A method for manufacturing a polycrystalline diamond wire drawing die

Abstract

This invention belongs to the field of wire drawing dies, specifically relating to a method for manufacturing a polycrystalline diamond (PCD) wire drawing die. The PCD wire drawing die manufacturing method involves, for the surface of the blank to be processed, first machining the PCD die core to a set size using laser grinding, and then machining the end face of the alloy ring to the same height as the end face of the PCD die core using a surface grinding process. This invention employs different processes to remove the end face allowance of the PCD die core and the alloy ring. By using laser grinding to process the PCD die core, the difficulty of removing the allowance is reduced, and the processing efficiency of removing the allowance is improved. By using surface grinding to process the alloy ring, the surface processing quality of the alloy ring is improved. Overall, the processing efficiency and quality are improved, and by using different processes to treat different parts of the PCD wire drawing die, the investment in equipment is effectively reduced.

Description

Technical Field

[0001] This invention belongs to the field of wire drawing dies, and specifically relates to a method for manufacturing a polycrystalline diamond wire drawing die. Background Technology

[0002] Polycrystalline diamond (PCD) wire drawing die blanks possess extremely high hardness, wear resistance, thermal conductivity, elastic modulus, and strength. Therefore, wire drawing dies made from PCD blanks are highly durable, produce wires with high precision and smoothness, and are low in cost, making them the most superior material for manufacturing wire drawing dies, unmatched by traditional cemented carbide (CLC) wire drawing dies. Currently, common PCD wire drawing die blanks are available with or without CLC rings. Blanks with CLC rings generally include a CLC ring and a PCD die core. The CLC ring surrounds the PCD die core. Because the CLC ring exerts a tightening inward compressive stress on the surrounding PCD, it effectively counteracts the outward tensile stress on the PCD during wire drawing. Therefore, it has high strength and can withstand larger external forces during wire drawing, making it more suitable for manufacturing larger-sized initial drawing dies or transition drawing dies.

[0003] The existing technology for preparing polycrystalline diamond (PCD) wire drawing die blanks with cemented carbide support rings involves two steps: 1) synthesizing a PCD die core blank using a high-temperature, high-pressure method; 2) embedding the PCD die core into a cemented carbide ring, and then drilling die holes in the die core blank to obtain the final die. As is well known, PCD is produced by sintering diamond micropowder and a cemented carbide substrate under a metal shielding cup at a high pressure of 5 GPa–6 GPa and a high temperature of 1550℃. Due to the influence of high temperature, high pressure, and existing six-sided press synthesis technology, the dimensional accuracy and surface quality of the synthesized PCD diamond often fail to meet usage requirements, necessitating multiple reprocessing steps. Among these, removing end-face allowances is not only related to achieving product dimensional standardization but also helps eliminate end-face defects, thereby improving and stabilizing the overall performance of the product.

[0004] Currently, common end-face allowance removal processing technologies include mechanical grinding, electrical discharge machining (EDM), laser processing, and ultrasonic processing. Among these, mechanical grinding has a low overall utilization rate of abrasive materials and relatively low grinding efficiency; EDM, which uses electrical discharge, can damage the internal structure of the material, resulting in a decline in the final product quality; and laser processing does not use consumables and has a higher processing efficiency than mechanical grinding and EDM. Therefore, laser processing is more widely used in the processing of polycrystalline diamond wire drawing dies. In actual production, due to the significant difference in hardness between the polycrystalline diamond core and the alloy ring, removing excess material from the polycrystalline diamond core is more difficult than removing excess material from the alloy ring under the same laser intensity. This can cause the height dimension of the polycrystalline diamond core to protrude, requiring additional correction and leveling treatment. Using a lower laser intensity to remove excess material from the polycrystalline diamond core significantly reduces the efficiency of material removal. While using a higher laser intensity makes it easier to remove excess material from the polycrystalline diamond core, it can cause the end face of the alloy ring to be ablated by the laser, resulting in an uneven surface or difficult-to-remove textures. Furthermore, using a single laser device to process different areas with different laser intensities requires a high investment in equipment costs. Summary of the Invention

[0005] The purpose of this invention is to provide a method for manufacturing polycrystalline diamond wire drawing dies, in order to solve the problems of high difficulty or low efficiency in removing the excess material of polycrystalline diamond die cores under the same laser intensity during the existing laser processing method for removing excess material from the end face of polycrystalline diamond wire drawing die blanks, as well as the problems of easily affecting the surface processing quality of alloy rings and high equipment investment when removing alloy rings.

[0006] To achieve the above objectives, the manufacturing method of polycrystalline diamond wire drawing die in this invention adopts the following technical solution:

[0007] A method for manufacturing polycrystalline diamond wire drawing dies involves first machining the polycrystalline diamond die core to a set size using a laser grinding process on the surface of the blank, and then machining the end face of the alloy ring to the same height as the end face of the polycrystalline diamond die core using a flat grinding process.

[0008] The beneficial effects of the above technical solution are as follows: This invention innovatively uses different processes to remove the end face allowance of the polycrystalline diamond die core and the alloy ring. By using laser grinding to process the polycrystalline diamond die core, the difficulty of removing the allowance of the polycrystalline diamond die core is reduced, and the processing efficiency of removing the allowance is improved. By using a flat grinding process to process the alloy ring, the surface processing quality of the alloy ring is improved. Overall, the processing efficiency and quality are improved. At the same time, by treating different parts of the polycrystalline diamond wire drawing die with different processes, the investment in equipment is effectively reduced.

[0009] Furthermore, before processing the polycrystalline diamond mold core, the uneven surface to be processed is pre-ground using a flat grinding process to obtain a flat reference surface that can serve as the processing reference for the laser grinding process.

[0010] The beneficial effects of the above technical solution are as follows: by using a flat grinding process to pre-process the uneven surface of the blank to be processed to obtain a flat reference surface, a positioning reference is provided for the subsequent processing of polycrystalline diamond mold core and alloy ring, which effectively ensures the processing quality of the product.

[0011] Furthermore, the end face of the polycrystalline diamond mold core, processed to a set size by laser grinding, also has a machining allowance so that it can be processed together with the end face of the alloy ring to the target size when the end face of the alloy ring is processed by flat grinding.

[0012] The beneficial effects of the above technical solution are as follows: after the polycrystalline diamond mold core is pre-processed, there is still a machining allowance. Then, the alloy ring and the polycrystalline diamond mold core are processed simultaneously by the flat grinding process, which can effectively ensure that the flatness and roughness of the alloy ring and the polycrystalline diamond mold core are consistent, thereby improving product quality and processing efficiency.

[0013] Furthermore, the blank has two surfaces to be machined. First, a polycrystalline diamond mold core and an alloy ring are machined on one of the surfaces to be machined, and then the other surface to be machined is machined in the same way.

[0014] The beneficial effects of the above technical solution are as follows: When there are two uneven surfaces to be processed on the blank, one surface to be processed is first processed with a polycrystalline diamond mold core and an alloy ring to obtain a flat reference surface that can be used as a reference for subsequent processing. Then, the other surface to be processed is processed in the same way. A high-quality wire drawing die under the target size is obtained through step-by-step processing. Attached Figure Description

[0015] Figure 1 This is one implementation process of the polycrystalline diamond wire drawing die manufacturing method in this invention;

[0016] Figure 2 This is a schematic diagram of the polycrystalline diamond wire drawing die in this invention;

[0017] Figure 3 for Figure 2 A schematic diagram of the processing procedure.

[0018] In the diagram: 1. Pre-grinding area; 2. Reference surface; 3. Core removal area; 4. Alloy ring removal area; 5. Polycrystalline diamond core; 6. Alloy ring. Detailed Implementation

[0019] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0020] Example 1 of a method for manufacturing polycrystalline diamond wire drawing dies in this invention:

[0021] In the current production of polycrystalline diamond (PCD) wire drawing dies, the removal of excess material from the end face is more difficult than from the alloy ring due to the significant difference in hardness between the PCD core and the alloy ring under the same laser intensity. This can lead to a protrusion in the height dimension of the PCD core, requiring additional correction and leveling. Using a lower laser intensity to remove excess material from the PCD core significantly reduces the efficiency of the removal process. While using a higher laser intensity makes it easier to remove excess material from the PCD core, it can cause the end face of the alloy ring to be ablated by the laser, resulting in an uneven surface or difficult-to-remove textures. Furthermore, using a single laser device to process different areas with different laser intensities requires a high investment in equipment.

[0022] To address the aforementioned problems, the polycrystalline diamond (PCD) wire drawing die manufacturing method provided by this invention, for the surface of the blank to be processed, firstly, the PCD die core is processed to a set size using laser grinding, and then the end face of the alloy ring is processed to the same height as the end face of the PCD die core using a surface grinding process. This invention employs different processes to remove the end face allowance of the PCD die core and the alloy ring. By using laser grinding to process the PCD die core, the difficulty of removing the allowance is reduced, and the processing efficiency of removing the allowance is improved; by using surface grinding to process the alloy ring, the surface processing quality of the alloy ring is improved. Overall, processing efficiency and quality are improved, and by using different processes to treat different parts of the PCD wire drawing die, the investment in equipment is effectively reduced.

[0023] In this embodiment, when the end face of the polycrystalline diamond wire drawing die with an alloy ring, which is to have its end face allowance removed, is irregular and requires necessary trimming, such as... Figure 1 As shown, the steps are as follows:

[0024] The first step is to use a surface grinder to pre-grind the uneven end face of the blank in order to repair the uneven area of ​​the surface and obtain a flat reference surface that can be used as the processing reference for the laser grinding process.

[0025] The second step involves using a reference surface as a reference and employing laser grinding technology to remove excess material from the polycrystalline diamond mold core in the blank to the set size.

[0026] The third step is to use a flat grinding process to remove the excess material from the alloy ring on the same side of the blank until the end face of the alloy ring is at the same height as the end face of the polycrystalline diamond mold core.

[0027] Fourth step: Repeat steps two and three as needed until the remaining material on the other end face is removed by grinding.

[0028] The fifth step is to remove the excess material from the end face of the polycrystalline diamond wire drawing die blank with alloy rings to obtain the polycrystalline diamond wire drawing die of the target size.

[0029] Specifically, in this embodiment, as Figure 2 and Figure 3 As shown, this is a polycrystalline diamond wire drawing die blank with an alloy ring, for which the end face allowance is to be removed. The height of the polycrystalline diamond wire drawing die blank is H1. First, a surface grinder is used to repair the uneven pre-grinding area 1 of the blank surface until the internal polycrystalline diamond wire drawing die core 5 is exposed, thereby obtaining the reference surface 2. At this time, the height of the polycrystalline diamond wire drawing die blank is reduced from H1 to the height of the polycrystalline diamond wire drawing die core 5 inside the blank, which is H2. Then, using the reference surface 2 as a reference, a laser grinding process is used to grind the die core removal area 3 of the polycrystalline diamond die core 5 with a set laser program until the height of the polycrystalline diamond die core 5 meets the target size H3 (not marked in the figure). A surface grinding process is used to grind the same surface of the blank. The alloy ring 6 is ground in the alloy ring removal area 4 until the end face of the alloy ring 6 is at the same height as the end face of the polycrystalline diamond die core 5. If there are defects on the other opposite surface of the blank, the polycrystalline diamond drawing die blank is flipped over. Using the processed polycrystalline diamond die core 5 and the alloy ring 6 end faces at the same height as reference, laser grinding and flat grinding processes are used to grind the die core removal area 3 of the polycrystalline diamond die core 5 and the alloy ring removal area 4 of the alloy ring 6 on the other reference surface 2 of the blank until the target size H3 of the polycrystalline diamond drawing die is reached. The processing of the polycrystalline diamond drawing die blank is completed, and a polycrystalline diamond die core 5 and alloy ring 6 containing the target size are obtained.

[0030] Example 2 of a method for manufacturing polycrystalline diamond wire drawing dies in this invention:

[0031] When the end face of a polycrystalline diamond wire drawing die with an alloy ring, to which the end face allowance is to be removed, is regular and flat, and does not require trimming, the steps are as follows:

[0032] The first step is to use one of the surfaces of the blank as a reference surface and use laser grinding technology to remove the excess material of the polycrystalline diamond core in the blank to the set size.

[0033] The second step is to use a flat grinding process to remove the excess material from the alloy rings on the same side of the blank until the end face of the alloy rings is at the same height as the end face of the polycrystalline diamond mold core.

[0034] The third step is to repeat the first and second steps as needed until the remaining material on the other end face is removed by grinding.

[0035] The fourth step is to remove the excess material from the end face of the polycrystalline diamond wire drawing die blank with alloy rings to obtain the polycrystalline diamond wire drawing die of the target size.

[0036] Example 3 of a method for manufacturing polycrystalline diamond wire drawing dies in this invention:

[0037] In Example 1, a laser grinding process is used to first remove excess material from the polycrystalline diamond mold core in the blank to a set size. In this example, a laser grinding process is used to remove excess material from the polycrystalline diamond mold core in the blank to a size slightly larger than the target size. That is, the end face of the polycrystalline diamond mold core processed to the set size by the laser grinding process still has processing allowance. Then, a flat grinding process is used to simultaneously process the alloy ring and the polycrystalline diamond mold core to the target size.

[0038] Example 4 of a method for manufacturing polycrystalline diamond wire drawing dies in this invention:

[0039] In Example 1, the removal of excess material from the alloy ring is achieved using a surface grinding process. In this example, the removal of excess material from the alloy ring can be achieved using ultrasonic machining, electrical discharge machining, or other mechanical grinding methods besides surface grinding, such as diamond wheel grinding or diamond micron powder grinding.

[0040] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. The scope of patent protection of the present invention shall be determined by the claims. Similarly, any equivalent structural changes made based on the description and drawings of the present invention shall also be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing a polycrystalline diamond wire drawing die, characterized in that: For the surface of the blank to be processed, the polycrystalline diamond mold core is first processed to the set size by laser grinding, and then the end face of the alloy ring is processed to the same height as the end face of the polycrystalline diamond mold core by surface grinding. The end face of the polycrystalline diamond mold core processed to the set size by laser grinding still has a processing allowance, so that it can be processed together with the end face of the alloy ring to the target size when the end face of the alloy ring is processed by surface grinding.

2. The method for manufacturing polycrystalline diamond wire drawing dies according to claim 1, characterized in that: Before processing the polycrystalline diamond mold core, the uneven surface to be processed is pre-ground using a flat grinding process to obtain a flat reference surface that can serve as the processing reference for the laser grinding process.

3. The method for manufacturing polycrystalline diamond wire drawing dies according to claim 1 or 2, characterized in that: The blank has two surfaces to be machined. First, a polycrystalline diamond mold core and an alloy ring are machined on one of the surfaces, and then the other surface is machined in the same way.

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