Wafer cutting machine with cutting and cooling structure

Abstract

The application discloses a wafer cutting machine with cutting and cooling structures, which comprises a control and adjustment structure as a base, dust suction and conveying cold structures are arranged on the two sides of the control and adjustment structure, the control and adjustment structure comprises a control and driving assembly for mounting and synchronously driving the cutting and cooling structure, the control and driving assembly comprises a control box with a control panel on the surface, a half frame for conveniently driving and adjusting a group of ball screws by a motor is arranged on the control box, ball nuts for driving and adjusting are arranged on the surfaces of the ball screws, adjusting pieces with through slot structures are arranged on one side of the ball nuts, the adjusting pieces are movably arranged between the half frame and the connecting pins and mounting plates on one end of the adjusting pieces, and the other ends of the adjusting pieces are movably arranged above the surfaces of the other ball nuts through the connecting pins and the mounting plates, the wafer cutting machine with the cutting and cooling structures has the penetrating and stress driving and adjusting effects through the adjusting pieces.

Description

Technical Field

[0001] This invention relates to the field of wafer technology, specifically to a wafer dicing machine with a dicing cooling structure. Background Technology

[0002] The raw material for wafers is silicon, and the Earth's crust has an inexhaustible supply of silicon dioxide. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polycrystalline silicon. Wafer manufacturers then melt this polycrystalline silicon, plant seed crystals in the molten liquid, and slowly pull them out to form cylindrical single-crystal silicon rods. Since the silicon rod is gradually formed from a seed crystal with a defined crystal orientation in molten silicon, this process is called "crystal growth." After being cut, tumbled, sliced, chamfered, polished, laser-etched, and packaged, the silicon rod becomes the basic raw material for integrated circuit factories—silicon wafers. Wafer dicing machines typically draw intersecting warp and weft lines on the upper surface of the wafer. Existing dicing machines generally use high-pressure nozzles to spray water directly onto the dicing head during dicing. This cleans up dicing debris and cools the diced parts. However, this high-pressure water spray can cause slight changes in the wafer's position on the dicing table, affecting the wafer dicing accuracy. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing a wafer dicing machine with a cutting and cooling structure, thereby solving the problem mentioned in the background art where the high-pressure water used for rinsing causes slight changes in the position of the wafer on the dicing table, affecting the wafer dicing accuracy.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a wafer dicing machine with a dicing and cooling structure, comprising a basic control and adjustment structure, wherein dust collection and conveying cooling structures are provided on both sides of the control and adjustment structure;

[0005] The control and adjustment structure includes a control drive component for installing and synchronously driving the cutting and cooling structure. The control drive component includes a control box with a control panel on its surface. The control box is provided with a half-frame for convenient driving and adjusting a set of ball screws by a motor. At the same time, a ball nut for driving and adjusting is provided through the surface of the ball screw. An adjustment component with a through groove structure is provided on one side of the ball nut.

[0006] By adopting the above technical solution, the adjustable components can achieve the effects of penetration and force-driven adjustment.

[0007] Preferably, one end of one of the adjusting members is movably disposed between the half frame and the connecting pin and the mounting plate, and the other end is also movably disposed above the surface of one of the ball nuts via the connecting pin and the mounting plate. The other two adjusting members are also connected to the corresponding ball nuts respectively. At the same time, the adjusting members are also provided with a mounting plate for mounting the cutting and cooling structure components via the connecting pin and the mounting plate.

[0008] By adopting the above technical solution, the installation plate can achieve the effect of force-driven adjustment.

[0009] Preferably, the control box is provided with mounting brackets with through holes on both sides, and the mounting brackets are provided with fixing plates for mounting another set of half frames.

[0010] By adopting the above technical solution, the mounting bracket can achieve a fixed bidirectional installation effect.

[0011] Preferably, the cutting and cooling structure includes an adsorption adjustment component mounted on the wafer, and the adsorption adjustment component is provided with a cooling and cutting component for cutting the wafer. The adsorption adjustment component also includes a connecting seat with an internal groove structure, and the connecting seat has a slot for matching and connecting with the components of the cooling and cutting component.

[0012] By adopting the above technical solution, the connection socket is set to achieve the effects of installation and setup.

[0013] Preferably, the groove of the connector is provided with a miniature cylinder for driving and adjusting the placement seat, and the placement seat is provided with a suction cup for adsorbing and fixing the wafer. At the same time, the bottom of the connector is connected to the mounting plate through an adjusting cylinder.

[0014] By adopting the above technical solution, the adjustable cylinders are set up to achieve the driving and adjusting effect.

[0015] Preferably, the cooling and cutting assembly includes a connecting plate with a groove, and the connecting plate is installed on the square plate. At the same time, a connecting base for installing the cutting blade and the cutting motor is provided below the square plate.

[0016] By adopting the above technical solution, the connection base is set to achieve the effect of connecting the inner and outer sides.

[0017] Preferably, the slide is installed on the through frame via a slider, and the through frame has through slots on both sides for easy installation of the mounting bracket. Meanwhile, one side of the mounting bracket is equipped with a semiconductor cooler, and the other side of the mounting bracket is equipped with a horizontal fan with a filter screen to deliver cold air into the through frame. The bottom of the through frame is equipped with a locking block that is connected to the locking slot.

[0018] By adopting the above technical solution, the set card block achieves the effect of locking and setting.

[0019] Preferably, the dust collection and conveying cooling structure includes a negative pressure fan with a corrugated pipe, one end of which is connected to the through frame via a pipe connector, and the negative pressure fan is connected to one side of the mounting bracket.

[0020] By adopting the above technical solution, the corrugated pipe is used to achieve the driving and adjustment effect.

[0021] Preferably, the negative pressure fan has a conveying pipe connected to the collection box on one side, and the collection box has a grid for installing and placing the filter element inside, while a connecting pipe connected to the control box is provided below the collection box.

[0022] By adopting the above technical solution, the filter element can achieve the effect of filtering and interception.

[0023] Compared with the prior art, the beneficial effects of the present invention are: the wafer dicing machine with a cutting cooling structure,

[0024] (1) In this case, the cooling cutting component is set in the cutting cooling structure to solve the problem that the position of the wafer on the cutting table will change slightly when the high pressure water is flushed, which will affect the wafer cutting accuracy. When the wafer needs to be cut, the operator controls the semiconductor cooler to work. During the operation of the semiconductor cooler, the generated cold air is delivered to the inside of the frame in a horizontal manner. The cold air entering the frame cools the cutting blade, the cutting motor and the wafer during the cutting process. The cooling cutting component is set to avoid the above situation at the same time.

[0025] (2) By using the connecting plate, slide, slider, clamp and through frame in the cooling cutting assembly, the problem of the cold air spreading too fast and not being able to concentrate inside the through frame, resulting in poor cooling effect, is solved. During the wafer cutting process, the through frame is driven to move under force. During the movement of the through frame, the slider moves relative to the connecting plate and slide. During the synchronous movement of the through frame, the cold air inside the through frame always cools the cutting blade, cutting motor and wafer during the cutting process. The above-mentioned components are used to avoid the above-mentioned situation.

[0026] (3) The adsorption adjustment component set in the cutting cooling structure solves the problem of fixing the wafer by the fixing component during the wafer cutting process. Fixing the wafer by the fixing component not only makes the wafer fixing troublesome, but also makes the fixing component easy to damage the wafer during the fixing process. When the wafer needs to be cut, the operator manually places the wafer in the placement seat and uses the suction cup to adsorb and fix the wafer. After the wafer is adsorbed and fixed, the control adjustment cylinder works. During the operation of the adjustment cylinder, the connecting seat is driven to move under force. During the movement of the connecting seat under force, it can adapt to wafers of different thicknesses or different heights for cutting. The adsorption adjustment component set avoids the above situation at the same time.

[0027] (4) By setting up a dust collection and conveying cooling structure, the problem of dust generated during wafer cutting and the inability to dissipate heat quickly due to the constant heat generated by the internal components of the control box during operation is solved. When the dust generated during wafer cutting is conveyed to the inside of the collection box through a corrugated pipe by a negative pressure fan, the collection box is not only dustproof but also cold air. At this time, the dust in the cold air is filtered by the filter element and then conveyed to the inside of the control box through the connecting pipe to cool the internal components of the control box. The dust collection and conveying cooling structure can avoid the above situation at the same time. Attached Figure Description

[0028] Figure 1 This is a frontal cross-sectional view of the present invention.

[0029] Figure 2 This is a schematic diagram of the control and adjustment structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the control box, half-frame, motor, ball screw, ball nut, mounting plate, mounting bracket, and fixing plate of the present invention.

[0031] Figure 4 This is a schematic diagram of the structure of the half-frame, motor, ball screw, ball nut, adjusting component, and mounting plate of the present invention;

[0032] Figure 5 This is a schematic diagram of the cutting and cooling structure of the present invention;

[0033] Figure 6 This is a schematic diagram of the adsorption regulating component structure of the present invention;

[0034] Figure 7 This is a schematic diagram of the connecting plate, slide groove, square plate, cutting blade, cutting motor, connecting base, slider, through frame, fixing frame, horizontal fan and clamping block structure of the present invention;

[0035] Figure 8 This is a schematic diagram of the fixture and semiconductor cooler structure of the present invention;

[0036] Figure 9 This is a schematic diagram of the connecting plate, slide groove, and slider structure of the present invention;

[0037] Figure 10 This is a schematic diagram of the dust collection and conveying cold structure of the present invention.

[0038] In the diagram: 1. Control and adjustment structure; 101. Control drive assembly; 1011. Control box; 1012. Half-frame; 1013. Motor; 1014. Ball screw; 1015. Ball nut; 1016. Adjusting component; 1017. Mounting plate; 1018. Mounting bracket; 1019. Fixing plate; 102. Cutting and cooling structure; 1021. Adsorption and adjustment assembly; 10211. Connecting seat; 10212. Slot; 10213. Miniature cylinder; 10214. Placement seat; 10215. Suction cup; 10216. Adjusting cylinder; 1022. Cooling and cutting assembly, 10221, connecting plate, 10222, slide, 10223, square plate, 10224, cutting blade, 10225, cutting motor, 10226, connecting base, 10227, slider, 10228, through frame, 10229, fixing bracket, 102210, semiconductor cooler, 102211, horizontal fan, 102212, clamp, 2, dust collection and conveying cooling structure, 201, negative pressure fan, 202, corrugated pipe, 203, conveying pipe, 204, collection box, 205, filter element, 206, connecting pipe. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figure 1-10 This invention provides a technical solution: a wafer dicing machine with a dicing cooling structure, such as... Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, it includes a basic control and adjustment structure 1. The control and adjustment structure 1 includes a control drive assembly 101 for installing and synchronously driving the cutting and cooling structure 102. The control drive assembly 101 includes a control box 1011 with a control panel on its surface. The control box 1011 is provided with a half frame 1012 for convenient driving and adjusting a set of ball screws 1014 by a motor 1013. At the same time, a ball nut 1015 for driving and adjusting is provided through the surface of the ball screw 1014. An adjustment member 1016 with a through groove structure is provided on one side of the ball nut 1015. The adjustment member 1016 is shaped like an elliptical plate with a keyway in the middle. When the above-mentioned components are shaped like an elliptical plate, it not only allows the components to move in a cross manner, but also achieves a four-way driving and adjustment effect.

[0041] Furthermore, in the above scheme, one end of one adjusting component 1016 is movably connected to the half-frame 1012 via a connecting pin and a mounting plate, and the other end is also movably connected to the surface of one of the ball nuts 1015 via a connecting pin and a mounting plate. The other two adjusting components 1016 are also connected to their respective ball nuts 1015. At the same time, the adjusting components 1016 are also connected to the mounting plate via connecting pins and mounting plates, and a mounting plate is provided for mounting the components of the cutting and cooling structure 102. The above components are all mounted using existing technology, which effectively provides a four-way drive adjustment effect for the mounting plate 1017. The movement trajectory of the above components is driven and controlled by the control panel on the surface of the control box 1011, thereby effectively realizing automated cutting processing during wafer cutting. The above components are all set in three groups, which also effectively provides installation and synchronous drive adjustment effects for the components in the cutting and cooling structure 102.

[0042] Furthermore, the control box 1011 is provided with mounting brackets 1018 with through holes on both sides, and the mounting brackets 1018 are provided with fixing plates 1019 for mounting another set of half frames 1012. The above-mentioned components are also installed using existing technology components, which effectively achieves the installation and support effects when using existing technology components for installation.

[0043] In the above scheme, when the wafer is fixed and needs to be cut, the operator controls the motor 1013 to work through the control panel. During the operation of the motor 1013, the ball screw 1014, ball nut 1015 and adjusting component 1016 are driven to move synchronously under force. During the movement of the adjusting component 1016 under force, the mounting plate 1017 is driven to move synchronously under force through the connecting pin and the mounting plate. During the movement of the mounting plate 1017 under force, the components in the cutting cooling structure 102 are driven to move under force, thereby performing warp and weft cutting on the wafer.

[0044] like Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the cutting and cooling structure 102 includes an adsorption adjustment component 1021 for mounting the wafer, and a cooling and cutting component 1022 for cutting the wafer is provided on the adsorption adjustment component 1021. The adsorption adjustment component 1021 includes a connecting seat 10211 with an internal groove structure. The connecting seat 10211 has slots 10212 that are matched and connected to the components of the cooling and cutting component 1022. There are four slots 10212. The multiple slots 10212 effectively enable the connecting seat 10211 and the through frame 10228 to achieve a locking connection effect.

[0045] Furthermore, the groove of the connecting seat 10211 is provided with a miniature cylinder 10213 for driving and adjusting the placement seat 10214, and the placement seat 10214 is provided with a suction cup 10215 for adsorbing and fixing the wafer. At the same time, the bottom of the connecting seat 10211 is connected to the mounting plate 1017 through the adjusting cylinder 10216. The above-mentioned components are also installed using existing technology components. When using existing technology components for installation, it not only achieves the adjustment effect, but also achieves the effect of quickly adsorbing and fixing the wafer and quickly separating it under force. At the same time, the miniature cylinder 10213 provides a second-order driving adjustment effect for the placement seat 10214, which can effectively adapt to the dicing of thinner wafers.

[0046] Furthermore, the cooling and cutting assembly 1022 includes a connecting plate 10221 with a groove 10222, and the connecting plate 10221 is installed on the square plate 10223. At the same time, a connecting base 10226 is provided below the square plate 10223 for installing the cutting blade 10224 and the cutting motor 10225. The groove 10222 is arranged in a grid structure. When the groove is arranged in a grid structure, it effectively provides a synchronous force driving adjustment effect for the slider 10227, avoiding motion interference between the slider 10227 and the connecting plate 10221, thereby affecting the normal driving adjustment effect of the through frame 10228.

[0047] Furthermore, in the above scheme, the slide 10222 is installed on the through frame 10228 via the slider 10227, and the through frame 10228 has through slots on both sides for easy installation of the fixing bracket 10229. At the same time, a semiconductor cooler 102210 is provided on one side of the fixing bracket 10229, and a horizontal fan 102211 with a filter screen is provided on the other side of the fixing bracket 10229 to deliver cold air into the through frame 10228. A locking block 102212 is provided below the through frame 10228 to be connected to the locking slot 10212. The above components are also installed using existing technology components. When using existing technology components for installation, they can also effectively achieve synchronous force drive adjustment and cold air generation and delivery effects. In addition, the semiconductor cooler 102210 is set with positive and negative poles at different working environment temperatures, and the temperature difference effectively enables the semiconductor cooler 102210 to operate normally.

[0048] In the above scheme, when the wafer needs to be diced, the operator manually places the wafer into the placement seat 10214 using the suction cup 10215 for adsorption and fixation. Then, the operator controls the adjusting cylinder 10216 to operate. During operation, the adjusting cylinder 10216 drives the connecting seat 10211 and the placement seat 10214 to move synchronously under force. When the slot 10212 engages with the locking block 102212, the adjusting cylinder 10216 stops operating. When there is still a dicing distance between the wafer and the dicing blade 10224, the operator controls the micro cylinder 10213 to drive the placement seat 10214 to move under force, causing the wafer to move closer to the dicing blade. When the two are in contact, the motor 1013 drives the connecting seat 10211 to move under force. During the movement of the connecting seat 10211 under force, the slot 10212 and the block 102212 drive the through frame 10228 and the slider 10227 to move relative to the connecting plate 10221 and the slide 10222 under force. At the same time, during the operation of the cutting motor 10225, the semiconductor cooler 102210, the dust collection and conveying cooling structure 2 and the horizontal fan 102211 work synchronously. During the synchronous operation of the above components, not only is cooling and temperature reduction achieved, but dust collection is also achieved.

[0049] like Figure 10 As shown, the control and adjustment structure 1 is provided with a dust collection and conveying cooling structure 2 on both sides. The dust collection and conveying cooling structure 2 includes a negative pressure fan 201 with a corrugated pipe 202. One end of the corrugated pipe 202 is connected to the through frame 10228 through a pipe connector. At the same time, the negative pressure fan 201 is connected to one side of the mounting bracket 1018. The above-mentioned components are also installed using existing technology components. When the existing technology components are installed, they can effectively achieve the negative pressure extraction and conveying effect.

[0050] Furthermore, the above solution includes a conveying pipe 203 connected to the collection box 204 on one side of the negative pressure fan 201, and a grid for mounting the filter element 205 inside the collection box 204. At the same time, a connecting pipe 206 connected to the control box 1011 is provided below the collection box 204. The above components are installed using existing technology components, which can also effectively achieve the effects of filtration, conveying and cooling.

[0051] In the above scheme, when dust is generated during the wafer dicing process, it is transported to the inside of the collection box 204 through the corrugated pipe 202, the negative pressure fan 201 and the conveying pipe 203. The dust contained in the cold air entering the collection box 204 is filtered by the filter element 205 and then transported to the inside of the control box 1011 through the connecting pipe 206 to cool down the internal components of the control box 1011.

[0052] The terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of the present invention.

[0053] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer dicing machine with a cutting and cooling structure, characterized in that: It includes a basic control and adjustment structure (1), and dust collection and conveying cooling structures (2) are provided on both sides of the control and adjustment structure (1). The control and adjustment structure (1) includes a control drive assembly (101) for installing and synchronously driving the cutting and cooling structure (102). The control drive assembly (101) includes a control box (1011) with a control panel on its surface. The control box (1011) is provided with a half frame (1012) for driving and adjusting a set of ball screws (1014) through a motor (1013). Meanwhile, a ball nut (1015) for driving and adjusting is provided through the surface of the ball screw (1014). An adjustment component (1016) with a through groove structure is provided on one side of the ball nut (1015). One of the adjusting components (1016) is movably connected to the half frame (1012) at one end via a connecting pin and a mounting plate, and at the other end via a connecting pin and a mounting plate to the surface of one of the ball nuts (1015). The other two adjusting components (1016) are also connected to the corresponding ball nuts (1015). At the same time, the adjusting components (1016) are connected to each other via connecting pins and mounting plates and are provided with mounting plates (1017) for mounting the components of the cutting and cooling structure (102). The overall shape of the adjusting component (1016) is an elliptical plate structure with a keyway in the middle. There are three ball screws (1014). During the force movement of the adjusting component (1016), the mounting plates (1017) are driven to move synchronously through the connecting pins and mounting plates, thereby driving the components in the cutting and cooling structure (102) to move under force, thereby performing warp and weft cutting on the wafer. The cutting and cooling structure (102) includes an adsorption adjustment component (1021) for mounting the wafer and a cooling and cutting component (1022) for cutting the wafer. The adsorption adjustment component (1021) includes a connecting seat (10211) with an internal groove structure. The connecting seat (10211) has a slot (10212) that is matched and connected to the components of the cooling and cutting component (1022). The groove of the connecting seat (10211) is provided with a miniature cylinder (10213) for driving and adjusting the placement seat (10214), and the placement seat (10214) is provided with a suction cup (10215) for adsorbing and fixing the wafer. Meanwhile, the bottom of the connecting seat (10211) is connected to the mounting plate (1017) through the adjusting cylinder (10216). The cooling and cutting assembly (1022) includes a connecting plate (10221) with a groove (10222), and the connecting plate (10221) is installed on a square plate (10223). At the same time, a connecting base (10226) for installing the cutting blade (10224) and the cutting motor (10225) is provided below the square plate (10223). The slide (10222) is installed on the through frame (10228) via the slider (10227), and the through frame (10228) has through slots on both sides for easy installation of the fixing bracket (10229). At the same time, a semiconductor cooler (102210) is provided on one side of the fixing bracket (10229), and a horizontal fan (102211) with a filter screen is provided on the other side of the fixing bracket (10229) to deliver cold air into the through frame (10228). A card block (102212) is provided below the through frame (10228) to be connected to the card slot (10212).

2. The wafer dicing machine with a cutting and cooling structure according to claim 1, characterized in that: The control box (1011) has mounting brackets (1018) with through holes on both sides, and the mounting brackets (1018) have fixing plates (1019) for mounting another set of half frames (1012).

3. A wafer dicing machine with a cutting and cooling structure according to claim 1, characterized in that: The dust collection and conveying cold structure (2) includes a negative pressure fan (201) with a corrugated pipe (202), and one end of the corrugated pipe (202) is connected to the through frame (10228) through a pipe connector. At the same time, the negative pressure fan (201) is connected to one side of the mounting bracket (1018).

4. A wafer dicing machine with a cutting and cooling structure according to claim 3, characterized in that: The negative pressure fan (201) has a delivery pipe (203) connected to the collection box (204) on one side, and the collection box (204) has a grid for installing the filter element (205) inside, and a connecting pipe (206) connected to the control box (1011) is provided below the collection box (204).

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