Cathode rollers for electrolytic copper foil, their grinding and polishing methods and applications

Abstract

This invention provides a cathode roller for electrolytic copper foil, its grinding and polishing method, and its application. The method includes three-step grinding using a grinding device and two-step polishing using a polishing device. Specifically, the grinding device for the first step uses a grit size of any one of 46# to 120#; the grinding device for the second step uses a grit size of any one of 220# to 400#; the grinding device for the third step uses a grit size of any one of 600# to 1000#; the polishing device for the first step uses a mesh size of any one of 800 mesh to 1500 mesh; and the polishing device for the second step uses a mesh size of any one of 2000 mesh to 3500 mesh. This grinding and polishing method, by using a grinding device with a specific grit size for three-step grinding and a polishing device with a specific mesh size for two-step polishing, significantly reduces the surface roughness of the cathode roller, showing good application results in the manufacture of smooth, roughened, low-profile electrolytic copper foil.

Description

Technical Field

[0001] This invention relates to the field of electrolytic copper foil technology, and more specifically, to a cathode roller for electrolytic copper foil, its grinding and polishing method, and its application. Background Technology

[0002] Electrolytic copper foil is a continuation of the crystalline structure of copper ions on the surface of the cathode roller. Copper ions are electrodeposited onto titanium crystals, thus growing into copper foil. The side in contact with the cathode roller is called the smooth side, and the other side is called the rough side. The crystalline structure of the cathode roller surface determines the crystalline state of the electrolytic copper foil. A high surface smoothness and fine grains result in a finely crystalline copper layer deposited electrolytically. Different lattice sizes, shapes, and arrangements on the cathode roller surface lead to different electrochemical properties, electrode potentials, and overvoltages, exhibiting different electrochemical behaviors with impurities and additives in the electrolyte.

[0003] Since the surface treatment of smooth-surface roughened reverse copper foil is performed on the smooth surface of the raw foil, the surface condition of the cathode roller becomes even more crucial when producing smooth-surface roughened low-profile electrolytic copper foil. The smoother the surface of the cathode roller, the closer the actual surface area is to the theoretical surface area, the more negatively the cathode potential shifts, and the greater the cathode polarization value. This is beneficial for finer copper crystallization and results in lower surface roughness of the produced raw foil. Because the development of high-frequency, high-speed circuit boards requires increasingly lower surface roughness for copper foil processing, the roughness Ra of the cathode roller must generally be less than 0.15 μm. This places high demands on the grinding and polishing technology of the cathode roller.

[0004] Chinese patent application 201410259970.3 discloses a grinding method for a cathode roller used in the production of very low profile copper foil from electrolytic copper foil. This invention provides a grinding method for a cathode roller used in the production of very low profile copper foil from electrolytic copper foil with a reasonable grinding process. However, in practice, it has been found that the surface roughness Ra of the cathode roller after grinding using this patented technology is generally 0.25-0.4μm, which does not meet the surface roughness requirements for roughening and reversing copper foil. Summary of the Invention

[0005] The main objective of this invention is to provide a cathode roller for electrolytic copper foil, its grinding and polishing method, and its application, so as to solve the problem that the cathode roller for electrolytic copper foil in the prior art is difficult to achieve the roughness requirements of smooth surface roughening reverse copper foil.

[0006] To achieve the above objectives, according to one aspect of the present invention, a method for grinding and polishing a cathode roller for electrolytic copper foil is provided. The method includes three-step grinding using a grinding device and two-step polishing using a polishing device. The grinding device used for the first step of grinding has a grit size of any one of 46# to 120#, the grinding device used for the second step of grinding has a grit size of any one of 220# to 400#, the grinding device used for the third step of grinding has a grit size of any one of 600# to 1000#, the polishing device used for the first step of polishing has a mesh size of any one of 800 mesh to 1500 mesh, and the polishing device used for the second step of polishing has a mesh size of any one of 2000 mesh to 3500 mesh.

[0007] Furthermore, the grinding and / or polishing medium is water, preferably with a flow rate of 1–2.5 m³ / h. 3 / h;

[0008] Preferably, the grinding device is a grinding wheel, and more preferably, the grinding device is a PVA grinding wheel;

[0009] Preferably, the polishing device is a polishing cylinder, and more preferably, the abrasive of the polishing device is silicon carbide or aluminum oxide;

[0010] Preferably, the three-step grinding and two-step polishing are performed on a dedicated grinding roller machine, with a grinding device installed on one side and a polishing device installed on the other side.

[0011] Further, the grinding pressure in the first grinding step is 0.3-0.6 MPa; preferably, the lateral movement speed of the grinding device in the first grinding step is 30-60 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 strokes; preferably, the rotational speed of the cathode roller during the first grinding step is 2-8 rpm; preferably, the particle size of the grinding device in the first grinding step is any one of 60# to 80#.

[0012] Further, the grinding pressure in the second grinding step is 0.2-0.5 MPa; preferably, the lateral movement speed of the grinding device in the second grinding step is 20-50 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 times; preferably, the rotational speed of the cathode roller during the second grinding step is 2-8 rpm; preferably, the particle size of the grinding device in the second grinding step is any one of 300# to 400#.

[0013] Furthermore, the grinding pressure in the third grinding step is 0.1-0.4 MPa; preferably, the lateral movement speed of the grinding device in the third grinding step is 10-40 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 strokes; preferably, the rotational speed of the cathode roller during the third grinding step is 2-8 rpm; preferably, the particle size of the grinding device in the third grinding step is any one of 800# to 1000#.

[0014] Furthermore, the polishing pressure of the first polishing step is 1.0-3.0A, preferably, the rotation speed of the cathode roller during the first polishing step is 1.5-3.0 rpm, preferably, the polishing time of the first polishing step is 20-40 min; preferably, the mesh size of the polishing device for the first polishing step is 900 mesh to 1200 mesh.

[0015] Furthermore, the polishing pressure of the second polishing step is 0.5-1.2A, preferably, the rotation speed of the cathode roller is 1.5-3.0 rpm when performing the second polishing step, and preferably the polishing time of the first polishing step is 20-40 min; preferably, the mesh size of the polishing device for the second polishing step is 3000 mesh to 3500 mesh.

[0016] Furthermore, the surface roughness Ra of the cathode roller after the second polishing step is ≤0.15μm, preferably ≤0.12μm.

[0017] According to another aspect of this application, a cathode roller for electrolytic copper foil is provided, which is obtained by any of the above-described grinding and polishing methods.

[0018] According to another aspect of this application, the application of the above-mentioned cathode roller for electrolytic copper foil in the production of smooth, roughened, low-profile electrolytic copper foil is provided.

[0019] By applying the technical solution of this invention, the above-mentioned grinding and polishing method significantly reduces the surface roughness of the cathode roller through a three-step grinding process using a grinding device with a specific grit size and a two-step polishing process using a polishing device with a specific mesh size. This method is suitable for the production of electrolytic copper foil, and its application effect is particularly improved in the manufacturing of smooth, roughened, low-profile electrolytic copper foil. Furthermore, due to the lower surface roughness of the cathode roller, the problems of oxidation and scratches on the cathode roller surface are effectively solved. Detailed Implementation

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the embodiments.

[0021] As analyzed in the background section of this application, existing technologies suffer from the problem that cathode rollers used for electrolytic copper foil cannot meet the roughness requirements for smoothing and reversing copper foil. To solve this problem, this application provides a cathode roller for electrolytic copper foil, its grinding and polishing method, and its application. According to a typical embodiment of this application, a grinding and polishing method for a cathode roller for electrolytic copper foil is provided. This method includes three-step grinding using a grinding device and two-step polishing using a polishing device. The grinding device used for the first step of grinding has a grit size of any one of 46# to 120#, the grinding device used for the second step of grinding has a grit size of any one of 220# to 400#, the grinding device used for the third step of grinding has a grit size of any one of 600# to 1000#, the polishing device used for the first step of polishing has a mesh size of any one of 800 mesh to 1500 mesh, and the polishing device used for the second step of polishing has a mesh size of any one of 2000 mesh to 3500 mesh.

[0022] The aforementioned grinding and polishing method, employing a three-step grinding device with a specific grit size and a two-step polishing device with a specific mesh size, significantly reduces the surface roughness of the cathode roller. This method is suitable for the production of electrolytic copper foil, and its effectiveness is particularly enhanced in the manufacture of smooth, roughened, low-profile electrolytic copper foil. Furthermore, the lower surface roughness of the cathode roller effectively solves the problems of oxidation and scratches on its surface.

[0023] In some typical embodiments of this application, in order to improve the efficiency of grinding or polishing and further reduce the surface roughness of the cathode roller, water is added as a medium during the grinding and / or polishing process. This water acts as a cleaning agent and lubricant to clean impurities on the cathode roller surface and during the grinding or polishing process. Preferably, the flow rate of the medium is 1–2.5 m³ / h. 3 / h, providing better cleaning and lubrication.

[0024] The grinding and polishing apparatuses described above can be selected from existing technologies, and this application does not have any particular requirements.

[0025] In some embodiments of this application, the grinding device is a grinding wheel, which is beneficial to improving the grinding effect; preferably, the grinding device is a PVA grinding wheel, which is a sponge-like elastic grinding wheel using polyvinyl stearate as a binder. This grinding device can adapt to the microscopic uneven structure of the cathode roller and obtain a better uniform and smooth grinding surface.

[0026] In some embodiments of this application, the polishing device is a polishing cylinder, which is beneficial for improving the polishing effect. The abrasive used in the polishing device is preferably, but not limited to, silicon carbide or alumina, with silicon carbide abrasive being preferred because it has a relatively sharp shape and is easily broken, possessing not only strong polishing force but also the ability to break off quickly.

[0027] In some typical embodiments of this application, the three-step grinding and two-step polishing are performed on a dedicated grinding roller machine. One side of the dedicated grinding roller machine is the grinding side, which is used to install grinding devices, and grinding devices of different grit sizes can be installed. The other side is the polishing side, which is used to install polishing devices, and polishing devices of different mesh sizes can be installed.

[0028] In some embodiments of this application, in order to improve the grinding effect, the grinding pressure of the first grinding step is 0.3-0.6 MPa; preferably, the lateral movement speed of the grinding device in the first grinding step is 30-60 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 strokes, which can further improve the grinding efficiency; preferably, the rotation speed of the cathode roller during the first grinding step is 2-8 rpm, which better coordinates with the subsequent grinding and polishing steps and further improves the grinding and polishing effect of the cathode roller.

[0029] In some preferred embodiments of this application, the grinding device for the first step of grinding is a grinding wheel with a grit size of 60# to 80#, which has a particularly outstanding grinding effect.

[0030] In some embodiments of this application, the grinding pressure in the second grinding step is 0.2-0.5 MPa, resulting in a better grinding effect. Preferably, the lateral movement speed of the grinding device in the second grinding step is 20-50 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 times, which can better balance the grinding effect and grinding rate. Preferably, the rotational speed of the cathode roller during the second grinding step is 2-8 rpm, which helps to further improve the effect of the second grinding step. In some preferred embodiments of this application, the particle size of the grinding device in the second grinding step is any one of 300# to 400#, which can better coordinate with other grinding and polishing processes and further reduce the surface roughness of the cathode roller.

[0031] To improve the effect of the third grinding step, in some embodiments of this application, the grinding pressure of the third grinding step is 0.1-0.4 MPa. Preferably, the lateral movement speed of the grinding device in the third grinding step is 10-40 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 strokes, which can better balance the effect and efficiency of the third grinding step. Preferably, the rotation speed of the cathode roller during the third grinding step is 2-8 rpm, which results in a better grinding effect. Preferably, the particle size of the grinding device in the third grinding step is any one of 800# to 1000#, which significantly reduces the surface roughness of the cathode roller after grinding and also has a relatively high grinding efficiency.

[0032] In some preferred embodiments of this application, a three-step grinding process is performed using a PVA grinding wheel. The first step involves grinding with a grit size of 60# to 80#, a polishing pressure of 0.4 MPa to 0.5 MPa, a lateral movement speed of 40 to 50 mm / min, a linear speed of 8 to 12 m / s, 3 to 4 strokes, and a cathode roller speed of 3 to 5 rpm. The second step involves grinding with a grit size of 300# to 400#, a polishing pressure of 0.2 to 0.4 MPa, a lateral movement speed of 25 to 35 mm / min, a linear speed of 8 to 12 m / s, 3 to 4 strokes, and a cathode roller speed of 3 to 5 rpm. The third step involves grinding with a wheel grit size of 800# to 1000#, a polishing pressure of 0.1 to 0.3 MPa, a lateral movement speed of 10 to 30 mm / min, a linear speed of 8 to 12 m / s, 3 to 4 strokes, and a cathode roller speed of 3 to 5 rpm.

[0033] In some embodiments of this application, after the above three-step grinding process, the surface roughness Ra of the cathode roller is 0.4 to 0.6 μm, and the efficiency of the entire grinding and polishing process of the cathode roller is relatively high.

[0034] To improve the effect of the first polishing step, in some embodiments of this application, the polishing pressure of the first polishing step is 1.0-3.0A. Preferably, the rotation speed of the cathode roller during the first polishing step is 1.5-3.0rpm, and the polishing time of the first polishing step is preferably 20-40min. Preferably, the mesh size of the polishing device for the first polishing step is 900-1200 mesh, which significantly improves the polishing effect.

[0035] In some embodiments of this application, the polishing pressure of 0.5-1.2A in the second polishing step can improve the polishing effect; preferably, the rotation speed of the cathode roller is 1.5-3.0 rpm during the second polishing step, resulting in a better polishing effect; preferably, the polishing time of the first polishing step is 20-40 min, which can reduce the surface roughness of the cathode roller; preferably, the mesh size of the polishing device in the second polishing step is 3000-3500 mesh, which has a significant effect on improving the polishing effect of the second step.

[0036] In some embodiments of this application, when performing the first and / or second polishing steps described above, a polishing cylinder is used as the polishing device, and the vibration speed of the polishing cylinder is 150-180 rpm, which is beneficial to further improve the polishing effect.

[0037] In some preferred embodiments of this application, the two-step polishing uses a polishing cylinder with silicon carbide abrasive. In the first step of polishing, the polishing cylinder has a mesh size of 900 to 1200, a vibration speed of 150 to 170 rpm, a polishing pressure of 1.5 to 2.5 A, a cathode roller speed of 2 to 3 rpm, and a polishing time of 25 to 40 min. In the second step of polishing, the polishing cylinder has a mesh size of 3000 to 3500, a vibration speed of 150 to 170 rpm, a polishing pressure of 0.5 to 1 A, a cathode roller speed of 1.5 to 2.5 rpm, and a polishing time of 25 to 40 min.

[0038] In some embodiments of this application, the surface roughness Ra of the cathode roller after the second polishing step is ≤0.15μm, preferably, the surface roughness Ra is ≤0.12μm.

[0039] According to another typical embodiment of this application, a cathode roller for electrolytic copper foil is provided, which is prepared by any of the above-described grinding and polishing methods.

[0040] The cathode roller for electrolytic copper foil of this application employs a three-step grinding process with a grinding device of a specific grit size and a two-step polishing process with a polishing device of a specific mesh size, resulting in a significant reduction in the surface roughness of the cathode roller. This makes it suitable for the production of electrolytic copper foil, especially in the manufacture of smooth, roughened, low-profile electrolytic copper foil, where its application effect is significantly improved. Furthermore, due to the low surface roughness of the cathode roller, the problems of oxidation and scratches on the cathode roller surface are effectively solved.

[0041] According to another typical embodiment of this application, the above-described cathode roller for electrolytic copper foil is provided for use in the production of smooth, roughened, low-profile electrolytic copper foil. The cathode roller for electrolytic copper foil of this application, due to its low surface roughness, is particularly suitable for the production of smooth, roughened, low-profile electrolytic copper foil.

[0042] The beneficial effects that this application can achieve will be further illustrated below with reference to embodiments and comparative examples.

[0043] Example 1

[0044] 1) Offline Installation: The cathode roller is lifted from the electrolytic cell and placed between grinding rollers, then installed on a dedicated grinding machine. One side of the grinding machine is the grinding side, which can accommodate grinding wheels of different mesh sizes; the other side is the polishing side, which can accommodate polishing cylinders of different mesh sizes. The grinding and polishing medium is pure water with a flow rate of 1.5 m³ / min. 3 / h.

[0045] 2) Three-step grinding: PVA grinding wheels are used. The first step uses a 60# grinding wheel with a grinding pressure of 0.45MPa, a lateral movement speed of 45mm / min, a linear speed of 10m / s, 3 strokes, and a cathode roller speed of 4rpm. The second step uses a 320# grinding wheel with a grinding pressure of 0.3MPa, a lateral movement speed of 30mm / min, a linear speed of 10m / s, 3 strokes, and a cathode roller speed of 4rpm. The third step uses a 1000# grinding wheel with a grinding pressure of 0.2MPa, a lateral movement speed of 20mm / min, a linear speed of 10m / s, 3 strokes, and a cathode roller speed of 4rpm.

[0046] 3) Two-step polishing: The polishing device uses a polishing cylinder with silicon carbide abrasive. The first polishing cylinder has a mesh size of 1000, a vibration speed of 160 rpm, a polishing pressure of 2.0A, a cathode roller speed of 2.5 rpm, and a polishing time of 30 min. The second polishing cylinder has a mesh size of 3500, a vibration speed of 160 rpm, a polishing pressure of 0.8A, a cathode roller speed of 2.0 rpm, and a polishing time of 30 min.

[0047] 4) Surface roughness test: The surface roughness Ra of the cathode roller was measured to be 0.12 μm using a handheld roughness tester MarSurf-PS10.

[0048] Example 2

[0049] 1) Offline Installation: The cathode roller is lifted from the electrolytic cell and placed between grinding rollers, then installed on a dedicated grinding machine. One side of the grinding machine is the grinding side, which can accommodate grinding wheels of different mesh sizes; the other side is the polishing side, which can accommodate polishing cylinders of different mesh sizes. The grinding and polishing medium is pure water with a flow rate of 1.5 m³ / min. 3 / h.

[0050] 2) Three-step grinding: PVA grinding wheels are used. The first step uses a 46# grinding wheel with a grinding pressure of 0.50MPa, a lateral movement speed of 50mm / min, a linear speed of 15m / s, 2 strokes, and a cathode roller speed of 4rpm. The second step uses a 220# grinding wheel with a grinding pressure of 0.35MPa, a lateral movement speed of 40mm / min, a linear speed of 12m / s, 4 strokes, and a cathode roller speed of 6rpm. The third step uses one of the 800# grinding wheel grits with a grinding pressure of 0.2MPa, a lateral movement speed of 20mm / min, a linear speed of 10m / s, 3 strokes, and a cathode roller speed of 4rpm.

[0051] 3) Two-step polishing: The first polishing step uses a polishing cylinder with a mesh size of 800, a polishing cylinder vibration speed of 180 rpm, a polishing pressure of 2.5A, a cathode roller speed of 2.5 rpm, and a polishing time of 25 min; the second polishing step uses a polishing cylinder with a mesh size of 3000, a polishing cylinder vibration speed of 160 rpm, a polishing pressure of 1.0A, a cathode roller speed of 2.5 rpm, and a polishing time of 25 min.

[0052] 4) Surface roughness test: The surface roughness Ra of the cathode roller was measured to be 0.13 μm using a handheld roughness tester MarSurf-PS10.

[0053] Example 3

[0054] The difference from Example 1 is that in step 3), the polishing cylinder of the first polishing step has a mesh size of 800 mesh, and the polishing cylinder of the second polishing step has a mesh size of 2000 mesh. The other processing techniques are the same as in Example 1.

[0055] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0056] Example 4

[0057] The only difference from Example 1 is that in step 2), the pressure for all three grinding steps is 0.15 MPa.

[0058] The surface roughness Ra of the obtained cathode roller is 0.20 μm.

[0059] Example 5

[0060] The only difference from Example 1 is that in step 2), the pressure of the first grinding step is 0.3 MPa, the pressure of the second grinding step is 0.2 MPa, and the pressure of the third grinding step is 0.1 MPa.

[0061] The surface roughness Ra of the obtained cathode roller is 0.15 μm.

[0062] Example 6

[0063] The only difference from Example 1 is that in step 2), the pressure of the first grinding step is 0.2 MPa, the pressure of the second grinding step is 0.15 MPa, and the pressure of the third grinding step is 0.1 MPa.

[0064] The surface roughness Ra of the obtained cathode roller is 0.18 μm.

[0065] Example 7

[0066] The only difference from Example 1 is that in step 2), the linear speed of the three grinding steps is 5 m / s.

[0067] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0068] Example 8

[0069] The only difference from Example 1 is that in step 2), the linear speed of the three grinding steps is 15 m / s.

[0070] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0071] Example 9

[0072] The only difference from Example 1 is that in step 2), the linear speed of the three grinding steps is 20 m / s.

[0073] The surface roughness Ra of the obtained cathode roller is 0.18 μm.

[0074] Example 10

[0075] The only difference from Example 1 is that in step 3), the pressure of the first polishing step is 3A and the pressure of the second polishing step is 1.2A.

[0076] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0077] Example 11

[0078] The only difference from Example 1 is that in step 3), the pressure of the first polishing step is 1A and the pressure of the second polishing step is 0.5A.

[0079] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0080] Example 12

[0081] The only difference from Example 2 is that in step 3), the polishing time for the first step is 40 minutes and the polishing time for the second step is 40 minutes.

[0082] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0083] Example 13

[0084] The only difference from Example 1 is that in step 3), the vibration speed of the polishing cylinder in both polishing steps is 150 rpm.

[0085] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0086] Example 14

[0087] The only difference from Example 1 is that in step 3), the vibration speed of the polishing cylinder in both polishing steps is 180 rpm.

[0088] The surface roughness Ra of the obtained cathode roller is 0.14 μm.

[0089] Example 15

[0090] The only difference from Example 1 is that in step 3), the vibration speed of the polishing cylinder in both polishing steps is 130 rpm.

[0091] The surface roughness Ra of the obtained cathode roller is 0.19 μm.

[0092] Example 16

[0093] The only difference from Example 1 is that in step 3), the vibration speed of the polishing cylinder in both polishing steps is 200 rpm.

[0094] The surface roughness Ra of the obtained cathode roller is 0.16 μm.

[0095] Example 17

[0096] The difference from Example 1 is that no medium was added during the grinding and polishing process.

[0097] The surface roughness Ra of the obtained cathode roller is 0.25 μm.

[0098] Comparative Example 1

[0099] The difference from Example 1 is that in step 3), a polishing step is performed, and the mesh size of the polishing tube is 1500 mesh. Other process conditions are the same as the first polishing step in Example 1.

[0100] The surface roughness Ra of the obtained cathode roller is 0.26 μm.

[0101] Comparative Example 2

[0102] The difference from Example 1 is that in step 3), a polishing step is performed, and the polishing process is the same as the second polishing step in Example 1, but the mesh size of the polishing tube is 3500 mesh.

[0103] The surface roughness Ra of the obtained cathode roller is 0.19 μm.

[0104] Comparative Example 3

[0105] The difference from Example 1 is that in step 3), only one grinding step was performed, and the grinding process was the same as the second step of Example 1.

[0106] The surface roughness Ra of the obtained cathode roller is 0.35 μm.

[0107] Comparative Example 4

[0108] The difference from Example 1 is that in step 3), the polishing cylinder of the first polishing step has a mesh size of 800 mesh, and the polishing cylinder of the second polishing step has a mesh size of 1500 mesh. Other parameters are the same as in Example 1.

[0109] The surface roughness Ra of the obtained cathode roller is 0.17 μm.

[0110] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects: The grinding and polishing method of this application, through three-step grinding with a grinding device of a specific grit size and two-step polishing with a polishing device of a specific mesh size, significantly reduces the surface roughness of the cathode roller, making it suitable for the production of electrolytic copper foil, especially showing a significant improvement in the manufacturing of smooth, roughened, low-profile electrolytic copper foil. Furthermore, due to the lower surface roughness of the cathode roller, the problems of oxidation and scratches on the cathode roller surface are effectively solved.

[0111] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for grinding and polishing a cathode roller for electrolytic copper foil, characterized in that, This includes three-step grinding using a grinding device and two-step polishing using a polishing device; The grinding device used in the first grinding step has a particle size of 46# to 120#, the grinding device used in the second grinding step has a particle size of 220# to 400#, the grinding device used in the third grinding step has a particle size of 600# to 1000#, the polishing device used in the first polishing step has a mesh size of 800 mesh to 1500 mesh, and the polishing device used in the second polishing step has a mesh size of 2000 mesh to 3500 mesh. The grinding device is a PVA grinding wheel, and the polishing device is a polishing cylinder; The grinding pressure in the first grinding step is 0.3-0.6 MPa, the grinding pressure in the second grinding step is 0.2-0.5 MPa, and the grinding pressure in the third grinding step is 0.1-0.4 MPa. The polishing pressure for the first polishing step is 1.0-3.0A, and the polishing pressure for the second polishing step is 0.5-1.2A. The lateral movement speed of the grinding device in the first step of grinding is 30-60 mm / min, the linear speed is 5-15 m / s, and the stroke is 2-5 strokes; The second step of grinding involves a lateral movement speed of 20-50 mm / min, a linear speed of 5-15 m / s, and a stroke of 2-5 strokes. The grinding device for the third step of grinding has a lateral moving speed of 10-40 mm / min, a linear speed of 5-15 m / s, and a stroke of 2-5 strokes. After the second polishing step, the surface roughness Ra of the cathode roller is ≤0.15μm.

2. The grinding and polishing method according to claim 1, characterized in that, The grinding and / or polishing medium is water, and the flow rate of the medium is 1~2.5m³. 3 / h.

3. The grinding and polishing method according to claim 1, characterized in that, The abrasive used in the polishing device is silicon carbide or aluminum oxide.

4. The grinding and polishing method according to any one of claims 1 to 3, characterized in that, The grinding device used in the first step of grinding has a particle size of any one of 60# to 80#. And / or, the particle size of the grinding device used in the second grinding step is any one of 300# to 400#; And / or, the grinding device used in the third grinding step has a particle size of any one of 800# to 1000#.

5. The grinding and polishing method according to any one of claims 1 to 3, characterized in that, The rotational speed of the cathode roller is 2-8 rpm during the first grinding step and / or the second grinding step and / or the third grinding step.

6. The grinding and polishing method according to any one of claims 1 to 3, characterized in that, The rotation speed of the cathode roller during the first polishing step and / or the second polishing step is 1.5-3.0 rpm, and the polishing time for the first polishing step and / or the second polishing step is 20-40 min.

7. The grinding and polishing method according to any one of claims 1 to 3, characterized in that, The polishing device used in the first step of polishing has a mesh size of 900 to 1200 mesh; And / or, the polishing device used in the second polishing step has a mesh size of 3000 to 3500.

8. A cathode roller for electrolytic copper foil, characterized in that, Obtained by the grinding and polishing method according to any one of claims 1 to 7.

9. The application of the cathode roller for electrolytic copper foil as described in claim 8 in the production of smooth, roughened, low-profile electrolytic copper foil.