A groove back-milling grinding head

Abstract

The application provides a recessed root-milling grinding head and belongs to the field of precision machining. The grinding head is composed of an outer base body and a diamond ring. The outer base body and the diamond ring are both internally hollow and are provided with a through hole from top to bottom. The lower end of the outer base body is connected with the diamond ring. The lower end of the inner base body extends into the outer base body and is connected to the inner wall of the outer base body through a vane wheel. A water storage area is a space area formed above the vane wheel between the outer base body and the inner base body. The water storage area is connected with the outside through the gap between the upper end of the outer base body and the inner base body. The diamond ring is connected by a plurality of tooth-like structures. The diamond ring is also provided with an inner water groove and an outer chip removal groove. The device realizes the conversion from the external cooling mode to the internal cooling mode and guarantees the smooth flow of water. The water storage area provides temporary water storage, so that the water is more easily taken to the grinding work area during the rotation of the vane wheel, the grinding performance is improved, the tooth-like structure of the diamond ring can achieve one-time machining, and the root-milling treatment is not needed, thereby greatly reducing the cost.

Description

Technical Field

[0001] This invention relates to the field of precision machining, and in particular to a groove cleaning milling head. Background Technology

[0002] When machining grooves, the outer working surface of the powder metallurgy sintered diamond grinding head and the stress point at the bottom of the groove are easily deformed by the wear of the grinding head, resulting in a large radius arc. The appearance of a large arc often leads to errors in the assembly or positioning of the workpiece. Therefore, eliminating or reducing the size of the arc can improve assembly accuracy. To eliminate the large arc, it is often necessary to replace the grinding head and cutting tool, or to replace it with a grinding head with a smaller radius specifically designed for cleaning. This is often a complicated operation, requiring tool resetting, which is time-consuming and laborious.

[0003] The reasons why the bottom and sidewalls of the workpiece groove form a large arc are as follows:

[0004] 1. When the grinding head is machining grooves, the chip removal conditions are poor, and the interface / transition section of the grinding wheel is more prone to wear;

[0005] Second, especially when external cooling is used without an internal cooling structure, the cooling effect is very poor. The junction / transition section of the mold is more prone to heat up, which reduces the ability of the binder to hold the diamond and causes the diamond to fall off easily.

[0006] Third, the diamond particles at the interface / transition section of the grinding wheel experience greater stress than in other areas, which also makes them more prone to falling off. When the transition section with a large arc at the bottom and sidewall of the workpiece groove requires root cleaning, especially in precision machining, the grinding head is frequently reshaped, resulting in complex processes, increased machining steps, and higher costs.

[0007] The existing solution is to manufacture a ring-shaped grinding wheel and control the wall thickness of the ring-shaped grinding wheel to be less than 15% of the diameter to limit the upper limit of the radius of the intersection / transition section of the working surface at the bottom of the grinding wheel and the working surface on the outer circle. However, this method may be limited by the strength of the ring due to the small diameter and the thin wall thickness. The excessively thin ring width will reduce the bearing capacity and affect the processing efficiency. Furthermore, the grinding head manufactured by this method has poor resistance to deformation and still requires frequent reshaping and repair.

[0008] In order to reduce the number of processes, save costs, and achieve the purpose of root cleaning, a root cleaning abrasive tool that can be used directly in one step without the need for replacement is needed. Summary of the Invention

[0009] The purpose of this invention is to overcome at least one deficiency of the prior art. This invention provides a groove cleaning milling head that is ingeniously designed, easy to operate, and saves time and effort.

[0010] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a groove cleaning milling head, comprising:

[0011] Inner matrix, milling head, water storage area and impeller;

[0012] The milling head consists of an outer matrix and a diamond ring. Both the outer matrix and the diamond ring are hollow and connected vertically. The lower end of the outer matrix is ​​connected to the diamond ring. The lower end of the inner matrix extends into the outer matrix and is connected to the inner wall of the outer matrix through the impeller. The water storage area is the space formed between the outer matrix and the inner matrix above the impeller. The water storage area is connected to the outside through the gap between the upper end of the outer matrix and the inner matrix.

[0013] The diamond ring is formed by multiple tooth-like structures connected in a circle, with the tooth roots located on the outer side of the ring and the tooth tips located on the inner side; the total arc length of the ground solid on the outer wall of the diamond ring is greater than the total arc length of the ground solid on the inner wall.

[0014] The diamond ring is also provided with an inner water groove and an outer chip removal groove. The inner water groove is located on the inner side of the diamond ring and connects to the internal space of the diamond ring. The outer chip removal groove is located on the outer side of the diamond ring and connects to the outer side of the diamond ring. The radius of the inner circle at the tooth root is equal to the radius of the inner circle corresponding to the outermost end of the inner water groove.

[0015] The radius of the diamond ring to be ground and cleaned is R, the maximum wall thickness of the diamond ring at each position is B, where B≤R, the distance from the deepest radial point of the inner water groove to the inner wall of the diamond ring is b, the radius of the rounded transition between the lower end of the outer wall of the diamond ring and the bottom end face is R1, where R1=Bb, and 0<Bb<R; the distance from the deepest radial point of the outer chip removal groove to the inner wall of the diamond ring is b1, where 0<B-b1≤0.5mm.

[0016] The principle of this invention is as follows: both the outer substrate and the diamond ring are hollow and interconnected, enabling the entire device to switch from external cooling mode to internal cooling mode; the impeller rotates with the whole during grinding, pushing the water inside the milling head to the working surface, thus achieving smooth water flow in the internal cooling mode; the water storage area provides temporary water storage and also serves as a water flow channel, effectively reducing the proportion of atomized cooling water caused by the impeller, which is conducive to the flow of concentrated cooling water into the end face grinding area, ensuring the internal cooling mode during rotary grinding;

[0017] The tooth root is the main grinding point. On the one hand, it ensures that the grinding process is not prone to breakage and meets the processing conditions. On the other hand, during the grinding process, the tooth itself will be gradually worn away, which will lead to the formation of arcs at the bottom and sidewalls of the workpiece groove. At this time, since the total arc length of the outer wall grinding body is greater than the total arc length of the inner wall grinding body, the width of the entire tooth structure gradually decreases from the tooth root to the tooth tip. This is so that after the thicker tooth root is ground, the area from the tooth root to the tooth tip can also be quickly ground flat. This makes the arc generated at the bottom of the workpiece groove during grinding limited by the thickness of the tooth root.

[0018] The inner water tank, under the action of centrifugal force, facilitates the cooling water to be pushed from the inner water tank to the grinding zone to achieve the cooling effect, while the outer chip removal can realize the chip removal function during the grinding process.

[0019] The grindable thickness at the tooth root is R1 = Bb. During the machining process, the thickness at the tooth root is gradually ground away. At the same time, the area from the tooth root to the tooth tip on the lowest end face is quickly ground away due to the limited diamond material. After the bottom layer of the diamond ring is ground away, its new grinding point moves upward, and the maximum radius after root cleaning is R1. The entire process can be completed in one go without root cleaning. B-b1 is the radial width of the remaining solid material corresponding to the outer chip removal groove on the diamond ring. The thin-walled ring tool is conducive to chip removal and can better perform the root cleaning function. When the tool wall is very thin, setting an outer chip removal groove can increase the chip removal speed and reduce the diamond's passivation due to frictional heat from the powder. At the same time, it reduces the contact area between the tool and the glass, and has sufficient pressure under low pressure to achieve efficient grinding. Therefore, setting a width of B-b1 < 0.5mm can meet the operating environment of this device.

[0020] The beneficial effects of this invention are: it enables the entire device to switch from external cooling mode to internal cooling mode, and the root cleaning radius is dynamically changing throughout the grinding process. The maximum root cleaning radius is R1 = Bb, which satisfies the requirement of completing the process in one go without root cleaning treatment; at the same time, the cooling and chip removal are fast.

[0021] Based on the above technical solution, the present invention can be further improved as follows.

[0022] Furthermore, both the outer matrix and the diamond ring are cylindrical.

[0023] The beneficial effect of adopting the above-mentioned further solution is that the cylindrical shape of the outer matrix and the diamond outer surface facilitates rotary grinding.

[0024] Furthermore, the upper end of the outer substrate is provided with a funnel-shaped water inlet, and the water storage area is the space area formed between the inner wall of the outer substrate, the lower outer wall of the inner substrate, the water inlet and the impeller. The upper end of the water storage area is connected to the outside through the gap between the water inlet and the lower end of the inner substrate.

[0025] The beneficial effects of adopting the above-mentioned further scheme are: the funnel-shaped water inlet helps the cooling water enter the water storage area under the action of centrifugal force, ensuring that the cooling water can flow into the milling head through the water storage area. The establishment of the water storage area can greatly reduce the proportion of cooling water atomized by the impeller. Due to the action of centrifugal force, the cooling water forms a downward component force in the funnel-shaped water flow channel, which helps the cooling water flow towards the working end of the milling head, ensuring a stable supply of cooling water.

[0026] Furthermore, the inner wall of the outer matrix is ​​inclined along the central axis and forms an inclination angle θ, wherein 0 < θ < 45°, and the inner wall of the inlet is inclined along the central axis with an inclination angle of θ1, wherein 0 < θ1 < 90°.

[0027] The beneficial effects of adopting the above-mentioned further scheme are: the inclination of the inner wall of the outer base and the inclination of the inner wall of the inlet are both conducive to the entry of external water into the water storage area under the action of centrifugal force, among which the angle between 0 < θ < 45° and 0 < θ1 < 90° is most suitable.

[0028] Furthermore, both the inner water tank and the outer chip removal tank are vertically arranged and extend through the diamond ring from top to bottom.

[0029] The beneficial effects of adopting the above-mentioned further solution are: in grinding, the inner water tanks are arranged vertically and connected to the inner wall. Under the action of centrifugal force, the cooling water is conveniently pushed from the inner water tanks to the grinding area to achieve the cooling effect. The outer chip removal system is arranged vertically to achieve the chip removal function during the grinding process.

[0030] Furthermore, both the inner water tank and the outer chip removal tank are provided in multiples, and are arranged alternately and at intervals along the circumference of the diamond ring.

[0031] The beneficial effect of adopting the above-mentioned further solution is that the inner water tank and the outer chip removal tank are arranged in a circumferentially alternating sequence on the diamond ring, which helps to cool down and achieve circumferential chip removal.

[0032] Furthermore, the impeller comprises multiple blades, which are obliquely arranged at the lower end of the inner matrix to transport water in the water storage area to the lower working end of the milling head as the inner matrix rotates.

[0033] The beneficial effect of adopting the above-mentioned further solution is that the blades are arranged at the end of the inner matrix at an angle, so that when the inner matrix rotates, the blades rotate and push the cooling water to the working end, and squeeze the cooling water to the grinding zone. Attached Figure Description

[0034] Figure 1 This is a schematic cross-sectional view of the internal structure of the present invention;

[0035] Figure 2 for Figure 1External structural diagram;

[0036] Figure 3 This is a schematic diagram of the structure of the present invention;

[0037] Figure 4 This is a front view of the bottom structure of the present invention;

[0038] Figure 5 This is an enlarged schematic diagram of the diamond ring portion of the present invention;

[0039] Figure 6 This is a schematic diagram of the grinding and root cleaning process of the present invention;

[0040] Figure 7 This is a schematic diagram showing the width of the diamond ring, the length of the inner water groove, and the length of the outer chip removal groove of the present invention;

[0041] Figure 8 This is a comparative schematic diagram of the grinding and root clearing process of the present invention.

[0042] The attached diagram lists the components represented by each number as follows:

[0043] 1. Inner substrate, 2. Milling head, 21. Outer substrate, 211. Water inlet, 22. Diamond ring, 221. Inner water tank, 222. Outer chip removal tank, 3. Water storage area, 4. Impeller. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings, but this is not intended to limit the scope of the invention.

[0045] Example 1: As Figure 1-8 As shown, an embodiment of a groove cleaning milling head disclosed in this invention includes:

[0046] Inner substrate 1, milling head 2, water storage area 3, and impeller 4;

[0047] The milling head 2 is composed of an outer base 21 and a diamond ring 22. Both the outer base 21 and the diamond ring 22 are hollow inside and are arranged vertically. The lower end of the outer base 21 is connected to the diamond ring 22. The lower end of the inner base 1 extends into the outer base 21 and is connected to the inner wall of the outer base 21 through the impeller 4. The water storage area 3 is the space area formed between the outer base 21 and the inner base 1 above the impeller 4. The water storage area 3 is connected to the outside through the gap between the upper end of the outer base 21 and the inner base 1.

[0048] The diamond ring 22 is composed of multiple tooth-like structures connected in a circle, with the tooth roots located on the outer side of the ring and the tooth tips located on the inner side; the total arc length of the ground solid on the outer wall of the diamond ring 22 is greater than the total arc length of the ground solid on the inner wall.

[0049] The diamond ring 22 is also provided with an inner water groove 221 and an outer chip removal groove 222. The inner water groove 221 is located on the inner side of the diamond ring 22 and connects to the internal space of the diamond ring 22. The outer chip removal groove 222 is located on the outer side of the diamond ring 22 and connects to the outer side of the diamond ring 22.

[0050] The radius of the diamond ring 22 to be ground and cleaned is R, the maximum wall thickness of the diamond ring 22 is B, where B≤R, the distance from the deepest radial point of the inner water groove 221 to the inner wall of the diamond ring 22 is b, the radius of the rounded transition between the lower end of the outer wall of the diamond ring 22 and the bottom end face is R1, where R1=Bb, and 0<Bb<R; the distance from the deepest radial point of the outer chip removal groove 222 to the inner wall of the diamond ring 22 is b1, where 0<B-b1≤0.5mm.

[0051] Specifically, the function of this device is to perform groove cleaning work by rotating the milling head 2 to prevent the bottom and side walls of the workpiece groove from forming a large arc. During the movement, the inner base 1 first rotates under external drive, which drives the blade wheel 4 connected to it to rotate, and then drives the milling head 2 to rotate. During the rotation, external cooling water enters the water storage area 3 through the through-hole between the outer base 21 and the diamond ring 22. The water storage area 3 is used to temporarily store cooling water and also serves as a water flow channel for cooling water circulation. The cooling water in the water storage area 3 is transmitted to the lower end of the milling head 2 for processing surface through the rotation of the blade wheel 4, thereby achieving the effect of cooling the workpiece during grinding.

[0052] Meanwhile, the diamond ring 22 is composed of multiple tooth-like structures connected in a circle. The tooth root is the external grinding area, and the area from the tooth root to the tooth tip is the internal grinding area. The total arc length of the grinding body of the inner diameter tooth tip is close to zero, meaning that the cumulative total arc length of the grinding body of the outer diameter tooth root is much greater than that of the inner diameter tooth tip. On the one hand, by setting the thickness of the tooth root, the overall strength of the ring structure is ensured to meet the standard. On the other hand, the setting of the tooth tip ensures that during the grinding process, after the tooth root at the main contact point is worn, the tooth tip can also be worn away quickly and synchronously, thus ensuring the size of the dynamic root cleaning arc in the entire grinding root cleaning process. The tooth-like structure is conducive to heat dissipation and improves the overall grinding performance of the grinding head. The inner water tank 221 ensures that cooling water enters from the inside along the inner wall and flows down to the working surface, which facilitates the cooling water to be centrifuged from the inner water tank 221 to the working surface to achieve the cooling effect. Even after the bottom end face is worn, the internal cooling mode can still be maintained. The outer chip removal groove 222 can realize the chip removal function during the grinding process and improve the grinding performance.

[0053] It should be understood that the arc at the bottom of the groove to be ground is set as R. At this time, the width of the diamond ring 22 is B, and the distance from the deepest radial point of the inner water groove 221 to the inner wall of the diamond ring 22 is b. The radius of the inner circle where the tooth root is located is equal to the radius of the inner circle corresponding to the outermost end of the inner water groove 221. That is, the distance from the tooth root to the inner diameter of the diamond ring 22 is also b, to ensure that the maximum radius after grinding is R1 = Bb, that is, the arc at the bottom of the groove changes from R to R1 after grinding. The whole process is as follows: During the processing of the diamond ring 22, the thickness at the tooth root is gradually ground away. The part that is ground away will produce a small arc, and the maximum is its thickness Bb. At the same time, the area from the tooth root to the tooth tip on the lowest end face will be ground away quickly due to the small amount of diamond material. After the bottom layer of the diamond ring 22 is ground away, its new grinding point moves upward, so the maximum radius after the entire root cleaning is R1. When R1 is less than R, the set value of R1 can meet the root cleaning requirements. B-b1 is the radial thickness of the remaining solid corresponding to the outer chip removal groove 222 on the diamond ring 22. The thinner the wall, the better the chip removal of the ring tool, which can better play the root cleaning role. When the tool wall is very thin, the outer chip removal groove 222 can reduce the diamond from being passivated by grinding heat. At the same time, it reduces the contact area between the tool and the glass, and has sufficient pressure to achieve grinding strength under low pressure. Therefore, setting the width of B-b1 < 0.5mm can meet the usage environment of this device, and the whole process can be completed in one go without root cleaning, which greatly reduces the cost.

[0054] Optionally, the tooth-like structure in the diamond ring 22 can also be other structures such as arc-shaped, triangular, etc., where the total arc length of the outer diameter grinding entity is much greater than that of the inner diameter grinding entity.

[0055] Optionally, the diamond ring 22 and the outer substrate 21 can also be detachably connected to ensure the replaceability of the wear parts of the diamond ring 22 and save resources.

[0056] Preferably, the milling head 2 is configured as an annular milling head with sufficient strength. Under the condition that the strength can meet the processing requirements, the ring width should be selected as small as possible. When the strength is sufficient, the smaller the ring width, the smaller the arc formed by the bottom and sidewall of the workpiece groove after the root cleaning is, and the higher the assembly accuracy is.

[0057] Preferably, processing parameters such as high rotation speed, small cutting depth, and fast travel speed should be selected to ensure one-time processing and shape formation without the need for further root cleaning, resulting in better processing quality.

[0058] Based on Example 1, Example 2: as follows Figure 2-3 As shown, the outer substrate 21 and the diamond ring 22 are both cylindrical.

[0059] Specifically, the outer substrate 21 and the diamond ring 22 are cylindrical in appearance, and both are hollow inside. The cylindrical shape makes them easy to rotate and process.

[0060] Based on Example 2, Example 3: as follows Figure 1 As shown, the upper end of the outer substrate 21 is provided with a funnel-shaped water inlet 211. The water storage area 3 is the space area formed between the inner wall of the outer substrate 21, the lower outer wall of the inner substrate 1, the water inlet 211 and the impeller 4. The upper end of the water storage area 3 is connected to the outside through the gap between the water inlet 211 and the narrow end of the inner substrate 1.

[0061] Specifically, the upper end of the outer substrate 21 is provided with a gradually narrowing funnel-shaped water inlet 211. The water storage area 3 is the space area formed between the inner wall of the outer substrate 21, the lower outer wall of the inner substrate 1, the water inlet 211 and the impeller 4. The upper end of the water storage area 3 is connected to the outside through the gap between the water inlet 211 and the narrow end of the inner substrate 1.

[0062] Based on Example 3, Example 4: as follows Figure 1-3 As shown, the inner wall of the outer substrate 21 is inclined along the central axis and forms an inclination angle θ, 0 < θ < 45°, and the inner wall of the inlet 211 is inclined along the central axis with an inclination angle of θ1, 0 < θ1 < 90°.

[0063] Specifically, the inclined inner wall of the outer substrate 21 and the inclined inner wall of the inlet 211 are funnel-shaped, which is conducive to the entry of external water into the water storage area 3 under the action of centrifugal force. The angles are most suitable between 0 < θ < 45° and 0 < θ1 < 90°.

[0064] Preferably, the inlet 211 is funnel-shaped, and its inner wall is formed by extending the inner wall of the outer base 21 in a circle inclined towards the central axis, where θ1 > θ. The optimal inclination angle θ1 is 45°, at which point the cooling water is most likely to enter the water storage area 3 and is least likely to escape.

[0065] Preferably, the inclination angle θ of the inner wall of the outer substrate 21 is close to 5-20°.

[0066] Based on Example 1, Example 5: as follows Figure 1-3 As shown, the inner water tank 221 and the outer chip discharge tank 222 are both vertically arranged and connected vertically by the diamond ring 22.

[0067] Specifically, the inner water tanks 221 are arranged vertically, ensuring that cooling water enters from the inside along the inner wall and flows smoothly down to the working surface during operation. This facilitates the cooling water being centrifugally cooled from the inner water tanks 221 to the working surface. Even after the bottom end face is worn, the internal cooling mode can still be maintained. The outer chip removal grooves 222 are arranged vertically, which can realize the efficient chip removal function during the grinding process and improve grinding performance.

[0068] Based on Example 1, Example 6: as follows Figure 1-5 As shown, there are multiple inner water tanks 221 and outer chip removal tanks 222, which are arranged alternately along the circumference of the diamond ring 22.

[0069] Specifically, during operation, the inner water tank 221 is vertically arranged, and the outer chip removal tank 222 is alternately arranged on the diamond ring 22, which helps to cool down the water and ensure even chip removal, thereby improving work efficiency.

[0070] Based on Examples 1-6, Example 7: as follows Figure 1-8 As shown, the impeller 4 contains multiple blades, which are arranged obliquely at the lower end of the inner base 1 to transfer water in the water storage area 3 to the lower end of the milling head 2 as the inner base 1 rotates.

[0071] It should be understood that the blades are arranged at an angle at the lower end of the inner substrate 1, so that during the rotation of the inner substrate 1, the blades rotate and cut the cooling water flow, and squeeze the cooling water to the working surface.

[0072] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0074] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0075] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0077] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A groove cleaning and milling head, characterized in that, include: The inner substrate (1), milling head (2), water storage area (3), and impeller (4); The milling head (2) is composed of an outer base (21) and a diamond ring (22). Both the outer base (21) and the diamond ring (22) are hollow inside and connected vertically. The lower end of the outer base (21) is connected to the diamond ring (22). The lower end of the inner base (1) extends into the outer base (21) and is connected to the inner wall of the outer base (21) through the impeller (4). The water storage area (3) is the space formed between the outer base (21) and the inner base (1) above the impeller (4). The water storage area (3) is connected to the outside through the gap between the upper end of the outer base (21) and the inner base (1). The diamond ring (22) is formed by multiple tooth-like structures connected around a circle, with the tooth roots located on the outer side of the ring and the tooth tips located on the inner side; the total arc length of the cumulative grinding solid on the outer wall of the diamond ring (22) is greater than the total arc length of the grinding solid on the inner wall; The diamond ring (22) is also provided with an inner water groove (221) and an outer chip removal groove (222). The inner water groove (221) is located on the inner side of the diamond ring (22) and connects to the internal space of the diamond ring (22). The outer chip removal groove (222) is located on the outer side of the diamond ring (22) and connects to the outer side of the diamond ring (22). The radius of the inner circle at the tooth root is equal to the radius of the inner circle corresponding to the outermost end of the inner water groove (221). The radius of the diamond ring (22) to be ground and cleaned is R, the maximum wall thickness of the diamond ring (22) is B, where B≤R, the distance from the deepest radial part of the inner water groove (221) to the inner wall of the diamond ring (22) is b, the radius of the arc formed by the rounded transition between the lower end of the outer wall of the diamond ring (22) and the bottom end face is R1, where R1=Bb, and 0<Bb<R; the distance from the deepest radial part of the outer chip removal groove (222) to the inner wall of the diamond ring (22) is b1, where 0<B-b1≤0.5mm.

2. The groove cleaning and milling head according to claim 1, characterized in that, The outer substrate (21) and the diamond ring (22) are both cylindrical.

3. The groove cleaning and milling head according to claim 2, characterized in that, The upper end of the outer substrate (21) is provided with a trumpet-shaped water inlet (211). The water storage area (3) is the space area formed between the inner wall of the outer substrate (21), the lower outer wall of the inner substrate (1), the water inlet (211) and the impeller (4). The upper end of the water storage area (3) is connected to the outside through the gap between the water inlet (211) and the lower end of the inner substrate (1).

4. The groove cleaning and milling head according to claim 3, characterized in that, The inner wall of the outer substrate (21) is inclined along the central axis and forms an inclination angle θ, where 0 < θ < 45°. The inner wall of the inlet (211) is inclined along the central axis and has an inclination angle of θ1, where 0 < θ1 < 90°.

5. The groove cleaning and milling head according to claim 1, characterized in that, The inner water tank (221) and the outer chip removal tank (222) are both vertically arranged and pass through the diamond ring (22) from top to bottom.

6. The groove cleaning and milling head according to claim 1, characterized in that, Both the inner water tank (221) and the outer chip discharge tank (222) are provided in multiples, and are arranged alternately along the circumference of the diamond ring (22).

7. The groove cleaning and milling head according to any one of claims 1 to 6, characterized in that, The impeller (4) contains multiple blades, which are obliquely arranged at the lower end of the inner base (1) to transfer water in the water storage area (3) to the lower working end of the milling head (2) as the inner base (1) rotates.

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