Laser processing systems and processing methods

Abstract

This invention discloses a laser processing system and its processing method. The control unit of the laser processing system calculates a feasible solution set for the processing path based on the processing file, the galvanometer processing range, and the target processing speed. Then, based on the external axial smoothness of the feasible solution set, it generates corresponding processing path information. The control unit then generates control commands for the workpiece drive device, the galvanometer drive device, and the external axial drive device based on this processing path information, controlling the workpiece drive device, the galvanometer drive device, and the external axial drive device to perform corresponding drives. This achieves a simultaneous laser scanning path that considers processing path length, external axial speed, and processing quality optimization.

Description

Technical Field

[0001] This invention belongs to the field of laser processing technology. Specifically, it is a laser processing system and method that optimizes the synchronous laser scanning path by simultaneously considering multiple quality indicators such as laser processing speed and external axial speed, thereby solving the synchronous control problem. Background Technology

[0002] In a laser processing system, synchronous laser path scanning refers to the simultaneous movement of three coordinates: workpiece coordinates, galvanometer coordinates (the position of the galvanometer moved by an external axial motor), and galvanometer scanning point coordinates (the position of the processing point within the galvanometer range). This determines the final processing position, thereby expanding the overall processing range and optimizing processing quality.

[0003] Generally speaking, the scanning speed of the processing points within the galvanometer range is much greater than the speed at which the external axial motor drives the galvanometer to move. Therefore, the smaller the variation in the speed at which the external axial motor drives the galvanometer (hereinafter referred to as external axial speed), the better, and the simpler the path along which the external axial motor drives the galvanometer (hereinafter referred to as external axial path) is, the better. For example, the smaller the variation in external axial speed, the better the laser processing quality; and the simpler the external axial path, the fewer acceleration and deceleration stages there are in the external axial speed.

[0004] Existing laser processing technology generates a fixed processing path simply based on the geometry of the processing graphic, and cannot optimize the processing path according to the user's actual processing needs, thus limiting its application. Summary of the Invention

[0005] This invention provides a laser processing system and its processing method. Since the processing range of the laser galvanometer is related to the scanning range of the galvanometer, when processing a large area, it is necessary to use an external axially moving galvanometer. The laser spot is moved by synchronous control of the workpiece axis (controlling the workpiece coordinates), the external axis (controlling the galvanometer coordinates), and the galvanometer axis (controlling the galvanometer scanning point coordinates) to expand the overall processing range.

[0006] Another objective of this invention is to provide a laser processing system and method that simultaneously considers multiple quality indicators such as the target processing speed and external axial speed of laser processing, and plans this motion control problem as a multi-objective optimization problem (MOP), and performs motion path optimization.

[0007] To achieve the above objectives, the present invention provides a laser processing system and a processing machine for laser processing, comprising:

[0008] Input unit;

[0009] Workpiece driving device;

[0010] Galvanometer drive device;

[0011] External axial drive device;

[0012] A control unit is coupled to the input unit, the workpiece driving device, the galvanometer driving device, and the external axial driving device. The control unit receives the machining sequence, galvanometer machining range, and target machining speed from the input unit. Based on the machining sequence, galvanometer machining range, and target machining speed, the control unit calculates a first set of feasible solutions for the machining path, whereby the first set of feasible solutions completely covers the machining pattern in the machining sequence. The control unit generates first machining path information corresponding to the first set of feasible solutions based on the external axial smoothness of the first set of feasible solutions. The control unit then generates a first workpiece driving device control command, a first galvanometer driving device control command, and a first external axial driving device control command based on the first machining path information. The control unit transmits the first workpiece driving device control command, the first galvanometer driving device control command, and the first external axial driving device control command to the workpiece driving device, the galvanometer driving device, and the external axial driving device, respectively, to control and execute the corresponding drives.

[0013] Ideally, the target processing speed is the combined speed of the workpiece driving device, the galvanometer driving device, and the external axial driving device.

[0014] Ideally, the external axial smoothness is the speed smoothness of the motion trajectory generated by the external axial drive device on the machining path.

[0015] Ideally, the control unit calculates different first processing path information based on different target processing speeds.

[0016] Optimally, the control unit further includes receiving an external axial speed limit transmitted from the input unit. The control unit calculates a second set of feasible solutions for the machining path based on the machining file, the galvanometer machining range, the external axial speed limit, and the target machining speed. The second set of feasible solutions completely covers the machining pattern in the machining file. The control unit generates second machining path information corresponding to the second set of feasible solutions based on the external axial smoothness of the second set of feasible solutions. The control unit generates a second workpiece drive device control command, a second galvanometer drive device control command, and a second external axial drive device control command based on the second machining path information. The control unit transmits the second workpiece drive device control command, the second galvanometer drive device control command, and the second external axial drive device control command to the workpiece drive device, the galvanometer drive device, and the external axial drive device, respectively, to control and execute the corresponding drives.

[0017] Optimally, the control unit further includes generating third processing path information corresponding to the first set of feasible solutions based on the path length of the first set of feasible solutions; the path length of the first set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device, and the external axial driving device in laser processing.

[0018] Furthermore, the control unit also includes a fourth processing path information corresponding to the second set of feasible solutions, based on the path length of the second set of feasible solutions; the path length of the second set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device, and the external axial driving device in laser processing.

[0019] Furthermore, the control unit is coupled to the laser source, and the first processing path information, the second processing path information, the third processing path information, or the fourth processing path information includes the intensity and switching time information of the laser source.

[0020] Optimally, the control unit is coupled to the laser source, and the control unit generates fifth processing path information corresponding to the first set of feasible solutions based on the number of laser source switching and the external axial smoothness of the first set of feasible solutions to control the intensity and switching time of the laser source.

[0021] Furthermore, the control unit is coupled to the laser source, and the control unit generates the sixth processing path information corresponding to the second set of feasible solutions based on the number of laser source switching times and the external axial smoothness of the second set of feasible solutions, and controls the intensity and switching time of the laser source.

[0022] Furthermore, the control unit is coupled to the laser source, and the control unit generates seventh processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times, the external axial smoothness of the first set of feasible solutions, and the path length of the first set of feasible solutions to control the intensity and switching time of the laser source.

[0023] Furthermore, the control unit is coupled to the laser source, and the control unit generates an eighth processing path information corresponding to the second set of feasible solutions to control the intensity and switching time of the laser source based on the number of laser source switching times of the second set of feasible solutions, the external axial smoothness of the second set of feasible solutions, and the path length of the second set of feasible solutions.

[0024] The present invention also provides a laser processing method and a processing machine used in laser processing, comprising:

[0025] The control unit calculates and finds the first set of feasible solutions for the machining path based on the machining file, galvanometer machining range and target machining speed transmitted from the input unit. The first set of feasible solutions completely covers the machining pattern in the machining file.

[0026] The control unit finds the first processing path information of the first set of feasible solutions based on the external axial smoothness of the first set of feasible solutions;

[0027] The control unit generates a first workpiece drive device control command, a first galvanometer drive device control command, and a first external axial drive device control command based on the first processing path information. The control unit outputs the first workpiece drive device control command, the first galvanometer drive device control command, and the first external axial drive device control command and transmits them to the workpiece drive device, the galvanometer drive device, and the external axial drive device, respectively, to control and execute the corresponding drives.

[0028] Ideally, the target processing speed is the combined speed of the workpiece driving device, the galvanometer driving device, and the external axial driving device.

[0029] Ideally, the external axial smoothness is the speed smoothness of the motion trajectory generated by the external axial drive device on the machining path.

[0030] Ideally, the control unit calculates different first processing path information based on different target processing speeds.

[0031] Optimally, the control unit further includes receiving an external axial speed limit transmitted from the input unit. The control unit calculates and finds a second set of feasible solutions for the machining path based on the machining file, the galvanometer machining range, the external axial speed limit, and the target machining speed. The second set of feasible solutions completely covers the machining pattern in the machining file. The control unit finds a second machining path information for the second set of feasible solutions based on the external axial smoothness of the second set of feasible solutions. The control unit generates a second workpiece drive device control command, a second galvanometer drive device control command, and a second external axial drive device control command based on the second machining path information. The control unit outputs the second workpiece drive device control command, the second galvanometer drive device control command, and the second external axial drive device control command and transmits them to the workpiece drive device, the galvanometer drive device, and the external axial drive device, respectively, to control and execute the corresponding drives.

[0032] Optimally, the control unit further includes generating third processing path information corresponding to the first set of feasible solutions based on the path length of the first set of feasible solutions; the path length of the first set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device, and the external axial driving device in laser processing.

[0033] Furthermore, the control unit also includes a fourth processing path information corresponding to the second set of feasible solutions, based on the path length of the second set of feasible solutions; the path length of the second set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device, and the external axial driving device in laser processing.

[0034] Furthermore, the control unit is coupled to the laser source, and the first processing path information, the second processing path information, the third processing path information, or the fourth processing path information includes the intensity and switching time information of the laser source.

[0035] Optimally, the control unit is coupled to the laser source, and the control unit generates fifth processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times and the external axial smoothness of the first set of feasible solutions to control the intensity and switching time of the laser source.

[0036] Furthermore, the control unit is coupled to the laser source, and the control unit generates the sixth processing path information corresponding to the second set of feasible solutions based on the number of laser source switching times and the external axial smoothness of the second set of feasible solutions, and controls the intensity and switching time of the laser source.

[0037] Furthermore, the control unit is coupled to the laser source, and the control unit generates seventh processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times, the external axial smoothness of the first set of feasible solutions, and the path length of the first set of feasible solutions to control the intensity and switching time of the laser source.

[0038] Furthermore, the control unit is coupled to the laser source, and the control unit generates an eighth processing path information corresponding to the second set of feasible solutions to control the intensity and switching time of the laser source based on the number of laser source switching times of the second set of feasible solutions, the external axial smoothness of the second set of feasible solutions, and the path length of the second set of feasible solutions.

[0039] Compared to previous technologies, this invention proposes a wide-range synchronous laser scanning path design. By simultaneously considering multiple quality indicators such as the target processing speed and external axial speed of laser processing, the synchronous control problem is formulated as a multi-objective optimization problem for synchronous path optimization. This achieves a synchronous laser scanning path that simultaneously considers processing path length, external axial speed, and processing quality (such as overheating). This improves upon current methods that simplify the synchronous path to a combination of external axial and galvanometer axial directions based solely on the processing pattern, resulting in inflexible path generation and a lack of consideration for processing conditions and characteristics. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the multi-target laser processing path of the present invention;

[0041] Figure 2 This is a block diagram of the laser processing system of the present invention;

[0042] Figure 3 This is a diagram defining the processing range of the galvanometer in this invention;

[0043] Figure 4 This is a schematic diagram of the external axial path points of the present invention;

[0044] Figure 5 The process flow of the laser processing method of the present invention Figure 1 ;

[0045] Figure 6 The process flow of the laser processing method of the present invention Figure 2 ;

[0046] Figure 7 This is another block diagram of the laser processing system of this application.

[0047] Among them, 10 is the processing graphic; 20 is the first external axial path; 30 is the second external axial path; 100 and 400 are the processing table; 110 is the input element; 120 is the workpiece driving device; 130 is the galvanometer driving device; 140 is the external axial driving device; 150 is the control unit; 160 is the laser source; 200 is the rectangular block; and 300 is the processing graphic. Detailed Implementation

[0048] To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art under the premise of equivalent changes and modifications should fall within the protection scope of the present invention.

[0049] The following detailed description of various embodiments of the present invention, with reference to the accompanying drawings. Besides these detailed descriptions, the present invention can be widely implemented in other embodiments, and any easy substitutions, modifications, or equivalent changes to the described embodiments are included within the scope of the present invention and are subject to the claims. In the description of the specification, many specific details are provided to give the reader a more complete understanding of the present invention; however, the present invention may still be implemented even if some or all of the specific details are omitted. Furthermore, well-known steps or components are not described in the details to avoid unnecessarily limiting the present invention. The same or similar components in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustrative purposes only and do not represent the actual size or number of components; some details may not be fully drawn for the sake of simplicity.

[0050] The purpose of this application is to provide a laser processing system and method. When processing large areas, an external axially moving galvanometer is used to synchronously control the movement of the laser spot via the workpiece axis (controlling workpiece coordinates), the external axis (controlling galvanometer coordinates), and the galvanometer axis (controlling galvanometer scanning point coordinates), thereby expanding the overall processing range. By simultaneously considering multiple quality indicators such as the target processing speed and the external axial speed, this synchronous control problem is formulated as a multi-objective optimization problem (MOP), and synchronous path optimization is performed. For example, such as... Figure 1 As shown, for the processing pattern 10, a comparison is made. Figure 1 After considering various indicators such as the degree of change in external axial speed (e.g., smoothness), speed limit, and path simplification degree (e.g., path length) of the first external axial path 20 and the second external axial path 30, the external axial path that best meets the user's actual needs is selected for processing.

[0051] Please see Figure 2 This application presents a block diagram of a laser processing system. The system, a processing machine 100 used for laser processing, mainly includes: an input unit 110, a workpiece driving device 120, a galvanometer driving device 130, and an external axial driving device 140. The input unit 110 is not limited to any particular input method and can be an input interface on the processing machine 100 or an external input device (e.g., a laptop, server, etc.). The workpiece driving device 120 controls the position and angle (spatial coordinates) of the workpiece. The galvanometer driving device 130 controls the position (spatial coordinates) of the processing point within the galvanometer range. The external axial driving device 140 controls the position (spatial coordinates) of the moving galvanometer.

[0052] The control unit 150 is coupled to the input unit 110, the workpiece driving device 120, the galvanometer driving device 130, and the external axial driving device 140. The control unit 150 receives information such as the machining file, the galvanometer machining range, and the target machining speed from the input unit 110. The machining file can be a CAD file or an image file, etc., without limitation, or it can be a machining path file (e.g., a machining path described by a program). In this embodiment, the galvanometer machining range (e.g., ...) is defined as... Figure 3 As shown, a rectangular block 200 (the shape is not limited in practical applications, depending on the galvanometer of the laser processing machine) is an example. For instance, the external axial path points of a processed pattern 300 are composed of the center points of multiple rectangular blocks 200 within the processing range of this galvanometer, such as... Figure 4 As shown. A feasible solution must achieve 100% coverage of all rectangular blocks 200 and machining patterns 300, and the machining range covered by the external axial path must contain and cover the complete machining pattern 300.

[0053] Changes in the coordinates and arrangement of the rectangular block 200 within the galvanometer's processing range represent changes in the external axial path. The path length, turning angle, and other factors will affect the speed planning details, altering the smoothness of the external axial speed and thus impacting the processing quality.

[0054] Please see Figure 5 This is the flow chart of the laser processing method in this application. Figure 1 The control unit 150 calculates and finds multiple feasible solutions for the machining path based on the machining file, the galvanometer machining range, and the target machining speed transmitted from the input unit 110. The first feasible solution satisfies the condition that it completely covers the machining pattern in the machining file. The target machining speed is the combined speed of the workpiece driving device, the galvanometer driving device, and the external axial driving device.

[0055] The control unit 150 evaluates multiple feasible solutions of the first set of feasible solutions based on the external axial smoothness of the first set of feasible solutions, and finds the optimal processing path information of the first set of feasible solutions as the first processing path information; wherein, the external axial smoothness is the smoothness of the motion trajectory speed generated by the external axial drive device on the processing path.

[0056] The control unit 150 then generates control commands for the first workpiece drive device, the first galvanometer drive device, and the first external axial drive device based on the first machining path information. The control unit 150 outputs these commands and transmits them to the workpiece drive device 120, the galvanometer drive device 130, and the external axial drive device 140, respectively, to control and execute the corresponding drives of these devices. In practical applications, the control unit 150 calculates different first machining path information based on different target machining speeds. Since the target machining speed is the combined speed of the workpiece drive device 120, the galvanometer drive device 130, and the external axial drive device 140, in different machining scenarios, when the target machining speed changes, the individual speeds of the workpiece drive device 120, the galvanometer drive device 130, and the external axial drive device 140 may also change, and the control unit 150 will calculate different first machining path information accordingly.

[0057] In practical application, the control unit 150 further includes receiving the external axial speed limit transmitted from the input unit 110. The control unit 150 calculates multiple feasible solutions for the first set of feasible solutions for the machining path based on the machining file, the galvanometer machining range, the external axial speed limit, and the target machining speed. A second set of feasible solutions satisfies the requirement of completely covering the machining pattern in the machining file. Based on the external axial smoothness of the second set of feasible solutions, the control unit generates the optimal machining path information corresponding to the second set of feasible solutions, which is then used as the second machining path information. The control unit 150 then generates a second workpiece drive device control command, a second galvanometer drive device control command, and a second external axial drive device control command based on the second machining path information. The control unit 150 then transmits these commands to the workpiece drive device 120, the galvanometer drive device 130, and the external axial drive device 140, respectively, to control and execute the corresponding drives of these devices.

[0058] Please refer to the following: Figure 6 This is the flow chart of the laser processing method in this application. Figure 2 In practical application, this application must comply with external axial speed limits and / or take into account the external axial path length.

[0059] In practical application, the control unit 150 further includes a third processing path information corresponding to the first set of feasible solutions, based on the path length of the first set of feasible solutions; the path length of the first set of feasible solutions is the path length of the workpiece driving device 120, the galvanometer driving device 130 and the external axial driving device 130 in laser processing.

[0060] In practical application, the control unit 150 further includes a fourth processing path information corresponding to the second set of feasible solutions, based on the path length of the second set of feasible solutions; the path length of the second set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device and the external axial driving device in laser processing.

[0061] Please see Figure 7 In practical applications, the processing machine 400 used for laser processing, in addition to the aforementioned input unit 110, workpiece driving device 120, galvanometer driving device and external axial driving device 140, has a control unit 150 coupled to a laser source 160. Therefore, the aforementioned first processing path information, second processing path information, third processing path information or fourth processing path information includes the intensity and switching time information of the laser source 160.

[0062] Furthermore, the control unit 150 uses the number of times the laser source 160 of the first feasible solution is switched on and off and the external axial smoothness of the first feasible solution to generate the fifth processing path information corresponding to the first feasible solution and control the intensity and switching time of the laser source.

[0063] Furthermore, the control unit 150 uses the number of times the laser source 160 of the second set of feasible solutions is switched on and off and the external axial smoothness of the second set of feasible solutions to generate the sixth processing path information corresponding to the second set of feasible solutions and control the intensity and switching time of the laser source.

[0064] Furthermore, the control unit 150 uses the laser source switching times, external axial smoothness, and path length of the first feasible solution to generate the seventh processing path information corresponding to the first feasible solution and control the intensity and switching time of the laser source.

[0065] Furthermore, the control unit 150 uses the laser source switching times, external axial smoothness, and path length of the second set of feasible solutions to generate the eighth processing path information corresponding to the second set of feasible solutions and control the intensity and switching time of the laser source.

[0066] In practical application, the control unit 150 calculates and generates a first set of feasible solutions or a second set of feasible solutions according to the first algorithm, and the control unit 150 calculates and generates a first processing path information, a second processing path information, a third processing path information, a fourth processing path information, a fifth processing path information, a sixth processing path information, a seventh processing path information, or an eighth processing path information according to the second algorithm, and the first algorithm and the second algorithm can be the same or different algorithms.

[0067] This application employs a wide-range synchronous laser scanning path design method to achieve a synchronous laser scanning path that simultaneously considers the processing path length, external axial speed, and processing quality (such as overheating). This improves upon existing synchronous paths that are merely simplified to a combination of external axial and galvanometer axial directions based on the processing pattern, resulting in inflexible path generation and a lack of consideration for processing conditions and characteristics.

[0068] This technology plans the large-scale co-moving laser path scanning problem as a multi-objective optimization problem (MOP) and uses a multi-objective evolutionary algorithm to solve it. Considering the limitations of actual physics and engineering applications and boundary conditions, the search space is further narrowed, and the problem is planned and analyzed into a restricted multi-objective optimization problem.

[0069] In practical applications, the first and second algorithms can be Population-Based Metaheuristic Algorithms, where each step has a certain degree of randomness, and each individual in the population is a candidate solution. By designing the processing quality indicators that the co-moving laser path cares about as multiple evaluable and quantifiable computational functions, an evolutionary mechanism of retaining the strong and eliminating the weak is implemented during the population evolution process, and finally the optimal solution after weighing multiple objectives is obtained.

[0070] The evaluation of each objective in co-motion control problem planning can be achieved either by calculating the performance of the objective in real time or by designing heuristic functions to estimate the performance of the objective. The weights among multiple objectives can be defined by the user, who can choose preferred weights for optimization; or the concept of Pareto optimality can be used to design a multi-objective algorithm.

[0071] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. At the same time, those skilled in the art should understand and implement the above description. Therefore, any equivalent changes or modifications made without departing from the concept disclosed in the present invention should be covered within the scope of protection of the present invention.

Claims

1. A laser processing system, comprising a processing machine for laser processing, characterized in that, include: Input unit; Workpiece driving device; Galvanometer drive device; An external axial drive device is used to control the position of the moving galvanometer. A control unit, which is coupled to the input unit, the workpiece driving device, the galvanometer driving device and the external axial driving device; The control unit receives the machining file, galvanometer machining range, and target machining speed from the input unit. Based on the machining file, galvanometer machining range, and target machining speed, the control unit calculates a first set of feasible solutions for the machining path, which completely covers the machining pattern in the machining file. The control unit uses the external axial smoothness of the first set of feasible solutions to generate first machining path information corresponding to the first set of feasible solutions. The control unit then generates a first workpiece drive device control command, a first galvanometer drive device control command, and a first external axial drive device control command based on the first machining path information. The control unit transmits the first workpiece driving device control command, the first galvanometer driving device control command, and the first external axial driving device control command to the workpiece driving device, the galvanometer driving device, and the external axial driving device, respectively, to control and execute the corresponding drives. The external axial smoothness is the smoothness of the motion trajectory speed generated by the external axial drive device on the processing path.

2. The laser processing system according to claim 1, characterized in that: The target processing speed is the combined speed of the workpiece driving device, the galvanometer driving device, and the external axial driving device.

3. The laser processing system according to claim 1, characterized in that: The control unit calculates different first processing path information based on different target processing speeds.

4. The laser processing system according to claim 1, characterized in that: The control unit further includes receiving an external axial speed limit transmitted from the input unit. The control unit calculates a second set of feasible solutions for the machining path based on the machining file, the galvanometer machining range, the external axial speed limit, and the target machining speed. The second set of feasible solutions completely covers the machining pattern in the machining file. The control unit generates a second machining path information corresponding to the second set of feasible solutions based on the external axial smoothness of the second set of feasible solutions. The control unit generates a second workpiece drive device control command, a second galvanometer drive device control command, and a second external axial drive device control command based on the second machining path information. The control unit transmits the second workpiece drive device control command, the second galvanometer drive device control command, and the second external axial drive device control command to the workpiece drive device, the galvanometer drive device, and the external axial drive device, respectively, to control and execute the corresponding drives.

5. The laser processing system according to claim 1, characterized in that: The control unit further includes generating third processing path information corresponding to the first set of feasible solutions based on the path length of the first set of feasible solutions; the path length of the first set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device, and the external axial driving device in laser processing.

6. The laser processing system according to claim 4, characterized in that: The control unit further includes generating fourth processing path information corresponding to the second set of feasible solutions based on the path length of the second set of feasible solutions; the path length of the second set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device and the external axial driving device in laser processing.

7. The laser processing system according to claim 1, characterized in that: The control unit is coupled to the laser source, and the first processing path information includes the intensity and switching time information of the laser source.

8. The laser processing system according to claim 4, characterized in that: The control unit is coupled to the laser source, and the second processing path information includes the intensity and switching time information of the laser source.

9. The laser processing system according to claim 5, characterized in that: The control unit is coupled to the laser source, and the third processing path information includes the intensity and switching time information of the laser source.

10. The laser processing system according to claim 6, characterized in that: The control unit is coupled to the laser source, and the fourth processing path information includes the intensity and switching time information of the laser source.

11. The laser processing system according to claim 1, characterized in that: The control unit is coupled to the laser source. The control unit generates fifth processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times and the external axial smoothness of the first set of feasible solutions, and controls the intensity and switching time of the laser source.

12. The laser processing system according to claim 4, characterized in that: The control unit is coupled to the laser source. The control unit generates the sixth processing path information corresponding to the second set of feasible solutions based on the number of laser source switching and the external axial smoothness of the second set of feasible solutions, and controls the intensity and switching time of the laser source.

13. The laser processing system according to claim 5, characterized in that: The control unit is coupled to the laser source. The control unit generates the seventh processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times, the external axial smoothness of the first set of feasible solutions, and the path length of the first set of feasible solutions, and controls the intensity and switching time of the laser source.

14. The laser processing system according to claim 6, characterized in that: The control unit is coupled to the laser source. The control unit generates the eighth processing path information corresponding to the second set of feasible solutions based on the number of laser source switching, the external axial smoothness, and the path length of the second set of feasible solutions, and controls the intensity and switching time of the laser source.

15. A laser processing method, comprising a processing machine used for laser processing, including: The control unit calculates and finds the first set of feasible solutions for the machining path based on the machining file, galvanometer machining range and target machining speed transmitted from the input unit. The first set of feasible solutions completely covers the machining pattern in the machining file. The control unit finds the first processing path information of the first set of feasible solutions based on the external axial smoothness of the first set of feasible solutions; The control unit generates a first workpiece driving device control command, a first galvanometer driving device control command, and a first external axial driving device control command based on the first processing path information. The control unit outputs the first workpiece driving device control command, the first galvanometer driving device control command, and the first external axial driving device control command, which are respectively transmitted to the workpiece driving device, the galvanometer driving device, and the external axial driving device to control and execute the corresponding drives. The external axial drive device is used to control the position of the moving galvanometer, and the external axial smoothness is the speed smoothness of the motion trajectory generated by the external axial drive device on the machining path.

16. The laser processing method according to claim 15, characterized in that: The target processing speed is the combined speed of the workpiece driving device, the galvanometer driving device, and the external axial driving device.

17. The laser processing method according to claim 15, characterized in that: The control unit calculates different first processing path information based on different target processing speeds.

18. The laser processing method according to claim 15, characterized in that: The control unit further includes receiving an external axial speed limit transmitted from the input unit. The control unit calculates and finds a second set of feasible solutions for the machining path based on the machining file, the galvanometer machining range, the external axial speed limit, and the target machining speed. The second set of feasible solutions completely covers the machining pattern in the machining file. The control unit finds a second machining path information for the second set of feasible solutions based on the external axial smoothness of the second set of feasible solutions. The control unit generates a second workpiece drive device control command, a second galvanometer drive device control command, and a second external axial drive device control command based on the second machining path information. The control unit outputs the second workpiece drive device control command, the second galvanometer drive device control command, and the second external axial drive device control command, respectively, and transmits them to the workpiece drive device, the galvanometer drive device, and the external axial drive device to control and execute the corresponding drives.

19. The laser processing method according to claim 15, characterized in that: The control unit further includes generating third processing path information corresponding to the first set of feasible solutions based on the path length of the first set of feasible solutions; the path length of the first set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device and the external axial driving device in laser processing.

20. The laser processing method according to claim 16, characterized in that: The control unit further includes generating fourth processing path information corresponding to the second set of feasible solutions based on the path length of the second set of feasible solutions; the path length of the second set of feasible solutions is the path length of the workpiece driving device, the galvanometer driving device and the external axial driving device in laser processing.

21. The laser processing method according to claim 15, characterized in that: The control unit is coupled to the laser source, and the first processing path information includes the intensity and switching time information of the laser source.

22. The laser processing method according to claim 18, characterized in that: The control unit is coupled to the laser source, and the second processing path information includes the intensity and switching time information of the laser source.

23. The laser processing method according to claim 19, characterized in that: The control unit is coupled to the laser source, and the third processing path information includes the intensity and switching time information of the laser source.

24. The laser processing method according to claim 20, characterized in that: The control unit is coupled to the laser source, and the fourth processing path information includes the intensity and switching time information of the laser source.

25. The laser processing method according to claim 18, characterized in that: The control unit is coupled to the laser source. The control unit generates fifth processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times and the external axial smoothness of the first set of feasible solutions, and controls the intensity and switching time of the laser source.

26. The laser processing method according to claim 18, characterized in that: The control unit is coupled to the laser source. The control unit generates the sixth processing path information corresponding to the second set of feasible solutions based on the number of laser source switching and the external axial smoothness of the second set of feasible solutions, and controls the intensity and switching time of the laser source.

27. The laser processing method according to claim 19, characterized in that: The control unit is coupled to the laser source. The control unit generates the seventh processing path information corresponding to the first set of feasible solutions based on the number of laser source switching times, the external axial smoothness of the first set of feasible solutions, and the path length of the first set of feasible solutions, and controls the intensity and switching time of the laser source.

28. The laser processing method according to claim 20, characterized in that: The control unit is coupled to the laser source. The control unit generates the eighth processing path information corresponding to the second set of feasible solutions based on the number of laser source switching, the external axial smoothness, and the path length of the second set of feasible solutions, and controls the intensity and switching time of the laser source.

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