A polar laser fabrication mechanism

Abstract

This invention discloses an electrode laser fabrication mechanism, comprising a cutting device, a loading device, a laser fabrication device, a CCD waste removal device, and an unloading device. The loading device includes a multi-station rotary platform assembly, a CCD positioning platform assembly, a CCD imaging assembly, a positioning defect waste removal assembly, and an electrode suction cup gripping assembly. The laser fabrication device includes a multi-station rotary platform assembly, a laser slicing assembly, a slicing defect waste removal assembly, and an electrode vacuum adsorption assembly. The CCD waste removal device includes a multi-station rotary platform assembly, an electrode under-tabneck imaging assembly, an external CCD imaging assembly, an external shape defect waste removal assembly, a tabneck defect waste removal assembly, and an electrode suction cup gripping assembly. The unloading device includes a multi-station rotary platform assembly, an electrode on-tabneck imaging assembly, and an electrode vacuum adsorption assembly. This invention combines slitting and laser cutting, offering advantages such as high precision, high efficiency, low cost, and high yield.

Description

Technical Field

[0001] This invention relates to the field of lithium battery production, and specifically to an electrode laser fabrication mechanism. Background Technology

[0002] Lithium-ion batteries are high-performance green batteries with outstanding advantages such as high capacity, high voltage, low self-discharge, no memory effect, small size, and long lifespan. In recent years, automakers have launched numerous electric vehicle projects, and government policies have also strongly supported the development of the electric vehicle market; however, the market response has been lukewarm. One of the key factors affecting the market promotion of lithium-ion batteries is their safety. Safety issues are related not only to the materials used in the lithium-ion battery itself but also significantly to the electrode manufacturing process. For example, when lithium-ion battery electrodes have severe burrs and powder shedding, the battery may exhibit high self-discharge or even short circuits, posing a significant safety hazard.

[0003] Currently, in lithium battery production, the electrode sheet manufacturing method combines slitting and slicing. Slicing is done using metal die-cutting, which can cut electrode sheets with flexible shapes and high precision, but the production efficiency is low, the material waste rate is high, the cost of metal molds is also high, and the resulting electrode sheets have more burrs and a higher defect rate. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an electrode laser sheet making mechanism that combines slitting and laser cutting, which has the advantages of high precision, high production efficiency, low production cost and high yield.

[0005] The technical solution of the present invention is as follows:

[0006] An electrode laser sheet making mechanism includes a sheet cutting device, a feeding device, a laser sheet making device, a CCD waste removal device, and a unloading device;

[0007] The feeding device includes a first multi-station rotary platform assembly, a CCD positioning platform assembly, a CCD imaging assembly, a positioning defect removal assembly, and a plurality of first electrode suction cups for vertical gripping. The first multi-station rotary platform assembly is provided with a first feeding station, a CCD positioning and imaging station, a positioning defect removal station, and a first unloading station in sequence along the rotation direction. The cutting device is located at the first feeding station. The CCD imaging assembly and the CCD positioning platform assembly are located vertically at the CCD positioning and imaging station. The positioning defect removal assembly is located at the positioning defect removal station. The laser cutting device is located at the first unloading station. The plurality of first electrode suction cups for vertical gripping are arranged downwards on the first multi-station rotary platform assembly, corresponding to the first feeding station, the CCD positioning and imaging station, the positioning defect removal station, and the first unloading station, respectively.

[0008] The laser wafer fabrication device includes a second multi-station rotary platform assembly, a laser slicing assembly, a defective slice removal assembly, and several first electrode vacuum adsorption assemblies. The second multi-station rotary platform assembly is sequentially provided with a second loading station, a laser slicing station, a second unloading station, and a defective slice removal station along the rotation direction. The laser slicing assembly is located at the laser slicing station, the CCD waste removal device is located at the second unloading station, and the defective slice removal assembly is located at the defective slice removal station. The several first electrode vacuum adsorption assemblies are arranged upwards on the second multi-station rotary platform assembly, corresponding to the second loading station, the laser slicing station, the second unloading station, and the defective slice removal station, respectively.

[0009] The CCD waste removal device includes a third multi-station rotary platform assembly, an electrode tabneck imaging assembly, an outline CCD imaging assembly, an outline defect waste removal assembly, a tabneck defect waste removal assembly, and several second electrode suction cups for up-and-down gripping. The third multi-station rotary platform assembly is sequentially equipped with a third loading station, an electrode tabneck imaging station, a third unloading station, an outline defect waste removal station, and a tabneck defect waste removal station along the rotation direction. The electrode tabneck imaging assembly is located under the electrode tabneck. The abneck photo-taking station, the unloading device is located at the third unloading station and is equipped with an outline CCD photo-taking component above it, the outline defect waste removal component is located at the outline defect waste removal station, the Tabneck defect waste removal component is located at the Tabneck defect waste removal station, and the plurality of second electrode suction cups up and down gripping components are arranged downwards on the third multi-station rotating platform component, respectively corresponding to the third loading station, the electrode under Tabneck photo-taking station, the third unloading station, the outline defect waste removal station and the Tabneck defect waste removal station;

[0010] The unloading device includes a fourth multi-station rotary platform assembly, an electrode tabneck imaging assembly, and several second electrode vacuum adsorption assemblies. The fourth multi-station rotary platform assembly is provided with a fourth loading station, an electrode tabneck imaging station, and a fourth unloading station in sequence along the rotation direction. The electrode tabneck imaging assembly is located at the electrode tabneck imaging station. The several second electrode vacuum adsorption assemblies are arranged facing upwards on the fourth multi-station rotary platform assembly, corresponding to the fourth loading station, the electrode tabneck imaging station, and the fourth unloading station, respectively.

[0011] Furthermore, the cutting device includes an electrode belt conveyor assembly and a servo main drive electrode cutting assembly. The electrode belt conveyor assembly is located at the first feeding station, and the servo main drive electrode cutting assembly is located at the feeding end of the electrode belt conveyor assembly.

[0012] Furthermore, the laser slicing device has two laser slicing stations in sequence, and each laser slicing station is equipped with a corresponding laser slicing component.

[0013] Furthermore, the second multi-station rotary platform assembly is provided with a second loading station, a laser slicing station, a second unloading station, a defective slicing waste removal station, and an electrode vacuum adsorption assembly cleaning station in sequence along the rotation direction. The electrode vacuum adsorption assembly cleaning station is equipped with an electrode vacuum adsorption assembly cleaning component.

[0014] Furthermore, the third multi-station rotary platform assembly is provided with a third loading station, an electrode lower surface dust removal station, an electrode lower tabneck photography station, a third unloading station, a defective shape waste removal station, and a defective tabneck waste removal station in sequence along the rotation direction. The electrode lower surface dust removal station is equipped with an electrode lower surface dust removal component.

[0015] Furthermore, the fourth multi-station rotary platform assembly is provided with a fourth loading station, an electrode surface dust removal station, an electrode tabneck photography station, and a fourth unloading station in sequence along the rotation direction. The electrode surface dust removal station is equipped with an electrode surface dust removal component.

[0016] Compared to existing technologies, the advantages of this invention are as follows: The electrode laser fabrication mechanism provided by this invention includes a cutting device, a feeding device, a laser fabrication device, a CCD waste removal device, and a unloading device. Rolled electrode sheets are first cut into long electrode sheets by the cutting device. Then, after positioning defects are removed, the long electrode sheets are transferred to the laser fabrication device. The laser fabrication device cuts the long electrode sheets into individual units. Good products are then received by the CCD waste removal device, while defective products are removed. The CCD waste removal device sequentially takes bottom surface tabneck and outer shape CCD photos of the individual electrode sheets, transferring the good products to the unloading device. Defective products are removed. Finally, the unloading device takes top surface tabneck photos of the individual electrode sheets and then picks up the good products for the next station. This electrode laser fabrication mechanism combines slitting and laser cutting. Compared to metal die cutting, laser cutting offers higher cutting precision, higher production efficiency, and lower operating costs. It also significantly reduces electrode burrs. Furthermore, the system includes several defect detection stations from feeding to unloading, thus ensuring the production quality of lithium battery electrode sheets. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This invention provides a schematic diagram of the structure of an electrode laser fabrication mechanism;

[0019] Figure 2 This is a schematic diagram of the feeding device described in this invention;

[0020] Figure 3 This is a schematic diagram of the structure of the laser wafer fabrication device described in this invention;

[0021] Figure 4 This is a schematic diagram of the CCD waste discharge device described in this invention;

[0022] Figure 5 This is a schematic diagram of the feeding device described in this invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0024] To illustrate the technical solution described in this invention, specific embodiments are described below. Example

[0025] Please see Figure 1 This embodiment provides an electrode laser sheet making mechanism, including a sheet cutting device 1, a feeding device 2, a laser sheet making device 3, a CCD waste removal device 4, and a unloading device 5.

[0026] The cutting device 1 includes an electrode belt conveyor assembly 11 and a servo main drive electrode cutting assembly 12. The servo main drive electrode cutting assembly 12 is located at the feeding end of the electrode belt conveyor assembly 11. The rubber roller and the main drive roller of the servo main drive electrode cutting assembly 12 can be controlled by a servo motor to cut a certain length of electrode. The electrode belt conveyor assembly 11 can transport the long electrode to the designated feeding position through a sensor.

[0027] Combination Figure 2As shown, the feeding device 2 includes a first multi-station rotary platform assembly 21, a CCD positioning platform assembly 22, a CCD imaging assembly 23, a positioning defect waste removal assembly 24, and four first electrode suction cups gripping assemblies 25. The first multi-station rotary platform assembly 21 is arranged along the rotation direction with a first feeding station, a CCD positioning imaging station, a positioning defect waste removal station, and a first unloading station. The electrode belt conveyor assembly 11 is located at the first feeding station. The CCD imaging assembly 23 and the CCD positioning platform assembly 22 are located vertically at the CCD positioning imaging station. The positioning defect waste removal assembly 24 is located at the positioning defect waste removal station. The laser electrode preparation device 3 is located at the first unloading station. The four first electrode suction cups gripping assemblies 25 are arranged downwards on the first multi-station rotary platform assembly 21, corresponding to the first feeding station, the CCD positioning imaging station, the positioning defect waste removal station, and the first unloading station, respectively.

[0028] Combination Figure 3 As shown, the laser wafer fabrication device 3 includes a second multi-station rotary platform assembly 31, two laser slicing assemblies 32, a defective slicing waste removal assembly 33, an electrode vacuum adsorption assembly cleaning assembly 34, and six first electrode vacuum adsorption assemblies 35. The second multi-station rotary platform assembly 31 is sequentially provided with a second loading station, two laser slicing stations, a second unloading station, a defective slicing waste removal station, and an electrode vacuum adsorption assembly cleaning station along the rotation direction. The two laser slicing assemblies 32 are located at the two laser slicing stations respectively. The CCD waste removal device 4 is located at the second unloading station. The defective slicing waste removal assembly 33 is located at the defective slicing waste removal station. The electrode vacuum adsorption assembly cleaning assembly 34 is located at the electrode vacuum adsorption assembly cleaning station. The six first electrode vacuum adsorption assemblies 35 are arranged upwards on the second multi-station rotary platform assembly 31, respectively corresponding to the second loading station, the two laser slicing stations, the second unloading station, the defective slicing waste removal station, and the electrode vacuum adsorption assembly cleaning station.

[0029] Combination Figure 4As shown, the CCD waste removal device 4 includes a third multi-station rotary platform assembly 41, an electrode lower surface dust removal assembly 42, an electrode lower tabneck imaging assembly 43, an outline CCD imaging assembly 44, an outline defect waste removal assembly 45, a tabneck defect waste removal assembly 46, and six second electrode suction cups for vertical gripping assemblies 47. The third multi-station rotary platform assembly 41 is sequentially provided with a third loading station, an electrode lower surface dust removal station, an electrode lower tabneck imaging station, a third unloading station, an outline defect waste removal station, and a tabneck defect waste removal station along the rotation direction. The electrode lower surface dust removal assembly 42 is located at the electrode lower surface dust removal station. The electrode tabneck imaging component 43 is located at the electrode tabneck imaging station. The unloading device 5 is located at the third unloading station and is equipped with an outline CCD imaging component 44 above it. The outline defect waste removal component 45 is located at the outline defect waste removal station, and the tabneck defect waste removal component 46 is located at the tabneck defect waste removal station. The six second electrode suction cups up and down gripping components 47 are set downward on the third multi-station rotating platform component 41, corresponding to the third loading station, the electrode under surface dust removal station, the electrode tabneck imaging station, the third unloading station, the outline defect waste removal station, and the tabneck defect waste removal station, respectively.

[0030] Combination Figure 5 As shown, the unloading device 5 includes a fourth multi-station rotary platform assembly 51, an electrode upper surface dust removal assembly 52, an electrode tabneck imaging assembly 53, and four second electrode vacuum adsorption assemblies 54. The fourth multi-station rotary platform assembly 51 is provided with a fourth loading station, an electrode upper surface dust removal station, an electrode tabneck imaging station, and a fourth unloading station in sequence along the rotation direction. The electrode upper surface dust removal assembly 52 is located at the electrode upper surface dust removal station, and the electrode tabneck imaging assembly 53 is located at the electrode tabneck imaging station. The four second electrode vacuum adsorption assemblies 54 are arranged facing upwards on the fourth multi-station rotary platform assembly 51, corresponding to the fourth loading station, the electrode upper surface dust removal station, the electrode tabneck imaging station, and the fourth unloading station, respectively.

[0031] Working principle: Rolled electrode sheets are cut into long electrode sheets by the servo-driven slicing assembly 12 of the slicing device 1. The long electrode sheets are then conveyed to the first loading station of the loading device 2 via the electrode sheet belt conveyor assembly 11. Then, the first multi-station rotary platform assembly 21 grasps the long electrode sheets by the up-and-down movement of the first electrode sheet suction cup gripping assembly 25. After CCD positioning and imaging and waste removal, the long electrode sheets are loaded into the laser sheet making device 3. The long electrode sheets are cut into four electrode sheet units by two laser slicing assemblies 32. Good products are received by the CCD waste removal device 4, and defective products are collected by the defective slicing waste removal assembly 33. After the first electrode vacuum adsorption assembly 35 rotates once, the surface can be cleaned by the electrode vacuum adsorption assembly cleaning assembly 34; the CCD waste removal device 4 sequentially performs lower surface dust removal, lower surface tabneck photography, and shape CCD photography on the electrode unit. Good products are transferred to the unloading device 5 for unloading, while defective products are collected by the shape defect waste removal assembly 45 and the tabneck defect waste removal assembly 46; finally, after the good products pass through the unloading device 5 sequentially for upper surface dust removal and upper surface tabneck photography on the electrode unit, they can be picked up and moved to the next workstation.

[0032] This electrode laser manufacturing mechanism combines slitting and laser cutting. Compared with metal die cutting, laser cutting offers higher cutting precision, higher production efficiency, and lower operating costs. It also significantly reduces electrode burrs and features several defect detection stations from loading to unloading, thus ensuring the production quality of lithium battery electrodes.

[0033] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A polarimeter laser fabrication mechanism, characterized in that: It includes a cutting device, a feeding device, a laser cutting device, a CCD waste removal device, and a feeding device; The feeding device includes a first multi-station rotary platform assembly, a CCD positioning platform assembly, a CCD imaging assembly, a positioning defect removal assembly, and a plurality of first electrode suction cups for vertical gripping. The first multi-station rotary platform assembly is provided with a first feeding station, a CCD positioning and imaging station, a positioning defect removal station, and a first unloading station in sequence along the rotation direction. The cutting device is located at the first feeding station. The CCD imaging assembly and the CCD positioning platform assembly are located vertically at the CCD positioning and imaging station. The positioning defect removal assembly is located at the positioning defect removal station. The laser cutting device is located at the first unloading station. The plurality of first electrode suction cups for vertical gripping are arranged downwards on the first multi-station rotary platform assembly, corresponding to the first feeding station, the CCD positioning and imaging station, the positioning defect removal station, and the first unloading station, respectively. The laser wafer fabrication device includes a second multi-station rotary platform assembly, a laser slicing assembly, a defective slice removal assembly, and several first electrode vacuum adsorption assemblies. The second multi-station rotary platform assembly is sequentially provided with a second loading station, a laser slicing station, a second unloading station, and a defective slice removal station along the rotation direction. The laser slicing assembly is located at the laser slicing station, the CCD waste removal device is located at the second unloading station, and the defective slice removal assembly is located at the defective slice removal station. The several first electrode vacuum adsorption assemblies are arranged upwards on the second multi-station rotary platform assembly, corresponding to the second loading station, the laser slicing station, the second unloading station, and the defective slice removal station, respectively. The CCD waste removal device includes a third multi-station rotary platform assembly, an electrode tabneck imaging assembly, an outline CCD imaging assembly, an outline defect waste removal assembly, a tabneck defect waste removal assembly, and several second electrode suction cups for up-and-down gripping. The third multi-station rotary platform assembly is sequentially equipped with a third loading station, an electrode tabneck imaging station, a third unloading station, an outline defect waste removal station, and a tabneck defect waste removal station along the rotation direction. The electrode tabneck imaging assembly is located under the electrode tabneck. The abneck photo-taking station, the unloading device is located at the third unloading station and is equipped with an outline CCD photo-taking component above it, the outline defect waste removal component is located at the outline defect waste removal station, the Tabneck defect waste removal component is located at the Tabneck defect waste removal station, and the plurality of second electrode suction cups up and down gripping components are arranged downwards on the third multi-station rotating platform component, respectively corresponding to the third loading station, the electrode under Tabneck photo-taking station, the third unloading station, the outline defect waste removal station and the Tabneck defect waste removal station; The unloading device includes a fourth multi-station rotary platform assembly, an electrode tabneck imaging assembly, and several second electrode vacuum adsorption assemblies. The fourth multi-station rotary platform assembly is provided with a fourth loading station, an electrode tabneck imaging station, and a fourth unloading station in sequence along the rotation direction. The electrode tabneck imaging assembly is located at the electrode tabneck imaging station. The several second electrode vacuum adsorption assemblies are arranged facing upwards on the fourth multi-station rotary platform assembly, corresponding to the fourth loading station, the electrode tabneck imaging station, and the fourth unloading station, respectively.

2. The electrode laser fabrication mechanism according to claim 1, characterized in that: The cutting device includes an electrode belt conveyor assembly and a servo main drive feeding and slicing assembly. The electrode belt conveyor assembly is located at the first feeding station, and the servo main drive feeding and slicing assembly is located at the feeding end of the electrode belt conveyor assembly.

3. The electrode laser fabrication mechanism according to claim 1, characterized in that: The laser slicing device has two laser slicing stations, and each laser slicing station is equipped with a corresponding laser slicing component.

4. The electrode laser fabrication mechanism according to claim 1, characterized in that: The second multi-station rotary platform assembly is provided with a second loading station, a laser slicing station, a second unloading station, a defective slicing waste removal station, and an electrode vacuum adsorption assembly cleaning station in sequence along the rotation direction. The electrode vacuum adsorption assembly cleaning station is equipped with an electrode vacuum adsorption assembly cleaning component.

5. The electrode laser fabrication mechanism according to claim 1, characterized in that: The third multi-station rotary platform assembly is provided with a third loading station, an electrode lower surface dust removal station, an electrode lower tabneck photography station, a third unloading station, a defective shape waste removal station, and a defective tabneck waste removal station in sequence along the rotation direction. The electrode lower surface dust removal station is equipped with an electrode lower surface dust removal component.

6. The electrode laser fabrication mechanism according to claim 1, characterized in that: The fourth multi-station rotary platform assembly is provided with a fourth loading station, an electrode surface dust removal station, an electrode tabneck photography station and a fourth unloading station in sequence along the rotation direction. The electrode surface dust removal station is equipped with an electrode surface dust removal component.

Images