Resin molding apparatus and method for manufacturing resin molded article

Abstract

Provided are a resin molding apparatus in which a release film is easily replaced with a simple configuration, and a method for manufacturing a resin molded product. The resin molding apparatus (30) includes a stationary frame (3A), a molding die (C), a movable platen (34), a die clamping mechanism (35), and a film supply mechanism (1). The film supply mechanism (1) includes a feeding mechanism (11) fixed to the stationary frame (3A) that feeds a release film (F), a recovery mechanism (12) fixed to the stationary frame (3A) that recovers the release film (F), and a pair of moving rollers (13a) supported by the stationary frame (3A) on the feeding mechanism (11) side and the recovery mechanism (12) side in a conveying path of the release film (F) and moved in conjunction with displacement of the relative positions of an upper die (UM) and a lower die (LM).

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a resin molding apparatus and a method of manufacturing a resin molded article. BACKGROUND

[0002] A substrate to which a chip is attached is generally used as an electronic component by being resin-sealed. In the past, as a resin molding apparatus for resin-sealing a substrate, a resin molding apparatus provided with a film supply mechanism that supplies a release film between an upper mold and a lower mold is known (for example, refer to Patent Literature 1).

[0003] The film supply mechanism described in Patent Literature 1 is provided with a supply roller fixed to a movable platen that moves together with the lower mold, a recovery roller fixed to a main body, and a buffer roller that moves in conjunction with the movement of the movable platen. The release film supplied from the supply roller is arranged so as to surround the main body in a manner that passes through a lower portion of the main body between the upper mold and the lower mold and is recovered by the recovery roller via the buffer roller.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Publication No. 2009-178901 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The film supply mechanism described in Patent Literature 1 supplies a release film in a manner that surrounds the main body, and therefore the device configuration is complicated. In addition, the supply roller is fixed to the movable platen and the recovery roller is fixed to the main body, and therefore work needs to be performed inside the main body when the release film is replaced, which is poor in convenience.

[0009] Therefore, a resin molding apparatus and a method of manufacturing a resin molded article in which a release film is easily replaced with a simple configuration are desired.

[0010] SOLUTION TO PROBLEM

[0011] The resin molding apparatus of the present disclosure is characterized by being provided with: a fixed frame; a molding die supported by the fixed frame, having an upper mold and a lower mold; a movable platen supported by the fixed frame, causing the relative positions of the upper mold and the lower mold to displace; a die clamping mechanism that moves the movable platen to clamp the molding die; and a film supply mechanism that supplies a release film between the upper mold and the lower mold, the film supply mechanism having: a feeding mechanism fixed to the fixed frame that feeds the release film; a recovery mechanism fixed to the fixed frame that recovers the release film; and a pair of moving rollers supported by the fixed frame on the feeding mechanism side and the recovery mechanism side of a conveyance path of the release film that move in conjunction with the displacement of the relative positions.

[0012] The resin molding method using the resin molding apparatus described above is characterized by including: a film supply step of supplying the release film between the upper mold and the lower mold by the film supply mechanism; a mold closing step of moving the movable platen by the mold closing mechanism to move the upper mold and the lower mold close to each other, and moving the moving roller in conjunction with the close-together movement; and a molding step of supplying a pre-molding substrate and a resin material to the molding die to perform resin molding.

[0013] Effects of Invention

[0014] According to the present disclosure, it is possible to provide a resin molding apparatus and a resin molding method in which a release film is easily replaced with a simple configuration. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a schematic view of a resin molding unit.

[0016] Figure 2 is a schematic view of a resin molding apparatus.

[0017] Figure 3 is a schematic view of a moving mechanism of a film supply mechanism.

[0018] Figure 4 is a schematic view of a resin molding method. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the resin molding apparatus and the resin molding method of the present disclosure will be described based on the drawings. However, the embodiments are not limited to the following, and various modifications can be made within the scope of the gist thereof.

[0020] A substrate (molding object) to which a semiconductor chip is attached is used as an electronic component by being resin-sealed. As a technique for resin-sealing a molding object, a compression method (compression molding), a transfer method, and the like can be given. As one of the compression methods, a method in which, after a liquid resin (resin material) is supplied to a release film, the release film is adsorbed to a lower mold of a molding die, and a molding object is immersed in the liquid resin on the release film to perform resin molding can be given. As one of the transfer methods, a method in which a molding object is placed on a release film adsorbed to a lower mold of a molding die, a resin sheet (resin material) in which a powder particle-shaped resin is solidified is supplied to a barrel of the molding die and is heated and melted, and the melted resin is supplied to a cavity to perform resin molding on the molding object can be given.

[0021] The liquid resin includes not only a resin that is liquid at normal temperature (room temperature), but also a molten resin that is a solid resin that is melted by heating. The liquid resin that is liquid at normal temperature can be a thermoplastic resin or a thermosetting resin. The thermosetting resin is a liquid resin at normal temperature, and the viscosity thereof decreases when heated, and the resin is cured by polymerization when further heated, and becomes a cured resin. As described below, in the case of resin molding for sealing a pre-molding substrate to which a semiconductor chip is connected, it is desirable to use a thermosetting resin.

[0022] The powder particle resin includes not only a powder particle resin, but also a resin sheet formed of a solid resin that is a powder particle resin that is solidified by pressure. The powder particle resin is a molten resin that is melted by heating. The powder particle resin can be a thermoplastic resin or a thermosetting resin. The thermosetting resin is a liquid resin at normal temperature, and the viscosity thereof decreases when heated, and the resin is cured by polymerization when further heated, and becomes a cured resin. As described below, in the case of resin molding for sealing a pre-molding substrate to which a semiconductor chip is connected, it is desirable to use a thermosetting resin.

[0023] [Overall Configuration]

[0024] Hereinafter, a resin molding apparatus of a transfer type will be described as an example. Figure 1 A schematic view of a resin molding unit D provided with the resin molding apparatus 30 in the present embodiment is shown in FIG. 1. The resin molding unit D is provided with a molding module 3, a supply module 4, a control section 6, and a conveyance mechanism. The molding module 3 has the resin molding apparatus 30 for resin sealing of a molding target. The control section 6 includes a program stored in a hardware such as a HDD (Hard Disk Drive), a memory, and the like, and is executed by a processor including an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), a CPU (Central Processing Unit), or other hardware of a computer, as software for controlling at least the operation of the resin molding apparatus 30.

[0025] The resin molding apparatus 30 in the present embodiment is an apparatus for resin molding of a pre-molding substrate Sa to which a semiconductor chip is connected, and is assembled in the molding module 3. Note that the molding module 3 can be a resin molding apparatus, and the resin molding unit D can be a resin molding apparatus, and there is no particular limitation.

[0026] The molding module 3 molds a post-molding substrate Sb (a resin molded product) by resin sealing a pre-molding substrate Sa (a molding target) by the resin molding device 30. The molding module 3 is provided with a plurality of (two in the present embodiment) molding modules 3 that can be attached to or detached from each other independently. Details of the resin molding device 30 will be described later.

[0027] The supply module 4 supplies the pre-molding substrate Sa and the resin sheet T to the molding module 3 and accommodates the post-molding substrate Sb from the molding module 3, and includes a substrate supply mechanism 43, a substrate arrangement mechanism 44, a resin supply mechanism 45, and a substrate accommodation section 46. The loader 41 and the unloader 42 included in the conveyance mechanism are standby in the supply module 4. The substrate supply mechanism 43 hands over the stored pre-molding substrate Sa to the substrate arrangement mechanism 44. One semiconductor chip or a plurality of semiconductor chips are connected to the pre-molding substrate Sa in a longitudinal and / or lateral arrangement. The substrate arrangement mechanism 44 makes the pre-molding substrate Sa handed over from the substrate supply mechanism 43 into a state suitable for conveyance. The resin supply mechanism 45 stores the resin sheet T and arranges the resin sheet T into a state suitable for conveyance.

[0028] The conveyance mechanism includes the loader 41 that conveys the pre-molding substrate Sa to which the semiconductor chip is connected before resin sealing and the resin sheet T, and the unloader 42 that conveys the post-molding substrate Sb after resin sealing. The loader 41 can receive the pre-molding substrate Sa from the substrate arrangement mechanism 44, in addition, can receive the resin sheet T from the resin supply mechanism 45, and moves on the track from the supply module 4 to each of the molding modules 3, thereby handing over the pre-molding substrate Sa and the resin sheet T to each of the molding modules 3. The unloader 42 can take out the post-molding substrate Sb from the molding module 3 and moves on the track from each of the molding modules 3 to the substrate accommodation section 46, thereby accommodating the post-molding substrate Sb in the substrate accommodation section 46. In the post-molding substrate Sb, the semiconductor chip is sealed with the cured resin obtained by solidifying the molten resin.

[0029] [Details of resin molding device]

[0030] Figure 2 The resin molding device 30 in the present embodiment is shown in FIG. 8. The resin molding device 30 is provided with a fixed frame 3A that is placed on a horizontal plane and is fixed in a stationary state by the action of gravity, a molding die C that is supported by the fixed frame 3A, a movable platen 34 that is supported by the fixed frame 3A, a die closing mechanism 35 that moves the movable platen 34 to close the molding die C, and a film supply mechanism 1 that supplies a release film F. Note that "supported by the fixed frame 3A" means that the fixed frame 3A directly or indirectly supports in a state in which it is relatively movable with respect to the fixed frame 3A, and the same applies hereinafter.

[0031] The lower fixed plate 31 and the upper fixed plate 33, which are rectangular in plan view, are connected by a frame body formed of a plurality of tie-bars (not shown) or plate-like members (not shown) and are covered by the cover portion 32, in the case of the fixed frame 3A. A movable platen 34, which is rectangular in plan view, is provided between the lower fixed plate 31 and the upper fixed plate 33. The molding die C has an upper die UM and a lower die LM. The upper die UM and the lower die LM are formed of dies and the like that are arranged opposite each other. A heater (not shown) is built into the upper die UM and the lower die LM, and the heater heats a substrate and a resin sheet that are supplied to the molding die C. In addition, the lower die LM is provided with a suction mechanism (not shown) that suctions the release film F to a die surface by a vacuum pump or the like.

[0032] The movable platen 34 is movable up and down along the tie-bars or the plate-like members of the fixed frame 3A, and thereby moves the lower die LM up and down to displace the relative positions of the lower die LM and the upper die UM. A die closing mechanism 35 that moves the movable platen 34 up and down is provided on the lower fixed plate 31. The die closing mechanism 35 is formed of, for example, a combination of a servomotor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, or the like. The die closing mechanism 35 closes the molding die C by moving the movable platen 34 upward and opens the molding die C by moving the movable platen 34 downward.

[0033] The film supply mechanism 1 supplies the release film F between the upper die UM and the lower die LM. As a material of the release film F, a resin material having heat resistance, releasability, softness, stretchability, and the like is used, and, for example, PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, or the like is used.

[0034] The film supply mechanism 1 has a delivery mechanism 11 that delivers the release film F, a recovery mechanism 12 that recovers the release film F, and a pair of moving mechanisms 13, 13 that are provided on the delivery mechanism 11 side (between the molding die C and the delivery mechanism 11) and the recovery mechanism 12 side (between the molding die C and the recovery mechanism 12) of a conveyance path of the release film F.

[0035] The delivery mechanism 11 is capable of delivering the pre-use release film F between the upper mold UM and the lower mold LM, and is fixed to the fixed frame 3A. The delivery mechanism 11 in the present embodiment includes a delivery roller 11a that delivers the pre-use release film F wound around a roller shaft, and a motor (not shown) that rotationally drives the delivery roller 11a, and the delivery roller 11a is housed in an openable and closable housing 11b. The delivery mechanism 11 including the housing 11b is fixed to the fixed frame 3A on the side of the fixed frame 3A outside. Note that "fixed to the fixed frame 3A" means that the fixed frame 3A directly or indirectly supports in a state in which the fixed frame 3A cannot relatively move, and the same applies hereinafter.

[0036] The recovery mechanism 12 is capable of recovering the post-use release film F used for resin molding, and is fixed to the fixed frame 3A. The recovery mechanism 12 in the present embodiment includes a recovery roller 12a that winds the post-use release film F around a roller shaft to thereby recover the post-use release film F, and a motor (not shown) that rotationally drives the recovery roller 12a, and the recovery roller 12a is housed in an openable and closable housing 12b. The recovery mechanism 12 including the housing 12b is fixed to the fixed frame 3A on the side of the fixed frame 3A outside, on the side opposite to the delivery mechanism 11. The control section 6 delivers the release film F in the advancing direction (the direction from the delivery mechanism 11 toward the recovery mechanism 12) by controlling the torque of each motor in the delivery mechanism 11 and the recovery mechanism 12. Furthermore, when delivering the release film F, a suitable tension is imparted to the release film F by controlling the torque of each motor.

[0037] Between the delivery mechanism 11 and the molding die C, a plurality of (four in the present embodiment) delivery rollers 14a to 14d for applying a tension Fa to the release film F are rotatably fixed to the fixed frame 3A. The plurality of delivery rollers 14a to 14d include a first delivery roller 14a and a second delivery roller 14b that are disposed in this order from the side of the delivery mechanism 11 between the delivery mechanism 11 and the moving mechanism 13, and an upper third delivery roller 14c and a lower fourth delivery roller 14d that are disposed between the moving mechanism 13 and the molding die C. The release film F is sandwiched by the pair of delivery rollers 14c, 14d located closest to the molding die C, whereby the release film F is guided so as to be parallel to the die surface of the molding die C.

[0038] Between the take-up mechanism 12 and the molding die C, a plurality of (four in this embodiment) take-up rollers 15a to 15d for applying tension Fb to the release film F are rotatably fixed to the fixed frame 3A. The plurality of take-up rollers 15a to 15d include first and second take-up rollers 15a and 15b on the upper and lower sides, which are disposed between the moving mechanism 13 and the molding die C, and third and fourth take-up rollers 15c and 15d, which are disposed in order from the side of the moving mechanism 13 between the moving mechanism 13 and the take-up mechanism 12. The release film F is sandwiched by the pair of take-up rollers 15a and 15b located closest to the molding die C, whereby the release film F is guided so as to be parallel to the die surface of the molding die C.

[0039] The moving mechanism 13 has a moving roller 13a that moves in linkage with displacement of the relative positions of the upper and lower molds UM and LM to apply a moderate tension to the release film F. The moving roller 13a is supported by the fixed frame 3A. In this embodiment, the feeding mechanism 11, the take-up mechanism 12, the feeding rollers 14a to 14d, and the take-up rollers 15a to 15d are fixed to the fixed frame 3A, and thus a moderate tension can be applied to the release film F by moving the moving roller 13a up and down in linkage with the up-and-down movement of the lower mold LM. Details of the moving mechanism 13 will be described later.

[0040] The film supply mechanism 1 in this embodiment also has a pinch roller 16 that presses and holds the release film F. The pinch roller 16 is rotatably fixed to the fixed frame 3A on the take-up mechanism 12 side (between the moving mechanism 13 and the take-up mechanism 12 on the take-up mechanism 12 side) of the transport path of the release film F. The pinch roller 16 includes a transport roller 16a that rotates by the driving force of a motor (not shown) to adjust the transport speed V of the release film F, and a press roller 16b that presses the release film F toward the transport roller 16a. In order to hold the release film F, the surfaces of the transport roller 16a and the press roller 16b are covered with rubber, resin, or the like having a high coefficient of friction.

[0041] The operation of the film supply mechanism 1 is controlled by the control section 6. The control section 6 controls the feeding mechanism 11 so as to apply a rotational torque Ta to the feeding roller 11a of the feeding mechanism 11 in the direction opposite to the advancing direction of the release film F, thereby giving a moderate tension Fa to the release film F. In addition, the control section 6 controls the take-up mechanism 12 so as to apply a rotational torque Tb to the take-up roller 12a of the take-up mechanism 12 in the advancing direction of the release film F, thereby giving a moderate tension Fb to the release film F. Furthermore, the control section 6 can control the transport speed V of the release film F by controlling the rotational speed Nc of the transport roller 16a of the pinch roller 16. When the release film F is supplied, the rotational torque of the transport roller 16a is made larger than the rotational torque Ta of the feeding roller 11a, so that the feeding roller 11a and the take-up roller 12a are rotated in the advancing direction of the release film F.

[0042] The tension Fa of the release film F from the feeding roller 11a to the conveying roller 16a is calculated by dividing the rotational torque Ta of the feeding roller 11a by the radius (Da / 2) of the feeding roller 11a, as in the upper formula of Equation (1). Further, the tension Fb of the release film F from the conveying roller 16a to the recovery roller 12a is calculated by dividing the rotational torque Tb of the recovery roller 12a by the radius (Db / 2) of the recovery roller 12a, as in the lower formula of Equation (1). Note that the radius of the feeding roller 11a and the radius of the recovery roller 12a vary depending on the feeding amount and the winding amount of the release film F. Note that in the case of the feeding mechanism 11 or the recovery mechanism 12 whose radius does not vary depending on the feeding amount and the winding amount of the release film F, the tension Fa, Fb of the release film F can be controlled based on the rotational torque Ta of the feeding mechanism 11 or the rotational torque Tb of the recovery mechanism 12, as in Equation (1).

[0043] [Equation 1]

[0044] Fa = 2 x Ta / Da

[0045] Fb = 2 x Tb / Db... (1)

[0046] The conveying speed V of the release film F is calculated by multiplying the rotational speed Nc of the conveying roller 16a (the pinch roller 16) by the circumference (diameter Dc x π) of the conveying roller 16a, as in Equation (2).

[0047] [Equation 2]

[0048] V = Nc x Dc x π... (2)

[0049] The diameter Da of the feeding roller 11a or the diameter Db of the recovery roller 12a that varies is calculated by dividing the conveying speed V of the release film F by the rotational speed Na of the feeding roller 11a or the rotational speed Nb of the recovery roller 12a, as in Equation (3).

[0050] [Equation 3]

[0051] Da = V / (Na x π)

[0052] Db = V / (Nb x π)... (3)

[0053] The rotational torque Ta of the delivery roller 11a or the rotational torque Tb of the recovery roller 12a can be calculated based on the voltage applied to the motor, etc., while the diameter Dc of the conveying roller 16a remains unchanged. That is, as long as the rotational speed Nc of the clamping roller 16 and the rotational speed Na of the delivery roller 11a are measured using a sensor (not shown), the tension Fa of the release film F can be calculated as in the above formula (4). Furthermore, as long as the rotational speed Nc of the clamping roller 16 and the rotational speed Nb of the recovery roller 12a are measured using a sensor (not shown), the tension Fb of the release film F can be calculated as in the below formula (4). It should be noted that friction loss and mechanical loss can also be considered when calculating the tensions Fa and Fb of the release film F, and a specified coefficient can be used.

[0054] [Formula 4]

[0055] Fa = (2 × Na × Ta) / (Nc × Dc)

[0056] Fb=(2×Nb×Tb) / (Nc×Dc)……(4)

[0057] Therefore, in this embodiment, the control unit 6 can control the tensions Fa and Fb applied to the release film F based on the rotational speed Nc of the clamping roller 16 and the rotational speed Na of the delivery roller 11a or the rotational speed Nb of the recovery roller 12a. That is, the control unit 6 controls the torque of the motor that rotates at least one of the delivery roller 11a, the recovery roller 12a, and the conveying roller 16a to ensure that the tensions Fa and Fb applied to the release film F are within an appropriate range. This prevents deformation and damage to the release film F.

[0058] like Figures 2-3 As shown, the moving mechanism 13, which is respectively provided on the side of the delivery mechanism 11 and the side of the recycling mechanism 12, includes: the aforementioned moving roller 13a; a spring 13b that presses the moving roller 13a; a holding plate 13c that holds the moving roller 13a; and a support frame 13d that supports the moving roller 13a, the spring 13b, and the holding plate 13c.

[0059] A pair of movable rollers 13a, 13a are fixed to the holding plate 13c on the delivery mechanism 11 side and the recycling mechanism 12 side on the conveying path of the release film F, and are supported by the fixed frame 3A via the support frame 13d. The movable roller 13a can move up and down in conjunction with the action of the lower mold LM moving relative to the upper mold UM through the mold closing mechanism 35 (moving up and down).

[0060] Spring 13b, composed of a compression spring or the like, presses against moving roller 13a via holding plate 13c in the direction that applies tension to the release film F (downward). The pressing force of spring 13b is set to be greater than the tension Fa applied to the release film F, and less than the force (the value obtained by dividing the rotational torque applied to the stationary delivery roller 11a and delivery roller 12a by the radius) of the delivery mechanism 11 and the recovery mechanism 12 holding the release film F. Accordingly, when the lower mold LM moves up and down, while the release film F is held by the delivery mechanism 11 and the recovery mechanism 12, spring 13b can extend and retract against the tension Fa of the release film F.

[0061] The retaining plate 13c rotatably holds the moving roller 13a and is supported by the support frame 13d. The support frame 13d is fixed to the fixed frame 3A and is formed by connecting the four corners of the upper plate 13d1 and the lower plate 13d2 by a plurality of (four in this embodiment) rod-shaped members 13d3. The retaining plate 13c has holes through which the rod-shaped members 13d3 pass and can move up and down along the rod-shaped members 13d3. The spring 13b is disposed on the outside of the rod-shaped members 13d3, with one end contacting the lower surface of the upper plate 13d1 and the other end contacting the upper surface of the retaining plate 13c.

[0062] [Manufacturing method for resin molded articles]

[0063] use Figure 1 and Figure 4 A method for manufacturing a resin-molded article is described. The method for manufacturing a resin-molded article (molded substrate Sb) includes: a film supply step, in which a release film F is supplied between the upper mold UM and the lower mold LM via a film supply mechanism 1; a mold closing step, in which a movable platform 34 is moved by a mold closing mechanism 35 to bring the upper mold UM and the lower mold LM closer together, and a moving roller 13a moves in conjunction with this closer movement; and a molding step, in which a pre-molding substrate Sa and resin material (resin obtained by melting a resin sheet T) are supplied to a molding mold C to perform resin molding. This molding step is a process in which the resin molding apparatus 30 performs resin molding on the pre-molding substrate Sa from the time the pre-molding substrate Sa is moved into the molding module 3 until the molded substrate Sb is moved out of the molding module 3, and this molding step includes the mold closing step.

[0064] like Figure 1As shown, the loader 41 is preheated while the space for receiving the resin sheet T is insulated, and the molding die C is also heated. Then, the pre-molding substrate Sa, taken from the substrate supply mechanism 43, is placed on the loader 41. Furthermore, the resin sheet T, arranged by the resin supply mechanism 45, is received in the receiving space for the resin sheet T in the loader 41. Then, the loader 41 transports the pre-molding substrate Sa and the resin sheet T to the molding module 3, and receives the resin sheet T in the barrel of the lower die LM. By receiving the resin sheet T in the barrel, the heater built into the lower die LM heats the resin sheet T, making the resin sheet T molten resin.

[0065] In addition, the film supply mechanism 1 supplies the pre-use release film F between the upper mold UM and the lower mold LM. Figure 4 (a) Film supply process). At this time, the control unit 6 can also control the tension Fa and Fb applied to the demolding film F based on the rotational speed Nc of the clamping roller 16 and the rotational speed Na of the delivery roller 11a or the rotational speed Nb of the recovery roller 12a.

[0066] After supplying the release film F before use, the control unit 6 controls the conveying speed of the conveying roller 16a (stopping the rotation of the conveying roller 16a), thus stopping the conveying of the release film F and maintaining the tensions Fa and Fb applied to the release film F. Next, the movable platform 34 is moved upward by the mold closing mechanism 35, causing the lower mold LM to move towards the upper mold UM, thereby ensuring that the release film F before use is tightly adhered to the lower mold LM. Figure 4 (b) At this time, the spring 13b slightly shrinks in resistance to the tension Fa of the release film F. Then, the release film F is adsorbed onto the mold surface of the lower mold LM by the adsorption mechanism, and the substrate Sa before molding is supplied to the release film F. It should be noted that the amount of movement of the lower mold LM when the release film F before use is tightly attached to the lower mold LM is preset as long as there is space between the upper mold UM and the lower mold LM to supply the substrate Sa before molding.

[0067] Next, the movable platform 34 is moved further upward by the mold closing mechanism 35 to bring the upper mold UM and the lower mold LM closer together, thereby closing the forming mold C. Figure 4 (c) Mold closing process). At this time, while the release film F is held in place by the delivery mechanism 11 and the recovery mechanism 12, the spring 13b resists the tension Fa of the release film F and moves away from it. Figure 4 The state of (b) is reduced to Figure 4(c) of the present embodiment, the pair of moving rollers 13a, 13a moves upward, and the tension Fa imparted to the release film F becomes a moderate value. In the present embodiment, the pressing force of the spring 13b is set to be greater than the tension Fa imparted to the release film F and less than the force with which the delivery mechanism 11 and the recovery mechanism 12 hold the release film F, and thus a moderate force can be applied to the tension imparted to the release film F even without providing a complicated control mechanism. As a result, there are no adverse conditions such as deformation of the release film F, which reduces the molding accuracy, or a shift in the transport line of the release film F. Further, in a case where the release film F moves between the pair of delivery rollers 14c, 14d and the pair of recovery rollers 15a, 15b due to a mold clamping operation or the like, the pair of moving rollers 13a, 13a moves in conjunction therewith, and thus the variation in the length of the release film F is absorbed. As a result, the release film F hardly moves on the delivery roller 11a side relative to the second delivery roller 14b and on the recovery roller 12a side relative to the transport roller 16a. Thus, there are no adverse conditions such as a shift in the transport line of the release film F.

[0068] Next, the resin that has been obtained by melting the resin sheet T housed in the lower mold LM by an extruding mechanism not shown is circulated to the cavity MC, and thus the pre-molding substrate Sa is subjected to resin molding, and a post-molding substrate Sb is manufactured Figure 1 (c), the molding step). After the resin molding, the movable platen 34 is moved downward to open the molding die C. At this time, the spring 13b is elongated against the tension Fa of the release film F, and thus the pair of moving rollers 13a, 13a moves downward, and the tension Fa imparted to the release film F becomes a moderate value. Then, the post-molding substrate Sb is demolded from the cavity MC, and the post-molding substrate Sb is housed in the substrate housing portion 46 by the unloader 42 (see also Figure 2 ).

[0069] Before the next pre-molding substrate Sa is supplied to the lower mold LM, the used release film F is removed from the molding die C by driving the transport roller 16a, and a film supply step of supplying the pre-use release film F to the molding die C is performed, and this film supply step, the above-described mold clamping step, and the molding step are repeatedly performed. Then, in a case where the release film F is insufficient on the delivery roller 11a of the delivery mechanism 11, or in a case where more release film F cannot be wound by the recovery roller 12a of the recovery mechanism 12, the housings 11b, 12b are opened, and the delivery roller 11a or the recovery roller 12a is replaced (see also ​ ).

[0070] In the present embodiment, the feeding mechanism 11 and the recovery mechanism 12 are fixed to both sides of the fixed frame 3A, and thus the replacement work of the release film F can be performed outside the fixed frame 3A, and the release film F can be easily replaced. Further, by providing the feeding mechanism 11 and the recovery mechanism 12 outside the fixed frame 3A, the installation space of the feeding mechanism 11 and the recovery mechanism 12 can be easily secured, and thus the size of the feeding mechanism 11 and the recovery mechanism 12 can be changed according to the required amount of the release film F, and the convenience is high.

[0071] [Other Embodiments]

[0072] Hereinafter, for the ease of understanding, the same terms and reference numerals are used to describe the same components as those of the above-described embodiments.

[0073] <1> In the above-described embodiment, the release film F is adsorbed to the lower mold LM, but the release film F can be adsorbed to the upper mold UM, and the release film F can be adsorbed to both the upper mold UM and the lower mold LM.

[0074] <2> In the above-described embodiment, the feeding mechanism 11 and the recovery mechanism 12 are fixed to both sides of the fixed frame 3A, but the feeding mechanism 11 and the recovery mechanism 12 can be fixed to the inside of the fixed frame 3A.

[0075] <3> In the above-described embodiment, the moving roller 13a is pressed by the spring 13b, but the moving roller 13a can be pressed by a fluid supplied to a cylinder. In the case of using a cylinder, the pressing force to the moving roller 13a can be changed in conjunction with the relative movement of the lower mold LM and the upper mold UM.

[0076] <4> In the above-described embodiment, in addition to the pair of moving rollers 13a, 13a provided on the feeding mechanism 11 side and the recovery mechanism 12 side, respectively, a moving roller 13a can be further provided.

[0077] <5> The feeding mechanism 11 in the above-described embodiment can be any configuration as long as it is a mechanism that can feed the release film F. Similarly, the recovery mechanism 12 in the above-described embodiment can be any configuration as long as it is a mechanism that can recover the release film F. That is, as long as a mechanism that holds the release film F and imparts an appropriate tension to the release film F is provided, so that even if the release film F moves between the pair of feeding rollers 14c, 14d and the pair of recovery rollers 15a, 15b due to the mold closing operation or the like, the release film F does not move to the feeding side than the second feeding roller 14b and to the recovery side than the conveying roller 16a.

[0078] The pinch rollers 16 in the above-described embodiments can be omitted, or can be provided on the side of the delivery mechanism 11 closer to the molding die C, or a plurality of pinch rollers 16 can be provided on the side of the delivery mechanism 11 closer to the molding die C and on the side of the recovery mechanism 12 closer to the molding die C.

[0079] <7> In the above-described embodiments, the resin molding apparatus 30 of the transfer method was described, but the resin molding apparatus 30 of the compression method can also be applied. The substrate subjected to resin molding by the resin molding apparatus 30 is, for example, a semiconductor substrate (silicon wafer or the like), a metal substrate (lead frame or the like), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0080] [Summary of the above-described embodiments]

[0081] Hereinafter, a summary of the resin molding apparatus 30 and the manufacturing method of the resin molded product described in the above-described embodiments will be described.

[0082] (1) The resin molding apparatus 30 is characterized by including: a fixed frame 3A; a molding die C supported by the fixed frame 3A, having an upper die UM and a lower die LM; a movable platen 34 supported by the fixed frame 3A, displacing the relative positions of the upper die UM and the lower die LM; a die closing mechanism 35 moving the movable platen 34 to close the molding die C; and a film supply mechanism 1 supplying a release film F between the upper die UM and the lower die LM, the film supply mechanism 1 having: a delivery mechanism 11 fixed to the fixed frame 3A, delivering the release film F; a recovery mechanism 12 fixed to the fixed frame 3A, recovering the release film F; and a pair of moving rollers 13a supported by the fixed frame 3A on the side of the delivery mechanism 11 and on the side of the recovery mechanism 12 of the transport path of the release film F, moving in conjunction with the displacement of the relative positions of the upper die UM and the lower die LM.

[0083] In the present configuration, the delivery mechanism 11 that delivers the release film F and the recovery mechanism 12 that recovers the release film F are both fixed to the fixed frame 3A, and thus the delivery mechanism 11 and the recovery mechanism 12 have high degrees of freedom in arrangement, and a configuration in which the release film F is easily replaced can be adopted. On the other hand, the delivery mechanism 11 and the recovery mechanism 12 are configured to move without being linked to the movable platen 34, and thus the release film F is easily deformed when the mold clamping mechanism 35 is operated. Therefore, in the present configuration, a pair of moving rollers 13a that move in linkage with displacement of the relative position of the upper mold UM and the lower mold LM are provided on the delivery mechanism 11 side and the recovery mechanism 12 side, and thus the tension Fa of the release film F is made to be an appropriate value by the moving rollers 13a when the mold clamping mechanism 35 is operated. In this way, by fixing the delivery mechanism 11 and the recovery mechanism 12 to the fixed frame 3A and providing the pair of moving rollers 13a on the delivery mechanism 11 side and the recovery mechanism 12 side, a resin molding device 30 in which the release film F is easily replaced while being prevented from being deformed can be provided with a simple configuration.

[0084] (2) The delivery mechanism 11 and the recovery mechanism 12 can each be fixed to both sides of the fixed frame 3A.

[0085] In this way, if the delivery mechanism 11 and the recovery mechanism 12 are each fixed to both sides of the fixed frame 3A, the replacement work of the release film F can be performed outside the fixed frame 3A, and the release film F is easily replaced. Furthermore, by providing the delivery mechanism 11 and the recovery mechanism 12 outside the fixed frame 3A, the arrangement space of the delivery mechanism 11 and the recovery mechanism 12 is easily ensured, and thus the sizes of the delivery mechanism 11 and the recovery mechanism 12 can be changed according to the required amount of the release film F, and the convenience is high.

[0086] (3) The moving roller 13a can be pressed by a spring 13b in a direction in which tension is applied to the release film F.

[0087] In this way, if the moving roller 13a is pressed by the spring 13b, the tension Fa applied to the release film F can be made to be an appropriate value even without providing a complicated control mechanism.

[0088] (4) The pressing force of the spring 13b can be set to be greater than the tension Fa applied to the release film F and less than the force with which the recovery mechanism 12 holds the release film F.

[0089] If the pressing force of the spring 13b is thus set, the tension Fa of the release film F can be made to be an appropriate value by the moving roller 13a while the release film F is held by the recovery mechanism 12 when the mold clamping mechanism 35 is operated.

[0090] (5) The film supply mechanism 1 can also have a pinch roller 16 fixed to the fixed frame 3A on the side of the take-up mechanism 12 of the transport path of the release film F, which presses and holds the release film F.

[0091] By so providing the pinch roller 16, the transport of the release film F can be smoothly performed.

[0092] (6) The resin molding apparatus can also have a control section 6 that controls the operation of the film supply mechanism 1, the control section 6 controlling the tension Fa, Fb imparted to the release film F based on the rotational speed Nc of the pinch roller 16 and the rotational speed Na, Nb of at least either one of the feed mechanism 11 and the take-up mechanism 12.

[0093] By so controlling, the deformation and breakage of the release film F can be prevented.

[0094] (7) A method of manufacturing a resin molded product (molded substrate Sb) using the resin molding apparatus 30 of any one of the above (1) to (6) is characterized by including: a film supply step of supplying the release film F between the upper mold UM and the lower mold LM by the film supply mechanism 1; a mold closing step of moving the movable platen 34 to move the upper mold UM and the lower mold LM in close proximity, and moving the moving roller 13a in conjunction with the close proximity movement; and a molding step of supplying the pre-molding substrate Sa and a resin material (resin obtained by melting the resin sheet T) to the molding die C to perform resin molding.

[0095] In the method, when the mold closing mechanism 35 is operated, the state is achieved in which the tension of the release film F is moderately applied by the moving roller 13a moved in conjunction with the close proximity movement of the upper mold UM and the lower mold LM. As a result, the deformation of the release film F can be prevented, and proper resin molding can be achieved.

[0096] Note that the configuration disclosed in the above-described embodiments (including another embodiment, the same hereinafter) can be combined with the configuration disclosed in other embodiments as appropriate without causing contradiction. Furthermore, the embodiments disclosed in the present specification are examples, and the embodiments of the present disclosure are not limited thereto, and can be appropriately changed within the scope of the object of the present disclosure.

[0097] Industrial applicability

[0098] The present disclosure can be used for a resin molding apparatus and a method of manufacturing a resin molded product.

[0099] Explanation of reference numerals

[0100] 1: Film supply mechanism;

[0101] 3A: Fixed frame;

[0102] 6: Control section;

[0103] 11: delivery mechanism

[0104] 12: recovery mechanism

[0105] 13a: moving roller

[0106] 13b: spring

[0107] 16: clamping roller

[0108] 30: resin molding device

[0109] 34: movable platen

[0110] 35: mold closing mechanism

[0111] C: molding mold

[0112] F: release film

[0113] Fa: tension

[0114] LM: lower mold

[0115] Na: rotational speed of delivery mechanism

[0116] Nb: rotational speed of recovery mechanism

[0117] Nc: rotational speed of clamping roller

[0118] Sa: substrate before molding

[0119] Sb: substrate after molding (resin molded product)

[0120] T: resin sheet (resin material)

[0121] UM: upper mold

Claims

1. A resin molding apparatus, comprising: Fixed frame; The forming mold, supported by the fixed frame, has an upper mold and a lower mold; The movable platform is supported by the fixed frame, causing the relative positions of the upper mold and the lower mold to shift. A mold closing mechanism moves the movable platform to close the molding mold; A film supply mechanism supplies a release film between the upper mold and the lower mold; and The control unit controls the operation of the membrane supply mechanism. The membrane supply mechanism has: A delivery mechanism, fixed to the fixed frame, delivers the release film. A recycling mechanism, fixed to the fixed frame, recycles the release film; A pair of movable rollers, supported by the fixed frame on the feeding mechanism side and the recycling mechanism side of the conveying path of the release film, move in conjunction with the displacement of the relative positions; as well as A clamping roller, fixed to the fixed frame on the recycling mechanism side of the delivery film conveying path, presses and holds the delivery film. The control unit controls the tension applied to the release film based on the rotational speed of the clamping roller and the rotational speed of at least one of the feeding mechanism and the recycling mechanism.

2. A resin molding apparatus, comprising: Fixed frame; The forming mold, supported by the fixed frame, has an upper mold and a lower mold; The movable platform is supported by the fixed frame, causing the relative positions of the upper mold and the lower mold to shift. A mold closing mechanism moves the movable platform to close the molding mold; as well as The film supply mechanism supplies a release film between the upper mold and the lower mold. The membrane supply mechanism has: A delivery mechanism, fixed to the fixed frame, delivers the release film. A recycling mechanism, fixed to the fixed frame, recycles the release film; as well as A pair of movable rollers, supported by the fixed frame on the delivery mechanism side and the recycling mechanism side of the delivery film conveying path, move in conjunction with the displacement of their relative positions. The moving roller is pressed by a spring in the direction that applies tension to the release film.

3. The resin molding apparatus according to claim 2, wherein, The pressing force of the spring is set to be greater than the tension applied to the release film and less than the force with which the recycling mechanism holds the release film.

4. The resin molding apparatus according to any one of claims 1 to 3, wherein, The delivery mechanism and the recycling mechanism are respectively fixed on both sides of the fixed frame.

5. A method for manufacturing a resin molded article, comprising using a resin molding apparatus as described in any one of claims 1 to 4, and comprising: In the film supply process, the release film is supplied between the upper mold and the lower mold through the film supply mechanism; In the mold closing process, the movable platform is moved by the mold closing mechanism to bring the upper mold and the lower mold closer together, and the moving roller moves in conjunction with the approach movement. as well as In the molding process, a pre-molding substrate and resin material are supplied to the molding mold for resin molding.

Images