Surface processing method for carbon fiber PEEK material retaining ring

Abstract

The application relates to a surface processing method of a carbon fiber PEEK material retaining ring, which comprises the following steps: assembling a carbon fiber PEEK material retaining ring and a clamp, and then respectively performing first milling on the upper surface of the carbon fiber PEEK material retaining ring and second milling on the lower surface. The surface processing method provided by the application realizes the surface processing of the ring piece after the initial processing by adopting a specific processing process, so that the flatness and parallelism of the obtained product after processing meet the use requirements of the product, the problem of unqualified flatness and parallelism of the ring piece product is avoided, the flatness of the obtained ring piece product is less than or equal to 0.001 mm, and the parallelism is less than or equal to 0.002 mm.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of surface treatment, in particular to a surface processing method of a carbon fiber PEEK material retaining ring. BACKGROUND

[0002] At present, chemical mechanical polishing is a key technology for realizing wafer surface planarization in integrated circuit manufacturing process. With the increasing complexity of semiconductor manufacturing process, chemical mechanical polishing is more widely used. As one of the main consumables of chemical mechanical planarization process, the retaining ring is widely used in chemical mechanical polishing process.

[0003] CN111571427A discloses a retaining ring, which comprises a first ring and a second ring; the bonding part of the first ring and the second ring is subjected to sand blasting treatment; the roughness Ra of the bonding part of the first ring after sand blasting treatment is 4-8μm; the roughness Ra of the bonding part of the second ring after sand blasting treatment is 4-8μm. The retaining ring provided by the scheme solves the problems of particle dropping and delamination during use by sand blasting treatment of the bonding part of the retaining ring, and strictly limits the roughness of the bonding part after sand blasting, thereby significantly improving the service life of the retaining ring.

[0004] CN115958523A discloses a retaining ring and a polishing device. The retaining ring comprises a ring body having an inner peripheral wall, an outer peripheral wall and a polishing surface connected to the top end of the inner peripheral wall and the outer peripheral wall; the ring body further has a plurality of spaced grooves recessed from the polishing surface, the grooves extending from the inner peripheral wall to the outer peripheral wall and penetrating through; wherein the width between the two side walls of the groove is not completely the same in the direction perpendicular to the bottom wall of the groove, and the sum of the widths between the two side wall bottoms of all the grooves is greater than or equal to the sum of the widths between the two side wall tops of all the grooves. The retaining ring can reduce the polishing defects of the surface of the semiconductor structure and improve the polishing rate.

[0005] However, at present, carbon fiber reinforced polyether ether ketone material, i.e. carbon fiber PEEK material, is usually used to prepare ring parts, and the flatness and parallelism of the surface of the obtained ring parts still need to be further processed after initial forming to meet the use requirements. However, uneven stress on the workpiece may occur in the current surface treatment process, resulting in poor flatness and parallelism of the obtained ring part products. SUMMARY

[0006] In view of the problems in the prior art, the purpose of the present application is to provide a surface processing method of a carbon fiber PEEK material retaining ring to solve the problem of poor flatness and parallelism of the obtained ring part products.

[0007] To achieve this purpose, the present application adopts the following technical solutions:

[0008] The application provides a surface processing method of a carbon fiber PEEK material retaining ring, and the surface processing method comprises the following steps:

[0009] The carbon fiber PEEK material retaining ring and the clamp are assembled, and then the upper surface of the carbon fiber PEEK material retaining ring is subjected to first milling, and the lower surface is subjected to second milling.

[0010] The surface processing method provided by the application realizes surface processing of the ring piece after initial processing by adopting a specific processing process, so that the flatness and parallelism of the obtained product after processing meet the use requirements of the product, the problem of unqualified flatness and parallelism of the ring piece product is avoided, the flatness of the obtained ring piece product is ≤0.001 mm, and the parallelism is ≤0.002 mm.

[0011] As a preferred technical solution of the application, the flatness of the surface of the clamp in contact with the carbon fiber PEEK material retaining ring is ≤0.01 mm.

[0012] As a preferred technical solution of the application, the assembly is bonding the carbon fiber PEEK material retaining ring and the clamp.

[0013] As a preferred technical solution of the application, the spindle speed of the first milling is 5000-6000 r / min.

[0014] As a preferred technical solution of the application, the back engagement amount of the first milling is 0.1-0.2 mm.

[0015] As a preferred technical solution of the application, the feeding speed of the first milling is 1300-1400 mm / min.

[0016] As a preferred technical solution of the application, the spindle speed of the second milling is 4500-5000 r / min.

[0017] As a preferred technical solution of the application, the back engagement amount of the second milling is 0.1-0.15 mm.

[0018] As a preferred technical solution of the application, the feeding speed of the second milling is 1200-1300 mm / min.

[0019] As a preferred technical solution of the application, the surface processing method comprises the following steps:

[0020] The carbon fiber PEEK material retaining ring and the clamp are assembled, and then the upper surface of the carbon fiber PEEK material retaining ring is subjected to first milling, and the lower surface is subjected to second milling;

[0021] The planeness of the contact surface of the clamp carbon fiber PEEK material retaining ring is ≤0.01mm; the assembly is to bond the carbon fiber PEEK material retaining ring and the clamp; the spindle speed of the first milling is 5000-6000r / min; the back engagement of the first milling is 0.1-0.2mm; the feed speed of the first milling is 1300-1400mm / min; the spindle speed of the second milling is 4500-5000r / min; the back engagement of the second milling is 0.1-0.15mm; and the feed speed of the second milling is 1200-1300mm / min.

[0022] Compared with the prior art, the present application has the following beneficial effects:

[0023] The surface processing method provided by the present application realizes efficient processing of the surface of the ring piece after initial processing by adopting a specific processing process and with the aid of specific milling parameters and a clamp, avoids the problem of unqualified planeness and parallelism of the ring piece product, and the planeness of the obtained ring piece product is ≤0.001mm and the parallelism is ≤0.002mm. DETAILED DESCRIPTION

[0024] In order to better illustrate the present application and facilitate the understanding of the technical solutions of the present application, the typical but non-limiting embodiments of the present application are as follows:

[0025] The present embodiment provides a surface processing method of a carbon fiber PEEK material retaining ring, which comprises:

[0026] The carbon fiber PEEK material retaining ring and the clamp are assembled, and then the upper surface of the carbon fiber PEEK material retaining ring is subjected to first milling and the lower surface is subjected to second milling.

[0027] Specifically, the planeness of the surface of the clamp in contact with the carbon fiber PEEK material retaining ring is ≤0.01mm.

[0028] In the present application, controlling the planeness of the contact surface of the clamp is conducive to avoiding the problem of poor surface performance parameters of the retaining ring after processing due to the influence of the clamp itself.

[0029] Specifically, the assembly is to bond the carbon fiber PEEK material retaining ring and the clamp.

[0030] In the present application, the adhesive used for bonding the retaining ring and the clamp in the assembly can be glue, or other bonding tools that can achieve the same bonding strength as glue, such as strong adhesive tape, etc., but the bonding medium used should not affect the subsequent milling process to ensure that it does not interfere with the milling process.

[0031] In the bonding process, the retaining ring preliminary material of the carbon fiber PEEK material is bonded to the flat clamp, specifically, the lower surface or bottom surface of the flat clamp and the retaining ring preliminary material is bonded when processing the upper surface or top surface, then first milling is performed, then the flat clamp and glue are removed, then the upper surface and the flat clamp are bonded, and second milling is performed on the lower surface and the bottom surface.

[0032] After the surface processing method of the present application is completed, the surface residual adhesive can be removed by chemical cleaning (which has no effect on the performance of the retaining ring) or by pre-leaving a margin.

[0033] Further, in order to ensure that the ring product obtained after milling can have better surface performance, the influencing parameters in milling are further limited, such as spindle speed, back engagement amount and feed speed.

[0034] Specifically, the spindle speed of the first milling is 5000-6000 r / min, for example, it can be 5000 r / min, 5100 r / min, 5200 r / min, 5300 r / min, 5400 r / min, 5500 r / min, 5600 r / min, 5700 r / min, 5800 r / min, 5900 r / min or 6000 r / min, etc., but not limited to the listed values, other unlisted values within this range are also applicable.

[0035] Specifically, the back engagement amount of the first milling is 0.1-0.2 mm, for example, it can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm or 0.2 mm, etc., but not limited to the listed values, other unlisted values within this range are also applicable.

[0036] Specifically, the feed speed of the first milling is 1300-1400 mm / min, for example, it can be 1300 mm / min, 1310 mm / min, 1320 mm / min, 1330 mm / min, 1340 mm / min, 1350 mm / min, 1360 mm / min, 1370 mm / min, 1380 mm / min, 1390 mm / min or 1400 mm / min, etc., but not limited to the listed values, other unlisted values within this range are also applicable.

[0037] Specifically, the spindle speed of the second milling is 4500-5000 r / min, for example, it can be 4500 r / min, 4550 r / min, 4600 r / min, 4650 r / min, 4700 r / min, 4750 r / min, 4800 r / min, 4850 r / min, 4900 r / min, 4950 r / min or 5000 r / min, etc., but not limited to the listed values, other unlisted values within the range are also applicable.

[0038] Specifically, the second milling is 0.1-0.15mm, for example, it can be 0.1mm, 0.105mm, 0.11mm, 0.115mm, 0.12mm, 0.125mm, 0.13mm, 0.135mm, 0.14mm, 0.145mm or 0.15mm, etc., but not limited to the listed values, other unlisted values within the range are also applicable.

[0039] Specifically, the second milling is 1200-1300mm / min, for example, it can be 1200mm / min, 1210mm / min, 1220mm / min, 1230mm / min, 1240mm / min, 1250mm / min, 1260mm / min, 1270mm / min, 1280mm / min, 1290mm / min or 1300mm / min, etc., but not limited to the listed values, other unlisted values within the range are also applicable.

[0040] In order to further illustrate the effect of the present application, the following specific actual implementation examples are provided as follows:

[0041] Example 1

[0042] The present embodiment provides a surface processing method of a carbon fiber PEEK material retaining ring, the surface processing method comprising:

[0043] The carbon fiber PEEK material retaining ring and the clamp are assembled, and then the upper surface of the carbon fiber PEEK material retaining ring is first milled, and the lower surface is second milled;

[0044] The planeness of the surface of the fixture in contact with the carbon fiber PEEK material retaining ring is 0.01 mm; the assembly is to bond the carbon fiber PEEK material retaining ring and the fixture; the spindle speed of the first milling is 5400 r / min; the back engagement of the first milling is 0.14 mm; the feed speed of the first milling is 1360 mm / min; the spindle speed of the second milling is 4700 r / min; the back engagement of the second milling is 0.12 mm; and the feed speed of the second milling is 1240 mm / min.

[0045] Example 2

[0046] The embodiment provides a surface processing method of a carbon fiber PEEK material retaining ring, and the surface processing method comprises the following steps:

[0047] The carbon fiber PEEK material retaining ring and the fixture are assembled, and then the upper surface of the carbon fiber PEEK material retaining ring is subjected to first milling, and the lower surface is subjected to second milling.

[0048] The planeness of the surface of the fixture in contact with the carbon fiber PEEK material retaining ring is 0.001 mm; the assembly is to bond the carbon fiber PEEK material retaining ring and the fixture; the spindle speed of the first milling is 5700 r / min; the back engagement of the first milling is 0.16 mm; the feed speed of the first milling is 1330 mm / min; the spindle speed of the second milling is 4800 r / min; the back engagement of the second milling is 0.14 mm; and the feed speed of the second milling is 1270 mm / min.

[0049] Example 3

[0050] The embodiment provides a surface processing method of a carbon fiber PEEK material retaining ring, and the surface processing method comprises the following steps:

[0051] The carbon fiber PEEK material retaining ring and the fixture are assembled, and then the upper surface of the carbon fiber PEEK material retaining ring is subjected to first milling, and the lower surface is subjected to second milling.

[0052] The planeness of the surface of the fixture in contact with the carbon fiber PEEK material holding ring is 0.005 mm; the assembly is to bond the carbon fiber PEEK material holding ring and the fixture; the spindle speed of the first milling is 5000 r / min; the back engagement of the first milling is 0.1 mm; the feed speed of the first milling is 1400 mm / min; the spindle speed of the second milling is 5000 r / min; the back engagement of the second milling is 0.15 mm; and the feed speed of the second milling is 1300 mm / min.

[0053] Example 4

[0054] The embodiment provides a surface processing method of a carbon fiber PEEK material holding ring, and the surface processing method comprises:

[0055] The carbon fiber PEEK material holding ring and the fixture are assembled, and then the upper surface of the carbon fiber PEEK material holding ring is subjected to the first milling and the lower surface is subjected to the second milling;

[0056] The planeness of the surface of the fixture in contact with the carbon fiber PEEK material holding ring is 0.007 mm; the assembly is to bond the carbon fiber PEEK material holding ring and the fixture; the spindle speed of the first milling is 6000 r / min; the back engagement of the first milling is 0.2 mm; the feed speed of the first milling is 1300 mm / min; the spindle speed of the second milling is 4500 r / min; the back engagement of the second milling is 0.1 mm; and the feed speed of the second milling is 1200 mm / min.

[0057] Example 5

[0058] The only difference from the embodiment 1 is that the planeness of the surface of the fixture in contact with the carbon fiber PEEK material holding ring is 0.1 mm.

[0059] Example 6

[0060] The only difference from the embodiment 1 is that the feed speed of the first milling is 1000 mm / min.

[0061] Example 7

[0062] The only difference from the embodiment 1 is that the feed speed of the first milling is 1600 mm / min.

[0063] Example 8

[0064] The only difference from the embodiment 1 is that the feed speed of the second milling is 1000 mm / min.

[0065] Example 9

[0066] The difference from example 1 is that the feed speed of the third milling is 1500 mm / min.

[0067] The upper surface and the lower surface of the retaining ring disclosed in CN214322993U are processed by using the above processing process, the milling cutter used in the processing process is an 8mm milling cutter with diamond coating (specification model is D8*L12*4T*8D*50L), the adhesive used in the bonding process of the ring piece and the fixture is 502 glue, and the flatness and parallelism of the surface of the ring piece before and after processing are detected by a three-coordinate detector, and the results are shown in table 1 and table 2, table 1 is the flatness and parallelism of the upper surface, and table 2 is the flatness and parallelism of the lower surface.

[0068] Table 1

[0069]

[0070]

[0071] Table 2

[0072]

[0073] It can be known from the results of the above examples that the surface processing method provided by the application realizes the surface processing of the ring piece after rough machining by using a specific processing process, so that the flatness and parallelism of the obtained product after processing meet the use requirements of the product, the problem of unqualified flatness and parallelism of the ring piece product is avoided, the flatness of the obtained ring piece product is ≤0.0093mm, and the parallelism is ≤0.0098mm.

[0074] It is declared that the detailed structural features of the application are illustrated by the above examples, but the application is not limited to the above detailed structural features, that is, it does not mean that the application must rely on the above detailed structural features to be implemented. It should be understood by those skilled in the art that any improvement of the application, equivalent replacement of the components selected by the application, increase of auxiliary components, selection of specific modes, etc. fall within the protection scope and disclosure scope of the application.

[0075] The preferred embodiments of the application are described in detail above, but the application is not limited to the specific details in the above embodiments, and various simple modifications can be made to the technical solutions of the application within the technical concept of the application, and these simple modifications all belong to the protection scope of the application.

[0076] It should be further noted that each of the various technical features described in the above embodiments can be combined with any other technical features in any suitable manner, and the present application is not limited to the combinations explicitly described herein, unless otherwise specified.

[0077] Furthermore, any combination of the various embodiments of the present application can be made, as long as it does not deviate from the spirit of the present application, and it should be considered as disclosed by the present application.

Claims

1. A surface processing method of a carbon fiber PEEK material retaining ring, characterized by, The surface processing method comprises: The carbon fiber PEEK material holding ring and the clamp are assembled by bonding; the lower surface of the carbon fiber PEEK material holding ring and the flat clamp are bonded when processing the upper surface, then first milling is carried out, then the flat clamp and the glue are removed, then the upper surface and the flat clamp are bonded, and second milling is carried out on the lower surface; The flatness of the surface of the clamp in contact with the carbon fiber PEEK material holding ring is ≤0.01mm; The spindle speed of the first milling is 5000-6000r / min; the feeding speed of the first milling is 1300-1400mm / min; The spindle speed of the second milling is 4500-5000r / min; the feeding speed of the second milling is 1200-1300mm / min.

2. The surface processing method according to claim 1, wherein The back engagement amount of the first milling is 0.1-0.2mm.

3. The surface processing method according to claim 1, wherein The back engagement amount of the second milling is 0.1-0.15mm.

4. The surface processing method according to Claim 1, wherein The surface processing method comprises: The carbon fiber PEEK material holding ring and the clamp are assembled by bonding; the lower surface of the carbon fiber PEEK material holding ring and the flat clamp are bonded when processing the upper surface, then first milling is carried out, then the flat clamp and the glue are removed, then the upper surface and the flat clamp are bonded, and second milling is carried out on the lower surface; The flatness of the surface of the clamp in contact with the carbon fiber PEEK material holding ring is ≤0.01mm; the assembly is bonding of the carbon fiber PEEK material holding ring and the clamp; the spindle speed of the first milling is 5000-6000r / min; the back engagement amount of the first milling is 0.1-0.2mm; the feeding speed of the first milling is 1300-1400mm / min; the spindle speed of the second milling is 4500-5000r / min; the back engagement amount of the second milling is 0.1-0.15mm; and the feeding speed of the second milling is 1200-1300mm / min.

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