Electronic device and portable communication device

Abstract

An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a first portion that is conductive, forms a side appearance of the electronic device, a second portion that is adjacent to the array antenna, the front cover, and the first portion that is conductive, and has at least one opening filled with a non-conductive material, and a third portion that includes the non-conductive material and is disposed adjacent to the array antenna, the rear cover, and the first portion that is conductive. The first portion that is conductive is exposed to an outside of the electronic device, and the second portion and the third portion are hidden by the front cover and the rear cover. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

Description

[0001] This application is a divisional application of Chinese invention patent application 202080003642.0, filed on May 4, 2020. Technical Field

[0002] This disclosure relates to antennas and electronic devices including them. Background Technology

[0003] With the development of wireless communication technology, electronic devices (e.g., communication electronic devices) are ubiquitous in daily life, leading to an exponential increase in content usage. Due to this rapid increase in content usage, network capacity is reaching its limits. Following the commercialization of 4G communication systems, to meet the ever-growing demand for wireless data traffic, research is underway on communication systems that use high-frequency (e.g., millimeter wave (mmWave)) frequency bands (e.g., the 3GHz to 300GHz band) to transmit and / or receive signals (e.g., 5G or pre-5G communication systems or new radio (NR)). Summary of the Invention

[0004] Technical issues

[0005] Current research focuses on developing next-generation wireless communication technologies to allow signal transmission / reception using frequencies ranging from 3 GHz to 100 GHz, overcome high free-space losses caused by frequency characteristics, implement efficient mounting structures to increase antenna gain, and develop related novel antenna modules. These antenna modules can include array-type antenna modules, in which various numbers of antenna elements (e.g., conductive patches) are arranged at regular intervals. These antenna elements can be positioned within an electronic device to form a beam pattern in one direction, for example, from the internal space of the electronic device towards its front, rear, or side surfaces.

[0006] The electronic device may include conductive portions (e.g., metal components) disposed on at least a portion of the housing to enhance rigidity and produce an aesthetically pleasing appearance, and non-conductive portions (e.g., polymer components) combined with the conductive portions. However, when the conductive portions are placed near an antenna module disposed inside the electronic device, the radiation performance and radiation sensitivity of the antenna module may degrade.

[0007] Non-conductive portions can be inserted into or structurally bonded to conductive portions to form a single housing. Furthermore, to prevent separation of the conductive and non-conductive portions due to external impact, the boundary region between the conductive and non-conductive portions can have a joining structure consisting of at least one protrusion and at least one recess for receiving the at least one protrusion. The portion of the housing facing the antenna module can be formed as a non-conductive portion, which forms a beam pattern in a specific direction from the internal space of the electronic device. Therefore, the boundary region between the conductive and non-conductive portions can be placed near the antenna module, and the recessed portion of the conductive portion resulting from the joining structure consisting of protrusions and recesses can also be placed near the antenna module.

[0008] Unfortunately, this recessed portion may induce excitation current, potentially causing a decrease in the antenna module's radiation performance and sensitivity.

[0009] The above information is presented as background information only and is intended to aid in understanding this disclosure. There is no determination or assertion as to whether any of the above content can be considered applicable prior art to this disclosure.

[0010] Technical solution

[0011] The aspects of this disclosure will at least address the aforementioned problems and / or disadvantages, and will at least provide the following advantages. Therefore, the present disclosure aims to provide apparatus and methods for antennas, and electronic devices including therein.

[0012] Another aspect of this disclosure is to provide apparatus and methods for an electronic device that can prevent a decrease in antenna radiation performance through structural modifications to the housing.

[0013] Another aspect of this disclosure is to provide an apparatus and method for an electronic device that can prevent damage to the housing due to external impacts and can also prevent degradation of antenna performance.

[0014] Other aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the embodiments presented.

[0015] According to an aspect of this disclosure, an electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The front cover and rear cover form part of the exterior appearance of the electronic device. The array antenna includes a plurality of antenna elements disposed between the front cover and the rear cover. The support member is disposed between the front cover and the rear cover and configured to support a display of the electronic device and extend to a side surface of the electronic device to at least partially form the side appearance of the electronic device. The support member includes: a conductive first portion forming the side appearance of the electronic device; a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material; and a third portion formed of a non-conductive material and adjacent to the array antenna, the rear cover, and the conductive first portion. The first portion is exposed to the exterior of the electronic device, and the second and third portions are concealed by the front and rear covers to avoid exposure to the exterior. A beam formed by the array antenna radiates to the exterior through at least one opening and the third portion.

[0016] According to another aspect of this disclosure, a portable communication device is provided. The portable communication device includes a housing, a display, and an antenna module. The housing includes a first member forming a front portion of the portable communication device, a second member forming a rear portion of the portable communication device, and a third member forming a side portion of the portable communication device. The third member includes a conductive member having an opening formed therein, and a non-conductive member filling the opening. One surface of the conductive member is exposed to the exterior of the portable communication device, and the non-conductive member is disposed within the housing so as not to be exposed to the exterior. The display is disposed below the first member and is visually visible from the exterior through the first member. The antenna module is disposed between the display and the second member and includes an antenna and a printed circuit board. The antenna is formed on the printed circuit board such that signals radiated from the antenna are transmitted to the exterior through the non-conductive member.

[0017] Other aspects, advantages, and distinctive features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of this disclosure, taken in conjunction with the accompanying drawings.

[0018] Beneficial effects

[0019] As described above, the electronic device according to embodiments of this disclosure has a structurally modified housing designed to prevent its non-conductive portions from separating from their conductive portions due to external impact. This also prevents degradation of the antenna's radiation performance. Attached Figure Description

[0020] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure.

[0022] Figure 2 This is a block diagram illustrating an electronic device for supporting conventional network communication and 5G network communication according to embodiments of the present disclosure.

[0023] Figure 3a This is a perspective view showing the front surface of a mobile electronic device according to an embodiment of the present disclosure.

[0024] Figure 3b This illustrates an embodiment according to the present disclosure. Figure 3a A perspective view of the rear surface of the mobile electronic device shown.

[0025] Figure 3c This illustrates an embodiment according to the present disclosure. Figure 3a and Figure 3b An exploded perspective view of the mobile electronic device shown.

[0026] Figure 4a An embodiment according to this disclosure is shown in Figure 2 Shown and referenced in Figure 2 An embodiment of the structure of the described third antenna module.

[0027] Figure 4b According to embodiments of this disclosure Figure 4a The cross-sectional view taken by line Y-Y' in the middle.

[0028] Figure 5 This is a perspective view showing an antenna module according to an embodiment of the present disclosure.

[0029] Figure 6a This is an exploded perspective view showing an antenna module and conductive components to be applied thereto according to an embodiment of the present disclosure.

[0030] Figure 6b This is a perspective view showing an antenna module and conductive components applied thereto according to an embodiment of the present disclosure.

[0031] Figure 7 This is a partial illustration of an embodiment according to the present disclosure. Figure 3b The line A-A' in the middle shows a cross-sectional view of the electronic device.

[0032] Figure 8a This is a partial illustration of an embodiment according to the present disclosure. Figure 3b The line B-B' in the middle is a view of the electronic device.

[0033] Figure 8b This is a view that partially illustrates a side member having a non-conductive region surrounding an antenna module according to an embodiment of the present disclosure.

[0034] Figure 9a and Figure 9bThis is a diagram showing the radiation pattern and gain of an antenna module according to various embodiments of the present disclosure, resulting from horizontal polarization.

[0035] Figure 9c This is a diagram illustrating the radiation pattern of an antenna module according to an embodiment of the present disclosure, caused by vertical polarization.

[0036] Figure 10 This is a partial illustration of an embodiment according to the present disclosure. Figure 3a The line C-C' in the middle is a cross-sectional view of the electronic device.

[0037] Figure 11a This is a perspective view showing a portion of the housing according to an embodiment of the present disclosure.

[0038] Figure 11b This is a perspective view showing a portion of the housing according to an embodiment of the present disclosure.

[0039] Figure 12a and Figure 12b This illustrates various embodiments according to the present disclosure. Figure 10 The radiation pattern and gain diagram of the antenna module caused by horizontal polarization.

[0040] Figure 13 This is a cross-sectional view of an electronic device including conductive connecting members according to an embodiment of the present disclosure.

[0041] Figure 14a This is a radiation pattern view showing the horizontal polarization of the antenna module before and after movement of the conductive connection member, according to an embodiment of the present disclosure.

[0042] Figure 14b This is a radiation pattern view showing the vertical polarization of the antenna module before and after the movement of the conductive connection member, according to an embodiment of the present disclosure.

[0043] Figure 15 This is a perspective view partially illustrating an electronic device including a conductive sheet with notches according to an embodiment of the present disclosure.

[0044] Figure 16 This illustrates the configuration according to embodiments of the present disclosure. Figure 15 A diagram showing the radiation pattern of an antenna module in an electronic device, resulting from vertical and horizontal polarization.

[0045] Figure 17 This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0046] Figure 18 This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0047] Figure 19a and Figure 19b This is a perspective view showing a support member according to various embodiments of the present disclosure.

[0048] Figure 20a and Figure 20b This is a perspective view partially illustrating an electronic device including a conductive sheet with grooves according to various embodiments of the present disclosure.

[0049] Throughout the accompanying drawings, the same reference numerals will be understood to refer to the same parts, components, and structures. Detailed Implementation

[0050] The following description, with reference to the accompanying drawings, is provided to aid in a thorough understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to aid in this understanding, but these details will be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and constructions may be omitted.

[0051] The terms and words used in the following description and claims are not limited to their literal meaning, but are used only to enable this disclosure to be clearly and consistently understood. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is for illustrative purposes only and not for limiting the disclosure as defined by the appended claims and their equivalents.

[0052] It will be understood that the singular forms of “one” and “the” include plural objects unless the context clearly indicates otherwise. Thus, for example, a reference to “part surface” includes a reference to one or more such surfaces.

[0053] Figure 1 An electronic device in a network environment is shown according to an embodiment of the present disclosure.

[0054] Reference Figure 1Electronic device 101 in network environment 100 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). Electronic device 101 can communicate with electronic device 104 via server 108. Electronic device 101 includes a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, and / or antenna module 197. In some embodiments, at least one of the components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

[0055] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. As at least part of the data processing or calculations, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. Processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or may be adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0056] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 may take over from the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190). Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190). The auxiliary processor 123 (e.g., ISP or CP) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally associated with the auxiliary processor 123.

[0057] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134, the non-volatile memory including one or more of internal memory 136 and external memory 138.

[0058] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144 and / or application 146.

[0059] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (e.g., stylus).

[0060] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0061] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. Display device 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0062] Audio module 170 can convert sound into electrical signals and vice versa. Audio module 170 can obtain sound via input device 150, or output sound via sound output device 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to electronic device 101.

[0063] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. Sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] Interface 177 may support one or more specific protocols used to enable direct (e.g., wired) or wireless connection between electronic device 101 and external electronic device (e.g., electronic device 102). Interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0065] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). Connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0066] The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0067] Camera module 180 can capture images or moving images. Camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0068] The power management module 188 manages the power supply to the electronic device 101. The power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0069] Battery 189 can power at least one component of electronic device 101. Battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0070] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., AP), and support direct (e.g., wired) or wireless communication. Communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the SIM 196.

[0071] Antenna module 197 can transmit or receive signals or power from the outside of electronic device 101 (e.g., external electronic device). Antenna module 197 may include an antenna comprising a radiating element composed of conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). Antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna. An additional component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be formed as part of antenna module 197.

[0072] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0073] Commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to the second network 199. Each of electronic devices 102 and 104 can be a device of the same type as electronic device 101, or a device of a different type. All or some operations that will run on electronic device 101 can be run on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more of the external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request one or more of the external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0074] The electronic device according to the embodiments can be one of various types of electronic devices. The electronic device may include portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. However, the electronic device is not limited to any of the electronic devices described above.

[0075] The various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents or substitutions to the respective embodiments.

[0076] In the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements.

[0077] The singular form of a noun corresponding to a term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B or C” may include any or all possible combinations of the items listed together with the corresponding phrase in the plurality of phrases.

[0078] As used herein, terms such as “first” and “second” or “first” and “second” can be used to simply distinguish one component from another without limiting the components in any other respect (e.g., importance or order). Where the terms “operably” or “communically” are used, or where the terms “operably” or “communically” are not used, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element),” it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0079] The term "module" can include units implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of that single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0080] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0081] Methods according to embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g., Play Store™), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0082] Each of the above components (e.g., a module or program) may include a single entity or multiple entities. One or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding component of the multiple components performed one or more functions prior to integration. The operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0083] Figure 2 This illustrates an electronic device in a network environment comprising multiple cellular networks, according to embodiments of the present disclosure.

[0084] Reference Figure 2 The electronic device 101 of block diagram 200 may include a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front-end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may also include reference... Figure 1 At least one of the described components, the second network 199 may also include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or included as part of the third RFIC 226.

[0085] The first communication processor 212 can establish a communication channel for a frequency band used for wireless communication with the first cellular network 292, and support conventional network communication through the established communication channel. According to various embodiments, the first cellular network can be a conventional network including second-generation (2G), 3G, 4G, or Long Term Evolution (LTE) networks. The second communication processor 214 can establish a communication channel corresponding to a specified frequency band (e.g., about 6 GHz to about 60 GHz) within the frequency band used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. According to various embodiments, the second cellular network 294 can be a 5G network defined in 3GPP. Additionally, according to embodiments, the first communication processor 212 or the second communication processor 214 can establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or less) within the frequency band used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 can be implemented as a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed as a single chip or a single package with the processor 120, the auxiliary processor 123 or the communication module 190.

[0086] When transmitting, the first RFIC 222 can convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of approximately 700 MHz to approximately 3 GHz used in the first cellular network 292 (e.g., a conventional network). When receiving, the RF signal can be obtained from the first cellular network 292 (e.g., a conventional network) via an antenna (e.g., the first antenna module 242) and preprocessed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 can then convert the preprocessed RF signal back into a baseband signal for processing by the first communication processor 212.

[0087] When transmitting, the second RFIC 224 can convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into a Sub6 band (e.g., 6 GHz or less) RF signal (hereinafter referred to as a 5G Sub6 RF signal) to be used in the second cellular network 294 (e.g., a 5G network). When receiving, the 5G Sub6 RF signal can be obtained from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., a second antenna module 244) and preprocessed by an RFFE (e.g., a second RFFE 234). The second RFIC 224 can convert the preprocessed 5G Sub6 RF signal back into a baseband signal, which can then be processed by the corresponding communication processor in the first communication processor 212 or the second communication processor 214.

[0088] The third RFIC 226 can convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as a 5G Above6 RF signal) in the 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network). Upon reception, the 5G Above6 RF signal can be obtained from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and preprocessed by the third RFFE 236. The third RFIC 226 can convert the preprocessed 5G Above6 RF signal back into a baseband signal for processing by the second communication processor 214. According to one embodiment, the third RFFE 236 can be formed as part of the third RFIC 226.

[0089] According to an embodiment, electronic device 101 may include a fourth RFIC 228, separate from or at least part of the third RFIC 226. In this case, the fourth RFIC 228 may convert a baseband signal generated by the second communication processor 214 into an intermediate frequency (IF) RF signal (e.g., about 9 GHz to about 11 GHz) and transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal back into a baseband signal for processing by the second communication processor 214.

[0090] According to one embodiment, the first RFIC 222 and the second RFIC 224 can be implemented as at least part of a single package or a single chip. According to one embodiment, the first RFFE 232 and the second RFFE 234 can be implemented as at least part of a single package or a single chip. According to one embodiment, at least one of the first antenna module 242 or the second antenna module 244 can be omitted, or can be combined with another antenna module to process RF signals of corresponding multiple frequency bands.

[0091] According to one embodiment, the third RFIC 226 and antenna 248 can be disposed on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or processor 120 can be disposed on the first substrate (e.g., a main PCB). In this case, the third RFIC 226 is disposed in a local area (e.g., the lower surface) of the first substrate and a separate second substrate (e.g., a sub-PCB), and the antenna 248 is disposed in another local area (e.g., the upper surface) of the first substrate and the separate second substrate, thereby forming the third antenna module 246. By disposing the third RFIC 226 and antenna 248 on the same substrate, the length of the transmission line between them can be reduced. This can reduce signal loss (e.g., attenuation) in the high-frequency band (e.g., from about 6 GHz to about 60 GHz) used in 5G network communication, for example, due to the transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (e.g., a 5G network).

[0092] According to one embodiment, antenna 248 may be configured as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, third RFIC 226 may include a plurality of phase shifters 238 corresponding to the plurality of antenna elements, for example as part of third RFFE 236. During transmission, each of the plurality of phase shifters 238 may shift the phase of a 5G Above6 RF signal that will be transmitted through the corresponding antenna element to an external location (e.g., a base station of a 5G network) of electronic device 101. During reception, each of the plurality of phase shifters 238 may shift the phase of a 5G Above6 RF signal received from the external location through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception to be performed via beamforming between electronic device 101 and the external location.

[0093] The second cellular network 294 (e.g., a 5G network) can operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone (SA)) or in combination with the first cellular network 292 (e.g., non-standalone (NSA)). For example, the 5G network may only have an access network (e.g., a 5G radio access network (RAN) or a next-generation (NG) RAN) and no core network (e.g., a next-generation core network (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 can access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., an evolved packet switching core network (EPC)). Protocol information for communicating with the legacy network (e.g., LTE protocol information) or protocol information for communicating with the 5G network (e.g., new radio (NR) protocol information) can be stored in memory 130 for access by other components (e.g., processor 120, first communication processor 212, or second communication processor 214).

[0094] Figure 3a A perspective view showing the front surface of a mobile electronic device according to an embodiment of the present disclosure is shown.

[0095] Figure 3b The illustration shows embodiments according to this disclosure. Figure 3a A perspective view of the rear surface of the mobile electronic device shown.

[0096] Reference Figure 3a and Figure 3bThe mobile electronic device 300 may include a housing 310, wherein the housing 310 includes a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a side surface 310C surrounding the space between the first surface 310A and the second surface 310B. The housing 310 may refer to a structure forming a portion of the first surface 310A, the second surface 310B, and the side surface 310C. The first surface 310A may be formed from a front panel 302 (e.g., a glass or polymer panel coated with various coatings), at least partially of which is substantially transparent. The second surface 310B may be formed from a substantially opaque rear panel 311. The rear panel 311 may be formed from, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The side surface 310C may be formed from a side frame structure (or “side member”) 318 bonded to the front panel 302 and the rear panel 311 and comprising metal and / or polymer. The back panel 311 and the side frame structure 318 can be integrally formed and can be made of the same material (e.g., a metallic material such as aluminum).

[0097] The front panel 302 may include two first regions 310D, each disposed along its long edge and seamlessly curved and extending from a first surface 310A toward the rear panel 311. Similarly, the rear panel 311 may include two second regions 310E, each disposed along its long edge and seamlessly curved and extending from a second surface 310B toward the front panel 302. The front panel 302 (or the rear panel 311) may include only one of the first regions 310D (or the second regions 310E). The first region 310D or the second region 310E may be partially omitted. When viewed from the side of the mobile electronic device 300, the side frame structure 318 may have a first thickness (or width) on the side excluding the first region 310D or the second region 310E, and may have a second thickness less than the first thickness on the other side including the first region 310D or the second region 310E.

[0098] The mobile electronic device 300 may include at least one of the following: a display 301, audio modules 303, 307 and 314, sensor modules 304 and 319, camera modules 305, 312 and 313, a key input device 317, a light-emitting device, and connector holes 308 and 309. The mobile electronic device 300 may omit at least one of the above components (e.g., key input device 317 or light-emitting device), or may include other components.

[0099] For example, a large portion of the display 301 may be exposed through the front panel 302. At least a portion of the display 301 may be exposed through the front panel 302 forming a first region 310D of the first surface 310A and side surfaces 310C. The outline of the display 301 (i.e., edges and corners) may have a substantially the same shape as the outline of the front panel 302. The spacing between the outline of the display 301 and the outline of the front panel 302 may remain substantially constant in order to increase the exposed area of ​​the display 301.

[0100] A recess or opening may be formed in a portion of the display area of ​​the display 301 to accommodate at least one of the audio module 314, sensor module 304, camera module 305, and light-emitting device. At least one of the audio module 314, sensor module 304, camera module 305, fingerprint sensor (not shown), and light-emitting element may be arranged on the back of the display area of ​​the display 301. The display 301 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. At least a portion of sensor modules 304 and 319 and / or at least a portion of key input device 317 may be arranged in a first region 310D and / or a second region 310E.

[0101] Audio modules 303, 307, and 314 may correspond to microphone hole 303 and speaker holes 307 and 314, respectively. Microphone hole 303 may contain a microphone for acquiring external sound, and in this case, may contain multiple microphones for sensing the direction of sound. Speaker holes 307 and 314 may be classified as external speaker hole 307 and call receiver hole 314. Microphone hole 303 and speaker holes 307 and 314 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without speaker holes 307 and 314.

[0102] Sensor modules 304 and 319 can generate electrical signals or data corresponding to the internal operating state of the mobile electronic device 300 or to external environmental conditions. Sensor modules 304 and 319 may include a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface 310B of the housing 310. A fingerprint sensor may be disposed on both the second surface 310B and the first surface 310A (e.g., a display 301) of the housing 310. The electronic device 300 may also include at least one of the following sensors: a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0103] Camera modules 305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, and a second camera module 312 and / or a flash 313 disposed on a second surface 310B. Camera module 305 or camera module 312 may include one or more lenses, an image sensor, and / or an image signal processor. Flash 313 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device 300.

[0104] The key input device 317 may be arranged on the side surface 310C of the housing 310. The mobile electronic device 300 may not include some or all of the key input devices 317 described above, and the un-included key input devices 317 may be implemented in another form, such as soft keys on the display 301. The key input device 317 may include a sensor module arranged on the second surface 310B of the housing 310.

[0105] A light-emitting device may be disposed on a first surface 310A of the housing 310. For example, the light-emitting device may provide status information of the electronic device 300 in an optical form. The light-emitting device may provide a light source associated with the operation of the camera module 305. The light-emitting device may include, for example, a light-emitting diode (LED), an IR LED, or a xenon lamp.

[0106] Connector holes 308 and 309 may include a first connector hole 308 and / or a second connector hole 309, wherein the first connector hole 308 is adapted for a connector for sending power and / or data to and from an external electronic device (e.g., a Universal Serial Bus (USB) connector), and the second connector hole 309 is adapted for a connector for sending audio signals to and from an external electronic device (e.g., a headphone jack).

[0107] Some of the camera modules 305 and 312, some of the sensor modules 304 and 319, or indicators may be arranged to be exposed through the display 301. For example, the camera module 305, sensor module 304, or indicator may be arranged within the interior space of the electronic device 300 so as to be in contact with the external environment through a perforated opening in the display 301 to the front panel 302. In another embodiment, some of the sensor modules 304 may be arranged to perform their functions within the interior space of the electronic device without being visually exposed through the front panel 302. For example, in this case, the area of ​​the display 301 facing the sensor modules may not require a perforated opening.

[0108] Figure 3c The illustration shows embodiments according to this disclosure. Figure 3a An exploded perspective view of the mobile electronic device shown.

[0109] Reference Figure 3c The mobile electronic device 300 may include a side frame structure 310, a first support member 3211 (e.g., a bracket), a front panel 302, a display 301, an electromagnetic induction panel (not shown), a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a rear cover), an antenna 370, and a rear panel 311. The mobile electronic device 300 may omit at least one of the above components (e.g., the first support member 3211 or the second support member 360), or may include another component. Some components of the electronic device 300 may be compatible with... Figure 1 or Figure 2 The components of the mobile electronic device 101 shown are the same or similar, therefore, their description is omitted below.

[0110] A first support member 3211 is disposed inside the mobile electronic device 300 and may be connected to or integrated with the side bezel structure 320. The first support member 3211 may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member 3211 may be coupled to a display 301 on one side and to a printed circuit board (PCB) 340 on the other side. A processor, memory, and / or interface may be mounted on the PCB 340. The processor may include one or more of, for example, a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor central processor, or a communication processor (CP).

[0111] The memory may include, for example, one or more of volatile memory and non-volatile memory.

[0112] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The interface enables the mobile electronic device 300 to be electrically or physically connected to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0113] Battery 350 is a means for supplying power to at least one component of mobile electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. At least a portion of battery 350 may be arranged on a plane substantially the same as PCB 340. Battery 350 may be integrally arranged within mobile electronic device 300 and may be detachably arranged from mobile electronic device 300.

[0114] Antenna 370 may be disposed between rear panel 311 and battery 350. Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 370 may perform short-range communication with external devices or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion of side frame structure 320 and / or first support member 3211, or a combination of side frame structure 320 and first support member 3211.

[0115] Figure 4a Reference is made to, for example, to, embodiments according to this disclosure. Figure 2 The structure of the third antenna module is described.

[0116] Reference Figure 4a View (a) is a perspective view showing the third antenna module 246 viewed from one side. Figure 4a View (b) is a perspective view showing the third antenna module 246 viewed from the other side. Figure 4a View (c) shows along Figure 4a A cross-sectional view of the third antenna module 246 taken by line X-X'.

[0117] Reference Figure 4a In one embodiment, the third antenna module 246 may include a printed circuit board 410, an antenna array 430, an RFIC 452, and a PMIC 454. Alternatively, the third antenna module 246 may also include a shielding member 490. In other embodiments, at least one of the above components may be omitted, or at least two of the components may be integrally formed.

[0118] The printed circuit board 410 may include multiple conductive layers and multiple non-conductive layers stacked alternately with the conductive layers. The printed circuit board 410 may provide electrical connections between the printed circuit board 410 and / or various electronic components disposed externally, using wiring and conductive paths formed in the conductive layers.

[0119] Antenna array 430 (e.g., Figure 2 The 248th antenna array may include a plurality of antenna elements 432, 434, 436, or 438 configured to form a directional beam. As shown, antenna elements 432, 434, 436, and / or 438 may be formed on a first surface of the printed circuit board 410. According to another embodiment, the antenna array 430 may be formed inside the printed circuit board 410. According to this embodiment, the antenna array 430 may include a plurality of antenna arrays (e.g., dipole antenna arrays and / or patch antenna arrays) of the same or different shapes or types.

[0120] RFIC 452 (e.g., Figure 2 The third RFIC 226 may be disposed spaced apart from the antenna array in another area of ​​the printed circuit board 410 (e.g., a second surface opposite to the first surface). RFIC 452 is configured to process signals of a selected frequency band transmitted / received via the antenna array 430. According to one embodiment, when transmitting, RFIC 452 can convert a baseband signal obtained from a communication processor (not shown) into an RF signal of the specified frequency band. When receiving, RFIC 452 can convert the RF signal received via the antenna array 430 into a baseband signal and transmit the baseband signal to the communication processor.

[0121] According to another embodiment, when transmitting, RFIC 452 can transmit data from an intermediate frequency integrated circuit (IFIC) (e.g., ...). Figure 2The IF signal (e.g., from about 9 GHz to about 11 GHz) obtained by antenna array 428 is up-converted to an RF signal in the selected frequency band. When receiving, RFIC 452 can down-convert the RF signal obtained by antenna array 430, convert the RF signal to an IF signal, and transmit the IF signal to IFIC.

[0122] The PMIC 454 may be disposed spaced apart from the antenna array 430 in another local area (e.g., a second surface) of the printed circuit board 410. The PMIC 454 may receive voltage from the main PCB (not shown) to provide the power required by various components on the antenna module (e.g., RFIC 452).

[0123] The shielding member 490 may be disposed on a portion (e.g., a second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 or PMIC 454. According to one embodiment, the shielding member 490 may include a shielding cover.

[0124] Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (e.g., a main circuit board) via a module interface. The module interface may include connection members, such as coaxial cable connectors, board-to-board connectors, interposers, or flexible printed circuit boards (FPCBs). The RFIC 452 and / or PMIC 454 of the antenna module may be electrically connected to the printed circuit board via the connection members.

[0125] Figure 4b This illustrates an embodiment according to the present disclosure. Figure 4a A cross-sectional view of the third antenna module 246 taken by line Y-Y' in view (a).

[0126] Reference Figure 4b The printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413. The antenna layer 411 may include at least one dielectric layer 437-1 and antenna elements 436 and / or feed portions 425 formed on or inside the outer surface of the dielectric layer. The feed portion 425 may include feed points 427 and / or feed lines 429.

[0127] Network layer 413 may include at least one dielectric layer 437-2, at least one ground layer 433 formed on or inside the outer surface of the dielectric layer, at least one conductive path 435, transmission line 423 and / or feed line 429.

[0128] Furthermore, in the illustrated embodiment, Figure 4a RFIC 452 of view (c) (e.g., Figure 2The third RFIC 226 can be electrically connected to the network layer 413 via, for example, a first solder bump 440-1 and a second solder bump 440-2. In other embodiments, various connection structures (e.g., solder or ball grid array (BGA)) can be used instead of solder bumps. RFIC 452 can be electrically connected to the antenna element 436 via the first solder bump 440-1, transmission line 423, and feed portion 425. RFIC 452 can also be electrically connected to the ground layer 433 via the second solder bump 440-2 and conductive path 435. Although not shown, RFIC 452 can also be electrically connected to the aforementioned module interface via feed line 429.

[0129] Figure 5 This is a perspective view showing an antenna module according to an embodiment of the present disclosure.

[0130] Figure 5 The antenna module 500 can be at least partially similar to Figure 2 The third antenna module 246 may be included, or other embodiments may include an antenna module.

[0131] Reference Figure 5 Antenna module 500 may include an antenna structure consisting of a printed circuit board (PCB) 590 and a plurality of conductive patches 510, 520, 530, and 540. According to an embodiment, antenna module 500 may include a wireless communication circuit 595 mounted on the PCB 590. According to an embodiment, the antenna structure may include a plurality of conductive patches 510, 520, 530, and 540 disposed on the PCB 590. According to an embodiment, antenna module 500 may include an array antenna AR1 consisting of a plurality of conductive patches 510, 520, 530, and 540. According to an embodiment, the plurality of conductive patches 510, 520, 530, and 540 may be formed on the PCB 590. According to an embodiment, PCB 590 may have a first surface 591 facing a first direction (indicated by ①) and a second surface 592 facing a second direction opposite to the first direction (indicated by ②). According to an embodiment, antenna module 500 may include a wireless communication circuit 595 disposed on the second surface 592 of PCB 590. In another embodiment, the wireless communication circuit 595 may be spaced apart from the PCB 590 within the internal space of the electronic device and electrically connected to the PCB 590 via an electrical connection member (e.g., a flexible PCB (FPCB)). According to an embodiment, a plurality of conductive patches 510, 520, 530, and 540 may be electrically connected to the wireless communication circuit 595. According to an embodiment, the wireless communication circuit 595 may be configured to transmit and / or receive radio frequency signals in the range of approximately 3 GHz to 100 GHz via an array antenna AR1.

[0132] According to various embodiments, the plurality of conductive patches 510, 520, 530, and 540 may include a first conductive patch 510, a second conductive patch 520, a third conductive patch 530, and a fourth conductive patch 540 disposed at regular intervals on or near the first surface 591 of the PCB 590. The conductive patches 510, 520, 530, and 540 may have substantially the same construction. Although the antenna module 500 according to embodiments is shown and described as comprising an array antenna AR1 consisting of four conductive patches 510, 520, 530, and 540, this is only and should not be construed as limiting. Alternatively, the antenna module 500 may include one, two, three, five, or more conductive patches as the array antenna AR1. In another embodiment, the antenna module may also include a plurality of conductive patterns (e.g., dipole antennas) disposed on the PCB 590. In this configuration, the conductive patterns can be arranged to form a beam pattern direction different from (e.g., perpendicular to) the beam pattern direction of the conductive patches 510, 520, 530, and 540. Although not shown, the antenna module 500 may also include a protective member (e.g., urethane resin) surrounding the wireless communication circuitry 595 on the second surface 592 of the PCB 590 and / or a conductive coating member (e.g., electromagnetic interference (EMI) shielding material) coated on the outer surface of the protective member to shield noise.

[0133] Figure 6a This is an exploded perspective view showing an antenna module and conductive components to be applied thereto according to an embodiment of the present disclosure.

[0134] Figure 6b This is a perspective view showing an antenna module and conductive components applied thereto according to an embodiment of the present disclosure.

[0135] Reference Figure 6a and Figure 6b Electronic devices (e.g.) Figure 3a The electronic device 300 may include a conductive member 550 that is at least partially fixed to the antenna module 500. According to an embodiment, the conductive member 550 may be fixed to a housing (e.g., Figure 3a and Figure 7 The conductive portion of the housing 310 (e.g., Figure 7 The conductive portion 321 in the middle) and / or the support member fixed to the internal space of the electronic device (e.g., Figure 7 The conductive portion of the first support member 3211 in the middle. According to an embodiment, the conductive member 550 may be connected to the side member (e.g., Figure 7 The conductive portion of the side member 320 (e.g., Figure 7The conductive portion 321) is in physical contact, thereby enhancing the rigidity of the antenna module 500. According to an embodiment, the conductive member 550 may be formed of a metallic material such as stainless steel (SUS), copper (Cu), or aluminum (Al), thereby effectively transferring high-temperature heat emitted from the antenna module 500 to the outside.

[0136] According to various embodiments, the conductive member 550 may include a first support portion 551 at least partially facing the PCB 590 (e.g., a side surface facing the PCB 590), and a second support portion 552 extending from the first support portion 551 and bent to face another portion (e.g., a second surface 592) of the PCB 590. According to embodiments, the conductive member 550 may include at least one extension portion 5511 and 5512, said at least one extension portion 5511 and 5512 extending from at least one end of the first support portion 551 and being secured to the side member (e.g., Figure 7 The conductive portion of the side member 320 (e.g., Figure 7 The conductive portion 321) and / or fixed to the support member (e.g., Figure 7 The conductive portion of the first support member 3211 in the conductive member 550. In one embodiment, at least one extension 5511 and 5512 may include a pair extending in opposite directions of the conductive member 550. In another embodiment, at least one extension 5511 and 5512 may extend from the second support 552. Thus, the antenna module 500 may be supported by the first support 551 and the second support 552 of the conductive member 550 and secured to the side member (e.g., via at least one extension 5511 and 5512) by fastening members such as screws. Figure 7 The conductive portion of the side member 320 (e.g., Figure 7 The conductive portion 321) and / or fixed to the support member (e.g., Figure 7 The conductive part of the first support member 3211 in the middle.

[0137] Figure 7 This is a partial illustration of an embodiment according to the present disclosure. Figure 3b The line A-A' in the middle shows a cross-sectional view of the electronic device.

[0138] Reference Figure 7The electronic device 300 may include a housing 310, which includes a front panel 302 (e.g., a front cover) facing a first direction (e.g., the Z direction), a rear panel 311 (e.g., a rear cover) facing a direction opposite to the front panel 302 (e.g., the Z direction), and a side member 320 surrounding an internal space 3001 between the front panel 302 and the rear panel 311. According to an embodiment, the side member 320 may include a conductive portion 321 (e.g., a metal member) at least partially disposed therein, and a non-conductive portion 322 (e.g., a polymer member) inserted into the conductive portion 321. In another embodiment, the non-conductive portion 322 may be replaced with space or any other dielectric material. In yet another embodiment, the non-conductive portion 322 may be structurally integrated with the conductive portion 321. According to an embodiment, the side member 320 may include a support member 3211 (e.g., a support member extending partially into the internal space 3001) that extends into the internal space 3001. Figure 3c The first support member 3211 extends from the side member 320 into the internal space 3001, or can be formed by structural integration with the side member 320. According to an embodiment, the first support member 3211 extends from the conductive portion 321. According to an embodiment, the support member 3211 can support at least a portion of the antenna module 500 disposed in the internal space 3001. According to an embodiment, the first support member 3211 can be configured to support at least a portion of the display 301. According to an embodiment, the display 301 can be configured to be visible from the outside through at least a portion of the front panel 302. According to an embodiment, the display 301 may include a flexible display.

[0139] According to various embodiments, the antenna module 500 can be disposed in the internal space 3001 of the electronic device 300 in a direction perpendicular to the front panel 302. According to embodiments, the antenna module 500 can be mounted such that it includes a conductive patch (e.g., Figure 5 The array antenna AR1 of the conductive patches 510, 520, 530, and 540 in the PCB faces the side member 320. For example, the antenna module 500 may be configured such that the first surface 591 of the PCB 590 faces the side member 320, and thus forms a beam pattern in the direction (indicated by ①) in which the side member 320 faces. According to an embodiment, at least a portion of the side member 320 facing the antenna module 500 may be formed as a non-conductive portion 322, such that a beam pattern is formed in the direction (indicated by ①) in which the side member 320 faces. According to an embodiment, the electronic device 300 may include a device substrate 340 disposed in the internal space 3001 (e.g., Figure 3c (PCB 340 in the example). According to an embodiment, although not shown, the antenna module 500 can be electrically connected to the device substrate 340 via an electrical connection member (e.g., an FPCB connector).

[0140] Figure 8a This is a partial illustration of an embodiment according to the present disclosure. Figure 3b The line B-B' in the middle is a view of the electronic device.

[0141] Figure 8a Only the conductive portion 321 as viewed from above of the rear panel 311 is shown, while the non-conductive portion 322 is substantially omitted. The non-conductive portion 322 may be filled with an insulating member such as a polymer component.

[0142] Reference Figure 8a The side member 320 may include a non-conductive portion 322 (e.g., a polymer component) configured to correspond to a region forming the beam pattern of the antenna module 500. According to an embodiment, the non-conductive portion 322 may be inserted into a conductive portion 321. According to an embodiment, a boundary region between the non-conductive portion 322 and the conductive portion 321 may be located near the antenna module 500. According to an embodiment, the boundary region may have a bonding structure designed to prevent the conductive portion 321 and the non-conductive portion 322 from separating from each other due to external impact after being bonded together. According to an embodiment, the boundary region may be positioned in a location that does not overlap with the antenna module 500 when viewed from the outside of the side member 320. For example, the conductive portion 321 may include a recessed portion 3221 recessed in the boundary region. According to an embodiment, the non-conductive portion 322 may be formed as part of the side member 320 of the electronic device 300 by being filled into the recessed portion 3221 via insertion injection.

[0143] According to various embodiments, when the recessed portion 3221 is formed deeper than a predetermined depth, an excitation current may be generated by means of current trapping in the recessed portion 3221. This excitation current may degrade the radiation performance of the antenna module 500. Therefore, the depth and / or shape of the recessed portion 3221 can be important parameters for determining the antenna radiation performance.

[0144] According to various embodiments, when as in Figure 3bWhen viewed from above, the rear panel 311, as shown in the diagram, can be shaped such that its tilt angle (θ) does not exceed approximately 60 degrees. As illustrated, the tilt angle (θ) is the angle formed by the starting point of the recessed portion 3221 (i.e., the contact point with the side member 320) relative to a virtual line (L) formed from both ends of the PCB toward the side member 320 (i.e., in the direction perpendicular to the side member 320, as indicated by ①). Furthermore, while ensuring that the tilt angle (θ) does not exceed approximately 60 degrees, the recessed portion 3221 can be formed at a certain depth and in a certain shape. The shape of the recessed portion 3221 can vary, such as a curved shape or a flat shape. In one embodiment, the recessed portion 3221 can be shaped such that the tilt angle (θ) relative to the virtual line (L) formed from both ends of the array antenna AR1 toward the side member 320 does not exceed approximately 60 degrees. According to an embodiment, considering the beam coverage of the array antenna AR1 (e.g., ±30 degrees relative to the virtual line (L), the tilt angle (θ) of the recessed portion 3221 can be in the range of about 30 degrees to about 60 degrees. According to an embodiment, the recessed portion 3221 can gradually narrow or widen relative to the virtual line (L) along the tilt angle (θ). According to an embodiment, the inner surface of the recessed portion 3221 can be a curved plane with a specific radius of curvature.

[0145] According to an embodiment, the recessed portion 3221 can prevent undesirable separation (indicated by ①) between the non-conductive portion 322 and the conductive portion 321 in the horizontal direction due to external impact. According to an embodiment, the recessed portion 3221 may have at least one slit 3221a that is further recessed from the inner surface of the recessed portion 3221. According to an embodiment, the slit 3221a may be formed in a direction substantially parallel to the rear plate 311. According to an embodiment, the slit 3221a can increase the contact area between the conductive portion 321 and the non-conductive portion 322, thereby improving the bonding force. According to an embodiment, the slit 3221a can prevent undesirable separation (indicated by ③) between the non-conductive portion 322 and the conductive portion 321 in the vertical direction due to external impact. According to an embodiment, the radiation characteristics of the antenna module 500 may be determined by the shape, depth, width, and / or number of slits 3221a.

[0146] According to various embodiments, the distance (d) between the recessed portion 3221 and the PCB 590, as shown, can be determined so as not to exceed one-quarter of the wavelength in the wavelength carrier of the maximum operating frequency of the antenna module (i.e., 1 / 4*λ).

[0147] Figure 8b This is a view that partially illustrates a side member having a non-conductive region surrounding an antenna module according to an embodiment of the present disclosure.

[0148] Reference Figure 8bThe side member 320 may include at least one non-conductive region 322a disposed around the antenna module 500 within the conductive portion 321. According to an embodiment, when viewed from the outside, the at least one non-conductive region 322a may be disposed near the left and right ends of the PCB 590 of the antenna module 500. According to an embodiment, the at least one non-conductive region 322a may be formed to at least partially intersect the side member 320 between the PCB 590 and the recessed portion 3221. According to an embodiment, the at least one non-conductive region 322a may be formed by injecting a material that is the same as or different from the material of the non-conductive portion 322. The at least one non-conductive region 322a can prevent double radiation caused by the recessed portion 3221 when a beam is emitted from the array antenna AR1.

[0149] Figure 9a and Figure 9b This is a diagram showing the radiation pattern and gain of an antenna module according to various embodiments of the present disclosure, resulting from horizontal polarization (H-pol).

[0150] Reference Figure 9a and Figure 9b Compared to the horizontal polarization 901 and gain 903 of a typical antenna module in which the recessed portion has a tilt angle (θ) exceeding approximately 60 degrees, the horizontal polarization 902 and gain 904 of the antenna module 500 according to the embodiment of the present disclosure exhibit relatively superior sensitivity characteristics, and the gain is improved by approximately 2.5 dB. This is because, as referenced above... Figure 7 and Figure 8a The recessed portion (e.g., Figure 8a The recessed portion 3221) is formed in the conductive portion (e.g., Figure 8a In the conductive part 321), its tilt angle (θ) is not more than about 60 degrees.

[0151] Figure 9c This is a diagram showing the radiation pattern of an antenna module according to an embodiment of the present disclosure caused by vertical polarization (V-pol).

[0152] Reference Figure 9c Compared to the vertical polarization 905 of a typical antenna module in which the recessed portion has a tilt angle (θ) exceeding approximately 60 degrees, the vertical polarization 906 of the antenna module 500 according to the embodiment of the present disclosure exhibits relatively superior sensitivity characteristics. This is because, as referenced above... Figure 7 and Figure 8a The recessed portion (e.g., Figure 8a The recessed portion 3221) is formed in the conductive portion (e.g., Figure 8a In the conductive part 321), its tilt angle (θ) is not more than about 60 degrees.

[0153] Figure 10 This is a partial illustration of an embodiment according to the present disclosure. Figure 3a The line C-C' in the middle shows a cross-sectional view of the electronic device.

[0154] Figure 11a This is a perspective view showing a portion of the housing according to an embodiment of the present disclosure.

[0155] In the following description of the electronic device 300, components that are the same as those described above are indicated by the same reference numerals, and their detailed descriptions may be omitted.

[0156] According to various embodiments, in an antenna module 500 that radiates along a direction (indicated by ①) from the internal space 3001 of the electronic device 300 toward the side member 320, a cancellation phenomenon (or void phenomenon) may occur due to the phase difference between the beam pattern directly radiated from the antenna module 500 and the beam pattern reflected by the first support member 3211 disposed nearby. This may degrade the radiation performance of the antenna module 500. Various embodiments of this disclosure may have configurations for preventing antenna performance degradation through structural changes to the side member 320.

[0157] Reference Figure 10 and Figure 11a The electronic device 300 may include a housing 310, which includes a front panel 302 (e.g., a front cover), a rear panel 311 (e.g., a rear cover) facing in the opposite direction to the front panel 302, and a side member 320 surrounding an internal space 3001 between the front panel 302 and the rear panel 311. According to an embodiment, the side member 320 may have a first surface 3201 facing the front panel 302 and a second surface 3202 facing in the opposite direction to the first surface 3201. According to an embodiment, the side member 320 may include a conductive portion 321 (e.g., a metal member) at least partially disposed therein and a first non-conductive portion 3224 (e.g., a metal member) inserted into the conductive portion 321. Figure 7 The non-conductive portion 322 in the interior space 3001 (e.g., a polymer component). According to an embodiment, the side member 320 may include a support member 3211 that extends at least partially into the interior space 3001 (e.g., ...). Figure 3c The first supporting member 3211 in the middle.

[0158] According to various embodiments, a front panel 302 may be disposed on a first surface 3201 of a side member 320. According to an embodiment, the front panel 302 may be supported by at least a portion of the side member 320, which includes a first support member 3211. According to an embodiment, an electronic device 300 may include a display 301 disposed between the front panel 302 and the side member 320. According to an embodiment, the display 301 may include a polarizing layer (not shown), a display panel (not shown), at least one additional layer (e.g., a buffer layer and / or an embossed layer, not shown), and / or a conductive sheet 3011 sequentially stacked on the rear surface of the front panel 302. According to an embodiment, the display 301 may include a conductive sheet 3011 (e.g., a Cu sheet) disposed on the rear surface of the display panel for noise shielding.

[0159] According to various embodiments, the antenna module 500 can be disposed in the internal space 3001 of the electronic device 300 in a direction perpendicular to the front panel 302 via a conductive member 550. According to embodiments, the antenna module 500 can be mounted such that it includes a conductive patch (e.g., Figure 5 The array antenna AR1 of the conductive patches 510, 520, 530, and 540 (e.g., multiple antenna elements) faces the side member 320. For example, the antenna module 500 may be configured such that the first surface 591 of the PCB 590 faces the side member 320, thus allowing a beam pattern to be formed in the direction (indicated by ①) facing the side member 320 of the electronic device 300. According to an embodiment, at least a portion of the side member 320 facing the antenna module 500 may be a first non-conductive portion 3224, which allows a beam pattern to be formed in the direction (indicated by ①) facing the side member 320. According to an embodiment, the electronic device 300 may include a device substrate 340 (e.g., ...) disposed in the internal space 3001. Figure 3c (PCB 340 in the example). According to an embodiment, although not shown, the antenna module 500 can be electrically connected to the device substrate 340 via an electrical connector (e.g., an FPCB connector).

[0160] According to various embodiments, at least a portion of the conductive portion 321 of the side member 320 may be shaped to support the display 301 and the front panel 302 on one side of the antenna module 500. Therefore, the conductive portion 321 of the side member 320 may at least partially influence the beam pattern radiated in the direction of the front panel 302.

[0161] According to various embodiments, the side member 320 may further include at least one second non-conductive portion 3222, which is disposed at a position corresponding to the array antenna AR1 of the antenna module 500 in the direction of the front panel 302. According to embodiments, the second non-conductive portion 3222 may be associated with the first non-conductive portion 3224 (e.g., Figure 7 The non-conductive portion 322 is inserted into the conductive portion 321 along with the non-conductive portion 3224. In another embodiment, the first non-conductive portion 3224 and the second non-conductive portion 3222 may be formed of insulating materials with different properties (e.g., different dielectric constants). In yet another embodiment, the second non-conductive portion 3222 may be an empty space in which no insulating material is disposed. The second non-conductive portion 3222 may be formed in the first surface 3201 (e.g., a flat portion) and / or a curved surface extending laterally from the first surface 3201 of the side member 320. According to an embodiment, at least one second non-conductive portion 3222 may be disposed at a position that at least partially overlaps with the array antenna AR1 when the front panel 302 is viewed from above and / or when the side member 320 is viewed from the outside. According to an embodiment, a plurality of second non-conductive portions 3222 may be disposed with each conductive patch (e.g., Figure 5 The first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and / or the fourth conductive patch 540 are located at corresponding positions. Therefore, the radiation length of the beam pattern radiated from the antenna module 500 in the direction of the side member 320 increases upward through the second non-conductive portion 3222 up to the conductive sheet 3011 of the display 301. This helps to reduce cancellation phenomena compared to an antenna module located near the side member 320 which does not have the second non-conductive portion 3222.

[0162] Figure 11b This is a perspective view showing a portion of the housing according to an embodiment of the present disclosure.

[0163] Reference Figure 11b The side member 320 may include a second non-conductive portion 3223 disposed in the first surface 3201 and / or a curved surface extending laterally from the first surface 3201. According to an embodiment, when viewing the front panel 302 from above and / or when viewing the side member 320 from the outside, the second non-conductive portion 3223 may be formed as a plurality of conductive patches (e.g., ...) with the array antenna AR1. Figure 5 The dimensions of the first conductive patch 510, the second conductive patch 520, the third conductive patch 530 and / or the fourth conductive patch 540 in the middle are at least partially overlapping.

[0164] Figure 12a and Figure 12b This illustrates various embodiments according to the present disclosure. Figure 10The radiation pattern and gain diagram of the antenna module caused by horizontal polarization (H-pol).

[0165] Reference Figure 12a and Figure 12b Compared to the horizontal polarization 1201 and gain 1203 of a typical antenna module in which the side member has a conductive portion, the antenna module according to the embodiments of this disclosure (e.g., Figure 10 The horizontal polarization 1202 and gain 1204 of the antenna module 500 in the embodiment exhibit relatively excellent sensitivity characteristics and high gain. This is because, as described above, the side components of the antenna module according to the embodiment (e.g., Figure 10 The side member 320 in the middle may include a second non-conductive portion (e.g., Figure 10 The second non-conductive portion 3222), when viewed from above the front panel (e.g., Figure 10 When the front panel 302 is in the middle and / or when the side member is viewed from the outside, the second non-conductive portion is disposed with the array antenna (e.g., Figure 10 The positions where the array antennas AR1 in the array at least partially overlap.

[0166] Figure 13 This is a cross-sectional view of an electronic device including conductive connecting members according to an embodiment of the present disclosure.

[0167] Reference Figure 13 When the antenna module (e.g., Figure 10 The antenna module 500 in the middle includes a second non-conductive portion (e.g., Figure 10 When the side member 320 of the second non-conductive portion 3222 in the antenna module 301 is in operation, the vertical polarization (V-pol) beamform may be distorted due to the conductive sheet 3011 (e.g., a Cu sheet) disposed on the rear surface of the display 301 (e.g., a display panel). According to embodiments of this disclosure, to suppress such vertical polarization beamform distortion, the electronic device 300 may include at least one conductive connection member 3212 disposed between the conductive portion 321 of the side member 320 and the conductive sheet 3011. According to embodiments, the conductive connection member 3212 may be configured to physically contact both the conductive sheet 3011 and the conductive portion 321 of the side member 320. According to embodiments, the conductive connection member 3212 may be formed of a metal component. Therefore, the conductive sheet 3011 electrically connected to the conductive member 321 via the conductive connection member 3212 can be considered as at least a portion of the conductive member 321 disposed near the antenna module 500.

[0168] According to various embodiments, the antenna module 500 can be configured to allow independent adjustment of the vertical polarization (V-pol) by moving the conductive connection member 3212 between the conductive sheet 3211 and the side member 320, without substantially changing the horizontal polarization (H-pol).

[0169] Figure 14a This is a radiation pattern view showing the horizontal polarization (H-pol) of the antenna module before and after the movement of the conductive connection member, according to an embodiment of the present disclosure.

[0170] Reference Figure 14a Even if the conductive connecting member 3212 moves between the conductive sheet 3011 and the side member 320, the horizontal polarization 1402 after the movement can still be in the same position as the horizontal polarization 1401 before the movement. This means that even when the conductive connecting member 3212 moves, the horizontal polarization (H-pol) can remain essentially fixed.

[0171] Figure 14b This is a radiation pattern view showing the vertical polarization (V-pol) of the antenna module before and after the movement of the conductive connection member, according to an embodiment of the present disclosure.

[0172] like Figure 13 As shown, when the conductive connection member 3212 moves from a first position (P1) between the conductive sheet 3011 and the side member 320 to a second position (P2), the vertical polarization (V-pol) can be adjusted. (Refer to...) Figure 14b In the absence of application Figure 13 Vertical polarization 1403 in the case of conductive connection member 3212, in Figure 13 The vertical polarization 1404 before the conductive connection member 3212 moves and the vertical polarization 1405 after the movement are both different from each other. This could mean that independent adjustment of the vertical polarization (V-pol) is possible depending on the presence and / or movement of the conductive connection member 3212.

[0173] Figure 15 This is a perspective view partially illustrating an electronic device including a conductive sheet with notches according to an embodiment of the present disclosure.

[0174] refer to Figure 15 When the antenna module (e.g., Figure 10 The antenna module 500 in the electronic device is as described above. Figure 13When the side member 320, which includes the second non-conductive portion 3222 and the conductive connection member 3212 as described in the figure, is in operation, the sensitivity may decrease due to the conductive sheet 3011 (e.g., a Cu sheet) disposed on the rear surface of the display 301. To prevent such a decrease in sensitivity, the electronic device 300 may include, for example, a notch 3012 formed in at least a portion of the conductive sheet 3011. According to an embodiment, when the front panel 302 is viewed from above, the notch 3012 may have an area overlapping with the second non-conductive region 3222. According to an embodiment, in the internal space 3001 of the electronic device 300, an antenna module (e.g., Figure 10 The antenna module 500 can form a beam pattern in the direction of the display 301 through the second non-conductive portion 3222 formed in the side member 320 and the notch 3012 formed in the conductive sheet 3011.

[0175] Figure 16 This illustrates the configuration according to embodiments of the present disclosure. Figure 15 Antenna modules in electronic devices (e.g., Figure 10 The radiation pattern of the antenna module 500 (in which the radiation pattern is caused by vertical polarization (V-pol) and horizontal polarization (H-pol).

[0176] Reference Figure 16 In the antenna module (e.g., Figure 10 In the antenna module 500, compared to the vertical polarization 1601 without the notch region applied, the notch region (e.g., Figure 15 The notch 3012 in the middle is used in conductive sheets (e.g., Figure 15 In the case of the conductive sheet 3011, the vertical polarization 1602 exhibits relatively superior sensitivity characteristics. Furthermore, compared to the horizontal polarization 1603 without the notch region applied, the horizontal polarization 1604 with the notch region applied to the conductive sheet exhibits relatively superior sensitivity characteristics.

[0177] Figure 17 This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0178] According to one embodiment, the performance degradation of the antenna module 500 can be prevented by changing the structural shape of the inner surface of the conductive portion 321 of the side member 320.

[0179] Reference Figure 17The electronic device 300 may include a conductive portion 321, which is configured as a portion of the side member 320 near an upper side of the antenna module 500 placed in the internal space 3001, and at least partially supports the front panel 302 and the display 301. According to embodiments, in the side member 320, the typical shape of the conductive portion 321 (such as a first-level structure (e.g., a first-level eaves structure) or a stepped structure (e.g., a two-level eaves structure)) is modified to increase (delay by 180 degrees) or decrease the phase difference between radio waves directly radiated from the antenna module 500 to the outside and radio waves reflected by the inner surface of the conductive portion 321. As a result, cancellation (or voiding) can be prevented when radio waves with different phases converge around a single location.

[0180] According to various embodiments, the conductive portion 321 of the side member 320 may include a structural shape not only for effectively distorting the direction of radio waves radiated from the antenna module 500 and reflected by the conductive portion 321, but also for increasing the path length. According to an embodiment, the conductive portion 321 may include a first flat plane 3203, a curved plane 3204 extending laterally from the first flat plane 3203, and a second flat plane 3205 extending from the curved plane 3204. According to an embodiment, the first flat plane 3203 and / or the second flat plane 3205 may be formed substantially perpendicular to a first surface 591 of the PCB 590. In another embodiment, the first flat plane 3203 and / or the second flat plane 3205 may be formed with various tilt angles that allow radio waves (E) radiated from the antenna module 500 and reflected by the conductive portion 321 to disperse rather than concentrate around a single location. In yet another embodiment, the curved plane 3204 may be formed with various radii of curvature that allow radio waves (E) radiated from the antenna module 500 and reflected by the conductive portion 321 to disperse rather than concentrate around a single location. In another embodiment, the conductive portion 321 may at least partially have a thickness (t) that is adjusted to increase the path length of the radio waves (E) radiated from the antenna module 500.

[0181] Figure 18 This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0182] Figure 19a and Figure 19b This is a perspective view showing a support member according to various embodiments of the present disclosure.

[0183] Figure 18 The electronic device 600 can be at least partially similar to Figure 1 Electronic device 101 Figure 3a Electronic devices 300 or Figure 10The electronic device 300, or other embodiments that may include the electronic device.

[0184] Reference Figure 18 and Figure 19a The electronic device 600 may include a housing 610 (e.g., Figure 10 The housing 610 includes a front cover 602 (e.g., housing 310), which is a shell 310 in the middle. Figure 10 The front panel 302 and the rear cover 611 facing the opposite direction to the front cover 602 (e.g., Figure 10 The rear panel 311 in the middle, and the support member 620 surrounding the internal space 6001 between the front cover 602 and the rear cover 611 (e.g., Figure 10 (Side member 320 in the middle). According to an embodiment, the electronic device 600 may include a device substrate 640 disposed in the internal space 6001 (e.g., side member 320 in the middle). Figure 3c (PCB 340 in the example). According to an embodiment, the support member 620 may include: a conductive first portion 621 that forms the side appearance of the electronic device 600 (e.g., PCB 340 in the example). Figure 3a The first portion 621 is formed of a non-conductive material and has at least one opening 6221 filled with a non-conductive material. The second portion 622 is adjacent to the array antenna AR1, the front cover 602, and the conductive first portion 621. The third portion 623 is formed of a non-conductive material and is adjacent to the array antenna AR1, the rear cover 611, and the conductive first portion 621. According to an embodiment, a support member 620 may be disposed between the front cover 602 and the rear cover 611, supporting the display 601 of the electronic device 600, and extending toward the side surface of the electronic device 600 to at least partially form the side appearance of the electronic device 600 (e.g., ...). Figure 3a (side surface 310c in the middle).

[0185] According to various embodiments, the front cover 602 may be disposed via at least a portion of the conductive first portion 621 and second portion 622 of the support member 620. According to embodiments, the front cover 602 may be disposed via an extension portion 6211 extending from the support member 620 (e.g., Figure 10 The first support member 3211 is supported. According to an embodiment, the electronic device 600 may include a display 601 disposed between the front cover 602 and the support member 620, so that it is at least partially visible from the outside through the front cover 602. According to an embodiment, the display 601 may include a polarizing layer (not shown), a display panel (not shown), at least one additional layer (e.g., a buffer layer and / or an embossed layer, not shown) and / or a conductive sheet 6011 (e.g., ...) stacked sequentially on the rear surface of the front cover 602. Figure 10(Conductive sheet 3011 in the display panel). According to an embodiment, the display 601 may include a conductive sheet 6011 (e.g., a Cu sheet) disposed on the rear surface of the display panel for noise shielding.

[0186] According to various embodiments, the antenna module 500 can be disposed in the internal space 6001 of the electronic device 600 in a direction perpendicular to the front cover 602 via a conductive member 550. According to embodiments, the antenna module 500 can be mounted such that it includes a conductive patch (e.g., Figure 5 The array antenna AR1 of the conductive patches 510, 520, 530 and 540 (e.g., multiple antenna elements) faces the support member 620. For example, the antenna module 500 can be configured such that the first surface 591 of the PCB 590 faces the support member 620, so that a beam pattern can be formed in the direction (indicated by ①) facing the support member 620 of the electronic device 600.

[0187] According to various embodiments, the conductive first portion 621 and second portion 622 of the support member 620 can be shaped to support the display 601 and the front cover 602 near an upper side of the antenna module 500. According to an embodiment, the third portion 623 of the support member 620 can be shaped to support the rear cover 611 near a lower side of the antenna module 500. According to an embodiment, the conductive first portion 621 can be at least partially exposed to the outside of the electronic device 600, and the second portion 622 and the third portion 623 can be hidden by the front cover 602 and the rear cover 611 to avoid exposure to the outside. According to an embodiment, the beam formed by the array antenna AR1 can radiate to the outside through at least one opening 6221 and the third portion 623.

[0188] According to various embodiments, at least one opening 6221 formed in the second portion 622 may be filled with a non-conductive material. For example, the non-conductive material of the second portion 622 and the non-conductive material of the third portion 623 may be inserted together with the conductive first portion 621. In one embodiment, the non-conductive material of the second portion 622 and the non-conductive material of the third portion 623 may be formed of insulating materials having the same or different properties (e.g., different dielectric constants). In one embodiment, the non-conductive material of the second portion 622 and the non-conductive material of the third portion 623 may be connected or spaced apart from each other in the internal space of the electronic device. In one embodiment, at least one opening 6221 may be an empty space in which no insulating material is disposed. According to an embodiment, the second portion 622 may include a flat portion 6201 and a curved portion 6202 extending from the flat portion 6201 to the first portion 621. According to an embodiment, at least one opening 6221 and / or the non-conductive material filled in at least one opening 6221 may be formed in a shape including the flat portion 6201 and / or the curved portion 6202.

[0189] According to an embodiment, when viewing the front cover 602 from above and / or when viewing the support member 620 from the outside, at least one opening 6221 may be provided at a location that at least partially overlaps with the array antenna AR1. According to an embodiment, multiple openings 6221 may be provided with respect to each conductive patch (e.g., Figure 5 The first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and / or the fourth conductive patch 540 are positioned corresponding to each other. Therefore, the radiation length of the beam pattern radiated from the antenna module 500 in the direction of the support member 620 (indicated by ①) increases upwards through at least one opening 6221 up to the conductive sheet 6011 of the display 601. This can help reduce cancellation phenomena compared to an antenna module provided through a support member 620 that does not have an opening 6221.

[0190] Reference Figure 19b The support member 620 may include a single opening 6221 configured to overlap with the array antenna AR1. According to an embodiment, when viewing the front cover 602 from above and / or when viewing the support member 620 from the outside, the opening 6221 may be formed with a plurality of conductive patches (e.g., Figure 5 The dimensions of all overlapping portions of the first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and / or the fourth conductive patch 540. Although not shown, the electronic device 600 may be as follows: Figure 13 The illustrated portion includes an electrical connection member (e.g., disposed between the conductive first portion 621 and the conductive sheet 6011) Figure 20a(Electrical connection component 3212 in the array). Furthermore, the radiation characteristics of the array antenna AR1 can be adjusted depending on the position of the conductive connection component.

[0191] Figure 20a and Figure 20b This is a perspective view partially illustrating an electronic device including a conductive sheet with grooves according to various embodiments of the present disclosure.

[0192] Reference Figure 20a and Figure 20b When passing Figure 18 When the at least one opening 6221 shown forms the beam pattern of the array antenna AR1, the sensitivity may decrease due to the conductive sheet 6011 (e.g., a Cu sheet) disposed on the rear surface of the display 601. To prevent this decrease in sensitivity, the electronic device 600 may include, for example, at least one slot 6011a or 6011b formed in at least a portion of the conductive sheet 6011. According to an embodiment, when the front cover 602 is viewed from above, at least one slot 6011a or 6011b may be formed at a location overlapping with at least one opening 6221. For example, at least one slot 6011a or 6011b may be one slot 6011a or two slots 6011b having a length overlapping with a plurality of antenna elements (e.g., conductive patches) of the array antenna AR1. In one embodiment, the at least one slot may be a plurality of slots respectively corresponding to the plurality of antenna elements.

[0193] According to various embodiments of this disclosure, electronic devices (e.g., Figure 18 The electronic device 600 in the middle may include a front cover (e.g., Figure 18 Front cover 602), rear cover (e.g., Figure 18 The back cover 611), array antenna (e.g., Figure 18 The array antenna AR1 and supporting components (e.g., Figure 18 The support member 620 in the middle. The front cover and the rear cover may form part of the appearance of the electronic device. The array antenna may include multiple antenna elements disposed between the front cover and the rear cover. The support member may be disposed between the front cover and the rear cover to support the display of the electronic device (e.g., Figure 18 The display 601 in the middle extends to the side surface of the electronic device to at least partially form the side appearance of the electronic device. The support member may include: a conductive first portion (e.g., Figure 18 The first conductive portion 621 in the middle forms the side appearance of the electronic device; the second portion (e.g., Figure 18 The second part 622), adjacent to the array antenna, the front cover and the conductive first part, has at least one opening filled with a non-conductive material (e.g., Figure 19a The opening 6221 in the middle); and the third part (e.g., Figure 18 The third portion (623) is formed of a non-conductive material and is adjacent to the array antenna, the back cover, and the conductive first portion. The first portion may be exposed to the outside of the electronic device, while the second and third portions may be concealed by the front and back covers to avoid external exposure. The beam formed by the array antenna can radiate to the outside through at least one opening and the third portion.

[0194] According to various embodiments, the display may include: a display panel disposed between a front cover and a rear cover and overlapping the at least one opening; and a conductive sheet (e.g., Figure 18 The conductive sheet 6011 is disposed on the rear surface of the display panel so as not to overlap with the at least one opening.

[0195] According to various embodiments, the conductive sheet may include at least one notch formed in a region overlapping with the at least one opening (e.g., Figure 15 (in the notch 3012) or at least one groove (e.g., Figure 20a The slot 6011a or Figure 20b (Slot 6011b in the middle).

[0196] According to various embodiments, the electronic device may further include a conductive connection member disposed between the conductive sheet and the conductive first portion (e.g., Figure 20a (Conductive connecting component 3212 in the middle).

[0197] According to various embodiments, the conductive connection member may include a metal member that electrically connects a first conductive portion and a conductive sheet.

[0198] According to various embodiments, the electrical connection position of the conductive connecting member between the conductive first part and the conductive sheet can determine the radiation characteristics of the array antenna.

[0199] According to various embodiments, the conductive first portion and / or second portion can be configured to face the front cover, and the conductive first portion and / or second portion can have a flat portion (e.g., Figure 19a The flat portion 6201) and the curved portion extending from the flat portion (e.g., Figure 19a (The curved portion 6202 in the middle). The display panel and the conductive sheet may be arranged adjacent to at least a portion of the curved portion from the flat portion.

[0200] According to various embodiments, the at least one opening may be provided at least partially in the flat portion and the curved portion.

[0201] According to various embodiments, the second and third parts may be configured to be at least partially connected to each other.

[0202] According to various embodiments, the non-conductive material in the second part and the non-conductive material in the third part may have the same or different dielectric constants.

[0203] According to various embodiments, the at least one opening may be located at a position corresponding to the plurality of antenna elements.

[0204] According to various embodiments, the at least one opening can be formed in a number corresponding to the antenna element.

[0205] According to various embodiments, the plurality of antenna elements may include a plurality of conductive patches disposed at regular intervals on a printed circuit board, wherein the at least one opening may be formed to a size corresponding to all of the plurality of conductive patches.

[0206] According to various embodiments of the present disclosure, a portable communication device (e.g., Figure 18 The electronic device 600 in the middle may include a housing (e.g., Figure 18 The housing 610 in the middle), the display (e.g., Figure 18 The display 601 in the middle) and the antenna module (e.g., Figure 18 The antenna module 500 in the housing may include a first component forming the front of the portable communication device (e.g., antenna module 500). Figure 18 The front cover 602), and the second component forming the rear of the portable communication device (e.g., Figure 18 The rear cover 611), and a third component forming the side of the portable communication device (e.g., Figure 18 The third member may include a support member 620 (within which the support member 620 is located). Figure 19a The conductive component (e.g., opening 6221) in the middle) Figure 18 The conductive first portion 621 in the middle), and the non-conductive component filling the opening (e.g., Figure 18 (Part 2, 622). One surface of the conductive component may be exposed to the exterior of the portable communication device, while the non-conductive component may be housed within the casing to avoid external exposure. A display may be positioned below the first component and visually visible from the outside through the first component. An antenna module may be positioned between the display and the second component and includes an antenna (e.g., ...). Figure 18 The array antenna AR1 and the printed circuit board (e.g., Figure 18 (PCB 590 in the example). The antenna can be formed on the printed circuit board, so that the signal radiated from the antenna can be transmitted to the outside through non-conductive components.

[0207] According to various embodiments, the display may include a display panel and a conductive sheet disposed on the rear surface of the display panel so as not to overlap with an opening (e.g., Figure 18 (Conductive sheet 6011 in the middle).

[0208] According to various embodiments, the conductive sheet may have at least one notch formed in a region overlapping with the opening (e.g., Figure 15 (in the notch 3012) or at least one groove (e.g., Figure 20a The slot 6011a or Figure 20b (Slot 6011b in the middle).

[0209] According to various embodiments, the opening may include a first sub-opening spaced apart therefrom (e.g., Figure 19a The first opening 6221) and the second sub-opening (e.g., Figure 19a The second opening 6221 is located near the first opening. The upper surface of the non-conductive member may include a first portion exposed via the first sub-opening through the conductive member (e.g., Figure 19a The second part 622) and the second part exposed via the second sub-opening through the conductive member (e.g., Figure 19a Part 2 (622).

[0210] According to various embodiments, the antenna may include first antennas spaced apart from each other (e.g., ...). Figure 5 The first conductive patch 510 in the middle) and the second antenna (e.g., Figure 5 The second conductive patch 520 in the image. When viewed in a direction substantially perpendicular to the first portion of the upper surface, the first portion may overlap with the first antenna, and when viewed in a direction substantially perpendicular to the second portion of the upper surface, the second portion may overlap with the second antenna.

[0211] According to various embodiments, when viewed in a direction substantially perpendicular to the side-facing surface of the printed circuit board, the conductive components (e.g., Figure 19a The first conductive portion 621 in the antenna can overlap with the antenna.

[0212] According to various embodiments, conductive components may extend into the housing to support the antenna module (e.g., Figure 18 The lower surface of the PCB 590 (including the array antenna AR1) is included.

[0213] Although this disclosure has been specifically shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the scope of the subject matter as defined by the appended claims.

[0214] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device comprising: The front and rear covers form part of the exterior of the electronic device; An antenna structure disposed between the front cover and the rear cover; as well as A side member, disposed between the front cover and the rear cover, extends to the side surface of the electronic device to at least partially form the side appearance of the electronic device, and includes conductive and non-conductive portions. The non-conductive portion is positioned where it overlaps with the antenna structure when viewed from the outside. The conductive portion includes a recessed portion for at least partially accommodating the non-conductive portion, and the boundary region between the conductive portion and the non-conductive portion is positioned where it does not overlap with the antenna structure when viewed from the outside. When viewed from above, the recessed portion is formed such that the tilt angle does not exceed 60 degrees. The tilt angle is formed between a tilt line and a vertical line. The tilt line connects one of the two ends of the antenna structure to the starting point of the recessed portion from the side surface. The vertical line vertically connects one end of the antenna structure to the side surface.

2. The electronic device of claim 1, wherein the tilt angle ranges from 30 degrees to 60 degrees.

3. The electronic device of claim 1, wherein the inner surface of the recessed portion is formed as a curved surface with a specific curvature.

4. The electronic device of claim 1, wherein the recessed portion has at least one slit, the at least one slit being further recessed from the inner surface of the recessed portion.

5. The electronic device of claim 4, wherein the slit is formed parallel to the rear cover and / or the front cover.

6. The electronic device of claim 4, wherein the radiation characteristics of the antenna structure are determined by the shape, depth, width and / or number of the slits.

7. The electronic device of claim 1, further comprising: A wireless communication circuit configured to transmit and / or receive radio frequency signals in the range of 3 GHz to 100 GHz via the antenna structure.

8. The electronic device of claim 1, wherein the antenna structure comprises: Printed circuit board (PCB); as well as An array antenna, comprising at least two antenna elements arranged at regular intervals on the PCB. When viewed from above, the recessed portion is formed such that the tilt angle does not exceed 60 degrees. The tilt angle is formed between the tilt line and the vertical line. The tilt line connects one of the two ends of the PCB with the starting point of the recessed portion from the side surface. The vertical line vertically connects one end of the antenna structure and the side surface.

9. The electronic device of claim 8, wherein the shortest distance between the starting point of the recessed portion and the vertical line is determined to be no more than one-quarter wavelength (1 / 4*λ) of the maximum operating frequency carrier frequency of the antenna structure.

10. The electronic device of claim 1, wherein the antenna structure comprises: Printed circuit board (PCB); as well as An array antenna, comprising at least two antenna elements arranged at regular intervals on the PCB. When viewed from above, the recessed portion is formed such that the tilt angle does not exceed 60 degrees. The tilt angle is formed between the tilt line and the vertical line. The tilt line connects one of the two ends of the array antenna to the starting point of the recessed portion from the side surface. The vertical line vertically connects one end of the antenna structure to the side surface.

11. The electronic device of claim 1, wherein the side member includes at least one non-conductive region disposed around the antenna structure in the conductive portion.

12. The electronic device of claim 11, wherein, When viewed from above, the at least one non-conductive region is disposed between the antenna structure and the recessed portion.

13. The electronic device of claim 1, wherein the antenna structure is configured such that a beam pattern is formed through the non-conductive portion in the direction facing the side surface.

14. The electronic device of claim 1, wherein the side member includes a support member extending at least partially between the front cover and the rear cover, and The electronic device further includes a display supported by the support member and configured to be visually visible to the outside through the front cover.

15. An electronic device comprising: The front and rear covers form part of the exterior of the electronic device; A side member, disposed in the space between the front cover and the rear cover, extends to the side surface of the electronic device to at least partially form the side appearance of the electronic device, and includes conductive and non-conductive portions; as well as An antenna structure, disposed between the front cover and the rear cover, includes: Printed circuit boards (PCBs) disposed in the space; and An array antenna includes multiple antenna elements arranged at regular intervals on the PCB and forming a beam pattern facing the side surface. The non-conductive portion is positioned where it overlaps with the antenna structure when viewed from the outside. The conductive portion includes a recessed portion that at least partially accommodates the non-conductive portion, and the boundary region between the conductive portion and the non-conductive portion is positioned where it does not overlap with the antenna structure when viewed from the outside. When viewed from above, the recessed portion is formed such that the tilt angle does not exceed 60 degrees. The tilt angle is formed between a tilt line and a vertical line. The tilt line connects one of the two ends of the antenna structure to the starting point of the recessed portion from the side surface. The vertical line vertically connects one end of the antenna structure to the side surface.

16. The electronic device of claim 15, wherein the recessed portion is formed at the tilt angle ranging from 30 degrees to 60 degrees.

17. The electronic device of claim 15, wherein, When viewed from above, the recessed portion is formed such that the tilt angle does not exceed 60 degrees, the tilt angle being formed between the tilt line and the vertical line, the tilt line connecting one of the two ends of the PCB to the starting point of the recessed portion from the side surface, and the vertical line vertically connecting one end of the antenna structure to the side surface.

18. The electronic device of claim 15, wherein, When viewed from above, the recessed portion is formed such that the tilt angle does not exceed 60 degrees, the tilt angle being formed between the tilt line and the vertical line, the tilt line connecting one of the two ends of the array antenna to the starting point of the recessed portion from the side surface, and the vertical line vertically connecting one end of the antenna structure to the side surface.

19. The electronic device of claim 15, wherein the recessed portion has at least one slit, the at least one slit being further recessed from the inner surface of the recessed portion.

20. The electronic device of claim 15, further comprising: The wireless communication circuit is configured to transmit and / or receive radio frequency signals in the range of 3 GHz to 100 GHz via the array antenna.

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