 26.7, connecting bolt. Specific embodiments

[0024] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0025] Embodiment 1

[0026] As Figures 1 - 5 shown, a device for bonding wire electroplating provided by the present invention includes an electroplating bath 1. A plurality of bases 2 are fixedly installed at the lower end of the electroplating bath 1, and the bases 2 are arranged at the lower end corner positions of the electroplating bath 1. A plurality of strengthening frames 3 are fixedly installed on the outer side of the electroplating bath 1. Columns 4 are fixedly installed on one of the strengthening frames 3 on both sides of the electroplating bath 1. A telescopic groove 5 is opened in the column 4, and a through hole concentric and of the same diameter as the telescopic groove 5 is opened in the strengthening frame 3 at the upper end of the column 4. A through-type insertion through groove 6 is opened on one side in the telescopic groove 5. A C-shaped lifting column 7 is movably installed in the telescopic groove 5. One end of the C-shaped lifting column 7 is provided with a connecting column 8. One end of the connecting column 8 is fixedly installed at one end of the C-shaped lifting column 7 through an arc-shaped fixing block 9 and an arc-shaped movable block 10. The other end of the C-shaped lifting column 7 is fixedly installed with a limiting rod 14. A connecting rod 12 is fixedly connected between the two limiting rods 14. A motor 24 is fixedly installed at the front end of the electroplating bath 1. A screw rod is fixedly installed on the output end of the motor 2, and the motor 24 is electrically connected to an external controller through a connecting wire...

[0027] By opening a first slot 13 at one end of the C-shaped lifting column 7, and inserting and installing the end of the C-shaped lifting column 7 with the first slot 13 into the telescopic slot 5, a plug 15 is fixedly installed on the limiting rod 14 relative to one end of the C-shaped lifting column 7. The plug 15 passes through the insertion through slot 6 and is inserted and installed in the first slot 13. The limiting rod 14 is fixedly connected to one end of the C-shaped lifting column 7 by screws, and the limiting rod 14 is also inserted and installed in the insertion through slot 6 at the same time, which can limit the lifting of the C-shaped lifting column 7. At the same time, it is also convenient for the connecting rod 12 and the fixed rod 25 to drive the C-shaped lifting column 7 through the limiting rod 14. A limiting ring 21 is fixedly installed at the end of the C-shaped lifting column 7 away from the first slot 13. Two positioning blocks 20 are fixedly installed on the C-shaped lifting column 7 at a position above the limiting ring 21. The connecting column 8 is L-shaped, and an arc-shaped fixing block 9 is fixedly installed at one end of the connecting column 8. Positioning grooves 23 are respectively opened on the opposite sides of the arc-shaped fixing block 9 and the arc-shaped movable block 10. Fixed seats 22 are also respectively fixedly installed on the outer sides of the arc-shaped fixing block 9 and the arc-shaped movable block 10. The arc-shaped fixing block 9 and the arc-shaped movable block 10 are respectively inserted and installed on the outside of the C-shaped lifting column 7, and the positioning grooves 23 are inserted and installed on the corresponding positioning blocks 20. The two adjacent fixed seats 22 on the outer sides of the arc-shaped fixing block 9 and the arc-shaped movable block 10 are fixed by screws. The two positioning blocks 20 fixedly installed at one end of the C-shaped lifting column 7 can enable the arc-shaped fixing block 9 and the arc-shaped movable block 10 to respectively cooperate with the positioning grooves 23 inside to position and install the connecting column 8, so as to ensure that the wire wheels 11 at one end of the connecting column 8 and the wire wheels 11 at one end of the C-shaped lifting column 7 are on the same extension line;

[0028] A wire wheel 11 is provided on the longitudinal part of the connecting column 8. The wire wheel 11 is rotatably installed at the front end of the connecting column 8 through a pin shaft 19. A wire wheel 11 is also rotatably installed at one end of the C-shaped lifting column 7 through a pin shaft 19. The height of the wire wheel 11 at one end of the C-shaped lifting column 7 is higher than that of the wire wheel 11 at one end of the connecting column 8. Fixed rods 25 are fixedly installed at both ends of the connecting rod 12. Second slots 16 are respectively opened on the opposite sides of the two fixed rods 25. The fixed rods 25 are inserted and installed at one end of the corresponding limiting rod 14 through the second slots 16, and the fixed rods 25 are fixed to the limiting rod 14 and the C-shaped lifting column 7 by screws. A fixed block 17 is fixedly installed at the center position of the front end of the connecting rod 12. A threaded hole 18 is opened in the fixed block 17. The threaded hole 18 is threadedly connected to the screw rod at the upper end of the motor 24. By providing a screw rod on the motor 24, the screw rod can be rotated in the threaded hole 18 of the fixed block 17, so as to control the lifting of the connecting rod 12 and the fixed rods 25 at both ends, and further synchronously control the lifting of the two C-shaped lifting columns 7, so as to facilitate pressing the copper wire into the electroplating tank 1 after winding the copper wire around the lower ends of multiple wire wheels 11.

[0029] It should be noted that the present invention is a device for wire bonding electroplating. When electroplating a copper wire, one end of the copper wire can be first pulled and the copper wire is pulled out from the pay-off reel, and the copper wire is made to successively bypass the upper end of the wire wheel 11 at one end of the left C-shaped lifting column 7 on the electroplating tank 1 and pass through the lower end of the wire wheel 11 at one end of the connecting column 8 on one side of the C-shaped lifting column 7. Subsequently, the copper wire is continuously pulled so that the copper wire passes through the lower end of the wire wheel 11 at one end of the connecting column 8 at the right side position on the electroplating tank 1 and bypasses the upper end of the wire wheel 11 at one end of the right C-shaped lifting column 7 on the electroplating tank 1. Finally, one end of the copper wire is fixed on the take-up reel. Then, the motor 24 is started through an external controller. Thus, the output end of the motor 24 drives the screw rod at its upper end to rotate. Then, the screw rod rotates in the screw hole 18 of the fixed block 17, causing the connecting rod 12 to move downward at the front end of the electroplating tank 1. Then, the connecting rod 12 synchronously drives the limiting rod 14 at one end of the corresponding C-shaped lifting column 7 to move downward through the fixing rods 25 at both ends, so that the two C-shaped lifting columns 7 can synchronously move downward in the corresponding telescopic grooves 5, and further the two C-shaped lifting columns 7 synchronously drive the connecting column 8 to move downward, and the copper wire is pressed into the electroplating solution in the electroplating tank 1 through the wire wheels 11 at one end of the two connecting columns 8.

[0030] Embodiment 2

[0031] On the basis of Embodiment 1, in combination with the attached Figure 6 、 7 , an air collecting hood 27 for collecting waste gas is installed on the top of the electroplating tank 1. The air collecting hood is used to collect the waste gas generated during the electroplating process, and after the waste gas is collected, it is convenient for centralized treatment; an electrode assembly 26 is installed inside the electroplating tank 1. The electrode assembly 26 includes a cathode plate 26.1 and an anode plate 26.2, and an insulating plate 26.3 is arranged between the cathode plate 26.1 and the anode plate 26.2; a bonding wire passing hole is arranged in the length direction of the cathode plate 26.1, the anode plate 26.2 and the insulating plate 26.3. Upper wire rings 26.5 are arranged at both ends of the anode plate 26.2; lower wire rings 26.4 are arranged at both ends of the cathode plate 26.1; both the upper wire ring 2.5 and the lower wire ring 26.4 are partial rings, and openings are arranged on the rings. When installed, the openings face each other; in order to better adjust the positional relationship between the upper and lower wire rings and the bonding wire through hole, both the upper and lower wire rings are installed at the ends of the cathode plate or the anode plate through a connecting rod with a threaded end. Corresponding T-shaped adjustment grooves are also arranged at the ends of the cathode plate and the anode plate. A fastening nut is arranged on the connecting rod. The end of the connecting rod is in a T shape, and the connecting rod can slide up and down in the adjustment groove to adjust the position of the upper and lower wire rings; the connecting rod, the fastening nut, the upper wire ring, and the lower wire ring are all made of insulating materials, such as porcelain materials.

[0032] When in use, after the bonding wire bypasses the wire wheel 11, it passes through the lower wire loop, the upper wire loop and the bonding wire through hole. The upper wire loop and the lower wire loop are arranged in an open shape to facilitate the installation of the bonding wire. Moreover, the openings of the upper wire loop and the lower wire loop face each other to define the position of the bonding wire and control the bonding wire to be at the center of the bonding wire through hole. The distance between the upper and lower wire loops is adjustable, so that the bonding wire can be adjusted to the center line of the bonding wire channel and the shaking amplitude of the bonding wire during the electroplating process can be reduced.

[0033] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An apparatus for wire bonding electroplating, comprising an electroplating bath (1), a plurality of bases (2) are fixedly installed at the lower end of the electroplating bath (1), and the bases (2) are arranged at the corner positions at the lower end of the electroplating bath (1), a plurality of strengthening frames (3) are fixedly installed on the outer side of the electroplating bath (1), characterized in that: One of the reinforcing frames (3) located on both sides of the electroplating tank (1) is fixedly installed with a column (4). A telescopic groove (5) is opened in the column (4), and a through hole concentric and of the same diameter as the telescopic groove (5) is opened in the reinforcing frame (3) at the upper end of the column (4). A through-type insertion through groove (6) is opened on one side in the telescopic groove (5). A C-shaped lifting column (7) is movably installed in the telescopic groove (5). One end of the C-shaped lifting column (7) is provided with a connecting column (8). One end of the connecting column (8) is fixedly installed with an arc-shaped fixing block (9) and an arc-shaped movable block (10) at one end of the C-shaped lifting column (7). The other end of the C-shaped lifting column (7) is fixedly installed with a limiting rod (14). A connecting rod (12) is fixedly connected between the two limiting rods (14). A motor (24) is fixedly installed at the front end of the electroplating tank (1). A screw rod is fixedly installed on the output end of the motor (24), and the motor (24) is electrically connected to an external controller through a connecting wire; One end of the C-shaped lifting column (7) is provided with a first insertion slot (13), and the end of the C-shaped lifting column (7) provided with the first insertion slot (13) is inserted and installed in the telescopic groove (5); A plug block (15) is fixedly installed on the limiting rod (14) relative to one end of the C-shaped lifting column (7). The plug block (15) passes through the insertion through groove (6) and is inserted and installed in the first insertion slot (13); A wire guide wheel (11) is provided on the longitudinal part of the connecting column (8). The wire guide wheel (11) is rotatably installed at the front end of the connecting column (8) through a pin shaft (19). A wire guide wheel (11) is also rotatably installed at one end of the C-shaped lifting column (7) through a pin shaft (19). The wire guide wheel (11) at one end of the C-shaped lifting column (7) is higher than the wire guide wheel (11) at one end of the connecting column (8); The connecting column (8) is L-shaped; Fixed rods (25) are fixedly installed at both ends of the connecting rod (12). Second insertion slots (16) are respectively opened on the opposite sides of the two fixed rods (25). The fixed rods (25) are inserted and installed at one end of the corresponding limiting rod (14) through the second insertion slots (16), and the fixed rods (25) are fixed to the limiting rod (14) and the C-shaped lifting column (7) by screws. A fixing block (17) is fixedly installed at the center position of the front end of the connecting rod (12). A threaded hole (18) is opened in the fixing block (17). The threaded hole (18) is threadedly connected to the screw rod at the upper end of the motor (24).

2. The apparatus for wire bonding electroplating according to claim 1, wherein: A limiting ring (21) is fixedly installed at the end of the C-shaped lifting column (7) away from the first insertion slot (13). Two positioning blocks (20) are fixedly installed on the C-shaped lifting column (7) at a position above the limiting ring (21).

3. The device for wire bonding electroplating according to claim 2, characterized in that: The arc-shaped fixed block (9) is fixedly installed at one end of the connecting column (8). Positioning grooves (23) are respectively formed on the opposite sides of the arc-shaped fixed block (9) and the arc-shaped movable block (10). Fixed seats (22) are respectively and fixedly installed on the outer sides of the arc-shaped fixed block (9) and the arc-shaped movable block (10). The arc-shaped fixed block (9) and the arc-shaped movable block (10) are respectively inserted and installed on the outer side of the C-shaped lifting column (7), and the positioning grooves (23) are inserted and installed on the corresponding positioning blocks (20). The two adjacent fixed seats (22) on the outer sides of the arc-shaped fixed block (9) and the arc-shaped movable block (10) are fixed by screws.

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